Chip device with uniform temperature heat dissipation structure

Abstract

The present invention provides a chip device with a uniform temperature heat dissipation structure, the chip device comprising: a base, an outer seal and a heat transfer space. The base has a working surface, a heat source portion is arranged on the working surface, at least one chip is arranged on the heat source portion, and the chip has a heat generation area relative to a horizontal reference surface. The outer seal is opposite to the working surface of the base, and the outer seal and the base cover the heat source portion together. The heat transfer space is arranged on the heat generation area, and a working fluid is arranged in the heat transfer space. In this way, the heat dissipation of the chip can be effectively carried out to ensure the normal operation of the chip.

Description

Technical Field

[0001] The invention relates to a chip device, and in particular to a chip device with a uniform temperature heat dissipation structure. Background Art

[0002] Currently, all common electronic components are designed and developed towards miniaturization. However, due to factors such as miniaturization and greatly improved performance, various electronic components are also prone to generate high heat during actual operation, affecting the overall operating performance. Therefore, it is necessary to use a known micro-heat plate for heat dissipation.

[0003] In addition, a conventional heat conducting plate is disposed above a chip to be used as a heat sink. However, the contact area between the conventional heat conducting plate and the chip is quite limited, resulting in a quite limited overall heat dissipation effect, and thus there is a need for improvement. Summary of the invention

[0004] The present invention provides a chip device with a uniform temperature heat dissipation structure. In one embodiment, the chip device includes: a base, an outer seal and a heat transfer space. The base has a working surface, a heat source portion is arranged on the working surface, and at least one chip is arranged on the heat source portion. The chip has a heat generation area relative to a horizontal reference surface. The outer seal is opposite to the working surface of the base, and the outer seal and the base cover the heat source portion together. The heat transfer space is arranged on the heat generation area, and a working fluid is arranged in the heat transfer space.

[0005] The chip device with a uniform temperature heat dissipation structure of the present invention can control the working fluid to perform a heat exchange effect of circulating backflow with phase change, so as to effectively dissipate heat for the chip at the heat source part, thereby achieving the effect of improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 A three-dimensional exploded view showing a chip device with a uniform temperature heat dissipation structure according to a first embodiment of the present invention;

[0007] Figure 2 A combined cross-sectional view showing a chip device with a uniform temperature heat dissipation structure according to a first embodiment of the present invention;

[0008] Figure 3 A three-dimensional exploded view showing a chip device with a uniform temperature heat dissipation structure according to a second embodiment of the present invention;

[0009] Figure 4 A combined cross-sectional view showing a chip device with a uniform temperature heat dissipation structure according to a second embodiment of the present invention;

[0010] Figure 5 A three-dimensional exploded view showing a chip device with a uniform temperature heat dissipation structure according to a third embodiment of the present invention;

[0011] Figure 6 A combined cross-sectional view showing a chip device with a uniform temperature heat dissipation structure according to a third embodiment of the present invention;

[0012] Figure 7 A three-dimensional exploded view showing a chip device with a uniform temperature heat dissipation structure according to a fourth embodiment of the present invention;

[0013] Figure 8 A combined cross-sectional view showing a chip device with a uniform temperature heat dissipation structure according to a fourth embodiment of the present invention;

[0014] Fig. 9 A combined cross-sectional view showing a chip device with a uniform temperature heat dissipation structure according to a fifth embodiment of the present invention.

[0015] Reference numerals:

