Light emitting device

Abstract

The application discloses a light emitting device, comprising a light-transmitting substrate, a reflecting structure and a light emitting unit. The light-transmitting substrate defines opposite first and second surfaces. The reflecting structure is arranged and contacts the second surface of the light-transmitting substrate, and comprises a reflecting layer and a circuit layer, and the reflecting structure defines a light-transmitting window. The light emitting unit is arranged corresponding to the light-transmitting window, the light emitting unit is electrically connected to the circuit layer of the reflecting structure, and the optical path of the light emitting unit passes through the light-transmitting window.

Description

TECHNICAL FIELD

[0001] The present invention relates to an electronic device, and more particularly to a light emitting device with high light extraction efficiency. BACKGROUND

[0002] Light emitting devices are one of the indispensable devices in modern life. Light sources used in light emitting devices, such as incandescent lamps, fluorescent lamps and light emitting diode lamps, have made significant progress in light emitting efficiency and life span. Unlike incandescent lamps, fluorescent lamps or energy saving bulbs, light emitting diodes are cold light emitting devices with low power consumption, long component life, no warm-up time, fast response, small size, vibration resistance, and suitability for mass production. Therefore, they can be widely used in lighting devices, information, communication, consumer electronics, indicators, display device backlight modules and / or displays, and are one of the indispensable components in daily life. SUMMARY

[0003] The present invention provides a light emitting device with high light extraction efficiency.

[0004] To achieve the above-mentioned purpose, a light emitting device according to the present invention includes a light-transmitting substrate, a reflective structure, and a light emitting unit. The light-transmitting substrate defines a first surface and a second surface opposite to each other. The reflective structure is disposed and contacts the second surface of the light-transmitting substrate. The reflective structure includes a reflective layer and a circuit layer. The reflective structure defines a light-transmitting window. The light emitting unit is disposed corresponding to the light-transmitting window. The light emitting unit is electrically connected to the circuit layer of the reflective structure, and the optical path of the light emitting unit emits light through the light-transmitting window.

[0005] In one embodiment, the reflective layer directly contacts the second surface of the light-transmitting substrate and is disposed along the second surface of the light-transmitting substrate.

[0006] In one embodiment, the circuit layer is disposed on a side of the reflective layer away from the second surface of the light-transmitting substrate.

[0007] In one embodiment, the circuit layer directly contacts the second surface of the light-transmitting substrate and is disposed along the second surface of the light-transmitting substrate.

[0008] In one embodiment, the light emitting device further includes a driving unit electrically connected to the circuit layer of the reflective structure. The driving unit has a driving member.

[0009] In one embodiment, the driving unit directly contacts the second surface of the light-transmitting substrate and is disposed along the second surface of the light-transmitting substrate.

[0010] In one embodiment, the driving unit is integrated into a single member with the light emitting unit.

[0011] In one embodiment, the driving unit further has a substrate, and the driving member is disposed on the substrate and electrically connected to the circuit layer of the reflecting structure.

[0012] In one embodiment, the driving member is a thin film component or an integrated circuit (IC) based on a silicon-based semiconductor.

[0013] In one embodiment, the light-transmitting window is an opening.

[0014] In one embodiment, the light-emitting unit has a light-emitting member and a reflecting cover covering the light-emitting member, the light-emitting member is disposed on one side of the second surface of the light-transmitting substrate and electrically connected to the circuit layer of the reflecting structure. The opening of the reflecting cover corresponds to the light-transmitting window, and the light-emitting member emits light toward the reflecting cover.

[0015] In one embodiment, the light-emitting unit has a carrier plate and a light-emitting member disposed on the carrier plate and facing the second surface of the light-transmitting substrate, the light-emitting member is electrically connected to the circuit layer of the reflecting structure.

[0016] In one embodiment, the reflecting layer is formed by a sputtering process.

[0017] In one embodiment, the reflecting layer comprises an aluminum metal material.

[0018] In one embodiment, the light-transmitting substrate is a glass substrate.

