Window and method for providing a window

Abstract

The present disclosure relates to a window of an electronic display device including a hard coating layer and a method for providing the window. The method for providing the window includes: providing a base substrate and a protective film each including an upper surface and a lower surface; removably attaching the upper surface of the protective film to the lower surface of the base substrate; providing a treated base substrate and a treated protective film by removing portions of the base substrate and the protective film to provide an exposed upper surface of the treated protective film, the exposed upper surface of the treated protective film being closer to its lower surface than its upper surface; providing a first surface protective layer on both the upper surface of the treated base substrate and the exposed upper surface of the treated protective film; and separating the treated protective film from the treated base substrate to provide a window that can be attached to a display device and includes the treated base substrate having the first surface protective layer.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2020-0080247, filed on June 30, 2020, and all benefits arising therefrom, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] The present disclosure relates to windows and methods of providing windows. More particularly, the present disclosure relates to windows of electronic display devices including a hard coating layer and methods of providing windows. Background Art

[0003] An electronic device that provides an image, such as a display monitor, a smart phone, a tablet computer, etc., includes a display device and a window. The display device generates an image, and the window transmits the image generated by the display device to the outside of the electronic device and protects the display device. The window has a hardness level to protect the display device, and for this purpose, the window includes a hard coating layer.

[0004] As the technology of display devices develops, curved display devices including edge areas are being developed. The curved display device includes a front surface having a flat shape and a side surface having a curved shape at the edge area. The window of the display device including the curved side surface protects both the front surface and the side surface. Summary of the invention

[0005] One or more embodiments provide a window including a hard coating layer on a side surface of a curved electronic device.

[0006] One or more embodiments provide a method of manufacturing or providing a window having a hard coating layer corresponding to a curved side surface of the window.

[0007] Embodiments provide a method for providing a window. The method for providing a window includes: providing a base substrate including a first upper surface and a first lower surface opposite to the first upper surface; providing a protective film including a second upper surface and a second lower surface opposite to the second upper surface; removably attaching the second upper surface of the protective film to the first lower surface of the base substrate; providing a processed base substrate and a processed protective film by removing a portion of the base substrate and a portion of the protective film to provide an exposed upper surface of the processed protective film, the exposed upper surface of the processed protective film being between the second lower surface and the second upper surface; providing a first surface protective layer on both the first upper surface of the processed base substrate and the exposed upper surface of the processed protective film; and separating the processed protective film from the processed base substrate to provide a window that can be attached to a display device of an electronic device and includes the processed base substrate having the first surface protective layer.

[0008] Removing the portion of the base substrate and the portion of the protective film may include defining in the processed base substrate: a width of a first upper surface, the width of the first upper surface being smaller than the width of the first lower surface, and a side surface connecting the first upper surface and the first lower surface to each other, and defining in the processed protective film: an overlapping portion corresponding to the width of the first lower surface of the processed base substrate; a non-overlapping portion extending further than the width of the first lower surface of the processed base substrate and defining an exposed upper surface of the processed protective film; and an exposed side surface connecting the exposed upper surface to the second upper surface.

[0009] Providing the first surface protective layer may include providing a protective layer material on the first upper surface and side surfaces of the processed base substrate and on the non-overlapping portion and exposed side surfaces of the processed protective film, and curing the protective layer material.

[0010] Providing the protective layer material may include a spray coating method or a slot coating method.

[0011] Curing the protective layer material may include a thermal curing method or an ultraviolet curing method.

[0012] Separating the treated protective film from the treated base substrate may include separating both the non-overlapping portion and the overlapping portion from the treated base substrate having the first surface protective layer, the non-overlapping portion being separated together with the protective layer material cured on the non-overlapping portion and on the exposed side surface of the treated protective film.

[0013] The method may further include providing a second surface protection layer on the first surface protection layer after providing the first surface protection layer, wherein the second surface protection layer is farther from the first lower surface of the processed base substrate than the first surface protection layer.

[0014] The method may further include providing a third surface protection layer on the first lower surface of the processed base substrate after separating the processed protection film from the processed base substrate.

[0015] An embodiment provides a window for an electronic device, comprising: a base substrate, comprising an upper surface corresponding to a transmission area of ​​a display device of the electronic device, a lower surface facing the upper surface, and a side surface corresponding to a frame area of ​​the display device and connecting the upper surface and the lower surface to each other; and a first surface protection layer on the upper surface and the side surface of the base substrate. The first surface protection layer comprises: a first portion on the upper surface and having a first thickness; and a second portion on the side surface and having a second thickness different from the first thickness. The first thickness and the second thickness are the minimum distances in the normal direction relative to the upper surface and the side surface, respectively.

[0016] The side surface may include a curved surface.

[0017] The upper surface may have a width smaller than a width of the lower surface.

[0018] The side surface may have a width decreasing from the lower surface toward the upper surface.

[0019] The base substrate may include a polymer resin.

[0020] The first portion may have a hardness corresponding to a pencil hardness that is equal to or greater than about 8H and equal to or less than about 9H.

[0021] A ratio of the second thickness to the first thickness may be equal to or greater than about 0.5 and less than about 1.

