Chip end sealing positioning device and positioning method

Abstract

The present invention discloses a chip end-sealing positioning device, comprising an implantation plate and a conveying plate, wherein the implantation plate is separated into a plurality of implantation units by a first horizontal beam and a first vertical beam arranged perpendicularly to each other, each implantation unit has a plurality of implantation areas arranged at intervals, and each implantation area is provided with a plurality of implantation holes, and the conveying plate is separated into a plurality of conveying units by a second horizontal beam and a second vertical beam arranged perpendicularly to each other, and each conveying unit has a conveying area corresponding to the implantation area one by one, and each conveying area is provided with a conveying hole. The present invention enhances the strength of each implantation unit and each conveying unit through the air avoidance design between each implantation area and each conveying area, thereby improving the overall strength of the implantation plate and the conveying plate, increasing the service life of both, and reducing the processing accuracy and processing cost of both. The present invention also discloses a chip end-sealing positioning method.

Description

Technical Field

[0001] The present invention relates to the technical field of multilayer ceramic capacitors, and in particular to a chip end-sealing positioning device and a positioning method for multilayer ceramic capacitors. Background Art

[0002] The copper electrode end-capping production of multi-layer ceramic capacitors (MLCC) is to dip copper at both ends of the MLCC chip after sintering and chamfering, so that the two ends of the capacitor form end electrodes, so that the capacitor can be welded on the substrate. Since the copper thickness and copper end width of the end electrodes of MLCC have certain technical requirements, in order to make the thickness and width of the copper dipped during the end-capping controllable, there will be different end-capping tooling for the end-capping production of MLCCs of different sizes. The existing domestic end-capping technology can correspond to the end-capping processing of MLCCs of 01005 and above.

[0003] For 01005 / 0201 size MLCC, the current end-capping technology is the hole-to-hole technology of the implant plate 100' and the conveying plate 200', wherein the implant plate 100' is evenly distributed with small implant holes 110', and the conveying plate 200' is partially provided with small conveying holes 210'. Figure 1a-1c As shown, before implantation, the implantation plate 100' is stacked on the conveying plate 200', and the implantation holes 110' on the implantation plate 100' correspond to the conveying holes 210' on the conveying plate 200'. Then, the chip 2' is implanted into the conveying hole 210' through the implantation hole 110' of the implantation plate 100', and one chip 2' is implanted into one conveying hole 210'. Figure 1a Then remove the implant plate 100 ', and through the flattening roller 300 'to roll back and forth over the chip 2 'so that the chip 2 'stands upright and close to the tape 400 ', as Figure 1b As shown, the copper thickness and width can be controlled during subsequent copper dipping; then the chip 2' and the conveying plate 200' that are tightly attached by the tape 400' are turned over 180° as a whole, so that the end of the chip 2' is adhered with copper paste, as shown in FIG. Figure 1c However, the existing end-capping method has the following problems:

[0004] First, the implantation hole 110' and the delivery hole 210' have small apertures and large density, so the alignment accuracy of the two is required to be high; and the inner wall of the delivery hole 210' must be processed with high accuracy, and there must be no abnormalities such as step burrs, otherwise the chip 2' is easily stuck when entering the delivery hole 210', causing the chip 2' to be inserted obliquely into the delivery hole 210', such as Figure 2a As shown, when flattening, the pressure of the roller 300' on the chip 2' may cause the chip 2' to be damaged, and there may be an oblique sticking phenomenon when copper is dipped;

[0005] Second, during unloading, the conveying hole 210' of the conveying plate 200' is easy to scratch the copper layer formed after the chip 2' is dipped in copper, which affects the quality of the capacitor;

[0006] 3. The conveying plate 200' is prone to local deformation, such as Figure 2b As shown, the local deformation position may cause the chip 2' to be skewed and reduce the life of the conveying plate 200';

[0007] Fourth, for ultra-small MLCCs such as 008004, the diameter of the conveying hole 210' is required to be smaller and the conveying plate 200' is required to be thinner. Therefore, densely opening the conveying holes 210' on the extremely thin conveying plate 200' will lead to insufficient strength of the conveying plate 200' and a reduced life of the conveying plate 200'.

[0008] Therefore, it is necessary to provide a chip end-sealing positioning device and positioning method that can improve the service life of the conveying plate and reduce the processing accuracy of the conveying plate to solve the above problems. Summary of the invention

[0009] The object of the present invention is to provide a chip end sealing and positioning device which can improve the service life of a conveying plate and reduce the processing accuracy of the conveying plate.

