Inertial sensor device and method for manufacturing the same

Abstract

The present invention relates to an inertial sensor device and a method for manufacturing an inertial sensor device. The inertial sensor device comprises: a first sensor module having a first inertial sensor that outputs a first signal related to a plurality of first detection axes and a first correction circuit that generates a first correction signal by correcting the first signal in a manner that makes the plurality of first detection axes orthogonal to each other; a second sensor module having a second inertial sensor that outputs a second signal related to a plurality of second detection axes and a second correction circuit that generates a second correction signal by correcting the second signal in a manner that makes the plurality of second detection axes orthogonal to each other; a matching processing unit that generates a first matching signal by applying a first correction coefficient that matches the plurality of first detection axes with the plurality of second detection axes to the first correction signal; and a synthesis processing unit that synthesizes the first matching signal and the second correction signal and outputs them.

Description

Technical Field

[0001] The present invention relates to an inertial sensor device and a method for manufacturing the inertial sensor device. Background Art

[0002] Patent Document 1 discloses a physical quantity detection circuit that converts a detection signal input from a terminal connected to a plurality of physical quantity detection elements into a voltage, thereby generating a physical quantity signal having a noise component whose magnitude is inversely proportional to the square root of the number of physical quantity detection elements.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-60689

[0004] However, according to the technology described in Patent Document 1, when detecting axis misalignment between a plurality of physical quantity detection elements, there is a possibility that the detection accuracy of the physical quantity may deteriorate. Summary of the Invention

[0005] On the one hand, an inertial sensor device comprises: a first sensor module having a first inertial sensor and a first correction circuit, the first inertial sensor outputting a first signal associated with a plurality of first detection axes, the first correction circuit generating a first correction signal by correcting the first signal in a manner that makes the plurality of first detection axes orthogonal to each other; a second sensor module having a second inertial sensor and a second correction circuit, the second inertial sensor outputting a second signal associated with a plurality of second detection axes, the second correction circuit generating a second correction signal by correcting the second signal in a manner that makes the plurality of second detection axes orthogonal to each other; a matching processing unit generating a first matching signal by applying a first correction coefficient to the first correction signal, the first correction coefficient matching (calibrating) the plurality of first detection axes with the plurality of second detection axes; and a synthesis processing unit synthesizing and outputting the first matching signal and the second correction signal.

[0006] On the other hand, an inertial sensor device comprises: a first sensor module having a first inertial sensor and a first correction circuit, the first inertial sensor outputting a first signal associated with a plurality of first detection axes, the first correction circuit generating a first correction signal by correcting the first signal in a manner that makes the plurality of first detection axes orthogonal to each other; a second sensor module having a second inertial sensor and a second correction circuit, the second inertial sensor outputting a second signal associated with a plurality of second detection axes, the second correction circuit generating a second correction signal by correcting the second signal in a manner that makes the plurality of second detection axes orthogonal to each other; a matching processing unit generating a first matching signal by applying a first correction coefficient to the first correction signal, and generating a second matching signal by applying a second correction coefficient to the second correction signal, the first correction coefficient matching the plurality of first detection axes with a reference axis, the second correction coefficient matching the plurality of second detection axes with the reference axis; and a synthesis processing unit synthesizing and outputting the first matching signal and the second matching signal.

[0007] On the other hand, a manufacturing method of an inertial sensor device is provided, wherein the inertial sensor device comprises: a first sensor module having a first inertial sensor and a first correction circuit, the first inertial sensor outputting a first signal associated with a plurality of first detection axes, the first correction circuit generating a first correction signal by correcting the first signal in a manner that makes the plurality of first detection axes orthogonal to each other; a second sensor module having a second inertial sensor and a second correction circuit, the second inertial sensor outputting a second signal associated with a plurality of second detection axes, the second correction circuit generating a second correction signal by correcting the second signal in a manner that makes the plurality of second detection axes orthogonal to each other; a matching processing unit generating a first matching signal by applying a first correction coefficient to the first correction signal; and a synthesis processing unit synthesizing and outputting the first matching signal and the second correction signal, the manufacturing method comprising: calculating the first correction coefficient for matching the plurality of first detection axes with the plurality of second detection axes by comparing the first correction signal with gravitational acceleration, and comparing the second correction signal with gravitational acceleration.

[0008] Another aspect provides a method for manufacturing an inertial sensor device, wherein the inertial sensor device includes: a first sensor module having a first inertial sensor and a first correction circuit, the first inertial sensor outputting first signals associated with a plurality of first detection axes, the first correction circuit generating a first correction signal by correcting the first signals so that the plurality of first detection axes are orthogonal to each other; a second sensor module having a second inertial sensor and a second correction circuit, the second inertial sensor outputting second signals associated with a plurality of second detection axes, the second correction circuit generating a second correction signal by correcting the second signals so that the plurality of second detection axes are orthogonal to each other; a matching processing unit generating a first matching signal by applying a first correction coefficient to the first correction signal and generating a second matching signal by applying a second correction coefficient to the second correction signal; and a combining processing unit combining the first matching signal and the second matching signal and outputting the result. The manufacturing method includes: calculating the first correction coefficient for matching the plurality of first detection axes with a reference axis by comparing the first correction signal with gravitational acceleration; and calculating the second correction coefficient for matching the plurality of second detection axes with the reference axis by comparing the second correction signal with gravitational acceleration. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 A perspective view illustrating an inertial sensor device according to an embodiment.

