Method for removing a workpiece portion from a machining machine, data processing program, safety device, and machining machine

Abstract

The present invention relates to a method for removing a workpiece portion (14) from a remaining workpiece (17), the workpiece portion being formed by a plate-shaped workpiece (12) placed on a workpiece support (15) through a segmentation process, the plate-shaped workpiece (12) being fixed by means of clamping devices (20, 21, 22, 23) for processing and movable in the support plane of the workpiece support (15) along at least one X or Y direction, before or after the workpiece portion (14) is segmented by the plate-shaped workpiece (12), a gripping device (52) is positioned relative to the workpiece portion (14) in a removal position, at least one gripping element or adsorption element (61) of the gripping device (52) acting on the workpiece portion (14), wherein, before driving the gripping device (52) to remove the workpiece portion (14) from the remaining workpiece (17), a sensor device (71) is activated, by means of solid acoustic vibration, to detect the segmentation of at least one workpiece portion (14) relative to the remaining workpiece (17).

Description

Technical Field

[0001] This invention relates to a method for removing a workpiece from a remaining workpiece, the workpiece being formed by a segmentation process from a plate-shaped workpiece resting on a workpiece support of a machine tool. Furthermore, this invention relates to a data processing program for removing such a workpiece portion in the machine control unit of a machining machine. The invention also relates to a sensor device for detecting the segmentation of a workpiece portion to be removed from the remaining workpiece, the workpiece portion being formed by segmentation of a plate-shaped workpiece. Additionally, this invention relates to a machining machine for performing the method. Background Technology

[0002] A device and method are known from DE 10 2017 205 095 B1, which enables enhanced process safety when removing a portion of a workpiece, made by a segmentation process from a plate-shaped workpiece, from a remaining workpiece. The device includes a sensor apparatus comprising at least one first conductive contact element contactable with the workpiece portion and at least one second conductive workpiece portion, the workpiece portion being positioned on the workpiece portion at a distance relative to the at least one first contact element. These contact elements are disposed on a holding device that acts on the workpiece portion for removal. The contact elements are connected to the sensor apparatus. The workpiece portion is held at a reference potential, for example via conductive grippers or via a workpiece rest—on which the workpiece portion and the remaining workpiece are rested. Before removing the workpiece portion, it is checked whether the workpiece portion is completely separated from the remaining workpiece. If the workpiece portion is completely separated from the remaining workpiece, a high resistance is detected by the sensor apparatus between the two conductive contact elements abutting the workpiece portion to be removed. If the workpiece part is in contact with the remaining workpiece in the opposite direction, a closed circuit is formed under the voltage existing between the contact element on one side and the ground potential on the other side, and the resistance between the contact element and the ground potential is very small.

[0003] Such resistance measurements are difficult or impossible to perform when processing plate-shaped workpieces with an oil film as a protective layer, or especially when processing coated workpieces. Summary of the Invention

[0004] The object of the present invention is to provide a method in which process safety is further improved in removing a portion of a workpiece from the remaining workpiece. Furthermore, the object of the present invention is to provide a data processing program for performing the method, and a sensor device for performing the method. Additionally, the object of the present invention is to provide a processing machine that has high process safety in removing a portion of a workpiece from the remaining workpiece.

[0005] The task is solved by activating a sensor device before the workpiece portion is removed from the remaining workpiece by a gripping device, particularly by a stroke perpendicular to the workpiece support. This sensor device detects the separation of the workpiece portion from the remaining workpiece using solid-state acoustic signals. This detection of the separation of the workpiece portion relative to the remaining workpiece using solid-state acoustics enables non-destructive testing. Furthermore, this method can be used even with unoiled, uncoated, film-coated, or coated plate-shaped workpieces. It also enables the identification of complete separation even with non-conductive materials.

[0006] Advantageously configured, the sensor device includes: at least one pulse emitter for generating solid-borne sound, which excites the workpiece portion or the remaining workpiece; and at least one vibration sensor for detecting the solid-borne sound, determining the proportion of the solid-borne sound transmitted to the remaining workpiece or workpiece via the cut. Thus, the vibration introduced by the pulse emitter is detected and evaluated by the vibration sensor to determine whether it is completely separated, partially separated, or not separated. If the workpiece portion is completely separated from the remaining workpiece and a complete surrounding cut is obtained between the workpiece portion and the remaining workpiece, no solid-borne sound is transmitted. This confirms that the workpiece portion is neither hooked onto the remaining workpiece nor has there been any incorrect cutting or form-locking or force-locking connection between the workpiece portion and the remaining workpiece that could interfere with removal.