[0010] Another object of the present invention is to provide a chip positioning method that can increase the service life of a conveyor plate and reduce the processing accuracy of the conveyor plate.

[0011] To achieve the above-mentioned purpose, the technical solution of the present invention is: to provide a chip end-sealing positioning device, which is suitable for the end-sealing positioning of the chip of the multilayer ceramic capacitor, and includes an implantation plate and a conveying plate; wherein the implantation plate includes at least one first horizontal beam and at least one first vertical beam, the first horizontal beam is perpendicularly arranged to the first vertical beam, and the area between the first horizontal beam and the first vertical beam forms an implantation unit, each of the implantation units has a plurality of implantation areas arranged at intervals, and each of the implantation areas has a plurality of implantation holes extending therethrough; the conveying plate includes at least one second horizontal beam and at least one second vertical beam, the second horizontal beam is perpendicularly arranged to the second vertical beam, and the area between the second horizontal beam and the second vertical beam forms a conveying unit, each of the conveying units has a plurality of conveying areas arranged at intervals, the conveying areas correspond one-to-one to the implantation areas, and each of the conveying areas has a conveying hole extending therethrough.

[0012] Preferably, each of the implantation units comprises a plurality of first lateral support portions arranged in parallel and a plurality of first vertical support portions arranged in parallel, the first lateral support portions and the first vertical support portions are arranged perpendicularly to each other, and the area between the first lateral support portions and the first vertical support portions forms the implantation area; each of the conveying units comprises a second lateral support portion corresponding to the first lateral support portion and a second vertical support portion corresponding to the first vertical support portion, and the area between the second lateral support portion and the second vertical support portion forms the conveying area; when the implantation plate and the conveying plate are overlapped, all of the implantation holes on the implantation area are connected to the corresponding conveying holes.

[0013] Preferably, a boss is further provided on one side of the implantation area, the outer diameter of the boss is smaller than the inner diameter of the delivery hole, and the height of the boss is less than or equal to the thickness of the delivery plate, each of the implantation holes passes through the boss, and when the implantation plate is stacked on the delivery plate, the boss is accommodated in the delivery hole.

[0014] Preferably, the widths of the first lateral support portion and the second lateral support portion are the same and smaller than the widths of the first horizontal beam and the second horizontal beam; the widths of the first vertical support portion and the second vertical support portion are the same and smaller than the widths of the first vertical beam and the second vertical beam.

[0015] Preferably, the width of the first horizontal supporting portion, the first vertical supporting portion, the second horizontal supporting portion, and the second vertical supporting portion are all 2-8 mm.

[0016] Preferably, the implant plate has a plurality of first horizontal beams arranged in parallel and a plurality of first vertical beams arranged in parallel, and the conveying plate has a second horizontal beam corresponding to the first horizontal beams and a second vertical beam corresponding to the first vertical beams.

[0017] Preferably, the first horizontal beam and the second horizontal beam have the same width, and the first vertical beam and the second vertical beam have the same width.

[0018] Preferably, the implantation area and the delivery area are both in a square structure, and the delivery hole is in a square structure with a side length of 50-150 mm.

[0019] Preferably, the chip end sealing and positioning device further comprises a leveling mechanism, and the leveling mechanism comprises a leveling platform and a leveling top plate which are arranged in parallel, and the dimensions of the leveling platform and the leveling top plate are both greater than or equal to the dimensions of the conveying plate.

[0020] Correspondingly, the present invention also provides a chip end-sealing positioning method, which uses the chip end-sealing positioning device as described above and is suitable for end-sealing positioning of a multilayer ceramic capacitor chip, and the method comprises the following steps:

[0021] (1) Stick the tape on one surface of the conveyor plate;

[0022] (2) stacking the implant plate on the other surface of the delivery plate so that each implant area corresponds to each delivery area one by one, and all implant holes on each implant area are connected to the delivery holes on the corresponding delivery area;

[0023] (3) placing a plurality of chips on the implantation plate, and implanting each chip into a corresponding implantation hole in the implantation area, and simultaneously implanting the plurality of chips into a corresponding delivery hole through the implantation area, with one end of each chip being bonded to the adhesive tape;

[0024] (4) The implantation plate is moved away from the conveying plate, and then the chip is leveled by a leveling mechanism so that it is in close contact with the tape.