[0010] Figure 2 A top view illustrating the interior of the inertial sensor device.

[0011] Figure 3 This is an exploded perspective view illustrating the substrate and sensor module.

[0012] Figure 4 An exploded perspective view showing a sensor module.

[0013] Figure 5 It is a plan view showing a circuit board included in the sensor module.

[0014] Figure 6 for Figure 5 A bottom view of the circuit substrate is shown.

[0015] Figure 7 A block diagram illustrating an inertial sensor device.

[0016] Figure 8 A block diagram illustrating the sensor module.

[0017] Figure 9 A flow chart illustrating the method for determining the correction coefficient.

[0018] Figure 10 It is a perspective view illustrating an inertial sensor device according to a first modified example of the embodiment.

[0019] Figure 11 It is a perspective view illustrating an inertial sensor device according to a second modified example of the embodiment.

[0020] Figure 12 It is a perspective view illustrating an inertial sensor device according to a third modified example of the embodiment.

[0021] Description of Reference Numerals

[0022] 1. 1A to 1C: inertial sensor device; 2. 2A to 2C: sensor module; 3: storage device; 20: inertial sensor; 24: circuit substrate; 26a: first angular velocity sensor; 26b: second angular velocity sensor; 26c: third angular velocity sensor; 27. 27A to 27C: acceleration sensor; 28: correction circuit; 100: processing circuit; 101: matching processing unit; 102: synthesis processing unit. DETAILED DESCRIPTION

[0023] The following describes embodiments of the present invention with reference to the accompanying drawings. The embodiments illustrate, by way of example, devices and methods for embodying the technical concept of the present invention. The technical concept of the present invention does not specify the material, shape, structure, configuration, etc. of the constituent components as described below. In the accompanying drawings, identical or similar elements are marked with identical or similar reference numerals, and repeated descriptions are omitted. The accompanying drawings are schematic and may include differences from actual dimensions, relative ratios of dimensions, configurations, structures, etc.

[0024] It should be noted that the following definitions of directions such as up, down, left, and right are merely for ease of explanation and are not intended to limit the technical concepts of the present invention. For example, if the observed object is rotated 90° with the line of sight as the axis, up and down will naturally be translated into left and right, and left and right will naturally be translated into up and down. If the object is rotated 180°, up and down and left and right will naturally be reversed. The technical concepts of the present invention can be modified in various ways within the technical scope of the claims.

[0025] like Figures 1 to 3As shown, an inertial sensor device 1 according to an embodiment includes, for example, a substrate 10, a first sensor module 2A, a second sensor module 2B, and a third sensor module 2C mounted on the substrate 10, a processing circuit 100, and a container 9. The inertial sensor device 1 is a composite sensor unit comprising multiple inertial sensors that detect acceleration in three axes and angular velocity about those three axes. The inertial sensor device 1 is used to detect the motion state of various other objects, such as mobile objects such as vehicles, robots, and drones; electronic devices such as smartphones and tablets; and other objects. Motion state includes, for example, position, posture, velocity, acceleration, and angular velocity.

[0026] like Figure 1 as well as Figure 2 As shown, the container 9 includes a base 91 having an upwardly open recess 911, and a lid 92 secured to the base 91 to block the opening of the recess 911. The container 9 is generally rectangular and flat. The base 91 and the lid 92 define a storage space S within the recess 911, which is closed by the lid 92. The storage space S is used to accommodate various components, such as the substrate 10, the first sensor module 2A, the second sensor module 2B, the third sensor module 2C, and the processing circuit 100. The container 9 protects the components stored in the storage space S from dust, moisture, ultraviolet rays, and shock.

[0027] The base 91 and the cover 92 can be made of aluminum (Al). The base 91 and the cover 92 can be made of metal materials such as Al alloy, zinc (Zn), stainless steel, various ceramics, various resin materials, and composite materials thereof.

[0028] The inertial sensor device 1 includes a connector 93 mounted on a side wall of the base 91 and a communication board 931 disposed in the storage space S. The connector 93 is a socket that electrically connects the interior and exterior of the container 9. The communication board 931 includes circuitry that handles communication between the inertial sensor device 1 and other devices.

[0029] The substrate 10 is a circuit board including various components and wiring. The substrate 10 carries the first sensor module 2A, the second sensor module 2B, the third sensor module 2C, the processing circuit 100 , the internal connector 110 , etc. The substrate 10 is fixed relative to the base 91 , for example.

