Optical integrated packaging semiconductor light source device

Abstract

The present invention relates to the technical field of optical integrated devices, and specifically discloses an optical integrated packaged semiconductor light source device with high light extraction efficiency and low device heat generation. The optical integrated packaged semiconductor light source device comprises a substrate, an optical lens, an LED chip and a light-transmitting adhesive layer. A circuit is provided on the substrate, the optical lens is fixedly connected to the substrate, a light source cavity is provided between the optical lens and the substrate, the LED chip and the light-transmitting adhesive layer are respectively accommodated in the light source cavity, the LED chip is arranged on the top of the circuit and is electrically connected to the circuit, the light-transmitting adhesive layer is at least arranged on the upper surface of the LED chip, and the light-transmitting adhesive layer is used to reduce the Fresnel loss when the LED chip extracts light; the outer surface of the light-transmitting adhesive layer is a convex arc surface, and the convex arc surface is used to reduce the total reflection loss of light emitted by the LED chip.

Description

Technical Field

[0001] The present invention relates to the technical field of optical integrated devices, and in particular to an optical integrated packaged semiconductor light source device. Background Art

[0002] LED is a lighting device that combines many advantages such as small size, low power consumption, high brightness, environmental protection, durability and long service life. In order to improve the quality of the product's light spot and make the product thinner and smaller, some packaging factories have combined secondary lenses with LED chips. Specifically, by designing a small optical lens above the LED chip, the refraction of light by the optical lens is used to adjust the shape of the light spot generated by the LED chip and improve the quality of the light spot. In other words, the function of the lens is integrated into the LED chip to complete the chip-level optical lens design.

[0003] However, in traditional optical lens-type light source devices, the Fresnel loss of the light emitted by the LED chip is large after passing through the air interface with a refractive index of 1, and the light extraction efficiency of the LED chip is only about 70%, resulting in a huge waste of light energy; in addition, the unextracted part of the light energy in the optical lens will be converted into heat energy, causing the temperature of each component to rise. If the device is in an overheated state for a long time, it will easily accelerate the aging of the device, thereby shortening the service life of the device. Summary of the invention

[0004] Based on this, it is necessary to provide an optically integrated packaged semiconductor light source device with high light extraction efficiency and low device heat generation to address the technical problems of low light extraction efficiency and accelerated aging of devices due to overheating.

[0005] An optically integrated packaged semiconductor light source device comprises a substrate, an optical lens, an LED chip and a light-transmitting adhesive layer, wherein a circuit is arranged on the substrate, the optical lens is fixedly connected to the substrate, a light source cavity is provided between the optical lens and the substrate, the LED chip and the light-transmitting adhesive layer are respectively accommodated in the light source cavity, the LED chip is arranged on the top of the circuit and is electrically connected to the circuit, the light-transmitting adhesive layer is at least arranged on the upper surface of the LED chip, and the light-transmitting adhesive layer is used to reduce the Fresnel loss when light from the LED chip is extracted; the outer surface of the light-transmitting adhesive layer is a convex arc surface, and the convex arc surface is used to reduce the total reflection loss of light emitted by the LED chip.

[0006] In one of the embodiments, the light-transmitting adhesive layer is arranged above the LED chip, and the light-transmitting adhesive layer is coated on the LED chip in one of the following ways: coating the upper surface of the LED chip; coating the upper surface and side surfaces of the LED chip; and coating the upper surface and side surfaces of the LED chip and connecting to the substrate.

[0007] In one of the embodiments, the optical integrated package semiconductor light source device further includes a wire, which is half-covered in the light-transmitting adhesive layer and is electrically connected to the circuit and the LED chip respectively.

[0008] In one of the embodiments, the curvature of each location on the convex arc surface is adapted to the shape and size of the LED chip, so as to increase the total reflection angle of light passing through the convex arc surface and reduce the total reflection loss.

[0009] In one of the embodiments, the light-transmitting adhesive layer is formed by pre-setting the light-transmitting adhesive in a mold of a predetermined shape and pressing the light-transmitting adhesive with the substrate.

