Carrier base module for lighting module

Abstract

A carrier base module (1) for a lighting module for automotive lighting and / or signaling and a method for manufacturing a customizable lighting module are described. The carrier base module (1) for a lighting module for automotive lighting and signaling comprises a module body (2) made of a polymer material, at least two lead frame elements (3a, 3b) embedded in the polymer material of the mounting body, an LED element (4) as a light source mounted on a mounting surface (5) of the module body (2), wherein the mounting surface (5) is arranged in a component potting area (6) in the module body (2) or adjacent to the component potting area (6) in the module body (2). The at least two lead frame elements (3a, 3b) have a first terminal side (8) arranged on the mounting surface (5) or in the component potting area (6) for electrically connecting the LED element (4), and at least two second terminal sides (9) arranged on the mounting surface (5) or in the component potting area (6) so that at least one additional electronic component (7) can be mounted after mechanical assembly of the carrier base module (1) to construct the lighting module.

Description

Technical Field

[0001] The present invention relates to a carrier base module for a lighting module, a lighting module, and a method for manufacturing a customizable lighting module. In particular, the present invention relates to a carrier base module for a lighting module having at least one LED element for automotive lighting and / or signaling. Background Art

[0002] LED components are often used in lighting applications, such as, for example, automotive lighting.

[0003] LED modules usually include at least one LED element and additional electronic components fixed within the module body of the LED module. Typically, the electronic components are first assembled and mounted to the lead frame element and are then bonded to the module body and / or embedded in the material of the module body. Therefore, the lighting module is a self-contained, non-modifiable unit that cannot be easily customized.

[0004] Reference WO 2018 / 069231 A1 describes a thermally self-supporting LED lighting unit comprising a heat sink and an LED module mounted to the heat sink, wherein the LED module comprises a carrier having a plurality of LED dies mounted on the carrier and a plurality of LED electrode contacts formed on the carrier. The heat sink is encapsulated in an outer mold, wherein a mounting surface area of ​​the heat sink is exposed and the LED module is mounted on the mounting surface area. Finally, an electrical interface is also encapsulated in the outer mold and is arranged to electrically connect the LED module to a power source. Summary of the invention

[0005] It may be deemed desirable to provide a carrier base module for a lighting module and a method that allows the lighting module to be modified according to the needs or requirements of a customer.

[0006] It may be considered particularly desirable to provide a lighting module that may be easily modified during a product cycle to support ongoing developments.

[0007] Finally, it would be desirable to provide a lighting module that can be easily adapted to new formats.

[0008] One or several of these objects may be solved by a carrier base module for a lighting module, a lighting module, and a method for manufacturing a customizable lighting module according to some embodiments of the present invention.

[0009] According to one aspect of the invention, a carrier base module for a lighting module, in particular for automotive lighting and / or signaling, and most preferably for automotive headlights, comprises a module body, at least two lead frame elements embedded in a polymer material of the mounting body, an LED element as a light source mounted on a mounting surface of the module body, wherein the mounting surface is arranged in a component potting area in and / or on the module body, or adjacent to a component potting area in and / or on the module body. According to the invention, at least two lead frame elements have a first terminal side arranged on the mounting surface or in the component potting area for electrical connection to the LED element, and at least two second terminal sides - preferably one for each of the lead frame elements - are arranged on the mounting surface or in the component potting area, so that at least one additional electronic component can be mounted after mechanical assembly of the carrier base module to construct the lighting module.

[0010] According to a further aspect of the invention, a lighting module is provided, in particular for automotive lighting and / or signaling, and most preferably for an automotive headlight with a carrier base module according to the invention, wherein at least one electronic component is mounted on a mounting surface and / or in the component potting area.

[0011] According to one aspect of the method (according to the invention), a lighting module based on a standardized carrier base module can be adapted to different specifications. According to some embodiments of the method for manufacturing a customizable lighting module for automotive lighting and / or signaling, first, a module body is constructed of a polymer material, the module body having a component potting area and at least two lead frame elements embedded in the polymer material, wherein at least one terminal side for electrically connecting an LED element and a second terminal side for electrically connecting at least one electronic component are arranged on the module body, and then the carrier base module is constructed by mounting the LED element on the mounting surface of the module body (electrically connected to the terminal side of each of the at least two lead frame elements). Finally, in order to construct the final lighting module, at least one electronic component is mounted in the component potting area and the electronic component is electrically connected to the lead frame element.