[0022] The first thickness may be equal to or greater than about 20 micrometers and equal to or less than about 50 micrometers, and the second thickness may be equal to or greater than about 10 micrometers and equal to or less than about 25 micrometers.

[0023] The second portion may have a thickness that decreases from the upper surface toward the lower surface.

[0024] The window may further include a second surface protection layer on the first portion.

[0025] The window may further include a third surface protection layer below the lower surface.

[0026] The third surface protection layer may have a thickness equal to or greater than about 1 micrometer and equal to or less than about 10 micrometers.

[0027] According to one or more embodiments of the method of providing a window, the protective film includes an exposed upper surface having a height difference relative to an attachment surface between the base substrate and the protective film, and thus, the first surface protective layer is stably on the side surface of the base substrate.

[0028] In addition, according to one or more embodiments of the window, the first surface protection layer has different thicknesses at the upper surface and the side surface of the base substrate, and thus, damage to the first surface protection layer is reduced or effectively prevented. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and other advantages of the present invention will become apparent by reference to the following detailed description considered in conjunction with the accompanying drawings, in which:

[0030] Figure 1 is a perspective view showing an embodiment of an electronic device;

[0031] Figure 2 is an exploded perspective view showing an embodiment of an electronic device;

[0032] Figure 3A is a plan view showing an embodiment of a window;

[0033] Figure 3B is a cross-sectional view showing an embodiment of a window;

[0034] Figure 4 is a flow chart illustrating an embodiment of a method of providing a window;

[0035] Figure 5 is a cross-sectional view showing an embodiment of a base substrate;

[0036] Figure 6 is a cross-sectional view showing an embodiment of a base substrate to which a protective film is removably attachable;

[0037] Fig. 7A is a flow chart showing an embodiment of processing a protective film and a base substrate;

[0038] Figure 7B is a cross-sectional view showing an embodiment of a processed base substrate and a processed protective film;

[0039] Fig. 8A is a flow chart illustrating an embodiment of providing a first hard coating layer;

[0040] Figure 8B is a cross-sectional view showing an embodiment of a treated base substrate having a first hard coating layer and a treated protective film;

[0041] Fig.9A is a flow chart showing an embodiment of removing a treated protective film and a treated base substrate;

[0042] Fig. 9B is a cross-sectional view showing an embodiment of a processed base substrate with a processed protective film separated therefrom;

[0043] Fig. 10A is a flow chart illustrating an embodiment of a method of providing a window including a second hard coating;

[0044] Fig. 10B is a cross-sectional view showing an embodiment of a treated base substrate having a second hard coating layer;

[0045] Fig.11A is a flow chart illustrating an embodiment of a method of providing a window including a third hard coating;

[0046] Fig. 11B is a cross-sectional view showing an embodiment of a treated base substrate having a third hard coating layer;

[0047] Fig.12 is an enlarged cross-sectional view showing a portion of an embodiment of a window having a first hard coating layer;

[0048] Fig.13 is an enlarged cross-sectional view showing a portion of an embodiment of a window having a second hard coating layer; and

[0049] Fig.14 is an enlarged cross-sectional view showing a portion of an embodiment of a window having a third hard coating layer. DETAILED DESCRIPTION

[0050] In the present disclosure, it will be understood that when an element or layer is referred to as being associated with another element, such as being "on", "connected to" or "coupled to" another element or layer, it may be directly on, directly connected to or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element or layer is referred to as being associated with another element, such as being "directly on", "directly connected to" or "directly coupled to" another element or layer, there are no other elements or layers or intervening elements or layers.

[0051] The present invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are shown. However, the present invention can be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. Specifically, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. Throughout the text, the same reference numerals represent the same elements. In the accompanying drawings, in order to effectively describe the technical content, the thickness, ratio and size of the components are exaggerated.

[0052] It will be understood that, although the terms first, second, etc. can be used herein to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish an element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teaching of the present disclosure, the first element, first component, first region, first layer or first part discussed below may be referred to as the second element, second component, second region, second layer or second part.

[0053] The terms used herein are only used for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, "a", "an", "the", and "at least one" do not represent a limit to quantity, and are intended to include both the singular and the plural, unless the context clearly indicates otherwise. As used herein, the singular forms "a", "an", and "the" are also intended to include the plural, unless the context clearly indicates otherwise. "At least one" should not be interpreted as limiting "a" or "an". "Or" means "and / or". As used herein, the term "and / or" includes any combination and all combinations of one or more of the associated listed items.

[0054] For ease of description, spatially relative terms, such as "under", "below", "lower", "over", "upper", etc., may be used herein to describe the relationship of one element or feature to another element (or elements) or feature (or features) as shown in the figures.

[0055] As used herein, "about" or "approximately" includes the stated value and the mean within an acceptable deviation range of the particular value as determined by one of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0056] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined in this article.

[0057] It will also be understood that when the terms "include" and / or "including" are used in this specification, the presence of the features, integers, steps, operations, elements and / or components is specified, but the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof is not excluded.

[0058] Hereinafter, a window WM of the electronic device EA and a method of providing the window WM will be explained in detail with reference to the accompanying drawings.