[0019] In one embodiment, the reflecting structure further comprises an optical layer disposed on the side of the reflecting layer opposite to the light-transmitting substrate.

[0020] In one embodiment, the optical layer comprises an insulating and light-transmitting organic material.

[0021] In one embodiment, the optical layer comprises a light-transmitting insulating substrate.

[0022] In one embodiment, the light-emitting device further comprises a light-blocking unit disposed on the first surface of the light-transmitting substrate, the light-blocking unit has a plurality of light-blocking portions.

[0023] In one embodiment, one of the light-blocking portions blocks the optical path of the light-emitting unit.

[0024] In one embodiment, one of the light-blocking portions blocks at least a portion of the light-transmitting window in a direction perpendicular to the second surface of the light-transmitting substrate.

[0025] In one embodiment, in each light-blocking unit, the light-blocking portions are gradually arranged away from the center of the light-transmitting window.

[0026] In one embodiment, the light-emitting device further comprises an optical member disposed facing the first surface of the light-transmitting substrate.

[0027] In one embodiment, the optical member is a diffusion film, a diffusion sheet, or a quantum dot film.

[0028] In summary, in the light emitting device of the present application, the reflective structure is disposed and contacts the second surface of the light transmitting substrate, and defines a light transmitting window; the light emitting unit is disposed corresponding to the light transmitting window, and is electrically connected to the circuit layer of the reflective structure, and the optical path of the light emitting unit passes through the light transmitting window. Therefore, the light emitted by the light emitting unit can pass through the light transmitting window, the second surface (light entrance surface) of the light transmitting substrate, and enter the light transmitting substrate, and is emitted by the first surface (light exit surface) of the light transmitting substrate. Since the reflective structure disposed on the second surface (light entrance surface) of the light transmitting substrate has a reflective layer, the light entering the light transmitting substrate will be confined above the reflective layer, and is not easy to be emitted reversely from the second surface (light entrance surface). Therefore, the light emitting device of the present application can have a higher light emitting efficiency.

[0029] In addition, in some embodiments of the present application, the first surface (light exit surface) of the light transmitting substrate is further provided with a light shielding unit (light shielding portion), and one of the light shielding portions shields at least one optical path of the light emitting unit. Therefore, the light passing through the light transmitting substrate can be emitted from the area of the first surface which is not provided with the light shielding portion, so that the light emitting device can also reduce or even avoid the occurrence of bright spots, while having the advantage of uniform light emission. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 and Figure 2 are respectively a cross-sectional view and a top view of a light emitting device according to an embodiment of the present application.

[0031] Figures 3A to 3D are respectively schematic diagrams of light emitting devices according to different embodiments of the present application. DETAILED DESCRIPTION

[0032] The following will describe a light emitting device according to some embodiments of the present application with reference to the relevant drawings, in which the same components will be described with the same reference numerals.

[0033] The light emitting device of the following embodiments can be applied to lighting devices, indicators of information, communication, consumer electronic products, backlight modules of display devices, or displays themselves. In addition, in order to clearly describe the present application, the drawings of the following embodiments are only schematically drawn, and the size and proportion of each component are only for illustrating the present application, and cannot limit the present application.

[0034] Figure 1 and Figure 2 are respectively a cross-sectional view and a top view of a light emitting device according to an embodiment of the present application.

[0035] Please refer to Figure 1 and Figure 2As shown, the light emitting device 1 includes a light-transmissive substrate 11, a reflective structure 12, and a light emitting unit 13. In the present embodiment, the reflective structure 12 includes a reflective layer 121 and a circuit layer 122. In addition, the light emitting device 1 of the present embodiment can further include a driving unit 14 and a light shielding unit 15.

[0036] The light-transmissive substrate 11 is defined with a first surface S1 and a second surface S2 opposite to each other. The light-transmissive substrate 11 is an insulating substrate, and can be a rigid substrate, a flexible substrate, or a combination thereof (e.g., a rigid substrate with a flexible substrate stacked thereon). The rigid substrate is exemplified by, but not limited to, a glass substrate, and the flexible substrate is exemplified by, but not limited to, a polyimide (PI) substrate. In the present embodiment, the light-transmissive substrate 11 is a light-transmissive glass substrate, and is exemplified by a light guide plate.