[0012] According to a further aspect, the invention may also relate to a method for manufacturing a lighting module, in particular for automotive lighting and / or signaling, comprising the following steps: constructing a module body with a mounting surface for an LED element, a component potting area on the surface of the module body for at least one electronic component, and at least two lead frame elements with at least two terminal sides arranged at the mounting surface and / or the component potting area. After the module body, in particular the carrier base module, is completely completed, at least one electronic component, such as an LED element, is mounted on the mounting surface and the electronic component is electrically connected to the lead frame element. Finally, at least one further electronic component, such as a TVS diode, a thermistor, or a capacitor, is mounted in the component potting area and / or the mounting area and electrically connected to the lead frame element or two further lead frame elements on the second terminal side, thereby adapting the lighting module to the customer's specifications.

[0013] The inventors have recognized that it is advantageous to be able to mount individual electronic components, in particular at least one electronic component in addition to the LED elements, to a standardized carrier base module, in order to continuously adapt the lighting module to ongoing developments and ongoing improvements. Additionally, it is advantageous to be able to easily modify the lighting module during the product cycle by mounting different electronic components to the same carrier base module, in order to support ongoing developments, in particular the efficiency of the LEDs and / or the corresponding electronic circuits. For example, it may be desirable to be able to mount a circuit board for protecting, operating or driving an LED to an otherwise unmodified lighting module immediately after a variant of this component has been developed that has advantageous properties, such as a lower current required to drive the LED at the same flux.

[0014] Further, the inventors have realized that according to the present invention, it may be possible to produce a wide variety of products by combining different light sources, in particular different or several LEDs, with one or several different further electronic components based on an existing lighting module, and in particular without the need for any modification of the carrier base module of the lighting module.

[0015] A lighting module is a component provided to be arranged in a vehicle, in particular for automotive lighting and / or signaling, and is preferably an LED headlight module and more preferably an LED headlight bulb unit. Further, the lighting module is preferably a complete and / or independent unit, which is most preferably arranged in a vehicle lighting system as a single-part unit. Preferably, the lighting module is also constructed as a replaceable part of the lighting system.

[0016] The carrier base module is a part of the lighting module, which comprises a module body made of polymer material, and a lead frame element, and preferably also an LED element. Thus, the carrier base module is a base part of the lighting module, to which further parts, in particular at least one electronic component other than the LED element, are mounted to build the lighting module. The carrier base module is advantageously a universal and / or standardized module for different electronic components, and therefore, the manufacture of the carrier base module may not be affected by variations in the electronic components used.

[0017] The carrier base module, and in particular the module body, has the function of allowing the other parts of the lighting module to be fixedly arranged relative to each other and / or providing a base for mounting other parts of the lighting module, in particular at least one electronic component and / or LED element. Therefore, the module body comprises a mounting surface for the LED element and preferably at least one, more preferably a further electronic component, wherein the mounting surface is preferably a part of the outer surface, in particular the front side, of the lighting module. The mounting surface may have any size and shape. Preferably, the mounting surface is flat and / or adapted to the shape of the at least one LED element. There may be more than one mounting surface on the lighting module, and in particular there may be one mounting surface for each LED element of the lighting module. Alternatively, more than one LED element may be arranged at one mounting surface, and in particular, several LED elements may be arranged in parallel or in series at one mounting surface.

[0018] The LED element may comprise a single LED or several LEDs and / or additional components. The term "LED" is used here to indicate any type of solid-state lighting element, such as a light emitting diode (LED), a laser diode, an organic light emitting diode (OLED), etc., or a group of several identical or different solid-state lighting elements. The LED element may comprise one or several packaged LEDs. Particularly preferred LED elements may be wire-bonded or ribbon-bonded LEDs, wherein the LED most preferably may have a planar light emitting surface. The light emitting surface may preferably have a rectangular shape. Additionally preferably, the LED element may include top contacts and / or contacts on one side of the LED element emitting light.

