Test method, device and application of step temperature rise test for thermosetting epoxy insulation parts

Abstract

The present invention belongs to the technical field of step temperature rise test of insulating materials, and discloses a test method, device and application of step temperature rise test of thermosetting epoxy insulating parts. The test method of step temperature rise test of thermosetting epoxy insulating parts comprises: the power frequency AC mains in the laboratory is connected to the input port of the voltage regulator via a wire, and the voltage regulator is regulated by connecting its output port to the input port of the power frequency test transformer; the test transformer provides a continuously regulated power frequency AC voltage to the insulating material connected via the wire through the voltage regulator, and the temperature sensor on the surface of the insulating board is fixed by an adhesive, and the temperature sensor is connected to the inspection instrument for temperature detection; the external environment is measured by a thermometer; a stopwatch is set, and the pressure timing is increased; the overall test circuit is checked, and a pressure test is performed. The present invention can provide a reference technical indicator for evaluating the quality of epoxy insulating parts, and provide very effective help for the application of epoxy resin insulating parts in the high voltage field.

Description

Technical Field

[0001] The present invention belongs to the technical field of step temperature rise test of insulating materials, and in particular relates to a test method, device and application of a step temperature rise test of a thermosetting epoxy insulating component. Background Art

[0002] At present, epoxy resin materials have a series of outstanding advantages in organic insulating materials, such as strong cohesion, strong adhesion, good flexibility, excellent thermal curing performance and stable chemical corrosion resistance. They can be made into various solid materials through epoxy resin casting systems such as automatic epoxy pressure gel manufacturing process (APG process) and vacuum casting. The epoxy resin insulation parts made are widely used in the power industry due to their high mechanical strength, strong arc resistance, high density, smooth surface, good cold resistance and heat resistance, good electrical insulation performance and other advantages, mainly playing a supporting and insulating role.

[0003] During the manufacturing process of thermosetting epoxy insulation parts, the quality of raw materials such as epoxy resin, molds, molds, heating temperature, pouring pressure, curing time, etc. have a great impact on the quality of the finished insulation parts, thereby affecting electrical equipment. The temperature rise of thermosetting epoxy insulation parts is the fundamental basis for measuring the heat release capacity of thermosetting epoxy insulation parts themselves, and is also an important indicator for temperature control of large-volume insulation parts. Conducting step temperature rise tests on insulation parts is the main basis for ensuring their insulation reliability and service life.

[0004] Through the above analysis, the problems and defects of the prior art are as follows: During the manufacturing process of thermosetting epoxy insulating parts, the quality of raw materials such as epoxy resin, molds, mold loading, heating temperature, casting pressure, curing time, etc. have a great influence on the quality of the finished insulating parts, thereby affecting electrical equipment.

[0005] The difficulty of solving the above problems and defects is: through analyzing the problems and defects of the existing epoxy resin technology, the main difficulty lies in building a suitable test platform for testing the temperature rise test rules of insulating materials, including selecting suitable sensors and their placement methods, real-time temperature measurement systems, and preventing the insulation board from protecting it from heat loss during the test.

[0006] The significance of solving the above problems and defects is that epoxy resin insulation materials have become the main insulating medium in high-voltage insulation. The temperature rise test of epoxy resin insulation materials affects its internal insulation performance and temperature rise distribution, restricting its life and capacity. Therefore, in the early stage of material preparation, accurately measuring the temperature rise law of its solid insulation materials can provide a new evaluation standard for evaluating insulating solid materials, and provide theoretical data for temperature rise and thermal analysis calculations in the application of epoxy resin insulation materials. Summary of the invention

[0007] In view of the problems existing in the prior art, the present invention provides a test method, device and application of a step temperature rise test for thermosetting epoxy insulation parts. The present invention can provide a reference technical indicator for evaluating the quality of epoxy insulation parts. The device of the present invention can provide very effective help for the application of epoxy resin insulation parts in the high voltage field.

[0008] The present invention is implemented as follows: a test method for a step temperature rise test of a thermosetting epoxy insulation component, the test method for a step temperature rise test of a thermosetting epoxy insulation component comprising:

[0009] Step 1: The power frequency AC mains 220V / 50HZ in the laboratory is connected to the input port of the voltage regulator through a wire, and the voltage regulator is regulated by connecting its output port to the input port of the power frequency test transformer;

[0010] Step 2: The output port of the test transformer is connected to one side of the insulating board through a wire, and the other side of the insulating board is grounded;

[0011] Step 3: The test transformer provides a continuously regulated power frequency AC voltage to the insulating material connected via the wires through the voltage regulator, the temperature sensor on the surface of the insulating board is fixed with an adhesive, and the temperature sensor is connected to the inspection instrument to detect the temperature;

[0012] Step 4: Use a thermometer to measure the external environment and record it as the temperature of the insulation board surface; set a high-precision stopwatch and prepare for the pressurization timing; check the entire test circuit and perform a pressurization test.

