An automatic microscopic inspection system and microscopic inspection method for chip electrolytic capacitors

Abstract

The present invention discloses an automatic microscopic inspection system and microscopic inspection method for chip electrolytic capacitors, and belongs to the field of microscopic inspection technology for chip electrolytic capacitors. The system includes a frame and a controller, and the frame is provided with a feeding mechanism, a collection box, an orientation correction mechanism, a discharging mechanism, a feeding and cutting mechanism, and a discharging mechanism in sequence according to the product flow path. The frame is provided with a microscopic inspection component just above the discharging port of the feeding mechanism, and the frame is provided with a moving mechanism between the discharging port of the feeding mechanism and the feeding port of the discharging mechanism, and the controller is arranged on the frame. It can realize automatic microscopic inspection, automatically remove products whose specifications, models or lead directions do not meet the requirements, automatically correct the product placement orientation, automatically stick the products on the masking tape, automatically cut off the masking tape, and automatically code the materials, etc. The system has a high degree of automation and high production efficiency, and meets the batch microscopic inspection needs of chip electrolytic capacitors.

Description

Technical Field

[0001] The invention relates to an automatic microscopic inspection system and a microscopic inspection method for a chip electrolytic capacitor, belonging to the technical field of microscopic inspection of chip electrolytic capacitors. Background Art

[0002] Appearance inspection is one of the important manufacturing processes of chip electrolytic capacitors. Only products that pass the appearance inspection can be delivered to users. The traditional appearance inspection is to manually arrange the sides of the chip electrolytic capacitors on the masking tape and inspect them under a microscope. The traditional appearance inspection method has the following shortcomings: First, the efficiency of manually placing the chip electrolytic capacitors on the masking tape is low, and it is easy to have problems such as inconsistent directions and uneven spacing; second, the product model, specifications and other information are all on the front of the chip electrolytic capacitor, and the side of the chip electrolytic capacitor is manually glued to the masking tape. If mixing occurs, it is not easy to be detected; third, with the substantial increase in the demand for chip electrolytic capacitors, the traditional manual external inspection method can no longer meet production needs.

[0003] A Chinese patent document with publication number CN110261398A discloses an automatic capacitor detection machine, comprising: a feeding mechanism, comprising a docking feeding component and a dividing component, the dividing component can convey the capacitors conveyed by the feeding component to a first detection mechanism one by one; a first detection mechanism, comprising a turntable component, the turntable component is provided with a plurality of fixture shafts that adsorb capacitors and can rotate, the turntable component can drive the fixture shaft to dock with the dividing component and a center positioning component, a weld foot positioning detection component, a rotation detection component, a defective product rejection component and a material transfer component sequentially arranged around the turntable component; a re-inspection mechanism, comprising a glass plate component and a first radial positioning component, a second radial positioning component, a downward detection component, an upward detection component, multiple side detection components, multiple first downward detection components, a first defective product rejection component and a feeding component sequentially arranged around the glass plate component.

[0004] However, the automatic capacitor inspection machine is only suitable for the appearance inspection of cylindrical capacitors, and cannot be used to inspect the appearance of chip electrolytic capacitors. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides an automatic microscopic inspection system and a microscopic inspection method for chip electrolytic capacitors.

[0006] The present invention is achieved through the following technical solutions:

[0007] An automatic microscopic inspection system for chip electrolytic capacitors comprises a frame and a controller. The frame is provided with a feeding mechanism, a collecting box, an orientation correction mechanism, a discharging mechanism, a feeding and cutting mechanism and a discharging mechanism in sequence according to a product flow path. The frame is provided with a microscopic inspection component just above a discharging port of the feeding mechanism. The frame is provided with a moving mechanism between the discharging port of the feeding mechanism and the feeding port of the discharging mechanism. The controller is arranged on the frame.

[0008] The feeding mechanism includes a vibration plate and a linear vibrator, the feed port of the linear vibrator is connected to the discharge port of the vibration plate, the microscopic inspection component is a CCD detector, and the vibration plate, the linear vibrator and the CCD detector are all electrically connected to the controller.

[0009] The material handling mechanism includes a chassis, a motor A, a driven synchronous pulley and a translation plate. The chassis is connected to the frame through a bracket A. Motor A is arranged in the chassis and electrically connected to the controller. The output shaft of motor A passes through bracket A and is fitted with a driving synchronous pulley. The driven synchronous pulley is movably connected to bracket A through a central axis. The driven synchronous pulley and the driving synchronous pulley are arranged at the same elevation, and the driven synchronous pulley is connected to the driving synchronous pulley through a synchronous belt. A vacuum air nozzle A and a vacuum air nozzle B are provided on the translation plate. The translation plate is respectively connected to the ends of the output shaft and the central axis of motor A through a connecting plate. The vacuum air nozzle A and the vacuum air nozzle B are respectively connected to the vacuum pump through pipes.