[0037] The reflective structure 12 is disposed on and contacts the second surface S2 of the light-transmissive substrate 11 and is capable of reflecting light, wherein the reflective structure 12 defines at least one light-transmissive window W1. In the present embodiment, the reflective layer 121 of the reflective structure 12 directly contacts the second surface S2 of the light-transmissive substrate 11 and is arranged continuously along the second surface S2 of the light-transmissive substrate 11 (but can have openings, such as the light-transmissive window W1). In some embodiments, the reflective layer 121 can be a reflective film formed by a sputtering process, such as sputtering along the second surface S2 of the light-transmissive substrate 11. In some embodiments, the reflective layer 121 can include an aluminum metal material (such as an aluminum metal reflective film, a reflective sheet). In some embodiments, the material of the reflective layer 121 can also include a non-metal material, such as titanium dioxide or silver, or a combination thereof, without limitation. In addition, the circuit layer 122 of the reflective structure 12 of the present embodiment is disposed on a side of the reflective layer 121 away from the second surface S2 of the light-transmissive substrate 11, and at least the reflective layer 121 and the circuit layer 122 together define the aforementioned light-transmissive window W1. In some embodiments, the circuit layer 122 can directly contact the second surface S2 of the light-transmissive substrate 11 and be arranged along the second surface S2 of the light-transmissive substrate 11; for example, the circuit layer 122 is disposed on a side of the reflective layer 121 away from the second surface S2 of the light-transmissive substrate 11, or for example, at least a portion of the circuit layer 122 is arranged together with the reflective layer 121 along the second surface S2 of the light-transmissive substrate 11 (e.g., staggered arrangement), and together with the reflective layer 121 forms a surface with a reflective function. In some embodiments, the reflectivity of the circuit layer 122 can be less than that of the reflective layer 121, but is not limited thereto.

[0038] In some embodiments, the reflective structure 12 further comprises an optical layer 123 located on the side of the reflective layer 121 opposite the light-transmissive substrate 11. The optical layer 123 covers the reflective layer 121, and the circuit layer 122 is disposed on the surface of the optical layer 123 away from the light-transmissive substrate 11. In some embodiments, the optical layer 123 is a planarization layer, which can comprise an insulating and light-transmissive organic material, such as an organosilicon oxide compound or a polyfluoroalkoxy (PFA) copolymer. The surface of the optical layer 123 away from the light-transmissive substrate 11 is a planar surface, and the circuit layer 122 can be disposed on the planar surface and cooperatively define the light-transmissive window W1 with the reflective layer 121. In addition, in embodiments of the present application, the electrical connection function of the circuit layer 122 is not affected by the optical layer 123, for example, the circuit layer 122 can pass through the optical layer 123 to be electrically connected. Here, the optical layer 123 can be selected to have a relatively thin thickness to improve the overall optical efficiency, but is not limited thereto.

[0039] The light-emitting unit 13 is disposed corresponding to the light-transmissive window W1, and the light-emitting unit 13 is electrically connected to the circuit layer 122 of the reflective structure 12. The light-emitting unit 13 can comprise a surface mount device (SMD), such as a light-emitting diode chip or package, and is disposed on the circuit layer 122 of the reflective structure 12 by surface mount technology (SMT) to be electrically connected to the circuit layer 122 of the reflective structure 12. The light-emitting unit 13 can have multiple optical paths, at least one of which passes through the light-transmissive window W1 into the light-transmissive substrate 11. In some embodiments, the light-emitting unit 13 can further define a light-emitting average principal axis L, and the light-emitting unit 13 emits light through the light-transmissive window W1 along the light-emitting average principal axis L. In some embodiments, the light-emitting average principal axis L is perpendicular to the second surface S2 of the light-transmissive substrate 11.