[0016] 1: Chip device

[0017] 10: Base

[0018] 11: Work surface

[0019] 12: Heat source

[0020] 20: Outer seal

[0021] 21a: Shell

[0022] 21b: First shell

[0023] 21c: Fixed seat

[0024] 21d: Shell cover

[0025] 22a: Exocyclic body

[0026] 22b: Second housing

[0027] 22c: Temperature balancing module

[0028] 22d: Temperature balancing module

[0029] 30: Heat transfer space

[0030] 31: Working fluid

[0031] 40: Heat dissipation space

[0032] 121: Chip

[0033] 211b: first surface

[0034] 211c: Positioning hole

[0035] 211d: base

[0036] 212b: first groove

[0037] 212c: Positioning flange

[0038] 212d: Side periphery

[0039] 213b: Positioning flange

[0040] 213c: Exhaust hole

[0041] 213d: Positioning flange

[0042] 214b: Exhaust hole

[0043] 214d: Exhaust hole

[0044] 221b: Second surface

[0045] 221c: Upper shell

[0046] 221d: Upper shell

[0047] 222b: second groove

[0048] 222c: Lower shell

[0049] 222d: Lower shell

[0050] 223b: Capillary structure

[0051] 223d: Extension

[0052] D: Horizontal spacing

[0053] F: Horizontal reference plane

[0054] R1: Heat generating area

[0055] R2: Heat transfer area DETAILED DESCRIPTION

[0056] Figure 1 A three-dimensional exploded view of a chip device with a uniform temperature heat dissipation structure according to a first embodiment of the present invention is shown. Figure 1 The chip device 1 with uniform temperature heat dissipation structure of the present invention comprises a base 10, an outer sealing member 20 and a heat transfer space 30. The chip device 1 of the present invention can be used to dissipate heat for various miniaturized electronic components (such as semiconductor chips, etc.), but is not limited to the above.

[0057] Figure 2 A cross-sectional view of a chip device with a uniform temperature heat dissipation structure according to a first embodiment of the present invention is shown. Figure 1 and Figure 2In one embodiment, the chip device 1 of the present invention has a base 10, an outer seal 20 and a heat transfer space 30. The base 10 has a working surface 11, and a heat source portion 12 can be disposed on the working surface 11. The heat source portion 12 is provided with at least one chip 121. The base 10 can be a circuit board for the chip 121 to be disposed, but is not limited to the above. In addition, the chip 121 has a heat generation area R1 relative to a horizontal reference plane F. In the embodiment shown in the figure, the heat generation area R1 can be located between the working surface 11 of the base 10 and the outer seal 20, and the heat generation area R1 can be the area covered by the chip 121. The outer seal 20 is opposite to the working surface 11 of the base 10, so that the outer seal 20 and the base 10 can cover the heat source portion 12 together. The heat transfer space 30 is disposed on the heat generating area R1. The heat transfer space 30 has a heat transfer area R2 relative to the horizontal reference plane F. A working fluid 31 is disposed in the heat transfer space 30. The working fluid 31 is a low boiling point liquid that can perform heat exchange by phase change, but is not limited thereto. The working fluid 31 is disposed around the chip 121 so that the working fluid 31 can cover the chip 121.

[0058] When the chip device 1 with a uniform temperature heat dissipation structure of the present invention is actually used, various heat dissipation elements such as heat dissipation fins or heat dissipation fans (not shown) can be arranged on the outer side of the outer seal 20. In this way, the chip 121 will generate high heat during actual operation. Since the heat transfer area R2 is arranged around the chip 121, the working fluid 31 located above and around the chip 121 will generate a vapor to the inner side of the outer seal 20 after being heated and evaporated; at this time, various heat dissipation elements arranged on the outer side of the outer seal 20 can be used to reduce its temperature, so that the vapor is further cooled and condensed into the working fluid 31 and then reflows above and around the chip 121. In general, by repeating the heat exchange effect of the working fluid 31 with phase change circulation, the heat dissipation of the chip 121 of the heat source part 12 can be effectively performed, so as to effectively improve the heat dissipation performance of the chip 121.

[0059] The heat transfer area R2 of the chip device with a uniform temperature heat dissipation structure of the present invention can be larger than the heat generation area R1 of the heat source part 12. Thus, by utilizing the structural design that the heat transfer area R2 is larger than the heat generation area R1, the heat conduction area of ​​the heat transfer space 30 can be greatly increased to enhance its heat exchange effect. In addition, the working fluid 31 can be selected not to fill the heat transfer space 30 to ensure that the working fluid 31 can more efficiently perform the heat exchange operation of phase change circulation reflux; or, the working fluid 31 can be selected as a non-conductive working fluid to prevent the working fluid 31 from affecting the operation of the chip 121.

[0060] Related References Figure 1 and Figure 2In the first embodiment, the outer seal 20 has a shell 21a and an outer ring 22a. The outer ring 22a is disposed on the working surface 11 of the base 10 and surrounds the heat source 12. A horizontal distance D is formed between the outer ring 22a and the heat source 12. The shell 21a is combined with the outer ring 22a and faces the working surface 11 of the base 10. The heat transfer space 30 is disposed between the shell 21a, the outer ring 22a and the base 10. The outer ring 22a can be made of adhesive or silicone, so that the shell 21a and the outer ring 22a can be easily and quickly assembled to improve assembly convenience. Alternatively, the outer ring 22a may be omitted, and the shell 21a may be directly disposed on the working surface 11 of the base 10. The heat transfer space 30 may be disposed between the shell 21a and the base 10, and the shell 21a may be fixed to the working surface 11 of the base 10 by welding (such as laser welding). In this way, it is ensured that the working fluid 131 in the heat transfer space 30 can effectively cover the periphery of the chip 121, so that the working fluid 131 can fully contact the chip 121. Furthermore, the outer ring 22a can stably support and fix the shell 21a, so that the heat transfer space 30 sufficient for the working fluid 31 to be filled is formed between the shell 21a, the outer ring 22a and the base 10, so as to effectively reduce the high heat generated by the actual operation of the chip 121, thereby improving the working efficiency of the chip 121.