[0013] The steps in the scheme of the present invention are concise and clear, with good logic and a good progressive relationship. Experimental personnel with certain basic operating knowledge and common sense can operate according to the series of steps described in the present invention when restoring the present invention or conducting further innovative experiments based on this. For ordinary technicians in this technical field, several improvements and modifications can be made according to this step without departing from the principles of the present invention. At the same time, these improvements and modifications also fall within the protection scope of the claims of the present invention.

[0014] Furthermore, in step 2, the test analysis process of the heat transfer of the insulation board is as follows:

[0015] The steady-state plate method is used for measurement. When two objects are in contact, heat is transferred from the high-temperature object to the low-temperature object by heat conduction.

[0016] When the temperature changes only in one direction, heat conduction is determined by physical quantities such as the amount of heat passing through the cross section per unit time, the temperature gradient, and the thermal conductivity coefficient. The temperature change of the insulating part is obtained through heat conduction.

[0017] Further, the heat transfer rate is:

[0018]

[0019] Where θ1 and θ2 are the temperatures of the upper and lower surfaces of the sample, respectively. B is the thickness of the sample, A is the cross-sectional area of ​​the sample; λ is the material heat transfer coefficient. is the heat transfer rate of the material.

[0020] In steady state: the heat input is equal to the heat dissipated, that is, the heat transfer rate of the sample is equal to the heat dissipation rate of the heat sink;

[0021]

[0022] where θ 10 and θ 20 The temperatures of the upper and lower surfaces of the sample are constant in steady state. is the heat transfer rate of the material. is the heat dissipation rate of the heat sink; θ1 and θ2 are the temperatures of the upper and lower surfaces of the sample, respectively; when the steady state is reached, equations (1) and (2) yield:

[0023]

[0024] From the above formula, we can see that the key is to find the heat dissipation rate of the heat sink.

[0025] Remove the sample and let the heat sink cool naturally. 20 Nearby, the heat dissipation rate of the heat sink is expressed as:

[0026]

[0027] m is the mass of the material and c is the specific heat capacity of the material.

[0028] Considering the difference in heat dissipation area between the free cooling and steady state of the heat sink, a correction factor is introduced:

[0029]

[0030] Therefore, the thermal conductivity of the sample is:

[0031]

[0032] Where Rc is the radius of the heat sink, D C and h C are the diameter and thickness of the heat sink respectively, and Hc is the thickness of the material.

[0033] Another object of the present invention is to provide a thermosetting epoxy insulation step temperature rise test device for implementing the thermosetting epoxy insulation step temperature rise test method, the thermosetting epoxy insulation step temperature rise test device comprising:

[0034] No partial discharge test transformer, temperature sensor, epoxy resin board, inspection instrument, thermal grease, temperature measuring gun, high-precision stopwatch, epoxy column;

[0035] An epoxy column is arranged on the epoxy resin board, and the epoxy resin board is connected to the high voltage end of the non-partial discharge test transformer to carry out the high voltage discharge environment in the temperature rise test;

[0036] Temperature sensors are installed on the top, bottom, left, right, front, and back of the epoxy resin plate and on the top, bottom, and surface of the epoxy column.

[0037] Furthermore, thermal grease, a temperature measuring gun and a stopwatch are installed around the epoxy resin plate; the temperature measuring gun measures the ambient temperature, and the stopwatch is used to record the time of temperature rise.

[0038] Furthermore, the epoxy resin plate has a diameter of 160 mm and a thickness of 12 mm.

[0039] Furthermore, the temperature sensor is connected to a patrol meter, the temperature sensor measures the change in the surface temperature of the insulation board during the temperature rise test, and the patrol meter displays the measured temperature.

[0040] Furthermore, the epoxy resin plate and the epoxy column are subjected to high voltage at one end and grounded at another end.

[0041] Another object of the present invention is to provide an application of the thermosetting epoxy insulation component step temperature rise test method in the manufacture of thermosetting epoxy insulation components.

