Heat sink and board

Abstract

The present disclosure discloses a heat dissipation device and a board card, wherein the heat dissipation device can include a heat pipe group (110) including a plurality of heat pipes (111, 112) for absorbing heat, and at least one fin group (120) in fixed contact with the heat pipe group (110) to cooperate with the heat pipe group (110) for heat dissipation. According to the heat dissipation assembly of the present disclosure, the firmness and heat dissipation efficiency of the heat dissipation device can be effectively improved.

Description

TECHNICAL FIELD

[0001] The present disclosure relates generally to the field of heat dissipation technology. More particularly, the present disclosure relates to a heat dissipation device and a board card. BACKGROUND

[0002] With the continuous optimization of the performance of electronic products, the continuous improvement of the power of various processors, higher requirements are put forward for the performance and heat dissipation effect of the heat sink. In the current heat sink, heat pipes and heat dissipation fins are widely used due to their good heat dissipation performance. However, due to the sealing process of the heat pipe, there is a difference in weldability and heat transfer performance between the two ends of the heat pipe, which causes problems such as unstable welding and low heat dissipation efficiency at the connection position between the sealed end of the heat pipe and the heat dissipation fin. Therefore, how to solve the stability problem of the heat sink and improve the heat dissipation efficiency of the heat sink has become a difficult problem. SUMMARY

[0003] In view of the above-mentioned technical problems, the technical scheme of the present disclosure provides a heat dissipation device and a board card in multiple aspects.

[0004] In one aspect, the present disclosure provides a heat dissipation device, comprising: a heat pipe group comprising a plurality of heat pipes for absorbing heat, wherein each heat pipe has a first end and a second end, and the plurality of heat pipes are staggered arranged so that both sides of the heat pipe group comprise the first end and the second end; and at least one heat dissipation fin group in fixed contact with the heat pipe group to cooperate with the heat pipe group for heat dissipation.

[0005] In another aspect, the present disclosure provides a board card comprising the aforementioned heat dissipation device.

[0006] Through the above description of the scheme of the present disclosure, those skilled in the art can understand that the present disclosure can effectively avoid problems such as unstable welding and uneven heat transfer caused by the first end or the second end of all heat pipes being located on the same side of the heat pipe group by arranging the plurality of heat pipes of the heat dissipation device in a staggered manner, thereby effectively improving the stability performance and heat dissipation efficiency of the heat dissipation device. BRIEF DESCRIPTION OF DRAWINGS

[0007] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, which show, by way of example, several embodiments of the present disclosure. In the drawings:

[0008] Figure 1 is a schematic view showing a heat dissipation device according to the present disclosure;

[0009] Figure 2is a schematic diagram showing a heat dissipation device according to an embodiment of the present disclosure;

[0010] Figure 3 is a schematic diagram showing a heat dissipation device including a plurality of heat sink groups according to an embodiment of the present disclosure;

[0011] Figure 4 is a schematic diagram illustrating a heat dissipation device including a fixing structure according to an embodiment of the present disclosure; and

[0012] Figure 5 It shows that according to Figure 4 Schematic diagram of the assembled heat sink shown in . DETAILED DESCRIPTION

[0013] The following will clearly and completely describe the technical solutions in the embodiments of this disclosure in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of this disclosure, not all of them. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this disclosure.

[0014] It should also be understood that the terminology used in this disclosure is for the purpose of describing specific embodiments only and is not intended to limit the disclosure. As used in this disclosure and the claims, the singular forms "a," "an," and "the" are intended to include the plural forms unless the context clearly indicates otherwise. It should further be understood that the term "and / or" as used in this disclosure and the claims refers to any and all possible combinations of one or more of the associated listed items, including and including these combinations.

[0015] As used in this disclosure and claims, the term "if" can be interpreted as "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [described condition or event] is detected" can be interpreted as meaning "upon determination" or "in response to determining" or "upon detection of [described condition or event]" or "in response to detecting [described condition or event]," depending on the context.

[0016] The present disclosure addresses the deficiencies of the prior art and provides a new and feasible solution. In particular, the staggered arrangement of the multiple heat pipes in the heat dissipation device disclosed herein enables both sides of the heat pipe group to include a first end and a second end, thereby avoiding possible problems such as unstable welding. Through the following description, it will be understood by those skilled in the art that in various embodiments of the present disclosure, it is also possible to fully utilize the heat transfer performance of the heat pipe group, for example, by providing multiple heat sink groups and arranging them at different positions of the heat pipe group, thereby further improving the heat dissipation efficiency of the heat dissipation device.