[0040] The light emitting unit 13 of the present embodiment has a light emitting element 131 and a reflecting cover 132 covering the light emitting element 131, and the light emitting element 131 is located on the side of the second surface S2 of the light transmitting substrate 11. The light emitting element 131 is electrically connected to the circuit layer 122 of the reflecting structure 12, and the opening of the reflecting cover 132 corresponds to the light transmitting window W1, and the light emitting element 131 emits light toward the reflecting cover 132. The light emitting element 131 of the present embodiment is disposed on the side of the optical layer 123 (planarization layer) away from the light transmitting substrate 11, and is located on the circuit layer 122 of the reflecting structure 12 and electrically connected to the circuit layer 122. In some embodiments, the light emitting unit 13 can also be defined with a light emitting window W2 facing one of the light transmitting substrate 11, and the light emitting window W2 corresponds to the light transmitting window W1. The light emitting window W2 of the present embodiment is defined by the opening of the reflecting cover 132, and the light emitting element 131 emits light toward the reflecting cover 132; at this time, the light transmitting window W1 can be smaller than the opening of the reflecting cover 132. Therefore, the light emitted by the light emitting element 131 can be reflected by the reflecting cover 132 and enter the light transmitting substrate 11 along at least one optical path; for example, along the direction of the light emitting average principal axis L, the light is emitted from the opening of the reflecting cover 132 (light emitting window W2) through the light transmitting window W1 to the light transmitting substrate 11. It is worth noting that the word "corresponds" in the "corresponds" of the opening of the reflecting cover 132 to the light transmitting window W1, and the "corresponds" of the light emitting window W2 to the light transmitting window W1 is not limited to "corresponds" with the center lines aligned with each other; in addition, the light emitting average principal axis L can also be aligned with the center lines of the aforementioned components (or not aligned). At this time, the "corresponds" between the aforementioned components can be selected to be aligned with each other to improve the overall optical efficiency, but it is not limited thereto.

[0041] The light emitting element 131 of the present embodiment is, for example but not limited to, a light emitting diode chip (LED chip), a mini light emitting diode chip (miniLED chip), a micro light emitting diode chip (microLED chip) or a package thereof, or a light emitting chip or package with a size of millimeter, micrometer or below. The aforementioned chip can be a die with horizontal electrodes, flip chip electrodes or vertical electrodes, and is electrically connected to the circuit layer 122 of the reflecting structure 12 by wire bonding or flip chip bonding.

[0042] In addition, the driving unit 14 of the present embodiment is electrically connected to the circuit layer 122 of the reflective structure 12 to drive the light emitting unit 13 to emit light. In some embodiments, the driving unit 14 is located on one side of the second surface S2 of the light-transmissive substrate 11; in this case, the driving unit 14 is also disposed on the side of the optical layer 123 away from the light-transmissive substrate 11 and is electrically connected to the light emitting unit 13 through the circuit layer 122 of the reflective structure 12. In some embodiments, the driving unit 14 can be disposed on either side of the reflective layer 121 of the reflective structure 12 adjacent to or opposite to the light-transmissive substrate 11. In some embodiments, the driving unit 14 can directly contact the second surface S2 of the light-transmissive substrate 11 and be disposed along the second surface S2 of the light-transmissive substrate 11, and can be electrically connected to the circuit layer 122 of the reflective structure 12. In some embodiments, one driving unit 14 can drive one light emitting unit 13 to emit light; alternatively, one driving unit 14 can drive multiple light emitting units 13 to emit light, and the present application is not limited in this regard. In this case, the number of driving units 14 is not limited to one.

