Solar cell manufacturing method

Abstract

The present invention relates to a method for manufacturing a solar cell, which includes a mounting process, a coating process and a scribing process. The mounting process is used to mount a cell formed of multiple thin film layers into a processing space for manufacturing a solar cell. The coating process is used to coat a conductive material on the cell. The scribing process is used to emit a laser toward the cell to form a cell dividing portion, which is used to divide the cell into multiple unit cells.

Description

Technical Field

[0001] The present invention relates to a solar cell, and more particularly to a solar cell combining a wafer-type solar cell and a thin-film-type solar cell. Background Art

[0002] A solar cell is a device that converts light energy into electrical energy based on the properties of semiconductors.

[0003] Solar cells have a PN junction structure, in which a positive (P) type semiconductor and a negative (N) type semiconductor are joined to each other in the PN junction structure. When sunlight is incident on a solar cell having a PN junction structure, holes and electrons are generated in the semiconductor by the energy of the incident sunlight. At this time, due to the electric field generated in the PN junction, holes (+) move to the P-type semiconductor, and electrons (-) move to the N-type semiconductor, thereby generating an electric potential to generate energy.

[0004] Solar cells can be classified into thin film type solar cells and wafer type solar cells.

[0005] The wafer type solar cell is a solar cell made by using a semiconductor material such as a silicon wafer as a substrate, while the thin film type solar cell is a solar cell made by forming a semiconductor on a substrate such as glass as a thin film type.

[0006] The efficiency of the wafer type solar cell is better than that of the thin film type solar cell, but the manufacturing cost of the thin film type solar cell is lower than that of the wafer type solar cell.

[0007] Therefore, a solar cell combining a wafer type solar cell and a thin film type solar cell is provided. Hereinafter, a solar cell in the prior art will be described with reference to the accompanying drawings.

[0008] Figure 1a to Figure 1d The figure is a side view schematically showing a method for manufacturing a solar cell according to the prior art.

[0009] First, a mounting process of the cell 100 is performed in a processing space (not shown) for manufacturing solar cells, and a plurality of thin film layers are formed on the cell 100. The processing space may be implemented entirely as a chamber.

[0010] Then, if Figure 1aAs shown, a scribing process of irradiating laser toward the battery 100 is performed. When the scribing process is performed, a battery dividing part 200 for dividing the battery 100 into a plurality of battery cells 100a may be formed. The scribing process may be performed by a scribing device 200a irradiating laser toward the battery 100.

[0011] Then, if Figure 1b As shown, a coating process is performed to print the conductor material 300 on the battery 100. When the coating process is performed, the conductor material 300 may be coated on the battery 100. The coating process may be performed by a conductor material coater 300a that prints the conductor material 300 on the battery 100.

[0012] Then, if Figure 1c As shown, a cutting process is performed to separate the battery 100 into a plurality of battery cells 100a. When the cutting process is performed, the battery 100 may be separated into the battery cells 100a via the battery separation unit 200. Figure 1c As shown, in the case where the battery 100 needs to be divided into five battery cells 100a, 100a', 100a", 100a'", 100a", four cutting processes may be performed.

[0013] Then, if Figure 1d As shown, a bonding process of bonding the divided battery cells 100 a , 100 a ′, 100 a ″, 100 a ′″, 100 a ″″ is performed. The bonding process may be performed in a manner of bonding the divided battery cells 100 a using a conductive material 300 .

[0014] Subsequently, a curing process of curing the coupled battery cells 100a, 100a', 100a", 100a'", 100a"' is performed. Thus, a module type solar cell 1000 having battery cells 100a connected to each other may be manufactured.

[0015] In such a solar cell manufacturing method, it is urgently required to develop a technology capable of improving the quality of the solar cell, the manufacturing time of the solar cell, and the manufacturing cost of the solar cell. Summary of the invention

[0016]

Technical issues

[0017] The present invention aims to solve the above problems and provide a method for manufacturing a solar cell, which can improve the quality of the solar cell, the manufacturing time of the solar cell and the manufacturing cost of the solar cell.

[0018]

Technical means

[0019] In order to solve the above technical problems, the present invention may include the following elements.

[0020] The solar cell manufacturing method according to the present invention may include a mounting process, a coating process and a scribing process. The mounting process is used to mount a cell for forming a plurality of thin film layers in a processing space for manufacturing a solar cell. The coating process is used to coat a conductive material on the cell. The scribing process is used to emit a laser toward the cell to form a cell dividing portion for dividing the cell into a plurality of unit cells.

[0021] In the method of manufacturing a solar cell according to the present invention, the coating process may be performed before the scribing process is performed.

[0022] In the solar cell manufacturing method according to the present invention, the coating process and the scribing process may be performed simultaneously.

[0023] The solar cell manufacturing method according to the present invention may include an installation process, a scribing process, a coating process, a cutting process and a bonding process. The installation process installs a battery for forming multiple thin film layers in a processing space for manufacturing a solar cell. The scribing process emits a laser onto the battery to form "N-1" (where N is an integer greater than or equal to 3) battery division parts for dividing the battery into N unit cells. The coating process applies a conductor material to the battery. The cutting process divides the battery into two unit cells. The bonding process is performed immediately after the cutting process and is used to combine the two divided unit cells. The cutting process and the bonding process can be performed repeatedly.

[0024] The solar cell manufacturing method according to the present invention may include a cutting process and a bonding process. The cutting process divides a substrate into two blocks along one of "N-1" (where N is an integer greater than or equal to 3) battery division parts to divide the substrate into N unit blocks. The bonding process combines the two divided blocks. Each cutting process and bonding process may be repeatedly performed "N-1" times.

[0025]

Beneficial effects

[0026] According to the present invention, the following effects can be obtained.

[0027] According to an embodiment of the present invention, the bonding force of the conductor material can be increased, thereby improving the integrity of the bonding process. In addition, according to an embodiment of the present invention, the probability of cracks in the cell can be reduced, thereby improving the quality of the finished solar cell.

[0028] According to another embodiment of the present invention, the manufacturing time of solar cells can be reduced, thereby increasing the yield of solar cells. In addition, according to an embodiment of the present invention, the cost of equipment required for manufacturing solar cells can be reduced, thereby reducing the manufacturing cost of solar cells.

[0029] According to another embodiment of the present invention, the time spent in the bonding process can be reduced, thereby increasing the yield of solar cells.

[0030] Brief description of the attached figure

[0031] Figure 1a to Figure 1d The figure is a schematic process side view showing a method for manufacturing a solar cell according to the prior art.

[0032] Figure 2 FIG. 4 is a schematic flow chart of a method for manufacturing a solar cell according to the present invention.

[0033] Figure 3a and Figure 3b The figure is a schematic side view showing the coating process and the scribing process in the solar cell manufacturing method according to the present invention.

[0034] Figure 4 The figure is a schematic side view showing a process of using a plurality of conductive material coaters and a plurality of scribing devices to perform an exemplary method for manufacturing a solar cell according to the present invention.

[0035] Figure 5 The figure is a schematic side view showing a cutting process in the method for manufacturing a solar cell according to the present invention.

[0036] Figure 6 The figure is a side view schematic diagram showing a solar cell after a bonding process and a curing process in the solar cell manufacturing method according to the present invention.

[0037] Figure 7 FIG. 4 is a schematic flow chart of a method for manufacturing a solar cell according to a second embodiment of the present invention.

[0038] Figure 8a and Figure 8b FIG. 1 is a schematic side view of a process of a method for manufacturing a solar cell according to a second embodiment of the present invention.

[0039] Fig. 9 FIG. 4 is a schematic flow chart of a method for manufacturing a solar cell according to a third embodiment of the present invention.

[0040] Fig.10 FIG. 4 is a schematic block diagram of a bonding process in a method for manufacturing a solar cell according to a third embodiment of the present invention.