[0010] In one embodiment, the light-transmitting adhesive layer is mixed with microparticles, and the microparticles include one or more of diffusion powder particles, fluorescent powder particles or colorant particles.

[0011] In one embodiment, at least one of the inner and outer optical interfaces of the optical lens is a free-form surface.

[0012] In one of the embodiments, the material of the light-transmitting adhesive layer and the optical lens is silicone or resin with a refractive index greater than .

[0013] In one embodiment, the side section of the optical lens and the side section of the substrate are parallel to each other and are both sections formed by metal or laser cutting.

[0014] In one of the embodiments, the bottom of the optical lens having the light source cavity is sealed and connected to the substrate.

[0015] The optically integrated packaged semiconductor light source device of the present invention is implemented by arranging a light-transmitting adhesive layer with a convex arc outer surface on the LED chip. When the light emitted from the LED chip passes through the light-transmitting adhesive layer, since the refractive index of the light-transmitting adhesive layer is greater than the refractive index of air, the emitted light will be refracted at the outer surface of the light-transmitting adhesive layer, so that the light emitted by the LED chip is deflected toward the top of the LED chip. The arrangement of the convex arc surface is beneficial to increasing the total reflection angle of the emitted light and reducing the total reflection loss of the emitted light, thereby improving the light extraction efficiency and the light energy utilization rate. In addition, while the light extraction efficiency of the light source device is increased, the amount of light that can be converted into heat energy in the optical lens is reduced, thereby reducing the heat generation of the light source device, and the temperature rise of the light source device is small, thereby delaying the aging rate of the light source device and extending its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic cross-sectional structure diagram of an optical integrated package semiconductor light source device in one embodiment of the present invention;

[0017] Figure 2 It is a schematic cross-sectional structure diagram of an optically integrated packaged semiconductor light source device in another embodiment of the present invention. DETAILED DESCRIPTION

[0018] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0019] See also Figure 1 The present invention provides an optical integrated package semiconductor light source device 10, which includes a substrate 100 provided with a circuit 300, an optical lens 200, an LED chip 400 and a light-transmitting adhesive layer 500, the optical lens 200 is fixedly connected to the substrate 100, a light source cavity 600 is provided between the optical lens 200 and the substrate 100, the LED chip 400 and the light-transmitting adhesive layer 500 are respectively accommodated in the light source cavity 600, the LED chip 400 is arranged on the top of the circuit 300 and is electrically connected to the circuit 300, the light-transmitting adhesive layer is at least arranged on the upper surface of the LED chip 400, and the light-transmitting adhesive layer 500 is used to reduce the Fresnel loss when the light of the LED chip 400 is taken out; the outer surface of the light-transmitting adhesive layer 500 is a convex arc surface, and the convex arc surface is used to reduce the total reflection loss of the light emitted by the LED chip 400.

[0020] The optically integrated packaged semiconductor light source device 10 of the present invention is implemented by setting a translucent adhesive layer 500 with a convex arc surface on the LED chip 400. When the light emitted from the LED chip 400 passes through the translucent adhesive layer 500, since the refractive index of the translucent adhesive layer 500 is greater than the refractive index of air, the emitted light will be refracted at the outer surface of the translucent adhesive layer 500, so that the light emitted from the LED chip 400 is deflected toward the top of the LED chip 400. The setting of the convex arc surface is beneficial to increase the total reflection angle of the emitted light and reduce the total reflection loss of the emitted light, thereby improving the light extraction efficiency and the light energy utilization rate; in addition, while the light extraction efficiency of the light source device is increased, the amount of light that can be converted into heat energy in the optical lens 200 is reduced, thereby reducing the heat generation of the light source device, and the temperature rise of the light source device is small, thereby delaying the aging rate of the light source device and extending its service life.

