Deposition equipment and deposition method using the same

Abstract

The present invention discloses a deposition apparatus and a deposition method using the deposition apparatus. The deposition apparatus includes: a protective member having a grid shape in a plan view and including short side edges extending in a first direction and long side edges extending in a second direction, the short side edges including a first short side edge and a second short side edge; a support member including a first support member coupled to the first short side edge and a second support member coupled to the second short side edge; a plurality of anode bars extending in the second direction and stably disposed on each of the first support member and the second support member; and a target member covering the plurality of anode bars. The anode bars among the plurality of anode bars protrude outwardly beyond at least one of the first support member and the second support member, and the anode bars are physically separated from the protective member by the support member.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority to and all benefits of Korean Patent Application No. 10 - 2020 - 0064080, filed on May 28, 2020, the content of which is incorporated herein by reference in its entirety. Technical Field

[0003] Embodiments of the present invention relate to a deposition apparatus and a deposition method using the deposition apparatus. Background Art

[0004] An electronic device that provides an image to a user, such as a smart phone, a tablet personal computer (“PC”), a digital camera, a laptop computer, a navigation device, and a smart TV, includes a display device for displaying an image. The display device may include a display panel for generating and displaying an image, and may further include various input devices.

[0005] The display device may include a plurality of conductive films and an insulating film disposed between the plurality of conductive films, and the plurality of conductive films may be formed or deposited by a deposition apparatus.

[0006] The deposition apparatus may sputter a target member to deposit a film - forming material of the target member on a substrate facing the target member.

[0007] Sputtering the target member is performed using plasma, and insufficient uniformity of the plasma is likely to reduce the uniformity of the deposited film. Summary of the Invention

[0008] A feature of the present invention provides a deposition apparatus capable of improving the uniformity of a deposited film.

[0009] A feature of the present invention also provides a deposition method capable of improving the uniformity of a deposited film.

[0010] In an embodiment, the deposition apparatus includes: a shielding member having a grid shape in a plan view, and including short side edges extending in a first direction and long side edges extending in a second direction intersecting the first direction, the short side edges including a first short side edge and a second short side edge; a support member including a first support member disposed on the first short side edge and connected to the first short side edge in parallel and a second support member disposed on the second short side edge and connected to the second short side edge in parallel; a plurality of anode bars extending in the second direction and stably disposed on each of the first support member and the second support member; and a target member covering the plurality of anode bars, wherein an anode bar among the plurality of anode bars protrudes outward beyond at least one of the first support member and the second support member, and the anode bar is physically separated from the shielding member by the support member.

[0011] In an embodiment, each of the first support member and the second support member may include a fixing member, a hole may be defined in the fixing member of the first support member, a groove may be defined in the fixing member of the second support member, and the anode bar projects outward through the hole of the first support member and is stably seated in the groove of the second support member.

[0012] In an embodiment, a plurality of anode bars may be spaced apart in a first direction and electrically grounded.

[0013] In an embodiment, the anode bar has a first width, adjacent anode bars among the plurality of anode bars may be spaced apart by a first pitch, and the first pitch may be equal to or greater than twice the first width.

[0014] In an embodiment, the long side of the long sides of the protective member has a first length, and the anode bar has a second length shorter than the first length.

[0015] In an embodiment, the protective member includes an upper protective member coupled to the support member, and the upper protective member includes a first extension portion coupled to the support member and a second extension portion connected to the first extension portion, disposed outside the anode bar, and extending in a third direction perpendicular to the first direction and the second direction.

[0016] In an embodiment, the protective member further includes a lower protective member spaced apart from the support member, and the lower protective member includes a third extension portion disposed outside the target member and a fourth extension portion connected to the third extension portion, extending in the third direction, and disposed outside the anode bar.

[0017] In an embodiment, the deposition apparatus may further include a back plate for supporting the lower protective member and the target member.

[0018] In an embodiment, the deposition apparatus may further include an insulating member disposed below the back plate.

[0019] In an embodiment, the deposition apparatus may further include a magnetic member disposed below the target member.

[0020] In an embodiment, the deposition apparatus may further include a mask member disposed inside the upper protective member, wherein the mask member may be electrically floating and may have a grid shape surrounding a first opening in a plan view.

[0021] In an embodiment, the film-forming material of the target member may be deposited on a substrate facing the target member.

[0022] In an embodiment, the target member includes a film-forming material, and the film-forming material includes a metal or a metal oxide.

[0023] In an embodiment, an anode bar is configured to deposit a film-forming material uniformly on a substrate.

[0024] In an embodiment, each of the anode bar and the support member includes a convex pattern on its surface.

[0025] In an embodiment, the anode bar has a first width, adjacent anode bars among a plurality of anode bars are spaced apart by a predetermined pitch, the predetermined pitch between adjacent anode bars is equal to or greater than twice the first width, the predetermined pitch has a first pitch in an outer region of the deposition apparatus and a second pitch in a central region of the deposition apparatus, and the first pitch is less than the second pitch.

[0026] In another embodiment, a deposition method includes: preparing a deposition apparatus including: a protective member having a grid shape in a plan view and including short side edges extending in a first direction and long side edges extending in a second direction intersecting the first direction, the short side edges including a first short side edge and a second short side edge; a support member including a first support member disposed on the first short side edge and connected to the first short side edge in parallel and a second support member disposed on the second short side edge and connected to the second short side edge in parallel; a plurality of anode bars extending in the second direction and stably disposed on each of the first support member and the second support member; and a target member covering the plurality of anode bars; and disposing a substrate to face the target member in a state separated from the target member across the plurality of anode bars between the substrate and the target member, wherein the anode bars among the plurality of anode bars protrude outward beyond at least one of the first support member and the second support member, and the anode bars are physically separated from the protective member by the support member.

[0027] In an embodiment, when preparing the deposition apparatus, each of the first support member and the second support member may include a fixing member, a hole may be defined in the fixing member of the first support member, a groove may be defined in the fixing member of the second support member, and the anode bar protrudes outward through the hole of the first support member and is stably disposed in the groove of the second support member.