[0010] The orientation correction mechanism includes a motor B, which is connected to the frame through a bracket B. The output shaft of the motor B is vertically upward, and a product receiving groove is provided at its end. The motor B is electrically connected to the controller.

[0011] The material discharging mechanism includes a material pushing assembly and a material sticking assembly, both of which are connected to the frame through a bracket B, and the material pushing assembly is located at the feeding side of the material sticking assembly;

[0012] The pushing assembly includes a pushing cylinder and a block to be displaced, the pushing cylinder and the block to be displaced are connected to the bracket B through a supporting block, and the block to be displaced is located between the pushing cylinder and the bonding assembly, a pushing rod is installed on the pushing cylinder, a limiting notch is provided on one end of the pushing rod close to the block to be displaced, and a product limiting groove is provided on the block to be displaced;

[0013] The adhesive component includes a motor C, a guide wheel and a guide strip. The motor C is arranged on a bracket B. The motor C is electrically connected to a controller. A masking film and a limit plate are mounted on the output shaft of the motor C. The guide wheel is movably arranged on the bracket B and is located above the masking film. A tape limit groove A is circumferentially arranged on the outer cylindrical surface of the guide wheel. The guide strip is arranged on the bracket B. A tape limit groove B is arranged on the top of the guide strip. The bottom surface of the tape limit groove B is horizontal and tangent to the guide wheel.

[0014] The cutting material feeding mechanism comprises a cutting belt assembly, a screw nut transmission assembly and an end clamping belt assembly. The cutting belt assembly and the end clamping belt assembly are both arranged on the screw nut transmission assembly, and the cutting belt assembly is located between the end clamping belt assembly and the material discharge mechanism.

[0015] The cutting belt assembly includes a workbench, a finger cylinder A and a cutter, wherein the finger cylinder A is connected to the workbench through a bottom plate, a slider A and a guide rail A, the bottom plate is connected to the workbench through a retreat cylinder, the cutter is connected to the bottom plate through a knife lifting cylinder, and the cutter is located at the rear side of the finger cylinder A;

[0016] The screw nut transmission assembly includes a bracket C and a motor D, a screw and a guide rail B are arranged side by side on the bracket C, a screw nut is mounted on the screw, the screw nut is connected to the workbench, the guide rail B is connected to the workbench through a slider B, the motor D is arranged on the bracket C and is electrically connected to the controller, and a synchronous belt and a synchronous wheel are used to transmit the output shaft of the motor D to the screw;

[0017] The end entrainment component is a finger cylinder B, which is arranged on a bracket C.

[0018] The discharging mechanism includes a belt conveyor and a material coding assembly. The belt conveyor is electrically connected to the controller. The material coding assembly is close to the feeding and cutting mechanism and is arranged on the belt conveyor. The material coding assembly includes a gantry, a translation plate and a lifting rod. The gantry is arranged on the frame of the belt conveyor and spans the belt conveyor. The translation plate is located on the inner side of the gantry and is connected to the top of the gantry through a push cylinder. The translation plate is slidably connected to the top of the gantry through two guide rods. The lifting rod is connected to the translation plate through a lifting cylinder, and clamping cylinders are provided at both ends of the lifting rod.

[0019] A microscopic inspection method of an automatic microscopic inspection system for a chip electrolytic capacitor comprises the following main steps:

[0020] A. Place the chip electrolytic capacitors into the vibration plate, adjust the chip electrolytic capacitors into a product queue with the leads facing downward through the vibration plate, and convey them to the linear vibrator;

[0021] B. When a chip electrolytic capacitor moves to the linear vibrator, the vibration plate stops, and the linear vibrator gradually transfers the chip electrolytic capacitor to the discharge port, and then the chip electrolytic capacitor is microscopically inspected and identified by the CCD detector;

[0022] C. Move the chip electrolytic capacitors that have been inspected on the linear vibrator to the collection box or the orientation correction mechanism through the material moving mechanism, and move the original chip electrolytic capacitors on the orientation correction mechanism to the discharge mechanism through the material moving mechanism;

[0023] D. The pusher assembly moves to push the chip electrolytic capacitor onto the masking tape in the masking film roll. The motor C rotates a certain angle to loosen the masking tape. Then, the screw nut transmission assembly drives the cutting tape assembly to pull the masking tape backward by one station and straighten the masking tape.

[0024] E. Start the vibration plate and repeat steps B to D until all the chip electrolytic capacitors in the vibration plate have been inspected or the masking tape is used up;

[0025] F. In the step E, when the cutting belt assembly moves to the end clamping belt assembly, the end clamping belt assembly clamps the end of the masking tape, the cutting belt assembly releases the masking tape, and resets to the initial position to clamp the masking tape again, then the stacking assembly clamps the two ends of the masking tape between the cutting belt assembly and the end clamping belt assembly, the cutting belt assembly cuts the masking tape, the stacking assembly moves the cut masking tape segment to the belt conveyor, the belt conveyor starts, and its conveyor belt moves backward to exit a masking tape segment placement position;

[0026] G. In step F, when the belt conveyor is filled with masking tape segments, the belt conveyor starts to transport the masking tape segments to the next process.