[0021] The substrate 100 is used to fix the optical lens 200, and together with the optical lens 200, forms a light source cavity 600, so as to facilitate the installation of the LED chip 400 and the light-transmitting adhesive layer 500, etc. The circuit 300 is set on the substrate 100 by printing. In actual production, the circuit 300 can also be set on the substrate 100 by electroplating or etching, etc., which will not be repeated here. In addition, the substrate 100 is also used to connect with external environmental elements, such as welding with environmental elements, to achieve the installation and setting of the light source device. It should be noted that in actual production, the substrate 100 can be made of plastic material, ceramic or metal material, and of course other materials. It is selected according to the production conditions and the applicable scenarios of the light source device, which will not be repeated here.

[0022] The optical lens 200 is used to refract the light emitted through the light-transmitting adhesive layer 500 to adjust the size and shape of the light spot formed by the emitted light, and further improve the quality of the light spot to meet the needs of users. Specifically, during the operation of the LED chip 400, the light emitted by the LED chip 400 is incident from the inner surface of the optical lens 200, enters the optical lens 200, and then is emitted from the outer surface of the optical lens 200. The light is regulated through the interface between the inner surface and the outer surface of the optical lens 200, which is more conducive to light type control and can make the light spot more uniform in the effective area. It should be noted that in one embodiment, at least one of the inner and outer optical interfaces of the optical lens 200 is a free-form surface, that is, the inner surface and the outer surface of the top of the optical lens 200 can be curved surfaces at the same time, or one of the two is a curved surface and the other is a plane; and the curved surface can be either a concave curved surface or a convex curved surface. When the inner surface and the outer surface of the top of the optical lens 200 are curved surfaces at the same time, the concave and convex directions of the inner surface and the outer surface can be the same or different. In addition, optical lenses 200 of different specifications of inner and outer surface curvature radii can be produced according to the light spot quality expected by the user to meet the needs of the user, which will not be described in detail here. In one embodiment, the optical lens 200 is made of silicone or resin with a refractive index greater than 1.4. Both silicone and resin are easy-to-form materials, which can reduce the difficulty of processing the optical lens 200. In addition, silicone and resin have good light transmittance, which is conducive to reducing light energy loss.

[0023] Furthermore, the bottom of the optical lens 200 has a non-optical functional part 210, and the non-optical functional part 210 is fixedly connected to the substrate 100. This part cannot refract the light generated by the LED chip 400 or realize light adjustment, and is only used to install the optical lens 200. While ensuring the stability of the connection between the optical lens 200 and the substrate 100, it prevents the substrate 100 from affecting the light emitting effect of the optical lens 200, thereby ensuring the reliability of the light source device in improving the light extraction efficiency of the LED chip 400. Preferably, the bottom of the optical lens 200 having the light source cavity 600 is sealed and connected to the substrate 100, that is, the light source cavity 600 is relatively independent of the external environment and is not connected. In this way, it is avoided that the dust and impurities in the external air enter the light source cavity 600 through the gap at the connection between the optical lens 200 and the substrate 100, causing the light to be diffracted or scattered at the dust and impurities, so as to improve the quality of the emitted light spot. In addition, by sealing the bottom of the optical lens 200 with the substrate 100 , leakage damage to the LED chip 400 caused by external water stains entering the light source cavity 600 is avoided, which is beneficial to extending the service life of the light source device.

[0024] In one embodiment, the side section of the optical lens 200 and the side section of the substrate 100 are parallel to each other and are both sections formed by metal or laser cutting. Preferably, the side section of the optical lens 200 and the side section of the substrate 100 are located in the same plane. In this way, when processing the light source device, only the cutting distance of the cutter or laser cutting machine needs to be set or there is no need to adjust the cutting distance, so as to realize the cutting processing of the optical lens 200 and the substrate 100, thereby avoiding the problem of increased workload caused by repeated adjustment of the cutting angle of the cutter and the laser cutting machine, which is conducive to improving the processing efficiency of the light source device.