[0059] Figure 1is a stereogram showing an embodiment of an electronic device EA. The electronic device EA may be a device that is activated in response to an electrical signal applied thereto. The electronic device EA may include various embodiments. In an embodiment, for example, the electronic device EA may include a tablet computer, a notebook computer, or a smart TV. In the following description, a smart phone will be described as a representative example of the electronic device EA.

[0060] The electronic device EA displays an image IM through the transmissive area TA. The image IM includes at least one of a still image and a moving image. Figure 1 A clock widget and application icons are shown as representative examples of the image IM.

[0061] The transmission area TA may have a quadrilateral planar shape in a plane substantially parallel to a plane defined by a first direction axis DR1 (eg, first direction) and a second direction axis DR2 (eg, second direction) crossing each other, but is not limited thereto. The transmission area TA may include various planar shapes and should not be particularly limited.

[0062] The bezel area BZA is defined to be adjacent to the transmissive area TA. In an embodiment, the bezel area BZA surrounds the transmissive area TA. The transmissive area TA and the bezel area BZA may together define a front surface FS (e.g., a display surface) of the electronic device EA. Various layers or components of the electronic device EA may include transmissive areas TA and bezel areas BZA corresponding to those features described above.

[0063] The normal direction of the front surface FS corresponds to the thickness direction of the electronic device EA (hereinafter, referred to as the "third directional axis DR3"). In the present disclosure, the front (or upper) surface and the rear (or lower) surface of each member are defined relative to the direction in which the image IM is displayed. The front surface and the rear surface are opposite to each other along the third directional axis DR3.

[0064] Hereinafter, the first direction, the second direction, and the third direction are indicated by a first direction axis DR1, a second direction axis DR2, and a third direction axis DR3, respectively, and are assigned the same reference numerals as the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3. The directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 are relative to each other and may be changed to other directions.

[0065] The electronic device EA may have an appearance defined by the window WM and the housing HU. A front surface FS of the electronic device EA may be defined in and / or by the window WM.

[0066] Figure 2 It is shown Figure 1 An exploded perspective view of the electronic device EA in FIG. Figure 2, the electronic device EA includes a display device DD and a window WM facing the display device DD. The display device DD includes a polarization module POL (e.g., a polarization member or a polarization layer) and a display module DM facing the polarization module POL. The window WM, the polarization module POL, and the display module DM are each arranged in a plane substantially parallel to a plane defined by a first direction axis DR1 and a second direction axis DR2 that intersect each other. The window WM, the polarization module POL, and the display module DM face each other and are stacked in a direction substantially parallel to a third direction axis DR3.

[0067] The display module DM may include a display area DA, where an image IM is generated and / or displayed, where light is generated and / or emitted, etc. The transmissive area TA may correspond to the display area DA. The display module DM may include a non-display area NDA adjacent to the display area DA. The frame area BZA may correspond to the non-display area NDA. The display module DM may also include a pad area PD and a non-pad area NPD, the pad area PD including one or more pads, where the display module DM is connected to an external device (e.g., a circuit board, a flexible film, etc.), and the non-pad area NPD is adjacent to the pad area PD. The non-pad area NPD may include a portion of the non-display area NDA and the display area DA.

[0068] Figure 3A is a plan view showing an embodiment of a window WM, and Figure 3B It is shown along Figure 3A A cross-sectional view of window WM taken along line II′.

[0069] Reference Figure 3A , the window WM includes a first portion PA1 and a second portion PA2. The second portion PA2 is a portion disposed outside the first portion PA1. The first portion PA1 and the second portion PA2 will be described in detail later. Each layer or component of the window WM may include the first portion PA1 and the second portion PA2 corresponding to those features described above.

[0070] Reference Figure 3B, the window WM includes a base substrate SUB and a hard coating layer HC (e.g., a surface protective layer) disposed on the base substrate SUB to face the base substrate SUB. Although not shown in the drawings, in addition to the hard coating layer HC, the window WM may further include at least one functional layer on the base substrate SUB. In an embodiment, for example, the window WM may further include an anti-fingerprint layer, a protective layer and / or an anti-static layer, however, it should not be limited to or restricted thereto. The functional layer disposed on the base substrate SUB may be implemented as a single layer having multiple functions or a multilayer having functions different from each other. The window WM may include a hard coating layer HC, which is disposed not only on the upper surface of the base substrate SUB, which is farthest on the third direction axis DR3, but also on the side surface of the base substrate SUB, which is farthest along the first direction axis DR1. The window WM will be described in detail later.

[0071] Figure 4 is a flow chart showing an embodiment of a method for providing a window WM. The method for providing a window WM includes: providing a base substrate SUB (S100); removably attaching a protection film PF (S300); processing the base substrate SUB and the protection film PF (S500); providing a first hard coating layer HC1 (S700); and removing the protection film PF (S900). Hereinafter, reference will be made to Figures 5 to 12 A method of providing a window WM is described in detail.