[0017] Several embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0018] Figure 1 is a schematic diagram generally showing a heat dissipation device according to the present disclosure. Figure 1 As shown in , a heat dissipation device 100 is provided, which may include: a heat pipe group (shown in a dotted box) 110, which may include a plurality of heat pipes (e.g., 111, 112, etc.) for absorbing heat, wherein each heat pipe has a first end and a second end, and the plurality of heat pipes (e.g., 111, 112, etc.) are staggered such that both sides of the heat pipe group 110 include the first end and the second end; and at least one heat sink group 120, which is in fixed contact with the heat pipe group 110 to cooperate with the heat pipe group 110 to dissipate heat.

[0019] The multiple heat pipes of the heat pipe assembly 110 described above can absorb heat through direct or indirect contact with a heat source (e.g., a device to be dissipated), thereby achieving heat transfer and heat dissipation. The staggered arrangement of the multiple heat pipes can involve the first ends of some of the heat pipes and the second ends of another portion of the heat pipes being arranged on the same side of the heat pipe assembly 110. In one embodiment, one side of the heat pipe assembly can include one or more first ends and one or more second ends.

[0020] The first end and the second end of each heat pipe in the heat pipe group 110 described above may have the same or different shapes. When the shapes of the first end and the second end of the heat pipe are different, there may be a difference in heat transfer performance between the first end and the second end. For example, Figure 1 The heat pipe 111 or heat pipe 112 shown in the figure has a relatively round end (or called an effective end) and a relatively pointed end (or called an ineffective end), wherein the ineffective end is usually a sealed end and may have disadvantages such as poor weldability and thermal conductivity. In one embodiment, the first end can be the effective end and the second end can be the ineffective end. In another embodiment, the first end can be the ineffective end and the second end can be the effective end. For ease of explanation, the following exemplary description is given by taking the first end as the effective end and the second end as the ineffective end in the figure as an example.

[0021] As shown in Figure 1 The heat pipe 111 can have a first end portion 1111 and a second end portion 1112, and the heat pipe 112 can have a first end portion 1121 and a second end portion 1122. The heat pipes 111 and 112 are staggered so that both sides of the heat pipe group 110 include the first end portion and the second end portion. For example Figure 1 One side of the heat pipe group 110 shown in

[0022] According to such an arrangement, when the first end portion and the second end portion of the heat pipe have different shapes, compared to arranging all the invalid ends (for example, the second end portion 1112 of the heat pipe 111 and the second end portion 1122 of the heat pipe 112, etc.) of all the heat pipes (for example, 111, 112, etc.) on the same side of the heat pipe group 110, the staggered arrangement can effectively avoid the risk of the overall welding of the side being not firm, thereby facilitating the improvement of the firmness and structural strength of the overall heat dissipation device. In addition, since there is a difference in the heat conduction performance between the invalid end and the valid end of the heat pipe, that is, the heat conduction performance of the invalid end is poorer than that of the valid end, the staggered arrangement of the heat pipe will facilitate more uniform heat dissipation, thereby ensuring the heat dissipation efficiency of the heat dissipation device.

[0023] As shown in Figure 1 According to the heat dissipation device 100 of the present disclosure, one or more heat sink groups 120 can also be included. The heat sink group 120 can be in fixed contact with the heat pipe group 110 to cooperate with the heat pipe group 110 to dissipate heat. The heat sink group 120 can be in fixed contact with at least one of the two sides and the middle of the heat pipe group 110, so as to transfer or dissipate the heat absorbed by the heat pipe group 110 outward. In one embodiment, the heat pipe group 110 and the heat sink group 120 can be fixed by welding, riveting, or bolting, etc.

[0024] According to one embodiment of the present disclosure, the heat sink group 120 can include a plurality of fins which can be fixed in parallel and equally spaced from each other. The space between the plurality of fins can form an air duct to assist heat dissipation. The plurality of fins can be arranged perpendicular to the heat pipe group 110. The heat pipe group 110 can pass through the plurality of fins or be in fixed contact with the edge or the like of the plurality of fins. The shape of the fin can be rectangular, square, circular, parallelogram, trapezoidal, etc. In one embodiment, the fin can be a high-density fin. In another embodiment, the heat sink group 120 can include a plurality of fins which can be uniformly arranged around the same axis, so that the heat sink group 120 as a whole is in the shape of a pie, a cylinder, or a sector, etc.

[0025] According to another embodiment of the present disclosure, the heat pipe assembly 110 and the heat sink assembly 120 can each be made of at least one of a metal or non-metallic thermally conductive material such as copper, aluminum, and silver. The materials of the heat pipe assembly 110 and the heat sink assembly 120 can be the same or different. For example, in one embodiment, the heat pipe assembly 110 and the heat sink assembly 120 are both made of copper, which can improve the heat transfer performance of the heat sink and thus improve heat dissipation efficiency. In another embodiment, the heat pipe assembly 110 and the heat sink assembly 120 can both be made of aluminum to reduce the processing cost and weight of the heat sink. In yet another embodiment, the heat pipe assembly 110 can be made of copper, while the heat sink assembly 120 can be made of aluminum, to reduce the processing cost and weight of the heat sink while ensuring the heat transfer performance of the heat sink 100. In addition, the materials of the multiple heat pipes (e.g., heat pipe 111 and heat pipe 112) in the heat pipe assembly 110 can be the same or different. The materials of the multiple heat sinks (or fins) in the heat sink assembly 120 can be the same or different.