[0025] The circuit 300 is used to be electrically connected to an external power source and control the LED chip 400 to emit light. In one embodiment, the optical integrated package semiconductor light source device also includes a wire 700, which is half-covered in the light-transmitting adhesive layer 500 and electrically connected to the circuit 300 and the LED chip 400, respectively, that is, one end of the wire 700 is electrically connected to the circuit 300 and exposed in the light source cavity 600, and the other end of the wire 700 is covered by the light-transmitting adhesive layer 500 and electrically connected to the LED chip 400. In this way, the connection between the wire 700 and the LED chip 400 is fixed to prevent the connection between the wire 700 and the LED chip 400 from being disconnected when the light source device is vibrated by an external force. In other words, the stability of the connection between the wire 700 and the LED chip 400 is improved.

[0026] The LED chip 400 is used to emit light when powered. Specifically, the LED chip 400 is a solid-state semiconductor device having a PN junction inside. When current acts on the LED chip 400, electrons are pushed from the N region of the PN junction of the LED chip 400 to the P region, and recombine with holes in the P region, and then emit energy in the form of photons, thereby emitting light.

[0027] The light-transmitting adhesive layer 500 is used to refract the light emitted by the LED chip 400 to reduce the Fresnel loss of the light emitted by the LED chip 400, thereby improving the light extraction efficiency of the LED chip 400. Specifically, due to the low refractive index of air, when the light emitted by the LED chip 400 enters the light source cavity 600, the amount of light reflected at the interface between the LED chip 400 and the light source cavity 600 is large when the light-transmitting adhesive layer 500 is not provided. In this way, the total amount of light energy emitted from the LED chip 400 to the light source cavity 600 is reduced, that is, the Fresnel loss of the light emitted by the LED chip 400 during the propagation process is large, which in turn makes the light extraction efficiency of the LED chip 400 low, affecting the light spot quality of the light emitted by the LED chip 400. When the light-transmitting adhesive layer 500 is provided, preferably, the light-transmitting adhesive layer 500 is made of molded glass or silicone or resin with a refractive index greater than 1.4. Since the refractive index of the above material is relatively large, the reflection amount of the light emitted by the LED chip 400 when passing through the light-transmitting adhesive layer 500 is greatly reduced, and the Fresnel loss of the light emitted by the LED chip 400 during the propagation process is reduced, thereby improving the light extraction efficiency of the LED chip 400.

[0028] Furthermore, by providing a light-transmitting adhesive layer 500, when the light emitted by the LED chip 400 propagates to the light-transmitting adhesive layer 500 and the input power of the LED chip 400 is determined, the size of the LED chip 400 and the size of the optical lens 200 can be appropriately reduced, that is, the overall size of the light source device can be reduced, and the light type and light spot quality of the light emitted by the light source device can still be guaranteed, thereby promoting the development of the light source device towards miniaturization.

[0029] In addition, by setting the outer surface of the light-transmitting adhesive layer 500 to a convex curved surface, when the light emitted by the LED chip 400 is emitted through the convex curved surface, the total reflection angle of the emitted light increases, which is beneficial to reduce the total reflection loss of the emitted light, thereby improving the light extraction efficiency. In one embodiment, the curvature of each part of the convex curved surface is adapted to the shape and size of the LED chip 400, and is used to increase the total reflection angle of the light passing through the convex curved surface and reduce the total reflection loss. For example, the convex curved surface is a spherical surface, an ellipsoidal surface or a free-form surface whose curvature at each part is adapted to the shape and size of the LED chip 400. In the process of the light emitted by the LED chip 400 propagating through the light-transmitting adhesive layer 500, the light less than the critical angle of the outer surface of the light-transmitting adhesive layer 500 can be completely emitted, that is, total reflection occurs. By setting the outer surface of the light-transmitting adhesive layer 500 to a convex curved surface whose curvature at each location matches the shape and size of the LED chip 400, the critical angle of the outer surface of the light-transmitting adhesive layer 500, that is, the total reflection angle, is greatly increased. In this way, more light will be completely emitted from the outer surface of the light-transmitting adhesive layer 500, thereby further reducing the total reflection loss of the light emitted by the LED chip 400, and achieving the purpose of improving the light extraction efficiency of the LED chip 400. It should be noted that the curvature at each location on the convex curved surface disclosed in this embodiment is adapted to the shape and size of the LED chip 400, which means that the shape of the convex curved surface is designed according to the shape and size of the LED chip 400 combined with the light propagation theory, so that the total reflection angle of the light emitted from each location on the LED chip 400 and emitted from the corresponding portion of the convex curved surface reaches the maximum, thereby minimizing the total reflection loss of the emitted light to the greatest extent, and achieving the purpose of improving the light extraction efficiency. This embodiment only shows the case where the light-transmitting adhesive layer 500 is a spherical surface, an ellipsoidal surface or a free-form surface. In actual production, depending on the shape and size of the LED chip 400, the production process conditions and the production capacity, the outer surface of the light-transmitting adhesive layer 500 can also be a convex ellipsoidal surface or other other curved surfaces of other shapes, which will not be repeated here.

