Electronic device and method for manufacturing the same

Abstract

The present disclosure relates to an electronic device, which may include a window, a display panel disposed below the window, a support member disposed below the display panel, and a light-blocking layer disposed on the support member. The light-blocking layer may include a light-blocking material, and the light-blocking layer may be directly disposed on the support member or may be directly attached to the support member through a light-blocking adhesive layer. Therefore, the electronic device has improved impact resistance and can prevent reflection of external light.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application Nos. 10-2020-0069803 and 10-2020-0071869, filed on June 9, 2020 and June 12, 2020, respectively, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to an electronic device having improved anti-impact properties and preventing reflection of external light, and a method of manufacturing the electronic device. Background Art

[0004] An electronic device may include an active area that can be selectively activated by an electrical signal. In the electronic device, the active area may be used to sense input provided from the outside and display various information images to the user. Recently, as the shapes of electronic devices have diversified, the active area has also developed into various shapes.

[0005] It will be understood that the present background technology of the technology section is intended, in part, to provide a useful background for understanding the technology. However, the present background technology of the technology section may also include ideas, concepts, or cognitions that were not part of what was known or appreciated by a person skilled in the relevant art before the corresponding effective filing date of the subject matter disclosed herein. Summary of the invention

[0006] Embodiments of the present disclosure provide an electronic device and a method of manufacturing the electronic device, which may have improved anti-impact properties and prevent reflection of external light.

[0007] According to an embodiment of the present disclosure, an electronic device may include: a window; a display panel disposed below the window; a support member disposed below the display panel; and a light-blocking layer disposed on the support member. The light-blocking layer may include a light-blocking material, and the light-blocking layer may be directly disposed on the support member or may be directly attached to the support member via a light-blocking adhesive layer.

[0008] In an embodiment, the support member may include a plate including a metal material, and the light blocking layer may be directly disposed on the plate or may be directly attached to the plate through a light blocking adhesive layer.

[0009] In an embodiment, the plate may include a first non-folding area, a folding area, and a second non-folding area, and the plate may include a plurality of openings overlapping the folding area.

[0010] In an implementation, the light blocking layer may include a plurality of light blocking openings overlapping the plurality of openings.

[0011] In an implementation, the light blocking layer may include at least one of a black dye and a black pigment.

[0012] In an implementation, the light blocking layer may include at least one of a polymer resin, a curing agent, a silane coupling agent, and amorphous silica particles.

[0013] In an embodiment, an average particle size of the solid in the light blocking layer may be in a range of about 0.1 μm to about 4 μm.

[0014] In embodiments, the light blocking layer may include a cross-linking additive.

[0015] In an embodiment, the light blocking layer may be a light blocking coating directly coated on the support member.

[0016] In an embodiment, the light blocking layer may be a light blocking sheet attached to the support member through a light blocking adhesive layer.

[0017] In an embodiment, the electronic device may further include a lower protective film disposed below the display panel. The light blocking layer may be directly attached to the lower protective film through an additional adhesive layer.

[0018] In an embodiment, the thickness of the light blocking layer is in a range from about 7 μm to about 13 μm.

[0019] In an implementation, the surface roughness of the light blocking layer may be less than or equal to about 0.10 μm.

[0020] In an embodiment, the surface adhesive strength of the light blocking layer may be greater than or equal to about 800 gf.

[0021] According to an embodiment of the present disclosure, an electronic device may include: a window; a display panel disposed below the window; a support member disposed below the display panel; and a light blocking layer disposed on the support member. The light blocking layer may include a light blocking material and may be directly coated on the support member.

[0022] According to an embodiment of the present disclosure, a method for manufacturing an electronic device is provided, the electronic device including a window, a display panel disposed below the window, and a support member disposed below the display panel. The method may include manufacturing the support member and attaching the support member to the bottom surface of the display panel. The manufacturing of the support member may include forming a light blocking layer by coating a coating including a light blocking material on a plate, the plate including a metal material.

[0023] In an embodiment, forming the light blocking layer may include applying a coating material on the board using a spray coating method.

[0024] In an embodiment, the board may include a first non-folding area, a folding area, and a second non-folding area. The board may include a plurality of openings overlapping the folding area, and the formation of the light blocking layer may be performed so that the coating may be applied to the remaining area of ​​the board except for the area overlapping the plurality of openings.

[0025] In an implementation, the light blocking material may include at least one of a polymer resin, a curing agent, a silane coupling agent, a black pigment, amorphous silica particles, and a solvent.

[0026] In an embodiment, an average particle size of solids in the light blocking material may be in a range of about 0.1 μm to about 4 μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Example embodiments will be more clearly understood from the following brief description taken in conjunction with the accompanying drawings.The accompanying drawings represent non-limiting example embodiments as described herein.

[0028] Figure 1A is a schematic perspective view showing an electronic device according to an embodiment of the present disclosure.

[0029] Figure 1B is a schematic perspective view showing an electronic device according to an embodiment of the present disclosure.

[0030] Figure 2 is a schematic cross-sectional view showing an electronic device according to an embodiment of the present disclosure.

[0031] Figure 3 is a schematic cross-sectional view showing a display panel according to an embodiment of the present disclosure.

[0032] Figure 4 is a schematic perspective view showing selected elements of an electronic device according to an embodiment of the present disclosure.

[0033] Figure 5A and Figure 5B are schematic plan views each showing a region of an electronic device according to an embodiment of the present disclosure.

[0034] Figure 6 is a schematic cross-sectional view showing an electronic device according to an embodiment of the present disclosure.

[0035] Figure 7 is a schematic diagram including images taken to illustrate surface roughness characteristics of plates according to example embodiments and comparative embodiments.

[0036] Figure 8 is a schematic diagram including images taken to illustrate surface adhesive strength characteristics of boards according to example embodiments and comparative embodiments.

[0037] 9A to 9C is a schematic diagram including an image taken to evaluate characteristics of an electronic device according to an embodiment of the present disclosure.

[0038] It should be noted that these drawings are intended to illustrate the general characteristics of methods, structures and / or materials utilized in certain example embodiments and are intended to supplement the written description provided below. However, these drawings are not to scale and may not accurately reflect the precise structure or performance characteristics of any given embodiment and should not be interpreted as defining or limiting the range of values ​​or properties covered by the example embodiments. For example, the relative thickness and position of molecules, layers, regions and / or structural elements may be reduced or exaggerated for clarity. The use of similar or identical reference numerals in the various drawings is intended to indicate the presence of similar or identical elements or features. DETAILED DESCRIPTION

[0039] The example embodiments of the present disclosure will now be described more fully with reference to the accompanying drawings showing example embodiments. However, the example embodiments of the present disclosure can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure will be exhaustive and complete, and these embodiments fully convey the concepts of the example embodiments to those of ordinary skill in the art. In the accompanying drawings, the thickness of layers and regions may be exaggerated for clarity. Similar reference numerals in the accompanying drawings represent similar elements, and their descriptions will therefore be omitted.

[0040] It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or there may be intervening elements. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements. Other words used to describe the relationship between elements or layers should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," "on" versus "directly on").

[0041] As used herein, the term "and / or" includes any and all combinations of one or more associated listed items. For example, "A and / or B" may be understood to mean "A, B, or A and B". The terms "and" and "or" may be used in a conjunctive or disjunctive sense and may be understood to be equivalent to "and / or". For the purposes of its meaning and interpretation, the phrase "at least one of..." is intended to include the meaning of "at least one selected from the group consisting of...". For example, "at least one of A and B" may be understood to mean "A, B, or A and B".

[0042] It will be understood that, although the terms "first", "second", etc. may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer, or portion discussed below may be referred to as a second element, component, region, layer, or portion.

[0043] For ease of description, spatial relative terms such as "below", "below", "below", "above", and "on" may be used herein to describe the relationship of one element or feature to another element or feature as shown in the figure. It will be understood that, in addition to the orientation depicted in the figure, spatial relative terms are also intended to cover different orientations of the device in use or operation. For example, if the device in the figure is turned over, the element described as "below" or "below" other elements or features will then be oriented to be "above" other elements or features. Therefore, the term "below" can cover both the orientation of above and below. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein are interpreted accordingly.