[0072] Figure 5 An embodiment of providing a base substrate SUB (S100) is shown. An unprocessed base substrate SUB (e.g., a preliminary base substrate) includes a first upper surface UA1 (e.g., an upper surface) and a first lower surface BA1 (e.g., a lower surface), and the first lower surface BA1 faces the first upper surface UA1 to be opposite to it along the third directional axis DR3. The first upper surface UA1 and the first lower surface BA1 are distinguished from each other with respect to the third directional axis DR3. The first upper surface UA1 is described as a surface defined as being exposed to the outside of the base substrate SUB in a direction in which the third directional axis DR3 extends, and the first lower surface BA1 is described as being defined as a surface exposed to the outside of the base substrate SUB in a direction opposite to the direction in which the third directional axis DR3 extends.

[0073] The base substrate SUB includes a polymer resin having light transmittance. The base substrate SUB includes at least one of polyethylene ("PET"), polypropylene ("PP"), polyamide ("PAM"), polyacetal ("POM"), polycarbonate ("PC"), polymethyl methacrylate ("PMMA"), polybutylene terephthalate ("PBT"), polycarbonate blend series, cellulose, moisture-proof glass paper, and low-refractive index resin. However, the material of the base substrate SUB should not be limited thereto or thereby.

[0074] Figure 6 An embodiment of attaching a protective film PF (S300) is shown. An untreated protective film PF (e.g., a preliminary protective film) is provided on the first lower surface BA1 of the base substrate SUB, such as being removably attached to the first lower surface BA1 of the base substrate SUB. The protective film PF can be attached to the base substrate SUB and can be removed from the base substrate SUB. The protective film PF includes a second upper surface UA2 and a second lower surface BA2 facing the second upper surface UA2. The protective film PF is arranged so that the second upper surface UA2 of the protective film PF is in contact with the first lower surface BA1 of the base substrate SUB. The surface or interface at which the first lower surface BA1 of the base substrate SUB contacts the second upper surface UA2 of the protective film PF is referred to as an attachment surface CA. The base substrate SUB and the protective film PF may contact each other along a plane parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2 to define a contact area or an attachment area.

[0075] Fig. 7A is a flowchart showing an embodiment of processing a base substrate SUB and a protection film PF (S500), and Figure 7B Shown including according to Fig. 7A A processed base substrate SUB (eg, a processed base substrate) and a Fig. 7A Embodiments of the structure of the treated protection film PF (eg, treated protection film). Figure 7B The structure including the base substrate SUB and the protective film PF includes Figure 6 The structure processed in . Figure 6 Side surfaces of the base substrate SUB and the protection film PF in FIG. 5 are substantially flat and may be aligned with each other (eg, coplanar with each other) along the third direction axis DR3 .

[0076] Reference Fig. 7A and Figure 7B, processing a base substrate SUB and a protective film PF (S500) includes processing a base substrate SUB (S501) and processing a protective film PF (S502). The base substrate SUB and the protective film PF may be processed together. Processing the base substrate SUB (S501) includes forming a side surface SA1 disposed between a first upper surface UA1 and a first lower surface BA1. The side surface SA1 connects the first upper surface UA1 and the first lower surface BA1 to each other. The side surface SA1 is provided in plurality, disposed at opposite ends of the first upper surface UA1, and the first upper surface UA1 is interposed therebetween. The first upper surface UA1 includes a flat surface, and the side surface SA1 includes a curved surface. The first upper surface UA1 of the processed base substrate SUB has a first width W1, and the first width W1 is smaller than the second width W2 of the first lower surface BA1 of the base substrate SUB. In an embodiment, the first upper surface UA1 and the side surface SA1 are adjacent to each other along the first direction, the first upper surface UA1 and the first lower surface BA1 of the base substrate SUB each have a width along the first direction, and the width W1 of the first upper surface UA1 is smaller than the width W2 of the first lower surface BA1.

[0077] The side surface SA1 may have a third width along the first direction axis DR1 taken from one end of the first upper surface UA1 to a corresponding end of the first lower surface BA1. The width of the side surface SA1 of the processed base substrate SUB gradually decreases in a direction from the first lower surface BA1 to the first upper surface UA1.

[0078] Processing the protective film PF (S502) includes providing or forming an exposed side surface SA2 disposed between the attachment surface CA and the exposed upper surface DCA of the processed protective film PF. The exposed side surface SA2 connects the attachment surface CA to the exposed upper surface DCA. The exposed upper surface DCA of the protective film PF is disposed closer to the second lower surface BA2 than the second upper surface UA2 or the attachment surface CA defined between the base substrate SUB and the protective film PF. The width of the protective film PF at the exposed side surface SA2 may increase as the distance from the exposed upper surface DCA decreases, however, it is not limited thereto.

[0079] The treated protective film PF includes an overlapping portion SPP that overlaps or corresponds to the treated base substrate SUB and a non-overlapping portion NSPP that does not overlap or correspond to the treated base substrate SUB. The non-overlapping portion NSPP extends farther than the end of the treated base substrate SUB, that is, extends farther than the first lower surface BA1. In an embodiment, the treated protective film includes an overlapping portion SPP corresponding to the width of the first lower surface BA1 of the treated base substrate, a non-overlapping portion NSPP that extends farther than the width of the first lower surface BA1 of the treated base substrate, and the non-overlapping portion NSPP defines an exposed upper surface DCA of the treated protective film, and an exposed side surface SA2 connecting the exposed upper surface DCA to the second upper surface UA2.

