Control method, circuit, device and electronic device of independent display chip

Abstract

The present application discloses a control method, circuit, device and electronic device for an independent display chip, which belongs to the field of computer control technology. The method includes: obtaining a first temperature value of the independent display chip; determining a target operating mode of a target functional module according to the first temperature value, wherein the independent display chip includes the target functional module, the target functional module includes at least two operating modes, and the power consumption of the target functional module is different under different operating modes; controlling the target functional module to operate in the target operating mode. The embodiment of the present application adjusts the operating mode of the target functional module in the independent display chip according to the temperature of the independent display chip, which can improve the control effect of the independent display chip.

Description

Technical Field

[0001] The present application belongs to the field of computer control technology, and specifically relates to a control method, circuit, device and electronic equipment of an independent display chip. Background Art

[0002] With the development of science and technology and the improvement of living standards, users are pursuing higher and higher display effects of display devices. In order to meet the needs of users, independent display enhancement chips (hereinafter referred to as "independent display chips") have been produced. The independent display chip processes the data source, such as data interpolation and image noise reduction, and processes the display content through special algorithms to achieve the purpose of improving the smoothness of the picture, improving the quality of the displayed picture, and improving the screen display effect.

[0003] However, current independent display chips usually only determine how to process data based on the needs of actual application scenarios. For example, in a game application scenario, the interpolation function module is turned on to utilize the interpolation function module to increase the refresh rate of the game interface.

[0004] As can be seen from the above, the independent display chip in the related art only determines which functional modules to turn on according to the needs of the actual application scenario, and its control effect is poor. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a control method, circuit, device and electronic device for an independent display chip, which can solve the problem of poor control effect caused by the independent display chip in the related art only determining which functional modules to turn on according to the needs of the actual application scenario.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] In a first aspect, an embodiment of the present application provides a control method for an independent display chip, the method comprising:

[0008] Acquire a first temperature value of an independent display chip;

[0009] Determining a target operating mode of a target functional module according to the first temperature value, wherein the independent display chip includes the target functional module, the target functional module includes at least two operating modes, and the power consumption of the target functional module is different in different operating modes;

[0010] Control the target functional module to operate in the target operating mode.

[0011] In a second aspect, an embodiment of the present application provides an independent display chip control circuit, comprising: an independent display chip, and a temperature detection unit arranged corresponding to the independent display chip;

[0012] The independent display chip comprises: a chip control unit and N functional modules, where N is a positive integer;

[0013] The chip control unit is connected to the temperature detection unit and the N functional modules respectively;

[0014] The chip control unit is used to obtain a first temperature value of the independent display chip collected by the temperature detection unit, determine a target operating mode of a target functional module according to the first temperature value, and control the target functional module to operate in the target operating mode;

[0015] The N functional modules include the target functional module, the target functional module includes at least two working modes, and the power consumption of the target functional module is different in different working modes.

[0016] In a third aspect, an embodiment of the present application provides an electronic device, comprising the independent display chip control circuit as described in the second aspect.

[0017] In a fourth aspect, an embodiment of the present application provides a control device for an independent display chip, including:

[0018] An acquisition module, used for acquiring a first temperature value of an independent display chip;

[0019] a determination module, configured to determine a target operating mode of a target functional module according to the first temperature value, wherein the independent display chip includes the target functional module, the target functional module includes at least two operating modes, and the power consumption of the target functional module is different in different operating modes;

[0020] The control module is used to control the target functional module to operate in the target operating mode.

[0021] In a fifth aspect, an embodiment of the present application provides an electronic device, which includes a processor, a memory, and a program or instruction stored in the memory and executable on the processor, wherein the program or instruction, when executed by the processor, implements the steps of the method described in the first aspect.

[0022] In a sixth aspect, an embodiment of the present application provides a readable storage medium, on which a program or instruction is stored, and when the program or instruction is executed by a processor, the steps of the method described in the first aspect are implemented.

[0023] In a fifth aspect, an embodiment of the present application provides a chip, comprising a processor and a communication interface, wherein the communication interface is coupled to the processor, and the processor is used to run a program or instruction to implement the method described in the first aspect.

[0024] In an embodiment of the present application, a first temperature value of an independent display chip is obtained; a target operating mode of a target functional module is determined according to the first temperature value, wherein the independent display chip includes the target functional module, the target functional module includes at least two operating modes, and the power consumption of the target functional module is different in different operating modes; the target functional module is controlled to operate in the target operating mode. In this way, the operating mode of the target functional module in the independent display chip can be adjusted according to the first temperature value of the independent display chip. In view of the different power consumption of the target functional module in different operating modes, more flexible power consumption control of the independent display chip can be achieved to improve the control effect of the independent display chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is a flow chart of a control method of an independent display chip provided in an embodiment of the present application;

[0026] Figure 2 It is a corresponding relationship diagram between the temperature of the independent display chip and each working mode of the target functional module;

[0027] Figure 3 is a corresponding relationship diagram between the temperature of an independent display chip and the surface temperature of an electronic device where the independent display chip is located;

[0028] Figure 4 It is one of the structural schematic diagrams of the independent display chip control circuit to which the independent display chip control method provided by the embodiment of the present application can be applied;

[0029] Figure 5 is a schematic diagram of the structure of the temperature detection unit;

[0030] Figure 6 This is a second structural schematic diagram of an independent display chip control circuit to which the independent display chip control method provided in the embodiment of the present application can be applied;

[0031] Figure 7 is a structural diagram of an electronic device provided in an embodiment of the present application;

[0032] Figure 8 is a structural diagram of a control device for an independent display chip provided in an embodiment of the present application;

[0033] Fig. 9 is a schematic diagram of the structure of another electronic device provided in an embodiment of the present application;

[0034] Fig.10 It is a schematic diagram of the hardware structure of another electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0037] In combination with the accompanying drawings, the control method of the independent display chip, the control circuit of the independent display chip, the control device of the independent display chip, the electronic device and the readable storage medium provided in the embodiments of the present application are described in detail through specific embodiments and their application scenarios.