[0041] Fig.11 FIG. 4 is a schematic side view of a scribing process in a method for manufacturing a solar cell according to a third embodiment of the present invention.

[0042] Fig.12 FIG. 4 is a schematic side view of a coating process in a method for manufacturing a solar cell according to a third embodiment of the present invention.

[0043] Figures 13a to 13e The figure is a schematic side view of a cutting process and a bonding process in a solar cell manufacturing method according to the prior art.

[0044] Figure 14a to Figure 14h FIG. 4 is a schematic side view of a cutting process and a bonding process in a method for manufacturing a solar cell according to a third embodiment of the present invention.

[0045] Figures 15a to 15e FIG. 4 is a schematic side view of a modular process in a method for manufacturing a solar cell according to a third embodiment of the present invention.

[0046] Implementation

[0047] The features of the various embodiments of the present invention may be coupled or combined with each other in part or in whole, and may interoperate differently from each other, and be used (driven) in a technical manner as can be fully understood by those skilled in the art. The embodiments of the present invention may be performed independently of each other, or in a mutually dependent relationship. When describing a positional relationship, for example, when the positional relationship between two components is described as "on", "above", "below", and "beside", one or more other components may be placed between the two components unless "only" or "directly" is used. When describing a temporal relationship, for example, when the temporal sequence is described as "after", "subsequently", "next", and "before", discontinuous situations may be included unless "only" or "directly" is used.

[0048] Hereinafter, an embodiment of a method for manufacturing a solar cell according to the present invention will be described in detail with reference to the accompanying drawings.

[0049] The solar cell manufacturing method according to the present invention is used to manufacture a solar cell that converts the light energy of sunlight into electrical energy. The solar cell manufacturing method according to the present invention can be used to manufacture a wafer-type solar cell and a thin-film type solar cell. Hereinafter, an embodiment of a wafer-type solar cell manufactured by the solar cell manufacturing method according to the present invention will be described, but it is obvious to a person skilled in the art that a thin-film type solar cell is manufactured by the solar cell manufacturing method according to the present invention.

[0050] See also Figures 2 to 4, the solar cell manufacturing method according to the present invention may include a mounting process S100, a coating process S200 and a scribing process S300. The mounting process S100 is to mount the cell 1 in a processing space for manufacturing a solar cell, wherein a plurality of thin film layers are formed on the cell 1. The coating process S200 is to coat the conductive material 20 onto the cell 1. The scribing process S300 is to emit a laser from a cell dividing unit 30 toward the cell 1 to divide the cell 1 into a plurality of unit cells 10.

[0051] Before performing the mounting process S100, the solar manufacturing method according to the present invention may include a cell manufacturing process of forming these thin film layers on a substrate. Before describing the mounting process S100, the coating process S200 and the scribing process S300, the cell manufacturing process will be described in detail with reference to the relevant drawings.

[0052] The cell manufacturing process is a process of forming these thin film layers on a substrate having a conductive polarity. Cell 1 represents that these thin film layers are stacked on a substrate. When sunlight is incident on cell 1, holes and electrons are generated in cell 1 by the energy of the incident sunlight. When a potential difference occurs in cell 1 based on the activity of holes and electrons, the solar cell manufactured by the solar cell manufacturing method of the present invention can generate energy. Because the cell manufacturing process is performed, these thin film layers can be stacked on a substrate.

[0053] The battery manufacturing process may include the following processes.

[0054] First, a substrate is prepared. The substrate may include a silicon wafer, and more specifically, may include an N-type silicon wafer or a P-type silicon wafer. Although not shown, the top and bottom surfaces of the substrate may have a concave-convex structure, and in this case, each layer formed on the top and bottom surfaces of the substrate is formed with a concave-convex structure in the following process.

[0055] Subsequently, a first thin film layer is formed on the substrate. The first thin film layer may be a semiconductor layer formed on the substrate in a thin film form. The first thin film layer may form a PN junction with the substrate. Therefore, when the substrate includes an N-type silicon wafer, the first thin film layer may be formed of a P-type semiconductor layer. The first thin film layer may be formed by using a chemical vapor deposition (CVD) process or a similar process. The first thin film layer may be formed in a PIN structure, in which a P-type semiconductor material, an I-type semiconductor material, and an N-type semiconductor material are sequentially stacked. When the first thin film layer is formed in the PIN structure in this way, the I-type semiconductor material is depleted by the P-type semiconductor material and the N-type semiconductor material, thereby generating an electric field therein, thereby causing holes and electrons generated by sunlight to be offset by the electric field and collected in the P-type semiconductor material and the N-type semiconductor material, respectively. In the case where the first thin film layer is formed in the PIN structure, it is preferred that the P-type semiconductor material is formed in the first thin film, and then the I-type semiconductor material and the N-type semiconductor material are formed. Since the displacement ability of holes is generally lower than that of electrons, the reason for doing so is to form the P-type semiconductor material at a position close to the light receiving surface to maximize the collection efficiency based on the incident light. The solar cell manufacturing method according to the present invention can form the first thin film layer to have a stacked structure. For example, the solar cell manufacturing method according to the present invention can form the first thin film layer to have a tandem [tandem (PIN / PIN)] or three-layer [three-layer (PIN / PIN / PIN)] stacked structure. The first thin film layer can be formed on the top surface of the substrate. The first thin film layer can be formed on each top and bottom surface in the substrate.

[0056] Subsequently, a second thin film layer is formed on the first thin film layer. The second thin film layer may be a transparent conductor layer formed on the first thin film layer. The second thin film layer may protect the first thin film layer, collect carriers (such as holes (+)) generated in the substrate, and move the collected carriers upward. The second thin film layer may include a transparent conductor material such as indium tin oxide (ITO), ZnOH, ZnO:B, ZnO:Al, SnO2, or SnO2:F. The second thin film layer may be formed using a transparent conductor material such as ZnO, ZnO:B, ZnO:Al, or Ag by using a sputtering process or an organic metal chemical vapor deposition (MOCVD) process. The second thin film layer has the function of scattering sunlight so that sunlight can be transmitted at various angles to increase the proportion of light that is incident on the first thin film layer again. The solar cell manufacturing method according to the present invention may not need to form a second thin film layer and may only form the first thin film layer. That is, the solar cell manufacturing method according to the present invention may selectively form a second thin film layer.

[0057] In the above, the battery 1 having two thin film layers formed on the substrate has been mainly described, but this is only exemplary, and three or more thin film layers may be formed on the substrate.

[0058] The battery manufacturing process may include a process of forming electrodes on a substrate. The electrodes may be separated from the substrate at a specific interval. The process of forming the electrodes may be performed before forming the thin film layer on the substrate. The electrodes may be formed on the substrate. For example, the electrodes may be formed on each top and bottom surface of the substrate. The electrodes may be formed on the thin film layer. For example, the electrodes may be formed on each top and bottom surface of the thin film layer.

[0059] After performing the cell manufacturing process, the mounting process S100, the coating process S200 and the scribing process S300 may be performed. Here, the solar cell manufacturing method according to the present invention is implemented according to multiple embodiments, and thus the following will sequentially describe multiple embodiments of the solar cell manufacturing method according to the present invention with reference to the relevant drawings.

[0060] <First Embodiment>

[0061] See also Figures 2 to 6 The solar cell manufacturing method according to the first embodiment of the present invention is implemented as follows: the coating process S200 is performed before the scribing process S300 is performed. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention can achieve the following effects.

[0062] First, when performing the scribing process S300, particles are formed on the cell 1, and in the solar cell manufacturing method according to the first embodiment of the present invention, because the coating process S200 is formed before the scribing process S300, the coating process S200 can be performed in a state where the particles generated by the scribing process S300 are not located on the cell 1. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention can increase the bonding force of the conductive material 20. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention can improve the completeness of the process of bonding the unit cell 10 by using the conductive material 20.