[0030] like Figure 2 and Figure 3As shown, the first sensor module 2A and the second sensor module 2B are arranged along the X-axis on the lower surface of the substrate 10. The third sensor module 2C is arranged on the upper surface of the substrate 10 so as to overlap with the first sensor module 2A when viewed along the Z-axis. The processing circuit 100 and the internal connector 110 are arranged on the upper surface of the substrate 10 so as to overlap with the second sensor module 2B when viewed along the Z-axis. In this way, by efficiently arranging various components according to the area of ​​the substrate 10 and the storage space S, the inertial sensor device 1 can be miniaturized.

[0031] The first sensor module 2A, the second sensor module 2B, and the third sensor module 2C are connected to a processing circuit 100 via a substrate 10. The processing circuit 100 controls the driving of the first sensor module 2A, the second sensor module 2B, and the third sensor module 2C. The processing circuit 100 is connected to the communication board 931 via an internal connector 110 and wiring (not shown) connected to the internal connector 110.

[0032] The first sensor module 2A, the second sensor module 2B, and the third sensor module 2C have, for example, the same structure. Hereinafter, any one of the first sensor module 2A, the second sensor module 2B, and the third sensor module 2C will be referred to simply as a "sensor module 2," and duplicate descriptions will be omitted. The number of sensor modules 2 is not limited to three and can be two or four or more.

[0033] like Figure 4 As shown, the sensor module 2 includes an outer shell 21, an inner shell 22, a bonding member 23, and a circuit board 24. The outer shell 21 has a recess for inserting the inner shell 22. The outer shell 21 and the inner shell 22 are bonded to each other by the bonding member 23 while accommodating and holding the circuit board 24. The sensor module 2 is opened from above, i.e., along the Figure 4 The housing 21 has a square shape when viewed in the direction of the c-axis. The housing 21 has screw holes 211 and 212 provided at a pair of diagonal corners of the upper surface. The sensor module 2 can be fixed to the substrate 10 by screwing through the screw holes 211 and 212.

[0034] like Figure 5 and Figure 6As shown, the circuit board 24 is equipped with a module connector 25, a first angular velocity sensor 26a, a second angular velocity sensor 26b, a third angular velocity sensor 26c, an acceleration sensor 27, a correction circuit 28, and the like. The module connector 25 connects the sensor module 2 to the board 10. The module connector 25 is exposed relative to the board 10, for example, through an opening 221 provided in the inner housing 22. The first angular velocity sensor 26a detects the angular velocity ωa about the a-axis. The second angular velocity sensor 26b detects the angular velocity ωb about the b-axis. The third angular velocity sensor 26c detects the angular velocity ωc about the c-axis. The acceleration sensor 27 detects acceleration Aa along the a-axis, acceleration Ab along the b-axis, and acceleration Ac along the c-axis. Three detection axes, a, b, and c, are defined for each sensor module 2.

[0035] The correction circuit 28 is formed, for example, of an integrated circuit (IC). The correction circuit 28 is connected to the first angular velocity sensor 26a, the second angular velocity sensor 26b, the third angular velocity sensor 26c, and the acceleration sensor 27 via the circuit board 24. The correction circuit 28 is connected to the processing circuit 100 via the circuit board 24, the module connector 25, the substrate 10, and the like.

[0036] The circuit board 24 is, for example, square in shape when viewed from the direction along the c-axis. Assuming that the four quadrants defined around the center O of the circuit board 24 are the first quadrant Q1, the second quadrant Q2, the third quadrant Q3, and the fourth quadrant Q4, the acceleration sensor 27 is disposed in the first quadrant Q1. Figure 3 As shown, the first sensor module 2A, the second sensor module 2B, and the third sensor module 2C are arranged so that their first quadrants Q1 are close to each other.

[0037] That is, in Figure 3 In the example shown, the acceleration sensor 27A of the first sensor module 2A and the acceleration sensor 27C of the third sensor module 2C are arranged so as to overlap when viewed along the Z-axis. The acceleration sensor 27A of the first sensor module 2A and the acceleration sensor 27B of the second sensor module 2B are arranged so as to overlap when viewed along the X-axis. This minimizes the difference in acceleration experienced by the acceleration sensors 27A, 27B, and 27C.

[0038] It should be noted that the module connector 25 is disposed on the upper surface 241 of the circuit substrate 24 in the second quadrant Q2 and the third quadrant Q3. The first angular velocity sensor 26a is disposed on the side surface of the circuit substrate 24 in the fourth quadrant Q4. The second angular velocity sensor 26b is disposed on the side surface of the circuit substrate 24 in the first quadrant Q1. The third angular velocity sensor 26c is disposed on the upper surface 241 of the circuit substrate 24 in the fourth quadrant Q4. The acceleration sensor 27 is disposed on the upper surface 241 of the circuit substrate 24 in the first quadrant Q1. The correction circuit 28 is disposed on the lower surface 242 of the circuit substrate 24 in the third quadrant Q3. The screw hole 211 is disposed in the second quadrant Q2, and the screw hole 212 is disposed in the fourth quadrant Q4.