[0044] The terms used herein are for the purpose of describing specific embodiments only and are not intended to limit the example embodiments. As used herein, the singular forms "a", "an", and "the" are also intended to include the plural forms unless the context clearly indicates otherwise. It will also be understood that terms such as "comprises", "comprising", "has", "having", "includes", and / or "including" specify the presence of stated features, integers, steps, operations, elements, and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, and / or groups thereof.

[0045] Example embodiments of the present disclosure are described herein with reference to cross-sectional illustrations, which are schematic illustrations of idealized embodiments (and intermediate structures) of example embodiments. As such, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, example embodiments of the present disclosure should not be construed as limited to the particular shapes of the regions shown herein, but rather are to include deviations in shape due to, for example, manufacturing.

[0046] The term overlapping may include overlaying, stacking, facing or facing, extending over, covering or partially covering or any other suitable term as would be appreciated and understood by one of ordinary skill in the art.

[0047] As used herein, "about" or "approximately" or "substantially" may include the stated value and mean within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "about" may mean within one or more standard deviations, or within, for example, ±30%, ±20%, or ±5% of the stated value.

[0048] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those skilled in the art to which the exemplary embodiments of the present disclosure belong. It will also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense, unless explicitly defined as such herein.

[0049] Figure 1A is a schematic perspective view showing an electronic device 1000 according to an embodiment of the present disclosure. Figure 1B is a schematic perspective view showing an electronic device 1000 according to an embodiment of the present disclosure. Figure 1A The electronic device 1000 is shown in an unfolded state, and Figure 1B The electronic device 1000 is shown in a folded state.

[0050] Reference Figure 1A and Figure 1B , the electronic device 1000 may be selectively activated by an electrical signal applied to the electronic device 1000. For example, the electronic device 1000 may be a cellular phone, a tablet computer, a car navigation system, a game console, or a wearable device, but the present disclosure is not limited to these examples. Figure 1A An example is shown in which the electronic device 1000 is a cellular phone.

[0051] The electronic device 1000 may include an active area 1000A, which may be used to display an image. When the electronic device 1000 is in an unfolded state, the active area 1000A may include a flat surface defined by a first direction DR1 and a second direction DR2. The thickness direction of the electronic device 1000 may be parallel to a third direction DR3, and the third direction DR3 may be different from the first direction DR1 and the second direction DR2. Therefore, the front surface or top surface and the rear surface or bottom surface of each of the plurality of elements constituting the electronic device 1000 may be distinguished from each other based on the third direction DR3.

[0052] The active area 1000A may include a first area 1000A1, a second area 1000A2, and a third area 1000A3. The second area 1000A2 may be bent or curved along a folding axis FX parallel to the second direction DR2. Therefore, the first area 1000A1 and the third area 1000A3 may be referred to as non-folding areas, and the second area 1000A2 may be referred to as a folding area.

[0053] If the electronic device 1000 is folded, the first area 1000A1 and the third area 1000A3 may face each other. In addition, if the electronic device 1000 is completely folded, the active area 1000A may not be exposed to the outside, and this state or operation may be referred to as an inward folded state or operation. However, this is only an example, and the operation of the electronic device 1000 is not limited to this example.

[0054] For example, the electronic device 1000 may be folded so that the first area 1000A1 may be disposed opposite to the third area 1000A3. In this folded state, the active area 1000A may be exposed to the outside, and this state or operation may be referred to as an outward folded state or operation.

[0055] In an embodiment, the electronic device 1000 may be configured so that only one of the inward folding operation and the outward folding operation is allowed. In another embodiment, the electronic device 1000 may be configured so that both the inward folding operation and the outward folding operation are allowed. The inward folding operation and the outward folding operation may be performed on the same area (e.g., the second area 1000A2) of the electronic device 1000. In other embodiments, the electronic device 1000 may include at least two different areas, one of the at least two different areas may be folded in an inward folding manner, and the other of the at least two different areas may be folded in an outward folding manner.

[0056] Figure 1A and Figure 1BAn example is shown, and in this example, one folding area and two non-folding areas may be provided, but the number of folding areas and non-folding areas is not limited thereto. For example, the electronic device 1000 may include two or more non-folding areas and two or more folding areas, and each of the folding areas may be arranged between adjacent non-folding areas in the non-folding area.

[0057] exist Figure 1A and Figure 1B , the folding axis FX is shown to be parallel to the short side of the electronic device 1000, but the present disclosure is not limited to this example. For example, the folding axis FX may be designed to be parallel to the long side or the first direction DR1 of the electronic device 1000. The first region 1000A1, the second region 1000A2, and the third region 1000A3 may be sequentially arranged (e.g., arranged) in the second direction DR2.

[0058] A plurality of sensing areas 100SA1 , 100SA2 , and 100SA3 may be defined in the electronic device 1000 . Figure 1A An example having three sensing areas 100SA1 , 100SA2 , and 100SA3 is shown, but the number of sensing areas is not limited thereto.

[0059] The plurality of sensing areas 100SA1, 100SA2, and 100SA3 may include a first sensing area 100SA1, a second sensing area 100SA2, and a third sensing area 100SA3. For example, the first sensing area 100SA1 may overlap with the camera module, and the second sensing area 100SA2 and the third sensing area 100SA3 may overlap with the ambient light sensor, but the present disclosure is not limited to this example.

[0060] Each electronic module may receive an input signal, which may be transmitted from the outside through the first sensing area 100SA1, the second sensing area 100SA2, or the third sensing area 100SA3, or may provide an output signal to the outside through the first sensing area 100SA1, the second sensing area 100SA2, or the third sensing area 100SA3.

[0061] The first sensing area 100SA1 may be surrounded by the active area 1000A, and the second sensing area 100SA2 and the third sensing area 100SA3 may be included in the active area 1000A. In other words, the second sensing area 100SA2 and the third sensing area 100SA3 may be used to display an image. The transmittance of each of the first sensing area 100SA1, the second sensing area 100SA2, and the third sensing area 100SA3 may be higher than the transmittance of the active area 1000A. In an embodiment, the transmittance of the first sensing area 100SA1 may be higher than each of the transmittance of the second sensing area 100SA2 and the transmittance of the third sensing area 100SA3.

[0062] According to an embodiment of the present disclosure, some electronic modules may overlap with the active area 1000A, and other electronic modules may be surrounded by the active area 1000A. Therefore, it may not be necessary to limit the area for the electronic modules to the peripheral area 1000NA around the active area 1000A. As a result, the ratio of the area of ​​the active area 1000A to the total area of ​​the electronic device 1000 may be increased.

[0063] Figure 2 is a schematic cross-sectional view showing an electronic device 1000 according to an embodiment of the present disclosure. For example, Figure 2 is along Figure 1A A cross-sectional view taken along line II'. Figure 3 is a schematic cross-sectional view showing a display panel 100 according to an embodiment of the present disclosure.

[0064] Reference Figure 2 , the electronic device 1000 may include a display panel 100 , an upper functional layer, and a lower functional layer.

[0065] Reference Figure 3 , the display panel 100 may generate an image and sense an input signal provided from the outside. For example, the display panel 100 may include a display layer 110 and a sensor layer 120. The thickness of the display panel 100 may be in the range of about 25 μm to about 35 μm, and may be, for example, about 30 μm, but the thickness of the display panel 100 is not limited thereto.

[0066] The display layer 110 may be a component that basically generates an image. The display layer 110 may be a light-emitting display layer. For example, the display layer 110 may be an organic light-emitting display layer, a quantum dot display layer, or a micro LED display layer.

[0067] The display layer 110 may include a base layer 111 , a circuit layer 112 , a light emitting device layer 113 , and an encapsulation layer 114 .

[0068] The base layer 111 may include a synthetic resin film. The synthetic resin layer may include a thermosetting resin. The base layer 111 may have a multilayer structure. For example, the base layer 111 may have a three-layer structure including a synthetic resin layer, an adhesive layer and a synthetic resin layer. The synthetic resin layer may be a polyimide-based resin layer, but the present disclosure is not limited to the material of the base layer 111. The synthetic resin layer may be formed by or include at least one of an acryl resin, a methacryl resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a polyurethane resin, a cellulose resin, a siloxane resin, a polyamide resin and a perylene resin. In some cases, the base layer 111 may include a glass substrate or a substrate made of an organic / inorganic composite material.