[0028] In an embodiment, when preparing the deposition apparatus, the plurality of anode bars may be spaced apart in the first direction and electrically grounded.

[0029] In an embodiment, the deposition method further includes forming a cathode on the target member to form a plasma between the plurality of anode bars and the target member.

[0030] In an embodiment, the deposition method further includes using plasma to sputter the target member to deposit a film-forming material of the target member on the substrate.

[0031] However, the features of the present invention are not limited to those described herein. The above and other features of the present invention will become more apparent to those of ordinary skill in the art to which the present invention pertains by referring to the detailed description of the present invention given below.

[0032] The deposition apparatus and method in the embodiments may be capable of improving the uniformity of the deposited film.

[0033] The effects of the present invention are not limited to the above effects, and various other effects are included in the specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The above and other embodiments, features, and advantages of the present invention will become more apparent by referring to the detailed description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0035] Figure 1 is a plan view of an embodiment of a deposition apparatus;

[0036] Figure 2 is a sectional view taken along line I-I' of Figure 1 ;

[0037] Figure 3 is Figure 1 an enlarged view of region A of

[0038] Figure 4 is a perspective view of an embodiment showing the connection relationship between the anode bar and the support member;

[0039] Figure 5 is a schematic diagram of an embodiment of a deposition apparatus for generating plasma for sputtering;

[0040] Figure 6 is a schematic diagram showing the spacing between the substrate and the anode bar before the anode bar is deflected;

[0041] Figure 7 is a schematic diagram showing the spacing between the substrate and the anode bar after the anode bar is deflected;

[0042] Figure 8 is a graph showing the degree of deflection according to the length of the anode bar;

[0043] Figure 9 is a table showing the spacing between the substrate and the anode bar in the improved product;

[0044] Figure 10 is a table showing the spacing between the substrate and the anode bar in the conventional product;

[0045] Figure 11 is a sectional view of another embodiment of the deposition apparatus;

[0046] Figure 12is an enlarged perspective view of another embodiment of the first support member;

[0047] Figure 13 is a table showing the particle reduction effect in a conventional product, a sample prepared by applying a convex pattern to the conventional product, and Figure 11 a sample of the deposition apparatus;

[0048] Figure 14 is a flowchart illustrating an embodiment of a deposition method using the deposition apparatus;

[0049] Figure 15 is a cross-sectional view illustrating an embodiment of a processing operation of the deposition method;

[0050] Figure 16 is a plan view of another embodiment of the deposition apparatus; and

[0051] Figure 17 is a perspective view illustrating another embodiment of the connection relationship between the anode bar and the support member. DETAILED DESCRIPTION

[0052] The specific structures and functional descriptions of the embodiments of the present invention disclosed herein are for illustrative purposes only of the embodiments of the present invention. Without departing from the spirit and important features of the present invention, the present invention can be embodied in many different forms. Therefore, the embodiments of the present invention are disclosed for illustrative purposes only and should not be construed as limiting the present invention. That is, the present invention is limited only by the scope of the claims.

[0053] It should be understood that when an element is referred to as being related to another element such as "coupled" or "connected" to another element, it can be directly coupled or connected to the other element, or there can be an intermediate element between it and the other element. In contrast, it should be understood that when an element is referred to as being related to another element such as "directly coupled" or "directly connected" to another element, there is no intermediate element. Other expressions for explaining the relationship between elements, such as "between", "directly between", "adjacent to" or "directly adjacent to" should be interpreted in the same way.

[0054] Throughout the specification, the same reference numerals will refer to the same or similar parts.

[0055] It should be understood that although terms such as "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Thus, the first element, component, region, layer, or part discussed below may be named the second element, component, region, layer, or part without departing from the teachings herein.

[0056] The purpose of the terms used herein is to describe only specific embodiments and is not intended to be limiting. As used herein, "a", "the", and "at least one" do not denote a quantity limitation and are intended to include both the singular and the plural, unless the context clearly indicates otherwise. For example, unless the context clearly indicates otherwise, "an element" has the same meaning as "at least one element". "At least one" should not be construed as limited to "one". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the listed associated items. It should be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of the stated features, regions, wholes, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, components, and / or groups thereof.

[0057] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another as shown in the figures. It should be understood that relative terms are intended to cover different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is flipped, an element described as on the "lower" side of other elements will then be oriented on the "upper" side of the other elements. Thus, depending on the specific orientation of the figures, the exemplary term "lower" can cover both the "lower" and "upper" orientations. Similarly, if the device in one of the figures is flipped, an element described as "below" or "beneath" other elements will then be oriented "above" the other elements. Thus, the exemplary terms "below" or "beneath" can cover both the upper and lower orientations.

[0058] When considering the measurements under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), "about" or "approximately" as used herein includes the stated value and the mean within an acceptable deviation range of the specific value determined by a person of ordinary skill in the art. For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0059] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Further, it should be understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and this disclosure, and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0060] Embodiments are described herein with reference to cross-sectional views that are schematic illustrations of ideal embodiments. As such, variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Accordingly, the embodiments described herein should not be construed as limited to the particular shapes of regions illustrated herein but include deviations in shapes due to, for example, manufacturing. For example, regions illustrated or described as flat will generally have rough and / or non-linear features. Additionally, sharp corners shown may be rounded. Thus, the regions shown in the figures are schematic in nature and their shapes are not intended to illustrate the exact shape of a region nor are they intended to limit the scope of the claims.

[0061] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0062] Figure 1 is a plan view of an embodiment of a deposition apparatus.

[0063] Referring to Figure 1 , the display device may include a plurality of conductive films and insulating films disposed between the plurality of conductive films, and the conductive films are provided or deposited by the deposition apparatus 1 to be described later.

[0064] In an embodiment, the deposition apparatus 1 may be a deposition apparatus for forming a plurality of conductive films of a display device.

[0065] In an embodiment, the deposition apparatus 1 may perform a sputtering target member to deposit a film-forming material of the target member on a substrate facing the target member. Hereinafter, the components of the deposition apparatus 1 and their connection relationships will be described in detail.

[0066] In an embodiment, the deposition apparatus 1 may include a shielding member S, a bracket member BR, a mask member M, and an anode bar AB.

