Substrate processing method and substrate processing apparatus

Abstract

The present application provides a substrate processing method which provides a technology capable of suppressing diffusion of contamination of a processing unit. The substrate processing method includes: a setting step (S1) of setting, based on input by a user, a usable simulation substrate among a plurality of simulation substrates housed in a housing container for each of a plurality of processing units included in a substrate processing apparatus, and generating setting information indicating a simulation substrate usable in each of the plurality of processing units; a simulation substrate specifying step (S3) of specifying, based on the setting information, a first simulation substrate usable in a first processing unit among the plurality of processing units, from among the plurality of simulation substrates; and a simulation processing step (S4) of carrying, by a carrying unit included in the substrate processing apparatus, the first simulation substrate from the housing container to the first processing unit, and performing simulation processing on the first simulation substrate by the first processing unit.

Description

TECHNICAL FIELD

[0001] The present application relates to a substrate processing method and a substrate processing apparatus. BACKGROUND

[0002] In a manufacturing process of products such as semiconductor devices and liquid crystal display devices, a substrate processing apparatus that performs various processes on a substrate is used. The substrate processing apparatus includes a plurality of processing units that supply a process liquid to a substrate, a conveyance unit that conveys the substrate, and a control unit that controls these. The processing units supply the process liquid to the substrate conveyed one by one from the conveyance unit and perform the process on the substrate one by one. If the processing units perform the process on a plurality of substrates, contamination (particles and the like) gradually accumulates inside the processing units. Therefore, in the substrate processing apparatus, a unit cleaning that cleans the inside of the processing units is performed as necessary (for example, Patent Literature 1).

[0003] In order to perform the unit cleaning, a dummy substrate is sometimes used. The dummy substrate refers to a substrate that has the same shape as a substrate on which a process for manufacturing a product (a product substrate) is performed, although it is not a substrate on which a process for manufacturing a product is performed. The unit cleaning process is performed in a state in which the dummy substrate is held in a substrate holder inside the processing unit, and thus, compared to a state in which no substrate is held on the substrate holder, a variety of unit cleanings can be performed. For example, sometimes, in order to cause a cleaning liquid to reach a specific position inside the processing unit, the dummy substrate is held in the substrate holder and the cleaning liquid is supplied to the dummy substrate. That is, since there is a place in the processing unit that cannot be cleaned by the unit cleaning without using the dummy substrate, it is effective to clean the inside of the processing unit using the dummy substrate.

[0004] Patent Literature 1: Japanese Patent Application Publication No. 2017-41506

[0005] In the plurality of processing units of the substrate processing apparatus, processing units used in different manufacturing stages in the manufacturing process can be included. For example, processing units used in an initial process (so-called Front End Of Line (FEOL)) in the manufacturing process and processing units used in a middle process (so-called Middle End Of Line (MEOL)) are included.

[0006] The film structure of a substrate conveyed into the processing unit for FEOL is different from the film structure of a substrate conveyed into the processing unit for MEOL, and in addition, the kind of process liquid supplied to the substrate in the processing unit for FEOL can be different from the kind of process liquid supplied to the substrate in the processing unit for MEOL. Due to this, the kind of contamination such as particles generated in the processing unit for FEOL can be different from the kind of contamination generated in the processing unit for MEOL.

[0007] If the same simulation board is used for the processing units for different uses, there is a problem in which contamination of the processing units for one use diffuses into the processing units for another use via the simulation board. SUMMARY

[0008] Therefore, the present application has been made to solve the above problems, and it is an object of the present application to provide a technology capable of inhibiting diffusion of contamination of processing units.

[0009] A first mode of a substrate processing method is a substrate processing method including: a setting step of setting, based on input by a user, a simulation board that can be used in each of a plurality of processing units included in a substrate processing apparatus, from among a plurality of simulation boards housed in a housing, generating setting information indicating the simulation board that can be used in each of the plurality of processing units; a simulation board specifying step of specifying, based on the setting information, a first simulation board that can be used in a first processing unit among the plurality of processing units, from among the plurality of simulation boards; and a simulation processing step of carrying, by a carrying unit included in the substrate processing apparatus, the first simulation board from the housing to the first processing unit, and performing simulation processing on the first simulation board by the first processing unit.

[0010] A second mode of a substrate processing method is the substrate processing method according to the first mode, the setting step includes: a step of setting, based on input by a user, a processing category for each of the plurality of processing units; and a step of setting, based on input by a user, a processing category for each of the plurality of simulation boards, and in the simulation board specifying step, a simulation board belonging to the same processing category as the processing category of the first processing unit is specified as the first simulation board.

[0011] A third mode of a substrate processing method is the substrate processing method according to the second mode, the processing category includes a category indicating one of a plurality of processing stages that divide a manufacturing process of a semiconductor device.

[0012] A fourth mode of a substrate processing method is the substrate processing method according to the second mode or the third mode, the processing category for each of the plurality of simulation boards includes a category indicating that the simulation board can be used in any of the plurality of processing units.