[0025] Compared with the prior art, the chip end-sealing and positioning device of the present invention has, firstly, an implantation plate divided into a plurality of implantation units by a first horizontal beam and a first vertical beam, and a plurality of implantation areas are arranged at intervals on each implantation unit, and a plurality of implantation holes are opened through each implantation area; secondly, a conveying plate divided into a plurality of conveying units by a second horizontal beam and a second vertical beam, and a plurality of conveying areas are arranged at intervals in each conveying unit, the conveying holes correspond one-to-one to the implantation areas, and a conveying hole is opened through each conveying area. Therefore, the air avoidance design between each implantation area and the air avoidance design between each conveying area first enhance the strength of each implantation unit and each conveying unit, so that each implantation unit and each conveying unit are not easily deformed; coupled with the arrangement of the horizontal beam and the vertical beam, the strength of the implantation plate and the conveying plate of the present invention is greatly improved, so that the implantation plate and the conveying plate as a whole are not easily deformed, thereby improving the service life of the implantation plate and the conveying plate, reducing the processing accuracy of the implantation plate and the conveying plate, thereby reducing the processing cost of the implantation plate and the conveying plate; in addition, the arrangement of multiple implantation holes corresponding to the same conveying hole can implant multiple chips in one conveying hole, and the inner wall of the conveying hole is not easy to get stuck with the chip during unloading, thereby avoiding the plate hole from scratching the copper layer, thereby improving the copper-wetting quality of the chip and saving costs at the same time.

[0026] Correspondingly, the chip terminal positioning method using the chip terminal positioning device of the present invention also has the above-mentioned effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1a-1c It is a schematic diagram of the existing chip termination positioning process.

[0028] Figure 2a-2b It is a schematic diagram of the local state of the existing conveyor plate.

[0029] Figure 3 It is a top view of the implant plate in the chip end sealing and positioning device of the present invention.

[0030] Figure 4 yes Figure 3 An enlarged schematic diagram of one of the implanted units.

[0031] Figure 5 It is a top view of the conveying plate in the chip end sealing and positioning device of the present invention.

[0032] Figure 6 yes Figure 5 An enlarged schematic diagram of a conveying unit.

[0033] Figure 7 It is a cross-sectional view of an implantation area and a delivery area after the implantation plate and the delivery plate are overlapped in one embodiment of the present invention.

[0034] Figure 8 yes Figure 7 Schematic diagram of the status during chip implantation.

[0035] Fig. 9 yes Figure 8 Schematic diagram of the chip after implantation.

[0036] Fig.10 Yes Fig. 9 Schematic diagram of the chip being leveled.

[0037] Fig.11 Yes Fig.10 Schematic diagram of the chip being dipped in copper.

[0038] Fig.12 It is a cross-sectional view of an implantation area and a delivery area after the implantation plate and the delivery plate are overlapped in another embodiment of the present invention. DETAILED DESCRIPTION

[0039] Embodiments of the present invention will now be described with reference to the accompanying drawings, in which like reference numerals represent like elements. Figure 3-Figure 12 As shown, the chip termination positioning device 1 provided by the present invention is particularly suitable for termination of multilayer ceramic capacitors of size 01005 / 008004, but is not limited thereto. Its principle and method can of course also be used for multilayer ceramic capacitors of other sizes.

[0040] Let's combine Figure 3-Figure 6As shown, the chip end sealing and positioning device 1 of the present invention comprises an implantation plate 100 and a conveying plate 200. The implantation plate 100 comprises at least one first cross beam 110 and at least one first vertical beam 120. The first cross beam 110 and the first vertical beam 120 both have a certain width and are arranged vertically to each other. The area separated by the first cross beam 110 and the first vertical beam 120 forms an implantation unit 130. Figure 3 Moreover, each implant unit 130 also has a plurality of implant areas 133 arranged at intervals, and each implant area 133 is provided with a plurality of implant holes 1331 extending therethrough, see Figure 4 Correspondingly, the conveying plate 200 includes at least one second cross beam 210 and at least one second vertical beam 220. The second cross beam 210 and the second vertical beam 220 both have a certain width and are arranged vertically. The area separated by the second cross beam 210 and the second vertical beam 220 forms a conveying unit 230. Figure 5 and each delivery unit 230 is separated into a plurality of spaced delivery areas 233, and each delivery area 233 on the delivery unit 230 corresponds to each implantation area 133 on the implantation unit 130, see Figure 6 As shown, each conveying area 233 is provided with a conveying hole 2331 extending therethrough.

[0041] Combine the following Fig.10 As shown, the chip end-sealing and positioning device 1 of the present invention further includes a leveling mechanism 300, which includes a leveling platform 310 and a leveling top plate 320 arranged in parallel. The sizes of the leveling platform 310 and the leveling top plate 320 are both greater than or equal to the sizes of the conveying plate 200. The two cooperate to level the chip 2 positioned by the conveying plate 200 (see below for details), wherein the distance D1 between the top surface of the leveling platform 310 and the top surface of the leveling top plate 320 = the thickness of the tape 400 + the size of the chip 2 + the allowable error, and the allowable error is preferably 0 to 50 um, but is not limited to this.

