A fixture for clamping wafer

Abstract

The present invention relates to the technical field of mechanical fixtures, and discloses a fixture for clamping wafers, comprising a cylinder, at least three clamping jaws, at least three supporting assemblies and a driving assembly; a slide groove is provided on the clamping jaw; the supporting assembly is fixedly connected to the cylinder, the supporting assembly is arranged corresponding to the clamping jaw, the supporting assembly comprises a supporting shaft, part of the supporting shaft is arranged in the slide groove; one end of the clamping jaw is rotatably connected to the driving assembly. The technical solution of the present invention realizes the function of rapidly transferring wafers by adopting a cylinder, at least three clamping jaws, at least three supporting assemblies and a driving assembly; solves the non-standardization and safety problems in wafer transfer after debonding is completed; protects the safety of operating staff, prevents wafers from slipping and breaking, improves the work efficiency of wafer production, and reduces the occurrence of wafer contamination caused by operation.

Description

Technical Field

[0001] The present invention relates to the technical field of mechanical fixtures, and in particular to a fixture for clamping a wafer. Background Art

[0002] At present, in the chip production process, it is necessary to thin and grind the wafers that have been initially formed. Before grinding, the wafers need to be bonded to sapphire and then ground. After grinding, the wafers need to be debonded to separate the wafers from the sapphire. Debonding requires a debonder. The wafer is placed on a silicon wafer larger than the wafer size and placed on the equipment carrier. Debonding is achieved by heating the carrier to transfer the temperature to the sapphire and the wafer, so that the adhesive between the sapphire and the wafer melts, thereby achieving the effect of the wafer being separated from the sapphire. After the debonding is completed, there is still residual adhesive on the surface of the wafer, which needs to be transferred to the cleaning machine to clean the surface of the wafer. Since the debonding machine debonds by heating, it is necessary to wait for the wafer to cool down after the debonding is completed. Then the wafer is transferred.

[0003] Currently, after debonding is completed, the wafer is manually transferred to the cleaning machine by touching it directly with the hands. Since it takes too long to wait for the wafer to completely cool down, for the sake of work efficiency and progress, the wafer is directly transferred by hand before the wafer is completely cooled down. This transfer method is very likely to cause burns to the operator's hands or the risk of the wafer slipping and breaking. The operation is not standardized. Summary of the invention

[0004] The main purpose of the present invention is to provide a clamp, which is intended to realize the function of quickly transferring wafers and improve the efficiency of wafer processing. It solves the non-standardization and safety problems that occur in wafer transfer after bonding is completed. It protects the safety of operating staff, prevents wafers from slipping and breaking, improves production efficiency, and reduces the occurrence of wafer contamination caused by operation.

[0005] In order to achieve the above-mentioned object, the clamp proposed in the present invention comprises:

[0006] Cylinder;

[0007] At least three clamping jaws, each of which is provided with a slide groove;

[0008] At least three support assemblies, wherein the support assemblies are fixedly connected to the cylinder, the support assemblies are arranged corresponding to the clamping jaws, and the support assemblies include support shafts, and part of the support shafts are arranged in the slide grooves;

[0009] A driving assembly, one end of the clamping jaw is rotatably connected to the driving assembly.

[0010] Optionally, two slide grooves are provided on the clamping jaw, and the supporting assembly includes two supporting shafts, which are perpendicular to the movement plane of the clamping jaw and are respectively arranged on both sides of the movement plane of the positioning jaw, and the slide grooves are respectively located on both sides of the movement plane of the clamping jaw.

[0011] Optionally, the support assembly further includes two support blocks, wherein the support blocks are fixedly disposed on the cylinder, and the support shaft is fixed on the support blocks.

[0012] Optionally, the clamp includes a transmission rod, a connecting rod and a contact block; one end of the transmission rod is rotatably connected to the driving assembly, the other end of the transmission rod is connected to the connecting rod, and the connecting rod is fixedly connected to the contact block.

[0013] Optionally, the transmission rod is detachably connected to the connecting rod.

[0014] Optionally, the driving assembly includes a driving rod and a driving spring, the driving spring is disposed in the cylinder, one end of the driving rod is in contact with the driving spring and is disposed in the cylinder, and the other end of the driving rod is disposed outside the cylinder;

[0015] At least three strip-shaped holes are formed on the cylinder body, and one end of the clamping claw passes through the strip-shaped hole and is rotatably connected to the driving rod.