[0038] See also Figure 1 The control method of the independent display chip provided in the embodiment of the present application may be executed by a control unit in an electronic device having the independent display chip, or by a chip control unit inside the independent display chip. For the sake of convenience, the following embodiments will be specifically described using the chip control unit inside the independent display chip as an example, which does not constitute a specific limitation.

[0039] like Figure 1 As shown, the control method of the independent display chip provided in the embodiment of the present application may include the following steps:

[0040] Step 101: Obtain a first temperature value of an independent display chip.

[0041] In a specific implementation, the first temperature value can be obtained by detecting a temperature detection device corresponding to the independent display chip, for example, the first temperature can be obtained by detecting a temperature detection unit integrated in the independent display chip, or by detecting a temperature sensor arranged close to the independent display chip.

[0042] Of course, the first temperature value may also be detected by any temperature detection device, and the first temperature value may be transmitted to the chip control unit of the independent display chip.

[0043] Step 102: determine a target operating mode of a target functional module according to the first temperature value, wherein the independent display chip includes the target functional module, the target functional module includes at least two operating modes, and the power consumption of the target functional module is different in different operating modes.

[0044] Step 103: Control the target functional module to operate in the target operating mode.

[0045] In a specific implementation, the above-mentioned target functional module can be understood as a module in an independent display chip that can independently complete a certain data processing function, such as an intellectual property (IP) core module, referred to as an IP module. For the sake of ease of explanation, the following embodiments use the functional module as an IP module as an example for illustration, which does not constitute a specific limitation herein.

[0046] In addition, the above-mentioned target function module includes at least two working modes, which can be understood as: the target function module can adjust the working mode by changing the algorithm parameters in the data processing process, for example: the interpolation function module can change the interpolation frame rate, so that the power consumption in the working mode with an interpolation frame rate of 90Hz is significantly less than the power consumption in the working mode with an interpolation frame rate of 120Hz. Of course, the above-mentioned target function module can also include modules for performing other data processing functions on the data source, such as: image noise reduction function, picture contrast enhancement function, etc. These function modules can also adjust the working mode by adjusting parameters such as noise reduction power and contrast enhancement function. For the sake of convenience, the following embodiments take the target function module as an interpolation function module as an example for illustration, but in actual applications, the above-mentioned target function module can also be other function modules, and can even include at least two function modules, which are not specifically limited here.

[0047] In practical applications, an independent display chip may include multiple functional modules, and at least one functional module has at least two working modes with different power consumption. Thus, by adjusting the working mode of the functional module, the overall power consumption of the independent display chip can be adjusted.

[0048] Implementation Method 1

[0049] The step of determining the target operating mode of the target functional module according to the first temperature value includes:

[0050] When the first temperature value is greater than or equal to a first threshold, it is determined that the target operating mode of the target functional module is adjusted from the first operating mode to the second operating mode, wherein the power consumption of the target functional module in the first operating mode is greater than the power consumption of the target functional module in the second operating mode.

[0051] In a specific implementation, the above-mentioned first threshold can be determined according to the operating temperature threshold of the independent display chip (for example: 50° or 60°, etc.). The operating temperature threshold can be understood as: in order to ensure the data processing effect and data processing efficiency and other performance of the independent display chip, the temperature of the independent display chip needs to be lower than the above-mentioned operating temperature threshold.

[0052] In the present embodiment, when the temperature of the independent display chip reaches or exceeds the operating temperature threshold, the operating mode of the target functional module is adjusted from the first operating mode to the second operating mode to reduce the power consumption of the target functional module. According to the principle that the greater the power consumption, the greater the heat generated by the independent display chip, resulting in the higher temperature of the independent display chip, the target operating mode of the target functional module is determined according to the first temperature value. The overall power consumption of the independent display chip can be adjusted according to the actual temperature of the independent display chip to reduce the heat generated by the independent display chip, and then gradually reduce the temperature of the independent display chip to prevent the independent display chip from overheating.

[0053] Optionally, in actual applications, after the operating mode of the target functional module is adjusted from the first operating mode to the second operating mode, a preset time period (for example, 2 minutes or 5 minutes, etc.) can be interval to again determine whether the temperature value of the independent display chip is greater than or equal to the above-mentioned first threshold value. If the judgment result is yes, the operating mode of the target functional module is again adjusted from the above-mentioned second operating mode to the third operating mode, wherein the power consumption of the target functional module in the second operating mode is greater than the power consumption of the target functional module in the third operating mode.

[0054] In this way, the working modes of the target functional module can be divided into multiple modes according to different power consumptions, and when the temperature value of the independent display chip is greater than or equal to the above-mentioned first threshold, it is judged once every certain period of time whether the temperature value of the independent display chip is reduced to less than the above-mentioned first threshold, so as to gradually reduce the power consumption of the target functional module according to the judgment result, until the temperature value of the independent display chip is reduced to less than the above-mentioned first threshold. In this way, the power consumption difference between different working modes of the target functional module can be reduced, so as to realize the slow reduction of the power consumption of the target functional module, so as to increase the power consumption of the target functional module as much as possible on the basis of realizing that the temperature value of the independent display chip is reduced to less than the above-mentioned first threshold.

[0055] Optionally, before determining that the target operating mode of the target functional module is adjusted from the first operating mode to the second operating mode, determining the target operating mode of the target functional module according to the first temperature value further includes:

[0056] Acquiring preset priority information of at least two functional modules included in the independent display chip;

[0057] According to the preset priority information, the target functional module is determined from the at least two functional modules.

[0058] In a specific implementation, when the independent display chip simultaneously turns on at least two functional modules, at least one functional module needs to be selected from the at least two functional modules to preferentially reduce the power consumption of the selected functional module, while the power consumption of other unselected functional modules can remain unchanged.

[0059] The above-mentioned determining the target functional module from the at least two functional modules according to the preset priority information can be understood as: determining at least one functional module with a low priority level in the preset priority information as the target functional module.