[0063] Second, in the solar cell manufacturing method according to the first embodiment of the present invention, the conductive material 20 can be pre-coated on the area where the scribing process S300 is performed, and then the conductive material 20 implements a restraining force to suppress the probability of cracks in the cell 1. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention can improve the quality of the finished solar cell.

[0064] Based on the solar cell manufacturing method according to the first embodiment of the present invention, the mounting process S100, the coating process S200 and the scribing process S300 may be implemented in the following manner.

[0065] See also Figure 2 The installation process S100 may be a process of installing the battery in a processing space for manufacturing solar cells. The installation process may be performed by a loading apparatus (not shown) that loads the battery into the processing space. The processing space may accommodate a processing apparatus (not shown) in which the solar cell needs to be manufactured and may be implemented as a cavity as a whole.

[0066] See also Figures 2 to 4 , the coating process S200 may be a process of coating the conductor material 20 onto the battery 1. The coating process S200 may be performed after the mounting process S100. The coating process S200 may be performed by a conductor material coater 2 that coats the conductor material 20. The conductor material coater 2 may coat the conductor material 20 onto a coating region, wherein the coating region is one of the regions in the battery 1. The conductor material 20 may be implemented as a material having conductivity. Figure 3a and Figure 3b An example of a conductive material 20 being coated on a battery 1 is schematically shown. Figures 3a to 4 In the figure, the coating process S200 is shown to be performed on the top surface 1 a of the battery 1 , but this is only an example, and the coating process S200 may be performed on the bottom surface 1 b of the battery 1 .

[0067] The coating process S200 may include a process of coating a plurality of conductive materials 20 on the battery 1. In this case, the process of coating a plurality of conductive materials 20 may be performed by a plurality of conductive material coaters 2. For example, Figure 4As shown, in the case where four conductor materials 20 need to be applied to the battery 1 at the same time, the coating process S200 can be performed by four conductor material applicators 2, 2', 2", 2'". Therefore, when the first conductor material applicator 2 applies the conductor material 20 to the first coating area of ​​the battery 1, the second conductor material applicator 2' can apply the conductor material 20 to the second coating area separated from the first coating area, the third conductor material applicator 2" can apply the conductor material 20 to the third coating area separated from the first coating area and the second coating area, and the fourth conductor material applicator 2'" can apply the conductor material 20 to the fourth coating area separated from the first coating area, the second coating area and the third coating area. In this case, the conductor material applicators 2, 2', 2", 2'" can be separated from each other at specific intervals. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention can be implemented so that the coating process S200 is performed on the entire surface of the battery 1. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention can reduce the time spent in the coating process S200. The first coating area, the second coating area, the third coating area and the fourth coating area can be areas of the top surface 1a of the cell 1.

[0068] See also Figures 2 to 4 , the scribing process S300 may be a process of forming a battery dividing part 30 for dividing the battery 1 into a plurality of unit batteries 10. The scribing process S300 may be performed after the coating process S200. The scribing process S300 may be performed by a scribing device 3 that emits a laser toward the battery 1. The scribing device 3 may emit a laser onto a scribing area, where the scribing area is an area of ​​the battery 1. The scribing area and the coating area may be disposed in different areas in the battery 1. Figure 3b and Figure 4 The arrows shown as one-dot-dashed lines in FIG. 3 schematically illustrate the laser light emitted by the scribing device 3. Figure 3b and Figure 4 In FIG. 1 , the scribing process S300 is illustrated as being performed on the bottom surface 1 b of the battery 1 , but this is merely exemplary, and the scribing process S300 may be performed on the top surface 1 a of the battery 1 .

[0069] The scribing process S300 may be performed by emitting a laser toward the battery 1. Thus, the battery dividing portion 30 may be formed by removing a specific area in the battery 1. The battery dividing portion 30 may be implemented as a groove recessed at a specific depth from the surface of the battery 1. The battery dividing portion 30 may be formed to extend from one side of the battery 1 to the other side of the battery 1. Figure 3b A battery dividing portion 30 is shown formed on the battery 1 .

[0070] The scribing process S300 may be a process of forming a plurality of battery dividing parts 30 on the battery 1. In this case, the process of forming these battery dividing parts 30 may be performed by a plurality of scribing devices 3. For example, Figure 4 As shown, in the case where four battery dividing parts 30 need to be formed on the battery 1 at the same time, the scribing process S300 can be performed by four scribing devices 3, 3', 3", 3'". Therefore, when the first scribing device 3 emits a laser onto the first scribing area of ​​the battery 1, the second scribing device 3' can emit a laser onto the second scribing area separated from the first scribing area, the third scribing device 3" can emit a laser onto the third scribing area separated from the first scribing area and the second scribing area, and the fourth scribing device 3'" can emit a laser onto the fourth scribing area separated from the first scribing area, the second scribing area and the third scribing area. In this case, the scribing devices 3, 3', 3", 3'" can be arranged to be separated from each other at specific intervals. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention can be implemented so that the scribing process S300 is performed on the entire surface of the battery 1. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention can reduce the time spent on the scribing process S300. The first scribe line region, the second scribe line region, the third scribe line region, and the fourth scribe line region may be regions of the bottom surface 1 b of the battery 1 .

[0071] The scribing process S300 may be performed by emitting laser light to the coating area. In this case, the scribing process S300 and the coating process S200 may be performed on the same surface of the cell 1. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention may be implemented to emit laser light to the area pre-coated with the conductor material 20, thereby reducing the probability of cracks caused by the scribing process S300. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention may improve the quality of the solar cell.

[0072] In the case where the scribing process S300 is performed to emit laser light onto the region where the conductor material 20 is applied, the coating process S200 may be performed by using a transparent conductor film (TCF) to emit laser light onto the cell 1. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention can reduce the probability of cracks and can achieve a transmissive force that allows laser light to pass through the conductor material 20.

[0073] See also Figures 3a to 4, the coating process S200 and the scribing process S300 may be performed at different positions on the cell 1. For example, in the case where the scribing process S300 is performed in the first scribing region, the coating process S200 may be performed in the first coating region separated from the first scribing region. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention may separate the region where the coating process S200 is performed from the region where the scribing process S300 is performed, thereby applying a suppressing force to suppress the conductor material 20 from being solidified due to the laser temperature.

[0074] The coating process S200 and the scribing process S300 may be performed at a plurality of locations separated from each other with respect to the first axial direction. The first axial direction may be a direction parallel to the direction in which the scribing device 3 emits the laser. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention may separate the region where the coating process S200 is performed from the region where the scribing process S300 is performed.

[0075] See also Figures 3a to 4 , the coating process S200 and the scribing process S300 can be performed on different surfaces of the cell 1. For example, the coating process S200 can be performed on the top surface 1a of the cell 1, and the scribing process S300 can be performed on the bottom surface 1b of the cell 1. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention can separate the surface where the coating process S200 is performed from the surface where the scribing process S300 is performed, thereby implementing a suppressing force to suppress the conductor material 20 from being solidified due to the laser temperature.

[0076] See also Figure 2 and Figure 5 The method for manufacturing a solar cell according to the first embodiment of the present invention may include a cutting process S400 of dividing the cell 1 into a plurality of unit cells 10 .

[0077] The cutting process S400 may be a process for dividing the battery 1 into the unit cells 10. The cutting process S400 may be performed after the scribing process S300. Figure 5 As shown, in the case where the battery 1 needs to be divided into five unit cells 10, 10', 10", 10"', 10"", the solar cell manufacturing method according to the first embodiment of the present invention may include four cutting processes S400. That is, in the case where the battery 1 needs to be divided into L (where L is an integer greater than 2) unit cells 10, the solar cell manufacturing method according to the first embodiment of the present invention may include (L-1) cutting processes S400. When performing the cutting process S400, the battery 1 can be divided into these unit cells 10 relative to the battery dividing part 30. The cutting process S400 can be performed by a cutting robot (not shown) that divides the battery 1 into unit cells 10.

