A coupling structure between a silicon photonics chip and an active chip

Abstract

The present application discloses a coupling structure between a silicon photonics chip and an active chip. The coupling structure includes: a silicon photonics chip, a ceramic substrate, a ceramic ferrule, a capillary, an active chip assembly, metal pins, and a single-mode optical fiber. The silicon photonics chip is disposed on one side of the ceramic substrate. The ceramic ferrule is opposite to and on the same side as the silicon photonics chip and is disposed on one side of the ceramic substrate. A pedestal is provided inside the ceramic ferrule. The active chip assembly is disposed on the pedestal of the ceramic ferrule. The single-mode optical fiber is respectively connected to the active chip assembly and the silicon photonics chip to transmit light. The capillary is used to hermetically seal the active chip assembly. The metal pins are electrically connected to the active chip inside the active chip assembly to provide driving energy. The coupling structure can reduce the size and packaging cost of the coupling package. At the same time, the coupling structure solves the reliability problem of the hermetic packaging of the active chip.

Description

Technical Field

[0001] This application relates to the field of chip technology, and specifically to a coupling structure between a silicon photonics chip and an active chip. Background Art

[0002] With the rapid development and wide application of 5G technology, the requirements for high speed of the current communication network are continuously increasing. Silicon materials have received great attention due to their advantages such as easy integration, compatibility with CMOS process, and sufficient content. Currently, the preparation of silicon photodetectors and electro-optic modulators has been realized, and the application of silicon photonics chips has also become an important research direction. Among them, the coupling and packaging of silicon photonics chips and active chips is an important part of realizing the application of silicon photonics chips. Since silicon photonics chips cannot emit light by themselves, existing silicon photonics products need to be coupled and packaged with active chips. Currently, there are two common methods: 1) The active chip is independently packaged by using TO (TO transistor outline package, for example, TO-92, TO-92L, TO-220, TO-252, etc. are all insertion package designs) or a gold shell, and then coupled with the silicon photonics chip; 2) The active chip and the silicon photonics chip are attached to the circuit board and coupled through a lens or directly. (1) For the first method, when the active chip uses TO and gold shell methods, this type of package requires a free space lens, which increases the cost and size and is not conducive to the low cost and miniaturization of the silicon photonics chip package; (2) For the second method, the active chip is exposed outside. Under this structure, there are strict requirements for the non-hermeticity of the active chip itself, the technical difficulty is relatively large, which limits the source of the active chip, increases the cost of the supply chain, and reduces the reliability of the component.

[0003] Therefore, a new coupling structure between a silicon photonics chip and an active chip is needed. Summary of the Invention

[0004] To overcome the above defects, one of the purposes of this application is to propose a new coupling structure between a silicon photonics chip and an active chip. Under this coupling structure, the size and cost of the coupling and packaging can be reduced, and at the same time, the reliability problem of the non-hermetic packaging of the active chip can be solved.

[0005] To solve the above technical problems, this application adopts the following technical solutions:

[0006] A coupling structure between a silicon photonics chip and an active chip, characterized by comprising: a silicon photonics chip, a ceramic substrate, a ceramic ferrule, a capillary, an active chip assembly, metal pins, and a single-mode optical fiber.

[0007] The silicon photonics chip is disposed on one side of the ceramic substrate.

[0008] The ceramic ferrule is disposed on one side of the ceramic substrate opposite to and on the same side as the silicon photonics chip. A pedestal is provided therein, and the active chip assembly is disposed on the pedestal.

[0009] The single-mode optical fiber is respectively connected to the active chip assembly and the silicon photonics chip to transmit light.

[0010] The capillary tube is used to hermetically seal the active chip assembly.

[0011] The metal pin is electrically connected to the active chip in the active chip assembly to provide driving energy.

[0012] In one embodiment, the capillary tube is disposed outside the ceramic ferrule and is used to hermetically seal the active chip assembly so that the active chip assembly is isolated from the external environment.

[0013] In one embodiment, at least two through holes are provided on one side of the metal pin. One through hole passes through a gold wire for connecting the positive electrode, and one through hole passes through a gold wire for connecting the negative electrode.

[0014] In one embodiment, the active chip assembly is fixed on the pedestal by silver glue.

[0015] In one embodiment, the active chip assembly is configured with a mode field converter.

[0016] In one embodiment, a substrate is disposed in the ceramic ferrule, through which the light output position of the active chip assembly is aligned with the end face of the single-mode optical fiber.

[0017] In one embodiment, at least two parts are disposed on the substrate. One part is the bottom negative electrode of the active chip, and one part is the positive electrode of the active chip. The bottom negative electrode and the bottom positive electrode are respectively led out through gold wires.

[0018] In one embodiment, the silicon photonics chip 11 is configured with a light inlet, which is located on the upper side of the silicon photonics chip and is perpendicular to the optical fiber.

[0019] In one embodiment, the coupling structure between the silicon photonics chip and the active chip includes an optical fiber with a 45-degree bevel, which is used to directly couple light into the grating light port through reflection, thereby realizing coupling.