[0069] The circuit layer 112 may be disposed on the base layer 111. The circuit layer 112 may include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. For example, at least one of the insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 111 by a coating or deposition method, and may be selectively patterned by one or more photolithography processes. The semiconductor pattern, the conductive pattern, and the signal line in the circuit layer 112 may be formed by this process or by repeating this process.

[0070] The light emitting device layer 113 may be disposed on the circuit layer 112. The light emitting device layer 113 may include a light emitting device. For example, the light emitting device layer 113 may include an organic light emitting material, a quantum dot, a quantum rod, or a micro LED.

[0071] The encapsulation layer 114 may be disposed on the light emitting device layer 113. The encapsulation layer 114 may include an inorganic layer, an organic layer, and an inorganic layer, which may be sequentially stacked on each other, and the structure of the encapsulation layer 114 is not limited to this example.

[0072] The inorganic layer may protect the light emitting device layer 113 from moisture or oxygen, and the organic layer may protect the light emitting device layer 113 from polluting materials (e.g., dust particles). Each of the inorganic layers may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, or a combination thereof. The organic layer may include an acrylic organic layer, but the present disclosure is not limited thereto.

[0073] The sensor layer 120 may be disposed on the display layer 110. The sensor layer 120 may sense an external input provided from the outside. The external input may be an input signal provided from a user. For example, the input signal from the user may include various types of external inputs caused by a part of the user's body, light, heat, pressure, or a pen.

[0074] The sensor layer 120 may be formed on the display layer 110 in a continuous manner. It may be expressed that the sensor layer 120 may be directly disposed on the display layer 110. This expression may mean that there may be no other element between the sensor layer 120 and the display layer 110. In other words, any other bonding member may not be disposed between the sensor layer 120 and the display layer 110.

[0075] In an embodiment, the sensor layer 120 may be bonded to the display layer 110 by an adhesive member. The adhesive member may be a typical adhesive material, a typical glue, or a combination thereof.

[0076] Return to reference Figure 2 , an upper functional layer may be disposed on the display panel 100. For example, the upper functional layer may include an anti-reflection member 200 and an upper member 300.

[0077] The anti-reflection member 200 may be referred to as an anti-reflection layer. The anti-reflection member 200 may reduce the reflectivity of external light to be incident from the outside. The anti-reflection member 200 may include an elongated synthetic resin film. For example, the anti-reflection member 200 may be provided by dyeing a polyvinyl alcohol (PVA) film with an iodine compound. However, the material used for the anti-reflection member 200 is not limited to this example. The anti-reflection member 200 may have a thickness in the range of about 25 μm to about 35 μm (e.g., about 31 μm), but the thickness of the anti-reflection member 200 is not limited thereto.

[0078] In an embodiment, the anti-reflection member 200 may include a color filter. The color filter may be arranged to form a specific arrangement. The arrangement of the color filter in the anti-reflection member 200 may be determined in consideration of the color of light to be emitted from the pixels in the display layer 110. In addition, the anti-reflection layer may further include a black matrix that may be arranged adjacent to the color filter.

[0079] In an embodiment, the anti-reflection member 200 may include a destructive interference structure. For example, the destructive interference structure may include a first reflective layer and a second reflective layer that may be disposed on different layers. The first reflected light and the second reflected light that may be reflected by the first reflective layer and the second reflective layer, respectively, may destructively interfere with each other, and thus, the reflectivity of the external light may be reduced.

[0080] The anti-reflection member 200 may be bonded to the display panel 100 by a first adhesive layer 1010. The first adhesive layer 1010 may be a transparent adhesive layer, such as a pressure sensitive adhesive (PSA) film, an optically clear adhesive (OCA) film, an optically clear resin (OCR) film, or a combination thereof. In various embodiments described below, the adhesive layer may include a typical adhesive material or adhesive. The first adhesive layer 1010 may have a thickness in the range of about 20 μm to about 30 μm (e.g., about 25 μm), but the thickness of the first adhesive layer 1010 is not limited thereto.

[0081] In an embodiment, the first adhesive layer 1010 may be omitted, and the anti-reflection member 200 may be directly disposed on the display panel 100. In an embodiment, another adhesive layer may not be disposed between the anti-reflection member 200 and the display panel 100.

[0082] The upper member 300 may be disposed on the anti-reflection member 200. The upper member 300 may include a first hard coating layer 310, a protective layer 320, a first upper adhesive layer 330, a window 340, a second upper adhesive layer 350, a black matrix 360, an impact absorbing layer 370, and a second hard coating layer 380. The elements constituting the upper member 300 are not limited to the above elements. For example, at least one of the above elements may be omitted, and other elements may be further provided as additional elements of the upper member 300.

[0083] The first hard coating layer 310 may be the outermost layer of the electronic device 1000. The first hard coating layer 310 may be a functional layer, which may be coated on the protective layer 320 and may be used to improve the use characteristics of the electronic device 1000. For example, the first hard coating layer 310 may prevent problems of fingerprints, contamination, and scratches.

[0084] The protective layer 320 may be disposed below the first hard coating layer 310. The protective layer 320 may protect the elements thereunder. In addition to the first hard coating layer 310, an anti-fingerprint layer may be further disposed on the protective layer 320 to improve chemical and corrosion resistance. The protective layer 320 may include a film having an elastic modulus that may be less than about 15 GPa at room temperature. The protective layer 320 may have a thickness in the range of about 50 μm to about 60 μm (e.g., about 55 μm), but the thickness of the protective layer 320 is not limited thereto. In an embodiment, the protective layer 320 may be omitted.

[0085] The first upper adhesive layer 330 may be disposed under the protective layer 320. The first upper adhesive layer 330 may be used to bond the protective layer 320 and the window 340 to each other. The first upper adhesive layer 330 may have a thickness in a range of about 20 μm to about 30 μm (e.g., about 25 μm), but the thickness of the first upper adhesive layer 330 is not limited thereto.

[0086] The window 340 may be disposed below the first upper adhesive layer 330. The window 340 may be formed of or include an optically transparent insulating material. For example, the window 340 may include a glass substrate, a synthetic resin film, or a combination thereof. If the window 340 is a glass substrate, the window 340 may have a thickness of about 80 μm or less (e.g., about 30 μm), but the thickness of the window 340 is not limited thereto.

[0087] In the case where the window 340 is a synthetic resin film, the window 340 may include a polyimide (Pl) film, a polyethylene terephthalate (PET) film, or a combination thereof.

[0088] The window 340 may have a multi-layer or single-layer structure. For example, the window 340 may include a synthetic resin film that may be bonded to each other by an adhesive material, or may include a glass substrate and a synthetic resin film that may be bonded to each other by an adhesive material.

[0089] The second upper adhesive layer 350 may be disposed under the window 340. The second upper adhesive layer 350 may be used to bond the window 340 and the impact absorbing layer 370 to each other. The second upper adhesive layer 350 may have a thickness in a range of about 30 μm to about 40 μm (e.g., about 35 μm), but the thickness of the second upper adhesive layer 350 is not limited thereto.

[0090] In an embodiment, the side surface 340S of the window 340 and the side surface 350S of the second upper adhesive layer 350 may be placed inward relative to the side surfaces of other layers (e.g., the side surface 100S of the display panel 100 and the side surface 320S of the protective layer 320). This means that the side surface 340S and the side surface 350S may be closer to the active area 1000A than the other side surfaces.

[0091] The folding operation of the electronic device 1000 may cause a change in the relative position of each layer constituting the electronic device 1000. According to an embodiment of the present disclosure, since the side surface 340S of the window 340 may be placed inwardly relative to the side surface 100S of the display panel 100 and the side surface 320S of the protective layer 320, even if the relative position of each layer is changed, it may be possible to suppress or prevent the side surface 340S of the window 340 from protruding from the side surface 320S of the protective layer 320. Therefore, it may be possible to prevent an external impact from being applied to the window 340 through the side surface 340S. As a result, the problem of cracks in the window 340 may be reduced.