[0039] like Figure 7 As shown, the inertial sensor device 1 includes a first sensor module 2A, a second sensor module 2B, a third sensor module 2C, and a processing circuit 100, as well as a communication circuit 90 and a storage device 3. The communication circuit 90 is mounted on, for example, a communication board 931. The communication board 931 outputs, for example, inertial data calculated by the processing circuit 100 to another device.

[0040] Processing circuit 100 includes a matching (integration) processing unit 101 and a synthesis processing unit 102 as its logical structure. Circuits constituting at least a portion of processing circuit 100 can include signal processing circuits such as A / D converters, MCUs (microcontroller units), and various logic operation circuits such as application-specific integrated circuits (ASICs). Storage device 3 is, for example, a nonvolatile storage device such as a semiconductor memory. Processing circuit 100 and storage device 3 can be configured as integrated hardware or as separate pieces of hardware.

[0041] like Figure 8 As shown, the sensor module 2 includes an inertial sensor 20, a calibration circuit 28, a communication interface (I / F) 31, and a storage unit 30. The inertial sensor 20 includes at least one of a first angular velocity sensor 26a, a second angular velocity sensor 26b, a third angular velocity sensor 26c, and an acceleration sensor 27. The communication I / F 31 includes a module connector 25. The storage unit 30 stores, for example, various parameters used for calibration in the calibration circuit 28.

[0042] The inertial sensor 20 outputs signals related to multiple detection axes to the correction circuit 28. The correction circuit 28 generates correction signals by correcting the signals output from the inertial sensor 20 so that the multiple detection axes are orthogonal to each other. For example, multiple detection axes forming a three-dimensional orthogonal coordinate system are set for each sensor module 2. Furthermore, the correction circuit 28 corrects offset errors and scale factor errors contained in the signals input from the inertial sensor 20.

[0043] Hereinafter, the inertial sensor 20 included in the nth sensor module is referred to as the nth inertial sensor. The nth sensor module is any one of the first sensor module 2A, the second sensor module 2B, and the third sensor module 2C. Similarly, the correction circuit 28 included in the nth sensor module is referred to as the nth correction circuit. The detection axis set in the nth sensor module is referred to as the nth detection axis. Signals related to multiple nth detection axes are referred to as nth signals, and the nth signal corrected so that the multiple nth detection axes are orthogonal to each other is referred to as the nth correction signal.

[0044] For example, in Figure 8 In the example shown, when the sensor module 2 is the first sensor module 2A, the inertial sensor 20 corresponds to a first inertial sensor that outputs first signals related to a plurality of first detection axes. The correction circuit 28 corresponds to a first correction circuit that generates a first correction signal by correcting the first signal so that the plurality of first detection axes are orthogonal to each other. Similarly, when the sensor module 2 is the second sensor module 2B, the inertial sensor 20 corresponds to a second inertial sensor that outputs second signals related to a plurality of second detection axes. The correction circuit 28 corresponds to a second correction circuit that generates a second correction signal by correcting the second signal so that the plurality of second detection axes are orthogonal to each other.

[0045] Generally speaking, the signals output by the inertial sensor 20 contain angular errors, or misalignment, relative to multiple detection axes due to, for example, misalignment during assembly. Therefore, the correction circuit 28 generates a correction signal by performing misalignment correction on the signals from the inertial sensor 20 using a predetermined correction coefficient, such as a rotation matrix. The correction circuit 28 outputs the correction signal to the processing circuit 100 via the communication interface 31.

[0046] The matching processing unit 101 generates a first matching signal by, for example, applying a first correction coefficient that matches (calibrates) the plurality of first detection axes with the plurality of second detection axes to the first correction signal. That is, the first correction coefficient is a coefficient used to eliminate misalignment of the first correction signal relative to the second correction signal. The first correction coefficient is a coefficient that rotates the plurality of first detection axes in the first correction signal to coincide with the reference axes, with the plurality of second detection axes as reference axes. The first correction coefficient can be any of a rotation matrix, Euler angles, and quaternions. The first correction coefficient is pre-stored in the storage device 3.

[0047] Synthesis processing unit 102 synthesizes and outputs the first matching signal generated by matching processing unit 101 and the second correction signal output from the second sensor module. Specifically, synthesis processing unit 102 generates inertial data by synthesizing the first matching signal and the second correction signal, and outputs the inertial data to an external device via communication circuit 90.

[0048] Furthermore, the matching processing unit 101 may also generate a third matching signal by applying a third correction coefficient that matches the plurality of third detection axes with the plurality of second detection axes to the third correction signal. The third correction coefficient is a coefficient that rotates the plurality of third detection axes in the third correction signal to align with the plurality of second detection axes. The third correction coefficient is pre-stored in the storage device 3. In this case, the synthesis processing unit 102 generates and outputs inertial data by synthesizing the first matching signal, the second correction signal, and the third matching signal.