[0078] See also Figure 2 and Figure 6 The method for manufacturing a solar cell according to the first embodiment of the present invention may include a bonding process S500 of bonding the divided unit cells 10 .

[0079] The bonding process S500 may be a process of bonding the separated unit cells 10. The bonding process S500 may be performed by bonding the separated unit cells 10 using the conductive material 20. The bonding process S500 may be performed after the cutting process S400. Figure 6 As shown, in the case where the cell 1 is divided into five unit cells 10, 10', 10", 10'", 10"" through the cutting process S400, the solar cell manufacturing method according to the first embodiment of the present invention may include four bonding processes S500. That is, in the case where L unit cells 10 need to be bonded, the solar cell manufacturing method according to the first embodiment of the present invention may include (L-1) bonding processes S500. Figure 6 As shown, the combining process S500 may include a process of combining the top surface of one side of the first unit cell 10 to the bottom surface of one side of the second unit cell 10', a process of combining the top surface of the other side of the second unit cell 10' to the bottom surface of one side of the third unit cell 10", a process of combining the top surface of the other side of the third unit cell 10" to the bottom surface of one side of the fourth unit cell 10'", and a process of combining the top surface of the other side of the fourth unit cell 10'" to the bottom surface of one side of the fifth unit cell 10"". One side and the other side of each unit cell 10 may be arranged at positions relative to each other relative to the center point of the unit cell 10. The combining process S500 may be performed by a transport robot (not shown) that moves the separated unit cells 10.

[0080] See also Figure 2 and Figure 6 The solar cell manufacturing method according to the first embodiment of the present invention may include a curing process S600.

[0081] The curing process S600 is a process of curing the combined unit cells 10. The curing process S600 may be performed after the combining process S500. The curing process S600 may be performed by a heating device (not shown) that heats the combined unit cells 10. When the curing process S600 is performed, a solar cell 10A having a module type in which the unit cells 10 are connected to each other may be manufactured. Figure 6 In the figure, the solar cell 10A is illustrated as being configured with five unit cells 10 , but this is merely exemplary, and the solar cell 10A may be configured with two or more and four or less unit cells 10 , or may be configured with six or more unit cells 10 .

[0082] <Second Embodiment>

[0083] See also Figures 3b to 8b The solar cell manufacturing method according to the second embodiment of the present invention is implemented as follows: the coating process S200 and the scribing process S300 are performed simultaneously. Therefore, the solar cell manufacturing method according to the second embodiment of the present invention can achieve the following effects.

[0084] First, the solar cell manufacturing method according to the second embodiment of the present invention can be implemented such that the coating process S200 and the scribing process S300 are performed simultaneously, thereby reducing the time required to manufacture the solar cell. Therefore, the solar cell manufacturing method according to the second embodiment of the present invention can increase the productivity of the solar cell.

[0085] Second, the solar cell manufacturing method according to the second embodiment of the present invention can be implemented as follows: a series of processes for transferring the cell 1 between the space for performing the scribing process S300 and the space for performing the coating process S200 are omitted. Therefore, the solar cell manufacturing method according to the second embodiment of the present invention can reduce the installation cost of the cell transfer device (not shown) for transferring the cell 1, thereby reducing the manufacturing cost of the solar cell.

[0086] Based on the solar cell manufacturing method according to the second embodiment of the present invention, the mounting process S100, the coating process S200 and the scribing process S300 can be implemented in the following manner. The mounting process S100, the coating process S200 and the scribing process S300 can be implemented substantially in accordance with the above description of the solar cell manufacturing method according to the first embodiment of the present invention, so the following mainly describes the different parts.

[0087] See also Figures 3b to 8b , in the scribing process S300, the process of forming these battery division parts 30 can be performed by moving the scribing device 3 along the first axial direction. In this case, a scribing transmission device (not shown) for moving the scribing device 3 can be installed. The first axial direction can be a direction perpendicular to the direction in which the laser is emitted onto the battery 1. For example, in the case where four battery division parts 30 need to be formed in the battery 1 by using two scribing devices 3, the process of forming these battery division parts 30 can be performed in the following manner. First, two battery division parts 30 are formed at a position on the right side relative to the center point of the battery 1 by using the scribing devices 3, 3'. Subsequently, the scribing device 3 can be moved along the first axial direction by using the scribing transmission device. Subsequently, the two battery division parts 30 are formed at a position on the left side relative to the center point of the battery 1 by using the scribing devices 3, 3'. Through the above process, the process of forming these battery division parts 30 in the battery 1 can be performed.

[0088] See also Figures 3b to 8b The coating process S200 may use a material such as a conductive transparent conductor film (TCF) as the conductor material 20. The coating area and the scribing area may be disposed in different areas of the battery 1. The coating process S200 and the scribing process S300 may be performed simultaneously.

[0089] The process of applying a plurality of conductor materials 20 onto the battery 1 can be performed by moving the conductor material applicator 2 along the first axial direction. In this case, a coating transmission device (not shown) for moving the conductor material applicator 2 can be installed. For example, in a case where four conductor materials 20 need to be applied onto the battery 1 by two conductor material applicators 2, the process of applying these conductor materials 20 can be performed in the following manner. First, two conductor materials 20 are applied on the left half relative to the center point of the battery 1 by using the conductor material applicator 2. Subsequently, the conductor material applicator 2 can be moved along the first axial direction by using the coating transmission device. Subsequently, two conductor materials 20 are applied on the right half relative to the center point of the battery 1 by using the two conductor material applicators 2. Through the above-mentioned process, the process of applying these conductor materials 20 onto the battery 1 can be performed.

[0090] The coating process S200 and the scribing process S300 may be performed in the same space. That is, both the coating process S200 and the scribing process S300 may be performed in the processing space.

[0091] The coating process S200 and the scribing process S300 may be performed at positions separated from each other relative to the first axial direction. Hereinafter, an embodiment in which the coating process S200 and the scribing process S300 are performed in the solar cell manufacturing method according to the second embodiment of the present invention will be described with reference to the relevant drawings. For ease of understanding, an example in which the coating process S200 is performed by four conductive material coaters 2, 2', 2", 2"' and the scribing process S300 is performed by four scribing devices 3, 3', 3", 3"' will be described below.

[0092] First, prepare the battery 1. Two conductive material applicators 2, 2' may be arranged in the upward direction of the battery 1, and two scribing devices 3, 3' may be arranged in the downward direction of the battery 1. In this case, the conductive material applicators 2, 2' may be arranged in the left half relative to the center point of the battery 1, and the scribing devices 3, 3' may be arranged in the right half relative to the center point of the battery 1, so that the conductive material applicators 2, 2' and the scribing devices 3, 3' are arranged separately from each other relative to the first axial direction.

[0093] Subsequently, the coating process S200 and the scribing process S300 may be performed simultaneously. Figure 8aAs shown, the coating process S200 and the scribing process S300 may be performed by the conductor material coater 2, 2' coating the conductor material 20, 20' onto the top surface 1a of the battery 1, and by the scribing device 3, 3' forming the battery dividing portion 30, 30' on the bottom surface 1b of the battery 1. In this case, the conductor material coater 2, 2' and the scribing device 3, 3' may be disposed separately from each other with respect to the first axial direction, thereby preventing the conductor material 20, 20' from being solidified by the laser.

[0094] Subsequently, a process of moving the battery 1 along the first axial direction may be performed. The process of moving the battery 1 may be performed by a battery moving device (not shown). In this case, the conductive material applicator 2", 2"' may be arranged at the right half relative to the center point of the battery 1, and the scribing device 3", 3"' may be arranged at the left half relative to the center point of the battery 1.