[0092] The first distance 340W between the side surface 340S of the window 340 and the side surface 320S of the protective layer 320 may be greater than a distance. Here, the first distance 340W may be a distance measured in the first direction DR1. When viewed in a plan view, the first distance 340W may correspond to the distance between the side surface 340S and the side surface 320S.

[0093] The first distance 340W may be in the range of about 180 μm to about 205 μm, and may be, for example, about 196 μm, but the present disclosure is not limited to this value or range. For example, the first distance 340W may be greater than about 50 μm or may be about 300 μm. The larger the first distance 340W, the longer the portion of the protective layer 320 protruding from the window 340, and a portion of the protective layer 320 may be bent and may be attached to other elements (e.g., a housing). In the case where the area of ​​the protective layer 320 may be increased, it may be possible to easily prevent contaminated materials from passing through the protective layer 320 in a downward or upward direction.

[0094] The window 340 and the second upper adhesive layer 350 may be attached to the impact absorbing layer 370 by a lamination process. Considering the error of the lamination process, the window 340 and the second upper adhesive layer 350 may be designed to have an area that may be smaller than the area of ​​the impact absorbing layer 370. In an embodiment, the area of ​​the second upper adhesive layer 350 may be smaller than the area of ​​the window 340. During the attachment process of the window 340, pressure may be applied to the second upper adhesive layer 350. The second upper adhesive layer 350 may be stretched in the first direction DR1 and the second direction DR2 by pressure. Even in this case, the second upper adhesive layer 350 may not protrude from the window 340 because, as described above, the second upper adhesive layer 350 has an area smaller than the window 340.

[0095] In the case where the first upper adhesive layer 330 and the second upper adhesive layer 350 are attached to the window 340, the window 340 may not slip during the folding operation of the electronic device 1000, and thus, a wrinkle problem may occur in the window 340. In contrast, according to an embodiment of the present disclosure, the area of ​​the second upper adhesive layer 350 may be smaller than that of the window 340. Therefore, the first upper adhesive layer 330 may not be attached to the second upper adhesive layer 350, and further, it may be possible to prevent or suppress the contamination material from being attached to the second upper adhesive layer 350.

[0096] The second distance 350W between the side surface 350S of the second upper adhesive layer 350 and the side surface 320S of the protective layer 320 may be greater than a distance. Here, the second distance 350W may be a distance measured in the first direction DR1. When viewed in a plan view, the second distance 350W may correspond to the distance between the side surface 350S and the side surface 320S.

[0097] The second distance 350W may be about 392 μm, but the present disclosure is not limited to this value. For example, the second distance 350W may be in the range of about 292 μm to about 492 μm, but the present disclosure is not limited to this range. The black matrix 360 may be disposed between the impact absorbing layer 370 and the second upper adhesive layer 350. The black matrix 360 may be disposed on the top surface of the impact absorbing layer 370 by a printing method. The black matrix 360 may overlap with the peripheral area 1000NA. The black matrix 360 may be a colored layer formed by a coating method. The black matrix 360 may include a colored organic material or an opaque metal, but the material of the black matrix 360 is not limited thereto.

[0098] Figure 2An example is shown in which the black matrix 360 may be provided on the top surface of the impact absorbing layer 370, but the position of the black matrix 360 is not limited to this example. For example, the black matrix 360 may be provided on at least one of the top and bottom surfaces of the protective layer 320 and the top and bottom surfaces of the window 340. The black matrix 360 may be provided to have a plurality of layers, and some of the plurality of layers may be provided on the top surface of the impact absorbing layer 370, and the others of the plurality of layers may be provided on at least one of the top and bottom surfaces of the protective layer 320 and the window 340.

[0099] The impact absorbing layer 370 may be a functional layer that can be used to protect the display panel 100 from external impacts. The impact absorbing layer 370 may be selected from a film having an elastic modulus higher than about 1 GPa at room temperature. The impact absorbing layer 370 may be an elongated film having an optical function. For example, the impact absorbing layer 370 may be an optical axis control film. The impact absorbing layer 370 may have a thickness in the range of about 35 μm to about 45 μm (e.g., about 41 μm), but the thickness of the impact absorbing layer 370 is not limited thereto. In an embodiment, the impact absorbing layer 370 may be omitted.

[0100] In the case where the impact absorbing layer 370 may be omitted, the anti-reflection member 200 may be attached to the window 340 through an adhesive layer. The anti-reflection member 200 may be in contact with the bottom surface of the second adhesive layer 1020, and the window 340 may be in contact with the top surface of the second adhesive layer 1020. If the impact absorbing layer 370 is omitted, the black matrix 360 may be provided on the top surface of the protective layer 320, the bottom surface of the protective layer 320, the top surface of the window 340, or the bottom surface of the window 340.

[0101] The second hard coating layer 380 may be provided on the surface of the impact absorbing layer 370. The impact absorbing layer 370 may have an uneven surface. The top surface of the impact absorbing layer 370 may be in contact with the second upper adhesive layer 350. Therefore, the uneven structure of the top surface of the impact absorbing layer 370 may be filled with the second upper adhesive layer 350. Therefore, it may be possible to prevent optical problems from occurring on the top surface of the impact absorbing layer 370. The bottom surface of the impact absorbing layer 370 may be covered by the second hard coating layer 380 having a flat surface. Since the second hard coating layer 380 covers the uneven surface of the impact absorbing layer 370, it may be possible to prevent haze problems that may be caused by the uneven surface.

[0102] The upper member 300 may be coupled to the anti-reflection member 200 through the second adhesive layer 1020. The second adhesive layer 1020 may include a typical adhesive material, a glue, or a combination thereof. The second adhesive layer 1020 may have a thickness in the range of about 20 μm to about 30 μm (e.g., about 25 μm), but the thickness of the second adhesive layer 1020 is not limited thereto.

[0103] The lower functional layer may be disposed below the display panel 100. For example, the lower functional layer may include a lower protective film 400, a light blocking layer 500, a first lower member 600, a second lower member 700, and a height difference compensation member 800. The elements constituting the lower functional layer are not limited to the above elements. For example, at least one of the above elements may be omitted, and other elements may also be provided as additional elements of the lower functional layer.

[0104] The lower protective film 400 may be bonded to the rear surface of the display panel 100 through the third adhesive layer 1030. The lower protective film 400 may prevent scratches from occurring on the rear surface of the display panel 100 during the manufacturing process of the display panel 100. The lower protective film 400 may be a colored polyimide film. For example, the lower protective film 400 may be an opaque yellow film, but the present disclosure is not limited to this example.

[0105] The lower protective film 400 may have a thickness in the range of about 40 μm to about 80 μm (e.g., about 68 μm). The third adhesive layer 1030 may have a thickness in the range of about 13 μm to about 25 μm (e.g., about 18 μm). However, the thickness of the lower protective film 400 and the third adhesive layer 1030 are not limited to these values ​​or ranges.

[0106] The light blocking layer 500 may be disposed under the lower protective film 400 , and may be disposed on the first lower member 600 , which will be described below.

[0107] The light blocking layer 500 may be a light blocking coating that may be coated on the top surface of the first lower member 600. The light blocking layer 500 may be in contact with the top surface of the first lower member 600. The first lower member 600 may include a plate 610 that may be formed of or include a metal material, and the light blocking layer 500 may be in contact with the top surface of the plate 610.

[0108] The light blocking layer 500 may include a light absorbing material (e.g., a black material) that prevents external light from being reflected by the first lower member 600 thereunder. The light blocking layer 500 may include, for example, a black dye, a black pigment, or a combination thereof. In an embodiment, the black pigment of the light blocking layer 500 may include carbon black.

[0109] In an embodiment, the light blocking layer 500 may include a polymer resin that can be used as a dielectric material in which a black pigment (e.g., carbon black) can be dispersed. The light blocking layer 500 may include carbon black that can be dispersed in a polymer material such as an acrylic resin, a melamine resin, an epoxy resin, or a combination thereof. The light blocking layer 500 may also include cellulose acetate butyrate that can be used as a polymer material. The light blocking layer 500 may be a single layer made of a polymer resin in which carbon black can be dispersed.