[0049] As described above, the inertial sensor device 1 corrects the first correction signal output from, for example, the first sensor module 2A, so that the detection axis of any sensor module 2 matches the detection axes of the other sensor modules 2. By eliminating any misalignment in the detection axes between the multiple sensor modules 2, degradation in the detection accuracy of the inertial data can be suppressed. Furthermore, by combining the signals from the multiple sensor modules 2, random noise can be reduced, improving the signal-to-noise ratio.

[0050] Alternatively, the matching processing unit 101 may also match the detection axes of the plurality of sensor modules 2 with other reference axes. For example, the matching processing unit 101 generates a first matching signal by applying a first correction coefficient that matches the plurality of first detection axes with a specified reference axis to the first correction signal output from the first sensor module 2A. In this case, the first correction coefficient is a coefficient for eliminating the misalignment of the first correction signal relative to the reference axis. That is, the first correction coefficient is a coefficient that rotates the plurality of first detection axes in the first correction signal to be consistent with the reference axis. The reference axis is an orthogonal coordinate system pre-set for each inertial sensor device 1, such as Figures 1 to 3 As shown, for example, the three axes may be X, Y, and Z set relative to the substrate 10 .

[0051] Similarly, the matching processing unit 101 generates a second matching signal by applying a second correction coefficient that aligns the plurality of second detection axes with the reference axis to the second correction signal output from the second sensor module 2B. In this case, the second correction coefficient is a coefficient that rotates the plurality of second detection axes so that they align with the reference axis. The first correction coefficient and the second correction coefficient are pre-stored in the storage device 3.

[0052] The synthesis processing unit 102 synthesizes and outputs the first matching signal and the second matching signal generated by the matching processing unit 101. Specifically, the synthesis processing unit 102 generates inertia data by synthesizing the first matching signal and the second matching signal, and outputs the inertia data to an external device via the communication circuit 90.

[0053] Furthermore, the matching processing unit 101 may also generate a third matching signal by applying a third correction coefficient that aligns the plurality of third detection axes with the reference axis to the third correction signal. The third correction coefficient is a coefficient that rotates the plurality of third detection axes in the third correction signal so that they align with the reference axis. The third correction coefficient is pre-stored in the storage device 3. In this case, the synthesis processing unit 102 generates and outputs inertial data by synthesizing the first matching signal, the second matching signal, and the third matching signal.

[0054] Reference Figure 9 , an example of a method for determining a correction coefficient will be described as a method for manufacturing the inertial sensor device 1 according to an embodiment. The matching processing unit 101 has a first mode for outputting a matching signal generated by applying a correction coefficient to a correction signal output from the sensor module 2, and a second mode for outputting a correction signal by passing the correction signal output from the sensor module 2 unchanged.

[0055] The following describes, by way of example, how the first correction coefficient is determined based on the first correction signal output from the first sensor module 2A. First, as a prerequisite, the first sensor module 2A is set to a reference posture. For example, the reference postures may be a first posture with the Z-axis of the first sensor module 2A as the direction of gravity, or a second posture with the X-axis of the first sensor module 2A as the direction of gravity. For example, the reference posture is the posture when a predetermined surface of the container 9 is placed on a horizontal surface.

[0056] In step S1, the processing circuit 100 transitions to the second mode. This transition to the second mode can be executed, for example, in response to a command received from another device via the communication circuit 90 or in response to the operation of a switch provided on the circuit board 24. The matching processing unit 101 applies a unit element to the first correction signal input from the first sensor module 2A instead of applying the first correction coefficient, thereby outputting the first correction signal in the second mode. For example, if the first correction signal is a matrix, the unit element is the unit matrix.

[0057] In step S2, the processing circuit 100 obtains the first correction signal output from the matching processing unit 101 as a module signal. In step S3, the processing circuit 100 compares the first correction signal with the gravitational acceleration to calculate a first correction coefficient for matching the multiple first detection axes with the reference axis. The reference axis can be multiple second detection axes or another reference axis set relative to the substrate 10, etc. For example, if the acceleration to be ideally measured in the reference posture is gravitational acceleration, the value obtained by applying the first correction coefficient to the first correction signal (measured value) is gravitational acceleration, so the first correction coefficient can be calculated based on the gravitational acceleration and the first correction signal.

[0058] In step S4, processing circuit 100 stores the first correction coefficient calculated in step S3 in storage device 3. The first correction coefficient stored in storage device 3 is used by matching processing unit 101 to generate a first matching signal. The first correction coefficient in inertial sensor device 1 is determined as described above.

[0059] Similarly, when determining the second correction coefficients, the matching processing unit 101 applies the unit element to the second correction signal in the second mode and outputs the result. The processing circuit 100 compares the second correction signal with the gravitational acceleration to calculate the second correction coefficients that align the plurality of second detection axes with the reference axis. The second correction coefficients are stored in the storage device 3 and used by the matching processing unit 101 to generate the second matching signal.