[0061] Figure 3 A three-dimensional exploded view of a chip device with a uniform temperature heat dissipation structure according to a second embodiment of the present invention is shown. Figure 4 A cross-sectional view of a chip device with a uniform temperature heat dissipation structure according to a second embodiment of the present invention is shown. Figure 3 and Figure 4 In the second embodiment, the outer seal 20 has a first shell 21b and a second shell 22b. The first shell 21b is combined with the working surface 11 of the base 10. The second shell 22b is combined with the first shell 21b and is located between the first shell 21b and the base 10. The heat transfer space 30 is formed between the first shell 21b and the second shell 22b. Thus, by utilizing the structural design of the first shell 21b and the second shell 22b, the heat transfer space 30 can be opposite to the heat source portion 12. The high heat generated by the chip 121 during actual operation can also cause the working fluid 31 to evaporate and generate steam to the inner side of the first shell 21b. At this time, various heat dissipation elements (not shown) disposed on the outer side of the first shell 21b of the outer sealing member 20 can be used to further reduce its temperature. By repeating the heat exchange effect of the working fluid 31 with phase change circulation, the heat dissipation of the chip 121 can be effectively performed.

[0062] Related References Figure 3 and Figure 4 In the second embodiment, the first shell 21b of the outer seal 20 has a first surface 211b, the first surface 211b faces the working surface 11 of the base 10, the second shell 22b has a second surface 221b, the second surface 221b faces the first surface 211b of the first shell 21b, the first surface 211b is provided with a first groove 212b, and the second surface 221b is provided with a second groove 222b, the second shell 22b is combined with the first groove 212b, and the heat transfer space 30 is formed in the second groove 222b. Thus, the design of the first groove 212b can ensure that the second shell 22b is firmly combined with the first shell 21b, so that the second groove 222b of the second shell 22b can form the heat transfer space 30 with better sealing effect.

[0063] Related References Figure 3 and Figure 4 In the second embodiment, the first shell 21b of the outer seal 20 forms a positioning flange 213b from the outer periphery of the first groove 212b, and the positioning flange 213b is combined with the working surface 11 of the base 10. Thus, the design of the positioning flange 213b can ensure that the first shell 21b is firmly combined with the working surface 11 of the base 10.

[0064] Related References Figure 3 and Figure 4 In the second embodiment, the second shell 22b is attached to the chip 121. Thus, the heat transfer effect of the heat transfer space 30 is effectively improved. A heat conducting medium may be disposed between the second shell 22b and the chip 121. The heat conducting medium may be a heat conducting film or a heat dissipating paste to ensure that the second shell 22b is attached to the surface of the chip 121. In addition, a capillary structure 223b may be disposed between the first shell 21b and the second shell 22b of the outer seal 20. The capillary structure 223b may be formed by sintering copper powder or using a capillary sheet. For example, when the capillary structure 223b is formed by sintering copper powder, the capillary structure 223b may be formed on the inner side of the first shell 21b or the second shell 22b. When a capillary sheet is used, the capillary structure may be disposed between the first shell 21b and the second shell 22b. After the vapor is cooled and condensed into the working fluid 31 , it is easier to flow back to the top and periphery of the chip 121 , so as to enhance the overall heat exchange effect.

[0065] Related References Figure 3 and Figure 4In the second embodiment, there is a horizontal distance D between the first shell 21b and the heat source 12, and a heat dissipation space 40 can be formed between the second shell 22b and the base 10 through the horizontal distance D. Thus, the heat dissipation space 40 can be located around the chip 121. Based on the fact that the heat transfer area R2 is larger than the heat generating area R1, the heat dissipation space 40 can be used to cooperate with the heat transfer space 30 to provide an auxiliary heat dissipation effect, so as to further reduce the high heat generated by the actual operation of the chip 121, thereby improving the working efficiency of the chip 121.