[0027] In the step C, if the specifications and models of the chip electrolytic capacitors on the linear vibrator do not meet the requirements, or the leads of the chip electrolytic capacitors are not facing downward, the material moving mechanism moves them to the collection box; if the specifications and models, lead directions and placement orientations of the chip electrolytic capacitors on the linear vibrator meet the requirements, the material moving mechanism moves them to the orientation correction mechanism; if the specifications and models and lead directions of the chip electrolytic capacitors on the linear vibrator meet the requirements, but the placement orientations are opposite, the material moving mechanism moves them to the orientation correction mechanism, and the orientation correction mechanism drives the chip electrolytic capacitors to rotate 180°.

[0028] The beneficial effects of the present invention are:

[0029] 1. The vibration plate adjusts the chip electrolytic capacitors into a product queue with the leads facing downward, that is, the front of the chip electrolytic capacitors facing upward, which makes it easier for the CCD detector to identify product specifications, models and other information during the microscopic inspection process.

[0030] 2. Move the chip electrolytic capacitor at the outlet of the linear vibrator to the collection box or the output shaft of the motor B through the vacuum air nozzle A, and remove the products whose specifications, models or lead directions do not meet the requirements during the moving process to avoid mixing.

[0031] 3. When the chip electrolytic capacitors are placed in the opposite direction, use motor B to rotate them 180° to correct their orientation to ensure that the chip electrolytic capacitors arranged on the masking tape are in the same direction.

[0032] 4. Use the proximity switch to detect whether there are chip electrolytic capacitors in the product limit slot of the block to be positioned. If so, the push cylinder pushes the chip electrolytic capacitors onto the masking tape through the push rod, and motors C and D work together to move the masking tape back one station and straighten it. If not, the push cylinder, motor C and motor D do not move to ensure that the chip electrolytic capacitors stuck on the masking tape are evenly spaced.

[0033] 5. Sticking the chip electrolytic capacitors after microscopic inspection on the masking tape can prevent the products from scratching or colliding with each other, effectively protecting the product surface; limiting the width direction of the masking tape through the tape limiting groove A and the tape limiting groove B helps to make the chip electrolytic capacitors neatly stick on the masking tape.

[0034] 6. The stacking assembly and the belt conveyor cooperate with each other to neatly stack the masking tape segments on the conveyor belt, and the belt conveyor can automatically transport them to the next process when the conveyor belt is full of masking tape segments.

[0035] 7. It can realize automatic microscopic inspection, automatically remove products that do not meet the requirements in terms of specifications, models or lead directions, automatically correct product placement, automatically stick products on masking tape, automatically cut off masking tape and automatically stack materials. The system has a high degree of automation and high production efficiency, meeting the needs of batch microscopic inspection of chip electrolytic capacitors. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a structural schematic diagram of the present invention;

[0037] Figure 2 This is a schematic diagram of the structure of the present invention after removing some parts of the frame;

[0038] Figure 3 It is a structural schematic diagram of the material handling mechanism of the present invention;

[0039] Figure 4 It is a structural schematic diagram of the cutting material feeding mechanism of the present invention;

[0040] Figure 5 for Figure 4 Schematic diagram of the structure from another perspective;

[0041] Figure 6 It is a structural schematic diagram of the coding component of the present invention.

[0042] In the figure: 1-feeding mechanism, 2-mirror inspection component, 3-collection box, 4-material moving mechanism, 40-bracket A, 41-chassis, 42-vacuum air nozzle A, 43-vacuum air nozzle B, 5-azimuth correction mechanism, 50-bracket B, 51-motor B, 6-push component, 60-push cylinder, 61-push rod, 62-waiting block, 7-bonding component, 70-motor C, 71-masking film, 72-guide wheel, 73-limiting plate, 74 -Belt guide bar, 8-gripping belt assembly, 80-workbench, 81-finger cylinder A, 82-retreat cylinder, 9-screw nut transmission assembly, 90-bracket C, 91-motor D, 10-end clamping belt assembly, 11-material guide plate, 12-material coding assembly, 120-gantry, 121-clamping cylinder, 122-lifting rod, 123-lifting cylinder, 124-translation plate, 125-guide rod, 13-belt conveyor, 14-controller. DETAILED DESCRIPTION

[0043] The technical solution of the present invention is further described below, but the scope of protection claimed is not limited to the description.