[0042] Another object of the present invention is to provide an application of the thermosetting epoxy insulation step temperature rise test method in epoxy resin materials.

[0043] Combining all the above technical solutions, the advantages and positive effects of the present invention are as follows: the present invention builds a test technology platform for the step temperature rise test of thermosetting epoxy insulation parts, and includes the devices and equipment required for the test, which provides a guarantee for the insulation performance of the insulation parts. It can make up for the problems of the step temperature rise test of thermosetting epoxy insulation parts, and can provide a reference technical indicator for evaluating the quality of epoxy insulation parts. Currently, there is no cooperation with commercial companies. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is a flow chart of a test method for a step temperature rise test of a thermosetting epoxy insulation component provided in an embodiment of the present invention.

[0045] Figure 2It is a schematic diagram of the structure of a test device for a step temperature rise test of a thermosetting epoxy insulation component provided in an embodiment of the present invention.

[0046] Figure 3 It is a schematic diagram of the temperature sensor installation structure provided by an embodiment of the present invention.

[0047] Figure 4 It is a schematic diagram of the structure of the epoxy resin board provided in an embodiment of the present invention.

[0048] Figure 5 It is a schematic diagram of a temperature-time variation curve provided by an embodiment of the present invention.

[0049] In the figure: 1. Transformer for non-partial discharge test; 2. Temperature sensor; 3. Epoxy resin board; 4. Inspection instrument; 5. Thermal grease; 6. Temperature measuring gun; 7. High-precision stopwatch; 8. Epoxy column. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical solution and advantages of the present invention clearer, the present invention is further described in detail in combination with the embodiments below. It should be understood that the specific embodiments described here are only used to explain that the present invention adopts a method for testing the step temperature rise of a thermosetting epoxy insulation part. The working module includes: an insulating material module, a detection module, and a power module. The power module is directly connected to the insulating material module and is used to provide high voltage to the insulating material for temperature rise testing; it also includes a temperature detection device and an outdoor control module for providing the external environment of the test and the control of the test time. First, the external environment is measured using a thermometer and recorded as the temperature of the surface of the insulating board. Then, the surface of the insulating board is detected to be smooth, and the uneven parts are evenly coated with thermal conductive silicone grease. Then, the temperature sensor on the surface of the insulating board is fixed with an adhesive, and the temperature sensor is connected to the inspection instrument for temperature detection. After the test transformer is connected, one end is connected to the high-voltage side of the insulating board, and the other end is connected to the ground of the insulating board. A high-precision stopwatch is set, and the pressure timing is prepared. The overall test circuit is checked and a pressure test is performed;

[0051] In practical applications, for example, bushings, supporting insulators, contact boxes, insulating cylinders and poles made of epoxy resin are used in three-phase AC high-voltage switchgear. For example, in terms of poles, it mainly refers to independent components composed of vacuum interrupter and / or conductive connection and its terminals encapsulated with solid insulating materials. Since its solid insulating materials are mainly epoxy resin, power silicone rubber and adhesive, etc., the outer surface of the vacuum interrupter is encapsulated from bottom to top with adhesive, power silicone rubber and epoxy resin on the periphery of the main circuit to form a pole according to the solid sealing process. During the production process, the pole should ensure that it will not cause the performance of the vacuum interrupter to decrease or lose its performance. Its surface should be flat and smooth, and there should be no looseness, impurities, bubbles or pores that reduce electrical and mechanical properties, and there should be no defects such as cracks. We can first measure the initial temperature rise test law of the epoxy solid insulation on the newly shipped pole, and then compare it with the temperature rise test of the pole after a period of operation, so as to determine whether the insulating parts in the pole have been broken down and cannot achieve a good insulation effect.

[0052] In view of the problems existing in the prior art, the present invention provides a test method, device and application of a step temperature rise test for a thermosetting epoxy insulation component. The present invention is described in detail below in conjunction with the accompanying drawings.

[0053] Ordinary technicians in the industry can also use other steps to implement the step temperature rise test method for thermosetting epoxy insulation provided by the present invention. Figure 1 The step temperature rise test method for thermosetting epoxy insulation provided by the present invention is only a specific embodiment.