[0026] Combination of the above Figure 1 The heat dissipation device according to the present disclosure has been generally described. It should be understood by those skilled in the art that the above description is exemplary and not restrictive. For example, the lengths of the multiple heat pipes in the heat pipe group 110 may not be limited to being equal as shown in the figure, and may be set to be unequal as needed. The number of heat pipes in the heat pipe group 110 may not be limited to two as shown in the figure, and may be set to more as needed. One side of the heat pipe group 110 may not be limited to including only one first end and one second end as shown in the figure, and may be arranged to include, for example, one first end and multiple second ends, or one second end and multiple first ends, or multiple first ends and multiple second ends, etc. as needed. For another example, the shape of the heat pipe may not be limited to the straight line as shown in the figure, and may be set to an arc, L-shape, U-shape, wave shape, broken line shape, coil shape, spiral shape, etc. or a combination thereof as needed. The contact position of the heat sink group 120 and the heat pipe group 110 may not be limited to being located on one side of the heat pipe group 110 as shown in the figure, and may also be arranged to, for example, contact both sides of the heat pipe group 110 as needed. The following will be combined with Figure 2 An exemplary description is given.

[0027] Figure 2 Schematic diagram of a heat dissipation device according to an embodiment of the present disclosure. Figure 2As shown in , the heat dissipation device 100 may include a heat pipe group and a heat sink group 120, wherein the heat pipe group may include a plurality of heat pipes (e.g., 111, 112, etc.), wherein the heat pipe 111 may have a first end 1111 and a second end 1112, and the heat pipe 112 may have a first end 1121 and a second end 1122. The heat pipes 111 and the heat pipes 112 are staggered such that one side of the heat pipe group may include the first end 1111 of the heat pipe 111 and the second end 1122 of the heat pipe 112, and the other side of the heat pipe group may include the second end 1112 of the heat pipe 111 and the first end 1121 of the heat pipe 112.

[0028] According to one embodiment of the present disclosure, the first and second ends of each heat pipe can be bent toward the middle, so that the heat pipe assembly as a whole can be formed into a U-shape, for example. This allows the two side portions of the heat pipe assembly to be fixedly contacted with a heat sink assembly 120, while the middle portion of the heat pipe assembly can be used to contact a heat source to absorb heat. In one embodiment, the two side portions of the heat pipe assembly can be perpendicular to the middle portion of the heat pipe assembly.

[0029] Furthermore, if Figure 2 As shown in , the heat dissipation device 100 may include a heat sink assembly 120, which may be in fixed contact with both sides of the heat pipe group. In one embodiment, the heat sink assembly 120 may include a plurality of heat sinks (or fins) 121 arranged in parallel and at equal intervals, and each fin 121 may be provided with a perforation at a corresponding position, so that both sides of the heat pipe group pass through the heat sink assembly 120 and are in fixed contact with each fin 121, so that the portions of each heat pipe located on both sides of the heat pipe group can fully utilize each fin 121 for heat dissipation.

[0030] Through the above description, those skilled in the art can understand that the U-shaped heat pipe can form a double-loop condensation, that is, the middle part of the heat pipe can absorb heat so that the liquid water in the heat pipe forms water vapor. The water vapor rises to the two sides of the U-shaped heat pipe and is cooled, and then condenses into liquid water and flows back to the middle part of the heat pipe, and circulates in this way to transfer heat. The U-shaped heat pipe has two cold ends (i.e., the two sides of the U-shaped heat pipe) which can effectively improve the heat transfer efficiency of the heat pipe. According to such a setting, not only can the heat transfer efficiency of the heat pipe group be effectively improved, but also because the heat sink group 120 is in full contact with both sides of the heat pipe group, the heat conduction area is increased, thereby improving the heat dissipation efficiency of the entire device. In addition, the staggered arrangement of multiple heat pipes is conducive to enhancing the connection strength between the heat pipe group and the heat sink group 120 at both ends and the uniform heat dissipation performance, which is more conducive to the stability of the device and ensuring the heat dissipation effect of the heat dissipation device.