[0067] More specifically, in a plan view, the shielding member S may have a grid shape.

[0068] In an embodiment, a first direction DR1 and a second direction DR2 cross each other in different directions. In Figure 1In the plan view, for the sake of explanation, the horizontal direction is defined as the first direction DR1, and the vertical direction is defined as the second direction DR2. In the following embodiments, one side in the first direction DR1 represents the direction towards the right in the plan view, and the other side in the first direction DR1 represents the direction towards the left in the plan view. One side in the second direction DR2 represents the upward direction in the plan view, and the other side in the second direction DR2 represents the downward direction in the plan view. However, it should be understood that the directions mentioned in the embodiments refer to relative directions, and the embodiments are not limited to the directions mentioned.

[0069] The grid-shaped protective member S may include a short side edge extending along the first direction DR1 and a long side edge extending along the second direction DR2. The grid-shaped protective member S may define an opening surrounded by it. That is, in the plan view, the opening of the protective member S may be completely surrounded by the grid-shaped protective member S. In the plan view, the opening of the protective member S may have a quadrilateral (e.g., rectangular) shape. However, the present invention is not limited thereto, and in the plan view, the opening of the protective member S may have a square, circular, elliptical or polygonal shape.

[0070] The short side edge of the grid-shaped protective member S may include an upper short side edge SG1 provided on one side in the second direction DR2 and a lower short side edge SG2 provided on the other side in the second direction DR2 to face the upper short side edge SG1.

[0071] The long side edge of the grid-shaped protective member S may include a right long side edge LG2 provided on one side in the first direction DR1 and a left long side edge LG1 provided on the other side in the first direction DR1 to face the right long side edge LG2.

[0072] The length L1 of the long side edge of the grid-shaped protective member S may be greater than the length L2 of the anode bar AB which will be described later.

[0073] The protective member S may include a conductive material. A ground voltage may be applied to the protective member S. The protective member S may act as an anode for generating plasma.

[0074] In addition, the protective member S can prevent the film-forming material of the target member TG (see Figure 2 ) sputtered by the plasma from diffusing outwards to prevent the contamination of the chamber.

[0075] The mask member M may be arranged on the inner surface of the protective member S. The mask member M may be arranged along the long side edge and the short side edge of the protective member S. In the plan view, the mask member M may have a grid shape. The mask member M may include a long side edge adjacent to the long side edge of the protective member S and a short side edge adjacent to the short side edge of the protective member S. The opening (refer to Figure 2The OP) in can be defined within and surrounded by a mask member M in a grid shape. That is, the opening of the mask member M can be completely surrounded by the mask member M in a grid shape. The opening of the mask member M can be smaller in size than the opening of the above-mentioned protective member S. In a plan view, the opening of the mask member M can have a quadrilateral (e.g., rectangular) shape. However, the present invention is not limited thereto, and in a plan view, the opening of the mask member M can have a square, circular, elliptical, or polygonal shape.

[0076] The mask member M can be floating. This can prevent the film-forming material from being further deposited on both sides of the substrate G during the deposition of the film-forming material, thereby preventing uneven film formation.

[0077] The substrate G can be arranged on the deposition device 1. The substrate G can be understood as a component separated from the deposition device 1. However, the substrate G can also be understood as a component of the deposition device 1.

[0078] The substrate G can overlap with the opening of the above-mentioned protective member S in the third direction DR3 (hereinafter also referred to as the thickness direction). The substrate G can be arranged in the opening of the above-mentioned protective member S. That is, the substrate G can be smaller in planar size than the opening of the protective member S.

[0079] The substrate G can include a rigid material such as glass or quartz. However, the present invention is not limited thereto, and the substrate G can include a flexible material such as polyimide.

[0080] The substrate G can also overlap with the opening of the mask member M in the thickness direction. The substrate G can be larger in planar size than the opening of the above-mentioned mask member M. That is, the substrate G can overlap with the long side and the short side of the mask member M in the thickness direction.

[0081] The support member BR can be arranged on the short side of the protective member S. The support member BR can include a first support member BR1 arranged on the upper short side SG1 and a second support member BR2 arranged on the lower short side SG2. The support member BR can extend along the first direction DR1. The support member BR can be arranged inside the protective member S.

[0082] The support member BR can fix the anode bar AB to be described later. The support member BR can be electrically connected to the protective member S. The ground voltage applied to the protective member S can be applied to the anode bar AB connected to the support member BR.

[0083] In addition, the support member BR can physically separate the anode bar AB from the protective member S.

[0084] The anode strip AB can extend along the second direction DR2. In an embodiment, a plurality of anode strips AB can be provided. The plurality of anode strips AB can be arranged along the first direction DR1. The anode strip AB can be coupled to the support member BR. The anode strip AB can be coupled to each of the first support member BR1 and the second support member BR2. In a plan view, the anode strip AB can protrude outward (in the second direction DR2) beyond at least one of the first support member BR1 and the second support member BR2. In an embodiment, for example, the anode strip AB can protrude outward (or extend) (on one side in the second direction DR2) beyond the first support member BR1 and terminate inside the second support member BR2.

[0085] In some embodiments, the anode strip AB can also extend along the first direction DR1. In an embodiment, a plurality of anode strips AB can be provided. The plurality of anode strips AB can be arranged along the second direction DR2. In an embodiment where the anode strip AB extends along the first direction DR1, the length L2 of the anode strip AB, which is already shorter than the length L1 of the protection member S, can be further shortened to minimize Figure 2 the deflection of the anode strip AB shown in the figure towards the target member TG, which will be described later.

[0086] Figure 2 is a cross-sectional view taken along the line I-I’ Figure 1 as shown.

[0087] Referring to Figure 1 and Figure 2 , the protection member S can include an upper protection member S1 and a lower protection member S2. The lower protection member S2 can be disposed below the upper protection member S1. More specifically, the upper protection member S1 can be connected to the support member BR. The upper protection member S1 can include a first extension portion EP1 that extends along the second direction DR2 and is coupled to the support member BR, and a second extension portion EP2 that is connected to the first extension portion EP1, is disposed outside the anode strip AB, and extends in the thickness direction.