[0043] The driving unit 14 can be fabricated on the circuit layer 122 using a thin-film process and electrically connected to the circuit layer 122; alternatively, the driving unit 14 can also be a surface mount assembly fabricated using a thin-film process and disposed on the circuit layer 122 of the reflective structure 12 using surface mount technology and electrically connected to the circuit layer 122 of the reflective structure 12; or alternatively, the driving unit 14 can also include a silicon semiconductor-based integrated circuit (IC) directly bonded to the circuit layer 122 of the reflective structure 12, and the present invention is not limited in any of these respects. In some embodiments, the position of the driving unit 14 is not limited to being located on one side of the second surface S2 of the light-transmitting substrate 11, but at least does not interfere with one side of the first surface S1 of the light-transmitting substrate 11, for example, disposed on another substrate other than the circuit layer 122 of the reflective structure 12; this other substrate can be located on the end side of the light-transmitting substrate 11 or on one side of the second surface S2 of the light-transmitting substrate 11 and parallel to the light-transmitting substrate 11. In some embodiments, the driving unit 14 may have at least one driving element (not shown) to drive the light-emitting unit 13 to emit light through the circuit layer 122 of the reflective structure 12; the driving element may include a thin-film assembly and / or related thin-film lines (such as conductive layers, signal transmission lines) or film layers (such as insulating layers). The thin-film assembly may be, for example, but not limited to, a thin-film transistor (TFT). In some embodiments, the driving element may also be a silicon semiconductor-based integrated circuit. In this embodiment, in addition to the driving element, the driving unit 14 may also have a substrate (not labeled), with the driving element disposed on the substrate to form an independent component and electrically connected to the circuit layer 122 of the reflective structure 12. In some embodiments, the driving unit 14 may also be disposed on the light-emitting unit 13 and integrated with the light-emitting unit 13 into a single component to become an active light-emitting unit. Furthermore, in some embodiments, the number of the light-transmitting window W1, the light-emitting unit 13, and the driving unit 14 may each be multiple, and arranged in a two-dimensional matrix (e.g., Figure 2 (As shown). Among them, these light-emitting units 13 correspond to these light-transmitting windows W1, and these driving units 14 drive the corresponding light-emitting units 13.

[0044] It is worth mentioning that, such as Figure 1 As shown, along the direction perpendicular to the second surface S2 of the light-transmitting substrate 11, this embodiment can, in conjunction with the improvement of overall optical efficiency, make the light-transmitting window W1 smaller than the light-emitting window W2. However, this is not a limitation; in different embodiments, the light-transmitting window W1 may also be larger than or equal to the light-emitting window W2. Additionally, as... Figure 2 As shown, in this embodiment, the light-transmitting window W1 and the light-emitting window W2 completely overlap, and the top view shape of both the light-transmitting window W1 and the light-emitting window W2 is circular. However, this is not a limitation. In different embodiments, the top view shape of the light-transmitting window W1 and the light-emitting window W2 can also be other shapes, such as oval, polygonal, or irregular shapes, or combinations thereof.

[0045] In some embodiments, a light-shielding unit 15 is disposed on the first surface S1 of the light-transmitting substrate 11. The light-shielding unit 15 can have a plurality of light-shielding portions 151, wherein a light-shielding portion shields at least one optical path of the light-emitting unit 13, thereby reducing or even avoiding the occurrence of hot spots, so that the light-emitting device 1 has a higher light-emitting uniformity; for example, wherein a light-shielding portion 151 shields at least a portion of the light-transmitting window W1 in a direction perpendicular to the second surface S2 of the light-transmitting substrate 11. In some embodiments, the number of light-shielding units 15 and the number of light-emitting units 13 correspond to each other.

[0046] The arrangement of the light-shielding unit 15 can include, for example, coating printing, screen printing, or inkjet printing. In the present embodiment, the light-shielding portions 151 are arranged on the first surface S1 of the light-transmitting substrate 11 by printing, for example. Therefore, the position, density, concentration, or weight ratio of the light-shielding portions 151 arranged on the light-transmitting substrate 11 is relatively easy to control, and has high stability and a simple process. In addition, the number of times of printing can be repeated as needed. The shape of each light-shielding portion 151 can be circular, elliptical, or polygonal, or a combination thereof. Here, the shape of the light-shielding portion 151 is taken as an example of a circle. In some embodiments of the light-shielding unit 15, corresponding to the center of the light-transmitting window W1, the light-shielding portions 151 are arranged gradually sparse in a direction away from the light-transmitting window W1, and in a state of being viewed in a direction perpendicular to the second surface S2 of the light-transmitting substrate 11, wherein the (here, the largest) light-shielding portion 151 is arranged directly above the light-emitting unit 13 of the light-emitting element 131 in a direction perpendicular to the second surface S2 of the light-transmitting substrate 11.