[0110] The light blocking layer 500 may further include at least one of a curing agent, a silane coupling agent, and amorphous silica particles. In an embodiment, the curing agent of the light blocking layer 500 may include blocked polyisocyanate. The silane coupling agent of the light blocking layer 500 may include glycidyloxypropyltrimethoxysilane.

[0111] The light-blocking layer 500 may also include a cross-linking additive. The cross-linking additive may be formed of or include at least one of the materials that can accelerate the cross-linking reaction in forming the light-blocking layer 500 and improve the cross-linking density and surface bonding strength of the light-blocking layer 500. The cross-linking additive may be a co-cross-linking agent. The cross-linking additive may include, for example, trimethylolpropane trimethacrylate. Since the light-blocking layer 500 also includes the cross-linking additive, it may be possible to keep the surface roughness of the light-blocking layer 500 at a low level and improve the surface bonding strength of the light-blocking layer 500.

[0112] The average particle size of the solid in the light blocking layer 500 may be in the range of about 0.1 μm to about 4 μm. In particular, the average particle size of the solid in the light blocking layer 500 may be in the range of about 2 μm to about 3 μm. If the average particle size of the solid in the light blocking layer 500 is less than about 0.1 μm, there may be difficulties in the process, and the light blocking layer 500 may be subjected to low surface adhesive strength, and this may result in reduced adhesive strength with the additional adhesive layer 1050 thereon. If the average particle size of the solid in the light blocking layer 500 is greater than about 4 μm, the surface roughness of the light blocking layer 500 may be increased, and the user may recognize the surface of the light blocking layer 500.

[0113] The surface roughness of the light blocking layer 500 may be less than or equal to about 0.10 μm. If the surface roughness of the light blocking layer 500 is greater than about 0.10 μm, the surface quality of the light blocking layer 500 may be deteriorated, and further, since the surface of the light blocking layer 500 may be recognized by the user, the display quality of the electronic device 1000 may be deteriorated.

[0114] The light blocking layer 500 may have a surface adhesive strength of about 800 gf or more. If the surface adhesive strength of the light blocking layer 500 is less than about 800 gf, the adhesive strength between the light blocking layer 500 and the additional adhesive layer 1050 may be weaker than the adhesive strength between the release film and the additional adhesive layer 1050, and a reverse delamination problem may occur during the process of attaching the additional adhesive layer 1050 to the light blocking layer 500.

[0115] The light blocking layer 500 may be attached to the lower protective film 400 through an additional adhesive layer 1050. The additional adhesive layer 1050 may be disposed between the light blocking layer 500 and the lower protective film 400 so that the light blocking layer 500 and the lower protective film 400 are bonded to each other. The light blocking layer 500 may be directly attached to the lower protective film 400 through the additional adhesive layer 1050. In the present disclosure, the expression "two elements may be directly attached to each other through an adhesive layer" means that these elements may be bonded to each other without any element such as a part of a layer, film, region or plate intervening therebetween or through an adhesive layer interposed therebetween. For example, the expression "two elements may be directly attached to each other through an adhesive layer" means that two elements (e.g., layers or members) may be bonded to each other through an adhesive layer interposed therebetween. The light blocking layer 500 may be in contact with the bottom surface of the additional adhesive layer 1050, and the lower protective film 400 may be in contact with the top surface of the additional adhesive layer 1050.

[0116] In an embodiment, the additional adhesive layer 1050 may not be disposed on a region of the first lower member 600 that may define the opening 611. For example, the additional adhesive layer 1050 may include a first additional adhesive layer 1050-1 and a second additional adhesive layer 1050-2 that may be spaced apart from each other, and the opening 611 may be interposed between the first additional adhesive layer 1050-1 and the second additional adhesive layer 1050-2 when viewed in a plan view.

[0117] The light blocking layer 500 may have a thickness in the range of about 7 μm to about 13 μm. In an embodiment, the thickness of the light blocking layer 500 may be in the range of about 8 μm to about 12 μm. If the thickness of the light blocking layer 500 is less than about 7 μm, the light blocking property of the light blocking layer 500 may be degraded, and the light blocking layer 500 coated on the first lower member 600 may suffer from low durability. If the thickness of the light blocking layer 500 is greater than about 13 μm, the light blocking layer 500 may be thickly formed on the first lower member 600, and it may be difficult to improve the folding property of the electronic device 1000 and the layer forming property of the light blocking layer 500.

[0118] In the manufacture of the electronic device 1000 according to an embodiment of the present disclosure, the light blocking layer 500 may be coated on the first lower member 600 that may be included in the electronic device 1000, and the first lower member 600 coated with the light blocking layer 500 may be attached to the lower protective film 400. The first lower member 600 coated with the light blocking layer 500 may be attached to the lower protective film 400 through the additional adhesive layer 1050.

[0119] The light blocking layer 500 may be formed by coating the first lower member 600 with a coating material containing a light blocking material. In the step of coating the coating material containing a light blocking material on the first lower member 600, the coating may be coated on the first lower member 600 by a spray coating method. Since the coating of the coating may be performed by a spray coating method, it may be possible to perform a subsequent process such as an etching process after the coating step, and the coating process may be performed in a manner suitable for the shape of the opening 611 that may be defined in the folding region of the plate 610.

[0120] As mentioned above, the light-blocking material of the coating may be a black dye, a black pigment or a combination thereof. The light-blocking material may include carbon black.

[0121] The coating may include at least one of a polymer resin, a curing agent, a silane coupling agent, amorphous silica particles, a cross-linking additive, and a solvent. The polymer resin of the coating may be at least one of an acrylic resin, a melamine resin, and an epoxy resin. The polymer resin of the coating may be butyl acetate cellulose. The curing agent of the coating may be a blocked polyisocyanate. The silane coupling agent of the coating may be glycidyloxypropyl trimethoxysilane. The cross-linking additive of the coating may be a co-cross-linking agent, and may be trimethylolpropane trimethacrylate.

[0122] Any material that can dissolve other solutes and allow the coating to be provided as a coating solution can be used as a solvent for the coating without any limitation. For example, the solvent may include at least one of formaldehyde, n-butanol, butyl acetate, methyl isobutyl ketone, isobutyl acetate, propylene glycol methyl ether acetate, isobutyl alcohol, ethylene glycol tert-butyl ether, ethylbenzene and xylene.

[0123] In an embodiment, the coating may include about 20 wt % to about 30 wt % of a polymer resin, about 2 wt % to about 4 wt % of a curing agent, about 1 wt % to about 3 wt % of a silane coupling agent, about 3 wt % to about 7 wt % of amorphous silica particles, about 1 wt % to about 3 wt % of a black pigment, about 5 wt % to about 7 wt % of a cross-linking additive, and about 48 wt % to about 65 wt % of a solvent.

[0124] In an embodiment, the average particle size of the solid in the coating may be in the range of about 0.1 μm to about 4 μm. In detail, the average particle size of the solid in the coating may be in the range of about 2 μm to about 3 μm.

[0125] The first lower member 600 may be disposed below the light blocking layer 500. The first lower member 600 may be coated with the light blocking layer 500 and may be in contact with the light blocking layer 500. The light blocking layer 500 may be in contact with the top surface of the board 610 in the first lower member 600. The first lower member 600 may support other elements disposed thereon. In this sense, the first lower member 600 may be referred to as a supporting member.

[0126] The first lower member 600 may include a plate 610, a lower adhesive layer 620, and a cover layer 630. The elements constituting the first lower member 600 are not limited to the above elements. For example, at least one of the above elements may be omitted, and other elements may be further provided as additional elements of the first lower member 600. The plate 610 may include a material having an elastic modulus greater than about 60 GPa at room temperature. The plate 610 may be formed of or include a metal material. The plate 610 may include a metal material (e.g., at least one of a pure metal and an alloy). For example, the plate 610 may be SUS304, but the present disclosure is not limited to this example. The plate 610 may support an element disposed thereon. The heat dissipation characteristics of the electronic device 1000 may be improved by the plate 610.