[0044] like Figures 1 to 6 As shown, an automatic microscopic inspection system for chip electrolytic capacitors described in the present invention includes a frame and a controller 14, on which a feeding mechanism 1, a collecting box 3, an orientation correction mechanism 5, a discharging mechanism, a feeding and cutting mechanism and a discharging mechanism are sequentially installed according to the product flow path, a microscopic inspection component 2 is installed on the frame just above the discharging port of the feeding mechanism 1, a material moving mechanism 4 is installed on the frame between the discharging port of the feeding mechanism 1 and the feeding port of the discharging mechanism, and the controller 14 is installed on the frame.

[0045] The feeding mechanism 1 includes a vibration plate and a linear vibrator, the feed port of the linear vibrator is connected to the discharge port of the vibration plate, the microscopic inspection component 2 is a CCD detector, and the vibration plate, the linear vibrator and the CCD detector are all electrically connected to the controller 14.

[0046] The material handling mechanism 4 includes a chassis 41, a motor A, a driven synchronous pulley and a translation plate. The chassis 41 is connected to the frame through a bracket A40. The motor A is installed in the chassis 41 and is electrically connected to the controller 14. The output shaft of the motor A passes through the bracket A40 and is fitted with a driving synchronous pulley. The driven synchronous pulley is movably connected to the bracket A40 through a central axis. The driven synchronous pulley and the driving synchronous pulley are arranged at the same elevation, and the driven synchronous pulley is connected to the driving synchronous pulley through a synchronous belt. A vacuum air nozzle A42 and a vacuum air nozzle B43 are installed on the translation plate. The translation plate is respectively connected to the ends of the output shaft and the central axis of the motor A through a connecting plate. The vacuum air nozzle A42 and the vacuum air nozzle B43 are respectively connected to the vacuum pump through pipes. When in use, the distance between the vacuum air nozzle B43 and the vacuum air nozzle A42, the distance between the central axis of the motor B51 output shaft and the linear vibrator discharge port, and the distance between the product limit groove on the to-be-displaced block 62 and the central axis of the motor B51 output shaft are equal; the chip electrolytic capacitor at the linear vibrator discharge port is moved to the collection box 3 or to the motor B51 output shaft through the vacuum air nozzle A42, and the chip electrolytic capacitor on the motor B51 output shaft is moved to the to-be-displaced block 62 through the vacuum air nozzle B43. Solenoid valves are installed on each pipeline, and the solenoid valves are electrically connected to the controller 14.

[0047] The orientation correction mechanism 5 includes a motor B51, which is connected to the frame through a bracket B50. The output shaft of the motor B51 is vertically upward, and a product receiving groove is processed at its end. The motor B51 is electrically connected to the controller 14.

[0048] The material discharging mechanism includes a material pushing assembly 6 and a material sticking assembly 7 . Both the material pushing assembly 6 and the material sticking assembly 7 are connected to the frame via a bracket B50 , and the material pushing assembly 6 is located at the feeding side of the material sticking assembly 7 .

[0049] The pusher assembly 6 includes a pusher cylinder 60 and a block to be displaced 62, which are connected to the bracket B50 through a support block, and the block to be displaced 62 is located between the pusher cylinder 60 and the adhesive assembly 7. A pusher rod 61 is installed on the pusher cylinder 60, and a limiting notch is machined on one end of the pusher rod 61 near the block to be displaced 62, and a product limiting groove is machined on the block to be displaced 62. The limiting notch is machined on the end of the pusher rod 61, so that a step is formed on the end of the pusher rod 61, and the step cooperates with the block to be displaced 62 to limit the displacement stroke of the pusher cylinder 60.

[0050] The adhesive component 7 includes a motor C70, a guide wheel 72 and a guide strip 74. The motor C70 is installed on the bracket B50. The motor C70 is electrically connected to the controller 14. The output shaft of the motor C70 is provided with a masking film 71 and a limit plate 73. The guide wheel 72 is movably installed on the bracket B50 and is located above the masking film 71. A tape limit groove A is circumferentially processed on the outer cylindrical surface of the guide wheel 72. The guide strip 74 is installed on the bracket B50. A tape limit groove B is processed on the top of the guide strip 74. The bottom surface of the tape limit groove B is horizontal and tangent to the guide wheel 72.

[0051] The cutting material feeding mechanism includes a clamping belt assembly 8, a screw nut transmission assembly 9 and an end clamping belt assembly 10. The clamping belt assembly 8 and the end clamping belt assembly 10 are both installed on the screw nut transmission assembly 9, and the clamping belt assembly 8 is located between the end clamping belt assembly 10 and the discharge mechanism.

[0052] The cutting belt assembly 8 includes a workbench 80, a finger cylinder A81 and a cutter. The finger cylinder A81 is connected to the workbench 80 through a bottom plate, a slider A and a guide rail A. The bottom plate is connected to the workbench 80 through a retreat cylinder 82. The cutter is connected to the bottom plate through a knife-lifting cylinder, and the cutter is located at the rear side of the finger cylinder A81.