[0060] Although the processing of steps S2 to S4 is described as being performed by the processing circuit 100, it can also be performed by an external computer device. For example, in step S2, the matching processing unit 101 outputs the correction signal output from the target sensor module 2 from the connector 93 or the internal connector 110 to the external device. As a result, the correction coefficient is calculated in the external device. In addition, the correction signal can also be output through a logic circuit or the like in the second mode. In this way, by having the second mode, the matching processing unit 101 can calculate the correction coefficient without requiring a dedicated structure for outputting the correction signal.

[0061] While the embodiments have been described above, the present invention is not limited to these disclosures. The components of each part may be replaced with any other component having the same function. Furthermore, any component in each embodiment may be omitted or added within the technical scope of the present invention. Thus, various alternative embodiments will be readily apparent to those skilled in the art based on these disclosures.

[0062] For example, Figure 10As shown, an inertial sensor device 1A according to the first modified example includes a first sensor module 2A, a second sensor module 2B, and a third sensor module 2C stacked in a single direction, namely, along the Z-axis. The inertial sensor device 1A further includes four substrates 10A, 10B, 10C, and 10D, and a processing circuit 100 and an internal connector 110 mounted on each substrate 10D. Substrates 10A to 10D are fixed relative to each other. The first sensor module 2A is mounted on substrate 10A. The second sensor module 2B is mounted on substrate 10B. The third sensor module 2C is mounted on substrate 10C.

[0063] The first sensor module 2A, the second sensor module 2B, and the third sensor module 2C are daisy-chained and connected to the processing circuit 100 via a plurality of cables 4a, 4b, and 4c. The cables 4a, 4b, and 4c connect the first sensor module 2A, the second sensor module 2B, the third sensor module 2C, and the processing circuit 100, for example, via connectors mounted on the substrates 10A, 10B, and 10C. Connecting the sensor modules 2 in series in this manner increases design flexibility and allows for a simple increase in the number of sensor modules. This further improves the signal-to-noise ratio of the output signal.

[0064] Or, as Figure 11 As shown in FIG. 1 , the inertial sensor device 1B according to the second modification includes a first sensor module 2A, a second sensor module 2B, and a third sensor module 2C arranged on the same plane. The inertial sensor device 1B includes substrates 10A to 10D arranged on a plane along the XY plane. Figure 10 Similarly to the example shown, the first sensor module 2A, the second sensor module 2B, and the third sensor module 2C are daisy-chained via a plurality of cables 4a, 4b, and 4c and connected to the processing circuit 100. This improves design freedom and allows for easy increase in the number of sensor modules.

[0065] like Figure 12 As shown, an inertial sensor device 1C according to the third modified example includes a single substrate 10E instead of the multiple substrates 10A to 10D arranged on the same plane. The first sensor module 2A, the second sensor module 2B, the third sensor module 2C, the processing circuit 100, and the internal connector 110 are mounted on substrate 10E. Substrate 10E includes wiring that connects the first sensor module 2A, the second sensor module 2B, and the third sensor module 2C to the processing circuit 100. The processing circuit 100 is connected in parallel with each sensor module 2, for example. This allows for more efficient use of communication capacity compared to serial wiring.

[0066] The functions of the processing circuit 100 can also be implemented by the correction circuit 28. That is, the correction signal generated by the correction circuit 28 of each sensor module 2 can be converted into a matching signal using a correction coefficient pre-stored in the storage unit 30. Alternatively, the correction circuit 28 of any sensor module 2 can be made the master, and the master correction circuit 28 can synthesize the correction signals or matching signals input from other sensor modules 2.

[0067] In addition, it is needless to say that the present invention includes various embodiments not described above, such as configurations obtained by mutually applying the above configurations. The technical scope of the present invention is limited only by the invention-specific matters according to the claims appropriately derived from the above description.