[0088] The lower protection member S2 can be physically separated from the support member BR. The lower protection member S2 can include a third extension portion EP3 disposed outside the target member TG and a fourth extension portion EP4 that is connected to the third extension portion EP3, extends in the thickness direction, and is disposed outside the anode strip AB.

[0089] The upper protection member S1 can have, for example, a shape that is laterally symmetric, and the lower protection member S2 can have, for example, a shape that is laterally symmetric, but is not limited thereto.

[0090] The mask member M can abut against the short side and the long side of the upper protection member S1. Although in Figure 1 andFigure 2 The mask member M is depicted as being adjacent to the short and long sides of the upper protective member S1, but the mask member M can actually be separated from the short and long sides of the upper protective member S1 by an insulating member interposed between the mask member M and the upper protective member S1. This can enable the mask member M to remain in a floating state even when a ground voltage is applied to the protective member S.

[0091] As described above, the substrate G can be disposed on the mask member M to cover the opening of the mask member M.

[0092] The first support member BR1 and the second support member BR2 can be connected to the bottom surfaces of the corresponding short sides SG1 and SG2. The first support member BR1 can be connected to the upper short side SG1, and the second support member BR2 can be connected to the lower short side SG2. The support members BR1 and BR2 can include a horizontal portion connected to the short sides SG1 and SG2 and extending in the second direction DR2, and a vertical portion bent from the horizontal portion to extend in the thickness direction. Although the first support member BR1 and the second support member BR2 can have, for example a shape that is laterally symmetric, the present invention is not limited thereto.

[0093] In an embodiment, the anode bar AB can be separated from the upper protective member S1 by the support member BR. This can avoid the anode bar AB being close to or in contact with the upper protective member S1, which can prevent or minimize the warping phenomenon caused by thermal expansion due to the temperature of the anode bar AB increasing together with the upper protective member S1 when plasma is generated.

[0094] Figure 4 is a perspective view of an embodiment showing the connection relationship between the anode bar and the support member.

[0095] Referring to Figure 4 , the first support member BR1 and the second support member BR2 can each include a fixing member FP1 and FP2. A hole or a groove can be defined in each of the fixing members FP1 and FP2. In an embodiment, for example, a hole HO can be defined in the fixing member FP1 of the first support member BR1, and a groove GR can be defined in the fixing member FP2 of the second support member BR2. Here, a hole can mean a space passing through the fixing member, and a groove can mean a space that only enters a part of the fixing member.

[0096] In this case, the anode bar AB can be stably placed by the first support member BR1 so as to protrude (or extend) outward (in the second direction DR2) beyond the fixing member FP1 of the first support member BR1, and at the same time can be stably placed or fixed by the fixing member FP2 of the second support member BR2 so as to terminate inside the fixing member FP2.

[0097] The anode bar AB can be stably positioned by the first support member BR1 so as to protrude (or extend) outwardly (in the second direction DR2) beyond the fixing member FP1 of the first support member BR1, and at the same time can be stably positioned or fixed by the fixing member FP2 of the second support member BR2 so as to terminate inside the fixing member FP2, thereby allowing the anode bar AB that is not fully fixed to the first support member BR1 to fully accommodate the thermal expansion caused by the heat generated by the plasma. This can avoid any flexure of the anode bar AB due to thermal expansion caused by fixing the anode bar AB at both ends.

[0098] The target member TG and the substrate G can cover a plurality of anode bars AB.

[0099] The target member TG can face the substrate G across a plurality of anode bars AB between the target member TG and the substrate G. The target member TG can be larger in size than the substrate G, but is not limited thereto, and can be substantially equal in size to the substrate G.

[0100] The target member TG can include a film-forming material. The film-forming material can include a metal or a metal oxide. In an embodiment, the film-forming material can include, for example, aluminum (Al), molybdenum (Mo), titanium (Ti), silver (Ag), or indium tin oxide (ITO), but is not limited thereto.

[0101] A cathode is applied to the target member TG such that plasma can be generated between the cathode of the target member TG and the anodes of the anode bars AB and the protective member S.

[0102] The deposition apparatus 1 can further include a back plate BP for supporting the target member TG and the lower protective member S2. The back plate BP can support the above-mentioned target member TG and the lower protective member S2.

[0103] The deposition apparatus 1 can further include a protective layer SH disposed on the bottom surface of the back plate BP. The protective layer SH can include an insulating material. Although not shown in Figure 2 , a common plate can be disposed on the bottom surface of the protective layer SH and on the side surfaces of the protective layer SH, the back plate BP, and the target member TG. The common plate can include the same conductive material as the conductive material of the above-mentioned protective member S. The protective layer SH can electrically isolate the back plate BP and the target member TG from the common plate including the conductive material.

[0104] A magnetic member MG can be further disposed below the protective layer SH.

[0105] The magnetic member MG can include a ferromagnetic material. The magnetic member MG can guide the plasma to the surface of the target member TG. As a result, the plasma can effectively bombard the target member TG to promote the sputtering process.

[0106] As described above, a ground voltage can be applied to a plurality of anode bars AB that can overlap the openings of the target member TG and the protection member S in the thickness direction. As a result, anodes exist even in the openings of the protection member S, enabling the induction of plasma with substantially uniform intensity in the central and edge portions of the surface of the target member TG. When plasma with substantially uniform intensity is induced in the central and edge portions of the surface of the target member TG, a film with a uniform thickness can be deposited on the substrate G.

[0107] Figure 3 Yes Figure 1 is an enlarged view of region A.

[0108] Reference Figure 3 , the anode bar AB can have a first width d1, and adjacent anode bars AB can be spaced apart from each other by a first pitch d2.

[0109] The first width d1 can be equal to or less than 50% of the first pitch d2. That is, the first pitch d2 can be equal to or greater than twice the first width d1. This can significantly reduce the amount of sputtered film-forming material deposited on the anode bar AB rather than on the substrate G.

[0110] Figure 5 is a schematic diagram showing an embodiment of a deposition apparatus for generating plasma for sputtering.