[0013] A fifth mode of a substrate processing method is the substrate processing method according to any one of the second mode to the fourth mode, the setting step further includes a step of setting, based on input by a user, a hand included in a plurality of hands included in the carrying unit, which is used for carrying the first simulation board, in accordance with the processing category.

[0014] The sixth mode of the substrate processing method is the substrate processing method according to any one of the first mode to the fifth mode, in the setting step, two or more of the simulation substrates among the plurality of simulation substrates are set as being able to be used in the first processing unit, in the simulation substrate specifying step, a simulation substrate having the least number of uses among the two or more simulation substrates is specified as the first simulation substrate.

[0015] The seventh mode of the substrate processing method is the substrate processing method according to any one of the first mode to the sixth mode, the setting step further includes a step of setting, based on an input of a user, a plurality of the simulation substrates housed in which of a first housing that is movable and is loaded on a loading section of the substrate processing apparatus and a second housing that is fixed and is provided in the substrate processing apparatus.

[0016] The eighth mode of the substrate processing method is the substrate processing method according to any one of the first mode to the seventh mode, the setting step further includes a step of setting, based on an input of a user, a start condition of the simulation processing, the step further includes a step of setting, as the start condition of each of the plurality of processing units, at least one of a first start condition and a second start condition, the first start condition refers to a life time during which each of the plurality of processing units does not continue processing of a substrate being a life setting time or more, the second start condition refers to a number of substrates processed in each of the plurality of processing units being a life setting number or more.

[0017] The ninth mode of the substrate processing method is the substrate processing method according to the eighth mode, the setting step further includes a step of setting, based on an input of a user, at least one of the life setting time and the life setting number.

[0018] The tenth mode of the substrate processing method is the substrate processing method according to any one of the first mode to the ninth mode, the setting step further includes a step of setting, based on an input of a user, a number of times of processing of a simulation substrate used in the simulation processing step for each of the plurality of processing units, in the simulation processing step, the first simulation substrate of the set number of times of processing is sequentially moved into the first processing unit, and the first processing unit performs the simulation processing on the first simulation substrate sequentially moved in, respectively.

[0019] The eleventh mode of the substrate processing method is the substrate processing method according to any one of the first mode to the tenth mode, further including a processing step in which a plurality of the processing units sequentially perform processing on a substrate for each processing task in which a predetermined plurality of substrates are taken as a unit, the setting step further including a step of setting, based on an input by a user, whether the simulation processing is performed during execution of processing of the processing task and execution of processing of a next processing task or the simulation processing is performed within the execution of the processing task.

[0020] The twelfth mode of the substrate processing method is the substrate processing method according to any one of the first mode to the eleventh mode, further including an inspection step of inspecting whether the setting in the setting step is appropriate.

[0021] The thirteenth mode of the substrate processing method is the substrate processing method according to any one of the second mode to the fourth mode, further including an inspection step of inspecting whether all types of processing categories set in the plurality of the processing units are set to the plurality of the simulation substrates.

[0022] The fourteenth mode of the substrate processing method is the substrate processing method according to any one of the first mode to the thirteenth mode, in the simulation processing step, the first processing unit supplies a cleaning liquid to the first simulation substrate.

[0023] The fifteenth mode of the substrate processing method is the substrate processing method according to any one of the first mode to the fourteenth mode, in the simulation processing step, the first processing unit supplies a processing liquid identical to a processing liquid supplied to a substrate by the first processing unit to the first simulation substrate.

[0024] The sixteenth mode of the substrate processing method is the substrate processing method according to any one of the first mode to the fifteenth mode, further including an initialization step of initializing the setting information when the plurality of the simulation substrates are carried out to the outside of the substrate processing apparatus.

[0025] A first embodiment of the substrate processing apparatus is a substrate processing apparatus including an input device; a plurality of processing units; a conveyance unit that conveys a dummy substrate between a housing that houses a plurality of dummy substrates and each of the plurality of processing units; and a control unit that, based on an input to the input device, creates setting information indicating a usable dummy substrate among the plurality of dummy substrates for each of the plurality of processing units, specifies a first dummy substrate usable in a first processing unit among the plurality of processing units based on the setting information, causes the conveyance unit to convey the first dummy substrate from the housing to the first processing unit, and causes the first processing unit to perform a simulation process on the first dummy substrate.

[0026] According to the first, third, and embodiments of the substrate processing method and the substrate processing apparatus, a dummy substrate usable in a processing unit is set. Thus, in a processing unit in which different contamination is generated, by setting a different dummy substrate, the contamination generated in one processing unit can be suppressed from spreading to another processing unit.

[0027] According to the second embodiment of the substrate processing method, in processing units of different processing categories, different dummy substrates are used, so that the spread of different contamination can be suppressed. Further, one processing category is set for each processing unit, and one processing category is set for each dummy substrate, so that the settings can be easily made.