Claims

1. An inertial sensor device, It is characterized in that have: A first sensor module, comprising a first inertial sensor and a first correction circuit, wherein the first inertial sensor outputs first signals of three axes corresponding to the detection axes 1a, 1b, and 1c, and the first correction circuit generates a first correction signal by correcting the first signal in the following manner, wherein the three axes of the first signal are corrected to axes parallel to the first detection axis, the second detection axis, and the third detection axis of the first correction signal, respectively, and the first detection axis, the second detection axis, and the third detection axis are orthogonal to each other; A second sensor module, comprising a second inertial sensor and a second correction circuit, wherein the second inertial sensor outputs second signals of three axes corresponding to the 2a axis, the 2b axis, and the 2c axis as detection axes, and the second correction circuit generates a second correction signal by correcting the second signal in the following manner, wherein the three axes of the second signal are corrected to axes parallel to the fourth detection axis, the fifth detection axis, and the sixth detection axis of the second correction signal, respectively, and the fourth detection axis, the fifth detection axis, and the sixth detection axis are orthogonal to each other; a matching processing section that generates a first matching signal by applying a first correction coefficient to the first correction signal so that the first detection axis, the second detection axis, and the third detection axis are matched with the fourth detection axis, the fifth detection axis, and the sixth detection axis, respectively; and a synthesis processing unit, which synthesizes the first matching signal and the second correction signal and outputs the synthesized signal, The inertial sensor device further includes a substrate, the first sensor module and the second sensor module are mounted on the substrate, the first sensor module and the second sensor module each include a first angular velocity sensor for detecting an angular velocity around an a-axis, a second angular velocity sensor for detecting an angular velocity around a b-axis, a third angular velocity sensor for detecting an angular velocity around a c-axis, and acceleration sensors for respectively detecting acceleration along an a-axis direction, acceleration along a b-axis direction, and acceleration along a c-axis direction, the acceleration sensor of the first sensor module and the acceleration sensor of the second sensor module are arranged close to each other, The first correction circuit generates the first correction signal by performing misalignment correction on the first signal of the first inertial sensor, the second correction circuit generates the second correction signal by performing misalignment correction on the second signal of the second inertial sensor, and the first correction coefficient is a coefficient used to eliminate the misalignment of the first correction signal relative to the second correction signal.

2. An inertial sensor device, It is characterized in that have: The three mutually orthogonal reference axes are defined as the X-axis, Y-axis and Z-axis. A first sensor module, comprising a first inertial sensor and a first correction circuit, wherein the first inertial sensor outputs first signals of three axes corresponding to the detection axes 1a, 1b, and 1c, and the first correction circuit generates a first correction signal by correcting the first signal in the following manner, wherein the three axes of the first signal are corrected to axes parallel to the first detection axis, the second detection axis, and the third detection axis of the first correction signal, respectively, and the first detection axis, the second detection axis, and the third detection axis are orthogonal to each other; A second sensor module, comprising a second inertial sensor and a second correction circuit, wherein the second inertial sensor outputs second signals of three axes corresponding to the 2a axis, the 2b axis, and the 2c axis as detection axes, and the second correction circuit generates a second correction signal by correcting the second signal in the following manner, wherein the three axes of the second signal are corrected to axes parallel to the fourth detection axis, the fifth detection axis, and the sixth detection axis of the second correction signal, respectively, and the fourth detection axis, the fifth detection axis, and the sixth detection axis are orthogonal to each other; a matching processing unit that generates a first matching signal by applying a first correction coefficient to the first correction signal so that the first detection axis, the second detection axis, and the third detection axis match the X axis, the Y axis, and the Z axis, respectively, and generates a second matching signal by applying a second correction coefficient to the second correction signal so that the fourth detection axis, the fifth detection axis, and the sixth detection axis match the X axis, the Y axis, and the Z axis, respectively; and a synthesis processing unit, which synthesizes the first matching signal and the second matching signal and outputs the synthesized signal; The inertial sensor device further includes a substrate, the first sensor module and the second sensor module are mounted on the substrate, the first sensor module and the second sensor module each include a first angular velocity sensor for detecting an angular velocity around an a-axis, a second angular velocity sensor for detecting an angular velocity around a b-axis, a third angular velocity sensor for detecting an angular velocity around a c-axis, and acceleration sensors for respectively detecting acceleration along an a-axis direction, acceleration along a b-axis direction, and acceleration along a c-axis direction, the acceleration sensor of the first sensor module and the acceleration sensor of the second sensor module are arranged close to each other, The first correction circuit generates the first correction signal by performing misalignment correction on the first signal of the first inertial sensor, the second correction circuit generates the second correction signal by performing misalignment correction on the second signal of the second inertial sensor, the first correction coefficient is a coefficient for eliminating misalignment of the first correction signal relative to the reference axis, and the second correction coefficient is a coefficient for eliminating misalignment of the second correction signal relative to the reference axis.

3. The inertial sensor device according to claim 1 or 2, It is characterized in that The matching processing unit has a first mode for outputting the first matching signal and a second mode for outputting the first correction signal.

4. The inertial sensor device according to claim 3, It is characterized in that The matching processing unit applies a unit element to the first correction signal in the second mode and outputs the resultant signal.

5. The inertial sensor device according to claim 1 or 2, It is characterized in that The first correction coefficient is any one of a rotation matrix, an Euler angle, and a quaternion.