[0016] Optionally, a sliding column is provided at one end of the driving rod in contact with the driving spring, and a diameter of the sliding column is larger than a diameter of the driving rod and smaller than an inner diameter of the cylinder.

[0017] Optionally, at least three driving members are fixedly arranged on the driving rod, and the driving members include: two driving blocks and a driving shaft, one end of the positioning claw is provided with a driving hole, both ends of the driving shaft are respectively fixedly connected to the driving blocks, and the driving shaft passes through the driving hole.

[0018] Optionally, a hand-held ball is provided at one end of the driving rod outside the cylinder.

[0019] Optionally, a hand-held ring is provided at the mouth of the cylinder extending in the outer diameter direction.

[0020] The technical solution of the present invention realizes the function of quickly transferring wafers by adopting a cylinder, at least three clamps, at least three supporting components and a driving component, thereby improving the efficiency of wafer processing; solves the non-standardization and safety problems that occur in wafer transfer after the bonding is completed; protects the safety of operating employees, prevents the wafer from slipping and breaking, improves the work efficiency of wafer production, and reduces the occurrence of wafer contamination caused by operation; and can be used in wafer transfer that is not easy to transfer directly by hand or has safety risks. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0022] Figure 1 It is a structural schematic diagram of an embodiment of a clamp of the present invention;

[0023] Figure 2 It is a structural schematic diagram of another embodiment of the clamp of the present invention;

[0024] Figure 3 for Figure 2 A partial enlarged view of the middle A;

[0025] Figure 4 It is a structural schematic diagram of another embodiment of the clamp of the present invention;

[0026] Figure 5 for Figure 4 A partial enlarged view of point B in the middle;

[0027] Figure 6 for Figure 4 A partial enlarged view of point C in the middle.

[0028] Description of Figure Numbers:

[0029]

[0030]

[0031] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0034] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0035] The present invention provides a clamp 100 .

[0036] In the embodiment of the present invention, Figure 1-6As shown, the clamp 100 includes a barrel 110, at least three clamping jaws 120, at least three supporting assemblies 130 and a driving assembly 140; the clamping jaws 120 are provided with a slide groove 121; the supporting assembly 130 is fixedly connected to the barrel 110, the supporting assembly 130 is arranged corresponding to the clamping jaws 120, the supporting assembly 130 includes a supporting shaft 131, part of the supporting shaft 131 is arranged in the slide groove 121; one end of the clamping jaw 120 is rotatably connected to the driving assembly 140. Each supporting assembly 130 is evenly arranged outside the barrel 110. One end of the driving assembly 140 is arranged in the barrel 110. When the operator needs to clamp the wafer through the clamp 100, the operator holds the driving assembly 140 with one hand and holds the cylinder 110 with the other hand. The operator drives the driving assembly 140 to move toward the bottom of the cylinder 110. Under the support of the support assembly 130, the clamp 120 is driven by the driving assembly 140, and the end of the clamp 120 connected to the driving assembly 140 moves toward the bottom of the cylinder 110; and the other end of the clamp 120 is moved away from the bottom of the cylinder 110 under the action of the support shaft 131 and the slide groove 121, that is, at least three clamps 120 are opened; the opened clamp 120 can be moved to the outside of the wafer on the sapphire. Then drive the driving assembly 140 to move away from the bottom of the cylinder 110, and the driving assembly 140 drives the end of the clamp 120 connected to the drive to move away from the bottom of the cylinder 110; and the other end of the clamp 120 moves toward the bottom of the cylinder 110 under the action of the supporting assembly 130, that is, at least three clamps 120 are contracted to fix the wafer inside at least three clamps 120; when each clamp 120 is in contact with the outer circumference of the wafer, stop the movement of the driving assembly 140. Then the wafer is driven away from the sapphire by the clamp 100. Among them, the space captured by the clamp 120 corresponds to the size of the wafer. The clamp 100 is mainly made of aluminum alloy, which has the advantages of light weight and softness, high strength, good rigidity, durability, and corrosion resistance.

[0037] The technical solution of the present invention realizes the function of quickly transferring wafers and improves the efficiency of wafer processing by adopting a cylinder 110, at least three clamps 120, at least three support components 130 and a drive component 140; solves the non-standardization and safety problems in wafer transfer after the bonding is completed; protects the safety of operating employees, prevents the wafer from slipping and breaking, improves the work efficiency of wafer production, and reduces the occurrence of wafer contamination caused by operation; and can be used in wafer transfer that is not easy to transfer directly by hand or has safety risks.