[0066] Related References Figure 3 and Figure 4 In the second embodiment, the first shell 21b of the outer seal 20 may be provided with at least one exhaust hole 214b, and the exhaust hole 214b is connected to the heat dissipation space 40. Thus, the design of the exhaust hole 214b can provide a convection effect between the heat dissipation space 40 and the external space, so as to effectively enhance the auxiliary heat dissipation effect of the heat dissipation space 40; in addition, the exhaust hole 214b can also provide a pressure relief effect to prevent the internal pressure of the heat dissipation space 40 from being too high.

[0067] Figure 5 A three-dimensional exploded view of a chip device with a uniform temperature heat dissipation structure according to a third embodiment of the present invention is shown. Figure 6 A cross-sectional view of a chip device with a uniform temperature heat dissipation structure according to a third embodiment of the present invention is shown. Figure 5 and Figure 6 In the third embodiment, the outer seal 20 has a fixing seat 21c and a temperature balancing module 22c. The fixing seat 21c is combined with the working surface 11 of the base 10. The temperature balancing module 22c is combined with the fixing seat 21c. The heat transfer space 30 is formed inside the temperature balancing module 22c. By utilizing the modular design of the temperature averaging module 22c, the temperature averaging module 22c can be quickly assembled and disassembled on the fixing seat 21c to improve the convenience of assembly. Furthermore, the temperature averaging module 22c can be more easily connected to the optimal heat dissipation position of the heat source part 12, so that the heat transfer space 30 and the chip 121 can be exactly opposite to each other. The high heat generated by the chip 121 in actual operation can also cause the working fluid 31 to evaporate and generate a vapor to the inner side surface of the upper half of the temperature averaging module 22c (mainly in the direction of the figure). At this time, various heat dissipation elements (not shown) arranged on the outer side surface of the temperature averaging module 22c of the outer sealing member 20 can also be used to further reduce its temperature, so as to repeat the heat exchange effect of the working fluid 31 in the phase change circulation to effectively dissipate heat for the chip 121.

[0068] Related References Figure 5 and Figure 6In the third embodiment, the temperature-averaging module 22c is formed by an upper shell 221c and a lower shell 222c being matched to form a hollow shell, which is used to form the heat transfer space 30 inside the temperature-averaging module 22c; wherein the upper shell 221c and the lower shell 222c can be welded together (such as laser welding), but the present invention is not limited thereto. Thus, by using the design that the upper shell 221c and the lower shell 222c are matched to form the temperature-averaging module 22c, the heat transfer space 30 with good sealing effect can be formed. Furthermore, a capillary structure may be disposed between the upper shell 221c and the lower shell 222c of the temperature balancing module 22c. The capillary structure may be formed by sintering copper powder or by using a capillary sheet. For example, when the capillary structure is formed by sintering copper powder, the capillary structure may be formed on the inner side of the upper shell 221c or the lower shell 222c. When a capillary sheet is used, the capillary structure may be disposed between the upper shell 221c and the lower shell 222c. This makes it easier for the vapor to flow back to the top and periphery of the chip 121 after cooling and condensing into the working fluid 31, thereby improving the overall heat exchange effect.

[0069] Related References Figure 5 and Figure 6 In the third embodiment, the temperature averaging module 22c is attached to the chip 121. Thus, the heat transfer effect of the heat transfer space 30 is effectively improved. A heat conducting medium may be provided between the temperature averaging module 22c and the chip 121. The heat conducting medium may be a heat conducting film or heat dissipation paste to ensure that the temperature averaging module 22c is attached to the surface of the chip 121.

[0070] Related References Figure 5 and Figure 6 In the third embodiment, the fixing seat 21c is provided with a through positioning hole 211c, and the temperature averaging module 22c is correspondingly engaged with the positioning hole 211c. In this way, the assembly convenience and assembly stability of the temperature averaging module 22c are improved. In addition, the temperature averaging module 22c can be welded (such as laser welding) to the peripheral wall of the positioning hole 211c to ensure that the temperature averaging module 22c can be more firmly combined with the positioning hole 211c to prevent the temperature averaging module 22c from loosening.

[0071] Related References Figure 5 and Figure 6 In the third embodiment, a positioning flange 212c is formed on the outer periphery of the fixing seat 21c of the outer seal 20, and the positioning flange 212c is combined with the working surface 11 of the base 10. Thus, the design of the positioning flange 212c can ensure that the fixing seat 21c is firmly combined with the working surface 11 of the base 10.