[0031] Combination of the above Figure 2An exemplary description is given of the implementation method of a heat sink group 120 in fixed contact with two side portions of a heat pipe group according to an embodiment of the present disclosure. It will be understood by those skilled in the art that the above description is exemplary and not restrictive. For example, the number of heat pipes in the heat pipe group may not be limited to the two shown in the figure, and may be set to more as needed. The number of heat pipe groups may not be limited to one shown in the figure, and may be set to more as needed. In one embodiment, a plurality of heat pipe groups may be arranged in a staggered manner and may be in fixed contact with one or more heat sink groups. In another embodiment, a plurality of heat pipe groups may be arranged in parallel and may be in fixed contact with one or more heat sink groups. The number of heat sink groups 120 may not be limited to one shown in the figure, and may be set to more as needed. The position where the heat sink group 120 is in fixed contact with the heat pipe group may not be limited to the two side portions of the heat pipe group shown in the figure, and may also be set to be in contact with the middle portion of the heat pipe group as needed. The following will be combined with Figure 3 An exemplary description is given.

[0032] Figure 3 FIG is a schematic diagram showing a heat dissipation device including a plurality of heat sink groups according to an embodiment of the present disclosure. Figure 3 As shown in FIG, the heat dissipation device 100 may include a heat pipe group 110, a first heat sink group 120-1, a second heat sink group 120-2, and a third heat sink group 120-3. The first heat sink group 120-1 and the second heat sink group 120-2 may be respectively provided with a through hole 122 for nesting the side of the heat pipe group 110, and the middle portion of the heat pipe group 110 may be fixedly contacted with the third heat sink group 120-3.

[0033]

[0066] The first heat sink group 120-1, the second heat sink group 120-2, and the third heat sink group 120-3 described above can be fixedly contacted with the two side portions and the middle portion of the heat pipe group 110, respectively. This arrangement can fully utilize the heat dissipation area of ​​each portion of the heat pipe group 110, especially the high heat transfer portion in the middle portion, thereby accelerating the heat transfer rate of each portion of the heat pipe group 110, thereby significantly improving the heat dissipation efficiency of the heat dissipation device 100.

[0034] like Figure 3 As shown in FIG, the number and position of the through-holes 122 provided on the first heat sink assembly 120-1 and the second heat sink assembly 120-2 can match the number and position of the first and second ends of the corresponding side portions of the heat pipe assembly 110 to be nested therein. For example, a side portion of the heat pipe assembly 110 (e.g., the left side portion of the heat pipe assembly 110 shown in the figure) can include four first ends and three second ends, and the first heat sink assembly 120-1 for nesting therein can be provided with at least seven matching through-holes 122.

[0035] According to one embodiment of the present disclosure, the middle portion of the heat pipe group 110 is in fixed contact with the third heat sink group 120-3. One side of the middle portion of the heat pipe group 110 is in fixed contact with the third heat sink group 120-3 to dissipate heat, while the other side of the middle portion of the heat pipe group 110 can be used to directly or indirectly contact with a heat source to absorb heat. For example, Figure 3 As shown in , in one embodiment, the first end and the second end of each heat pipe can be bent toward the middle, so that the heat pipe group 110 is U-shaped as a whole, and the first heat sink group 120-1 and the second heat sink group 120-2 are nested on both sides of the U-shaped heat pipe group 110, and the third heat sink group 120-3 can be arranged above the bottom of the U-shaped heat pipe group 110, and the bottom of the U-shaped heat pipe group 110 can be used to contact the heat source. The heat dissipation principle and heat transfer effect of the U-shaped heat pipe group are combined with the above. Figure 2 The descriptions are the same or similar and will not be repeated here.

[0036] Combination of the above Figure 3 An exemplary description is given of a heat dissipation device including a plurality of heat sink groups according to an embodiment of the present disclosure. It will be understood by those skilled in the art that the above description is exemplary and not restrictive. For example, the number of heat sink groups may not be limited to three as shown in the figure, and may be set to more or less as needed. The number of heat pipes included in the heat pipe group 110 may not be limited to seven as shown in the figure, and may be set to more or less as needed. The shape of the heat pipe group 110 may not be limited to a U-shape, and may be set to a straight shape or an L-shape, etc. as needed. The arrangement positions of the heat pipes on the two sides of the U-shaped heat pipe group 110 may be symmetrical, or may be set to asymmetrical as needed. The position of the third heat sink group 120-3 may not be limited to above the bottom of the heat pipe group 110 as shown in the figure, and may be set to, for example, below the bottom of the heat pipe group 110 as needed, and the top of the bottom of the heat pipe group 110 may be used to contact the heat source. In some application scenarios, in order to facilitate installation and give full play to the heat dissipation performance, the heat dissipation device according to the present disclosure may also be provided with a fixed structure as needed, which will be combined below. Figure 4 An exemplary description is given.