[0028] According to the fourth embodiment of the substrate processing method, the usability can be improved.

[0029] According to the fifth embodiment of the substrate processing method, the hand is set according to the processing category, so that the spread of contamination via the hand can also be suppressed.

[0030] According to the sixth embodiment of the substrate processing method, the number of times of use of a specific dummy substrate can be greatly suppressed compared to other dummy substrates.

[0031] According to the seventh embodiment of the substrate processing method, the usability can be improved.

[0032] According to the eighth embodiment of the substrate processing method, the usability can be improved.

[0033] According to the ninth embodiment of the substrate processing method, the usability can be improved.

[0034] According to the tenth embodiment of the substrate processing method, in the simulation processing step, one or more simulation processes can be continuously performed. The number of times of continuous simulation processes (the number of processes) is set for each processing unit, so that the simulation processes can be performed at a number suitable for the processing unit.

[0035] According to the eleventh embodiment of the substrate processing method, the usability can be improved.

[0036] According to the twelfth and thirteenth modes of the substrate processing method, erroneous settings can be suppressed.

[0037] According to the fourteenth mode of the substrate processing method, the processing unit can be cleaned.

[0038] According to the fifteenth mode of the substrate processing method, the processing environment of the processing unit can be adjusted.

[0039] According to the sixteenth mode of the substrate processing method, when a new plurality of simulation substrates are carried into the substrate processing apparatus, the simulation substrates can be carried into the processing units using the previous setting information. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 is a diagram schematically showing an example of the overall structure of the substrate processing apparatus.

[0041] Figure 2 is a side view schematically showing an example of the structure of the substrate processing apparatus.

[0042] Figure 3 is a block diagram schematically showing an example of the electrical structure of the substrate processing apparatus.

[0043] Figure 4 is a flowchart showing an example of the operation of the substrate processing apparatus.

[0044] Figure 5 is a flowchart showing an example of the setting procedure.

[0045] Figure 6 is a diagram schematically showing an example of the first setting image.

[0046] Figure 7 is a diagram schematically showing an example of the second setting image.

[0047] Figure 8 is a flowchart showing an example of the simulation substrate specifying procedure.

[0048] Figure 9 is a diagram showing an example of the relationship between the hand and the processing category.

[0049] Figure 10 is a timing chart showing an example of the simulation processing procedure.

[0050] Figure 11 is a timing chart showing an example of the substrate processing.

[0051] Figure 12 is a timing chart showing an example of the substrate processing.

[0052] Figure 13 is a flowchart showing an example of the inspection procedure.

[0053] Figure 14 FIG. 2 is a diagram schematically showing another example of a second set image.

[0054] Figure 15 FIG. 3 is a flowchart schematically showing an example of an initialization process.

[0055] In the drawings, the following reference numerals are used:

[0056] 10: processing unit

[0057] 90: control section

[0058] 100: substrate processing apparatus

[0059] BF: container (dummy substrate container)

[0060] C: container (container rack)

[0061] DW: dummy substrate

[0062] CR: transfer section (central robot)

[0063] H: hand

[0064] IR: transfer section (indexer robot)

[0065] W: substrate DETAILED DESCRIPTION

[0066] Hereinafter, embodiments will be described with reference to the drawings. Note that the drawings are schematic diagrams, and structures are appropriately omitted and simplified for the sake of explanation. In addition, the size and the positional relationship of the structures shown in the drawings are not necessarily drawn accurately, and appropriate changes can be made.

[0067] In addition, in the explanation shown below, the same reference numerals are assigned to the same constituent elements, and the names and functions thereof are also the same. Therefore, detailed explanation thereof is sometimes omitted in order to avoid repetition.

[0068] In addition, in the explanation described below, even in the case where ordinal numbers such as "first" or "second" are used, these terms are used in order to easily understand the contents of the embodiments, and are not limited to the order and the like generated by these ordinal numbers.

[0069] expressions indicating a relative or absolute positional relation (e.g., "in a direction", "along a direction", "parallel", "orthogonal", "center", "concentric", "coaxial", etc.) indicate not only a strict sense of the positional relation but also a state where the relative angle or distance is shifted within a range of tolerance or a range where the same degree of function is obtained, unless otherwise specified. Expressions indicating an equal state (e.g., "same", "equal", "uniform", etc.) indicate not only a quantitative strict sense of equality but also a state where there is a difference within a range of tolerance or a range where the same degree of function is obtained, unless otherwise specified. Expressions indicating a shape (e.g., "quadrilateral shape" or "cylindrical shape", etc.) indicate not only a geometrically strict sense of the shape but also a shape having, for example, a concave-convex or a chamfered corner within a range where the same degree of effect is obtained, unless otherwise specified. The expression of "provided with", "possessed of", "including", "comprising", or "having" a constituent element is not an exclusive expression that excludes the presence of other constituent elements. The expression of "at least one of A, B, and C" includes only A, only B, only C, any two of A, B, and C, and all of A, B, and C.