[0095] Subsequently, the coating process S200 and the scribing process S300 may be performed simultaneously. Figure 8b As shown, the coating process S200 and the scribing process S300 can be performed by a conductor material applicator 2", 2"' that applies the conductor material 20", 20"' onto the top surface 1a of the battery 1, and by a scribing device 3", 3"' that forms the battery dividing portion 30", 30"' on the bottom surface 1b of the battery 1. In this case, the conductor material applicator 2", 2"' and the scribing device 3", 3"' can be arranged separately from each other relative to the first axial direction, thereby preventing the conductor material 20", 20"' from being solidified by the laser.

[0096] As described above, the solar cell manufacturing method according to the second embodiment of the present invention may be implemented such that the scribing process S300 and the coating process S200 are simultaneously performed in a state where the scribing device 3 and the conductive material coater 2 are separated.

[0097] See also Figures 3b to 8b The solar cell manufacturing method according to the second embodiment of the present invention may include a cutting process S400 and a bonding process S500. The cutting process S400 and the bonding process S500 may be implemented substantially in accordance with the above description of the solar cell manufacturing method according to the first embodiment of the present invention, and thus their detailed descriptions will be omitted.

[0098] <Third Embodiment>

[0099] See also Figures 9 to 15e, the solar cell manufacturing method according to the third embodiment of the present invention may include a mounting process S100, a scribing process S300, a coating process S200, a cutting process S400 and a bonding process S500. The mounting process S100 is to mount the battery 1 for forming a plurality of thin film layers in a processing space for manufacturing a solar cell. The scribing process S300 is to emit a laser onto the battery 1 to form "N-1" (where N is an integer greater than or equal to 3) battery dividing parts 30 in order to divide the battery 1 into N unit cells 10. The coating process S200 is to apply a conductive material 20 onto the battery 1. The cutting process S400 is to divide the battery 1 into two unit cells 10. The bonding process S500 is performed immediately after the cutting process S400 and is used to bond the two divided unit cells 10.

[0100] The solar cell manufacturing method according to the third embodiment of the present invention is implemented so that the cutting process S400 and the bonding process S500 are repeatedly performed "N-1" times. Therefore, the solar cell manufacturing method according to the third embodiment of the present invention is implemented as follows: the cutting process S400 divides the battery 1 into N unit cells 10 and then performs the bonding process S500. Compared with the known technology, the time spent on the bonding process S500 can be reduced. This will be described in detail below with reference to the relevant drawings. For ease of understanding, an example of dividing the battery 1 into five unit cells 10, 10', 10", 10"', 10"" will be described below.

[0101] Figures 13a to 13e FIG. 4 is a schematic side view of the process of cutting process S400 and bonding process S500 in the solar cell manufacturing method according to the prior art. Fig.13a As shown, the cutting process S400 can be performed four times simultaneously to divide the battery 1 into five unit cells 10, 10', 10", 10'", 10". When the cutting process S400 is performed four times simultaneously on the battery 1, the five unit cells 10, 10', 10", 10'", 10"" can be separated from each other by the cutting distance CL. Here, the four cutting distances CL between the five unit cells 10, 10', 10", 10'", 10"" can be the same.

[0102] See also Figures 13b to 13e After the cutting process S400 is performed, the bonding process S500 may be performed four times to bond the five unit cells 10, 10', 10", 10'", 10". First, as shown in FIG. Fig.13b As shown, when performing the bonding process S500, the second unit cell 10' may be bonded to the first unit cell 10. In this case, the bonding process S500 may include a process of moving the second unit cell 10' by about a cutting distance CL. Fig.13cAs shown, when the bonding process S500 is performed, the third unit cell 10" may be bonded to the second unit cell 10'. In this case, the bonding process S500 may include a process of moving the third unit cell 10" by about two cutting distances CL. This is because the process of moving the second unit cell 10' by one cutting distance CL is performed in a state where the second unit cell 10' is separated from the third unit cell 10", and thus the third unit cell 10" should be additionally moved by one cutting distance CL in the case where the second unit cell 10' has been moved. Subsequently, as Fig.13d As shown, when the bonding process S500 is performed, the fourth unit cell 10'' may be bonded to the third unit cell 10". In this case, the bonding process S500 may include a process of moving the fourth unit cell 10'' by about three cutting distances 3CL. This is because the process of moving the third unit cell 10'' by two cutting distances 2CL is performed in a state where the third unit cell 10'' is separated from the fourth unit cell 10'', and thus the fourth unit cell 10'' should be additionally moved by two cutting distances 2CL in the case where the third unit cell 10'' has been moved. Subsequently, as Fig.13e As shown, when performing the bonding process S500, the fifth unit cell 10"" may be bonded to the fourth unit cell 10"'. In this case, the bonding process S500 may include a process of moving the fifth unit cell 10"" by approximately four cutting distances 4CL. This is because the process of moving the fourth unit cell 10"' by three cutting distances 3CL is performed when the fourth unit cell 10"' is separated from the fifth unit cell 10"", so the fifth unit cell 10"" should be moved an additional three cutting distances 3CL when the fourth unit cell 10"' has been moved. As described above, the comparative example may include moving the five unit cells 10, 10', 10", 10"', 10"" by approximately ten cutting distances "10CL=CL+2CL+3CL+4CL".

[0103] Figure 14a to Figure 14h1 is a process side schematic diagram of the cutting process S400 and the bonding process S500 in the solar cell manufacturing method according to the third embodiment of the present invention. In the solar cell manufacturing method according to the third embodiment of the present invention, unlike the comparative example, the cutting process S400 is not performed simultaneously in order to divide the battery 1 into five unit cells 10, 10', 10", 10"', 10"". That is, the solar cell manufacturing method according to the third embodiment of the present invention is implemented so that when the cutting process S400 is performed once, the bonding process S500 is performed sequentially and successfully. Below, the cutting process S400 and the bonding process S500 of the solar cell manufacturing method according to the third embodiment of the present invention will be described.

[0104] See also Fig.14a First, a primary cutting process S400 is performed to separate the first unit cell 10 and the second unit cell 10' in the battery 1. In this case, the first unit cell 10 and the second unit cell 10' may be separated from each other by a cutting distance CL.

[0105] Then, if Fig.14b As shown, when the bonding process S500 is performed, the second unit cell 10' may be bonded to the first unit cell 10. In this case, the bonding process S500 may include a process of moving the second unit cell 10' by about the cutting distance CL.

[0106] Then, if Fig.14c As shown, a primary cutting process S400 of dividing the second unit cell 10 ′ and the third unit cell 10 ″ is performed. In this case, the second unit cell 10 ′ and the third unit cell 10 ″ may be separated from each other by a cutting distance CL.

[0107] Then, if Fig.14d As shown, when performing the bonding process S500, the third unit cell 10" may be bonded to the second unit cell 10'. In this case, the bonding process S500 may include a process of moving the third unit cell 10" by approximately the cutting distance CL. The solar cell manufacturing method according to the third embodiment of the present invention is implemented such that in the bonding process S500 of bonding the second unit cell 10' to the first unit cell 10, when the second unit cell 10' is moved to the first unit cell 10, the third unit cell 10" is also moved together. Therefore, compared to the comparative example, the solar cell manufacturing method according to the third embodiment of the present invention can reduce the moving distance required to bond the third unit cell 10".

[0108] Then, if Fig.14eAs shown, the third unit cell 10" and the fourth unit cell 10"'

[0109] The first cutting process of singulation S400 is performed. In this case, the fourth unit cell 10'' and the third unit cell 10'' may be separated from each other by the cutting distance CL.