[0019] The component potting area is an area, and more preferably a cavity, at least partially, in particular completely in the module body for accommodating at least one electronic component. Most preferably, the component potting area is formed by a groove in the surface of the module body. Preferably, the component potting area of ​​the carrier base module is not enclosed by any material of the module body. Particularly preferably, the electronic components can be inserted and / or installed in the component potting area without being embedded in any material, in particular not embedded in polymer materials and / or metal parts. Preferably, after at least one electronic component has been installed, the component potting area is constructed to be potted by potting material, wherein in particular, all electronic components except the LED element can be completely covered by the potting material. The mounting surface can be arranged partially or completely in the component potting area.

[0020] In order to facilitate the ability to customize the lighting module, further electronic components may be mechanically mounted to further parts of the module body and / or the carrier base module. This may include any type of mounting device, such as, for example, a clamping device, a bayonet connection, a snap connection, etc. Thus, the electronic components in the component potting area may be fastened by form fit and / or force closure, but most preferably, are not fully or at least partially integrated into the material of the module body or another part of the lighting module. Additionally or alternatively, the electronic components may be bonded to the module body and / or to further parts of the carrier base module, in particular using thermally and / or electrically conductive adhesives. The electronic components may also be welded or fused to further parts of the module body and / or the carrier base module, in particular to the terminal side of the lead frame elements.

[0021] In order to be able to insert and mount the electronic components in the component potting region of the carrier base module, the component potting region can have at least one, preferably precisely one, potting region opening. The potting region opening can be arranged at any position in the component potting region. Preferably, however, the component potting region has at least one open side, and in particular only one open side, wherein all other sides are closed by the material of the module body.

[0022] The additional electronic component may be any single electronic part, such as a single resistor, a single capacitor, or a single diode, or may be any electronic circuit. In particular, the electronic component is at least one electronic component other than the LED element. There may be several electronic components mounted in the component potting area and / or on the mounting surface. Preferably, each electronic component comprising more than one single electronic part is constructed as an electronic module, wherein the electronic part is more preferably mounted on at least one circuit board, and most preferably precisely on a single circuit board. Preferably, within the specifications and / or as originally intended for the lighting module, all electronic components are constructed and / or arranged in the lighting module to be driven by an unmodified driver circuit, in particular a driver circuit of the lighting system.

[0023] At least two lead frame elements are arranged in the carrier base module to provide an electrical connection to the electronic components of the lighting module and / or between the electronic components of the lighting module, in particular between the components in the component potting area and / or on the mounting surface. Each lead frame element may be made of any electrically conductive material. Preferably, all lead frame elements are made of the same material, in particular a metal or an alloy. The lead frame element may also be part of a printed circuit board. Most preferably, the two lead frame elements are arranged in parallel and / or are identical to each other. Preferably, the two lead frame elements, in particular all lead frame elements, are electrically isolated from each other. There may be more than two lead frame elements, and in particular there may be at least one, preferably two further lead frame elements, to be able to mount at least one electronic component and / or another electronic component that is electrically isolated from the LED element.

[0024] Each lead frame element comprises at least one terminal side and / or is arranged at one terminal side for mounting at least one LED element and / or at least one further electronic component, wherein preferably one terminal side is arranged on or beside a mounting surface for the LED element. Further, the two lead frame elements and / or at least one, preferably two further lead frame elements comprise at least two second terminal sides for electrically connecting at least one further electronic component. Each second terminal side can be arranged at one of the lead frame elements and / or the two second terminal sides can form two contacts for connecting one or several further electronic components.

[0025] It is further preferred that at least one, more preferably all terminal sides are arranged in and / or at the surface of the component potting area and / or the mounting surface. Each terminal side can be a flat surface to provide electrical contact with the electronic components of the lighting module, and is preferably used to weld, bond, or solder the electronic components, LED elements, and / or electrical connectors to the terminal side, in particular for band-bonding the electronic components, LED elements, and / or electrical connectors to the terminal side. Therefore, it is particularly preferred that each terminal side is a bonding pad. More preferably, at each terminal side, a device is provided for electrically connecting at least one electronic component, most preferably by an electrical plug connection or by a plug-in board connection. At least two terminal sides of the lead frame element may be directly arranged adjacent to each other, and / or may be made of a single flat surface. Therefore, the term "terminal side" may refer to one of at least two positions on the larger surface of the lead frame element.