[0038] Specifically, in order to improve the gripping efficiency of the clamp 100 in gripping the wafer, and to more stably drive the clamp 120 to move through the driving assembly 140. The clamp 120 is provided with two said slide grooves 121, and the said support assembly 130 includes two said support shafts 131, and the said support shafts 131 are perpendicular to the movement plane of the clamp 120 and the said support shafts 131 are respectively arranged on both sides of the movement plane of the positioning claw, and the slide grooves 121 are respectively located on both sides of the movement plane of the clamp 120. When the support assembly 130 includes one support shaft 131, the slide groove 121 is a bar-shaped hole passing through the movement plane of the clamp 120, and the support shaft 131 passes through the slide groove 121; so that the support shaft 131 slides in the bar-shaped hole. When the support assembly 130 includes two support shafts 131, two slide grooves 121 are opened on the clamping jaw 120, the support shafts 131 are perpendicular to the movement plane of the clamping jaw 120 and the support shafts 131 are respectively arranged on both sides of the movement plane of the positioning jaw, and the slide grooves 121 are respectively located on both sides of the movement plane of the clamping jaw 120; the two support shafts 131 limit the clamping jaw 120 to slide between the two support shafts 131 through the two slide grooves 121 arranged on both sides of the movement plane of the clamping jaw 120.

[0039] Specifically, in order to better fix the support shaft 131 and more stably drive the clamping jaw 120 to move through the driving assembly 140, the support assembly 130 further includes two support blocks 132, the support blocks 132 are fixedly disposed on the cylinder 110, and the support shaft 131 is fixed on the support blocks 132.

[0040] Specifically, in order to better fix the wafer and save space of the clamp 100, the clamp 120 includes a transmission rod 122, a connecting rod 123 and a contact block 124; one end of the transmission rod 122 is rotatably connected to the driving assembly 140, the other end of the transmission rod 122 is connected to the connecting rod 123, and the connecting rod 123 is fixedly connected to the contact block 124. The contact block 124 is used to carry and contact the wafer, and the connecting rod 123 is used to fix and limit the wafer.

[0041] Specifically, in order to replace the connecting rod 123 and the contact block 124, save the use cost of the fixture 100, and prevent the fixture 100 from being replaced due to the corrosion of the connecting rod 123 and the contact block 124 by immersion in acid, alkali, and organic solutions. The transmission rod 122 is detachably connected to the connecting rod 123. Through the detachable connection between the transmission rod 122 and the connecting rod 123, after the connecting rod 123 and the contact block 124 are corroded, only the connecting rod 123 and the contact block 124 can be replaced without discarding the fixture 100, thereby saving the use cost of producing wafers.

[0042] Specifically, in order to realize automatic wafer clamping, the position of the clamping jaw 120 is automatically adjusted according to the size of the wafer. The driving assembly 140 includes a driving rod 141 and a driving spring 142, wherein the driving spring 142 is disposed in the cylinder 110, one end of the driving rod 141 contacts the driving spring 142 and is disposed in the cylinder 110, and the other end of the driving rod 141 is disposed outside the cylinder 110; at least three strip holes 111 are provided on the cylinder 110, and one end of the clamping jaw 120 passes through the strip holes 111 and is rotatably connected to the driving rod 141. The support blocks 132 are disposed on both sides of the strip holes 111. When the operator needs to clamp the wafer through the clamp 100, the operator holds the driving rod 141 with one hand and holds the cylinder 110 with the other hand. The operator drives the driving rod 141 to move toward the bottom of the cylinder 110, and the driving spring 142 produces compression deformation under the action of the driving rod 141. Under the support of the support assembly 130, the clamp 120 is driven by the driving rod 141, and the end of the clamp 120 connected to the driving rod 141 moves toward the bottom of the cylinder 110; and the other end of the clamp 120 moves away from the bottom of the cylinder 110 under the action of the support shaft 131 and the slide groove 121, that is, at least three clamps 120 are opened; the opened clamp 120 can be moved to the outside of the wafer on the sapphire. When the operator does not apply force to the cylinder 110 and the driving rod 141, the driving spring 142 drives the driving rod 141 to move away from the bottom of the cylinder 110 under the action of the elastic force of the spring, and the driving rod 141 drives the end of the clamping jaw 120 connected to the drive to move away from the bottom of the cylinder 110; and the other end of the clamping jaw 120 moves toward the bottom of the cylinder 110 under the action of the supporting assembly 130, that is, at least three clamping jaws 120 contract to fix the wafer inside at least three clamping jaws 120; when each clamping jaw 120 contacts the outer circumference of the wafer, the driving assembly 140 stops moving. Then the wafer is driven away from the sapphire by the fixture 100.