[0111] Reference Figure 5 , as described above, a cathode is applied to the target member TG, and anodes are applied to the protection member S and the anode bar AB, such that plasma is generated between the target member TG and the protection member S and the anode bar AB.

[0112] In the embodiment, anodes exist even in the openings of the protection member S, enabling the induction of plasma with substantially uniform intensity in the central and edge portions of the surface of the target member TG.

[0113] When the intensity of the plasma is stronger than the binding force of the atoms in the target member TG, the film-forming material can be sputtered from the surface of the target member TG by the plasma. The film-forming material sputtered from the target member TG can be deposited on the substrate G in the order shown in the figure.

[0114] In the embodiment, since plasma with substantially uniform intensity is induced in the central and edge portions of the surface of the target member TG, a film with a uniform thickness can be deposited on the substrate G.

[0115] Although the anode bar AB is separated from the upper protection member S1 by the support member BR and stably placed by the first support member BR1 to protrude (or extend) outward (in the second direction DR2) beyond the fixing member FP1 of the first support member BR1 as described above, the anode bar AB itself may be deflected by the plasma. This will be described below.

[0116] Figure 6 is a schematic diagram showing the spacing between the substrate and the anode bar before the anode bar is deflected. Figure 7 is a schematic diagram showing the spacing between the substrate and the anode bar after the anode bar is deflected. Figure 8 is a graph showing the degree of deflection according to the length of the anode bar. Figure 9 is a table showing the spacing between the substrate and the anode bar in the improved product. Figure 10 is a table showing the spacing between the substrate and the anode bar in the conventional product.

[0117] First, referring to Figure 6 and Figure 7 , after a predetermined period of time has elapsed after the plasma is generated or when the intensity of the plasma is greater than a predetermined level, the initial spacing d3 between the anode bar AB and the substrate G can increase to Figure 7 another spacing d3' shown in. Here, each of the spacings d3 and d3' represents the distance from the center of the anode bar AB to the substrate G (or the maximum spacing between the anode bar AB and the substrate G).

[0118] When the initial spacing d3 between the anode bar AB and the substrate G increases to the spacing d3', this means that the anode bar AB is deflected by the plasma generated between the target member TG and the substrate G to bulge toward the target member TG.

[0119] As Figure 8 shown, the degree of deflection of the anode bar AB toward the target member TG is related to the length of the anode bar AB. As Figure 8 shown, the anode bar AB has a rectangular parallelepiped shape. "σ" refers to the stress applied to the rectangular parallelepiped, "b" refers to the length of the short side of the rectangular parallelepiped, "d" refers to the height of the rectangular parallelepiped, and "L" refers to the length of the long side of the rectangular parallelepiped.

[0120] Further referring to Figure 1 , the length L2 of the anode bar AB can be determined to be shorter than the length L1 of the protection member S to minimize the deflection of the anode bar AB toward the target member TG.

[0121] Referring to Figure 9 and Figure 10, in the embodiment, it is confirmed that the amount of change in the spacing (d3’ - d3) before and after plasma generation is about 4 to 7 in a sample (or improved product) of the anode bar AB where the length L2 is less than the length L1 of the protective member S to minimize the deflection of the anode bar AB toward the target member TG, and is about 8 to 12 in a sample (or conventional product) of the anode bar AB where the length L2 is greater than the length L1 of the protective member S.

[0122] The deposition apparatus 1 in the embodiment can prevent non-uniformity of film formation caused by more film formation material being deposited on both sides of the substrate G during deposition of the film formation material on the substrate G, in such a way that the floating mask member M is arranged on the inner surface of the protective member S.

[0123] The anode bar AB can also be separated from the upper protective member S1 by the support member BR. This can avoid the anode bar AB approaching or contacting the upper protective member S1, which can prevent or minimize the warping phenomenon caused by thermal expansion due to the temperature of the anode bar AB rising together with the upper protective member S1 when plasma is generated.

[0124] In addition, the anode bar AB can be stably placed by the first support member BR1 so as to protrude (or extend) outward (in the second direction DR2) beyond the fixing member FP1 of the first support member BR1, and at the same time can be stably placed or fixed by the fixing member FP2 of the second support member BR2 so as to terminate inside the fixing member FP2, thereby allowing the anode bar AB not fully fixed to the first support member BR1 to fully accommodate the thermal expansion caused by the heat generated by the plasma. This can avoid any deflection of the anode bar AB caused by thermal expansion due to fixing the anode bar AB at both ends.

[0125] In addition, the length L2 of the anode bar AB can be determined to be shorter than the length L1 of the protective member S to minimize the deflection of the anode bar AB toward the target member TG.

[0126] Hereinafter, a deposition apparatus according to another embodiment will be described. In the following embodiment, components identical to those in the above embodiment are denoted by the same reference numerals, and their descriptions will be omitted or simplified.

[0127] Figure 11 is a cross-sectional view of another embodiment of the deposition apparatus. Figure 12 is an enlarged perspective view of another embodiment of the first support member.

[0128] Refer to Figure 11 and Figure 12 , the deposition apparatus 2 according to the present embodiment is different from the deposition apparatus 1 according to the above embodiment in that it includes an anode bar AB_1 and support members BR1_1 and BR2_1.

[0129] More specifically, the deposition apparatus 2 according to the present embodiment may include an anode bar AB_1 and support members BR1_1 and BR2_1. Further reference is made to Figures 1 to 10 describe this embodiment.

[0130] According to the present embodiment, the anode bar AB_1 and the support members BR1_1 and BR2_1 may each include a convex (or concave) pattern on one of their surfaces.

[0131] In an embodiment, the convex pattern of the anode bar AB_1 may include the same material as the material of the anode bar AB_1 and may be a single body with the anode bar AB_1. In an embodiment, the convex patterns of the support members BR1_1 and BR2_1 may include the same material as the materials of the support members BR1_1 and BR2_1 and may be a single body with the support members BR1_1 and BR2_1.

[0132] In a plan view, each element of the convex pattern on the surfaces of the anode bar AB_1 and the support members BR1_1 and BR2_1 may have a square shape. The length of one side of the planar shape of the convex pattern on the surfaces of the anode bar AB_1 and the support members BR1_1 and BR2_1 may be about 2 mm, but is not limited thereto. The convex patterns of the anode bar AB_1 and the support members BR1_1 and BR2_1 may be different from each other in element size.