[0070] <Outline structure of substrate processing apparatus>

[0071] Figure 1 is a plan view that schematically shows an example of the structure of the substrate processing apparatus 100. Figure 2 is a side view that schematically shows an example of the structure of the substrate processing apparatus 100.

[0072] As shown in Figure 1 , the substrate processing apparatus 100 is, for example, a single-wafer type apparatus that can be used for processing to remove organic residues adhering to the surface of a semiconductor substrate (wafer) W as an example of a substrate. As the organic residues, for example, there are included an unnecessary resist remaining on the surface of the substrate W after ion implantation processing or the like in which impurities are injected into the surface of the substrate W, or organic garbage or the like from the resist adhering to the surface of the substrate W near the outer periphery. In addition, the substrate processing apparatus 100 can also be used for inorganic residue removal and etching of the substrate W.

[0073] The substrate processing apparatus 100 includes a load port LP as a container holding mechanism that holds a plurality of container racks C as containers, and a plurality of processing units 10 for processing the substrate W (12 units in the present embodiment).

[0074] In the load port LP, a plurality of container racks C that accommodate a plurality of substrates W are arranged in a horizontal arrangement direction D when viewed from above. The container racks C are carried into the load port LP from the outside of the substrate processing apparatus 100, and thus the load port LP functions as a carrying-in portion that carries in the substrates W.

[0075] In Figure 1 In the example, four processing units 10 are arranged in the arrangement direction D. In the substrate processing apparatus 100, a plurality of groups (for example, three groups) of the processing units 10 respectively constituted by the four processing units 10 are arranged in the vertical direction.

[0076] The substrate processing apparatus 100 further includes, for example, an indexer robot IR, a central robot CR, and a control section 90. The indexer robot IR carries the substrate W between the load port LP and the central robot CR. The central robot CR carries the substrate W between the indexer robot IR and each processing unit 10.

[0077] The indexer robot IR is disposed adjacent to the load port LP in a direction orthogonal to the arrangement direction D. The indexer robot IR is disposed so as to be movable in the arrangement direction D and so as to be movable to a position opposite each of the cassettes C. The indexer robot IR is capable of carrying out the substrates W from each of the cassettes C one by one and carrying the substrates W to a substrate placement section 110. The substrate placement section 110 is disposed on the opposite side from the indexer robot IR to the load port LP in a plan view and includes a placement table on which the substrates W are placed. The indexer robot IR is capable of carrying the substrates W from the substrate placement section 110 to each of the cassettes C one by one.

[0078] The central robot CR is disposed on the opposite side from the substrate placement section 110 to the indexer robot IR in a plan view and is capable of carrying out the substrates W from the substrate placement section 110. In Figure 1 In the example, four towers TW are arranged so as to surround the central robot CR in a plan view. Each of the towers TW is constituted by a plurality of (for example, three) processing units 10 stacked in the vertical direction. The substrate placement section 110 is disposed between two of the four towers TW on the side of the indexer robot IR. Further, in Figure 2 In the example, only one tower TW is shown.

[0079] The central robot CR is capable of carrying the substrates W from the substrate placement section 110 to each of the processing units 10 one by one and from each of the processing units 10 to the substrate placement section 110 one by one, for example. Further, the central robot CR is capable of carrying the substrates W between a plurality of the processing units 10 one by one as necessary, for example. The indexer robot IR and the central robot CR are carrying sections (carrying robots) that carry the substrates W between each of the cassettes C and the processing units 10.

[0080] In Figure 1In the example, the indexing robot IR has a U-shaped hand H when viewed from above. Here, the indexing robot IR has two hands H. The two hands H are positioned at different heights. Each hand H can support the substrate W in a horizontal position. The indexing robot IR can move its hands H in both the horizontal and vertical directions. A ball screw mechanism, for example, can be used as the moving mechanism for the indexing robot IR.

[0081] Furthermore, the indexing robot IR can change the orientation of its hand H by rotating (self-rotating) around an axis along the vertical direction. A motor, for example, can be used as the rotating mechanism that causes the indexing robot IR to rotate.

[0082] The indexing robot IR passes through the handover position. Figure 1 The indexing robot IR moves along the path (showing the position of the indexing robot IR) along the arrangement direction D. The junction position is the position where, when viewed from above, the indexing robot IR and the substrate mounting section 110 are opposite each other in a direction orthogonal to the arrangement direction D. The indexing robot IR can position its hand H opposite any of the receiving racks C and the substrate mounting section 110. Here, for example, by moving its hand H, the indexing robot IR can perform the loading action of moving the substrate W into the receiving rack C and the unloading action of moving the substrate W out of the receiving rack C. In addition, for example, by moving its hand H at the junction position, the indexing robot IR can perform the loading action of moving the substrate W into the substrate mounting section 110 and the unloading action of moving the substrate W out of the substrate mounting section 110.

