Automatic packaging device for substrates

Abstract

The present invention provides an automatic bundling device for substrates, including a bottom plate, a linear guide rail arranged on the bottom plate, a carrier plate slidably mounted on the linear guide rail, a rodless cylinder arranged on the bottom plate and connected to the carrier plate, a tray positioning block arranged on the carrier plate and including several workstations, and a cover plate arranged directly above the bottom plate. A guide assembly connecting the bottom plate and the cover plate is arranged between the bottom plate and the cover plate. A pneumatic slide table driving the cover plate to move up and down is arranged on the bottom plate. When the cover plate is in the initial position, the cover plate is located above the left side of the carrier plate, and when the cover plate is in the working state, the carrier plate is located directly below the cover plate. A buffer is arranged on the cover plate. A buckle is arranged on the cover plate to fix and bundle the cover side of the substrate. This device is placed on a workbench, and the cover side and the table side of the magnetic substrate are merged, and the manual operation method is replaced by a semi-automatic bundling method.

Description

Technical Field

[0001] The present invention relates to an automatic substrate packaging device, and more particularly to an automatic substrate packaging device with high working efficiency. Background Art

[0002] The automatic packaging device for substrates currently uses manual operation. Current situation - manual operation (magnetic substrate capping): Manual capping places the cap side on the table side. When the two objects are close, the magnet generates a large suction force, which makes it difficult to place them and easily causes collisions, resulting in the lenses being scattered (all lenses are NG after being scattered). Due to the different proficiency of the operators, their hands directly touch the substrates, and there are no dust prevention measures, which easily causes stains, garbage and damage to the lenses; the manual capping method is to place one substrate at a time, which takes 16s / pcs and is inefficient. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide an automatic substrate packaging device in view of the deficiencies of the prior art. The specific scheme is as follows:

[0004] The present invention is an automatic bundling device for substrates, which is characterized in that: the automatic bundling device for substrates comprises a bottom plate, a linear guide rail arranged on the bottom plate, a carrier plate slidably mounted on the linear guide rail, a rodless cylinder arranged on the bottom plate and connected to the carrier plate, a collection tray positioning block arranged on the carrier plate and comprising several workstations, and a cover plate arranged directly above the bottom plate; a guide assembly connecting the bottom plate and the cover plate is arranged between the bottom plate and the cover plate; a pneumatic slide table driving the cover plate to move up and down is arranged on the bottom plate; when the cover plate is in the initial position, the cover plate is located above the left side of the carrier plate; when the cover plate is in the working state, the carrier plate is located directly below the cover plate; a buffer is arranged on the cover plate; and a buckle is arranged on the cover plate to achieve fixation and bundling of the substrate cover side.

[0005] The technical problem to be solved by the present invention can be further achieved by the following technical solution: a shaft sleeve is arranged on the carrier plate, a guide pin is arranged on the cover plate, and the guide pin shaft is located in the shaft sleeve when the cover plate is in working state.

[0006] The technical problem to be solved by the present invention can be further achieved by the following technical solution: the guide assembly includes a guide shaft with a vertical center axis and a linear bearing arranged on the guide shaft.

[0007] The technical problem to be solved by the present invention can be further achieved by the following technical solution: the buckle is installed on the optical axis, and the optical axis is installed on the cover plate through an optical axis fixing block.

[0008] The technical problem to be solved by the present invention can be further achieved by the following technical solution: a torsion spring for adjusting the buckle to hook and release the substrate is arranged on the optical axis.

[0009] The technical problem to be solved by the present invention can be further achieved by the following technical solution: a limit pin for limiting the rotation angle of the buckle is arranged on the optical axis.

[0010] The technical problem to be solved by the present invention can be further achieved by the following technical solution: a buffer fixing block for fixing the buffer is provided on the cover plate.

[0011] The technical problem to be solved by the present invention can be further achieved by the following technical solution: a carrier plate limiting block is provided on the bottom plate, and the carrier plate abuts against the carrier plate limiting block after moving to the left to the extreme position.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows: the device is placed on a workbench to combine the cover side and the table side of the magnet substrate, and a semi-automatic packaging method is used to replace the manual operation method.

[0013] After improvement - semi-automatic operation (magnet substrate covering): The improved buckle cooperates with the cover plate and the buffer to fix the substrate, and the suction force generated by the magnet will not cause any influence; this device allows manual labor to not touch the substrate during packaging, which can effectively reduce the generation of stains and garbage; when this device is used, 8 substrates are placed at the same time, which takes 7s / pcs, greatly improving the packaging efficiency and reducing manual operation time. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 It is a schematic structural diagram of an automatic substrate packaging device of the present invention.

[0016] Figure 2 It is a schematic diagram of an automatic substrate packaging device of the present invention.

[0017] Figure 3 It is a schematic structural diagram of the first process in an automatic substrate packaging device of the present invention.

[0018] Figure 4 It is a schematic structural diagram of the second process in an automatic substrate packaging device of the present invention.

[0019] Figure 5 It is a schematic structural diagram of the third process in an automatic substrate packaging device of the present invention.

[0020] Figure 6 It is a schematic structural diagram of the fourth step in an automatic substrate packaging device of the present invention.

[0021] Figure 7 It is a schematic structural diagram of the fifth step in an automatic substrate packaging device of the present invention.

[0022] Figure 8 It is a schematic structural diagram of the sixth step in an automatic substrate packaging device of the present invention.