[0060] For example: When the temperature rises above the threshold in a gaming scenario, and the interpolation function and dynamic range adjustment function of the independent display chip are turned on in the gaming scenario, the user may be more concerned about the low gaming latency experience brought by high-frequency refresh and needs to prioritize the refresh frequency. In this case, the dynamic range adjustment function can be selected as the function that prioritizes power consumption reduction and ensures that the interpolation function is not affected.

[0061] Of course, in different application scenarios, the functional modules enabled by the independent display chip may be different, and in different application scenarios, the priority information of the functional modules enabled by the independent display chip may also be different, which is not specifically limited here.

[0062] In actual applications, if the operating mode of the first functional module with a low priority level is adjusted to the operating mode corresponding to the lowest power consumption, if the temperature of the independent display chip is still greater than or equal to the first threshold, the second functional module can be determined as the target functional module, and the second functional module is a functional module among the functional modules turned on by the independent display chip, and has a priority level one level higher than the first functional module.

[0063] In this implementation, according to the priority information of each functional module in the preset priority information, in order from low to high priority, the power consumption of the functional modules with low priority levels can be preferentially reduced to preferentially ensure the performance of the functional modules with high priority levels.

[0064] Implementation Method 2

[0065] Determining the target operating mode of the target functional module according to the first temperature value includes at least one of the following:

[0066] Determine, according to a first mapping relationship, a target functional module in an on state corresponding to the first temperature value, wherein the target operating mode is an operating mode currently on for the target functional module, wherein the first mapping relationship includes a mapping relationship between the temperature value of the independent display chip and the functional modules turned on in the independent display chip;

[0067] According to a second mapping relationship, a target operating mode of the target functional module corresponding to the first temperature value is determined, wherein the second mapping relationship includes a mapping relationship between the temperature value of the independent display chip and the alternative operating mode of each functional module in the independent display chip.

[0068] In an optional embodiment, according to the first mapping relationship, the target functional module in the turned-on state corresponding to the first temperature value is determined, which can be understood as: adjusting the number of functional modules in the turned-on state in the independent display chip according to the temperature value of the independent display chip, that is, adjusting the overall power consumption of the independent display chip by adjusting the turn-on rate of the functional modules in the independent display chip.

[0069] For example, the larger the first temperature value is, the smaller the number of enabled functional modules in the independent display chip determined according to the first mapping relationship is.

[0070] In actual application scenarios, if the independent display chip turns on other functional modules except the target functional module corresponding to the first temperature value that is in the turned-on state, the other functional modules can be controlled to be turned off according to the first mapping relationship to reduce the overall power consumption of the independent display chip.

[0071] Of course, in a specific implementation, the above determination of the target functional module in the turned-on state corresponding to the first temperature value according to the first mapping relationship can also be understood as: the larger the first temperature value is, only the functional module with the lower power consumption in the independent display chip is allowed to be turned on.

[0072] In actual application scenarios, if the independent display chip turns on other functional modules with higher power consumption than the target functional module in the turned-on state corresponding to the first temperature value, the other functional modules can be controlled to be turned off according to the first mapping relationship to reduce the overall power consumption of the independent display chip.

[0073] In this embodiment, the target functional modules turned on by the independent display chip at the current temperature can be determined through the mapping relationship between the temperature of the independent display chip and the number of functional modules turned on in the independent display chip or the power consumption level, so as to adjust the turn-on rate of the functional modules in the independent display chip, adjust the power consumption according to the temperature of the independent display chip, and thus realize the temperature control function of the independent display chip.

[0074] In another optional embodiment, the target operating mode of the target functional module corresponding to the first temperature value is determined according to the second mapping relationship. It can be understood that: when the independent display chip is in a certain actual application scenario and the target functional module is turned on, the operating mode of each functional module in the target functional module can be determined according to the second mapping relationship.

[0075] Among them, the target functional module can be understood as the functional module currently enabled by the independent display chip, and its quantity and type are determined according to the actual application scenario of the independent display chip. For example, in a game scenario, the independent display chip enables the interpolation function and the dynamic range adjustment function.

[0076] It is worth noting that the difference between this embodiment and the above-mentioned embodiment one is that: in the embodiment one, when the first temperature value is greater than the first threshold, the temperature of the independent display chip is reduced by reducing the power consumption of the target functional module; while in the present embodiment, the mapping relationship between various temperatures of the independent display chip and the alternative working modes of each functional module in the independent display chip is pre-stored, so that when the above-mentioned first temperature value is obtained, the alternative working mode corresponding to the target functional module in the second mapping relationship of the first temperature value can be directly determined as the target working mode of the target functional module, and the control process is simpler.

[0077] In practical applications, the first mapping relationship and the second mapping relationship can be determined at the factory stage, for example, by adjusting the functional module and its working mode through simulation or detection means, and simultaneously obtaining the impact of the adjustment on the temperature of the independent display chip to determine the first mapping relationship and the second mapping relationship.

[0078] The following takes the second mapping relationship as an example to illustrate the corresponding relationship between the temperature of the independent display chip and each working mode of the target functional module.

[0079] like Figure 2 As shown, assuming that the target functional module is an interpolation functional module, the mapping relationship between each candidate working mode of the interpolation functional module and the temperature of the independent display situation can be determined through the following process:

[0080] Step 1. Receive a data source with a refresh frequency of 30 Hz, determine that the target interpolation frame rate is 120 Hz, and after the interpolation function module runs stably in the working mode of 30 Hz → 120 Hz for a period of time (for example, 5 minutes), obtain the temperature of the independent display chip, and record the mapping data between the temperature and the working mode of 30 Hz → 120 Hz;

[0081] Step 2. Adjust the interpolation function module to a 30 Hz → 90 Hz working mode. After running stably in this working mode for a period of time, obtain the temperature of the independent display chip, and record the mapping data between the temperature and the 30 Hz → 90 Hz working mode;

[0082] Step 3. Adjust the interpolation function module to a 30 Hz → 60 Hz working mode. After running stably in this working mode for a period of time, obtain the temperature of the independent display chip, and record the mapping data between the temperature and the 30 Hz → 60 Hz working mode;

[0083] Step 4. Adjust the interpolation function module to a 30 Hz → 45 Hz working mode. After running stably in this working mode for a period of time, obtain the temperature of the independent display chip, and record the mapping data between the temperature and the 30 Hz → 45 Hz working mode;

[0084] Based on the above mapping data, the following Figure 2 The various working modes and temperature curves of the interpolation function module are shown, so as to determine the mapping relationship between various alternative working modes of the interpolation function module and the temperature of the independent display situation.