[0026] Mounting at least one electronic component after mechanical assembly of the carrier base module generally means that the assembly of the mechanical components of the carrier base module (in particular including the module body and the lead frame elements) is first completed and the electronic component is then mounted in the preferably mechanically finished carrier base module. Most preferably, all mechanical, non-electronic components of the carrier base module are assembled first. Finally, the finished carrier base module can be adapted to the customer's specifications by adding specifically selected electronic components and / or at least one LED element to the mounting surface and / or the component potting area.

[0027] In order to help dissipate the heat generated by the LED element and / or in particular the electronic components mounted directly adjacent to the LED element, in a preferred embodiment of the carrier base module and / or the lighting module, a heat sink element is arranged on the module body, in particular in the area of ​​the mounting surface, and most preferably directly between the module body and the LED element, and particularly preferably the LED element is mounted directly to the surface of the heat sink element. Preferably, the heat sink element covers at least the area of ​​the LED element on the mounting surface of the module body, and is particularly preferably at least 25%, more preferably 50%, and most preferably 100% larger than the area of ​​the LED element. Further preferably, the heat sink element is not in contact with the lead frame element and / or is arranged adjacent to the lead frame element. The heat sink element can be placed on the surface of or in the module body. It is particularly preferred that the heat sink element is at least partially, preferably completely, embedded in the polymer material of the module body.

[0028] The heat sink should be made of a material with good thermal conductivity, preferably a metal, in particular including aluminum and / or copper. The heat sink can be made in one piece, or can include several parts joined together.

[0029] In a preferred embodiment, the second terminal side of each lead frame element is in the component potting area and / or the second terminal side is arranged in the component potting area, which is directly adjacent to the first terminal side of the same lead frame element and / or directly adjacent to the LED element, which advantageously allows at least one electronic component to be arranged to be mounted in electrical parallel connection with the LED element and / or in close proximity to the LED element. Additionally, several electronic components of the lighting module can be arranged in series and / or in parallel in the component potting area.

[0030] The LED element can be electrically connected to the first and / or second terminal side of at least two lead frame elements (and preferably precisely two lead frame elements) of the lighting module by means of an electrical connector, wherein each of the two electrical connectors most preferably allows a connection by wire or ribbon bonding. It is particularly preferred that the LED element and / or at least one electronic component is electrically connected to the lead frame element via ribbon bonding. Therefore, preferably, the electrical connector is electrically connected - preferably glued, welded, or soldered - to each of the two lead frame elements for electrically connecting the LED element and / or the electronic component to each lead frame element. It is particularly preferred that two pins or other connection points of the LED element are each connected to one lead frame element by means of one electrical connector.

[0031] The electronic component of the lighting module, which can be mounted in the component potting area and / or on the mounting surface and / or at one terminal end of the lead frame element, can be any electronic part or any electronic circuit. Preferably, the electronic component includes and more preferably is a Bin code resistor and / or a thermistor and / or a TVS diode and / or a capacitor, which is most preferably mounted between two lead frame elements and / or adjacent to the LED element. The Bin code resistor can be used to determine the current used to drive the LED element. The TVS diode is a transient voltage suppression diode, which can be used to protect the LED element from electrostatic discharge (ESD). The TVS diode is preferably installed adjacent to the LED element and / or electrically connected in parallel with the LED element. The TVS diode is most preferably a bidirectional TVS diode. The electronic component can also be a capacitor, which is also preferably installed adjacent to the LED element and / or another electronic component, and / or electrically connected in parallel with the LED element and / or another electronic component. The capacitor can be arranged in parallel with the LED element and / or the electronic component on the same terminal side or spaced apart on the other terminal sides of the same lead frame element. The thermistor is a thermal resistor and may have a negative or positive temperature coefficient. Most preferably, the thermistor is an NTC. The thermistor is preferably mounted on a mounting surface of the lighting module, more preferably in close proximity to the LED element, and most preferably in close proximity to the LED element. It is further preferred that the thermistor and / or the TVS diode and / or the Bin code resistor are mounted to two further lead frame elements and / or are mounted to be electrically independent and electrically isolated from the LED element. Generally, the further lead frame elements preferably also each have at least one terminal side, most preferably arranged directly adjacent to the LED element.