[0083] exist Figure 1 In the example, similar to the indexing robot IR, the central robot CR has a U-shaped hand H when viewed from above. Here, the central robot CR has two hands H. The two hands H are positioned at different heights. Each hand H can support the substrate W in a horizontal posture. The central robot CR can move each hand H in both the horizontal and vertical directions.

[0084] Furthermore, the central robotic arm CR can change the orientation of its hand H by rotating (self-rotating) around an axis along the vertical direction. A motor, for example, can be used as the rotation mechanism for rotating the central robotic arm CR. The central robotic arm CR is surrounded by multiple processing units 10 when viewed from above. The central robotic arm CR can position its hand H opposite any of the processing units 10 and the substrate mounting section 110.

[0085] Here, for example, the central robot CR is capable of a carry-in operation of carrying the substrate W into each processing unit 10 and a carry-out operation of carrying the substrate W out of each processing unit 10 by moving the hand H. In addition, for example, the central robot CR is capable of a carry-in operation of carrying the substrate W into the substrate placing portion 110 and a carry-out operation of carrying the substrate W out of the substrate placing portion 110 by moving the hand H.

[0086] The unprocessed substrate W is taken out of the housing rack C by the indexer robot IR and is handed over to the central robot CR via the substrate placing portion 110. The central robot CR carries the unprocessed substrate W into the processing unit 10. The processing unit 10 processes the substrate W. The processed substrate W is taken out of the processing unit 10 by the central robot CR and is handed over to the indexer robot IR via the substrate placing portion 110 after passing through other processing units 10 as necessary. The indexer robot IR carries the processed substrate W into the housing rack C. Thus, the processing of the substrate W is performed.

[0087] As shown in FIG. 1, the processing system 100 includes a plurality of processing units 10, a substrate placing portion 110, a central robot CR, and an indexer robot IR. The plurality of processing units 10 are arranged in a row. The substrate placing portion 110 is arranged between the plurality of processing units 10. The central robot CR is arranged above the plurality of processing units 10. The indexer robot IR is arranged above the substrate placing portion 110. Figure 2 As shown in FIG. 1, the processing system 100 includes a plurality of processing units 10, a substrate placing portion 110, a central robot CR, and an indexer robot IR. The plurality of processing units 10 are arranged in a row. The substrate placing portion 110 is arranged between the plurality of processing units 10. The central robot CR is arranged above the plurality of processing units 10. The indexer robot IR is arranged above the substrate placing portion 110.

[0088] The substrate holding portion 12 holds the substrate W in a horizontal posture. Here, the horizontal posture means a posture in which a normal line of the substrate W is along a vertical direction. In addition, the substrate holding portion 12 rotates the substrate W about a rotation axis that passes through a central portion of the substrate W and extends in the vertical direction. The substrate holding portion 12 is also referred to as a rotary chuck. The substrate holding portion 12 can hold end portions of the substrate W by a plurality of pins or can hold a back surface of the substrate W by vacuum suction.

[0089] The nozzle 13 sprays a processing liquid to a main surface of the substrate W held by the substrate holding portion 12. If the processing liquid lands on the main surface of the substrate W that is rotating, the processing liquid flows outward on the main surface of the substrate W by a centrifugal force and scatters outward from a peripheral edge of the substrate W. Thus, the processing of the substrate W is performed. In addition, the nozzle 13 can spray a plurality of processing liquids. For example, the nozzle 13 is connected to a plurality of processing liquid supply sources via a plurality of pipes. In addition, a valve is provided on each pipe. By controlling opening and closing of each valve, it is possible to switch the plurality of processing liquids to be sprayed from the nozzle 13. In addition, the processing unit 10 can be provided with a plurality of nozzles 13.

[0090] The cup 14 has a cylindrical shape that surrounds the substrate holding portion 12 and receives the processing liquid scattered from the peripheral edge of the substrate W.

[0091] Here, the multiple processing units 10 belonging to the substrate processing apparatus 100 are each classified into one of multiple uses. As a specific example, each processing unit 10 is classified into one of two types: a processing unit 10 for the initial process and a processing unit 10 for the intermediate process in the manufacturing process of products such as semiconductor devices. The initial process is called the front end of line (FEOL), and the intermediate process is called the middle end of line (MEOL).

[0092] The processing unit 10 for FEOL and the processing unit 10 for MEOL are common in that they include a processing chamber 11, a substrate holding section 12, a nozzle 13, and a cup 14, but their more detailed structures may differ. For example, the structure of the substrate holding section 12 in the processing unit 10 for FEOL may differ from that in the processing unit 10 for MEOL. In addition, the processing unit 10 for FEOL and the processing unit 10 for MEOL may also differ in many other aspects, such as the number and shape of the nozzles 13 and the type of processing liquid that can be supplied to the substrate W.