[0085] Implementation Method 3

[0086] The step of determining a target operating mode of a target functional module according to the first temperature value includes:

[0087] Determining the surface temperature of the electronic device including the independent display chip according to the first temperature value;

[0088] When the surface temperature is greater than or equal to a second threshold, it is determined that the target operating mode of the target functional module is adjusted from the first operating mode to the second operating mode, wherein the power consumption of the target functional module in the first operating mode is greater than the power consumption of the target functional module in the second operating mode.

[0089] In a specific implementation, the temperature of the independent display chip will affect the surface temperature of the electronic device including the independent display chip, that is, the higher the temperature of the independent display chip, the higher the surface temperature of the electronic device. If the independent display chip overheats, it may cause the outer surface of the electronic device to become hot, seriously affecting the user experience.

[0090] The above-mentioned determining the surface temperature of the electronic device including the independent display chip according to the first temperature value may be understood as: determining the surface temperature of the electronic device according to a third mapping relationship between the first temperature value and the surface temperature of the electronic device.

[0091] The third mapping relationship can be obtained in a similar manner to the first mapping relationship or the second mapping relationship, for example: Figure 3 As shown, through simulation and actual measurement, the temperature of the outer surface of the electronic device and the temperature of the independent display chip are synchronously detected in the application scenario of the whole electronic device to obtain the following Figure 3 The corresponding relationship diagram between the temperature of the independent display chip and the surface temperature of the electronic device where the independent display chip is located is shown, and the above-mentioned third mapping relationship is determined based on this.

[0092] It should be noted that the first mapping relationship, the second mapping relationship and the third mapping relationship may be mapping relationships in other forms such as mapping tables or mapping formulas in addition to mapping relationship diagrams, which are not specifically limited herein.

[0093] In practical applications, the second threshold can be set according to user needs or the structure of the electronic device, for example, to 35° or 40°, etc. The value of the second threshold is not specifically limited here.

[0094] It is worth noting that, unlike other embodiments in which the overall power consumption of the independent display chip is adjusted with the purpose of making the temperature of the independent display chip less than a first threshold, in this embodiment, the overall power consumption of the independent display chip is adjusted with the purpose of making the surface temperature of the electronic device less than a second threshold. In this way, the problem of excessive surface temperature of the electronic device including the independent display chip can be reduced, thereby improving the overall performance of the electronic device.

[0095] Optionally, the statement in the above-mentioned embodiment 1 or embodiment 3 that: the power consumption of the target functional module in the first working mode is greater than the power consumption of the target functional module in the second working mode, can be understood as: when the temperature of the independent display chip exceeds the standard, or when the surface temperature of the electronic device including the independent display chip exceeds the standard, the power consumption of the target functional module during data processing is reduced, so that the overall power consumption of the independent display chip is reduced, and then the heat generation of the independent display chip is reduced, so that the temperature of the independent display chip or the surface temperature of the electronic device including the independent display chip is gradually reduced to less than the corresponding threshold value (i.e., the first threshold value or the second threshold value).

[0096] The above-mentioned target functional module can be any functional module in an independent display chip, such as: an interpolation functional module and / or an image noise reduction functional module, etc., and the data processing parameters of these functional modules, such as: the interpolation frame rate of the interpolation functional module, the noise reduction power of the image noise reduction functional module are adjustable, so by adjusting the interpolation frame rate of the interpolation functional module or the noise reduction power of the image noise reduction functional module, the working mode of the interpolation functional module or the image noise reduction functional module can be adjusted.

[0097] As an optional implementation manner, when the target functional module includes a frame insertion functional module, the frame insertion frame rate in the first working mode is greater than the frame insertion frame rate in the second working mode;

[0098] In the case where the target functional module includes an image noise reduction functional module, the noise reduction power in the first working mode is greater than the noise reduction power in the second working mode.

[0099] In this implementation, according to the principle that the greater the interpolation frame rate, the greater the power consumption of the interpolation function module, the interpolation frame rate of the interpolation function module is reduced to adjust the working mode of the interpolation function module to reduce the power consumption of the interpolation function module; in addition, according to the principle that the greater the noise reduction power, the greater the power consumption of the image noise reduction function module, the noise reduction power of the image noise reduction function module is reduced to adjust the working mode of the image noise reduction function module to reduce the power consumption of the image noise reduction function module.

[0100] It is worth noting that, in a specific implementation, the above-mentioned target functional module may also include other functional modules in an independent display chip. Correspondingly, the working mode of the image noise reduction functional module can be adjusted by adjusting other image processing parameters of the other functional modules to achieve the purpose of reducing the power consumption of the image noise reduction functional module. The examples are not exhaustive here.

[0101] In an embodiment of the present application, a first temperature value of an independent display chip is obtained; a target operating mode of a target functional module is determined according to the first temperature value, wherein the independent display chip includes the target functional module, the target functional module includes at least two operating modes, and the power consumption of the target functional module is different in different operating modes; the target functional module is controlled to operate in the target operating mode. In this way, the operating mode of the target functional module in the independent display chip can be adjusted according to the first temperature value of the independent display chip. In view of the different power consumption of the target functional module in different operating modes, more flexible power consumption control of the independent display chip can be achieved to improve the control effect of the independent display chip.

[0102] See also Figure 4 The present application also provides an independent display chip control circuit, which can perform the following steps: Figure 1 The control method of the independent display chip shown in FIG. Figure 4 As shown, the independent display chip control circuit includes: an independent display chip 41 and a temperature detection unit 42;

[0103] The independent display chip 41 includes: a chip control unit 411 and N functional modules (such as Figure 6 IP 1~IP8) shown in, N is a positive integer;

[0104] The chip control unit 411 is connected to the temperature detection unit 42 and the N functional modules respectively;

[0105] The chip control unit 411 is used to obtain a first temperature value of the independent display chip 41 collected by the temperature detection unit 42, determine a target working mode of the target function module 412 according to the first temperature value, and control the target function module 412 to work in the target working mode;

[0106] The N functional modules include a target functional module 412 , and the target functional module 412 includes at least two working modes, and the power consumption of the target functional module 412 is different in different working modes.