[0072] Related References Figure 5 and Figure 6In the third embodiment, there is a horizontal distance D between the fixing base 21c and the heat source 12, and a heat dissipation space 40 can be formed between the temperature balancing module 22c and the base 10 through the horizontal distance D. Thus, the heat dissipation space 40 can be located around the heat source 12. Based on the fact that the heat transfer area R2 is larger than the heat generating area R1, the heat dissipation space 40 can be used to cooperate with the heat transfer space 30 to provide an auxiliary heat dissipation effect, so as to further reduce the high heat generated by the actual operation of the chip 121, thereby improving the working efficiency of the chip 121.

[0073] Related References Figure 5 and Figure 6 In the third embodiment, the fixing base 21c of the outer seal 20 may be provided with at least one exhaust hole 213c, and the exhaust hole 213c is connected to the heat dissipation space 40. Thus, the design of the exhaust hole 213c can provide a convection effect between the heat dissipation space 40 and the external space, so as to effectively enhance the auxiliary heat dissipation effect of the heat dissipation space 40; in addition, the exhaust hole 213c can also provide a pressure relief effect to prevent the internal pressure of the heat dissipation space 40 from being too high.

[0074] Figure 7 A three-dimensional exploded view of a chip device with a uniform temperature heat dissipation structure according to a fourth embodiment of the present invention is shown. Figure 8 A cross-sectional view of a chip device with a uniform temperature heat dissipation structure according to a fourth embodiment of the present invention is shown. Figure 7 and Figure 8 In the fourth embodiment, the outer seal 20 has a shell cover 21d and a temperature-averaging module 22d. The shell cover 21d is combined with the working surface 11 of the base 10. The temperature-averaging module 22d is disposed between the shell cover 21d and the base 10. The heat transfer space 30 is formed inside the temperature-averaging module 22d. The temperature-averaging module 22d in this embodiment has the same function as the temperature-averaging module 22c in the third embodiment, which will not be described here. In this embodiment, the shell cover 21d can be used to further fix the temperature-averaging module.

[0075] Related References Figure 7 and Figure 8In the fourth embodiment, the temperature-averaging module 22d is formed by an upper shell 221d and a lower shell 222d being matched to form a hollow shell, which is used to form the heat transfer space 30 inside the temperature-averaging module 22d; wherein the upper shell 221d and the lower shell 222d can be welded together (such as laser welding), but the present invention is not limited thereto. Thus, by using the design that the upper shell 221d and the lower shell 222d are matched to form the temperature-averaging module 22d, the heat transfer space 30 with good sealing effect can be formed. Furthermore, a capillary structure may be disposed between the upper shell 221d and the lower shell 222d of the temperature balancing module 22d. The capillary structure may be formed by sintering copper powder or by using a capillary sheet. For example, when the capillary structure is formed by sintering copper powder, the capillary structure may be formed on the inner side of the upper shell 221d or the lower shell 222d. When a capillary sheet is used, the capillary structure may be disposed between the upper shell 221d and the lower shell 222d. This makes it easier for the vapor to flow back to the top and periphery of the chip 121 after cooling and condensing into the working fluid 31, thereby improving the overall heat exchange effect.

[0076] Related References Figure 7 and Figure 8 In the fourth embodiment, the shell cover 21d has a base 211d and a side peripheral portion 212d, the side peripheral portion 212d surrounds and is connected to the periphery of the base 211d, and the side peripheral portion 212d is combined with the working surface 11 of the base 10. Thus, the design of the side peripheral portion 212d can ensure that the shell cover 21d is firmly combined with the working surface 11 of the base 10.

[0077] Related References Figure 7 and Figure 8 In the fourth embodiment, the side peripheral portion 212d of the shell cover 21d may form a positioning flange 213d, and the positioning flange 213d is combined with the working surface 11 of the base 10. Thus, the design of the positioning flange 213d can effectively increase the combination area of ​​the shell cover 21d and the base 10 to enhance the combination stability between the two.

[0078] Related References Figure 7 and Figure 8 In the fourth embodiment, the temperature averaging module 22d is attached to the chip 121, and the base 211d and the chip 121 clamp and fix the temperature averaging module 22d. In this way, the heat transfer effect of the heat transfer space 30 is effectively improved. A heat conducting medium may be provided between the temperature averaging module 22d and the chip 121, and the heat conducting medium may be a heat conducting film or heat dissipation paste, etc., to ensure that the temperature averaging module 22d is attached to the surface of the chip 121.