[0080] The non-overlapping portion NSPP is provided in plurality, disposed at opposite sides of the processed protective film PF, and the overlapping portion SPP is interposed therebetween. The non-overlapping portion NSPP is exposed to the outside of the base substrate SUB by processing the base substrate SUB and the protective film PF. The non-overlapping portion NSPP is a portion of the protective film PF that is recessed relative to the attachment surface CA in the direction toward the second lower surface BA2 of the protective film PF. The exposed upper surface DCA corresponds to the upper surface of the non-overlapping portion NSPP.

[0081] Fig. 8A is a flow chart showing an embodiment of providing a first hard coating layer HC1 (S700), and Figure 8B It shows that according to Fig. 8A A cross-sectional view of an embodiment of a base substrate SUB and a protective film PF processed and provided with a first hard coating layer HC1 as a first surface protective layer.

[0082] Reference Fig. 8A , providing the first hard coating layer HC1 (S700) includes providing a hard coating solution (S701) as a protective layer material and curing the hard coating solution (S702). Providing the hard coating solution (S701) includes providing the hard coating solution such as by a spray coating method or a slit coating method. Curing the hard coating solution (S702) includes a thermal curing process or an ultraviolet curing process.

[0083] Reference Figure 8B, the first hard coating layer HC1 is arranged to overlap with the upper surface UA1 and the side surface SA1 of the base substrate SUB, the exposed side surface SA2 of the protective film PF, and the exposed upper surface DCA of the protective film PF. The exposed upper surface DCA of the protective film PF is arranged to be closer to the second lower surface BA2 of the protective film PF than the attachment surface CA, and therefore, the first hard coating layer HC1 covers the side surface SA1. That is, the first hard coating layer HC1 may have a thickness that prevents the window WM from being damaged due to external impact. The thickness of the first hard coating layer HC1 may be obtained in a direction perpendicular to the corresponding surface among the upper surface UA1 and the side surface SA1 of the base substrate SUB, the exposed side surface SA2 of the protective film PF, and the exposed upper surface DCA of the protective film PF.

[0084] In an embodiment, when the base substrate SUB is processed alone or separately from the protective film PF, or when the exposed upper surface DCA is set in the protective film PF without reference to the attachment surface CA, the hard coating solution is not fixed on the curved surface, and it is impossible to provide a hard coating layer HC having a thickness sufficient to protect the side surface SA1.

[0085] In contrast, according to one or more embodiments of the method of providing the window WM, the hard coating solution is applied to extend from the base substrate SUB to the exposed upper surface DCA of the protective film PF to stably provide the hard coating solution on the entire side surface SA1 of the base substrate SUB. Therefore, the first hard coating layer HC1 as a cured hard coating solution is provided on the entire side surface SA1 as the curved surface of the window WM.

[0086] The first portion PA1 of the first hard coating layer HC1 has a uniform thickness taken in a direction perpendicular to the processed base substrate SUB. The thickness of the second portion PA2 of the first hard coating layer HC1 is non-uniform, taken in a direction perpendicular to the corresponding surface covered by the first hard coating layer HC1. However, the present invention should not be limited to or thereby. That is, the thickness of the first portion PA1 may be non-uniform, and the thickness of the second portion PA2 may be uniform. In an embodiment, both the thickness of the first portion PA1 and the thickness of the second portion PA2 may be uniform or may be non-uniform.

[0087] Fig.9A is a flow chart showing an embodiment of separating a processed protective film from a processed base substrate, and Fig. 9B is a cross-sectional view showing an embodiment of a base substrate SUB which has been processed and has a first hard coating layer HC1 and from which a processed protection film PF is separated.

[0088] Reference Fig.9A and Fig. 9B, removing the treated protection film PF (S900) includes removing the non-overlapping portion NSPP (S901) and removing the overlapping portion SPP (S902). In an embodiment, the non-overlapping portion NSPP is removed, such as by being separated from the remaining portion of the protection film PF in a direction opposite to the third directional axis DR3. Removing the overlapping portion SPP can be performed by peeling the protection film PF from the base substrate SUB. The non-overlapping portion NSPP of the protection film PF may be removed together with a portion of the first hard coating layer HC1 at the exposed side surface SA2 and the exposed upper surface DCA of the protection film PF. However, the non-overlapping portion NSPP and the overlapping portion SPP of the protection film PF may be removed from the base substrate SUB substantially at the same time.

[0089] When the protection film PF is removed from the base substrate SUB, a window WM including the first hard coating layer HC1 disposed on the upper surface UA1 and the side surface SA1 of the base substrate SUB may be provided.

[0090] In the following, reference will be made to Fig. 10A and Fig. 10B A method of providing window WM-1 is described. Fig. 10B The above reference can be omitted Figures 1 to 9B A detailed description of the same components is mentioned, and the different features will be mainly described.

[0091] Fig. 10A is a flow chart illustrating an embodiment of a method of providing window WM-1. Fig. 10B A structure is shown in which a second hard coating layer HC2 is provided as a second surface protective layer in the process of the method of providing the window WM-1.