[0054] like Figure 1 As shown, the step temperature rise test method of the thermosetting epoxy insulation provided by the embodiment of the present invention includes:

[0055] S101: The power frequency AC mains 220V / 50HZ in the laboratory is connected to the input port of the voltage regulator through a wire, and the voltage regulator is regulated by connecting its output port to the input port of the power frequency test transformer;

[0056] S102: The output port of the test transformer is connected to one side of the insulating board through a wire, and the other side of the insulating board is grounded;

[0057] S103: The test transformer provides a continuously regulated power frequency AC voltage to the insulating material connected via the wires through the voltage regulating station, the temperature sensor on the surface of the insulating board is fixed by an adhesive, and the temperature sensor is connected to the inspection instrument to detect the temperature;

[0058] S104: Use a thermometer to measure the external environment and record it as the temperature of the surface of the insulation board; set a high-precision stopwatch and prepare for pressurization timing; check the entire test circuit and perform a pressurization test.

[0059] In S102 provided in the embodiment of the present invention, the test analysis process of the heat transfer of the insulation board is as follows:

[0060] There are many methods for measuring the temperature of insulating materials. Depending on whether the temperature changes with time during measurement, they can be divided into two categories: steady-state method and non-steady-state method.

[0061] The so-called steady-state method refers to a method of determining the thermal conductivity by measuring the heat flowing through the sample, the temperature gradient, etc. after the sample reaches thermal stability. It has the advantages of clear principle, accurate and direct acquisition of the thermal conductivity of the material.

[0062] The so-called non-steady-state method means that during the measurement process, the temperature distribution in the sample changes with time. The measurement method is relatively complicated and the process is difficult to control.

[0063] Since epoxy resin insulation material is a large block of material that has been cast and solidified, it is easy to form a stable temperature distribution inside, so it is more appropriate to use the steady-state plate method for measurement.

[0064] The process of temperature rise test using steady-state plate method is as follows:

[0065] The measurement principle of the steady-state flat plate method is that when two objects are in contact, heat is transferred from the high-temperature object to the low-temperature object by heat conduction; when the temperature changes in only one direction, heat conduction is determined by physical quantities such as the amount of heat passing through the cross section per unit time, the temperature gradient, and the thermal conductivity coefficient, and the temperature change of the insulating part is obtained by heat conduction.

[0066] The heat transfer rate of the sample (epoxy resin) is:

[0067]

[0068] Where θ1 and θ2 are the temperatures of the upper and lower surfaces of the sample, hB is the thickness of the sample, and A is the cross-sectional area of ​​the sample.

[0069] In steady state: the heat input is equal to the heat dissipated, that is, the heat transfer rate of the sample is equal to the heat dissipation rate of the heat sink;

[0070]

[0071] where θ 10 and θ 20 When the steady state is reached, the temperature of the upper and lower surfaces of the sample is constant. When the steady state is reached, it can be obtained from equations (1) and (2):

[0072]

[0073] As can be seen from the above formula, the key is to find the heat dissipation rate of the heat sink

[0074] Remove the sample and let the heat sink cool naturally. 20 Nearby, the heat dissipation rate of the heat sink can be expressed as:

[0075]

[0076] Considering the difference in heat dissipation area between the free cooling and steady state of the heat sink, a correction factor is introduced:

[0077]

[0078] Therefore, the thermal conductivity of the sample is:

[0079]

[0080] Where D C and h C are the diameter and thickness of the heat sink respectively.

[0081] like Figure 2 As shown, the step temperature rise test device for thermosetting epoxy insulation provided by the embodiment of the present invention includes: a non-partial discharge test transformer 1, a temperature sensor 2, an epoxy resin board 3, a patrol meter 4, thermal grease 5, a temperature measuring gun 6, a high-precision stopwatch 7, and an epoxy column 8.

[0082] An epoxy column 8 is provided on the epoxy resin board 3, and high voltage is applied to one section of the epoxy resin board 3 and the epoxy column 8 and the other section is grounded; the epoxy resin board 3 is connected to the high voltage end of the non-partial discharge test transformer 1, and is used for the high voltage discharge environment in the temperature rise test; temperature sensors 2 are respectively installed on the top, bottom, left, right, front and back of the epoxy resin board 3 and the top, bottom and surface of the epoxy column 8, and the temperature sensor 2 is connected to the inspection meter 4. The temperature sensor 2 is used to measure the change of the surface temperature of the insulating board in the temperature rise test, and the inspection meter 4 directly displays the measured temperature; thermal conductive silicone grease 5 and a temperature measuring gun 6 are installed around the epoxy resin board 3 to measure the ambient temperature, and a high-precision stopwatch 7 is used to record the time of temperature rise.