[0030] In one embodiment, the light-transmitting adhesive layer 500 is disposed above the LED chip 400, and the light-transmitting adhesive layer 500 is coated on the LED chip 400 in one of the following ways: coating the upper surface of the LED chip 400; coating the upper surface and side surfaces of the LED chip 400; and coating the upper surface and side surfaces of the LED chip 400 and connecting with the substrate 100. The above three coating methods can be achieved by setting the light-transmitting adhesive in a mold of a predetermined shape and pressing it with the substrate 100 while adjusting the amount of adhesive. Specifically, the light-transmitting adhesive is loaded into a mold of a predetermined shape, and then the substrate 100 equipped with the LED chip 400 is turned over and pressed onto the mold, so that the LED chip 400 contacts the light-transmitting adhesive in the mold until the light-transmitting adhesive is solidified on the top of the LED chip 400, thereby achieving the connection between the light-transmitting adhesive layer 500 and the LED chip 400.

[0031] In another embodiment, the light-transmitting glue can be dripped onto the upper surface of the LED chip 400, that is, the top of the LED chip 400, and the light-transmitting glue is solidified to form a light-transmitting glue layer 500. In this case, the light-transmitting glue layer 500 is firmly combined with the top of the LED chip 400 to facilitate the refraction of the light emitted by the LED chip 400. During the process of dripping the light-transmitting glue, the light-transmitting glue is naturally formed into the light-transmitting glue layer 500 under the action of gravity and surface tension, which reduces the processing difficulty of the light source device and is conducive to the large-scale production of the product. In addition, the side of the light-transmitting glue layer 500 formed by the natural molding of the light-transmitting glue can refract the light emitted by the LED chip 400, so that part of the light is deflected toward the top of the LED chip 400, thereby reducing the lateral light-emitting angle of the LED chip 400, thereby reducing the difficulty of the light collection design of the optical lens 200.

[0032] It should be noted that when the light-transmitting adhesive layer 500 covers the upper surface and side surfaces of the LED chip 400 and is connected to the substrate 100, on the premise that the light-transmitting adhesive layer 500 refracts the light emitted by the LED chip 400, the light-transmitting adhesive layer 500 is simultaneously connected to the LED chip 400 and the substrate 100, thereby increasing the installation area of ​​the light-transmitting adhesive layer 500 and preventing the light-transmitting adhesive layer 500 from falling off the LED chip 400, so as to ensure the reliability of the light source device of this embodiment in improving the light extraction efficiency of the LED chip 400.

[0033] In one embodiment, the light-transmitting adhesive layer 500 is mixed with microparticles, and the microparticles include one or more of diffusion powder particles, fluorescent powder particles or colorant particles. Specifically, during the processing of the light-transmitting adhesive layer 500, the microparticles are added to the light-transmitting adhesive and stirred sufficiently to make the microparticles uniformly dispersed in the light-transmitting adhesive, thereby obtaining a light-transmitting adhesive layer 500 in which the microparticles are uniformly dispersed. The diffusion powder particles are a dispersant with excellent performance and have a good light-homogenizing effect. They can homogenize the light emitted by the LED chip 400 to weaken the influence of the electrode pattern imaging in the LED chip 400 on the emitted light, so as to improve the quality of the light spot. The fluorescent powder particles can homogenize the light emitted by the LED chip 400, and can also convert the light emitted by the LED chip 400 into white light, that is, to improve the brightness of the light emitted by the LED chip 400. The colorant particles have light shielding properties and can shield the light in a specific wavelength range, so that the light emitted through the optical lens 200 presents a specific color, thereby achieving the purpose of controlling the light color.