[0092] Reference Fig. 10A and Fig. 10B The method of providing the window WM-1 includes providing a second hard coating layer HC2 (S800) in addition to the processes in the method of providing the window WM described previously.

[0093] Providing the second hard coating layer HC2 (S800) is performed by providing the second hard coating layer HC2 on the first hard coating layer HC1. That is, the second hard coating layer HC2 faces the base substrate SUB, and the first hard coating layer HC1 is between them. The second hard coating layer HC2 is provided on the first portion PA1. In an embodiment, the second surface protection layer (e.g., the second hard coating layer HC2) is farther from the first lower surface BA1 of the base substrate SUB than the first surface protection layer (e.g., the first hard coating layer HC1). The second hard coating layer HC2 may terminate at the boundary between the first portion PA1 and the second portion PA2. The first portion PA1 of the window WM-1 is defined by the second hard coating layer HC2, which overlaps or corresponds to the first upper surface UA1 of the base substrate SUB. The second portion PA2 of the window WM-1 is defined by the first hard coating layer HC1 that overlaps or corresponds to the side surface SA1 of the base substrate SUB.

[0094] In an embodiment, the second hard coating layer HC2 is provided by stacking the hard coating layer HC twice on the first upper surface UA1 to ensure hardness to prevent the window WM-1 from being damaged. Fig. 10B The structure in shows a method of stacking two of the hard coating layers HC, however, the present invention is not limited thereto. In an embodiment, the hard coating layer HC may include a plurality of sub-coating layers stacked on each other, or may be provided in a single layer structure.

[0095] At corresponding positions along the base substrate SUB, the thickness of the second hard coating layer HC2 is relatively smaller than the thickness of the first hard coating layer HC1. The second hard coating layer HC2 has a uniform thickness along the base substrate SUB, however, it should not be limited to or restricted thereto. In an embodiment, the thickness of the second hard coating layer HC2 may be relatively greater than the thickness of the first hard coating layer HC1, and / or the thickness of the second hard coating layer HC2 may be non-uniform.

[0096] In the following, reference will be made to Fig.11A and Fig. 11B A method for providing window WM-2 is described. Fig.11A and Fig. 11B In the reference, it can be omitted Figures 1 to 9B A detailed description of the same components is mentioned, and the different features will be mainly described.

[0097] Fig.11A is a flow chart illustrating an embodiment of a method of providing window WM-2. Fig. 11B A structure is shown in which a third hard coating layer HC3 as a third surface protective layer is provided in the process of the method of providing the window WM-2.

[0098] Reference Fig.11A and Fig. 11BThe method of providing the window WM-2 includes providing a third hard coating layer HC3 (S1000) in addition to the processes in the previously described method of providing the window WM and / or the window WM-1.

[0099] Providing the third hard coating layer HC3 is performed by providing a coating layer on the first lower surface BA1 of the base substrate SUB. The third hard coating layer HC3 reduces or effectively prevents generation of scratches when the window WM-2 is combined with the display device DD.

[0100] The thickness of the third hard coating layer HC3 is less than the thickness of the first hard coating layer HC1 and / or the second hard coating layer HC2. The thickness of the third hard coating layer HC3 is uniform, however, it should not be limited to or restricted thereto. In an embodiment, the thickness of the third hard coating layer HC3 may be the same as the thickness of the first hard coating layer HC1 and / or the second hard coating layer HC2, or greater than the thickness of the first hard coating layer HC1 and / or the second hard coating layer HC2, and / or the thickness of the third hard coating layer HC3 may be non-uniform.

[0101] In the following, reference will be made to Fig. 9B , Fig. 10B and Fig. 11B The window WM is described in detail, and a detailed description of the same components as those previously mentioned may be omitted. Fig.12 It is shown Fig. 9B An enlarged cross-sectional view of an embodiment of a portion ED of a window WM. Fig. 9B and Fig.12 Describe window WM in detail.

[0102] The window WM includes a base substrate SUB and a first hard coating layer HC1 disposed on the base substrate SUB. The window WM may include only the first hard coating layer HC1, but is not limited thereto.

[0103] The first hard coating layer HC1 is disposed to overlap or correspond to the first upper surface UA1 and the side surface SA1 of the base substrate SUB. The first hard coating layer HC1 includes a first portion PA1 overlapping the first upper surface UA1 and having a first thickness T1 and a second portion PA2 overlapping the side surface SA1 and having a second thickness T2. The first thickness T1 and the second thickness T2 are the minimum distances in the normal direction relative to the first upper surface UA1 and the side surface SA1 of the base substrate SUB, respectively.

[0104] The first thickness T1 is greater than the second thickness T2. The ratio of the second thickness T2 to the first thickness T1 is equal to or greater than about 0.5 and less than about 1. The first thickness T1 is equal to or greater than about 20 micrometers and equal to or less than about 50 micrometers. The second thickness T2 is equal to or greater than about 10 micrometers and equal to or less than about 25 micrometers.

[0105] When the first thickness T1 is less than about 20 micrometers, the hardness of the front surface FS of the electronic device EA cannot be ensured. When the first thickness T1 is greater than about 50 micrometers, the surface hardness increases, however, due to the hardening shrinkage of the first hard coating layer HC1, wrinkles or curling increase, and cracking or peeling of the first hard coating layer HC1 occurs.