[0007] In cases where the proportion of coupled solid-borne sound is transmitted, it can be detected, for example, whether a portion of the workpiece is only partially pushed under the remaining workpiece and whether a removal process can be performed using a gripping device. If the proportion of solid-borne sound detected by the vibration sensor is large, it can be determined that the portion of the workpiece is hooked relative to the remaining workpiece or there is incorrect cutting or other interference, thus either driving a release strategy or stopping the machine and outputting a signal to the operator.

[0008] The advantageous configuration of the method involves performing at least one reference measurement during the operation of the machining machine, with the workpiece completely separated from the remaining workpieces, and forming a reference value from the data obtained in the reference measurement. Forming a reference value during operation, taking the machining machine into account, has the advantage that interference sources related to the machining machine or interference sources in the production hall affecting the machining machine are detected and considered. This allows the effects of interference to be eliminated during evaluation. For example, the system's natural frequency can be determined within the scope of the reference measurement for verification.

[0009] Furthermore, preferably, if the measured value detected by the sensor device is equal to or less than a reference value or a threshold related to the reference value, the removal of the workpiece portion from the remaining workpiece is preferably initiated by an upward stroke of the gripping device perpendicular to the workpiece support. This ensures that the removal process can be performed without obstruction. By considering the threshold related to the reference value, it is taken into account that although the workpiece portion is loosely positioned within the remaining workpiece, it has several contact points. Thus, although a certain proportion of the solid-state acoustic signal is transmitted – as long as it is below the threshold related to the reference value – it can still be safely removed. Advantageously, in the case where there are several contact points between the workpiece portion and the remaining workpiece, an inspection procedure can also be performed while the workpiece portion is slightly raised relative to the remaining workpiece during the lifting process from the remaining grid.

[0010] This differs from the case of hooking or incorrect cutting. In the case of hooking or incorrect cutting interference, a solid-state acoustic signal that is elevated relative to a threshold value related to a reference value will be transmitted.

[0011] Furthermore, preferably, if the detected measured value is greater than a reference value or a threshold related to the reference value, the workpiece portion is instead removed by the stroke movement of the gripping device, which is used for a release strategy to detach the workpiece portion from the remaining workpiece. Such a release strategy for releasing force-locking and / or material-locking connections or hooks between the workpiece portion and the remaining workpiece is known, for example, from WO 2014 / 023 323 A1, which is cited in its entirety herein.

[0012] To detect the separation of the workpiece portion relative to the remaining workpiece, it is preferable to use at least one vibration sensor to detect and evaluate the frequency and amplitude of the excitation by the pulse transmitter. This makes it easy to obtain measurements for evaluating the state of the workpiece portion within the remaining workpiece.

[0013] In a preferred configuration, a frequency-modulated and / or pulse-modulated vibration in the range of 1 to 3 kHz is coupled into the workpiece or the remaining workpiece via a pulse generator. The coupled, modulated vibration has the advantage of eliminating several sources of interference, enabling reliable detection of the separation or hooking of the workpiece portion relative to the remaining workpiece. Excitation within, for example, the determined natural frequency range of the system can further improve detection efficiency.

[0014] Furthermore, in a preferred configuration, after the solid-borne sound is coupled into the workpiece portion or the remaining workpiece via a pulse emitter, the vibration sensor filters out vibrations in the 1 to 3 kHz range via a filter, preferably a bandpass filter, and preprocesses the signal using a Fourier transform, preferably with 256 values, to obtain the maximum value. The relationship between the maximum value and a reference value is detected, and a signal is output accordingly indicating whether the workpiece is completely separated. This allows for automatic and reliable evaluation of the solid-borne sound signal, enabling the removal process to begin as soon as the prerequisite that the workpiece portion is separated relative to the remaining workpiece is met.