[0032] According to a further preferred embodiment, the component potting area of ​​the lighting module has a coating, a covering and / or is encapsulated in a protective material to protect the electronic components in the component potting area and / or on the mounting surface from the environment and / or from human contact with the electronic components. Most preferably, the electronic components and / or the complete lighting module are sealed. Preferably, the module body is potted except for the LED elements and / or the openings for the LED elements. The potting of the potting area, and in particular the potting of the recesses in the module body, is preferably done with a polymer material, in particular a silicone material.

[0033] It is further preferred that at least two second terminal sides are arranged in component potting regions on at least two different leadframe elements, advantageously allowing connection of at least one further electronic component, more preferably electrically independent from the LED element and / or the further electronic component.

[0034] According to a preferred embodiment, the module body and / or the lighting module comprises a recess around the mounting surface for the LED element. It is further preferred that at least one terminal side, preferably all terminal end sides, of each of the two lead frame elements are arranged in the area of ​​the recess (around the mounting surface for the LED element), and most preferably at least one further electronic component is mounted between the two lead frame elements, in particular in the recess and / or adjacent to the LED element, advantageously allowing easy mounting of the further electronic component at a fairly accessible position of the lighting module and / or advantageously in the immediate vicinity of the LED element. The area in the recess of the module body for the LED element is preferably not completely covered by the LED element, so that at least one, preferably several further electronic components can be mounted next to the LED element.

[0035] According to one embodiment, the recesses and / or openings of the potting area are arranged in the module body on a side of the module body including the mounting surface and / or LED elements, advantageously allowing mounting of electronic components without affecting the LED elements on the front side of the lighting module.

[0036] According to a favorable embodiment of the method, after placing the electronic components, the potting component potting area is potted, in particular by potting with a silicone material. Preferably, all electronic components in the component potting area and / or all strip bonding objects are completely potted, i.e. covered by potting material. Particularly preferably, some LED elements are also covered by potting material, wherein the light-emitting area of ​​the LED element is not potted and does not have potting material. It is also preferred that during the construction of the module body, at least one radiator element is embedded in the module body in the area of ​​the mounting surface. Finally, it may be advantageous that the LED element and / or at least one electronic component is electrically connected to the terminal side of the lead frame element via strip bonding.

[0037] These and other aspects of the invention will be apparent from and elucidated with reference to the embodiments described hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 shows a perspective view of a cross section of an embodiment of a carrier base module with portions of an exterior surface removed;

[0039] Figure 2 Shows Figure 1 Another perspective view of the carrier base module, wherein the outer surface is closed;

[0040] Figure 3 shows a detailed perspective view of the mounting surface of a carrier base module with TVS diodes mounted to two lead frame elements in the component potting area;

[0041] Figure 4 shows a detailed perspective view of the mounting surface of the carrier base module with thermistors mounted to additional lead frame elements in the component potting area;

[0042] Figure 5 Another perspective view of the carrier base module is shown with the Bin code resistors mounted to additional lead frame elements in the component potting area; and

[0043] Figure 6 Another detailed perspective view of the mounting surface of the carrier base module is shown with the thermistor mounted to an additional lead frame element by ribbon bonding. DETAILED DESCRIPTION

[0044] Figure 1 and Figure 2 An embodiment of a carrier base module 1 for a lighting module is shown in . The module body 2 of the carrier base module 1 is made of a polymer material and comprises a component potting area 6 formed as a recess 11 in the module body 2. In the component potting area 6, one or several electronic components 7, such as a controller circuit board, can be arranged and electrically connected to each of the two lead frame elements 3a, 3b.