[0133] The convex patterns of the anode bar AB_1 and the support members BR1_1 and BR2_1 may minimize or prevent the sputtered film-forming material from generating particles on the surfaces of the anode bar AB_1 and the support members BR1_1 and BR2_1.

[0134] More specifically, the convex patterns of the anode bar AB_1 and the support members BR1_1 and BR2_1 may increase the surface areas of the anode bar AB_1 and the support members BR1_1 and BR2_1, which may minimize the damage caused by the collision of the sputtered film-forming material, thereby reducing the generation of particles.

[0135] Other configurations are the same as those described above with reference to Figures 1 to 10 those described, and thus the repeated description will be omitted.

[0136] The deposition apparatus 2 according to the present embodiment may also be configured to prevent non-uniform film formation caused by more film-forming material being deposited on both sides of the substrate G during the deposition of the film-forming material on the substrate G by arranging a floating mask member M on the inner surface of the protection member S.

[0137] The anode strip AB_1 can also be separated from the upper protective member S1 through the support members BR1_1 and BR2_1. This can avoid the anode strip AB_1 approaching or contacting the upper protective member S1, which can prevent or minimize the warping phenomenon caused by thermal expansion due to the temperature of the anode strip AB_1 rising together with the upper protective member S1 when generating plasma.

[0138] In addition, the anode strip AB_1 can be stably placed by the first support member BR1_1 so as to protrude (or extend) outward (in the second direction DR2) beyond the fixing member FP1 of the first support member BR1_1, and at the same time can be stably placed or fixed by the fixing member FP2 of the second support member BR2_1 so as to terminate inside the fixing member FP2, thereby allowing the anode strip AB_1 that is not fully fixed to the first support member BR1_1 to fully accommodate the thermal expansion caused by the heat generated by the plasma. This can avoid any flexure of the anode strip AB_1 caused by thermal expansion by fixing the anode strip AB_1 at both ends of the anode strip AB_1.

[0139] In addition, the length L2 of the anode strip AB_1 can be determined to be shorter than the length L1 of the protective member S to minimize the flexure of the anode strip AB_1 toward the target member TG.

[0140] Other configurations are the same as those described above with reference to Figures 1 to 10 and thus the repeated description is omitted.

[0141] Figure 13 shows a traditional product, a sample prepared by applying a convex pattern to the traditional product, and Figure 11 a table of the particle reduction effect in a sample of the deposition equipment.

[0142] Reference Figures 1 to 13 , shows a traditional product (neither applying a convex pattern nor a structure in which the length L2 of the anode strip AB is less than the length L1 of the protective member S), a sample prepared by applying only a convex pattern to the traditional product, and a sample prepared by applying Figure 11 the deposition equipment 2.

[0143] As Figure 13 confirmed, about 1408 particles were found in the traditional product (neither applying a convex pattern nor a structure in which the length L2 of the anode strip AB is less than the length L1 of the protective member S), about 270 particles were found in the sample prepared by applying a convex structure to the traditional product, and about 177 particles were found in the sample prepared by applying Figure 11 the deposition equipment 2.

[0144] As described above, the convex patterns of the anode bar AB_1 and the support members BR1_1 and BR2_1 can increase the surface areas of the anode bar AB_1 and the support members BR1_1 and BR2_1, which can minimize the damage caused by the collision of the sputtered film-forming material, thereby reducing the generation of particles.

[0145] Hereinafter, embodiments of a deposition method including using a deposition apparatus are described. In the following embodiments, components identical to those in the above embodiments are denoted by the same reference numerals, and their descriptions will be omitted or simplified.

[0146] Figure 14 is a flowchart illustrating an embodiment of a deposition method using a deposition apparatus. Figure 15 is a cross-sectional view illustrating an embodiment of a processing operation of the deposition method.

[0147] Reference Figure 1 、 Figure 2 、 Figure 4 and Figure 14 , at operation S10, a reference Figure 1 and Figure 2 described deposition apparatus 1 is prepared. As described above, the deposition apparatus 1 in the embodiments may include a shielding member S, a support member BR, a substrate G, a mask member M, and an anode bar AB.

[0148] More specifically, in a plan view, the shielding member S may have a grid shape.

[0149] The grid-shaped shielding member S may include short side edges extending in a first direction DR1 and long side edges extending in a second direction DR2. The grid-shaped shielding member S may define and enclose an opening. That is, in a plan view, the opening of the shielding member S may be completely surrounded by the grid-shaped shielding member S.

[0150] The short side edges of the grid-shaped shielding member S may include an upper short side edge SG1 provided on one side in the second direction DR2 and a lower short side edge SG2 provided on the other side in the second direction DR2 to face the upper short side edge SG1.

[0151] The long side edges of the grid-shaped shielding member S may include a right long side edge LG2 provided on one side in the first direction DR1 and a left long side edge LG1 provided on the other side in the first direction DR1 to face the right long side edge LG2.

[0152] The length L1 of the long side edges of the grid-shaped shielding member S may be greater than the length L2 of the anode bar AB to be described later.

[0153] The shielding member S may include a conductive material.

[0154] The mask member M can be arranged on the inner surface of the protection member S. The mask member M can be arranged along the long side and the short side of the protection member S. In a plan view, the mask member M can have a grid shape. The mask member M can include a long side adjacent to the long side of the protection member S and a short side adjacent to the short side of the protection member S. An opening (refer to OP in Figure 2 ) can be defined in and surrounded by the grid-shaped mask member M. That is, the opening of the mask member M can be completely surrounded by the grid-shaped mask member M.

[0155] The mask member M can be floating.

[0156] The substrate G can overlap with the opening of the above-mentioned protection member S in the thickness direction. The substrate G can be arranged in the opening of the above-mentioned protection member S. That is, the substrate G can be smaller than the opening of the protection member S in terms of planar dimensions.