[0107] In a specific implementation, the temperature detection unit 42 is disposed corresponding to the independent display chip 41, and the temperature detection unit 42 can detect the temperature of the independent display chip 41. Figure 4 or Figure 6 As shown, the temperature detection unit 42 can be integrated into the independent display chip 41. For another example, the temperature detection unit 42 can be close to the independent display chip 41 and arranged outside the independent display chip 41. Figure 4 and Figure 6 In the illustrated embodiment, the temperature detection unit 42 may be integrated into the independent display chip 41 as an example for illustration, which does not constitute a specific limitation.

[0108] In addition, the temperature detection unit 42 can obtain working power from the power management module 43 in the independent display chip 41, or the temperature detection unit 42 can also obtain working power from the outside of the independent display chip 41. For example: when the independent display chip 41 is assembled in a mobile phone, the temperature detection unit 42 can obtain working power from the mobile phone power supply.

[0109] Optional, such as Figure 5 As shown, the temperature detection unit 42 includes: an excitation circuit 421, a temperature sensor 422, a signal preprocessing module 423 and an analog-to-digital converter 424;

[0110] The excitation circuit 421 is connected to the temperature sensor 422, the signal preprocessing module 423 and the analog-to-digital converter 424 respectively, and is used to provide working power to the temperature sensor 422, the signal preprocessing module 423 and the analog-to-digital converter 424 respectively;

[0111] The output end of the temperature sensor 422 is connected to the input end of the signal preprocessing module 423 , the output end of the signal preprocessing module 423 is connected to the input end of the analog-to-digital converter 424 , and the output end of the analog-to-digital converter 424 is connected to the input end of the chip control unit 411 .

[0112] During operation, the temperature analog signal detected by the temperature sensor 422 undergoes preset signal processing via the signal preprocessing module 423 , and the analog-to-digital converter 424 converts the temperature analog signal after the preset signal processing into a temperature digital signal and transmits it to the chip control unit 411 .

[0113] In a specific implementation, the temperature analog signal detected by the temperature sensor 422 may be an electrical signal that changes with temperature changes, and the signal preprocessing module 423 is used to perform signal conditioning on the electrical signal sent by the temperature sensor 422 so that the analog-to-digital converter 424 can convert the electrical signal value processed by the signal preprocessing module 423 into an accurate temperature value.

[0114] In operation, the chip control unit 411 can determine the target functional module 412 and the target working mode of the target functional module 412 according to the first temperature value detected by the temperature detection unit 42. Accordingly, the chip control unit 411 can send a control instruction to the IP processor module to control the target functional module 412 in the IP processor module to work in the target working mode through the control instruction. The IP processor module represents a module composed of N functional units, and the chip control unit 411 can call any functional module from the IP processor module and adjust the working mode of the called functional module.

[0115] For example, by pre-storing in the chip control unit 411 Figure 1 In the second mapping relationship of the method embodiment shown, when the chip control unit 411 obtains the first temperature value detected by the temperature detection unit 42, it determines that the interpolation frame rate of the interpolation function module corresponding to the first temperature value in the second mapping relationship is 90Hz, and the current interpolation frame rate of the interpolation function module is 120HZ, then the chip control unit 411 sends a control instruction to the interpolation function module to control the interpolation function module to reduce the interpolation frame rate from 120Hz to 90Hz.

[0116] As another example: assuming that the chip control unit 411 pre-stores the surface temperature control range of the electronic device including the independent display chip (the surface temperature of the electronic device needs to be lower than the second threshold), when the surface temperature of the electronic device is greater than or equal to the second threshold, the chip control unit 411 sends an instruction to the IP processor to reduce the interpolation frame rate, and the IP processor can control the interpolation function module to reduce the interpolation frame rate from 120Hz to 90Hz.

[0117] It should be noted that the temperature detection unit 42 may be Figure 5 In addition to the structure shown, the temperature detection unit 42 may also include at least one of any other devices, circuits or electronic components capable of realizing the temperature detection function, which is not specifically limited here.

[0118] It should be noted that if Figure 6 As shown, in actual applications, the independent display chip control circuit may further include: a signal receiving unit 61, a signal sending unit 62, a mobile industry processor interface (MIPI) clock 63, a panel control unit 64 and a power management unit 65;

[0119] The signal receiving unit 61 is used to receive the image data to be processed, and the signal sending unit 62 is used to send the processed image data;

[0120] The chip control unit 411 is connected to the signal receiving unit 61, the signal sending unit 62, the MIPI clock 63 and the panel control unit 64 respectively; the IP processor module is connected between the first output terminal of the signal receiving unit 61 and the first input terminal of the signal sending unit 62;

[0121] The second output terminal of the signal receiving unit 61 is connected to the second input terminal of the signal sending unit 62;

[0122] The power management unit 65 is used to provide the working power required by each unit in the independent display chip.

[0123] In a specific implementation, the above-mentioned signal receiving unit 61 and signal sending unit 62 can be a MIPI display serial interface (DisplaySerial Interface, DSI). The specific signal receiving unit 61 is a MIPI DSI interface for connecting to an image data source, which includes: an RX1 port and an RX0 port, that is, a dual-channel MIPI receiving solution of RX0 and RX1, RX0 can be used to receive original image data, and RX1 can be used to receive user interface (User Interface, UI) screen data; the second interface unit 62 is a MIPI DSI TX interface for connecting to an image display panel component.

[0124] During operation, the chip control unit can determine what kind of data processing to perform on the image data received by the signal receiving unit 61 according to actual needs, thereby calling the functional module corresponding to the data processing in the IP processor module.