[0034] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0035] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. An optically integrated packaged semiconductor light source device (10), characterized in that: It comprises a substrate (100), an optical lens (200), an LED chip (400) and a light-transmitting adhesive layer (500). The substrate (100) is provided with a circuit (300); the optical lens (200) is fixedly connected to the substrate (100); a light source cavity (600) is provided between the optical lens (200) and the substrate (100); the LED chip (400) and the light-transmitting adhesive layer (500) are respectively accommodated in the light source cavity (600); the LED chip (400) is arranged on the top of the circuit (300) and is electrically connected to the circuit (300); the light-transmitting adhesive layer is at least arranged on the upper surface of the LED chip (400); the light-transmitting adhesive layer (500) is used to reduce Fresnel loss when light from the LED chip (400) is extracted; the outer surface of the light-transmitting adhesive layer (500) is a convex arc surface; the convex arc surface is used to reduce the total reflection loss of light emitted by the LED chip (400); The side surface of the light-transmitting adhesive layer (500) formed by the natural molding of the light-transmitting adhesive refracts the light emitted by the LED chip (400), causing part of the light to be deflected toward the top of the LED chip (400), thereby reducing the lateral light-emitting angle of the LED chip (400).

2. The optical integrated package semiconductor light source device (10) according to claim 1, characterized in that: The light-transmitting adhesive layer (500) is arranged above the LED chip (400), and the light-transmitting adhesive layer (500) covers the LED chip (400) in the following manner: only covers the upper surface of the LED chip (400); or only covers the upper surface and side surfaces of the LED chip (400).

3. The optically integrated packaged semiconductor light source device (10) according to claim 1, characterized in that: The light-transmitting adhesive layer (500) is arranged above the LED chip (400), and the light-transmitting adhesive layer (500) covers the LED chip (400) in the following manner: covers the upper surface and side surfaces of the LED chip (400) and is connected to the substrate (100).

4. The optical integrated package semiconductor light source device (10) according to claim 1, characterized in that: The optical integrated package semiconductor light source device (10) further comprises a wire (700), wherein the wire (700) is half-covered in the light-transmitting adhesive layer (500) and is electrically connected to the circuit (300) and the LED chip (400) respectively.

5. The optical integrated package semiconductor light source device (10) according to claim 1, characterized in that: The curvature of each location on the convex curved surface is adapted to the shape and size of the LED chip (400), and is used to increase the total reflection angle of light passing through the convex curved surface, thereby reducing total reflection losses.

6. The optically integrated packaged semiconductor light source device (10) according to claim 1, characterized in that: The light-transmitting adhesive layer (500) is mixed with microparticles, and the microparticles include one or more of diffusion powder particles, fluorescent powder particles or colorant particles.

7. The optically integrated packaged semiconductor light source device (10) according to claim 1, characterized in that: At least one of the inner and outer optical interfaces of the optical lens (200) is a free-form surface.

8. The optically integrated packaged semiconductor light source device (10) according to claim 1, characterized in that: The material of the light-transmitting adhesive layer (500) and the optical lens (200) is silicone or resin with a refractive index greater than 1.

4.

9. The optical integrated package semiconductor light source device (10) according to claim 1, characterized in that: The side section of the optical lens (200) and the side section of the substrate (100) are parallel to each other and are both sections formed by metal or laser cutting.

10. The optical integrated package semiconductor light source device (10) according to claim 1, characterized in that: The bottom of the optical lens (200) having the light source cavity (600) is sealed and connected to the substrate (100).

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