[0157] The substrate G can overlap with the opening of the mask member M in the thickness direction. The substrate G can be larger than the opening of the above-mentioned mask member M in terms of planar dimensions. That is, the substrate G can overlap with the long side and the short side portions of the mask member M in the thickness direction.

[0158] The support member BR can be arranged on the short side of the protection member S. The support member BR can include a first support member BR1 arranged on the upper short side SG1 and a second support member BR2 arranged on the lower short side SG2. The support member BR can extend along the first direction DR1. The support member BR can be arranged inside the protection member S.

[0159] The ground voltage applied to the protection member S can be applied to the anode bar AB connected to the support member BR. In addition, the support member BR can physically separate the anode bar AB and the protection member S from each other.

[0160] The anode bar AB can extend along the second direction DR2. In an embodiment, a plurality of anode bars AB can be provided. The plurality of anode bars AB can be arranged along the first direction DR1. The anode bar AB can be coupled to the support member BR. The anode bar AB can be coupled to each of the first support member BR1 and the second support member BR2. In a plan view, the anode bar AB can protrude outward (in the second direction DR2) beyond at least one of the first support member BR1 and the second support member BR2. In an embodiment, for example, the anode bar AB can protrude (or extend) outward (on one side in the second direction DR2) beyond the first support member BR1 and terminate inside the second support member BR2.

[0161] The protection member S may include an upper protection member S1 and a lower protection member S2. The lower protection member S2 may be disposed below the upper protection member S1. The lower protection member S2 may be physically separated from the support member BR.

[0162] The mask member M may be adjacent to the short side edges and the long side edges of the upper protection member S1. As described above, the substrate G may be disposed on the mask member M to cover the opening of the mask member M.

[0163] The first support member BR1 and the second support member BR2 may be connected to the bottom surfaces of the corresponding short side edges SG1 and SG2.

[0164] The first support member BR1 and the second support member BR2 may each include a fixing member FP1 and FP2. The fixing members FP1 and FP2 may each include a hole or a groove. In an embodiment, for example, a hole HO may be defined in the fixing member FP1 of the first support member BR1, and a groove GR may be defined in the fixing member FP2 of the second support member BR2.

[0165] In this case, the anode bar AB may be stably positioned by the first support member BR1 so as to protrude (or extend) outwardly (in the second direction DR2) beyond the fixing member FP1 of the first support member BR1, and at the same time may be stably positioned or fixed by the fixing member FP2 of the second support member BR2 so as to terminate inside the fixing member FP2.

[0166] The anode bar AB may be stably positioned by the first support member BR1 so as to protrude (or extend) outwardly (in the second direction DR2) beyond the fixing member FP1 of the first support member BR1, and at the same time may be stably positioned or fixed by the fixing member FP2 of the second support member BR2 so as to terminate inside the fixing member FP2, thereby allowing the anode bar AB that is not fully fixed to the first support member BR1 to fully accommodate the thermal expansion caused by the heat generated by the plasma. This may avoid any flexure of the anode bar AB due to thermal expansion caused by fixing the anode bar AB at both ends.

[0167] The target member TG and the substrate G may cover a plurality of anode bars AB.

[0168] The target member TG may face the substrate G across a plurality of anode bars AB interposed between the target member TG and the substrate G. The target member TG may be larger in size than the substrate G, but is not limited thereto, and may be substantially equal in size to the substrate G.

[0169] The target member TG may include a film-forming material. A cathode is applied to the target member TG such that plasma can be generated between the cathode of the target member TG and the anodes of the anode bars AB and the protection member S.

[0170] The deposition apparatus 1 may further include a back plate BP for supporting the target member TG and the lower protection member S2. The back plate BP may support the above-mentioned target member TG and the lower protection member S2.

[0171] The deposition apparatus 1 may further include a protection layer SH disposed on the bottom surface of the back plate BP. The protection layer SH may include an insulating material. Although not shown in Figure 2 , a common plate may be disposed on the bottom surface of the protection layer SH and on the side surfaces of the protection layer SH, the back plate BP, and the target member TG. The common plate may include the same conductive material as that of the above-mentioned protection member S. The protection layer SH may electrically isolate the back plate BP and the target member TG from the common plate including the conductive material.

[0172] A magnetic member MG may be further disposed below the protection layer SH.

[0173] The magnetic member MG may include a ferromagnetic material. The magnetic member MG may guide the plasma to the surface of the target member TG. As a result, the plasma may effectively bombard the target member TG to promote the sputtering process.

[0174] Next, as referred to in Figure 1 and Figure 2 described, a substrate G is disposed at the operation S20 as shown in Figure 14 .

[0175] More specifically, the substrate G may overlap the opening of the above-mentioned protection member S in the thickness direction. The substrate G may be disposed in the opening of the above-mentioned protection member S. That is, the substrate G may be smaller in planar size than the opening of the protection member S. The substrate G may include a rigid material such as glass or quartz. However, the present invention is not limited thereto, and the substrate G may include a flexible material such as polyimide. The substrate G may also overlap the opening of the mask member M in the thickness direction. The substrate G may be larger in planar size than the opening of the above-mentioned mask member M. That is, the substrate G may overlap the long side and short side portions of the mask member M in the thickness direction.

[0176] Next, as referred to in Figure 5 described, plasma is generated at the operation S30 as shown in Figure 14 .

[0177] More specifically, as referred to above in Figure 5 described, a cathode is applied to the target member TG, and an anode is applied to the protection member S and the anode bar AB such that plasma is generated between the target member TG and the protection member S and the anode bar AB.

[0178] Next, as in Figure 14 andFigure 15 As shown, at operation S40, a film-forming material ML is deposited on a substrate G.

[0179] The film-forming material ML is a film-forming material sputtered from a target member TG. In an embodiment, the film-forming material ML may include, for example, aluminum (Al), molybdenum (Mo), titanium (Ti), silver (Ag), or ITO, but is not limited thereto.

[0180] Figure 16 is a plan view of another embodiment of the deposition apparatus. Figure 17 is a perspective view of another embodiment illustrating the connection relationship between the anode bars and the support members.