[0042] Continue to see below Figure 3 , Figure 5As shown, in one embodiment of the present invention, the implant plate 100 includes a first horizontal beam 110 and a first vertical beam 120 which are arranged vertically to each other. The first horizontal beam 110 and the first vertical beam 120 are arranged vertically in the middle of the implant plate 100. Therefore, the first horizontal beam 110 and the first vertical beam 120 separate four implant units 130 on the implant plate 100. The arrangement of the first horizontal beam 110 and the first vertical beam 120 having a certain width can strengthen the overall strength of the implant plate 100. Correspondingly, the conveying plate 200 also includes a second horizontal beam 210 and a second vertical beam 220 which are arranged vertically to each other. The second horizontal beam 210 and the second vertical beam 220 are arranged vertically in the middle of the conveying plate 200. Therefore, four conveying units 230 are also separated on the conveying plate 200. The arrangement of the second horizontal beam 210 and the second vertical beam 220 on the conveying plate 200 also serves the purpose of strengthening its overall strength.

[0043] It is understandable that the number of implant units 130 on the implant plate 100 and the number of conveying units 230 on the conveying plate 200 are not limited to four. For example, in other embodiments, a plurality of first horizontal beams 110 and a plurality of first vertical beams 120 arranged in parallel may be provided on the implant plate 100, and the first horizontal beams 110 and the first vertical beams 120 are both arranged vertically, thereby separating a plurality of implant units 130 on the implant plate 100. The number of the second horizontal beams 210 and the second vertical beams 220 on the conveying plate 200 may correspond to the number of the first horizontal beams 110 and the first vertical beams 120.

[0044] Continue to combine Figure 3 , Figure 5 As shown, in the present invention, the widths of the first cross beam 110 and the second cross beam 210 are preferably the same, and the widths of the first vertical beam 120 and the second vertical beam 220 are the same. Such a structural arrangement enables the upper and lower plates to be quickly aligned and the alignment accuracy to be improved by aligning the first cross beam 110 with the second cross beam 210 and the first vertical beam 120 with the second vertical beam 220 when the implant plate 100 and the conveying plate 200 are stacked.

[0045] See also Figure 3 As shown, in a more preferred embodiment of the present invention, the widths of the first cross beam 110 and the first vertical beam 120 of the implant plate 100 are the same, and both are L1. Correspondingly, the widths of the second cross beam 210 and the second vertical beam 220 of the conveying plate 200 are also the same, and are preferably L1, as shown in FIG. Figure 5 That is to say, the widths of all the cross beams and vertical beams of the implantation plate 100 and the conveying plate 200 are the same. This arrangement can further improve the alignment accuracy.

[0046] Recombination Figure 3-Figure 6As shown, in a more preferred embodiment of the present invention, the implant plate 100 and the conveying plate 200 are both square structures, and the sizes of the two are the same. In addition, the first cross beam 110 and the first vertical beam 120 on the implant plate 100 are arranged at the center of each side thereof, and the widths of the first cross beam 110 and the first vertical beam 120 are the same and are both L1, so four implant units 130 of the same size are separated on the implant plate 100. Correspondingly, the widths of the second cross beam 210 and the second vertical beam 220 on the conveying plate 200 are also L1, and the second cross beam 210 and the second vertical beam 220 are also arranged at the center of each side of the conveying plate 200, so that four conveying units 230 of the same size are also separated on the conveying plate 200, and the size of each conveying unit 230 is the same as the size of each implant unit 130. This structural arrangement can make the implant plate 100 and the conveying plate 200 quickly aligned, and the alignment accuracy is high.

[0047] Obviously, in other embodiments, the implant plate 100 and the conveying plate 200 are not limited to square structures, and the sizes of the implant units 130 formed on the implant plate 100 are not necessarily exactly the same, and the conveying units 230 on the conveying plate 200 only need to be set corresponding to the implant units 130.

[0048] Combine the following Figure 3-Figure 7 As shown, the specific structures of the implant unit 130 and the delivery unit 230 in the present invention are described in detail.