[0045] The lead frame elements 3a, 3b are arranged with a second terminal side 9 in the component potting area 6 and with a first terminal side 8 directly adjacent to a mounting surface 5 in a recess 11 of the carrier base module 1. The mounting surface 5 is a flat surface on the front side of the carrier base module 1 and thus of the lighting module, in which the LED elements 4 and further electronic components 7 can be arranged.

[0046] The LED elements 4 comprise three individual rectangular LEDs with their flat surfaces connected to a single substrate mounted directly on the mounting surface 5 of the carrier base module 1. Below the LED elements 4, a metal heat sink element 10 is embedded in the surface of the module body 2 for conducting heat away from the LED elements 4 during operation. The LED elements 4 are electrically connected to the first terminal side 8 of each of the lead frame elements 3a, 3b via metal connectors 12 for ribbon bonding.

[0047] In a complete lighting module constructed by a carrier base module 1 and at least one electronic component 7, a groove 11 including a component potting area 6 and a mounting surface 5 is closed by a silicone layer, which is inserted into the groove 11 on the outer surface of the module body 2, thereby potting the component potting area 6.

[0048] To manufacture the lighting module, first, a carrier base module 1 is constructed of a polymer material, the carrier base module 1 having a component potting area 6 and at least two lead frame elements 3a, 3b embedded in the polymer material. The carrier base module 1 has at least two terminal sides 8, 9 of each of the lead frame elements 3a, 3b arranged on the module body 2, wherein at least one surface is accessible for electrically connecting at least one electronic component 7. Then, in the region of the mounting surface 5 of the module body 2, an LED element 4 is mounted directly on a heat sink element 10 embedded in the module body 2, wherein the LED element 4 is electrically connected to the first terminal sides 8 of the at least two lead frame elements 3a, 3b.

[0049] Thereafter, at least one electronic component 7 is mounted to the mounting surface 5 and / or in the component potting area 6 of the standardized carrier base module 1 and electrically connected to the lead frame elements 3a, 3b and / or further lead frame elements 3c, 3d for building a final lighting module.

[0050] An electronic component 7, such as a TVS diode, may be arranged in parallel with the LED element 4 and electrically connected to the second terminal side 9 of each of the two lead frame elements 3a, 3b (see Figure 3 Alternatively or additionally, electronic components 7 (such as thermistors or Bin code resistors) may be mounted to two additional lead frame elements 3c, 3d which are not electrically connected to the first two lead frame elements 3a, 3b (see Figure 4 ). The electronic component 7 may be mounted directly on the terminal side 9 of the second pair of lead frame elements 3c, 3d (see Figure 4 ), or possibly mounted to a mounting surface 5 via a ribbon bond connection (see Figure 6 ).

[0051] Finally, on the mounting surface 5 and in the component potting area 6 there may be a further second terminal side 9 which may be isolated or electrically connected to the first two lead frame elements 3a, 3b or to further lead frame elements 3c, 3d (see Figure 5 ).

[0052] While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive; the invention is not limited to the disclosed embodiments.

[0053] In particular, the LED elements 4 including the number and specific shapes of the LEDs should be considered exemplary; different shapes, numbers and sizes are possible. Further, in alternative embodiments, the shape and size of the module body 2 can be selected differently. Finally, the position of the recess 11 of the component potting area 6 and the position around the mounting surface 5 can also be arranged at different positions on the module body 2.

[0054] These and other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a study of the drawings, the disclosure, and the appended claims.

[0055] In the claims, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" or "an" does not exclude a plurality.

[0056] The mere fact that certain measures or features are recited in mutually different dependent claims or disclosed in a separate embodiment does not indicate that a combination of these measures and features cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.

Claims

1. A carrier base module, comprising: a module body comprising a heat sink element partially covered in a polymer material, a portion of the heat sink element emerging from the polymer material and forming both a component potting area and a mounting surface adjacent the potting area; a plurality of lead frame elements, at least two of the plurality of lead frame elements comprising a first portion and a second portion on the component potting area, and remaining portions of at least two of the plurality of lead frame elements being embedded in the polymer material of the mounting body, such that after mechanical assembly of the carrier base module, at least one additional electronic component is mounted on the second portion of at least two of the plurality of lead frame elements to construct a lighting module; and an LED element on a mounting surface of the module body and electrically coupled to a first portion of at least two of the plurality of lead frame elements; Wherein the first portion and the second portion of at least two of the plurality of lead frame elements are continuous.