[0125] Of course, in actual applications, the chip control unit may also determine, according to actual needs, not to process the image data received by the signal receiving unit 61, but to send the image data directly to the image display panel assembly for display through the second output end of the signal receiving unit 61 and the second input end of the signal sending unit 62.

[0126] That is, the chip control unit 411 can control whether the data source received by the MIPI DSI RX enters the independent display chip and is directly transmitted through the MIPI DSI TX module, or is processed by the IP processor module and then transmitted through the MIPI DSI TX module.

[0127] It should be noted that if Figure 4 and Figure 6 The independent display chip control circuit shown can perform the following operations provided in the embodiment of the present application: Figure 1 The various processes in the method embodiment shown, however, Figure 1 The method embodiment shown can also be applied to Figure 4 and Figure 6 Other devices or equipment other than the independent display chip control circuit shown in the figure are not limited to the following: Figure 1 The method embodiment shown can only be used if Figure 4 and Figure 6 The independent display chip control circuit is shown.

[0128] The present application also provides an electronic device, which includes: Figure 4 or Figure 6 The independent display chip control circuit in the circuit structure embodiment shown.

[0129] The electronic device provided in the embodiment of the present application has the following features: Figure 4 or Figure 6 The independent display chip control circuit in the circuit structure embodiment shown in the figure can be used as Figure 4 or Figure 6 The independent display chip control circuit in the circuit structure embodiment shown in the figure adjusts the working mode of the target functional module according to the temperature of the independent display chip, so as to adjust the overall temperature of the independent display chip and the electronic device by adjusting the overall power consumption of the independent display chip, thereby preventing the external surface temperature of the independent display chip or the electronic device from overheating. Figure 4 or Figure 6 The same beneficial effects as those of the independent display chip control circuit in the circuit structure embodiment shown are not described again here to avoid repetition.

[0130] As Figure 7 Taking the application architecture diagram of the chip of the electronic device shown as an example, the independent display chip in the above-mentioned independent display chip control circuit can be connected between the central processing unit (CPU) of the electronic device and the driver integrated circuit (IC) of the display screen.

[0131] During operation, the independent display chip adopts a dual-channel MIPI solution. The CPU transmits the original image data through MIPI0 and the user interface (UI) screen through MIPI1. After the independent display chip processes the data, the final image is transmitted to the driver IC of the display screen through the independent display chip. After receiving the data, the driver IC decodes and converts it into an electrical signal to light up the screen and display the image.

[0132] Of course, the electronic device may also have other structures, and may also include other devices besides the CPU and the driver IC of the display screen, for example: Figure 7 The power management integrated circuit (Power Management IC, PMIC) and power supply shown in the figure are not elaborated in detail here.

[0133] It should be noted that the control method of the independent display chip provided in the embodiment of the present application can be executed by a control device of the independent display chip, or a control module in the control device of the independent display chip for executing the control method of the independent display chip. In the embodiment of the present application, the control device of the independent display chip executing the control method of loading the independent display chip is taken as an example to illustrate the control device of the independent display chip provided in the embodiment of the present application.

[0134] See also Figure 8, a control device 800 of an independent display chip provided in an embodiment of the present application may include:

[0135] An acquisition module 801 is used to acquire a first temperature value of an independent display chip;

[0136] A determination module 802 is used to determine a target operating mode of a target functional module according to the first temperature value, wherein the independent display chip includes the target functional module, the target functional module includes at least two operating modes, and the power consumption of the target functional module is different in different operating modes;

[0137] The control module 803 is used to control the target functional module to operate in the target operating mode.

[0138] Optionally, the determination module 802 is specifically configured to:

[0139] When the first temperature value is greater than or equal to a first threshold, it is determined that the target operating mode of the target functional module is adjusted from the first operating mode to the second operating mode, wherein the power consumption of the target functional module in the first operating mode is greater than the power consumption of the target functional module in the second operating mode.

[0140] Optionally, the determining module 802 further includes:

[0141] An acquiring unit, configured to acquire preset priority information of at least two functional modules included in the independent display chip;

[0142] The first determining unit is configured to determine the target functional module from the at least two functional modules according to the preset priority information.

[0143] Optionally, the determining module 802 is specifically configured to perform at least one of the following:

[0144] Determine, according to a first mapping relationship, a target functional module in an on state corresponding to the first temperature value, wherein the target operating mode is an operating mode currently on for the target functional module, wherein the first mapping relationship includes a mapping relationship between the temperature value of the independent display chip and the functional modules turned on in the independent display chip;

[0145] According to a second mapping relationship, a target operating mode of the target functional module corresponding to the first temperature value is determined, wherein the second mapping relationship includes a mapping relationship between the temperature value of the independent display chip and the alternative operating mode of each functional module in the independent display chip.

[0146] Optionally, the determination module 802 includes:

[0147] A second determining unit, configured to determine an external temperature of the electronic device including the independent display chip according to the first temperature value;

[0148] A third determination unit is used to determine that the target operating mode of the target functional module is adjusted from the first operating mode to the second operating mode when the surface temperature is greater than or equal to a second threshold, wherein the power consumption of the target functional module in the first operating mode is greater than the power consumption of the target functional module in the second operating mode.

[0149] Optionally, when the target functional module includes a frame insertion functional module, the frame insertion frame rate in the first working mode is greater than the frame insertion frame rate in the second working mode;

[0150] In the case where the target functional module includes an image noise reduction functional module, the noise reduction power in the first working mode is greater than the noise reduction power in the second working mode.

[0151] The control device of the independent display chip in the embodiment of the present application can be a device, or a component, integrated circuit, or chip in a terminal. The device can be a mobile electronic device or a non-mobile electronic device. Exemplarily, the mobile electronic device can be a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc., and the non-mobile electronic device can be a network attached storage (NAS), a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc., which is not specifically limited in the embodiment of the present application.

[0152] The control device of the independent display chip in the embodiment of the present application may be a device having an operating system. The operating system may be an Android operating system, an iOS operating system, or other possible operating systems, which are not specifically limited in the embodiment of the present application.