[0049] Combine first Figure 4 , Figure 7 As shown, each implant unit 130 includes a plurality of first lateral support portions 131 and a plurality of first vertical support portions 132 arranged in parallel, and the first lateral support portions 131 and the first vertical support portions 132 are arranged perpendicularly to each other, and the areas separated by the first lateral support portions 131 and the first vertical support portions 132 form implant areas 133, and a plurality of implant holes 1331 are evenly provided in each implant area 133, see Figure 4 In a specific embodiment of the present invention, each implant unit 130 includes two first lateral support portions 131 and two first vertical support portions 132. The two first lateral support portions 131 are evenly arranged along the longitudinal direction of the implant unit 130. Similarly, the two first vertical support portions 132 are evenly arranged along the transverse direction of the implant unit 130. Therefore, nine implant areas 133 of the same size are separated from each implant unit 130, and each implant area 133 has a square structure, as shown in FIG. Figure 4 shown.

[0050] In this specific embodiment, the first horizontal support portion 131 and the first vertical support portion 132 both have a certain width, and the widths of the two can be the same or different. In this embodiment, the widths of the two are preferably the same and are both L2. Figure 4 The implantation area 133 for providing the implantation hole 1331 is connected by a first transverse support portion 131 and a first vertical support portion 132 having a certain width, that is, the area for providing the implantation hole 1331 in each implantation unit 130 is designed to avoid air, thereby enhancing the strength of the implantation unit 130. Compared with the method of densely providing implantation holes in the entire area of ​​the implantation unit 130, the implantation unit 130 of the present invention is not easy to deform, thereby improving the strength and service life of the entire implantation plate 100.

[0051] Combine the following Figure 6-7 As shown, in this specific embodiment, each conveying unit 230 includes a second lateral support portion 231 corresponding to the first lateral support portion 131 and a second vertical support portion 232 corresponding to the first vertical support portion 132, that is, each conveying unit 230 includes two second lateral support portions 231 and two second vertical support portions 232 arranged vertically, and the width of the second lateral support portion 231 is the same as that of the first lateral support portion 131 and is both L2, the two second lateral support portions 231 and the two second vertical support portions 232 separate nine conveying areas 233 of the same size on each conveying unit 230, and each conveying area 233 has a square structure, so that each conveying area 233 can correspond to an implantation area 133, and a conveying hole 2331 is correspondingly opened in each conveying area 233, therefore, when the implantation plate 100 and the conveying plate 200 are stacked, a plurality of implantation holes 1331 on an implantation area 133 correspond to a conveying hole 2331.

[0052] In the present invention, the size of the delivery hole 2331 is set corresponding to the area where the implantation hole 1331 is opened on the implantation area 133, as long as it can be ensured that the multiple implantation holes 1331 in the implantation area 133 are connected to the corresponding delivery holes 2331 when the implantation plate 100 and the delivery plate 200 are stacked. In other words, the size of the delivery hole 2331 needs to be slightly larger than the area where the implantation hole 1331 is opened on the implantation area 133. For details, see Figure 7 As shown, Figure 7 Only four implantation holes 1331 are schematically drawn in the figure, but the number of implantation holes 1331 opened on the implantation area 133 is not limited to Figure 7 In a preferred embodiment of the present invention, the delivery hole 2331 is preferably in a square structure, and the side length of the delivery hole 2331 is preferably 50-150 mm, but not limited thereto.

[0053] In the present invention, since each conveying unit 230 is provided with a second transverse support portion 231 and a second vertical support portion 232 having a certain width, the conveying area 233 with the opening is connected by the second transverse support portion 231 and the second vertical support portion 232. That is to say, the area with the opening on each conveying unit 230 is designed to avoid air, thereby enhancing the strength of the conveying unit 230. Compared with the method of densely opening conveying holes 2331 in the entire area of ​​the conveying unit 230, the present invention makes the conveying unit 230 less likely to deform due to the air-avoiding arrangement of the second transverse support portion 231 and the second vertical support portion 232, thereby making the entire conveying plate 200 less likely to deform, thereby improving the service life of the entire conveying plate 200, and reducing the processing accuracy of the conveying plate 200, thereby reducing the processing cost of the conveying plate 200. In addition, through the arrangement of one conveying hole 2331 corresponding to multiple implantation holes 1331, see Figure 7 As shown, Figure 7 Only four implantation holes 1331 are schematically drawn, so multiple chips are implanted into one delivery hole 2331 at one time. Compared with the method in which one delivery hole 2331 corresponds to one chip, the delivery hole 2331 in the present invention can effectively avoid the chip jamming problem, and when unloading, the delivery hole 2331 is not easy to scratch the copper layer on the chip, thereby improving the end sealing quality.