[0015] Preferably, when the gripping device is positioned on the workpiece portion, the at least one pulse emitter or the at least one vibration sensor is in contact with the workpiece portion. This also automates the removal process.

[0016] The sensor device is not positioned on the gripping device, but on a separate part of the remaining workpiece or on a machine part coupled and connected to the remaining workpiece for solid-borne sound transmission. This separate machine part can be a clamping device, a conveying device, a workpiece holder, or another machine part. This has the advantage of using an existing machine part or machine shaft to receive the pulse generator or vibration sensor. In the case of a clamping device, the pulse generator or vibration sensor can be, for example, positioned on a movable part of the conveying device or on at least one gripper or clamping device. Thus, the sensor device can be fixedly constructed in the machining machine, allowing the automated processes currently used for machining plate-shaped workpieces to be further maintained and executed.

[0017] Furthermore, the objective of this invention is achieved through a data processing program for the machine control unit of a processing machine, particularly a laser cutting machine or a laser stamping machine, which drives the processing machine to execute the aforementioned method. This allows for the direct integration of the detection of the portion of the workpiece to be removed from the remaining workpiece using solid-state acoustics into the automation process.

[0018] Furthermore, the objective of this invention is achieved by a sensor device for detecting the separation of a workpiece portion relative to the remaining workpiece, the workpiece portion being formed from a plate-shaped workpiece through a segmentation process. The sensor device includes: at least one pulse emitter, which can be positioned on the part to be excited; at least one vibration sensor, which can be positioned on parts adjacent by a slit; and a control and evaluation device that drives the vibration of the at least one pulse emitter to introduce solid-borne sound, evaluates the solid-borne sound vibration detected by the at least one vibration sensor, and outputs a signal regarding the process status.

[0019] The pulse emitter of the sensor device is preferably constructed as a piezoelectric actuator or an electromagnetically driven impactor. A separate pulse emitter for generating solid-borne sound can also be provided.

[0020] Vibration sensors are preferably constructed for detecting acoustic vibrations in solids.

[0021] Furthermore, the objective of this invention is achieved by a machining machine for manufacturing workpiece portions from a plate-shaped workpiece, the machining machine comprising: a workpiece holding portion on which the plate-shaped workpiece can be positioned; a machining head through which at least one workpiece portion is formed from the plate-shaped workpiece by segmentation; a clamping device for gripping the plate-shaped workpiece positioned on the workpiece holding portion; and a gripping device for removing the workpiece portion from the remaining workpiece formed after segmentation, wherein, before removing the workpiece portion from the remaining workpiece, the segmentation can be detected by means of a sensor device according to the aforementioned embodiment using the method described in the aforementioned embodiment. This allows for timely identification of potential interferences during automation, which may arise from incorrect cutting, welding, hooking, or oblique clamping. Attached Figure Description

[0022] The present invention, as well as other advantageous embodiments and extensions, are described and explained in detail below with reference to the examples shown in the accompanying drawings. According to the invention, features obtained from the specification and drawings can be used individually or in arbitrary combinations of multiple features. The drawings show:

[0023] Figure 1 This is a perspective view of the first embodiment of the processing machine.

[0024] Figure 2 yes Figure 1 A perspective view of an alternative implementation of the processing machine.

[0025] Figure 3 This is a perspective view of a conveying device having at least a gripping device for removing a portion of the workpiece.

[0026] Figure 4 This is a schematic diagram of the adsorption plate with a vacuum adsorption gripping device, viewed from below.

[0027] Figure 5 This is a schematic side view of a gripping device with a sensor that operates on the workpiece.

[0028] Figure 6 This is a schematic side view of a gripping device with a sensor that acts on the workpiece when interference is detected.

[0029] Figure 7 yes Figure 5 A schematic diagram of an alternative implementation method,

[0030] Figure 8 yes Figure 5 A schematic side view of an alternative implementation. Detailed Implementation

[0031] exist Figure 1 The diagram exemplarily illustrates a processing machine 11 for manufacturing a workpiece portion 14 from a plate-shaped workpiece 12. The manufacturing of the workpiece portion 14 from the plate-shaped workpiece 12 is performed by a segmentation process, particularly by means of a process beam 13. The processing machine 11 can be configured as a laser processing machine for laser cutting the workpiece portion 14 using a laser beam as the process beam 13. For cutting the workpiece portion 14, the process beam 13 can also be a plasma beam.