2. The carrier base module of claim 1, wherein the heat sink element is in contact with the LED element. 3 . The carrier base module of claim 1 , wherein the second portion for each of at least two of the plurality of lead frame elements is arranged in the component potting area directly adjacent to the first portion of the same lead frame element. 4 . The carrier base module of claim 1 , wherein the mounting surface and the component potting area are disposed within a recess in the polymer material.

5. The carrier base module of claim 1 , further comprising one of a first ribbon bond or a first wire bond electrically coupled between a first portion of at least two of the plurality of lead frame elements and the LED element, and one of a second ribbon bond or a second wire bond electrically coupled between a first portion of another of at least two of the plurality of lead frame elements and the LED element.

6. An automobile lighting system, comprising: a module body comprising a heat sink element partially covered in a polymer material, a portion of the heat sink element emerging from the polymer material and forming both a component potting area and a mounting surface adjacent the potting area; a plurality of lead frame elements, at least two of the plurality of lead frame elements comprising a first portion and a second portion on the component potting area, and remaining portions of at least two of the plurality of lead frame elements being embedded in the polymer material of the mounting body, such that after mechanical assembly of the carrier base module, at least one additional electronic component is mounted on the second portions of at least two of the plurality of lead frame elements to construct a lighting module; an LED element on a mounting surface of the module body and electrically coupled to a first portion of at least two of the plurality of lead frame elements; and at least one electronic component mounted on the second portion of at least two of the plurality of lead frame elements; Wherein the first portion and the second portion of at least two of the plurality of lead frame elements are continuous.

7. The system of claim 6 , wherein the plurality of lead frame elements comprises two additional lead frame elements, each lead frame element comprising a first portion and a second portion on the component potting area, and the remaining portions of the two additional lead frame elements embedded in the polymer material of the mounting body, and the system further comprises at least one additional electronic component electrically coupled to the first portion of each of the two additional lead frame elements.

8. The system of claim 6, wherein the at least one electronic component is a TVS diode mounted in parallel to the LED element.

9. The system of claim 6, wherein the mounting surface and the component potting area are disposed within a recess in the polymer material, and the system further comprises a potting material in the potting area in the recess and over the at least one electronic component.

10. The system of claim 6, wherein the at least one electronic component is another LED element.

11. The system of claim 6, further comprising at least one capacitor mounted in parallel to at least one of the at least one electronic component and / or the LED element.

12. The system of claim 6, wherein the at least one additional electronic component comprises at least one of a Bin code resistor or a thermistor.

13. A method for manufacturing a customizable lighting module, the method comprising: constructing a module body by covering at least a heat sink element with a polymer material such that a portion of the heat sink element emerges from the polymer material to form both a component potting region and a mounting surface adjacent the potting region; partially embedding at least two lead frame elements in the polymer material such that first and second portions of the at least two lead frame elements are over the component potting region and are continuous portions of the at least two lead frame elements, and remaining portions of at least two of the plurality of lead frame elements are embedded in the polymer material; mounting an LED element on the mounting surface to electrically couple the LED element to the first portions of the at least two lead frame elements; as well as After mounting the LED element, at least one electronic component is mounted on the second portions of the at least two lead frame elements. 14 . The method of claim 13 , further comprising potting the component potting region with a potting material after mounting the electronic component.

15. The method of claim 13, further comprising electrically coupling first portions of the at least two lead frame elements to the LED element. The method of claim 15 , wherein the electrical coupling comprises one of ribbon bonding or wire bonding.

17. The method of claim 13, wherein mounting the at least one electronic component comprises electrically coupling the at least one electronic component in parallel to the LED element.

18. The method of claim 13, wherein mounting the LED component on the mounting surface comprises mounting the LED component directly to the heat sink component.

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