6. A method for manufacturing an inertial sensor device, It is characterized in that The inertial sensor device comprises: A first sensor module, comprising a first inertial sensor and a first correction circuit, wherein the first inertial sensor outputs first signals of three axes corresponding to the detection axes 1a, 1b, and 1c, and the first correction circuit generates a first correction signal by correcting the first signal in the following manner, wherein the three axes of the first signal are corrected to axes parallel to the first detection axis, the second detection axis, and the third detection axis of the first correction signal, respectively, and the first detection axis, the second detection axis, and the third detection axis are orthogonal to each other; A second sensor module, comprising a second inertial sensor and a second correction circuit, wherein the second inertial sensor outputs second signals of three axes corresponding to the 2a axis, the 2b axis, and the 2c axis as detection axes, and the second correction circuit generates a second correction signal by correcting the second signal in the following manner, wherein the three axes of the second signal are corrected to axes parallel to the fourth detection axis, the fifth detection axis, and the sixth detection axis of the second correction signal, respectively, and the fourth detection axis, the fifth detection axis, and the sixth detection axis are orthogonal to each other; a matching processing unit that generates a first matching signal by applying a first correction coefficient to the first correction signal; as well as a synthesis processing unit, which synthesizes the first matching signal and the second correction signal and outputs the synthesized signal, The manufacturing method comprises: Calculating the first correction coefficient by comparing the first correction signal with the gravitational acceleration, and comparing the second correction signal with the gravitational acceleration; as well as By applying the first correction coefficient to the first correction signal, the first detection axis, the second detection axis, and the third detection axis are matched with the fourth detection axis, the fifth detection axis, and the sixth detection axis, respectively, The inertial sensor device further includes a substrate, the first sensor module and the second sensor module are mounted on the substrate, the first sensor module and the second sensor module each include a first angular velocity sensor for detecting an angular velocity around an a-axis, a second angular velocity sensor for detecting an angular velocity around a b-axis, a third angular velocity sensor for detecting an angular velocity around a c-axis, and acceleration sensors for respectively detecting acceleration along an a-axis direction, acceleration along a b-axis direction, and acceleration along a c-axis direction, the acceleration sensor of the first sensor module and the acceleration sensor of the second sensor module are arranged close to each other, The first correction circuit generates the first correction signal by performing misalignment correction on the first signal of the first inertial sensor, the second correction circuit generates the second correction signal by performing misalignment correction on the second signal of the second inertial sensor, and the first correction coefficient is a coefficient used to eliminate the misalignment of the first correction signal relative to the second correction signal.

7. A method for manufacturing an inertial sensor device, It is characterized in that The inertial sensor device comprises: The three mutually orthogonal reference axes are defined as the X-axis, Y-axis and Z-axis. A first sensor module, comprising a first inertial sensor and a first correction circuit, wherein the first inertial sensor outputs first signals of three axes corresponding to the detection axes 1a, 1b, and 1c, and the first correction circuit generates a first correction signal by correcting the first signal in the following manner, wherein the three axes of the first signal are corrected to axes parallel to the first detection axis, the second detection axis, and the third detection axis of the first correction signal, respectively, and the first detection axis, the second detection axis, and the third detection axis are orthogonal to each other; A second sensor module, comprising a second inertial sensor and a second correction circuit, wherein the second inertial sensor outputs second signals of three axes corresponding to the 2a axis, the 2b axis, and the 2c axis as detection axes, and the second correction circuit generates a second correction signal by correcting the second signal in the following manner, wherein the three axes of the second signal are corrected to axes parallel to the fourth detection axis, the fifth detection axis, and the sixth detection axis of the second correction signal, respectively, and the fourth detection axis, the fifth detection axis, and the sixth detection axis are orthogonal to each other; a matching processing unit that generates a first matching signal by applying a first correction coefficient to the first correction signal, and generates a second matching signal by applying a second correction coefficient to the second correction signal; as well as a synthesis processing unit, which synthesizes the first matching signal and the second matching signal and outputs the synthesized signal; The manufacturing method comprises: calculating the first correction coefficient by comparing the first correction signal with the gravitational acceleration; By applying the first correction coefficient to the first correction signal, the first detection axis, the second detection axis, and the third detection axis are matched with the X axis, the Y axis, and the Z axis respectively; calculating the second correction coefficient by comparing the second correction signal with the gravitational acceleration; and By applying the second correction coefficient to the second correction signal, the fourth detection axis, the fifth detection axis, and the sixth detection axis are matched with the X axis, the Y axis, and the Z axis, respectively, The inertial sensor device further includes a substrate, the first sensor module and the second sensor module are mounted on the substrate, the first sensor module and the second sensor module each include a first angular velocity sensor for detecting an angular velocity around an a-axis, a second angular velocity sensor for detecting an angular velocity around a b-axis, a third angular velocity sensor for detecting an angular velocity around a c-axis, and acceleration sensors for respectively detecting acceleration along an a-axis direction, acceleration along a b-axis direction, and acceleration along a c-axis direction, the acceleration sensor of the first sensor module and the acceleration sensor of the second sensor module are arranged close to each other, The first correction circuit generates the first correction signal by performing misalignment correction on the first signal of the first inertial sensor, the second correction circuit generates the second correction signal by performing misalignment correction on the second signal of the second inertial sensor, the first correction coefficient is a coefficient for eliminating misalignment of the first correction signal relative to the reference axis, and the second correction coefficient is a coefficient for eliminating misalignment of the second correction signal relative to the reference axis.

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