[0093] A substrate W is fed into a FEOL processing unit 10, which performs FEOL processing on the substrate W. FEOL processing includes standard cleaning using a treatment solution such as a mixture of hydrofluoric acid (HF), ammonia-hydrogen peroxide (SC-1), or hydrochloric acid-hydrogen peroxide (SC-2). A substrate W is then fed into a MEOL processing unit 10, which performs MEOL processing on the substrate W. MEOL processing includes cleaning of metal-containing substrates using a treatment solution such as dilute hydrofluoric acid (dHF) or SC-2, and polymer removal.

[0094] like Figure 1 As shown, the substrate processing apparatus 100 is provided with a user interface 94. The user interface 94 includes a display 95 and an input device 96. The display 95 is a display such as a liquid crystal display (LCD). The display 95 is controlled by the control unit 90 and displays various information. The input device 96 is an input device such as a keyboard and mouse. The input device 96 outputs information input by the user to the control unit 90. Using the input device 96, the user can input various information into the substrate processing apparatus 100. For example, the user can use the input device 96 to instruct the substrate processing apparatus 100 to start an operation.

[0095] The control unit 90 is capable of controlling the operation of various components, such as those in the substrate processing apparatus 100. Figure 3Fig. 1 is a block diagram schematically showing an example of an electric configuration of the substrate processing apparatus 100. The control section 90 is electrically connected to the indexer robot IR, the central robot CR, and the plurality of processing units 10, and controls the operation thereof. In addition, the control section 90 is electrically connected to the user interface 94, and uses the user interface 94 (specifically, the display 95) to notify the user of various information, or receives various information input to the user interface 94 (specifically, the input device 96).

[0096] The configuration of the hardware of the control section 90 is the same as that of a general computer. That is, the control section 90 includes a data processing section 91 such as a CPU, which performs various arithmetic processing, a read-only memory (ROM) as a dedicated memory, which stores a basic program, a non-transitory storage medium 92 such as a magnetic disk, which stores control software or data, and the like, and a temporary storage medium 93 such as a random access memory (RAM) that is freely read and written, which stores various information. Each operation mechanism of the substrate processing apparatus 100 is controlled by the control section 90 to perform processing in the substrate processing apparatus 100 by the data processing section 91 of the control section 90 processing a prescribed processing program. In addition, the control section 90 can be realized by a dedicated hardware circuit that does not need software to realize a function.

[0097] <Simulation Processing>

[0098] Each processing unit 10 can perform simulation processing in addition to the above-described processing on the substrate W. The simulation processing is processing using a simulation substrate DW that is different from the substrate W. The simulation substrate DW has the same shape (for example, a circular plate shape) as the substrate W, and for example, has almost the same diameter as the substrate W. However, unlike the substrate W, the simulation substrate DW is not a manufacturing substrate that is actually used for manufacturing products.

[0099] When the simulation processing is performed, the simulation substrate DW is carried into the processing unit 10. Then, the processing unit 10 sprays a processing liquid (for example, a cleaning liquid such as pure water) from the nozzle 13 toward the main surface of the simulation substrate DW while rotating the simulation substrate DW by the substrate holding section 12 (simulation processing). Thereby, for example, the processing unit 10 is cleaned. By performing the simulation processing in a state where the simulation substrate DW is held at the substrate holding section 12 in the processing unit 10, various cleaning of the inside of the processing unit 10 can be performed compared to a state where the substrate holding section 12 does not hold any substrate. For example, in order to cause the cleaning liquid to reach a specific position in the processing unit 10, the simulation substrate DW can be held at the substrate holding section 12, and the cleaning liquid can be supplied to the simulation substrate DW.

[0100] <Simulation Substrate Container>

[0101] The simulation substrates DW can be housed in the portable housings C held by the load ports LP (see also Figure 1 ). In the example of Figure 1 , four housings C are held because four load ports LP are provided. A plurality of simulation substrates DW can also be housed in one of the four housings C. In this case, the indexer robot IR and the central robot CR transport the simulation substrates DW between the housing C and each processing unit 10.

[0102] However, in this case, one load port LP is occupied by the simulation substrates DW. As a result, the processing capacity for processing substrates W can decrease.

[0103] Therefore, in the example of Figure 2 , a simulation substrate housing BF that houses the simulation substrates DW can also be provided in the substrate processing apparatus 100, separately from the load ports LP. The simulation substrate housing BF is a fixed-type housing, for example, disposed in the upper space of the substrate mounting portion 110. As a specific example, the simulation substrate housing BF is provided at a position vertically opposite the substrate mounting portion 110.

[0104] The simulation substrate housing BF houses a plurality of simulation substrates DW in a state in which they are arranged in a horizontal attitude and along the vertical direction, for example, the same as the housings C. In addition, the simulation substrate housing BF has a box-type shape that is open on the central robot CR side when viewed from above.

[0105] The central robot CR can raise and lower the hand H, and can move the hand H to a height position vertically opposite the simulation substrate housing BF. The central robot CR can perform a carry-in operation of carrying in the substrates W to the simulation substrate housing BF and a carry-out operation of carrying out the substrates W from the simulation substrate housing BF by moving the hand H.