[0153] The control device of the independent display chip provided in the embodiment of the present application can achieve Figure 1 The various processes implemented by the illustrated method embodiment can achieve the same beneficial effects, and will not be described again here to avoid repetition.

[0154] Optional, such as Fig. 9As shown, an embodiment of the present application also provides an electronic device 900, including a processor 901, a memory 902, and a program or instruction stored in the memory 902 and executable on the processor 901. When the program or instruction is executed by the processor 901, each process of the above-mentioned independent display chip control method embodiment is implemented, and the same technical effect can be achieved. To avoid repetition, it will not be described here.

[0155] It should be noted that the electronic devices in the embodiments of the present application include the mobile electronic devices and non-mobile electronic devices mentioned above.

[0156] Fig.10 A schematic diagram of the hardware structure of an electronic device to implement an embodiment of the present application.

[0157] The electronic device 1000 includes but is not limited to: a radio frequency unit 1001, a network module 1002, an audio output unit 1003, an input unit 1004, a sensor 1005, a display unit 1006, a user input unit 1007, an interface unit 1008, a memory 1009, and a processor 1010 and other components.

[0158] Those skilled in the art will appreciate that the electronic device 1000 may also include a power source (such as a battery) for supplying power to each component, and the power source may be logically connected to the processor 1010 through a power management system, thereby implementing functions such as managing charging, discharging, and power consumption management through the power management system. Fig.10 The electronic device structure shown in the figure does not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently, which will not be described in detail here.

[0159] The input unit 1004 is used to obtain a first temperature value of the independent display chip;

[0160] The processor 1010 is configured to determine a target operating mode of a target functional module according to the first temperature value, wherein the independent display chip includes the target functional module, the target functional module includes at least two operating modes, and the power consumption of the target functional module is different in different operating modes;

[0161] The processor 1010 is further configured to control the target functional module to operate in the target operating mode.

[0162] Optionally, the determining, according to the first temperature value, a target operating mode of a target functional module performed by the processor 1010 includes:

[0163] When the first temperature value is greater than or equal to a first threshold, it is determined that the target operating mode of the target functional module is adjusted from the first operating mode to the second operating mode, wherein the power consumption of the target functional module in the first operating mode is greater than the power consumption of the target functional module in the second operating mode.

[0164] Optionally, before executing the step of determining that the target operating mode of the target functional module is adjusted from the first operating mode to the second operating mode, the processor 1010 is further configured to:

[0165] Acquiring preset priority information of at least two functional modules included in the independent display chip;

[0166] According to the preset priority information, the target functional module is determined from the at least two functional modules.

[0167] Optionally, the determining, according to the first temperature value, a target operating mode of a target functional module performed by the processor 1010 includes at least one of the following:

[0168] Determine, according to a first mapping relationship, a target functional module in an on state corresponding to the first temperature value, wherein the target operating mode is an operating mode currently on for the target functional module, wherein the first mapping relationship includes a mapping relationship between the temperature value of the independent display chip and the functional modules turned on in the independent display chip;

[0169] According to a second mapping relationship, a target operating mode of the target functional module corresponding to the first temperature value is determined, wherein the second mapping relationship includes a mapping relationship between the temperature value of the independent display chip and the alternative operating mode of each functional module in the independent display chip.

[0170] Optionally, the determining, according to the first temperature value, a target operating mode of a target functional module performed by the processor 1010 includes:

[0171] Determining the surface temperature of the electronic device including the independent display chip according to the first temperature value;

[0172] When the surface temperature is greater than or equal to a second threshold, it is determined that the target operating mode of the target functional module is adjusted from the first operating mode to the second operating mode, wherein the power consumption of the target functional module in the first operating mode is greater than the power consumption of the target functional module in the second operating mode.

[0173] Optionally, when the target functional module includes a frame insertion functional module, the frame insertion frame rate in the first working mode is greater than the frame insertion frame rate in the second working mode;

[0174] In the case where the target functional module includes an image noise reduction functional module, the noise reduction power in the first working mode is greater than the noise reduction power in the second working mode.

[0175] The electronic device 1000 provided in the embodiment of the present application can achieve the following Figure 1 The various processes in the illustrated method embodiment can achieve the same beneficial effects, and will not be described again here to avoid repetition.

[0176] It should be understood that in the embodiment of the present application, the input unit 1004 may include a graphics processor (Graphics Processing Unit, GPU) and a microphone, and the graphics processor processes the image data of a static picture or video obtained by an image capture device (such as a camera) in a video capture mode or an image capture mode. The display unit 1006 may include a display panel, and the display panel may be configured in the form of a liquid crystal display, an organic light emitting diode, etc. The user input unit 1007 includes a touch panel and other input devices. The touch panel is also called a touch screen. The touch panel may include two parts: a touch detection device and a touch controller. Other input devices may include, but are not limited to, a physical keyboard, function keys (such as volume control buttons, switch buttons, etc.), a trackball, a mouse, and a joystick, which will not be repeated here. The memory 1009 can be used to store software programs and various data, including but not limited to applications and operating systems. The processor 1010 may integrate an application processor and a modem processor, wherein the application processor mainly processes an operating system, a user interface, and applications, and the modem processor mainly processes wireless communications. It is understandable that the above-mentioned modem processor may not be integrated into the processor 1010.

[0177] An embodiment of the present application also provides a readable storage medium, on which a program or instruction is stored. When the program or instruction is executed by a processor, each process of the above-mentioned independent display chip control method embodiment is implemented, and the same technical effect can be achieved. To avoid repetition, it will not be repeated here.

[0178] The processor is a processor in the electronic device described in the above embodiment. The readable storage medium includes a computer readable storage medium, such as a computer read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0179] An embodiment of the present application further provides a chip, which includes a processor and a communication interface, wherein the communication interface is coupled to the processor, and the processor is used to run programs or instructions to implement the various processes of the above-mentioned independent display chip control method embodiment, and can achieve the same technical effect. To avoid repetition, it will not be repeated here.

[0180] It should be understood that the chip mentioned in the embodiments of the present application can also be called a system-level chip, a system chip, a chip system or a system-on-chip chip, etc.