[0053] The screw nut transmission assembly 9 includes a bracket C90 and a motor D91. The bracket C90 is provided with a screw and a guide rail B in parallel. The screw is provided with a screw nut. The screw nut is connected to the workbench 80. The guide rail B is connected to the workbench 80 through a slider B. The motor D91 is provided on the bracket C90 and is electrically connected to the controller 14. The output shaft of the motor D91 and the screw are driven by a synchronous belt and a synchronous wheel.

[0054] The end entrainment component 10 is a finger cylinder B, which is mounted on a bracket C90.

[0055] The discharging mechanism includes a belt conveyor 13 and a material coding assembly 12. The belt conveyor 13 is electrically connected to a controller 14. The material coding assembly 12 is close to the feeding and cutting mechanism and is installed on the belt conveyor 13. The material coding assembly 12 includes a gantry 120, a translation plate 124 and a lifting rod 122. The gantry 120 is installed on the frame of the belt conveyor 13 and crosses the belt conveyor 13. The translation plate 124 is located on the inner side of the gantry 120 and is connected to the top of the gantry 120 through a push cylinder. The translation plate 124 is slidably connected to the top of the gantry 120 through two guide rods 125. The lifting rod 122 is connected to the translation plate 124 through a lifting cylinder 123. Clamping cylinders 121 are installed at both ends of the lifting rod 122. When in use, a material guide plate 11 is also installed obliquely between the bracket C90 and the belt conveyor 13.

[0056] A microscopic inspection method of an automatic microscopic inspection system for a chip electrolytic capacitor comprises the following main steps:

[0057] When using it for the first time, you need to first pass one end of the masking tape in the masking film roll 71 through the tape limiting groove A on the guide wheel 72 and the tape limiting groove B on the guide strip 74 in sequence, with the adhesive side of the masking tape facing up, and then clamp the end of the masking tape with the finger cylinder A81.

[0058] A. Place the chip electrolytic capacitors in the vibration plate, adjust the chip electrolytic capacitors into a product queue with the leads facing downwards through the vibration plate, and convey them to the linear vibrator. The vibration plate adjusts the chip electrolytic capacitors into a product queue with the leads facing downwards, even if the front of the chip electrolytic capacitors faces upwards, which makes it easier for the CCD detector to identify product specifications, models and other information during the microscopic inspection process.

[0059] B. When a chip electrolytic capacitor moves onto the linear vibrator, the vibration plate stops, and the linear vibrator gradually transfers the chip electrolytic capacitor to the discharge port, and then the chip electrolytic capacitor is microscopically identified by the CCD detector. When in use, whether a chip electrolytic capacitor moves onto the linear vibrator is detected by the photoelectric switch A, which is electrically connected to the controller 14, and a baffle is installed at the discharge port of the linear vibrator.

[0060] C. Move the chip electrolytic capacitors that have been inspected by the microscope on the linear vibrator to the collection box 3 or the orientation correction mechanism 5 through the material moving mechanism 4, and move the original chip electrolytic capacitors on the orientation correction mechanism 5 to the discharge mechanism through the material moving mechanism 4. When in use, the chip electrolytic capacitors at the outlet of the linear vibrator are moved to the collection box 3 or the output shaft of the motor B51 through the vacuum air nozzle A42. During the process of the vacuum air nozzle A42 moving the chip electrolytic capacitors from the outlet of the linear vibrator to the orientation correction mechanism 5, if the vacuum pump stops evacuating the vacuum air nozzle A42, the chip electrolytic capacitors will fall into the collection box 3 to eliminate products whose specifications, models or lead directions do not meet the requirements and avoid mixing. If the vacuum pump continues to evacuate the vacuum air nozzle A42, the chip electrolytic capacitors will be moved to the product receiving slot of the output shaft of the motor B51. The chip electrolytic capacitor in the product receiving groove on the output shaft of the motor B51 is moved to the block to be arranged 62 through the vacuum air nozzle B43.

[0061] D. The pusher assembly 6 is activated to push the chip electrolytic capacitor onto the masking tape in the masking film roll 71. The motor C70 rotates a certain angle to loosen the masking tape, and then the screw nut transmission assembly 9 drives the clamping tape assembly 8 to pull the masking tape backward by one station and straighten the masking tape. When in use, the proximity switch is used to detect whether there is a chip electrolytic capacitor in the product limit slot of the to-be-displaced block 62. If there is, the pusher cylinder 60 pushes the chip electrolytic capacitor onto the masking tape through the pusher rod 61, and the motor C70 loosens the masking tape. The motor D91 drives the clamping tape assembly 8 to pull the masking tape backward by one station to straighten the masking tape. If there is no chip electrolytic capacitor, the pusher cylinder 60, the motor C70 and the motor D91 do not operate to ensure that the chip electrolytic capacitors adhered to the masking tape are evenly spaced. The proximity switch is electrically connected to the controller 14.