[0054] Continue to combine Figure 3-6 As shown, in a preferred embodiment of the present invention, the width of the first lateral support portion 131, the first vertical support portion 132, the second lateral support portion 231, and the second vertical support portion 232 are all L2, and the width L2 is preferably smaller than the width L1 of the aforementioned horizontal beam and vertical beam, so that different support strengths are formed for areas of different sizes in the implant plate 100 and the conveying plate 200, which can further enhance the strength of both. Of course, the aforementioned width L2 is not limited to being smaller than the width L1, and both widths can be flexibly set as needed.

[0055] In a specific embodiment of the present invention, the width L2 of the first lateral support portion 131, the first vertical support portion 132, the second lateral support portion 231, and the second vertical support portion 232 is preferably 2-8 mm, but is not limited thereto. The specific width can be flexibly adjusted according to needs and the thickness of the implant plate 100 and the conveying plate 200.

[0056] See below Fig.12 As shown, in another embodiment of the chip end-sealing and positioning device 1 of the present invention, a boss 1332 is provided on one side of the implantation area 133, the outer diameter of the boss 1332 is slightly smaller than the inner diameter of the conveying hole 2331, and the height of the boss 1332 is less than or equal to the thickness of the conveying plate 200, and a plurality of implantation holes 1331 are provided at the position of the boss 1332 on the implantation area 133, Fig.12Only four implantation holes 1331 are schematically drawn, and the Fig.12 The number in is used as a limitation. By setting the boss 1332, the thickness of the implantation area 133 is greater than the thickness of other parts on the implantation plate 100. In this way, when the implantation plate 100 is stacked on one surface of the conveying plate 200, the boss 1332 protrudes into the conveying hole 2331, and the end face of the boss 1332 is a certain distance away from the other surface of the conveying plate 200 (or from the tape 400) or in the same plane with it. By thickening the implantation area 133, the height of the implantation hole 1331 is increased. When a chip 2 of a smaller size (for example, a chip of a multilayer ceramic capacitor of size 008004) is implanted, the chip 2 can be prevented from being skewed and lying horizontally during implantation, thereby ensuring that the chip 2 is implanted vertically.

[0057] In a preferred embodiment of the present invention, the height difference between the boss 1332 and the thickness of the conveying plate 200 is preferably 20 to 40 μm, so that when the boss 1332 protrudes into the conveying hole 2331, the distance D2 between the end surface of the boss 1332 and the tape 400 is approximately 20 to 40 μm, see Fig.12 as shown to avoid adhesion with the adhesive tape 400.

[0058] Combine the following Figure 8-Figure 12 As shown, a chip terminal positioning method using the chip terminal positioning device 1 of the present invention is described by taking a 01005 size multilayer ceramic capacitor as an example, wherein the length and width of the 01005 size multilayer ceramic capacitor are generally 0.4*0.2mm. The chip terminal positioning method of the present invention specifically includes the following steps:

[0059] (1) A high-temperature tape is attached to one surface of the conveying plate 200 .

[0060] (2) The implantation plate 100 is stacked on the other surface of the delivery plate 200, so that each implantation area 133 corresponds to each delivery area 233, and all implantation holes 1331 on each implantation area 133 are connected to the delivery holes 2331 below it.

[0061] Combination Figure 3-6 , Figure 8 As shown, the implant plate 100 is stacked on a surface of the conveying plate 200 away from the adhesive tape 400, and the first horizontal beam 110 and the first vertical beam 120 on the implant plate 100 correspond to the second horizontal beam 210 and the second vertical beam 220 on the conveying plate 200, respectively, so that the four implant units 130 correspond to the four conveying units 230. At the same time, each implant area 133 of each implant unit 130 corresponds to each conveying area 233 of each conveying unit 230, and all implant holes 1331 on each implant area 133 are connected to the conveying hole 233 below it, see Figure 8 As shown, Figure 8 Only four implantation holes 1331 are schematically drawn, and the four implantation holes 1331 are connected to a delivery hole 233 below them. Of course, the number of implantation holes 1331 is not limited to Figure 8 The limit is in.

[0062] (3) Place multiple chips 2 on the implantation plate 100, and make one end of each chip 2 corresponding to an implantation hole 1331 of the implantation area 133, and implant multiple chips 2 into one delivery hole 2331 at one time through the implantation hole 1331 of one implantation area 133, and make one end of each chip 2 adhere to the tape 400, and then move the implantation plate 100 away from the delivery plate 200.