[0047] As described above, in the light-emitting device 1 of the present embodiment, the light emitted by the light-emitting element 131 of the light-emitting unit 13 in the direction of the reflecting cover 132 and reflected by the reflecting cover 132 can pass through the light-transmitting window W1, the second surface S2 (light-incident surface) of the light-transmitting substrate 11, and enter the light-transmitting substrate 11 in the direction of the optical path (for example, parallel to the average principal axis L of light emission), and be emitted from the first surface S1 (light-emitting surface) of the light-transmitting substrate 11. Since the second surface S2 of the light-transmitting substrate 11 is provided with the reflecting layer 121 of the reflecting structure 12, the light entering the light-transmitting substrate 11 will be confined above the reflecting layer 121 of the reflecting structure 12, and is not easy to be emitted reversely from the second surface S2 (light-incident surface), so that it can have a higher light-emitting efficiency.

[0048] In addition, the first surface S1 (light-emitting surface) of the light-transmitting substrate 11 in this embodiment is provided with a light-shielding unit 15 (light-shielding part 151), wherein one light-shielding part 151 blocks the optical path of the light-emitting unit 13, and one of the light-shielding parts 151 blocks at least a portion of the light-transmitting window W1 along the direction perpendicular to the second surface S2 of the light-transmitting substrate 11. Therefore, the light transmitted in the light-transmitting substrate 11 can leave the light-transmitting substrate 11 from the area on the first surface S1 where no light-shielding part 151 is provided, so that the light-emitting device 1 can also reduce or even avoid the occurrence of bright spots, and at the same time has the advantage of uniform light emission.

[0049] Figures 3A to 3D These are schematic diagrams of light-emitting devices according to different embodiments of the present invention. Figure 3A As shown, the light-emitting device 1a of this embodiment has roughly the same component composition and connection relationship as the light-emitting device 1 of the previous embodiment. The difference is that in the light-emitting device 1a of this embodiment, the optical layer 123' of the reflective structure 12 is not a planarization layer, but a light-transmitting insulating substrate (e.g., a light-transmitting glass substrate), and can be disposed on the second surface S2 of the light-transmitting substrate 11 by means of pressing or gluing, so that the reflective layer 121 can be sandwiched between the light-transmitting substrate 11 and the insulating substrate (optical layer 123'). The light-transmitting window W1 of this embodiment can be an opening without any material. In different embodiments, the light-transmitting window W1 can also be filled with light-transmitting material.

[0050] In addition, such as Figure 3BAs shown, the light-emitting device 1b of this embodiment has roughly the same component composition and connection relationship as the light-emitting device 1 of the aforementioned embodiment. The difference is that in the light-emitting device 1b of this embodiment, the light-emitting unit 13 is a package, which has a carrier plate S (e.g., a PI substrate) and a light-emitting element 131 disposed on the carrier plate S and facing the second surface S2 of the light-transmitting substrate 11. The light-emitting element 131 is electrically connected to the circuit layer 122 of the reflective structure 12 and emits light in the direction of the second surface S2 of the light-transmitting substrate 11. In addition, the carrier plate S of the light-emitting unit 13 of this embodiment may be provided with a reflective film 135, an insulating film 134 and a conductive line 133. The reflective film 135 may include aluminum metal or non-aluminum metal materials (e.g., titanium dioxide or silver). The light-emitting element 131 is electrically connected to the circuit layer 122 of the reflective structure 12 through the conductive line 133, and the insulating film 134 is located between the reflective film 135 (e.g., an aluminum reflective film) and the conductive line 133 to avoid short circuit between the two. Therefore, the optical path can be as follows: when light emitted towards the light-transmitting substrate 11 is reflected back to the light-emitting unit 13, it can be reflected again through the reflective film 135 and pass through the light-emitting window W2. Furthermore, the light-emitting unit 13 of this embodiment also has a protective layer 136, such as encapsulating adhesive, which covers the light-emitting element 131 to prevent moisture or foreign objects from entering and damaging the light emission of the light-emitting element 131. In addition, the light-emitting unit 13 of this embodiment is an active light-emitting unit integrated with the driving unit 14.