[0062] E. Start the vibration plate and repeat steps B to D until all the chip electrolytic capacitors in the vibration plate have been inspected or the masking tape is used up.

[0063] F. In the step E, when the cutting belt assembly 8 moves to the end clamping belt assembly 10, the end clamping belt assembly 10 is actuated to clamp the end of the masking tape, the cutting belt assembly 8 releases the masking tape, and resets to the initial position to clamp the masking tape again, and then the coding assembly 12 is actuated to clamp the two ends of the masking tape between the cutting belt assembly 8 and the end clamping belt assembly 10, the cutting belt assembly 8 is actuated to cut the masking tape, and the coding assembly 12 moves the cut masking tape segment to the belt conveyor 13, the belt conveyor 13 is started, and its conveyor belt moves backward to exit a masking tape segment placement position. The process of the code material assembly 12 clamping the masking tape is as follows: the push cylinder is actuated to push the lifting rod 122 to the top of the masking tape, the lifting cylinder 123 pushes the lifting rod 122 downward, so that the claws of the clamping cylinder 121 contact the chip electrolytic capacitor on the masking tape, and then the clamping cylinder 121 is actuated to clamp the two ends of the masking tape between the clamping tape assembly 8 and the end clamping tape assembly 10. The process of the code material assembly 12 moving the masking tape segment to the belt conveyor 13 is as follows: the push cylinder is actuated to pull the lifting rod 122 back to the belt conveyor 13, the lifting cylinder 123 lowers the lifting rod 122 and the masking tape segment to a certain height from the conveyor belt, and the clamping cylinder 121 releases the masking tape segment to arrange it neatly on the conveyor belt.

[0064] G. In step F, when the belt conveyor 13 is filled with masking tape segments, the belt conveyor 13 starts to convey the masking tape segments to the next process. When in use, whether the belt conveyor 13 is filled with masking tape segments is detected by installing a photoelectric switch B at the discharge end of the belt conveyor 13, and the photoelectric switch B is electrically connected to the controller 14.

[0065] In the step C, if the specifications of the chip electrolytic capacitor on the linear vibrator do not meet the requirements, or the lead of the chip electrolytic capacitor is not facing downward, the material handling mechanism 4 moves it to the collection box 3; if the specifications, lead direction and placement orientation of the chip electrolytic capacitor on the linear vibrator meet the requirements, the material handling mechanism 4 moves it to the orientation correction mechanism 5; if the specifications, lead direction of the chip electrolytic capacitor on the linear vibrator meet the requirements, but the placement orientation is opposite, the material handling mechanism 4 moves it to the orientation correction mechanism 5, and the orientation correction mechanism 5 drives the chip electrolytic capacitor to rotate 180°. When the placement orientation of the chip electrolytic capacitor is opposite, it is driven by the motor B51 to rotate 180° to correct its orientation to ensure that the chip electrolytic capacitors arranged on the masking tape are in the same direction.

[0066] Specifically, motor A, motor B51, motor C70 and motor D91 are all servo motors for precise control.

[0067] The automatic microscopic inspection system and microscopic inspection method of chip electrolytic capacitors provided by the present invention have the following beneficial effects:

[0068] 1. The vibration plate adjusts the chip electrolytic capacitors into a product queue with the leads facing downward, that is, the front of the chip electrolytic capacitors facing upward, which makes it easier for the CCD detector to identify product specifications, models and other information during the microscopic inspection process.

[0069] 2. Move the chip electrolytic capacitor at the outlet of the linear vibrator to the collection box 3 or the output shaft of the motor B51 through the vacuum air nozzle A42, and remove the products whose specifications, models or lead directions do not meet the requirements during the moving process to avoid mixing.

[0070] 3. When the chip electrolytic capacitors are placed in the opposite direction, the motor B51 is used to rotate them 180° to correct their orientation to ensure that the chip electrolytic capacitors arranged on the masking tape are in the same direction.

[0071] 4. Use the proximity switch to detect whether there are chip electrolytic capacitors in the product limit slot of the block to be arranged 62. If yes, the push cylinder 60 pushes the chip electrolytic capacitors onto the masking tape through the push rod 61, and the motor C70 and the motor D91 cooperate to move the masking tape back one station and straighten it. If no, the push cylinder 60, the motor C70 and the motor D91 do not move to ensure that the chip electrolytic capacitors stuck on the masking tape are evenly spaced.

[0072] 5. Sticking the chip electrolytic capacitors after microscopic inspection on the masking tape can prevent the products from scratching or colliding with each other, effectively protecting the product surface; limiting the width direction of the masking tape through the tape limiting groove A and the tape limiting groove B helps to make the chip electrolytic capacitors neatly stick on the masking tape.