[0032] During processing, the plate-shaped workpiece 12 is placed on a workpiece support portion 15, which is, for example, composed of two workpiece support surfaces 16 arranged adjacent to each other, spaced apart by forming a gap 18. The workpiece support portion 15 includes a support plane E, which corresponds to the... Figure 1 The XY plane of the XYZ coordinate system is shown in the figure.

[0033] A plurality of clamping devices 20, 21, 22, and 23 are driven by a transport device 19, including a drive not shown in detail. The plate-shaped workpiece 12 can be moved along the direction of motion X on the workpiece holding portion 15 and moved to a predetermined processing position by means of the clamping devices 20, 21, 22, and 23. The clamping devices 20, 21, 22, and 23 are preferably configured as grippers or chucks that hold along the side edge 24 of the plate-shaped workpiece 12. Alternatively, the workpiece holding portion 15 itself may be configured as a motion device, for example, in the form of one or more encircling conveyor belts, as described in the applicant's DE 10 2011 051 170 A1, to facilitate or assist the movement of the plate-shaped workpiece 12 in the X direction.

[0034] Between the workpiece holding surfaces 16 of the workpiece holding section 15, the slit 18 preferably extends along the entire travel path of the processing head 25 in the Y direction, which directs and focuses the process beam 13 onto the plate-shaped workpiece 12. The processing head 25 is guided on a fixed gantry 27 by means of a driven slide 26 serving as a motion device. The processing head 25 is movable in the Y direction above the slit 18. In the example shown, the processing head 25 can also be additionally controlled to move in the X direction within the slit 18. For this purpose, the slide 26 can be controlled to move in the X direction by means of an additional motion device 28, for example, in the form of a linear actuator. By means of the motion devices 28 constructed on each other, the processing head 25 can be positioned in the desired cutting position within the slit 18, both in the X and Y directions. If necessary, the processing head 25 can also be moved in a third direction of motion (Z direction) to adjust the distance between the processing nozzle 29 of the processing head 25 and the workpiece surface.

[0035] Two auxiliary slides 31 and 32 are arranged within the slit 18. These slides extend across the width of the slit 18 and are controllably and independently movable along the Y-direction within the slit. Each of the auxiliary slides 31 and 32 has a covering element 33 and 34 at its end furthest from the process beam 13, through which the slit 18 is closed. The process beam 13 is generated by a beam source 36, particularly a laser source, and is guided to the processing head 25 by means of a beam guide (not shown in detail) and output via the processing head.

[0036] exist Figure 2 An alternative embodiment of the processing machine 11 is shown. The processing machine 11 is constructed, for example, as a laser stamping machine. For cutting and processing plate-shaped workpieces 12, a stamping head 40 and a processing head 25 are provided. The stamping head 40 has a punch (not shown in detail). The workpiece 12 to be processed is also placed on the workpiece support 15 during workpiece processing. During processing, the workpiece 12 is held by means of a transport device 19 having clamping devices 20, 21 and can be moved relative to the stamping head 40 and the processing head 25 in the X direction of the workpiece plane (X / Y plane) by means of a conventional linear actuator 37 (indicated by arrows). The workpiece 12 can additionally be moved in the Y direction of the workpiece plane by means of another linear actuator 39 (indicated by arrows) moving the workpiece support 15 together with the transport device 19 relative to a base 38 on which the workpiece support 15 is supported.

[0037] The plate-shaped workpiece 12 can be moved along the X and Y directions by means of the processing area fixed relative to the stamping head 40 and the processing area fixed relative to the processing head 25.

[0038] exist Figure 3The medium perspective view shows a conveying device 51, which includes a gripping device 52 movable along at least one linear axis 53. The conveying device 51 can be configured with... Figure 1 The processing machine 11 in the middle is also equipped with Figure 2 The processing machine 11 is used. This enables the unprocessed plate-shaped workpiece 12 to be positioned on the workpiece holding part 15 by means of the gripping device 52 for processing. Here, workpiece parts 14 are manufactured by cutting. Remaining workpieces 17, or remaining grids, are left. In order to remove workpiece parts 14, the gripping device 52 can be driven again to remove each workpiece part 14 from the remaining workpieces 17 and place them in another storage. The remaining workpieces 17 can also be removed by the gripping device 52 and transported to the scrap station.