[0023] In the figure: 1-base plate; 2-linear guide rail; 3-carrier plate; 4-disc positioning block; 5-sleeve; 6-cover plate; 7-buffer; 8-buffer fixing block; 9-pneumatic slide; 10-guide shaft; 11-linear bearing; 12-limit pin; 13-optical axis; 14-optical axis fixing block; 15-clip; 16-torsion spring; 17-guide pin; 18-carrier plate limit block; 19-rodless cylinder. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] The automatic substrate bundling device of the present invention comprises a base plate 1, a linear guide rail 2 arranged on the base plate, a carrier plate 3 slidably mounted on the linear guide rail, a rodless cylinder 19 arranged on the base plate and connected to the carrier plate, a plate positioning block 4 arranged on the carrier plate and including several workstations, and a cover plate 6 arranged directly above the base plate. A guide assembly connecting the base plate and the cover plate is arranged between the base plate and the cover plate. A pneumatic slide 9 driving the cover plate to move up and down is arranged on the base plate. When the cover plate is in the initial position, the cover plate is located above the left side of the carrier plate, and when the cover plate is in the working state, the carrier plate is located directly below the cover plate. A buffer 7 is arranged on the cover plate. A buckle 15 for fixing and bundling the cover side of the substrate is arranged on the cover plate. This device is placed on the workbench, and the cover side and the table side of the magnet substrate are merged, and the manual operation method is replaced by a semi-automatic bundling method. After improvement - semi-automatic operation (magnet substrate covering): The improved buckle cooperates with the cover plate and the buffer to fix the substrate, and the suction force generated by the magnet will not cause any influence; this device allows manual labor to not touch the substrate during packaging, which can effectively reduce the generation of stains and garbage; when this device is used, 8 substrates are placed at the same time, which takes 7s / pcs, greatly improving the packaging efficiency and reducing manual operation time.

[0026] The above-mentioned carrier plate is provided with a shaft sleeve 5, and the cover plate is provided with a guide pin 17. When the cover plate is in working state, the guide pin shaft is located in the shaft sleeve. The above-mentioned guide assembly includes a guide shaft 10 vertically arranged with a central axis, and a linear bearing 11 arranged on the guide shaft. The above-mentioned buckle is installed on the optical axis 13, and the optical axis is installed on the cover plate through an optical axis fixing block 14. The optical axis is provided with a torsion spring 16 for adjusting the buckle to hook and release the substrate, and the optical axis is provided with a limit 12 for limiting the rotation angle of the buckle. The above-mentioned cover plate is provided with a buffer fixing block 8 for fixing the buffer. The above-mentioned base plate is provided with a carrier plate limit block 18, and the carrier plate rests on the carrier plate limit block after moving to the extreme position to the left.

[0027] The working process is as follows: Figure 3 As shown in the figure, place the substrate cover side on the carrier at the discharge position according to the specified direction; Figure 4 As shown, the rodless cylinder moves the carrier to the substrate bundling position (left); Figure 5 As shown, the pneumatic slide connected to the cover plate descends, and the cover side is hooked by the buckle and fixed on the cover plate (the buckle is opened outward after contacting the edge of the cover side by the force of the descending cylinder, and the torsion spring returns the buckle to its position after the cover plate reaches the bottom, thereby fixing the cover side of the substrate); as shown Figure 6 As shown, the cover plate is hooked and fixed on the top, and the rodless cylinder pushes the carrier plate to the pick-up and placement position, and the extraction tray filled with lenses is placed at the designated position of the carrier plate; Figure 7 As shown in the figure, the rodless cylinder pushes the carrier plate to the inside of the device for closing (left); Figure 8As shown, the cover plate descends, and the buckle is slowly opened by utilizing the interference between the table side and the buckle. The cover side and the buckle are gradually separated. Under the action of the mutual attraction of the magnets, the cover side moves along the pin position and docks with the pin hole on the table side to complete the covering.

[0028] The above is only a specific implementation method of the patent of the present invention, but the protection scope of the patent of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solution and concept of the patent of the present invention within the scope disclosed by the patent of the present invention, which falls within the protection scope of the patent of the present invention.

Claims

1. An automatic substrate packaging device, characterized in that: The automatic substrate strapping device comprises a bottom plate, a linear guide rail arranged on the bottom plate, a carrier plate slidably mounted on the linear guide rail, a rodless cylinder arranged on the bottom plate and connected to the carrier plate, a tray positioning block arranged on the carrier plate and including several workstations, and a cover plate arranged directly above the bottom plate, a guide assembly connecting the bottom plate and the cover plate is arranged between the bottom plate and the cover plate, a pneumatic slide table driving the cover plate to move up and down is arranged on the bottom plate, the cover plate is located above the left side of the carrier plate when the cover plate is in the initial position, and the carrier plate is located directly below the cover plate when the cover plate is in the working state; a buffer is arranged on the cover plate; a buckle is arranged on the cover plate to realize the fixing and strapping of the substrate cover side; The carrier plate is provided with a shaft sleeve, the cover plate is provided with a guide pin, and the guide pin shaft is located in the shaft sleeve when the cover plate is in the working state; The guide assembly comprises a guide shaft with a central axis vertically arranged, and a linear bearing arranged on the guide shaft; The buckle is mounted on the optical axis, and the optical axis is mounted on the cover plate through an optical axis fixing block; A torsion spring for adjusting the buckle to hook and release the substrate is arranged on the optical axis; A limit pin for limiting the rotation angle of the buckle is arranged on the optical axis.

2. The automatic substrate packaging device according to claim 1, characterized in that: The cover plate is provided with a buffer fixing block for fixing the buffer.

3. The automatic substrate packaging device according to claim 1, characterized in that: The bottom plate is provided with a carrier plate limiting block, and the carrier plate abuts against the carrier plate limiting block after moving to the left to the limit position.

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