[0106] The thickness of the first hard coating layer HC1 may be uneven within a range from a boundary point between the first portion PA1 and the second portion PA2 to an end point (e.g., a distal end) of the second portion PA2. In detail, the second thickness T2 of the second portion PA2 decreases in a direction from the first upper surface UA1 to the first lower surface BA1 of the base substrate SUB.

[0107] The first portion PA1 of the first hard coating layer HC1 has a hardness corresponding to a pencil hardness equal to or greater than about 8H and equal to or less than about 9H. The pencil hardness may be a grading scale of pencils, which is the hardest and does not damage the surface, and is obtained when the pencil is moved at an angle of about 45 degrees and with a certain force. When the hardness of the first hard coating layer HC1 is less than the pencil hardness of about 8H, the hardness for providing protection for the window WM cannot be ensured, and it is difficult to protect the display device DD. When the hardness of the first hard coating layer HC1 is greater than the pencil hardness of about 9H, wrinkles or curling are generated due to the hardening shrinkage of the first hard coating layer HC1, and cracking or peeling of the first hard coating layer HC1 occurs.

[0108] Fig.13 It is shown Fig. 10B An enlarged cross-sectional view of an embodiment of a portion of window WM-1 of ED-1. Fig. 10B and Fig.13 Describe window WM-1 in detail.

[0109] Reference Fig. 10B and Fig.13 , the base substrate SUB and the first hard coating layer HC1 are described with reference to Fig.9A , Fig. 9B and Fig.12 The base substrate SUB and the first hard coating layer HC1 described herein are the same, and therefore, the details thereof will be omitted. Fig. 10B and Fig.13 The second hard coating layer HC2.

[0110] Reference Fig. 10B , the window WM-1 includes a second hard coating layer HC2 disposed on a first portion PA1 of the first hard coating layer HC1. The first portion PA1 corresponds to a portion where the first hard coating layer HC1 contacts the first upper surface UA1. Due to the contact, the first hard coating layer HC1 and the first upper surface UA1 form an interface therebetween.

[0111] The second hard coating layer HC2 additionally stacked on the first hard coating layer HC1 may define the hardness of the window WM-1. Fig. 10B and Fig.13 , a method of stacking two hard coating layers HC is shown, however, it should not be limited thereto. In an embodiment, the hard coating layer HC may collectively include a plurality of sub-coating layers stacked on each other, or may be provided in a single layer structure.

[0112] Reference Fig.13 , the first portion PA1 of the first hard coating layer HC1 has a first thickness T1, and the second hard coating layer HC2 has a third thickness T3. Fig. 10B and Fig.13 , the first thickness T1 is shown to be greater than the third thickness T3, however, it should not be limited thereto or thereby. In an embodiment, the first thickness T1 may be less than the third thickness T3, or the first thickness T1 and the third thickness T3 may be substantially the same as each other.

[0113] Fig.14 It is shown Fig. 11B An enlarged cross-sectional view of an embodiment of a portion of window WM-2 of ED-2. Fig. 11B and Fig.14 Describe window WM-2 in detail.

[0114] Reference Fig. 11B and Fig.14 , the base substrate SUB and the first hard coating layer HC1 are described with reference to Fig.9A , 9B and Fig.12 The base substrate SUB and the first hard coating layer HC1 described in the embodiment are the same, and therefore, the details thereof will be omitted. Fig. 11B and Fig.14 The third hard coating HC3.

[0115] Reference Fig. 11B The window WM-2 further includes a third hard coating layer HC3 disposed on the first lower surface BA1 of the base substrate SUB. When the window WM-2 is combined with the display device DD, the third hard coating layer HC3 reduces or effectively prevents the generation of scratches.

[0116] The third hard coating layer HC3 may be a hard coating layer HC that is not connected to the first hard coating layer HC1. Fig.14 The third hard coating layer HC3 is shown only on the first lower surface BA1 of the base substrate SUB and excluded from the side surface SA1 of the base substrate SUB, however, it should not be limited thereto.

[0117] In an embodiment, the third hard coating layer HC3 may extend in a direction substantially parallel to the first direction axis DR1 and further than the first lower surface BA1 to correspond to the bottom end surface of the first hard coating layer HC1, or the first hard coating layer HC1 may extend in a direction substantially parallel to the third direction axis DR3 and further than the first lower surface BA1 to correspond to the edge surface of the third hard coating layer HC3. Therefore, the first hard coating layer HC1 and the third hard coating layer HC3 may contact each other (e.g., forming an interface therebetween) to form one continuous layer of the hard coating layer HC.

[0118] The third hard coating layer HC3 has a uniform fourth thickness T4. The fourth thickness T4 of the third hard coating layer HC3 is less than the first thickness T1 of the first hard coating layer HC1, however, it should not be limited thereto or thereby. The fourth thickness T4 of the third hard coating layer HC3 may be non-uniform, or may be the same as or greater than the first thickness T1 of the first hard coating layer HC1. In an embodiment, the fourth thickness T4 may be equal to or greater than about 1 micrometer and equal to or less than about 10 micrometers.