[0127] The opening 611 may be defined in a portion of the plate 610. The opening 611 may be defined in a region of the plate 610 that may overlap with the second region 1000A2. When viewed in a plan view (e.g., perpendicular to the third direction DR3), the opening 611 may overlap with the second region 1000A2. Due to the presence of the opening 611, the shape of a portion of the plate 610 may be more easily changed.

[0128] The cover layer 630 may be attached to the board 610 via the lower adhesive layer 620. The lower adhesive layer 620 may include a typical adhesive material, a glue, or a combination thereof. Figure 2 In another embodiment such as the embodiment shown in , the lower adhesive layer 620 may not be provided on the region of the plate 610 that may overlap with the second region 1000A2. The cover layer 630 may cover the opening 611 of the plate 610. Therefore, it may be possible to additionally prevent the contamination material from being supplied into the opening 611.

[0129] The cover layer 630 may be formed of or include a material having a lower elastic modulus than the elastic modulus of the plate 610. The cover layer 630 may be formed of or include at least one of a material having an elastic modulus of about 30 MPa or less and an elongation of less than or equal to 100%. For example, the cover layer 630 may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a polyurethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin. For example, the cover layer 630 may include a thermoplastic polyurethane, but the present disclosure is not limited to this example. The cover layer 630 may be a thermoplastic polyurethane film formed with a mesh pattern.

[0130] The plate 610 may have a thickness in the range of about 120 μm to about 180 μm (e.g., about 150 μm). The lower adhesive layer 620 may have a thickness in the range of about 4 μm to about 15 μm (e.g., about 8 μm). The cover layer 630 may have a thickness in the range of about 4 μm to about 15 μm (e.g., about 8 μm). However, the thicknesses of the plate 610, the lower adhesive layer 620, and the cover layer 630 are not limited to the above values.

[0131] The second lower member 700 may be disposed below the first lower member 600. The plurality of second lower members 700 may be spaced apart from each other. For example, one of the plurality of second lower members 700 may be disposed in the first region 1000A1, and another of the plurality of second lower members 700 may be disposed in the third region 1000A3.

[0132] Each of the plurality of second lower members 700 may be attached to the first lower member 600 by the fourth adhesive layer 1040. For example, one of the plurality of fourth adhesive layers 1040 may be attached to the bottom surface of the first lower member 600 overlapping with the first region 1000A1, and another of the plurality of fourth adhesive layers 1040 may be attached to the bottom surface of the first lower member 600 overlapping with the third region 1000A3. In other words, the fourth adhesive layer 1040 may not overlap with the second region 1000A2. Each of the plurality of fourth adhesive layers 1040 may have a thickness in the range of about 8 μm to about 15 μm (e.g., about 8 μm), but the thickness of each of the plurality of fourth adhesive layers 1040 is not limited thereto.

[0133] Although not shown, the height difference compensation film may also be provided between each of the plurality of second lower members 700 and the first lower member 600. For example, the height difference compensation film may be provided in the region overlapping with the second region 1000A2. The height difference compensation film may have two opposing surfaces having different adhesive strengths from each other. For example, the height difference compensation film may have a non-adhesive surface having substantially no adhesive properties. The non-adhesive surface may be provided to face the first lower member 600.

[0134] Each of the plurality of second lower members 700 may include a lower plate 710, a heat sink 720, and an insulating film 730. The elements constituting the second lower member 700 are not limited to the above elements. For example, at least one of the above elements may be omitted, and other elements may be further provided as additional elements of the second lower member 700.

[0135] In an embodiment, the lower plate 710 may be provided in plurality. One of the plurality of lower plates 710 may overlap a portion of the first region 1000A1 and the second region 1000A2, and another of the plurality of lower plates 710 may overlap another portion of the third region 1000A3 and the second region 1000A2.

[0136] In the second area 1000A2, the plurality of lower plates 710 may be disposed to be spaced apart from each other. However, the plurality of lower plates 710 may be disposed to have a minimum distance therebetween so as to support the area where the opening 611 of the plate 610 is provided. For example, the lower plates 710 may prevent the area where the opening 611 of the plate may be provided from being deformed by the downward pressure applied by the upper element.

[0137] In addition, the lower plate 710 may serve to prevent an upper element that may be disposed on the second lower member 700 from being deformed by a lower element disposed under the second lower member 700 .

[0138] Each of the plurality of lower plates 710 may be formed of or include a metal alloy (e.g., a copper alloy). However, the present disclosure has no limitation on the specific material of the lower plate 710. Each of the plurality of lower plates 710 may have a thickness in the range of about 60 μm to about 100 μm (e.g., about 80 μm), but the thickness of the lower plate 710 is not limited thereto.

[0139] The heat sink 720 may be attached to the bottom surface of the lower plate 710. The heat sink 720 may be a heat conductive sheet having high thermal conductivity. For example, the heat sink 720 may include a heat dissipation layer 721, a first heat dissipation adhesive layer 722, a second heat dissipation adhesive layer 723, and a gap tape 724.

[0140] The gap tape 724 may be attached to the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723, the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723 may be spaced apart from each other, and the heat dissipation layer 721 is interposed therebetween. The gap tape 724 may include a plurality of layers. For example, the gap tape 724 may include a base layer, an upper adhesive layer disposed on the top surface of the base layer, and a lower adhesive layer disposed on the bottom surface of the base layer.

[0141] The heat dissipation layer 721 may be attached to the lower plate 710 by the first heat dissipation adhesive layer 722. The heat dissipation layer 721 may be hermetically sealed by the first heat dissipation adhesive layer 722, the second heat dissipation adhesive layer 723, and the gap band 724. The heat dissipation layer 721 may be a graphitized polymer film. The polymer film may be, for example, a polyimide film. Each of the first heat dissipation adhesive layer 722 and the second heat dissipation adhesive layer 723 may have a thickness in the range of about 3 μm to about 8 μm (e.g., about 5 μm). Each of the heat dissipation layer 721 and the gap band 724 may have a thickness in the range of about 10 μm to about 25 μm (e.g., about 17 μm). However, the thickness of each of the first heat dissipation adhesive layer 722, the second heat dissipation adhesive layer 723, the heat dissipation layer 721, and the gap band 724 is not limited to the above value or range.

[0142] The insulating film 730 may be attached to the bottom surface of the heat sink 720. For example, the insulating film 730 may be attached to the second heat dissipation adhesive layer 723. Due to the insulating film 730, it may be possible to prevent the problem of the rattling sound from occurring in the electronic device 1000. The insulating film 730 may have a thickness of about 15 μm, but the present disclosure is not limited to this example.

[0143] The height difference compensating member 800 may be attached to the bottom surface of the board 610. For example, the lower adhesive layer 620 may be attached to a portion of the bottom surface of the board 610, and the height difference compensating member 800 may be attached to another portion of the bottom surface of the board 610.

[0144] The height difference compensation member 800 may include a first compensation adhesive layer 810, a height difference compensation film 820, and a second compensation adhesive layer 830. The first compensation adhesive layer 810 may be attached to the bottom surface of the board 610. The height difference compensation film 820 may be a synthetic resin film. The second compensation adhesive layer 830 may be attached to the bottom surface of the height difference compensation film 820 and the component (not shown).

[0145] Although not shown, a buffer film including a buffer layer may be further disposed under the second lower member 700 or under the height difference compensating member 800 .

[0146] According to an embodiment of the present disclosure, an electronic device may include: a first lower member that may be disposed below a window and a display panel to support the window and the display panel; and a light blocking layer that may be disposed on the first lower member and includes a black material. The light blocking layer may be coated on the top surface of a metal plate in the first lower member. Therefore, an electronic device having improved impact resistance properties against external impact and effectively suppressing reflection of external light may be provided.