[0079] Related References Figure 7 and Figure 8In the fourth embodiment, there is a horizontal distance D between the cover 21d and the heat source 12, and a heat dissipation space 40 can be formed between the cover 21d and the base 10 through the horizontal distance D. Thus, the heat dissipation space 40 can be located around the chip 121. Based on the fact that the heat transfer area R2 is larger than the heat generating area R1, the heat dissipation space 40 is used to cooperate with the heat transfer space 30 to provide an auxiliary heat dissipation effect, so as to further reduce the high heat generated by the actual operation of the chip 121, thereby improving the working efficiency of the chip 121.

[0080] Related References Figure 7 and Figure 8 In the fourth embodiment, the shell cover 21d of the outer seal 20 is provided with at least one exhaust hole 214d, and the exhaust hole 214d is connected to the interior of the shell cover 21d. Thus, the design of the exhaust hole 214d can provide a convection effect between the heat dissipation space 40 and the external space, so as to effectively enhance the auxiliary heat dissipation effect of the heat dissipation space 40; in addition, the exhaust hole 214d can also provide a pressure relief effect to prevent the internal pressure of the heat dissipation space 40 from being too high.

[0081] Fig. 9 A cross-sectional view of a chip device with a uniform temperature heat dissipation structure according to a fifth embodiment of the present invention is shown. Fig. 9 In the fifth embodiment, the temperature balancing module 22d is provided with an extension portion 223d, and the extension portion 223d fills the horizontal distance D. Thus, the temperature balancing module 22d can utilize the extension portion 223d to cover and contact the chip 121 with a larger area, so as to enhance the overall heat dissipation effect.

[0082] The chip device with a uniform temperature heat dissipation structure of the present invention can control the working fluid 31 to perform a heat exchange effect by circulating back through phase change, so as to effectively dissipate heat for the chip 121 of the heat source part 12, ensuring that the chip 121 can maintain normal operation.

[0083] The above embodiments are only for explaining the principle and efficacy of the present invention, but not for limiting the present invention. The modifications and changes made by those skilled in the art to the above embodiments still do not violate the spirit of the present invention. The scope of rights of the present invention shall be as listed in the claims.

Claims

1. A chip device with a uniform temperature heat dissipation structure, characterized in that: include: A base having a working surface, a heat source portion is disposed on the working surface, at least one chip is disposed on the heat source portion, and the chip has a heat generating area relative to a horizontal reference surface; An outer seal, opposite to the working surface of the base, the outer seal and the base together cover the heat source; and a heat transfer space, arranged on the heat generating area, containing a working fluid, wherein the heat transfer space has a heat transfer area relative to the horizontal reference surface, the heat transfer area is larger than the heat generating area of ​​the heat source part, the outer sealing member has a fixing seat and a temperature averaging module, the fixing seat is combined with the working surface of the base, the temperature averaging module is combined with the fixing seat, and the heat transfer space is formed inside the temperature averaging module; The fixing seat is provided with a through positioning hole, and the temperature balancing module is correspondingly engaged with the positioning hole; A horizontal distance is provided between the fixing seat and the heat source part, and a heat dissipation space is formed between the temperature-averaging module and the base through the horizontal distance.

2. The chip device with a uniform temperature heat dissipation structure according to claim 1, characterized in that: The temperature-averaging module is composed of an upper shell portion and a lower shell portion which are relatively matched to form a hollow shell member, which is used to form the heat transfer space inside the temperature-averaging module.

3. The chip device with a uniform temperature heat dissipation structure according to claim 2, characterized in that: A capillary structure is arranged between the upper shell portion and the lower shell portion of the temperature-averaging module.

4. The chip device with a uniform temperature heat dissipation structure according to claim 1, characterized in that: The temperature balancing module is attached to the chip.

5. The chip device with a uniform temperature heat dissipation structure as claimed in claim 4, characterized in that: A heat conducting medium is arranged between the temperature averaging module and the chip.

6. The chip device with a uniform temperature heat dissipation structure according to claim 1, characterized in that: The temperature-averaging module is combined with the peripheral wall of the positioning hole by welding.

7. The chip device with a uniform temperature heat dissipation structure according to claim 1, characterized in that: A positioning flange is formed on the periphery of the fixing seat of the outer sealing member, and the positioning flange is combined with the working surface of the base.

8. The chip device with a uniform temperature heat dissipation structure according to claim 1, characterized in that: The fixing seat of the outer sealing member is provided with at least one exhaust hole, and the exhaust hole is connected to the heat dissipation space.

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