[0083] Among them, the non-partial discharge test transformer 1 is a 50kV / 10kVA non-partial discharge test transformer; the temperature sensor 2 is a temperature sensor of Pt100; the inspection instrument 4 is GWP100; the epoxy resin board 3 has a diameter of 160mm and a thickness of 12mm.

[0084] The thermal grease 5 is thermal grease made of Limin TFX, the temperature measuring gun 6 is CK-T1503, and the high-precision stopwatch 7 is PS528.

[0085] Preparation steps: make epoxy insulation parts of different shapes and process the test materials; instrument inspection. First, check whether there are rough areas on the surface of the epoxy resin board 3, and use thermal conductive silicone grease 5 to evenly spread the rough surface, so as to facilitate the placement of temperature sensor 2 and patrol meter 4 to detect the surface temperature in real time, check the boost workbench, confirm that the high-voltage power supply can work normally, the temperature display of the temperature gun 6 is normal, and the stopwatch 7 is counting time normally, and confirm that it is intact.

[0086] according to Figure 2 The wiring diagram shown is used to connect each test equipment and device in turn. To ensure the safety of the entire experimental process, the grounding wire should be accurately and reliably grounded first, and then connected to the high-voltage side; the main circuit should be connected first, and then the measurement circuit should be connected; confirm the prepared epoxy material device. First, confirm that the place where the temperature sensor is placed is smooth and has no defects, and detect the temperature of the environment and the normal temperature of the epoxy device in the external environment and record them in time as t0.

[0087] Confirm whether the temperature sensor on the surface of the epoxy component is tightly connected to it. If necessary, use adhesives such as 502 to connect it to prevent it from falling off during the test, which will cause inaccurate test results. Turn on the power, slowly and evenly increase the experimental voltage from zero, pay attention to the temperature monitoring interface, and record the temperature of each surface every 2 minutes; continue to pressurize, and continue to measure the surface temperature every 2 minutes until the maximum temperature that the surface of the insulating board can withstand is reached and then stop pressurizing. After the temperature is recorded, slowly reduce the voltage until it is zero, turn off the power, and follow the principle of high-voltage side first, low-voltage side later, measurement system first, and high-voltage system later to remove the system wiring;

[0088] Change the shape of the epoxy device, repeat the above process, and conduct the temperature rise test. Clean up and sweep the test site, turn off all power supplies, and the test is complete.

[0089] During the entire test process, the external ambient temperature needs to be kept uniform.

[0090] The temperature of the material surface and the temperature of the heat sink at different times are measured by the above-mentioned inventive device, and the relationship between the time and temperature of the heat sink is fitted by data processing software. Figure 5 shown.

[0091] By calculation, the thermal conductivity corresponding to different temperatures can be obtained as shown in Table 1:

[0092] Table 1 Thermal conductivity at different temperatures

[0093]

[0094] The error analysis of measuring epoxy resin using this experimental method is as follows:

[0095] 1) The initial test condition requires that the temperature inside the sample is absolutely uniform, which is difficult to achieve. On the one hand, due to the inaccurate temperature control of the heating plate, the temperature inside the sample fluctuates, and the result deviation is about 2-6.5%; on the other hand, because the interval between the two tests is too short, the temperature of the heat sink is not completely dissipated, leaving residual heat inside the sample, so that the test result will be 10-15% higher than the normal value.

[0096] 2) Appropriate heating plate temperature can reduce errors, depending on the applied voltage and power-on time.

[0097] 3) The sample surface is uneven, the contact performance is poor, and the thermal insulation effect of the sample is poor, which causes deviations in the measurement results.

[0098] The above description is only a specific implementation mode of the present invention, but the protection scope of the present invention is not limited thereto. Any modifications, equivalent substitutions and improvements made by any technician familiar with the technical field within the technical scope disclosed by the present invention and within the spirit and principle of the present invention should be covered by the protection scope of the present invention.