[0043] Specifically, in order to drive the driving rod 141 more stably, a sliding column 143 is provided at one end of the driving rod 141 that contacts the driving spring 142 . The diameter of the sliding column 143 is larger than the diameter of the driving rod 141 and slightly smaller than the inner diameter of the cylinder 110 .

[0044] Specifically, in order to better drive the clamping jaw 120 to rotate, at least three driving members are fixedly arranged on the driving rod 141, and the driving members include: two driving blocks 143 and a driving shaft 144, one end of the positioning jaw is provided with a driving hole, and both ends of the driving shaft 144 are respectively fixedly connected to the driving block 143, and the driving shaft 144 passes through the driving hole.

[0045] Specifically, in order to better hold the driving rod 141 , a hand-held ball 145 is provided at one end of the driving rod 141 disposed outside the cylinder 110 .

[0046] Specifically, in order to better hold the cylinder 110 , a hand-holding ring 112 is provided at the mouth of the cylinder 110 extending in the outer diameter direction.

[0047] The technical solution of the present invention realizes the function of quickly transferring wafers and improves the efficiency of wafer processing by adopting a cylinder 110, at least three clamps 120, at least three support components 130 and a drive component 140; solves the non-standardization and safety problems in wafer transfer after the bonding is completed; protects the safety of operating employees, prevents the wafer from slipping and breaking, improves the work efficiency of wafer production, and reduces the occurrence of wafer contamination caused by operation; and can be used in wafer transfer that is not easy to transfer directly by hand or has safety risks.

[0048] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A fixture for clamping a wafer, characterized in that: The fixture comprises: Cylinder; At least three clamping jaws, each of which is provided with a slide groove; At least three support assemblies, wherein the support assemblies are fixedly connected to the cylinder, the support assemblies are arranged corresponding to the clamping jaws, and the support assemblies include support shafts, and part of the support shafts are arranged in the slide grooves; A driving assembly, one end of the clamping jaw is rotatably connected to the driving assembly, at least three strip holes are provided on the cylinder, one end of the clamping jaw passes through the strip holes and is rotatably connected to the driving rod, wherein the support block is arranged on both sides of the strip holes, two slide grooves are provided on the clamping jaw, and the supporting assembly includes two support shafts, the support shafts are perpendicular to the movement plane of the clamping jaw and the support shafts are respectively arranged on both sides of the movement plane of the positioning jaw, and the slide grooves are respectively located on both sides of the movement plane of the clamping jaw.

2. The clamp according to claim 1, characterized in that: The support assembly also includes two support blocks, the support blocks are fixedly arranged on the cylinder, and the support shaft is fixed on the support blocks.

3. The clamp according to claim 1, characterized in that: The clamp comprises a transmission rod, a connecting rod and a contact block; one end of the transmission rod is rotatably connected to the driving assembly, the other end of the transmission rod is connected to the connecting rod, and the connecting rod is fixedly connected to the contact block.

4. The clamp according to claim 3, characterized in that: The transmission rod is detachably connected to the connecting rod.

5. The clamp according to claim 1, characterized in that: The driving assembly comprises a driving rod and a driving spring, wherein the driving spring is disposed in the cylinder, one end of the driving rod contacts the driving spring and is disposed in the cylinder, and the other end of the driving rod is disposed outside the cylinder; At least three strip-shaped holes are formed on the cylinder body, and one end of the clamping claw passes through the strip-shaped hole and is rotatably connected to the driving rod.

6. The clamp according to claim 5, characterized in that: A sliding column is arranged at one end of the driving rod that contacts the driving spring. The diameter of the sliding column is larger than the diameter of the driving rod and smaller than the inner diameter of the cylinder.

7. The clamp according to claim 5, characterized in that: At least three driving members are fixedly arranged on the driving rod, and the driving members include: two driving blocks and a driving shaft. A driving hole is opened at one end of the positioning claw, and both ends of the driving shaft are respectively fixedly connected to the driving blocks, and the driving shaft passes through the driving hole.

8. The clamp according to claim 5, characterized in that: One end of the driving rod outside the cylinder is provided with a hand-held ball.

9. The clamp according to claim 5, characterized in that: A hand-holding ring is provided at the mouth of the cylinder body extending in the outer diameter direction.

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