[0037] Figure 4 Schematic diagram showing a heat dissipation device including a fixing structure according to an embodiment of the present disclosure. Figure 4As shown in the figure, the heat dissipation device 100 may include a heat pipe group 110, a first heat sink group 120-1, a second heat sink group 120-2, and a third heat sink group 120-3. The first heat sink group 120-1 and the second heat sink group 120-2 may each be provided with a through-hole 122 for nesting the side portion of the heat pipe group 110, while the middle portion of the heat pipe group 110 may be in fixed contact with the third heat sink group 120-3. Furthermore, the heat dissipation device 100 may also include a fixing structure for fixing the heat pipe group 110. The fixing structure may include a base plate 130 and a bracket 140 detachably connected to the base plate 130. The base plate 130 may be in fixed contact with the heat pipe group 110 and fixed relative to the device to be cooled by the bracket 140. The device to be cooled according to the present disclosure may be a heat-generating device such as a processor or a chip. The heat pipe group 110, the first heat sink group 120-1, the second heat sink group 120-2 and the third heat sink group 120-3 have been described in detail above and will not be repeated here. The fixing structure will be described exemplarily below.

[0038] In one embodiment, the third heat sink group 120-3 and the bottom plate 130 can be respectively arranged on two sides of the middle portion of the heat pipe group 110 (eg Figure 4 As shown in FIG, the third heat sink group 120-3 is arranged on the upper middle surface of the heat pipe group 110, while the base plate 130 is arranged on the lower middle surface of the heat pipe group 110. This allows the third heat sink group 120-3 to directly contact the middle portions of the heat pipes in the heat pipe group 110, facilitating direct heat transfer and improving heat transfer efficiency. This arrangement also allows the middle portions of all heat pipes in the heat pipe group 110 to be located on the same plane, facilitating surface-to-surface contact with the device to be cooled. Compared to the multiple line-to-surface contact arrangements where multiple heat pipes directly contact the device to be cooled, or the risk of not ensuring that all heat pipes can contact the device to be cooled, surface-to-surface contact ensures contact and increases the contact area, thereby increasing the heat transfer area. This arrangement is therefore more conducive to improving the device's heat dissipation efficiency.

[0039] According to one embodiment of the present disclosure, the heat pipe group 110 and the base plate 130 can be fixedly contacted by, for example, welding, riveting, or bolts. The fixed contact method between the heat pipe group 110 and the base plate 130 and the fixed contact method between the heat pipe group 110 and the heat sink group can be the same or different. For example, in one embodiment, the heat pipe group 110 and the base plate 130 and the heat pipe group 110 and the heat sink group are both connected by welding. In another embodiment, the heat pipe group 110 and the base plate 130 and the heat pipe group 110 and the heat sink group are both connected by riveting. In yet another embodiment, the heat pipe group 110 and the heat sink group are connected by welding, and the heat pipe group 110 and the base plate 130 are connected by riveting.

[0040] The base plate 130 of the fixing structure described above can be used to fix the heat pipe assembly 110, while the bracket 140 can be used to fix the heat dissipation device composed of the base plate 130 and the heat pipe assembly 110. The base plate 130 and the bracket 140 cooperate to fix the heat pipe assembly 110 relative to the device to be cooled. According to the heat dissipation device fixed with the bracket 140 of the present disclosure, it is possible to avoid opening holes around the device to be cooled (for example, opening holes around the main chip of the printed circuit board PCB), thereby reducing the impact on the surrounding area of ​​the device to be cooled, such as wiring space and signal quality. It can also reduce the angle between the base plate 130 and the device to be cooled (such as a chip) during installation of the heat dissipation device, thereby reducing the risk of the device to be cooled (such as a chip) being broken during installation.

[0041] In one embodiment, the base plate 130 and the bracket 140 can be connected by a detachable connection method such as snap connection, splicing, screw connection, etc. Compared with the case of non-detachable connection, the detachable connection between the base plate 130 and the bracket 140 has a certain buffering effect, which can reduce the direct stress impact of the heat dissipation device on the heat dissipation device during transportation. In another embodiment, the material of the base plate 130 and the bracket 140 can be selected from at least one of metals such as copper, aluminum, silver, and non-metallic thermal conductive materials. The materials of the base plate 130 and the bracket 140 can be the same or different, and can be selected as needed. In order to facilitate the understanding of the matching relationship between the base plate 130 and the bracket 140, an exemplary description will be given below through specific embodiments.

[0042] like Figure 4 As shown in , according to one embodiment of the present disclosure, the base plate 130 may include a middle portion 131 having a first surface and a second surface and two side portions 132 and 133 for fixedly connecting to a bracket 140. The first surface of the middle portion 131 (for example, the upper surface of the bottom plate middle portion 131 in the figure) is in fixed contact with the heat pipe group 110, and the bracket 140 is provided with an opening 141 that is adapted to the size and position of the second surface of the middle portion 131 (for example, the lower surface of the bottom plate middle portion 131 in the figure).