[0181] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0182] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, a magnetic disk, or an optical disk), and includes a number of instructions for a terminal (which can be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to execute the methods described in each embodiment of the present application.

[0183] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A control method for an independent display chip, characterized in that: include: Acquire a first temperature value of an independent display chip; Determining a target operating mode of a target functional module according to the first temperature value, wherein the independent display chip includes the target functional module, the target functional module includes at least two operating modes, and the power consumption of the target functional module is different in different operating modes; Controlling the target functional module to operate in the target operating mode; Wherein, determining the target operating mode of the target functional module according to the first temperature value includes at least one of the following: Determine, according to a first mapping relationship, a target functional module in an on state corresponding to the first temperature value, wherein the target operating mode is an operating mode currently on for the target functional module, wherein the first mapping relationship includes a mapping relationship between the temperature value of the independent display chip and the functional modules turned on in the independent display chip; According to a second mapping relationship, a target operating mode of the target functional module corresponding to the first temperature value is determined, wherein the second mapping relationship includes a mapping relationship between the temperature value of the independent display chip and the alternative operating mode of each functional module in the independent display chip.

2. The method according to claim 1, characterized in that The step of determining a target operating mode of a target functional module according to the first temperature value includes: When the first temperature value is greater than or equal to a first threshold, it is determined that the target operating mode of the target functional module is adjusted from the first operating mode to the second operating mode, wherein the power consumption of the target functional module in the first operating mode is greater than the power consumption of the target functional module in the second operating mode.

3. The method according to claim 2, characterized in that Before the step of determining that the target operating mode of the target functional module is adjusted from the first operating mode to the second operating mode, the step of determining the target operating mode of the target functional module according to the first temperature value further includes: Acquiring preset priority information of at least two functional modules included in the independent display chip; According to the preset priority information, the target functional module is determined from the at least two functional modules.

4. The method according to claim 1, characterized in that: The step of determining a target operating mode of a target functional module according to the first temperature value includes: Determining the surface temperature of the electronic device including the independent display chip according to the first temperature value; When the surface temperature is greater than or equal to a second threshold, it is determined that the target operating mode of the target functional module is adjusted from the first operating mode to the second operating mode, wherein the power consumption of the target functional module in the first operating mode is greater than the power consumption of the target functional module in the second operating mode.

5. The method according to claim 2 or 4, characterized in that: In a case where the target functional module includes a frame insertion functional module, the frame insertion frame rate in the first working mode is greater than the frame insertion frame rate in the second working mode; In the case where the target functional module includes an image noise reduction functional module, the noise reduction power in the first working mode is greater than the noise reduction power in the second working mode.

6. An independent display chip control circuit, characterized in that: include: Independent display chip and temperature detection unit; The independent display chip comprises: a chip control unit and N functional modules, where N is a positive integer; The chip control unit is connected to the temperature detection unit and the N functional modules respectively; The chip control unit is used to obtain a first temperature value of the independent display chip collected by the temperature detection unit, determine a target operating mode of a target functional module according to the first temperature value, and control the target functional module to operate in the target operating mode; The N functional modules include the target functional module, the target functional module includes at least two working modes, and the power consumption of the target functional module is different in different working modes; Wherein, determining the target operating mode of the target functional module according to the first temperature value includes at least one of the following: Determine, according to a first mapping relationship, a target functional module in an on state corresponding to the first temperature value, wherein the target operating mode is an operating mode currently on for the target functional module, wherein the first mapping relationship includes a mapping relationship between the temperature value of the independent display chip and the functional modules turned on in the independent display chip; According to a second mapping relationship, a target operating mode of the target functional module corresponding to the first temperature value is determined, wherein the second mapping relationship includes a mapping relationship between the temperature value of the independent display chip and the alternative operating mode of each functional module in the independent display chip.

7. The independent display chip control circuit according to claim 6, characterized in that: The temperature detection unit is integrated into the independent display chip, or the temperature detection unit is arranged close to the independent display chip.

8. The independent display chip control circuit according to claim 6, characterized in that: The temperature detection unit includes: an excitation circuit, a temperature sensor, a signal preprocessing module and an analog-to-digital converter; The excitation circuit is connected to the temperature sensor, the signal preprocessing module and the analog-to-digital converter respectively, and is used to provide working power to the temperature sensor, the signal preprocessing module and the analog-to-digital converter respectively; The output end of the temperature sensor is connected to the input end of the signal preprocessing module, the output end of the signal preprocessing module is connected to the input end of the analog-to-digital converter, and the output end of the analog-to-digital converter is connected to the input end of the chip control unit.

9. An electronic device, characterized in that: include: An independent display chip control circuit as claimed in any one of claims 6 to 8.

10. A control device for an independent display chip, characterized in that: include: An acquisition module, used for acquiring a first temperature value of an independent display chip; a determination module, configured to determine a target operating mode of a target functional module according to the first temperature value, wherein the independent display chip includes the target functional module, the target functional module includes at least two operating modes, and the power consumption of the target functional module is different in different operating modes; A control module, used for controlling the target functional module to operate in the target operating mode; The determining module is specifically configured to perform at least one of the following: Determine, according to a first mapping relationship, a target functional module in an on state corresponding to the first temperature value, wherein the target operating mode is an operating mode currently on for the target functional module, wherein the first mapping relationship includes a mapping relationship between the temperature value of the independent display chip and the functional modules turned on in the independent display chip; According to a second mapping relationship, a target operating mode of the target functional module corresponding to the first temperature value is determined, wherein the second mapping relationship includes a mapping relationship between the temperature value of the independent display chip and the alternative operating mode of each functional module in the independent display chip.

11. An electronic device, characterized in that: The invention comprises a processor, a memory and a program or instruction stored in the memory and executable on the processor, wherein the program or instruction, when executed by the processor, implements the steps of the control method of the independent display chip as described in any one of claims 1 to 5.

12. A readable storage medium, characterized in that: The readable storage medium stores a program or instruction, and when the program or instruction is executed by a processor, the steps of the control method of the independent display chip according to any one of claims 1 to 5 are implemented.

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