[0106] The central robot CR transports the simulation substrates DW between the simulation substrate housing BF and each processing unit 10. Specifically, the central robot CR moves the hand H to a height position opposite the simulation substrate housing BF. Then, the central robot CR moves the hand H to carry out the simulation substrates DW from the simulation substrate housing BF, and carries in the simulation substrates DW to the processing unit 10. The processing unit 10 performs simulation processing on the simulation substrates DW. If the simulation processing ends, the central robot CR carries out the simulation substrates DW from the processing unit 10. The central robot CR moves the hand H on which the simulation substrates DW are mounted to a height position opposite the simulation substrate housing BF, and moves the hand H to carry in the simulation substrates DW to the simulation substrate housing BF.

[0107] Thus, in a case where the dummy substrate DW housed in the dummy substrate housing container BF is used, a housing rack C housing only a substrate W for a product can be placed on the load port LP. Thus, it is possible to avoid a decrease in the processing capacity of the process.

[0108] <Kind of processing unit>

[0109] As described above, the plurality of processing units 10 belonging to the substrate processing apparatus 100 are each classified as one of a processing unit 10 for FEOL and a processing unit 10 for MEOL. In a manufacturing process of a product such as a semiconductor device, various thin films are formed on the main surface of the substrate W in order. Therefore, the film structure of the main surface of the substrate W in the FEOL and the film structure of the main surface of the substrate W in the MEOL are different from each other. Thus, the film structure of the main surface of the substrate W carried into the processing unit 10 for FEOL and the film structure of the main surface of the substrate W carried into the processing unit 10 for MEOL are different from each other.

[0110] In addition, the kind of processing liquid supplied to the substrate W by the processing unit 10 for FEOL and the kind of processing liquid supplied to the substrate W by the processing unit 10 for MEOL are sometimes different from each other.

[0111] As described above, the film structure of the main surface of the substrate W carried into the processing unit 10 for different uses is different from each other, and in addition, the kind of processing liquid supplied to the substrate W by the processing unit 10 for different uses is also different from each other. Thus, the kind of contamination (e.g., particles) generated in the processing unit 10 for different uses is also different from each other.

[0112] Here, a case where one dummy substrate DW is commonly used for processing units 10 for different uses is considered. If the dummy substrate DW is carried into a processing unit 10 for one use to perform a dummy process, the dummy substrate DW is slightly contaminated by the dummy process. The contaminated dummy substrate DW is carried into a processing unit 10 for another use to perform a dummy process, and thus the contamination of the dummy substrate DW can spread to the inside of the processing unit 10 for another use. That is, the contamination in the processing unit 10 for one use can spread to the processing unit 10 for another use via the dummy substrate DW. Sometimes, the contamination generated under different uses is difficult to remove by a dummy process, and such spread of contamination is not desirable.

[0113] Thus, in the present embodiment, the dummy substrate DW usable for each processing unit 10 can be individually set as described below.

[0114] Further, the input device 96 can receive input of various settings related to a dummy process. For example, the input device 96 can receive input for setting the dummy substrate DW usable for each processing unit 10. Hereinafter, an example of the operation of the substrate processing apparatus 100 will be described.

[0115] <Action>

[0116] Figure 4 This is a flowchart illustrating an example of the operation of the substrate processing apparatus 100. First, the control unit 90 performs various settings related to simulation processing based on user input (step S1: setting process). Figure 5 This is a flowchart illustrating a specific example of the setting process. First, the control unit 90 causes the display 95 to show the first setting screen for setting (step S11). Figure 6 This is a diagram that roughly represents an example of a first setting image. Based on the display of this first setting image, various setting-related information for simulation processing can be input to the input device 96.

[0117] <Correspondence Information>

[0118] First, a method for setting a usable simulation substrate DW among multiple simulation substrate DWs housed in a container (reservoir C or simulation substrate container BF) for each processing unit 10 is described. As detailed below, the user inputs information about the simulation substrate DWs usable by each processing unit 10 using an input device 96. The input device 96 outputs the input information to the control unit 90. Based on the information from the input device 96, the control unit 90 generates a mapping information indicating the correspondence between the simulation substrate DWs usable by each processing unit 10 as one of the setting information (step S12).

[0119] In this embodiment, as an example of a method for setting up a usable simulation substrate DW, processing categories are introduced for explanation. A processing category is a category used to distinguish processing units 10; specifically, it includes two categories: "FEOL" and "MEOL". In this embodiment, as described below, a processing category is set for each processing unit 10, and a processing category is set for each simulation substrate DW. Simulation substrate DWs belonging to the same processing category as the processing unit 10 can be used in this processing unit 10.

[0120] Figure 6 The first example configuration image shows a table with "Processing Unit" and "Processing Category" listed as its items. In the "Processing Unit" item, processing units 10A, 10B, ..., 10H are displayed vertically, representing all the processing units 10 belonging to the substrate processing apparatus 100. In the "Processing Category" item, processing categories (here, "FEOL" or "MEOL") are displayed vertically, corresponding to each processing unit 10.