[0110] Then, if Fig.14f As shown, when performing the bonding process S500, the fourth unit cell 10'" may be bonded to the third unit cell 10". In this case, the bonding process S500 may include a process of moving the fourth unit cell 10'" by approximately the cutting distance CL. The solar cell manufacturing method according to the third embodiment of the present invention is implemented so that in the bonding process S500 of bonding the third unit cell 10' to the second unit cell 10', when the third unit cell 10'" moves to the second unit cell 10', the fourth unit cell 10'" will also move together. Therefore, compared with the comparative example, the solar cell manufacturing method according to the third embodiment of the present invention can reduce the moving distance required to bond the fourth unit cell 10'".

[0111] Then, if Figure 14g As shown, a primary cutting process S400 of dividing the fourth unit cell 10''' and the fifth unit cell 10''' is performed. In this case, the fifth unit cell 10''' and the fourth unit cell 10''' may be spaced apart from each other by a cutting distance CL.

[0112] Then, if Figure 14h As shown, when performing the bonding process S500, the fifth unit cell 10"" may be bonded to the fourth unit cell 10"'. In this case, the bonding process S500 may include a process of moving the fifth unit cell 10"" by about the cutting distance CL. The solar cell manufacturing method according to the third embodiment of the present invention is implemented so that in the bonding process S500 of bonding the fourth unit cell 10"' to the third unit cell 10", when the fourth unit cell 10"' moves to the third unit cell 10", the fifth unit cell 10"" will also move together. Therefore, compared with the comparative example, the solar cell manufacturing method according to the third embodiment of the present invention can reduce the moving distance required for bonding the fifth unit cell 10".

[0113] In the case of using this method, the solar cell manufacturing method according to the third embodiment of the present invention may include a process of moving the five unit cells 10 , 10 ′, 10 ″, 10 ′″, 10 ″″ separated in the bonding process S500 by four cutting distances 4CL.

[0114] As described above, the solar cell manufacturing method according to the third embodiment of the present invention is implemented such that a bonding process S500 is sequentially performed immediately after a cutting process S400 is performed on the cell 1, and each cutting process S400 and bonding process S500 are repeatedly performed "N-1" times. Therefore, compared with the comparative example, the solar cell manufacturing method according to the third embodiment of the present invention is implemented such that the moving distance of the unit cell 10 in the split state in the bonding process S500 can be reduced despite the same number of cutting processes S400 and the same number of bonding processes S500. Therefore, the solar cell manufacturing method according to the third embodiment of the present invention can reduce the time spent in the bonding process S500, thereby increasing the yield of solar cells.

[0115] Hereinafter, the mounting process S100 , the scribing process S300 , the coating process S200 , the cutting process S400 , and the bonding process S500 will be described in detail with reference to the relevant drawings.

[0116] See also Fig. 9 , the installation process S100 may be a process of installing the battery 1 in a processing space for manufacturing solar cells. The installation process S100 may be a process of preparing a substrate provided with a solar cell in the processing space. Here, the solar cell may be a battery 1 in which a plurality of thin film layers are stacked on a substrate. The installation process may be performed by a loading device (not shown) that loads the battery into the processing space. The processing space may accommodate a manufacturing device (not shown) in which a solar cell needs to be manufactured and may be implemented as a cavity as a whole.

[0117] See also Fig. 9 and Fig.11 , the scribing process S300 may be a process of dividing the battery 1 into a plurality of unit batteries 10. The scribing process S300 may be performed after the mounting process S100. The scribing process S300 may be performed by a scribing device 3 that emits a laser toward the battery 1. The scribing device 3 may emit a laser onto a scribing area, where the scribing area is one of the areas of the battery 1. The scribing area and the coating area may be set in different areas of the battery 1. Fig.11 The arrows shown in dashed lines in FIG. 3 schematically illustrate the laser light emitted by the scribing device 3. Fig.11 In the figure, the scribing process S300 is illustrated as being performed on the top surface 1 a of the battery 1 , but this is merely exemplary, and the scribing process S300 may be performed on the bottom surface 1 b of the battery 1 .

[0118] The scribing process S300 may be a process of forming "N-1" battery dividing parts 30 for dividing the battery 1 into N unit batteries 10. In this case, the scribing process S300 may be performed by "N-1" scribing devices 3. For example, Fig.11As shown, in the case where five unit cells 10 need to be separated, the scribing process S300 can be performed by four scribing devices 3, 3', 3", 3'". Therefore, when the first scribing device 3 emits a laser to the first scribing area of ​​the battery 1, the second scribing device 3' can emit a laser to the second scribing area separated from the first scribing area, the third scribing device 3" can emit a laser to the third scribing area separated from the first scribing area and the second scribing area, and the fourth scribing device 3'" can emit a laser to the fourth scribing area separated from the first scribing area, the second scribing area and the third scribing area. In this case, the scribing devices 3, 3', 3", 3'" can be arranged separately from each other at specific intervals. Therefore, the solar cell manufacturing method according to the third embodiment of the present invention can be implemented so that the scribing process S300 is performed simultaneously on the entire surface of the battery 1. Therefore, the solar cell manufacturing method according to the third embodiment of the present invention can reduce the time spent on the scribing process S300. The first scribe line region, the second scribe line region, the third scribe line region, and the fourth scribe line region may be regions of the top surface 1 a of the battery 1 .

[0119] The scribing process S300 may be performed by emitting a laser toward the battery 1. Thus, by removing a specific area of ​​the battery 1, the battery dividing part 30 may be formed. When the scribing process S300 is performed, the battery dividing part 30 may be formed on one of the surfaces of the battery 1. When the scribing process S300 is performed, the battery dividing part 30 may be formed on one of the surfaces of the substrate. The battery dividing part 30 may be implemented as a groove recessed from the surface of the battery 1 at a certain depth. The battery dividing part 30 may be formed to extend from one side of the battery 1 to the other side of the battery 1.

[0120] See also Fig. 9 and Fig.12 , the coating process S200 may be a process of coating the conductive material 20 onto the battery 1. When performing the coating process S200, the conductive material 20 may be coated on the periphery of the battery dividing portion 30. The coating process S200 may be performed after the scribing process S300. The conductive material 20 may be a conductive material, such as a transparent conductive film. The coating process S200 may be performed by a conductive material coater 2 that coats the conductive material 20. The conductive material coater 2 may coat the conductive material 20 on a coating area, wherein the coating area is one of the areas of the battery 1. The coating area and the scribing area may be disposed in different areas of the battery 1. Fig.12 In FIG. 1 , the coating process S200 is illustrated as being performed on the top surface 1 a of the battery 1 , but this is merely exemplary, and the coating process S200 may be performed on the bottom surface 1 b of the battery 1 .

[0121] The coating process S200 may include a process of coating a plurality of conductive materials 20 onto the battery 1 by using a plurality of conductive material coaters 2. In the case where the battery 1 needs to be divided into N unit batteries 10, the coating process S200 may be performed by "N-1" conductive material coaters 2. For example, Fig.12 As shown, in the case where the battery 1 needs to be divided into five unit cells 10, the coating process S200 can be performed by four conductive material applicators 2, 2', 2", 2'". Therefore, when the first conductive material applicator 2 applies the conductive material 20 to the first coating area of ​​the battery 1, the second conductive material applicator 2' can apply the conductive material 20 to the second coating area separated from the first coating area, the third conductive material applicator 2" can apply the conductive material 20 to the third coating area separated from the first coating area and the second coating area, and the fourth conductive material applicator 2'" can apply the conductive material 20 to the fourth coating area separated from the first coating area, the second coating area and the third coating area. In this case, the conductive material applicators 2, 2', 2", 2'" can be separated from each other at specific intervals. Therefore, the solar cell manufacturing method according to the third embodiment of the present invention can be implemented so that the coating process S200 is performed on the entire surface of the battery 1. Therefore, the solar cell manufacturing method according to the third embodiment of the present invention can reduce the time spent in the coating process S200. The first coating area, the second coating area, the third coating area and the fourth coating area can be areas of the top surface 1a of the cell 1.