[0051] In addition, such as Figure 3C As shown, the light-emitting device 1c of this embodiment has roughly the same component composition and connection relationship as the light-emitting device 1 of the aforementioned embodiment. The difference lies in that the light-emitting device 1c of this embodiment further includes one or more optical elements 16, which are disposed facing the first surface S1 of the light-transmitting substrate 11. The optical elements 16 can be directly disposed on the first surface S1 of the light-transmitting substrate 11 (there may be an air gap between them, and no adhesive material is applied); or, the optical elements 16 can be indirectly disposed on the first surface S1 of the light-transmitting substrate 11 through an adhesive material. In this embodiment, the optical element 16 is exemplified by an adhesive layer 17 attached to the first surface S1 of the light-transmitting substrate 11. The adhesive layer 17 is, for example, but not limited to, optically clear adhesive (OCA).

[0052] The optical component 16 can be a diffusion film, a diffusion sheet, or a quantum dot film. When the optical component 16 is a diffusion film or a diffusion sheet, it is an optical component with continuous optical properties, which can soften or transmit the light emitted by the light-emitting component 131 (e.g., a micro light-emitting diode chip), so that the light-emitting device 1c can emit light uniformly. When the optical element 16 is a quantum dot film, it may include multiple quantum dots, and preferably has two types of quantum dots with different shapes or sizes, to absorb high-energy light emitted by the light-emitting element 131 and excite visible light of different frequencies. For example, the two types of quantum dots may absorb high-energy blue light or UV light and excite low-energy red light and green light. The residual high-energy blue light that is not fully absorbed and the red and green light excited by the two types of quantum dots are emitted from the quantum dot film to form white light. Alternatively, in different embodiments, the quantum dots may absorb high-energy blue light and green light emitted by the light-emitting element 131 and excite low-energy red light (in this case, there is only one type of quantum dot with a better conversion efficiency). The residual high-energy blue light and green light that is not fully absorbed and the excited red light are emitted from the quantum dot film to form white light.

[0053] In addition, such as Figure 3D As shown, the light-emitting device 1d of this embodiment has roughly the same component composition and connection relationship as the light-emitting device 1b of the aforementioned embodiment. The difference lies in that the light-emitting device 1d of this embodiment further includes an optical element 16, which is disposed facing the first surface S1 of the light-transmitting substrate 11. Here, there may be an air gap between the optical element 16 and the light-transmitting substrate 11 (e.g., no adhesive material is applied). In this embodiment, the optical element 16 is attached to the first surface S1 of the light-transmitting substrate 11 with an adhesive layer 17, which is, for example, but not limited to, optical adhesive (OCA).

[0054] In summary, in the light-emitting device of the present invention, a reflective structure is disposed and contacts the second surface of the light-transmitting substrate, and a light-transmitting window is defined; a light-emitting unit is disposed correspondingly to the light-transmitting window and electrically connected to the circuit layer of the reflective structure, and the optical path of the light-emitting unit passes through the light-transmitting window. Therefore, the light emitted by the light-emitting unit can pass along the optical path through the light-transmitting window and the second surface (light-incident surface) of the light-transmitting substrate into the light-transmitting substrate for transmission, and is emitted from the first surface (light-exit surface) of the light-transmitting substrate. Since the reflective structure disposed on the second surface (light-incident surface) of the light-transmitting substrate has a reflective layer, the light entering the light-transmitting substrate will be confined above the reflective layer and is not easily emitted back from the second surface (light-incident surface). Therefore, the light-emitting device of the present invention can have a high light extraction efficiency.