[0181] Referring to Figure 16 and Figure 17 , the deposition apparatus 3 according to the present embodiment is different from the deposition apparatus 1 according to the above embodiment in that the anode bar AB has a first width d1 (refer to Figure 3 ), and adjacent anode bars AB are arranged at different intervals of spacing d2 and d4 according to their positions.

[0182] More specifically, the deposition apparatus 3 includes anode bars AB each having a first width d1 and arranged at different intervals of spacing d2 and d4 according to their positions.

[0183] The spacings d2 and d4 of the anode bars AB may have a second spacing d2 in a central region in the first direction DR1 within an opening (see OP in Figure 2 ), while having a fourth spacing d4 in an outer region in the first direction DR1 within the opening (refer to OP in Figure 2 ).

[0184] The fourth spacing d4 may be less than the second spacing d2. The fourth spacing d4 may be less than 50% of the second spacing d2. The shorter the spacings d2, d4 between adjacent anode bars AB, the more uniform the intensity density of the plasma in the corresponding overlapping region.

[0185] According to the present embodiment, the spacings d2 and d4 of the anode bars AB are configured such that the fourth spacing d4 is less than the second spacing d2, which enables the intensity density of the plasma to become more uniform in an outer region in the first direction DR1 within an opening (refer to OP in Figure 2 ).

[0186] Although embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will understand that various modifications, additions, and substitutions are possible.

Claims

1. A deposition device, comprising: A protective member having a grid shape in a plan view, and including short side edges extending in a first direction and long side edges extending in a second direction intersecting the first direction, the short side edges including a first short side edge and a second short side edge; A bracket member including a first bracket member disposed on and connected to the first short side edge and a second bracket member disposed on and connected to the second short side edge; A plurality of anode bars extending in the second direction and stably disposed on each of the first bracket member and the second bracket member; And A target member covering the plurality of anode bars, Wherein an anode bar among the plurality of anode bars protrudes outward beyond at least one of the first bracket member and the second bracket member, The anode bar is physically separated from the protective member by the bracket member, Wherein each of the first bracket member and the second bracket member includes a fixing member, A hole is defined in the fixing member of the first bracket member; A groove is defined in the fixing member of the second bracket member, A first end of the anode bar protrudes outward through the hole of the first bracket member so that the anode bar is not fully fixed to the first bracket member, and a second end of the anode bar is stably disposed in the groove of the second bracket member.

2. The deposition device according to claim 1, wherein the plurality of anode bars are spaced apart in the first direction and electrically grounded.

3. The deposition device according to claim 2, wherein the anode bar has a first width, Adjacent anode bars among the plurality of anode bars are spaced apart by a first pitch, and The first pitch is equal to or greater than twice the first width.

4. The deposition device according to claim 2, wherein a long side edge of the long side edges of the protective member has a first length, and The anode bar has a second length shorter than the first length.

5. The deposition device according to claim 4, wherein the protective member includes an upper protective member connected to the bracket member, and The upper protective member includes: A first extension portion connected to the bracket member; And A second extension portion connected to the first extension portion, disposed outside the anode bar, and extending in a third direction perpendicular to the first direction and the second direction.

6. The deposition device according to claim 5, wherein the protective member further includes a lower protective member spaced apart from the bracket member, and The lower protective member includes: A third extension portion disposed outside the target member; And A fourth extension portion connected to the third extension portion, extending in the third direction, and disposed outside the anode bar.

7. The deposition device according to claim 6, further comprising: A back plate for supporting the lower protective member and the target member.

8. The deposition device according to claim 7, further comprising: An insulating member disposed between the mask member and the upper protective member.

9. The deposition device according to claim 6, further comprising: A magnetic member, which is disposed below the target member.

10. The deposition apparatus according to claim 5, further comprising: A mask member, which is disposed inside the upper protection member, wherein the mask member is electrically floating and has a grid shape surrounding a first opening in the plan view.

11. The deposition apparatus according to claim 1, wherein a film forming material of the target member is deposited on a substrate facing the target member.

12. The deposition apparatus according to claim 1, wherein the target member includes a film forming material, and the film forming material includes a metal or a metal oxide.

13. The deposition apparatus according to claim 11, wherein the anode bars are used to deposit the film forming material uniformly on the substrate.

14. The deposition apparatus according to claim 1, wherein each of the anode bars and the support member includes a convex pattern on its surface.

15. The deposition apparatus according to claim 2, wherein the anode bar has a first width, adjacent anode bars among the plurality of anode bars are spaced apart by a predetermined distance, the predetermined distance between the adjacent anode bars is equal to or greater than twice the first width, the predetermined distance has a first distance in an outer region of the deposition apparatus and a second distance in a central region of the deposition apparatus, and the first distance is less than the second distance.

16. A deposition method, comprising: Preparing a deposition apparatus, the deposition apparatus including: a protection member, which has a grid shape in the plan view and includes short side edges extending in a first direction and long side edges extending in a second direction crossing the first direction, the short side edges including a first short side edge and a second short side edge; a support member, including a first support member disposed on the first short side edge and connected to the first short side edge in parallel and a second support member disposed on the second short side edge and connected to the second short side edge in parallel; a plurality of anode bars, extending in the second direction and stably disposed on each of the first support member and the second support member; and a target member, covering the plurality of anode bars; and Arranging a substrate to face the target member in a state separated from the target member across the plurality of anode bars between the substrate and the target member, wherein an anode bar among the plurality of anode bars protrudes outward beyond at least one of the first support member and the second support member, and the anode bar is physically separated from the protection member by the support member, wherein each of the first support member and the second support member includes a fixing member, a hole is defined in the fixing member of the first support member; a groove is defined in the fixing member of the second support member, a first end of the anode bar protrudes outward through the hole of the first support member so that the anode bar is not completely fixed to the first support member, and a second end of the anode bar is stably disposed in the groove of the second support member.

17. The deposition method according to claim 16, wherein when preparing the deposition equipment, the plurality of anode bars are spaced apart along the first direction and electrically grounded.

18. The deposition method according to claim 17, further comprising: forming a cathode on the target member to form a plasma between the plurality of anode bars and the target member.

19. The deposition method according to claim 18, further comprising: using the plasma to sputter the target member to deposit the film-forming material of the target member on the substrate.

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