[0043] The first surface of the middle portion of the bottom plate 130 described above can be used for fixed contact with the heat pipe assembly 110, and the two side portions 132 and 133 can be used for detachable connection with the bracket 140. For example, in one embodiment, the two side portions 132 and 133 of the bottom plate 130 can be provided with screw holes so as to be fastened to the bracket 140 by screws. The two side portions 132 and 133 of the bottom plate can be in the same plane as the middle portion 131, or can be configured as needed, for example, to protrude from the first surface of the middle portion 131 of the bottom plate (for example, Figure 4), so that the first surface of the bottom plate middle portion 131 forms a concave surface relative to the two side portions 132 and 133, thereby facilitating the fixation and limiting the position of the heat pipe assembly 110 in contact therewith. In another embodiment, the two side portions 132 and 133 of the bottom plate 130 can be configured as needed to protrude from the second surface of the bottom plate middle portion 131, so that the second surface of the bottom plate middle portion 131 forms a concave surface relative to the two side portions 132 and 133. After connection with the bracket 140, a certain space is formed to facilitate accommodating thicker heat dissipation devices.

[0044] The bracket 140 described above can be an integrally formed structure, or a structure connected by a detachable connection method such as splicing, clamping, screw connection, etc. The opening 141 provided on the bracket 140 can be located in the middle or one side of the bracket 140, etc. The opening 141 can be used to place one or more devices to be cooled and fix the base plate 130 so that the middle portion 131 of the base plate 130 is in contact with the device to be cooled. The size of the opening 141 and the size of the middle portion 131 of the base plate can be adapted to the size of the device to be cooled, so that the device to be cooled can be arranged in the opening 141 and fixed in position, and the second surface of the middle portion 131 of the base plate is in contact with the larger cooling surface of the device to be cooled as much as possible.

[0045] Furthermore, bracket 140 not only serves to arrange the heat dissipation components, but also functions as a position limiter. Specifically, opening 141 on bracket 140 is adapted to the size and position of the second surface of base plate middle portion 131. This allows the base plate 130 to be mounted with bracket 140 to limit the degree of deflection relative to the heat dissipation components, thereby ensuring the contact flatness between base plate 130 and the heat dissipation components, and preventing the risk of failure caused by excessive deflection angles that could result in significant stress on the corners of the heat dissipation components.

[0046] Based on the above description, those skilled in the art will understand that the present disclosure essentially discloses a fixing device for fixing a heat pipe assembly (i.e., the fixing structure described above). The fixing device can be used alone and can be applied to fix various types of radiators. It can also be combined with the heat pipe assembly disclosed herein or other types of radiators to form a new type of heat dissipation device with the above-mentioned characteristics.

[0047] Combination of the above Figure 4The heat dissipation device including the fixed structure according to the embodiment of the present disclosure is described in an exemplary manner. It should be understood by those skilled in the art that the above description is exemplary and not restrictive. For example, the shape of the bracket 140 is not limited to the square shown in the figure, and can be set to a circle or the like as needed. The number of openings 141 provided on the bracket 140 is not limited to one as shown in the figure, and more can be provided as needed. According to one embodiment of the present disclosure, the structure of the bracket 140 is not limited to including the opening 141, and can be provided as needed, for example Figure 4 As shown in the figure, the periphery of the bracket 140 can also be arranged with a plurality of tooth plates for heat dissipation to assist in heat dissipation. The number of tooth plates is not limited to that shown in the figure, and more or less can be set as needed. In order to facilitate understanding of the use state of the heat dissipation device according to the present disclosure (i.e., the assembled structure), the following will be Figure 4 Taking the heat dissipation device shown in FIG as an example, the assembled heat dissipation device is described.

[0048] Figure 5 It shows that according to Figure 4 The schematic diagram of the heat sink after assembly is shown in FIG. Figure 5 As shown in FIG, the heat dissipation device 100 may include a heat pipe group 110, a first heat sink group 120-1, a second heat sink group 120-2, a third heat sink group 120-3, and a fixing structure, wherein the fixing structure may include a base plate 130 and a bracket 140, and the first heat sink group 120-1 and the second heat sink group 120-2 are provided with a plurality of through holes 122 on both sides for nesting the heat pipe group 110, as shown in FIG. Figure 5 As shown in FIG, first and second ends of a plurality of heat pipes can be observed at the through-holes 122 .

[0049] According to the heat pipe group 110 of the heat dissipation device 100 of the present disclosure, the plurality of heat pipes are arranged in a staggered manner, so that both sides of the heat pipe group 110 include a first end and a second end. Figure 5 As shown in FIG, four first ends and three second ends can be observed in the plurality of through-holes 122 of the first heat sink group 120 - 1 , and correspondingly three first ends and four second ends can be observed in the plurality of through-holes 122 of the second heat sink group 120 - 2 .