[0039] The gripping device 52 can be configured as, for example, a magnetic adsorbent, a vacuum adsorbent, an electro-adhesive adsorbent, or a mechanical gripper. Figure 4 The embodiment schematically shows a vacuum adsorber 65, which is arranged on an adsorption frame 54 including one or more adsorption plates 63. Each adsorption plate 63 is provided with a plurality of adsorption elements 61. Each adsorption element 61 serves as a take-off adsorber. Such adsorption elements 61 may be constructed as bellows or telescopic tubes made of a flexible synthetic material. The adsorption plates 63 of the vacuum adsorber 65 are preferably connected to a vacuum pump via flexible tubing. To independently drive the adsorption elements 61, valve 69 ( Figure 5 The number of vacuum adsorbers 65, the size of the adsorption elements 61, and their arrangement in rows, columns, or a special grid are arbitrary and adaptable to the corresponding handling task.

[0040] exist Figure 5 The diagram shows a schematic side view of the gripping device 52, positioned for gripping the workpiece portion 14. The adsorption element 61 may simply support the workpiece portion 14 or may be loaded with a vacuum, thereby fixing the workpiece portion 14 to the adsorption element 61 of the gripping device 52.

[0041] To detect the division of workpiece portion 14 relative to the remaining workpiece 17 through the slit 76 using solid-state acoustic detection, a sensor device 71 is provided. The sensor device 71 includes at least one pulse emitter 72 and at least one vibration sensor 73, which are connected to a control and evaluation device 74. Figure 5 In the first embodiment, a pulse emitter 72 is arranged on the gripping device 52. The pulse emitter 72 may be arranged adjacent to the adsorption element 61 on the housing 68 of the gripping device 52. Here, the pulse emitter 72a is fixed to the housing 68 such that when the gripping device 52 is positioned in the gripping position for the workpiece portion 14, the pulse emitter 72 rests on or abuts against the surface of the workpiece portion 14.

[0042] The at least one vibration sensor 73 is disposed on a machine part of the processing machine 11. The vibration sensor 73 may be directly fastened to the clamping device 20 or to the conveying device 19, for example. The clamping device 20 receives the remaining workpiece 17.

[0043] according to Figure 5 In one embodiment, the workpiece portion 14 is arranged completely separated from the remaining workpiece 17 by the slit 76.

[0044] To detect potential interference during the removal of workpiece portion 14 from the remaining workpiece 17—interference caused, for example, by incorrect cutting, welding, misalignment, or hooking—detection is performed by sensor device 71. Control and evaluation device 74 outputs a signal to pulse emitter 72, causing solid-borne acoustic vibrations to be coupled into workpiece portion 14 via pulse emitter 72. The coupled solid-borne acoustic vibrations are detected by at least one vibration sensor 73 and then transmitted back to control and evaluation device 74.

[0045] Based on the complete separation of workpiece portion 14 relative to the remaining workpiece 17 via the slit 76, no solid-borne acoustic vibrations are transmitted, or only a very small portion is transmitted via the workpiece support portion 15. Thus, a signal is detected by the control and evaluation device 74 indicating that there is no contact between workpiece portion 14 and the remaining workpiece 17, and the removal process via the gripping device 52 can begin. Preferably, the gripping device 52 first moves vertically upward along the Z-axis until the lifted workpiece portion 14 is free relative to the remaining workpiece 17, thereby driving further movement.