[0020] Advantageous Effects

[0021] Compared with the solutions in the prior art, the advantageous effects of the present application are as follows:

[0022] The coupling structure between the silicon photonics chip and the active chip proposed in the present application removes the lens in the existing coupling structure, reduces the size and cost of the coupling package, solves the problem of non-hermetic packaging of the active chip, and improves the reliability of the connection between the silicon photonics chip and the active chip. Description of the Drawings

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings, where:

[0024] Figure 1 Schematic diagram of the coupling structure between the silicon optical chip and the active chip in the embodiment of the present application;

[0025] Figure 2 is Figure 1 a side sectional view from one perspective;

[0026] Figure 3 Schematic diagram of the coupling structure between the silicon optical chip and the active chip in another embodiment of the present application;

[0027] Figure 4 is Figure 3 the schematic diagram of the coupling structure between the silicon optical chip and the active chip in;

[0028] Figure 5 is Figure 3 a side sectional view from one perspective. Detailed Embodiments

[0029] The above solution will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are used to illustrate the present application and are not limited to restricting the scope of the present application. The implementation conditions adopted in the embodiments can be further adjusted according to the conditions of specific manufacturers, and the implementation conditions not specified are usually the conditions in conventional experiments.

[0030] In order to better illustrate the present disclosure, numerous specific details are given in the following detailed embodiments. Those skilled in the art should understand that the present disclosure can be implemented without some specific details. In some instances, methods, means, elements, and circuits well-known to those skilled in the art are not described in detail in order to highlight the gist of the present disclosure. The drawings include schematic diagrams, and there will be situations where the scale of each component and the aspect ratio in the vertical and horizontal directions are different from the actual ones

[0031] The present application proposes a coupling structure between a silicon optical chip and an active chip, and this structure uses a ceramic ferrule to achieve coupling with the silicon optical chip. In this coupling structure, the lens in the coupling between the active chip and the silicon optical chip is removed, and at the same time, the reliability problem of the non-hermetic packaging of the active chip is solved.

[0032] Next, in combination with the attached Figures 1 - 5The coupling structure of the silicon photonics chip and the active chip proposed in this application will be described in detail. The accompanying drawings include schematic diagrams, and there will be situations where the scales and aspect ratios of various components are different from the actual ones.

[0033] Embodiment 1

[0034] The following will describe the coupling structure of the silicon photonics chip and the active chip in an embodiment in combination with Figure 1 and Figure 2 The coupling structure 100 of the silicon photonics chip and the active chip in an embodiment includes:

[0035] A silicon photonics chip 1, a ceramic substrate 2, a ceramic ferrule 3, a capillary 4, an active chip component 5, a metal pin 6, and a single-mode optical fiber 7.

[0036] The silicon photonics chip 1 is disposed on one side of the ceramic substrate 2, and the active chip component 5 is disposed opposite to and on the same side as the silicon photonics chip 1.

[0037] The ceramic ferrule 3 is disposed opposite to and on the same side as the silicon photonics chip 1 on one side of the ceramic substrate 2. A base 301 is provided inside it, and the active chip component 5 is disposed on the base 301 of the ceramic ferrule. The ceramic ferrule 3 is used as a carrier for fixing the single-mode optical fiber 7 and the active chip component 5.

[0038] The single-mode optical fiber 7 is respectively connected to the active chip component 5 and the silicon photonics chip 1 to transmit light.

[0039] The capillary 4 wraps the ceramic ferrule 3 inside, and it is used to hermetically seal the active chip component. In this way, the capillary 4 isolates the fixed active chip component from the external environment and plays a protective role.

[0040] The metal pin 6 is electrically connected to the active chip inside the active chip component 5 to provide driving energy. In this embodiment, at least two through holes are disposed on one side of the ceramic ferrule 3, one of which is connected to the positive electrode and the other is connected to the negative electrode, realizing external power supply for the active chip. The ceramic substrate is the base of the entire coupling structure and also has a heat dissipation function. In this way, components such as the silicon photonics chip and the ceramic ferrule are fixed on the substrate with a specific glue, and different heat dissipation materials can be selected according to different requirements. The heat generated when the silicon photonics chip and the active chip operate is transferred out through the ceramic substrate. The silicon photonics chip serves as an optical modulator and emits the light modulated by the active chip. The coupling method of the silicon photonics chip implemented in this application uses a ceramic pin to realize the coupling structure between the active chip and the silicon photonics chip. Under this coupling structure, the lens in the coupling of the active chip and the silicon photonics chip is removed, and at the same time, the reliability problem of non-hermetic packaging of the active chip is solved.

[0041] In one embodiment, after the active chip component is positioned properly, it is fixed on the base of the ceramic ferrule using glue (silver glue). The active chip component is configured with a mode spot converter structure. Preferably, the coupling efficiency is monitored through the output surface of the single-mode optical fiber to determine the position accuracy of the active chip.

[0042] In one embodiment, the active chip component is soldered on the ceramic substrate 2 or the base, and the light output height is adjusted.