[0073] 6. The stacking assembly 12 and the belt conveyor 13 cooperate with each other to neatly stack the masking tape segments on the conveyor belt, and the belt conveyor 13 can automatically convey the masking tape segments to the next process when the conveyor belt is full of the masking tape segments.

[0074] 7. It can realize automatic microscopic inspection, automatically remove products that do not meet the requirements in terms of specifications, models or lead directions, automatically correct product placement, automatically stick products on masking tape, automatically cut off masking tape and automatically stack materials. The system has a high degree of automation and high production efficiency, meeting the needs of batch microscopic inspection of chip electrolytic capacitors.

Claims

1. A microscopic inspection method for an automatic microscopic inspection system for chip electrolytic capacitors, characterized in that: The automatic microscopic inspection system for chip electrolytic capacitors comprises a frame and a controller (14); the frame is provided with a loading mechanism (1), a collecting box (3), an orientation correction mechanism (5), a discharge mechanism, a feeding and cutting mechanism and a discharge mechanism in sequence according to a product flow path; the frame is provided with a microscopic inspection component (2) directly above a discharge port of the loading mechanism (1); the frame is provided with a moving mechanism (4) between the discharge port of the loading mechanism (1) and a feed port of the discharge mechanism; and the controller (14) is arranged on the frame; The feeding mechanism (1) comprises a vibrating plate and a linear vibrator, the feed port of the linear vibrator is connected to the discharge port of the vibrating plate, the microscopic inspection component (2) is a CCD detector, and the vibrating plate, the linear vibrator and the CCD detector are all electrically connected to a controller (14); The material discharging mechanism comprises a material pushing assembly (6) and a material sticking assembly (7), wherein the material pushing assembly (6) and the material sticking assembly (7) are both connected to the frame via a bracket B (50), and the material pushing assembly (6) is located on the feeding side of the material sticking assembly (7); The adhesive component (7) comprises a motor C (70), a guide wheel (72) and a guide strip (74); the motor C (70) is arranged on a bracket B (50); the motor C (70) is electrically connected to a controller (14); a masking film (71) and a limiting plate (73) are mounted on an output shaft of the motor C (70); the guide wheel (72) is movably arranged on the bracket B (50) and is located above the masking film (71); a tape limiting groove A is circumferentially arranged on the outer circumferential surface of the guide wheel (72); the guide strip (74) is arranged on the bracket B (50); a tape limiting groove B is arranged on the top of the guide strip (74); the bottom surface of the tape limiting groove B is horizontal and tangent to the guide wheel (72); The cutting material feeding mechanism comprises a cutting belt assembly (8), a screw nut transmission assembly (9) and an end clamping belt assembly (10); the cutting belt assembly (8) and the end clamping belt assembly (10) are both arranged on the screw nut transmission assembly (9), and the cutting belt assembly (8) is located between the end clamping belt assembly (10) and the material discharge mechanism; The material discharging mechanism comprises a belt conveyor (13) and a material stacking assembly (12); the belt conveyor (13) is electrically connected to a controller (14); the material stacking assembly (12) is close to the material feeding and cutting mechanism and is arranged on the belt conveyor (13); the material stacking assembly (12) comprises a gantry (120), a translation plate (124) and a lifting rod (122); the gantry (120) is arranged on a frame of the belt conveyor (13) and crosses the belt conveyor (13). The conveyor (13) comprises a translation plate (124) located inside the portal frame (120) and connected to the top of the portal frame (120) via a push cylinder, and the translation plate (124) is slidably connected to the top of the portal frame (120) via two guide rods (125), a lifting rod (122) is connected to the translation plate (124) via a lifting cylinder (123), and clamping cylinders (121) are provided at both ends of the lifting rod (122); The microscopic inspection method of the chip electrolytic capacitor automatic microscopic inspection system comprises the following steps: A. Place the chip electrolytic capacitors into the vibration plate, adjust the chip electrolytic capacitors into a product queue with the leads facing downward through the vibration plate, and convey them to the linear vibrator; B. When a chip electrolytic capacitor moves to the linear vibrator, the vibration plate stops, and the linear vibrator gradually transfers the chip electrolytic capacitor to the discharge port, and then the chip electrolytic capacitor is microscopically inspected and identified by the CCD detector; C. The chip electrolytic capacitors inspected by the microscope on the linear vibrator are moved to the collection box (3) or the orientation correction mechanism (5) by the material moving mechanism (4), and the chip electrolytic capacitors originally on the orientation correction mechanism (5) are moved to the discharge mechanism by the material moving mechanism (4); D. The push assembly (6) is actuated to push the chip electrolytic capacitor onto the masking tape in the masking film roll (71), the motor C (70) is rotated at a certain angle to loosen the masking tape, and then the screw nut transmission assembly (9) drives the cutting tape assembly (8) to pull the masking tape backward by one station and straighten the masking tape; E. Start the vibration plate and repeat steps B to D until all the chip electrolytic capacitors in the vibration plate have been inspected or the masking tape is used up; F. In the step E, when the cutting belt assembly (8) moves to the end clamping belt assembly (10), the end clamping belt assembly (10) clamps the end of the masking tape, the cutting belt assembly (8) releases the masking tape and returns to the initial position to clamp the masking tape again, then the stacking assembly (12) clamps the two ends of the masking tape between the cutting belt assembly (8) and the end clamping belt assembly (10), the cutting belt assembly (8) cuts the masking tape, the stacking assembly (12) moves the cut masking tape segment to the belt conveyor (13), the belt conveyor (13) starts, and its conveyor belt moves backward to exit a masking tape segment placement position; G. In step F, when the belt conveyor (13) is filled with masking tape segments, the belt conveyor (13) is started to transport the masking tape segments to the next process.