[0046] exist Figure 6 The diagram shows a schematic side view of workpiece portion 14 relative to remaining workpiece 17, wherein workpiece portion 14 is abutted against remaining workpiece 17 in at least one region. During detection, solid-borne acoustic vibration is coupled into workpiece portion 14 via pulse emitter 72. Based on the fact that workpiece portion 14 is in at least regional contact with remaining workpiece 17, a larger proportion of solid-borne acoustic vibration is transmitted to remaining workpiece 17, which transmits the solid-borne acoustic vibration to conveying device 19 via clamping device 20, making the solid-borne acoustic vibration detectable by vibration sensor 73. The proportion of detected solid-borne acoustic vibration can initially detect that workpiece portion 14 is not completely free relative to remaining workpiece 17. If the detected proportion of solid-borne acoustic vibration is below a predetermined threshold or reference value, it can be detected that only contact exists and a removal process can be initiated by gripping device 52. If the proportion of solid-borne acoustic vibration detected by at least one vibration sensor 73 is above the reference value or threshold, interference is confirmed. Then, a release strategy using gripping device 52 or machine shutdown can be initiated, allowing for manual intervention by an operator.

[0047] Before performing the detection of the separation of workpiece portion 14 relative to the remaining workpiece 17, reference values ​​can be stored in the control and evaluation device 74. These reference values ​​are detected by measurement while the machining machine 11 is running, ensuring that workpiece portion 14 is completely separated from the remaining workpiece 17. A fully encircling slit 76 is constructed between workpiece portion 14 and the remaining workpiece 17. Other orientations of workpiece portion 14 relative to the remaining workpiece 17 can be simulated based on the reference values, and these reference values ​​can be detected. This allows for a subsequent selection: whether to continue the removal process or whether interference will occur during the removal process.

[0048] exist Figure 7 An alternative embodiment of the method for performing a detection of the arrangement of workpiece portion 14 relative to the remaining workpiece 17 is shown. In this embodiment, for example, the at least one vibration sensor 73 is positioned directly on the remaining workpiece 17. The at least one pulse emitter 72 may be positioned on the gripping device 52 in a manner similar to that described in the previous embodiment.

[0049] exist Figure 8 Alternatively, the sensor device 71 may be arranged in a different configuration. In this embodiment, the pulse emitter 72 may be integrated into the adsorption element 61, i.e., positioned within the adsorption element 61. The vibration sensor 73 may be provided, for example, on the conveying device 19.

[0050] Alternatively, at least one pulse emitter 72 may be disposed within the at least one adsorption element 61 and at least one pulse emitter 72 may be disposed on the housing 63 outside the vacuum adsorber 65. The position of the at least one vibration sensor 73 may also be variably configured and may be selectively disposed on the remaining workpiece 17 or on one or more clamping devices 20, 21, 22, 23 and / or conveying device 19.

[0051] The aforementioned embodiments of the arrangement of the sensor device 71 may also include an interchangeable arrangement of at least one pulse emitter 72 and the at least one vibration sensor 73.

Claims

1. A method for removing a workpiece portion (14) from a remaining workpiece (17), said workpiece portion being formed by cutting a plate-shaped workpiece (12) resting on a workpiece resting part (15). - The plate-shaped workpiece (12) is fixed by clamping devices (20, 21, 22, 23) on the machining machine (11) for machining, and the plate-shaped workpiece (12) can move at least along the X direction or the Y direction in the receiving plane of the workpiece receiving part (15). - wherein, Before or after separating the workpiece portion (14) from the plate-shaped workpiece (12), the gripping device (52) is positioned relative to the workpiece portion (14) at the removal position. - Wherein, at least one gripping element or adsorption element (61) of the gripping device (52) acts on the workpiece portion (14), Its features are, - Before driving the gripping device (52) to remove the workpiece portion (14) from the remaining workpiece (17), the sensor device (71) is activated to detect the separation of at least one workpiece portion (14) relative to the remaining workpiece (17) by means of solid acoustic vibration.

2. The method according to claim 1, characterized in that, The sensor device (71) includes: at least one pulse emitter (72) for generating solid-borne sound, through which the pulse emitter excites the workpiece portion (14) or the remaining workpiece (17); and at least one vibration sensor (73) for detecting solid-borne sound vibration, through which the vibration sensor determines the proportion of solid-borne sound vibration transmitted to the remaining workpiece (17) or the workpiece portion (14) via the cut (76).

3. The method according to claim 1, characterized in that, First, while the workpiece portion (14) is completely separated from the remaining workpiece (17) during the operation of the machining machine (11), at least one reference measurement is performed and a reference value is formed based on the data obtained from the reference measurement.