[0147] In more detail, if an elastic buffer layer (e.g., sponge) is provided between the protective film and the first lower member, when the buffer layer is compressed due to an external impact, the window and the display panel on the first lower member may also be compressed, and failures such as cracking or warping may occur. However, in an electronic device according to an embodiment of the present disclosure, the buffer layer may be omitted from the area between the protective film and the first lower member, or the buffer layer may be moved to another area (e.g., under the second lower member), and the first lower member coated with the light-blocking layer may be directly attached to the lower protective film that may be provided under the display panel through an adhesive layer. Therefore, it may be possible to improve the impact resistance of the electronic device against external impacts, compared with the case of an elastic buffer layer provided between the first lower member and the display panel. The light-blocking layer may include a black light-blocking material, and it may be possible to prevent external light from being reflected by the metal plate and thereby improve the visibility of the electronic device.

[0148] Figure 4is a schematic perspective view showing selected elements of an electronic device 1000 according to an embodiment of the present disclosure. For example, Figure 4 1 is an exploded perspective view showing selected elements of the electronic device 1000 (eg, the board 610 in the first lower member 600 and the light blocking layer 500 on the board 610 ). Figure 5A The electronic device 1000 according to the embodiment of the present disclosure can be used with Figure 4 A schematic plan view of a portion of the overlap of area A. Figure 5B The electronic device 1000 according to the embodiment of the present disclosure can be used with Figure 4 A schematic plan view of a portion of the overlapped region A. For example, Figure 5A The light blocking layer 500 is shown Figure 4 overlaps a portion of area A, and Figure 5B The board 610 is shown with Figure 4 A portion of the area A overlaps.

[0149] Reference Figure 2 , Figure 4 , Figure 5A and Figure 5B , the board 610 of the electronic device 1000 may include a first non-folding area 610A1, a folding area 610A2, and a second non-folding area 610A3 that may be arranged in the first direction DR1. The folding area 610A2 of the board 610 may overlap with the second area 1000A2 of the active area 1000A of the electronic device 1000. The first non-folding area 610A1 and the second non-folding area 610A3 of the board 610 may be adjacent to the folding area 610A2, and at least a portion of the first non-folding area 610A1 may overlap with the first area 1000A1 of the active area 1000A of the electronic device 1000, and at least a portion of the second non-folding area 610A3 may overlap with the third area 1000A3 of the active area 1000A of the electronic device 1000. At least a portion of the first non-folding area 610A1 and the second non-folding area 610A3 may overlap with the peripheral area 1000NA of the electronic device 1000. The plate 610 may include a first portion 610 - 1 overlapping the first non-folding region 610A1 , a second portion 610 - 2 overlapping the folding region 610A2 , and a third portion 610 - 3 overlapping the second non-folding region 610A3 .

[0150] The plate 610 may include an opening 611 that may overlap the folding area 610A2. For example, the opening 611 that overlaps the folding area 610A2 may be defined in the plate 610. The opening 611 may overlap the second area 1000A2 of the active area 1000A of the electronic device 1000. The opening 611 may be provided to form a plurality of rows. In an embodiment, the openings 611 may be arranged to form a plurality of rows, and the plurality of rows may be staggered from each other in an alternating manner.

[0151] The light blocking layer 500 may include a first light blocking portion 501 overlapping the first non-folding region 610A1 of the plate 610, a second light blocking portion 502 overlapping the folding region 610A2, and a third light blocking portion 503 overlapping the second non-folding region 610A3. The first light blocking portion 501 may overlap the first portion 610-1 of the plate 610, the second light blocking portion 502 may overlap the second portion 610-2 of the plate 610, and the third light blocking portion 503 may overlap the third portion 610-3 of the plate 610.

[0152] The light blocking layer 500 may include a light blocking opening 511 in the second light blocking portion 502. For example, the light blocking opening 511 may be defined in the second light blocking portion 502 of the light blocking layer 500. When viewed in a plan view, the plurality of light blocking openings 511 may overlap with the plurality of openings 611 defined in the folding area 610A2 of the plate 610, respectively. In detail, the light blocking opening 511 may be defined to have the same shape and arrangement as the opening 611. For example, the light blocking opening 511 may be arranged to form a plurality of rows, and the plurality of rows may be staggered from each other in an alternating manner. In the process of coating the top surface of the plate 610 with the light blocking layer 500, a coating containing a light blocking material may be applied to the remaining area of ​​the plate 610 except the opening 611 to form the light blocking layer 500. Therefore, the light blocking opening 511 and the opening 611 may completely overlap each other.

[0153] Since the light blocking opening 511 defined in the light blocking layer 500 may completely overlap with the opening 611 defined in the plate 610, the opening 611 defined in the plate 610 may not be covered by the light blocking layer 500 and may remain open when viewed in a plan view. Therefore, the folding property of the folding region 610A2 of the plate 610 may not be deteriorated, and the shape of the folding region 610A2 may be more easily changed by a folding operation.

[0154] Figure 6 is a schematic cross-sectional view showing an electronic device 1000 - 1 according to an embodiment of the present disclosure. For example, Figure 6 is along Figure 1A A cross-sectional view taken along line I-I'. Figure 6 In the description of the electronic device 1000-1, previously referenced Figure 2 , Figure 3 , Figure 4 , Figure 5A and Figure 5B The described elements may be denoted by the same reference numerals without repeating their redundant descriptions.

[0155] exist Figure 6 In the electronic device 1000-1, Figure 2 Unlike the electronic device 1000 of the present invention, the light blocking layer 500-1 may be attached to the first lower member 600 through an additional light blocking adhesive layer 1060. The light blocking layer 500-1 may be provided in the form of a light blocking sheet, and may be attached to the first lower member 600 through the light blocking adhesive layer 1060. The light blocking layer 500-1 may be directly attached to the first lower member 600 through the light blocking adhesive layer 1060. For example, the light blocking layer 500-1 may be in contact with the top surface of the light blocking adhesive layer 1060, and the first lower member 600 may be in contact with the bottom surface of the light blocking adhesive layer 1060.

[0156] The light blocking layer 500-1 may be attached to the first lower member 600 by the light blocking adhesive layer 1060. For example, the light blocking layer 500-1 may be attached to the top surface of the board 610 by the light blocking adhesive layer 1060. The light blocking adhesive layer 1060 may include a typical adhesive material, a glue, or a combination thereof. Figure 6 In another embodiment like the embodiment shown in , the light blocking adhesive layer 1060 may not be disposed on the area of ​​the board 610 overlapping the second area 1000A2.

[0157] The light blocking layer 500-1 may define light blocking openings 511-1 therein. When viewed in a plan view, the plurality of light blocking openings 511-1 may respectively overlap with the plurality of openings 611 of the board 610. The light blocking openings 511-1 that may be defined in the light blocking layer 500 may completely overlap with the openings 611 that may be defined in the board 610.

[0158] Figure 7 is a schematic diagram including images taken to illustrate surface roughness characteristics of plates according to example embodiments and comparative embodiments.

[0159] exist Figure 7 In the figure, image A shows the surface of the plate not formed with the light-blocking coating, and images B and C show the surface of the plate coated with the light-blocking coating. The light-blocking coating in image B is formed using a coating material containing solids having an average particle size of about 5 μm, and the light-blocking coating in image C is formed using a coating material containing solids having an average particle size of about 2 μm.

[0160] exist Figure 7 , the measured values ​​of surface roughness for the plates shown in Image A, Image B, and Image C were about 0.1 μm, about 0.26 μm, and about 0.05 μm, respectively.

[0161] These surface roughness measurement results show that if a light blocking layer is formed on the top surface of the panel by coating a coating including solid particles having an average particle size of less than about 0.4 μm, it may be possible to allow the lower member to have a low surface roughness and thereby prevent the display quality of the electronic device from deteriorating.

[0162] Figure 8 is a schematic diagram including images taken to illustrate surface adhesive strength characteristics of boards according to example embodiments and comparative embodiments.

[0163] exist Figure 8 In the figure, each of image A and image B shows the top surface of the coating, which is prepared by forming an adhesive layer with a release film attached on the coating and removing the release film; and image B shows the top surface of the coating, which is prepared by forming an adhesive layer with a release film attached on the coating and removing the release film. For image A and image B, the surface adhesive strengths of the coating are about 476 gf and about 990 gf, respectively.