2. The microscopic inspection method of the chip electrolytic capacitor automatic microscopic inspection system according to claim 1, characterized in that: The material handling mechanism (4) comprises a chassis (41), a motor A, a driven synchronous pulley and a translation plate. The chassis (41) is connected to the frame via a bracket A (40). The motor A is arranged in the chassis (41) and is electrically connected to the controller (14). The output shaft of the motor A passes through the bracket A (40) and is provided with a driving synchronous pulley. The driven synchronous pulley is movably connected to the bracket A (40) via a central axis. The driven synchronous pulley and the driving synchronous pulley are arranged at the same elevation, and the driven synchronous pulley is connected to the driving synchronous pulley via a synchronous belt. A vacuum air nozzle A (42) and a vacuum air nozzle B (43) are provided on the translation plate. The translation plate is respectively connected to the output shaft of the motor A and the end of the central axis via a connecting plate. The vacuum air nozzle A (42) and the vacuum air nozzle B (43) are respectively connected to a vacuum pump via a pipeline.

3. The microscopic inspection method of the chip electrolytic capacitor automatic microscopic inspection system according to claim 1, characterized in that: The orientation correction mechanism (5) comprises a motor B (51), the motor B (51) being connected to the frame via a bracket B (50), the output shaft of the motor B (51) being vertically upward, and a product receiving groove being provided at the end thereof, and the motor B (51) being electrically connected to the controller (14).

4. The microscopic inspection method of the chip electrolytic capacitor automatic microscopic inspection system according to claim 1, characterized in that: The pushing assembly (6) comprises a pushing cylinder (60) and a block to be displaced (62). The pushing cylinder (60) and the block to be displaced (62) are connected to the bracket B (50) via a supporting block, and the block to be displaced (62) is located between the pushing cylinder (60) and the bonding assembly (7). A pushing rod (61) is mounted on the pushing cylinder (60), and a limiting notch is provided at one end of the pushing rod (61) close to the block to be displaced (62), and a product limiting groove is provided on the block to be displaced (62).

5. The microscopic inspection method of the chip electrolytic capacitor automatic microscopic inspection system according to claim 1, characterized in that: The cutting belt assembly (8) comprises a workbench (80), a finger cylinder A (81) and a cutter, wherein the finger cylinder A (81) is connected to the workbench (80) via a base plate, a slider A and a guide rail A, the base plate is connected to the workbench (80) via a retreat cylinder (82), the cutter is connected to the base plate via a knife lifting cylinder, and the cutter is located at the rear side of the finger cylinder A (81); The screw nut transmission assembly (9) comprises a bracket C (90) and a motor D (91), wherein a screw and a guide rail B are arranged side by side on the bracket C (90), a screw nut is mounted on the screw, the screw nut is connected to the workbench (80), the guide rail B is connected to the workbench (80) via a slider B, the motor D (91) is arranged on the bracket C (90) and is electrically connected to the controller (14), and a synchronous belt and a synchronous wheel are used to transmit power between the output shaft of the motor D (91) and the screw; The end clamping assembly (10) is a finger cylinder B, and the finger cylinder B is arranged on a bracket C (90).

6. The microscopic inspection method of the chip electrolytic capacitor automatic microscopic inspection system according to claim 1, characterized in that: In the step C, if the specifications and models of the chip electrolytic capacitors on the linear vibrator do not meet the requirements, or the leads of the chip electrolytic capacitors are not facing downward, the material moving mechanism (4) moves them into the collection box (3); if the specifications and models, the lead direction and the placement orientation of the chip electrolytic capacitors on the linear vibrator meet the requirements, the material moving mechanism (4) moves them to the orientation correction mechanism (5); if the specifications and models, the lead direction of the chip electrolytic capacitors on the linear vibrator meet the requirements, but the placement orientation is opposite, the material moving mechanism (4) moves them to the orientation correction mechanism (5), and the orientation correction mechanism (5) drives the chip electrolytic capacitors to rotate 180°.

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