[0050] According to one embodiment of the present disclosure, the third heat sink group 120-3 can be in fixed contact with the middle portion of the heat pipe group 110. Figure 5From the perspective of the structure of the assembled heat dissipation device 100, the third heat sink group 120-3 can be located between the first heat sink group 120-1 and the second heat sink group 120-2, and the first heat sink group 120-1, the second heat sink group 120-2 and the third heat sink group 120-3 almost cover the maximum contact area of ​​the multiple heat pipes of the heat pipe group 110, which has a significant effect on improving the heat dissipation effect of the heat pipe group 110.

[0051] like Figure 5 As shown in , the base plate 130 and the bracket 140 can be fastened by, for example, screws, so that the assembled base plate 130 and the bracket 140 can form a fixed structure with stable structure and uniform force, thereby ensuring the stability and effectiveness of the entire heat dissipation device.

[0052] The technical solution of the heat dissipation device according to the present disclosure and its multiple embodiments are described in detail above. Through the above description, those skilled in the art can understand that the multiple heat pipes of the heat dissipation device disclosed herein can be arranged in a staggered manner so that both sides of the heat pipe group include a first end and a second end, which can ensure the connection strength and heat transfer uniformity when the two sides of the heat pipe group are connected to the heat sink group, thereby ensuring the heat dissipation efficiency of the heat dissipation device. The heat dissipation device according to the present disclosure can include one or more heat sink groups to be fixedly contacted with at least one of the middle and two side parts of the heat pipe group. A preferred embodiment is that multiple heat sink groups are respectively fixedly contacted with the middle and two side parts of the heat pipe group to fully utilize the heat transfer parts of the heat pipe group and obtain the maximum contact area (i.e., the maximum heat dissipation area). It can also fully utilize more heat dissipation ducts within the multiple heat sink groups, thereby effectively improving the heat dissipation efficiency of the heat dissipation device.

[0053] Furthermore, according to the embodiments of the present disclosure, the heat dissipation device can also be provided with a fixed structure as needed. Through the coordination and installation of the base plate and the bracket in the fixed structure, not only can all heat pipes of the heat pipe group in fixed contact with the base plate be guaranteed to absorb heat to a large extent, but also, because the bracket has a limiting function, it can effectively reduce the risk of failure of the heat dissipation device due to excessive installation stress. Therefore, the heat dissipation device according to the present disclosure has the advantages of high heat dissipation efficiency, high safety, and strong stability.

[0054] In addition, through the above description, it should be understood by those skilled in the art that the heat pipe group composed of the plurality of heat pipes arranged in a staggered manner and the fixing structure for fixing the heat pipe group are separately arranged, wherein the heat pipe group composed of the plurality of heat pipes arranged in a staggered manner has the characteristics of uniform heat dissipation, enhanced stability in connection with the heat sink group, etc., and the fixing structure has the characteristics of facilitating the fixing and installation of the heat dissipation device and reducing the risk of breakage and failure of the device to be cooled, etc., and those skilled in the art can select according to the needs. For example, in some application scenarios, the heat dissipation device combined with the heat pipe group composed of the plurality of heat pipes arranged in a staggered manner and the heat sink group can be used for heat dissipation without using the fixing device. In some other application scenarios, the fixing structure (or fixing device) of the present disclosure can be used alone to fix the heat sink. In some other application scenarios, the heat pipe group and the fixing structure of the present disclosure can be used in combination to form a heat dissipation device with the characteristics of high-efficiency heat dissipation and safe and stable connection.

[0055] According to another aspect of the present disclosure, a board card can include any one or more of the heat dissipation devices described above, and can be used for heat dissipation of one or more devices to be cooled. In one embodiment, the board card according to the present disclosure can include the device to be cooled and the heat dissipation device arranged on the device to be cooled. The structure and heat dissipation mode of the heat dissipation device according to the present disclosure have been described in detail above in combination with a plurality of embodiments, and will not be described here again.

[0056] In the above embodiments, the description of each embodiment focuses on different aspects, and the parts not described in detail in a certain embodiment can be referred to the relevant description of other embodiments. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present disclosure.

[0057] The foregoing can be better understood in light of the following clauses:

[0058] Clause A1, a heat dissipation device, comprising: a heat pipe group comprising a plurality of heat pipes for absorbing heat, wherein each heat pipe has a first end and a second end, and the plurality of heat pipes are arranged in a staggered manner such that both sides of the heat pipe group comprise the first end and the second end; and at least one heat sink group in fixed contact with the heat pipe group for heat dissipation in cooperation with the heat pipe group.

[0059] Clause A2, the heat dissipation device according to Clause A1, wherein the heat dissipation device further comprises a fixing structure for fixing the heat pipe group, the fixing structure comprising a bottom plate and a bracket detachably connected with the bottom plate, wherein the bottom plate is in fixed contact with the heat pipe group and is fixed relative to the device to be cooled by the bracket.