[0122] The coating process S200 and the scribing process S300 may be performed on different surfaces of the cell 1. For example, the coating process S200 may be performed on the top surface 1a of the cell 1, and the scribing process S300 may be performed on the bottom surface 1b of the cell 1. Therefore, the solar cell manufacturing method according to the first embodiment of the present invention can separate the surface where the coating process S200 is performed and the surface where the scribing process S300 is performed, thereby applying a suppressing force to suppress the conductor material 20 from being solidified due to the laser temperature.

[0123] See also Fig. 9 and Figure 14a to Figure 14h , the cutting process S400 is a process of dividing the battery 1 into two unit cells 10. That is, when the cutting process S400 is performed, the substrate constituting the battery 1 may be divided into two blocks along one of the "N-1" battery dividing parts 30. When the cutting process S400 is performed, the battery 1 may be divided into two unit cells 10 relative to the battery dividing part 30. The cutting process S400 may be performed by a cutting machine (not shown) that divides the battery 1 into two unit cells 10. When "N-1" battery dividing parts 30 are formed in the battery 1, the cutting process S400 may be performed "N-1" times.

[0124] See also Fig. 9 and Figure 14a to Figure 14h , when the cutting process S400 is performed, the cutting distance CL may be formed between the two divided unit cells 10. That is, when the cutting process S400 is performed, the two divided blocks may be separated from each other by the cutting distance CL. In this case, the combining process S500 may include a process of moving the divided unit cells 10.

[0125] The cutting distance CL formed by repeatedly performing the cutting process S400 may be gradually reduced. Fig.14a As shown in FIG. 1 , the cutting distance CL formed by repeatedly performing the cutting process S400 may be greater than Fig.14c The cutting distance CL formed by repeatedly performing the cutting process S400 twice is shown in FIG. By using this method, the solar cell manufacturing method according to the third embodiment of the present invention can be implemented as follows: the cutting distance CL generated by repeatedly performing the cutting process S400 is gradually reduced, thereby reducing the moving distance for combining the unit cells 10 in the combining process S500. Therefore, the solar cell manufacturing method according to the third embodiment of the present invention can reduce the time spent in the combining process S500. The cutting distance CL formed by repeatedly performing the cutting process S400 can be the same.

[0126] See also Fig. 9 and Figure 14a to Figure 14h , the combining process S500 is a process of combining the divided unit cells 10. That is, the combining process S500 is a process of combining two divided blocks. In order to combine the two divided unit cells 10, the combining process S500 may be performed sequentially immediately after the cutting process S400, and the combining process S500 and the cutting process S400 may be repeated "N-1" times. Therefore, compared to the known technology implemented as performing the combining process S500 after dividing the battery 1 into a plurality of unit cells 10 in the cutting process S400, the solar cell manufacturing method according to the third embodiment of the present invention can reduce the time spent on the combining process S500.

[0127] The bonding process S500 may be performed by bonding two separated unit cells 10 using the conductive material 20. The bonding process S500 and the cutting process S400 may be performed the same number of times. Figures 14a to 14f As shown, the cutting process S400 is performed three times, and the bonding process S500 may also be performed three times.

[0128] The combining process S500 may include a process of moving one of the two divided unit cells 10. That is, the combining process S500 may include a process of moving one of the two divided blocks to overlap with a portion of the other block. Here, the overlapping portion of the two blocks may be the coating distance SL (e.g., Fig.14a ), the coating distance SL is the length of the conductive material 20 coated on the battery 1. The bonding process S500 may be performed by a transport machine (not shown) for moving the unit battery 10.

[0129] The bonding process S500 may include a process of moving only one of the two divided unit cells 10. Therefore, the ease of operation of moving the unit cells 10 may be improved compared to a comparative example in which all the unit cells 10 are moved in the bonding process S500.

[0130] See also Fig.10 and Figure 14a to Figure 14h , the combining process S500 may include a moving process S510 of moving a moving battery 10b to a fixed battery 10a. When performing the moving process S510, the moving battery 10b may be moved to the fixed battery 10a. The fixed battery 10a may be a fixed unit battery 10 that will not be moved in the combining process S500 among the separated unit batteries 10. The moving battery 10b may be a unit battery 10 that will be moved in the combining process S500 among the separated unit batteries 10. The moving process S510 may be performed by a transfer machine.

[0131] The moving process S510 may include a first moving process S511 and a second moving process S512 .

[0132] The first moving process S511 may be a process of moving the movable battery 10b along a first axial direction. The first axial direction may be a direction parallel to the emission direction of the laser. When performing the first moving process S511, the movable battery 10b may be disposed in an upward direction relative to the fixed battery 10a.

[0133] The second moving process S512 may be a process of moving the mobile battery 10b along a second axial direction. The second axial direction may be a direction perpendicular to the first axial direction. When performing the second moving process S512, the mobile battery 10b may be moved by a cutting distance CL and a coating distance SL (e.g., Fig.14a ). The coating distance SL may be a length of the conductive material 20 coated on the battery 1 relative to the second axial direction. The second moving process S512 may be sequentially performed after the first moving process S511 is performed.

[0134] The second moving process S512 and the first moving process S511 may be performed simultaneously. Therefore, the solar cell manufacturing method according to the third embodiment of the present invention can reduce the time taken to move the mobile battery 10b.

[0135] The second moving process S512 may be implemented to be performed before the first moving process S511. In this case, the second moving process S512 may be performed so that the movable cell 10b does not move more than the cutting distance CL. Therefore, the solar cell manufacturing method according to the third embodiment of the present invention can prevent the possibility of damage to the movable cell 10b and the fixed cell 10a caused by collision between the movable cell 10b and the fixed cell 10a. The solar cell manufacturing method according to the third embodiment of the present invention can move the movable cell 10b by the cutting distance CL, thereby improving the efficiency of the bonding process S500.

[0136] See also Fig. 9 and Figure 14a to Figure 14h The solar cell manufacturing method according to the third embodiment of the present invention may further include a determination process S700.

[0137] The determination process S700 determines whether the number of times each cutting process S400 and the combining process S500 are executed reaches "N-1" times. The determination process S700 can be executed by a controller (not shown) that calculates the number of times each cutting process S400 and the combining process S500 are executed. When the controller determines that the repetition process is less than "N-1" times, the controller can provide a processing signal to a cutting machine (not shown) and a transmission machine (not shown) to execute the cutting process S400 and the combining process S500. When the controller determines that the repetition process is "N-1" times, the controller may not need to provide a processing signal to the cutting machine and the transmission machine, and thus no longer execute the cutting process S400 and the combining process S500.

[0138] See also Fig. 9 and Figure 14h The solar cell manufacturing method according to the third embodiment of the present invention may include a curing process S600.

[0139] The curing process S600 is a process for curing the combined unit cells 10. The curing process S600 may be performed after the determination process S700. That is, the curing process S600 may be performed after completing (N-1) times of the cutting process S400 and (N-1) times of the combining process S500. The curing process S600 may be performed by a heating device (not shown) for heating the combined unit cells 10. When the curing process S600 is performed, a module-type solar cell 100 may be manufactured, in which N unit cells 10 are connected to each other in the module-type solar cell 100. Figure 14hIn the figure, the solar cell 100 is illustrated as being configured with five unit cells 10 , but this is merely exemplary, and the solar cell 100 may be configured with one or more or four or less unit cells 10 , or may be configured with six or more unit cells 10 .

[0140] See also Figures 15a to 15e , a solar cell manufacturing method according to an embodiment of the present invention may include a module process.