[0063] Specific combination Figure 3-6 , Figure 8-9 As shown, when implanting the chip 2, multiple chips 2 are placed on the implantation plate 100, and a large number of chips are implanted at one time through the multiple implantation areas 133 of the four implantation units 130. In the following, one implantation area 133 is taken as an example, and the implantation area 133 has multiple chips 2, and then one end of each chip 2 corresponds to an implantation hole 1331. At this time, the chip 2 can be introduced into the delivery hole 2331 through the implantation hole 1331, that is, multiple chips 2 can be implanted into one delivery hole 2331 at one time through the multiple implantation holes 1331 of the implantation area 133. Figure 8 Only four implantation holes 1331 are schematically drawn.

[0064] After each chip 2 is vertically introduced into the delivery hole 2331 through the implantation hole 1331, one end of each chip 2 is bonded to the adhesive tape 400, and then the implantation plate 100 is moved away from the delivery plate 200. At this time, a plurality of chips 2 are vertically bonded in each delivery hole 2331. Fig. 9 As shown, Fig. 9 Only four chips 2 are schematically drawn.

[0065] (4) The chip 2 is leveled by the leveling mechanism 300 so that one end of the chip 2 is in close contact with the tape 400 .

[0066] Specific combination Figure 3-6 , Fig.10 As shown, the conveying plate 200, the adhesive tape 400 and the chips 2 bonded thereon are moved as a whole to the leveling platform 310 of the leveling mechanism 300, and the leveling top plate 320 is pressed on the upper end of the chip 2 to level the chip 2, so that each chip 2 is tightly attached to the adhesive tape 400. Fig.10 Only four chips 2 are schematically drawn.

[0067] Furthermore, the chip end-sealing and positioning method of the present invention may further include the following steps:

[0068] (5) The conveying plate 200, the adhesive tape 400 and the chip 2 bonded thereon are turned over 180 degrees as a whole, so that the end of the chip 2 is stained with copper paste, and the copper slurry is completed. For details, please refer to Fig.11 shown.

[0069] It should be noted that the chip termination positioning device 1 of the present invention is not limited to being used for termination positioning of 01005-size multilayer ceramic capacitors. Multilayer ceramic capacitors of any other size, such as 0201-size (length*width=0.6*0.3mm) multilayer ceramic capacitors, are also suitable for the chip termination positioning device 1 of the present invention. It is only necessary to adjust the aperture of the implantation hole 1331 accordingly according to the multilayer ceramic capacitors of different sizes.

[0070] Furthermore, for the 008004 size multilayer ceramic capacitor, since its size is too small, the implantation plate 100 in another embodiment of the chip termination positioning device 1 of the present invention is used, that is, the implantation plate 100 having a boss 1332 on one side of the implantation area 133 is provided. Fig.12 As shown, when the implantation plate 100 of this structure is stacked on the conveying plate 200, the boss 1332 protrudes into the conveying hole 2331. The setting of the boss 1332 increases the height of the implantation hole 1331. Therefore, when the chip 2 of the multilayer ceramic capacitor of size 008004 is implanted through the implantation hole 1331, the implantation can be avoided from being skewed and lying horizontally, thereby ensuring that the chip 2 is implanted vertically.

[0071] In summary, according to the chip end-sealing and positioning device 1 of the present invention, firstly, its implantation plate 100 is divided into a plurality of implantation units 130 by the first horizontal beam 110 and the first vertical beam 120, and a plurality of implantation areas 133 are arranged at intervals on each implantation unit 130, and a plurality of implantation holes 1331 are opened through each implantation area 133; secondly, the conveying plate 200 is divided into a plurality of conveying units 230 by the second horizontal beam 210 and the second vertical beam 220, and a plurality of conveying areas 233 are arranged at intervals in each conveying unit 230, the conveying holes 2331 correspond one-to-one to the implantation areas 133, and a conveying hole 2331 is opened through each conveying area 233. In the present invention, the air avoidance design between each implantation area 133 and the air avoidance design between each conveying area 233 first enhance the strength of each implantation unit 130 and each conveying unit 230, so that each implantation unit 130 and each conveying unit 230 are not easy to deform; coupled with the arrangement of the cross beam and the vertical beam, the strength of the implantation plate 100 and the conveying plate 200 of the present invention is greatly improved, so that the implantation plate 100 and the conveying plate 200 are not easy to deform as a whole, thereby improving the service life of the implantation plate 100 and the conveying plate 200, reducing the processing accuracy of the implantation plate 100 and the conveying plate 200, thereby reducing the processing cost of the implantation plate 100 and the conveying plate 200; in addition, the arrangement of multiple implantation holes 1331 corresponding to the same conveying hole 2331 can implant multiple chips 2 in one conveying hole 2331, and the inner wall of the conveying hole 2331 is not easy to get stuck with the chip 2 during unloading, thereby avoiding the plate hole from scratching the copper layer, thereby improving the copper-wetting quality of the chip 2 and saving costs at the same time.