[0055] In some embodiments of the present application, the first surface (light exit surface) of the light-transmissive substrate is further provided with light-shielding units (light-shielding portions), and one of the light-shielding portions shields at least one optical path of the light-emitting unit. Thus, the light transmitted in the light-transmissive substrate can exit the light-transmissive substrate through the area of the first surface that is not provided with the light-shielding portions, so that the light-emitting device can reduce or even avoid the occurrence of bright spots, while having the advantages of uniform light emission and thin profile.

[0056] With the above-mentioned high light emission efficiency and / or preferred uniform light emission, the number of light-emitting units can be reduced to lower the cost, while the overall optical properties of the light-emitting device remain unchanged.

[0057] The above description is only exemplary and not limiting. Any equivalent modification or change made to the present application without departing from the spirit and scope thereof shall be included in the scope of the appended claims.

Claims

1. A light-emitting device, comprising: A light-transmitting substrate is defined to have a first surface and a second surface that are opposite to each other. A reflective structure is disposed on and in contact with the second surface of the light-transmitting substrate; the reflective structure includes a reflective layer and a circuit layer; the reflective structure defines a light-transmitting window; as well as A light-emitting unit is disposed corresponding to the light-transmitting window, and the light-emitting unit is electrically connected to the circuit layer of the reflective structure; The optical path of the light-emitting unit passes through the light-transmitting window; Light entering the light-transmitting substrate through the light-transmitting window and the second surface is reflected by the reflective layer and exits through the first surface.

2. The light-emitting device according to claim 1, wherein the reflective layer directly contacts the second surface of the light-transmitting substrate and is disposed along the second surface of the light-transmitting substrate.

3. The light-emitting device according to claim 2, wherein the circuit layer is disposed on the side of the reflective layer away from the second surface of the light-transmitting substrate.

4. The light-emitting device according to claim 2, wherein the circuit layer directly contacts the second surface of the light-transmitting substrate and is arranged along the second surface of the light-transmitting substrate.

5. The light-emitting device according to claim 1, further comprising: The driving unit is electrically connected to the circuit layer of the reflective structure; The drive unit has a drive component.

6. The light-emitting device according to claim 5, wherein the driving unit directly contacts the second surface of the light-transmitting substrate and is arranged along the second surface of the light-transmitting substrate.

7. The light-emitting device according to claim 5, wherein the driving unit and the light-emitting unit are integrated into a single component.

8. The light-emitting device according to claim 5, wherein the driving unit further comprises a substrate, the driving member is disposed on the substrate and electrically connected to the circuit layer of the reflective structure.

9. The light-emitting device according to claim 5, wherein the driving element is a thin-film component or a silicon semiconductor-based integrated circuit.

10. The light-emitting device according to claim 1, wherein the light-emitting unit has a light-emitting element and a reflective cover disposed on the light-emitting element, the light-emitting element being located on one side of the second surface of the light-transmitting substrate and electrically connected to the circuit layer of the reflective structure; wherein, The opening of the reflector corresponds to the light-transmitting window, and the light-emitting element emits light towards the reflector.

11. The light-emitting device according to claim 1, wherein the light-emitting unit has a carrier plate and a light-emitting element disposed on the carrier plate and facing the second surface of the light-transmitting substrate, the light-emitting element being electrically connected to the circuit layer of the reflective structure.

12. The light-emitting device according to claim 1, wherein the reflective layer is formed by a sputtering process.

13. The light-emitting device according to claim 1, wherein the reflective layer comprises an aluminum metal material.

14. The light-emitting device according to claim 1, wherein the light-transmitting substrate is a glass substrate.

15. The light-emitting device according to claim 1, further comprising: A light-shielding unit is disposed on the first surface of the light-transmitting substrate. The light-shielding unit has a plurality of light-shielding parts, wherein one light-shielding part blocks the optical path of the light-emitting unit.

16. The light-emitting device according to claim 15, wherein a light-shielding portion shields at least a portion of the light-transmitting window in a direction perpendicular to the second surface of the light-transmitting substrate.

17. The light-emitting device according to claim 15, wherein in each of the light-shielding units, the light-shielding portions are arranged gradually away from the center of the light-transmitting window.

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