[0164] Figure 8 It is shown that if the surface bonding strength of the light-blocking coating is less than about 800 gf (e.g., about 476 gf), it may be less than the bonding strength between the release film and the adhesive layer, and therefore, when the release film is removed, the adhesive layer may be removed together with the release film, or may be partially detached to form stains. However, in the case of the light-blocking coating according to an embodiment of the present disclosure, the surface bonding strength between the light-blocking coating and the adhesive layer may be greater than about 800 gf, and therefore, may be greater than the surface bonding strength between the release film and the adhesive layer. Therefore, when the release film is removed, the adhesive layer will not detach, and therefore, an electronic device with improved reliability can be provided.

[0165] 9A to 9C is a schematic diagram including an image that is taken to evaluate the characteristics of an electronic device according to an embodiment of the present disclosure. 9A to 9C In each of the experiments, a plate coated with a light-blocking coating according to an embodiment of the present disclosure was used as a sample.

[0166] exist Fig.9A In the experiment, the sample was kept under high temperature (e.g., about 70°C) and high humidity (e.g., about 90%) conditions for about 24 hours. Two images were taken from the sample to check whether detachment or discoloration problems occurred under high temperature and high humidity conditions. Fig.9A , Image A and Image B show surface images of the sample taken before and after the test under high temperature and high humidity conditions, respectively. Fig.9AIt is shown that when the light-blocking coating according to the embodiment of the present disclosure is used, there is no problem of detachment or discoloration at the edge even under high temperature and high humidity conditions.

[0167] exist Fig. 9B In the experiment, a scratch was formed on the sample and the sample was tested in a heating bath at about 80°C to see if peeling occurred near the scratch under such conditions. Fig. 9B , Image A and Image B show surface images of the sample taken before and after the heating bath conditions, respectively. Fig. 9B It is shown that when the light-blocking coating according to the embodiment of the present disclosure is used, no peeling phenomenon occurs near the scratch even under the heating bath condition.

[0168] exist Fig. 9C In the experiment, the folding operation was repeatedly performed on the sample, and the sample was inspected to see if peeling or cracks occurred on the coating near the folded portion. Fig. 9C The image shows the sample after performing the folding operation approximately 150,000 times. Fig. 9C It is shown that when the light-blocking coating according to the embodiment of the present disclosure is used and the folding operation is repeated within a reasonable range, no cracks or coating peeling occur near the folded portion.

[0169] Reference 9A to 9C According to the results in Figure 1, in the case of using the light-blocking coating according to the embodiment of the present disclosure, failure of the coating (such as cracks or coating peeling) does not occur under various reliability evaluation conditions (e.g., high temperature and high humidity conditions, heating bath conditions, and repeated folding conditions). This shows that according to the embodiment of the present disclosure, it may be possible to improve the reliability and durability of electronic devices including the light-blocking coating.

[0170] Table 1 below summarizes the impact resistance and repellency properties in electronic devices according to two different embodiments. The data in the row of "Example Embodiment" represents an electronic device including a board coated with a light blocking coating according to an embodiment of the present disclosure, or having Figure 2 The data in the row of "Comparative Embodiment" represents an electronic device including an elastic buffer layer provided between the board and the lower protective member. In Table 1, the item of "Impact Resistance" is obtained by measuring the minimum height of a bright spot appearing through a pen drop test, and the item of "Repulsive Property" is obtained by multiplying the repulsive force applied to resist an object dropped from a specific height by the height.

[0171]

Table 1

[0172]

[0173] Referring to the results of Table 1, when compared with the comparative embodiment, in the case of the electronic device including the plate coated with the light-blocking coating according to the embodiment of the present disclosure, the height at which the bright spot appears increases by about 2.5 times, and the repelling property decreases by about 30% at room temperature and by about 45% at low temperature. These results show that, compared with the electronic device including the elastic buffer layer in question, the electronic device including the plate coated with the light-blocking coating according to the embodiment of the present disclosure can have strong impact resistance against external impact, and thus can improve the durability and reliability of the electronic device.

[0174] In the display panel according to the embodiment of the present disclosure, the buffer layer can be omitted from the space between the lower protective film and the metal support member, and the light blocking layer can be coated on the metal support member or the light blocking layer can be attached to the metal support member in the form of a sheet. The electronic device has improved impact resistance and prevents reflection of external light that may be caused by the metal support member.

[0175] While example embodiments of the present disclosure have been particularly shown and described, it will be understood by those skilled in the art that changes in form and details may be made therein without departing from the spirit and scope of the appended claims including their equivalents.

Claims

1. An electronic device, comprising: window; A display panel, disposed below the window; A supporting member, disposed below the display panel; as well as a light blocking layer, disposed on the supporting member, Wherein, the light blocking layer comprises a light absorbing material, The light blocking layer is directly disposed on the support member or is directly attached to the support member via an adhesive layer, The support member comprises a plate and a folding region, The plate includes a plurality of openings overlapping the folding region, and The light blocking layer includes a plurality of openings overlapping the plurality of openings of the plate.

2. The electronic device according to claim 1, wherein: The plate comprises a metallic material, and The light blocking layer is directly disposed on the board or is directly attached to the board through the adhesive layer.

3. The electronic device according to claim 2, wherein: The plate further includes a first non-folding area and a second non-folding area, the folding area being disposed between the first non-folding area and the second non-folding area.

4. The electronic device according to claim 1, wherein: The light blocking layer includes at least one of a black dye and a black pigment.

5. The electronic device according to claim 4, wherein: The light blocking layer includes at least one of a polymer resin, a curing agent, a silane coupling agent and amorphous silica particles.

6. The electronic device according to claim 4, wherein: The average particle size of the solid in the light blocking layer is in the range of 0.1 μm to 4 μm.

7. The electronic device according to claim 4, wherein: The light blocking layer includes a cross-linking additive.

8. The electronic device according to claim 1, wherein: The light-blocking layer is a light-blocking coating directly coated on the supporting member.

9. The electronic device according to claim 1, wherein: The light blocking layer is a light blocking sheet attached to the support member through the adhesive layer.

10. The electronic device according to claim 1, further comprising a lower protective film disposed below the display panel, in, The light blocking layer is directly attached to the lower protective film through an additional adhesive layer.

11. The electronic device according to claim 1, wherein: The thickness of the light blocking layer is in the range of 7 μm to 13 μm.

12. The electronic device according to claim 1, wherein: The surface roughness of the light-blocking layer is less than or equal to 0.10 μm.

13. The electronic device according to claim 1, wherein: The surface adhesive strength of the light-blocking layer is greater than or equal to 800 gf.

14. An electronic device comprising: window; A display panel, disposed below the window; A supporting member, disposed below the display panel; as well as a light blocking layer, disposed on the supporting member, wherein the light blocking layer comprises a light absorbing material and is directly coated on the supporting member, The supporting member includes a first unfolded area, a second unfolded area, and a folded area disposed between the first unfolded area and the second unfolded area, the folded area includes a plurality of openings, and The light blocking layer includes a plurality of openings overlapping the plurality of openings of the support member.

15. A method for manufacturing an electronic device, the electronic device comprising a window, a display panel disposed below the window, and a support member disposed below the display panel, the method comprising: manufacturing the support member and attaching the support member to the bottom surface of the display panel, wherein manufacturing the support member comprises forming a light blocking layer by coating a coating material comprising a light absorbing material on a plate, the plate comprising a metal material, The support member comprises a folding region, The plate includes a plurality of openings overlapping the folding region, and The light blocking layer includes a plurality of openings overlapping the plurality of openings of the plate.

16. The method according to claim 15, wherein: Forming the light blocking layer includes coating the coating on the board using a spray coating method.

17. The method according to claim 15, wherein: The plate further comprises a first non-folding area and a second non-folding area, the folding area being disposed between the first non-folding area and the second non-folding area, and The forming of the light blocking layer is performed such that the coating material is coated on the remaining area of ​​the plate except for the area overlapping with the plurality of openings.

18. The method according to claim 15, wherein: The light absorbing material includes at least one of a polymer resin, a curing agent, a silane coupling agent, a black pigment, amorphous silica particles, and a solvent.

19. The method according to claim 15, wherein: The average particle size of the solid in the light absorbing material is in the range of 0.1 μm to 4 μm.

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