[0141] The modularization process is a process of additionally coupling a connection module to a battery (hereinafter referred to as a "base module") that has undergone the mounting process S100, the scribing process S300, the coating process S200, the "N-1" cutting process S400, and the "N-1" bonding process S500, wherein the connection module is configured with M (where M is an integer greater than or equal to 2) unit module batteries 11 (such as Fig.15a For example, Fig.15d As shown, the modularization process may be a process of additionally coupling a connection module to a base module, wherein five unit module batteries 11, 11', 11", 11"', 11"" are connected to each other in the connection module and five unit batteries 10, 10', 10", 10"', 10"" are connected to each other in the base module. The modularization process may be performed in a processing space.

[0142] See also Fig.15a , the modularization process may include a connection process.

[0143] The connection process may be a process of connecting the connection battery 11A formed by a plurality of thin film layers to the base module. The connection process may be performed by coating the conductor material 20 on the base module and then bonding the base module to the conductor material 20. The connection battery 11A may be manufactured by a battery manufacturing process. Therefore, the connection battery 11A may be implemented to be approximately equal to the battery 1. The connection process may be performed after each cutting process S400 and bonding process S500 are performed "N-1" times. The connection process may be performed by a transfer machine.

[0144] The modularization process may include a modular scribing process and a modular coating process.

[0145] The module scribing process is a process of forming "M-1" battery division parts to divide the connected battery 11A into M (where M is an integer greater than or equal to 2) unit module batteries 11. Here, the unit module battery 11 may be implemented to be approximately equal to the unit battery 10. The module scribing process may be implemented to be approximately equal to the scribing process S300.

[0146] The module coating process is a process of coating the conductor material 20 onto the connection battery 11A. The module coating process may be performed after the module scribing process. The module coating process may be implemented to be approximately equal to the coating process S200.

[0147] The module coating process and the module scribing process may be performed before the connection process. In this case, the battery dividing portion 30 may be formed in the connection battery 11A before the connection process is performed, and the conductor material 20 may be coated on the connection battery 11A. The module coating process and the module scribing process may be performed after the connection process.

[0148] See also Fig.15b , the modularization process may include a module cutting process.

[0149] The module cutting process is used to divide the connected battery 11A into two unit module batteries 11. The module cutting process may be performed after the connection process. When the module cutting process is performed, a cutting distance CL may be formed between the two divided unit module batteries 11. In the case where "M-1" battery dividing parts are formed on the connected battery 11A, the module cutting process may be performed "M-1" times. The module cutting process may be implemented to be approximately equal to the cutting process S400.

[0150] See also Fig.15c , the modular process may include a module combining process.

[0151] The module bonding process is a process of bonding two separated unit module batteries 11. The module bonding process may be sequentially performed immediately after the module cutting process to bond the two separated unit module batteries 11. The module bonding process and the module cutting process may be performed the same number of times. The module bonding process may be implemented to be approximately equal to the bonding process S500.

[0152] See also Fig.15d , the module bonding process may be sequentially performed immediately after the module cutting process once, and each module bonding process and the module cutting process may be repeatedly performed "M-1" times. Therefore, compared with the comparative example implemented so that the module bonding process is performed after the connection cell 11A is divided into a plurality of unit module cells 11 in the module cutting process, the solar cell manufacturing method according to the third embodiment of the present invention can reduce the time spent on the module bonding process.

[0153] See also Fig.15dWhen the solar cell manufacturing method according to the third embodiment of the present invention includes a modularization process, the curing process S600 may be performed after the modularization process is completed. In this case, the curing process S600 may cure the base module and the connection module. When the curing process S600 is performed, a solar cell 100 having a module type may be manufactured, wherein the module type has N unit cells 10 connected to M unit module cells 11. Fig.15d A solar cell 100 is shown which is configured with five unit cells 10 , 10 ′, 10 ″, 10 ′″, 10 ″″ and five unit module cells 11 , 11 ′, 11 ″, 11 ′″, 11 ″″.

[0154] The solar cell manufacturing method according to the third embodiment of the present invention may be implemented such that the modular process is repeatedly performed. Fig.15e As shown, nine connection modules can be sequentially coupled to the base module. When each connection module connects five unit module batteries, the solar cell 100 can be configured with five unit modules 10, 10', 10", 10"', 10"" and forty-five unit module batteries 11, 11', 11", 11"', 11"", ..., 11"". In this case, the curing process S600 can be performed after the modularization process is completed.

[0155] The above description of the present invention is not limited to the above embodiments and related drawings. Those skilled in the art will clearly realize that various modifications, variations and substitutions may be made without departing from the scope and spirit of the present invention.

Claims

1. A method for manufacturing a solar cell, the method comprising: an installation process for installing a cell for forming a plurality of thin film layers in a processing space for manufacturing a solar cell; a coating process to coat a conductive material on the battery; and a scribing process, emitting a laser toward the battery to form a battery dividing portion for dividing the battery into a plurality of unit batteries, The coating process and the scribing process are performed simultaneously on different surfaces in the battery.

2. The method of claim 1, wherein the coating process comprises coating a conductive material at predetermined intervals on the surface of the battery.

3. The method of claim 1, wherein The coating process is performed on a top surface of the cell, and The scribing process is performed on a bottom surface of the cell.

4. The method of claim 1, wherein the coating process and the scribing process are performed at different locations in the battery.

5. The method of claim 1, wherein The coating process includes a process of coating a plurality of conductive materials onto the battery by using a plurality of conductive material coaters, and The scribing process includes a process of forming a plurality of battery dividing portions on the battery by using a plurality of scribing equipment.

6. The method of claim 1, further comprising: A cutting process to separate the battery into a plurality of unit batteries; a bonding process to bond the separated unit cells; and A curing process is used to cure the combined unit cells. 7 . The method of claim 1 , wherein the coating process and the scribing process are performed at positions separated from each other with respect to a first axial direction, and the first axial direction is perpendicular to an emitting direction of the laser. The method of claim 1 , wherein the scribing process is performed on the entire surface of the battery. 9 . The method of claim 1 , wherein the scribing process and the coating process are performed in the same space.

10. The method of claim 6, wherein the cutting process and the bonding process are repeatedly performed. 11 . The method of claim 10 , wherein the combining process includes a process of moving only one of the two separated unit cells. 12 . The method of claim 10 , wherein the combining process comprises a moving process of moving a movable cell of the two divided unit cells to a fixed cell of the two divided unit cells.

13. The method of claim 12, wherein the moving process comprises: a first moving process, moving the movable battery along a first axial direction, wherein the first axial direction is parallel to the emitting direction of the laser; and A second moving process is used to move the mobile battery along a second axial direction, and the second axial direction is perpendicular to the first axial direction.

14. The method of claim 13, wherein the second moving process moves the movable battery by a distance obtained by adding a cutting distance and a coating distance, wherein the fixed battery and the movable battery are separated from each other by the cutting distance, and the conductive material is coated by the coating distance. The method of claim 13 , wherein the first shift process and the second shift process are performed simultaneously. 16 . The method of claim 10 , wherein a cutting distance is formed between two separated unit cells when performing the cutting process. 17 . The method of claim 16 , wherein a plurality of cutting distances formed when the cutting process is repeatedly performed have a gradually decreasing trend.

18. The method of claim 16, wherein a plurality of cutting distances formed when the cutting process is repeatedly performed are the same.

19. The method of claim 10, further comprising: A modularization process, coupling a connection module to the battery that has undergone the mounting process, the scribing process, the coating process, an "N-1" cutting process, and an "N-1" bonding process, and the connection module is configured with M unit module batteries, wherein M is an integer greater than or equal to 2; and A curing process is used to cure the battery and the connection module.

20. The method of claim 6, wherein each of the cutting process and the bonding process is repeatedly performed "N-1" times. 21 . The method of claim 20 , wherein the combining process comprises a process of moving one of the two separated blocks to overlap a portion of the other block.

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