[0043] When fabricating the coupling structure,

[0044] The silicon photonics chip is mounted on the preset pattern substrate of the ceramic substrate 2 using glue (such as silver glue);

[0045] The ceramic ferrule is configured such that the middle part is not completely hollowed out, leaving a part of the substrate so that the light output position of the active chip component is exactly aligned with the end face of the single-mode optical fiber, and a pattern (pattern plating) is designed on the substrate to divide the bottom into at least two parts, one part being the negative electrode at the bottom of the active chip, and one part being the positive electrode of the active chip led out through a gold wire.

[0046] The rear end of the ceramic cannula is configured with at least two through holes, one for connecting the positive electrode and one for connecting the negative electrode, and is led out through metal pins, thus realizing the power supply to the active chip. In this embodiment, the volume of the ceramic ferrule is fully utilized while being conducive to integration.

[0047] Embodiment 2

[0048] The following describes a coupling structure between a silicon photonics chip and an active chip in one embodiment. The module 200 of this coupling structure includes: Figures 3 - 5 The silicon photonics chip 201, the ceramic substrate 202, the ceramic ferrule 203, the capillary 204, the active chip component 205, the metal pins 206, and the single-mode optical fiber 207.

[0049] The silicon photonics chip 201 is disposed on one side of the ceramic substrate 202, and the active chip component 205 is disposed opposite to and on the same side as the silicon photonics chip 201; the silicon photonics chip 201 is configured with a light input port 2011 (also referred to as a grating light port), which is located above the silicon photonics chip and is perpendicular to the single-mode optical fiber.

[0050] The ceramic ferrule 203 is disposed opposite to and on the same side as the silicon photonics chip 201 on one side of the ceramic substrate 202, and a base 2032 is provided therein. The active chip component 205 is disposed on the base 2032 of the ceramic ferrule 203, which serves as a carrier for fixing the single-mode optical fiber 207 and the active chip component 205.

[0051]

[0052] ​The single-mode optical fiber 207 is respectively connected to the active chip component 205 and the silicon photonics chip 201 (a light inlet 2011, i.e., a grating optical port, and two electrodes 2012 are arranged on the silicon photonics chip 201) to transmit light;

[0053] The capillary 204 wraps the ceramic ferrule 203 to hermetically seal the active chip component 205;

[0054] The metal pin 206 is electrically connected to the active chip in the active chip 205 component to provide driving energy. In this embodiment, an optical fiber with a 45-degree bevel ( Figure 4 the end face of the optical fiber in 2031 is a 45-degree bevel) is used to directly couple the light into the grating optical port by reflection, thereby achieving coupling.

[0055] The size of the module adopting the above coupling structure is much smaller than that of the existing products and has a lower cost at the same time.

[0056] It should be noted that in this application, the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "middle", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe this application and its embodiments, and are not used to limit that the indicated device, element or component must have a specific orientation, or be constructed and operated in a specific orientation. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0057] In the description of the above embodiments, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the connection inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations. In addition, in the description of the present invention, unless otherwise stated, the meaning of "a plurality" is two or more.

[0058] The above embodiments are only for illustrating the technical concept and features of this application, and their purpose is to enable those who are familiar with this technology to understand the content of this application and implement it accordingly, and cannot be used to limit the protection scope of this application. Any equivalent transformation or modification made according to the spirit and essence of this application should be covered within the protection scope of this application.

Claims

1. A coupling structure between a silicon photonic chip and an active chip, characterized in that, It has: a silicon photonics chip, a ceramic substrate, a ceramic ferrule, a capillary, an active chip component, metal pins and a single-mode optical fiber. The silicon photonics chip is disposed on one side of the ceramic substrate. The silicon photonics chip is configured with a light inlet, which is located on the upper side of the silicon photonics chip and is perpendicular to the single-mode optical fiber; The ceramic ferrule is disposed on one side of the ceramic substrate opposite to and on the same side as the silicon photonics chip. A pedestal is provided therein, and the active chip component is disposed on the pedestal; at least two parts are configured on the pedestal, wherein one part serves as the negative electrode of the active chip and the other part serves as the positive electrode of the active chip, and the negative electrode and the positive electrode are respectively led out by gold wires; The single-mode optical fiber is respectively connected to the active chip component and the silicon photonics chip to transmit light; The capillary is disposed outside the ceramic ferrule and is used for hermetically packaging the active chip component to isolate the active chip component from the external environment; One end of the ceramic ferrule is provided with the metal pins. At least two through holes are provided on one side of the metal pins. One through hole passes through the gold wire to connect the positive electrode, and the other through hole passes through the gold wire to connect the negative electrode. The other end of the ceramic ferrule is inserted into the single-mode optical fiber, and the light output position of the active chip component is aligned with the end face of the single-mode optical fiber; The metal pins are electrically connected to the active chip in the active chip component to provide driving energy.

2. The coupling structure of the silicon photonics chip and the active chip according to claim 1, wherein The active chip component is fixed on the pedestal by silver glue.

3. The coupling structure of the silicon photonics chip and the active chip according to claim 2, characterized in that, The active chip component is configured with a mode spot converter.

4. The coupling structure of the silicon photonics chip and the active chip according to claim 1, wherein It includes an optical fiber with a 45-degree bevel, which is used to directly reflect light into the light inlet to achieve the coupling of the silicon photonics chip.

Images