[0119] As described above, the exposed upper surface DCA is disposed closer to the second lower surface BA2 than the attachment surface CA between the protection film PF and the base substrate SUB. Therefore, a method of providing a window WM in which the hard coating layer HC protects the side surface SA1 of the base substrate SUB is provided.

[0120] Since the window WM includes the hard coating layer HC disposed to overlap the entire surface of the side surface SA1 , a side surface portion of the display device DD that is curved and covered by the curved portion of the window WM may be protected.

[0121] Although the embodiments have been described, it should be understood that the present disclosure should not be limited to these embodiments, but a person skilled in the art may make various changes and modifications within the spirit and scope of the present disclosure as claimed.

[0122] Therefore, the disclosed subject matter should not be limited to any single embodiment described herein, and the scope of the present invention should be determined in accordance with the appended claims.

Claims

1. A method for providing a window for an electronic device, comprising: providing a base substrate, the base substrate comprising a first upper surface and a first lower surface opposite to the first upper surface; providing a protective film, the protective film comprising a second upper surface and a second lower surface opposite to the second upper surface; removably attaching the second upper surface of the protective film to the first lower surface of the base substrate; providing a processed base substrate and a processed protective film by removing a portion of the base substrate and a portion of the protective film to provide an exposed upper surface of the processed protective film, the exposed upper surface of the processed protective film being closer to the second lower surface of the protective film than the second upper surface of the protective film; providing a first surface protection layer on both the first upper surface of the treated base substrate and the exposed upper surface of the treated protective film; as well as The treated protective film is separated from the treated base substrate to provide the window, which is attachable to a display device of the electronic apparatus and includes the treated base substrate having the first surface protective layer.

2. The method according to claim 1, wherein: Removing the portion of the base substrate and the portion of the protective film includes: Defined within said processed base substrate: a width of the first upper surface, the width of the first upper surface being smaller than the width of the first lower surface, and a side surface connecting the first upper surface and the first lower surface to each other; and Defined within the treated protective film: an overlapping portion corresponding to the width of the first lower surface of the processed base substrate, a non-overlapping portion extending further than the width of the first lower surface of the processed base substrate and defining an exposed upper surface of the processed protective film, and The exposed side surface connects the exposed upper surface to the second upper surface.

3. The method according to claim 2, wherein: Separating the processed protection film from the processed base substrate includes separating the non-overlapping portion and the overlapping portion from the processed base substrate.

4. The method according to claim 1, further comprising: After providing the first surface protection layer, providing a second surface protection layer on the first surface protection layer, Wherein, compared with the first surface protection layer, the second surface protection layer is farther away from the first lower surface of the processed base substrate.

5. The method according to claim 1, further comprising: After separating the treated protection film from the treated base substrate, a third surface protection layer is provided on the first lower surface of the treated base substrate.

6. The window of an electronic device provided by the method according to any one of claims 1 to 5, comprising: A base substrate comprising: an upper surface corresponding to a transmission area of ​​a display device of the electronic device, a lower surface, opposite to the upper surface, and a side surface corresponding to a frame region of the display device and connecting the upper surface and the lower surface to each other; and A first surface protection layer, on the upper surface and the side surface of the base substrate, the first surface protection layer comprising: a first portion on the upper surface of the base substrate and having a first thickness; and a second portion on the side surface of the base substrate and having a second thickness different from the first thickness, The first thickness and the second thickness are respectively the minimum distances in the normal direction relative to the upper surface and the side surface.

7. The window according to claim 6, wherein: The side surface of the base substrate includes a curved surface.

8. The window according to claim 6, wherein: The upper surface and the side surface are adjacent to each other along a first direction, The upper surface and the lower surface of the base substrate each have a width along the first direction, and The width of the upper surface is smaller than the width of the lower surface.

9. The window according to claim 6, wherein: The upper surface and the side surface are adjacent to each other along a first direction, The side surface has a width along the first direction, and The width of the side surface decreases in a direction from the lower surface toward the upper surface.

10. The window according to claim 6, wherein: The first portion of the first surface protection layer has a pencil hardness, and The pencil hardness is equal to or greater than 8H and equal to or less than 9H.

11. The window according to claim 6, wherein: In the first surface protection layer, a ratio of the second thickness to the first thickness is equal to or greater than 0.5 and less than 1.

12. The window according to claim 11, wherein In the first surface protection layer, The first thickness is equal to or greater than 20 micrometers and equal to or less than 50 micrometers, and The second thickness is equal to or greater than 10 micrometers and equal to or less than 25 micrometers.

13. The window according to claim 6, wherein: In the first surface protection layer, the second thickness of the second portion decreases in a direction from the upper surface toward the lower surface.

14. The window according to claim 6, further comprising a second surface protection layer corresponding to the first portion of the first surface protection layer, in, Compared to the first surface protection layer, the second surface protection layer is farther from the lower surface of the base substrate.

15. The window according to claim 6, further comprising a third surface protection layer corresponding to the first portion of the first surface protection layer, in, The third surface protection layer faces the first surface protection layer, and the base substrate is between the third surface protection layer and the first surface protection layer.

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