[0072] Correspondingly, the chip terminal positioning method using the chip terminal positioning device 1 of the present invention also has the above-mentioned effects.

[0073] The structure of the multilayer ceramic capacitor involved in the present invention and other steps of its termination method are conventional methods well known to ordinary technicians in the field and will not be described in detail here.

[0074] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope covered by the present invention.

Claims

1. A chip end-sealing positioning device, suitable for the end-sealing positioning of a multilayer ceramic capacitor chip, characterized in that: include: An implant plate, comprising at least one first horizontal beam and at least one first vertical beam, wherein the first horizontal beam is arranged perpendicularly to the first vertical beam, and the area between the first horizontal beam and the first vertical beam forms an implant unit, each of the implant units comprises a plurality of first horizontal support portions arranged in parallel and a plurality of first vertical support portions arranged in parallel, the first horizontal support portions and the first vertical support portions are arranged perpendicularly to each other, and the area between the first horizontal support portions and the first vertical support portions forms a plurality of implant areas arranged at intervals, and each of the implant areas is provided with a plurality of implant holes extending therethrough; A conveying plate, comprising at least one second horizontal beam and at least one second vertical beam, wherein the second horizontal beam is arranged perpendicularly to the second vertical beam, and the area between the second horizontal beam and the second vertical beam forms a conveying unit, each of the conveying units comprises a second horizontal support portion corresponding to the first horizontal support portion and a second vertical support portion corresponding to the first vertical support portion, and the area between the second horizontal support portion and the second vertical support portion forms a plurality of conveying areas arranged at intervals, wherein the conveying areas correspond to the implantation areas one by one, and each of the conveying areas is provided with a conveying hole extending therethrough; The first horizontal beam and the second horizontal beam have the same width, and the first vertical beam and the second vertical beam have the same width.

2. The chip end sealing and positioning device according to claim 1, characterized in that: When the implantation plate and the delivery plate are stacked, all the implantation holes on the implantation area are connected to the corresponding delivery holes.

3. The chip end sealing and positioning device according to claim 1, characterized in that: A boss is also provided on one side of the implantation area, the outer diameter of the boss is smaller than the inner diameter of the delivery hole, and the height of the boss is less than or equal to the thickness of the delivery plate. Each implantation hole passes through the boss, and when the implantation plate is stacked on the delivery plate, the boss is accommodated in the delivery hole.

4. The chip end sealing and positioning device according to claim 2, characterized in that: The widths of the first horizontal support portion and the second horizontal support portion are the same and smaller than the widths of the first horizontal beam and the second horizontal beam; the widths of the first vertical support portion and the second vertical support portion are the same and smaller than the widths of the first vertical beam and the second vertical beam.

5. The chip end sealing and positioning device according to claim 2, characterized in that: The width of the first horizontal supporting portion, the first vertical supporting portion, the second horizontal supporting portion, and the second vertical supporting portion are all 2-8 mm.

6. The chip end sealing and positioning device according to claim 1, characterized in that: The implant plate has a plurality of first horizontal beams and a plurality of first vertical beams arranged in parallel, and the conveying plate has a second horizontal beam corresponding to the first horizontal beams and a second vertical beam corresponding to the first vertical beams.

7. The chip end sealing and positioning device according to claim 1, characterized in that: The implantation area and the delivery area are both square structures, and the delivery hole is square structure with a side length of 50-150 mm.

8. The chip end sealing and positioning device according to claim 1, characterized in that: It also includes a leveling mechanism, which includes a leveling platform and a leveling top plate arranged in parallel, and the sizes of the leveling platform and the leveling top plate are both greater than or equal to the size of the conveying plate.

9. A chip end-sealing positioning method using the chip end-sealing positioning device according to any one of claims 1 to 8, which is suitable for end-sealing positioning of a multilayer ceramic capacitor chip, characterized in that: The method comprises the following steps: (1) Stick the tape on one surface of the conveyor plate; (2) stacking the implant plate on the other surface of the delivery plate so that each implant area corresponds to each delivery area one by one, and all implant holes on each implant area are connected to the delivery holes on the corresponding delivery area; (3) placing a plurality of chips on the implantation plate, and implanting each chip into a corresponding implantation hole in the implantation area, and simultaneously implanting the plurality of chips into a corresponding delivery hole through the implantation area, with one end of each chip being bonded to the adhesive tape; (4) The implantation plate is moved away from the conveying plate, and then the chip is leveled by a leveling mechanism so that it is in close contact with the tape.

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