4. The method according to claim 3, characterized in that, If the measured value detected by the sensor device (71) is equal to or less than the reference value, the removal of the workpiece part (14) from the remaining workpiece (17) begins, which is achieved by the upward stroke of the gripping device (52) perpendicular to the workpiece support part (15).

5. The method according to claim 4, characterized in that, Measurements are taken during workpiece removal.

6. The method according to claim 5, characterized in that, If the detected measurement value is higher than the reference value, the movement of the gripping device (52) for removing the workpiece portion (14) is introduced into the gripping device (52) to replace the stroke of the gripping device (52), the movement being used for the detachment strategy of the workpiece portion (14) relative to the remaining workpiece (17).

7. The method according to claim 2, characterized in that, The frequency and amplitude excited by the pulse generator (72) are detected by the at least one vibration sensor (73).

8. The method according to claim 7, characterized in that, The pulse generator (72) couples at least one frequency-modulated or pulse-modulated vibration in the range of 1 to 3 kHz into the workpiece portion (14) or the remaining workpiece (17).

9. The method according to claim 8, characterized in that, Vibrations in the range of 1 to 3 kHz are filtered out by the at least one vibration sensor (73) via a filter. The vibrations in the range of 1 to 3 kHz are preprocessed by Fourier transform and the maximum value is obtained and the relationship between the maximum value and the reference value is checked. Then, a signal is output by the control and evaluation device (74) to drive the grasping device (52) to perform the take-out process or the release strategy, or to drive the processing machine (11) to stop by the signal.

10. The method according to claim 2, characterized in that, When the gripping device (52) is positioned on the workpiece portion (14), the at least one pulse emitter (72) or the at least one vibration sensor (73) comes into contact with the workpiece portion (14).

11. The method according to claim 2, characterized in that, The at least one vibration sensor (73) or the at least one pulse emitter (72) is positioned or fixed on a component of the processing machine (11), a conveying device (19) or a workpiece holding part (15), or the at least one vibration sensor (73) or the at least one pulse emitter (72) is placed directly on the remaining workpiece (17).

12. The method according to claim 11, characterized in that, The at least one vibration sensor (73) or the at least one pulse emitter (72) is positioned or fixed on the clamping device (20, 21, 22, 23) of the processing machine (11).

13. The method according to claim 9, characterized in that, The filter is a bandpass filter.

14. A data processing program for a machine control unit of a machining machine (11), the machining machine having: Workpiece support (15); Clamping devices (20, 21, 22, 23) are used to grip the plate-shaped workpiece (12) positioned on the workpiece support (15). A beam source (36) is used to generate a process beam (13), which is directed onto the plate-shaped workpiece (12) via a processing head (25). Its features are, The data processing program can drive the processing machine (11) to perform the method according to any one of claims 1 to 13.

15. The data processing program according to claim 14, characterized in that, The processing machine (11) is a laser cutting machine or a stamping laser machine.

16. A machining machine for manufacturing a workpiece portion (14) from a plate-shaped workpiece (12), comprising: - Workpiece holding part (15), the plate-shaped workpiece (12) can be positioned on the workpiece holding part, - A processing head (25) by means of which at least one workpiece portion (14) is formed from the plate-shaped workpiece (12) used for segmentation processing. - At least one clamping device (20, 21, 22, 23) for gripping the plate-shaped workpiece (12) positioned on the workpiece support (15). - A gripping device (52) for removing the at least one workpiece portion (14) from the remaining workpiece (17) formed after the segmentation of the plate-shaped workpiece (12). Its features are, The processing machine has a sensor device (71), which has the following features: - At least one pulse generator (72) positioned on the part to be excited. - At least one vibration sensor (73), said vibration sensor being positioned on an adjacent part via a slit (76), - A control and evaluation device (74) drives the vibration of the at least one pulse emitter (72) to generate solid-borne sound and outputs the vibration through the pulse emitter (72). The control and evaluation device also evaluates the solid-borne sound vibration detected by the at least one vibration sensor (73) and outputs a signal regarding the process status. - The at least one workpiece portion (14) is removed from the remaining workpiece (17) by the method of any one of claims 1 to 13.

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