Claims

1. A step temperature rise test method for thermosetting epoxy insulation, characterized in that: The step temperature rise test method of the thermosetting epoxy insulation part comprises: Step 1: The power frequency AC mains 220V / 50HZ in the laboratory is connected to the input port of the voltage regulator through a wire, and the voltage regulator is regulated by connecting its output port to the input port of the power frequency test transformer; Step 2: The output port of the test transformer is connected to one side of the epoxy resin board via a wire, and the other side of the epoxy resin board is grounded; Step 3: The test transformer provides a continuously regulated power frequency AC voltage to the epoxy resin board connected via the wire through the voltage regulating station, and the temperature sensor on the surface of the epoxy resin board is fixed with an adhesive, and the temperature sensor is connected to the inspection instrument to detect the temperature; Step 4: Use a thermometer to measure the external environment and record it as the temperature of the epoxy resin board surface; set a high-precision stopwatch and prepare for pressurization timing; check the overall test circuit and perform a pressurization test; Turn on the power supply, slowly and evenly increase the experimental voltage from zero, pay attention to the temperature monitoring interface, and record the temperature of each surface every 2 minutes; continue to pressurize, and continue to measure the surface temperature every 2 minutes until the maximum temperature that the epoxy resin board surface can withstand is reached, and then stop pressurizing; after the temperature is recorded, slowly reduce the voltage until the voltage is zero, turn off the power supply, and remove the system wiring in accordance with the principle of high-voltage side first, low-voltage side later, measuring system first, and high-voltage system later; In step 2, the experimental analysis process of heat transfer of epoxy resin board is as follows: The steady-state plate method is used for measurement. When two objects are in contact, heat is transferred from the high-temperature object to the low-temperature object by heat conduction. When the temperature changes only in one direction, heat conduction is determined by physical quantities such as the amount of heat passing through the cross section per unit time, the temperature gradient, and the thermal conductivity coefficient. The temperature change of the insulating part is obtained through heat conduction; The heat transfer rate is: ； in , are the temperatures of the upper and lower surfaces of the epoxy resin plate, h B is the thickness of the epoxy resin board, A is the cross-sectional area of ​​the epoxy resin board; λ is the heat transfer coefficient of the epoxy resin board, is the heat transfer rate of the epoxy resin board; In steady state: the heat input is equal to the heat dissipated, and the heat transfer rate of the epoxy resin board is equal to the heat dissipation rate of the heat sink; ； in and The temperatures of the upper and lower surfaces of the epoxy resin board are constant in steady state. is the heat transfer rate of the epoxy resin board; is the heat dissipation rate of the heat sink; , are the temperatures of the upper and lower surfaces of the epoxy resin plate, respectively. When the steady state is reached, equations (1) and (2) yield: ； From the above formula, we can see that the heat dissipation rate of the heat sink is ; Remove the epoxy resin plate and let the heat sink cool naturally. Nearby, the heat dissipation rate of the heat sink is expressed as: ； m is the mass of the epoxy resin board, c is the specific heat capacity of the epoxy resin board, and the heat dissipation area of ​​the heat sink in free cooling is different from that in steady state, so a correction factor is introduced: ； Therefore, the thermal conductivity of the epoxy resin board is: ； Where Rc is the radius of the heat sink, D C and h C are the diameter and thickness of the heat sink, R B is the radius of the epoxy resin plate; Thermosetting epoxy insulation step temperature rise test test equipment includes: No partial discharge test transformer, temperature sensor, epoxy resin board, inspection instrument, thermal grease, temperature measuring gun, high-precision stopwatch, epoxy column; An epoxy column is arranged on the epoxy resin board, and the epoxy resin board is connected to the high voltage end of the non-partial discharge test transformer to carry out the high voltage discharge environment in the temperature rise test; Temperature sensors are installed on the top, bottom, left, right, front, and back of the epoxy resin plate and on the top, bottom, and surface of the epoxy column.

2. The step temperature rise test method for thermosetting epoxy insulation according to claim 1, characterized in that: Thermal grease, a temperature measuring gun and a stopwatch are installed around the epoxy resin plate; the temperature measuring gun measures the ambient temperature, and the stopwatch is used to record the time of temperature rise.

3. The step temperature rise test method for thermosetting epoxy insulation according to claim 1, characterized in that: The epoxy resin plate has a diameter of 160 mm and a thickness of 12 mm.

4. The step temperature rise test method for thermosetting epoxy insulation according to claim 1, characterized in that: The temperature sensor is connected to the inspection instrument, the temperature sensor measures the change of the surface temperature of the epoxy resin board in the temperature rise test, and the inspection instrument displays the measured temperature.

5. The step temperature rise test method for thermosetting epoxy insulation according to claim 1, characterized in that: The epoxy resin plate and the epoxy column are provided with high voltage at one end and grounded at the other end.

6. An application of the step temperature rise test method for thermosetting epoxy insulation parts as claimed in claim 1 in the manufacture of thermosetting epoxy insulation parts.

7. An application of the step temperature rise test method for thermosetting epoxy insulation as claimed in claim 1 in epoxy resin materials.

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