[0060] Item A3, a heat dissipation device according to Item A2, wherein the base plate includes a middle portion having a first surface and a second surface and two side portions for fixedly connecting to the bracket, the first surface of the middle portion is in fixed contact with the heat pipe group, and the bracket is provided with an opening that is adapted to the size and position of the second surface of the middle portion.

[0061] Item A4, a heat dissipation device according to Item A3, wherein screw holes are provided on two sides of the base plate so as to be fastened to the bracket by screws.

[0062] Item A5, a heat dissipation device according to any one of Items A1-A4, wherein the at least one heat sink group includes a first heat sink group, a second heat sink group and a third heat sink group, and wherein the first heat sink group and the second heat sink group are respectively provided with perforations on the side for nesting the heat pipe group, and the middle portion of the heat pipe group is fixedly contacted with the third heat sink group.

[0063] Item A6, a heat dissipation device according to Item A5, wherein the first end and the second end of each heat pipe are bent toward the middle so that the heat pipe group as a whole is U-shaped, and the first heat sink group and the second heat sink group are nested on both sides of the U-shaped heat pipe group, and the third heat sink group is arranged above the bottom of the U-shaped heat pipe group.

[0064] Item A7, a heat sink according to any one of Items A1-A6, wherein the heat sink group includes a plurality of fins, and the plurality of fins are fixed parallel to each other and at equal intervals.

[0065] Item A8, a heat dissipation device according to any one of Items A2-A7, wherein the heat pipe group and the heat sink group, and the heat pipe group and the base plate are fixed by welding, riveting or bolts.

[0066] Item A9, a heat dissipation device according to any one of Items A2-A7, wherein the material of the heat pipe group, the heat sink group, the base plate and the bracket is selected from at least one of copper and aluminum.

[0067] Item A10, a board comprising a heat dissipation device according to any one of items A1-A9.

[0068] The above is a detailed introduction to the embodiments of the present disclosure. Specific examples are used herein to illustrate the principles and implementation methods of the present disclosure. The description of the above embodiments is only used to help understand the scheme and core ideas of the present disclosure. At the same time, changes or deformations made by those skilled in the art based on the ideas of the present disclosure, the specific implementation methods and the scope of application of the present disclosure, all fall within the scope of protection of the present disclosure. In summary, the contents of this specification should not be understood as limiting the present disclosure.

Claims

1. A heat dissipation device, comprising: a heat pipe assembly comprising a plurality of heat pipes for absorbing heat; At least one heat sink group, comprising a first heat sink group, a second heat sink group, and a third heat sink group, wherein the first heat sink group and the second heat sink group are fixed to two sides of the heat pipe group, and the third heat sink group is fixedly contacted with the middle of the heat pipe group to cooperate with the heat pipe group to dissipate heat; as well as The fixing structure includes a base plate and a bracket detachably connected to the base plate, wherein the base plate is in fixed contact with the heat pipe group and the heat pipe group is fixed relative to the device to be cooled by the base plate and the bracket, and the base plate and the bracket are connected to form a space for accommodating the device to be cooled. 2 . The heat dissipation device according to claim 1 , wherein the base plate is used to fix the heat pipe group.

3. The heat dissipation device according to claim 1, wherein the base plate comprises a middle portion having a first surface and a second surface and two side portions for fixedly connecting to the bracket, the first surface of the middle portion is in fixed contact with the heat pipe group, and the bracket is provided with an opening that is adapted to the size and position of the second surface of the middle portion. 4 . The heat dissipation device according to claim 3 , wherein screw holes are provided on two side portions of the base plate so as to be fastened to the bracket by screws.

5. The heat dissipation device according to any one of claims 1 to 4, wherein the first heat dissipation fin group and the second heat dissipation fin group are respectively provided with a through hole on the side for nesting the heat pipe group.

6. The heat dissipation device according to claim 5, wherein the first end and the second end of each heat pipe are bent toward the middle so that the heat pipe group as a whole is U-shaped, and the first heat sink group and the second heat sink group are nested on both sides of the U-shaped heat pipe group, and the third heat sink group is arranged above the bottom of the U-shaped heat pipe group.

7. The heat dissipation device according to any one of claims 1 to 6, wherein the heat sink group comprises a plurality of fins, the plurality of fins are fixed parallel to each other and at equal intervals, each heat pipe has a first end and a second end, and the plurality of heat pipes are staggered so that both sides of the heat pipe group include the first end and the second end.

8. The heat dissipation device according to any one of claims 1 to 7, wherein the heat pipe group and the heat sink group, and the heat pipe group and the base plate are fixed by welding, riveting or bolts.

9. The heat dissipation device according to any one of claims 1 to 7, wherein the heat pipe group, the heat sink group, the base plate and the bracket are made of at least one material selected from copper and aluminum.

10. A board comprising the heat dissipation device according to any one of claims 1 to 9.

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