[0121] exist Figure 6 The first setting image shown includes an input element M11 for inputting the processing category of each processing unit 10. Figure 6In the example of FIG. 10, a plurality of input elements M11 are provided in correspondence with the processing units 10A to 10H, for example, combo boxes. If the user operates (for example, clicks) the input element M11 corresponding to each processing unit 10 using the input device 96, a list of selectable processing categories (not shown) is displayed on the display 95. Here, "FEOL" and "MEOL" are displayed on the display 95. When the user selects one of the list using the input device 96, the information is output from the input device 96 to the control section 90. The control section 90 sets the processing category of the corresponding processing unit 10 to the selected processing category based on the information.

[0122] The user performs the above-described operation on all of the processing units 10, and thus the control section 90 can set the processing category to all of the processing units 10. Specifically, the control section 90 generates unit setting information that associates the processing units 10 and the processing categories.

[0123] In the example of FIG. 10, the processing category of the processing units 10A to 10F is set to "FEOL", and the processing category of the processing units 10G to 10H is set to "MEOL". Figure 6

[0124] In the example of FIG. 10, the processing category of the processing units 10A to 10F is set to "FEOL", and the processing category of the processing units 10G to 10H is set to "MEOL". Figure 6 The input element M12 is an input element for displaying a second setting image to be described later. The input element M12 is, for example, a button (also referred to as a soft key. Hereinafter, the same applies.). If the user operates (for example, clicks) the input element M12 of the first setting image using the input device 96, the control section 90 ends the operation in response to the operation and displays the first setting image in the display 95 and displays the second setting image.

[0125] The second setting image is a screen for setting the processing category of each dummy wafer DW. Figure 7 FIG. 11 is a diagram schematically showing an example of the structure of the second setting image. A table is also displayed in the second setting image, and "slot" and "processing category" are displayed as items thereof. The "slot" indicates a space for housing each dummy wafer DW in each of the racks C and the dummy wafer housing section BF. Here, as an example, each of the racks C and the dummy wafer housing section BF can house 25 dummy wafers DW. In the example of FIG. 11, the processing category of each dummy wafer DW is set to "FEOL" in the first setting image. Figure 7 In the example of FIG. 11, "1" to "25" are displayed as numbers for identifying the slots in the item of "slot". Each dummy wafer DW is housed in each slot, and thus the numbers for identifying the slots also function as numbers for identifying the dummy wafers DW.

[0126] ​In the "Processing Category" section, "FEOL" and "MEOL" are displayed horizontally, corresponding to each slot. The selected "FEOL" or "MEOL" slot is indicated by a diagonal shadow in the background. Figure 7 In the example, in the processing category corresponding to the slot represented by "1", "MEOL" is shaded, so "MEOL" is set as the processing category on the simulation substrate DW that accommodates the slot "1".

[0127] The areas displaying "MEOL" in the "Processing Category" section function as input element M13, used to input "ME OL" as the processing category for the corresponding simulation board DW. The areas displaying "FEOL" function as input element M14, used to input "FEOL" as the processing category for the corresponding simulation board DW. Input elements M13 and M14 are, for example, buttons.

[0128] If a user operates (e.g., clicks) an input element M13 using input device 96, the control unit 90 responds to the operation and sets the processing category of the simulation board DW corresponding to the input element M13 to "MEOL". Conversely, if a user operates (e.g., clicks) an input element M14 using input device 96, the control unit 90 responds to the operation and sets the processing category of the simulation board DW corresponding to the input element M14 to "FEOL".

[0129] exist Figure 7 In the example, the table for the second setting image displays "Existence" as an item. The "Existence" item displays information about whether the emulated substrate DW exists in each slot. Figure 7 In the examples, the presence of a simulated substrate DW is represented by a black circle, while the absence of a simulated substrate DW is represented by an empty column. Figure 7 In the example, slot "21" does not contain the simulated substrate DW, while the other slots do contain the simulated substrate DW.

[0130] Information indicating the presence or absence of the simulated substrate DW in each slot can be input by the customer using input device 96, or a mapping sensor for detecting the presence or absence of the simulated substrate DW in the holder C and a mapping sensor for detecting the presence or absence of the simulated substrate DW in the simulated substrate holder BF can be provided in the substrate processing apparatus 100.

[0131] The user operates input element M13 or input element M14 on all slots containing the emulated board DW, thereby enabling the control unit 90 to set processing categories for all emulated board DWs. Specifically, the control unit 90 generates emulated board setting information that associates the emulated board DWs with processing categories.

[0132] exist Figure 7 In the example, the simulation board DW containing slots "1" to "13" is set to "MEOL", and the simulation board DW containing slots "14" to "20" and "22" to "25" is set to "FEOL".

[0133] The second setting image also displays an input element M91. Input element M91 is an input element used to return to the first setting image, such as a button. If the user operates (e.g., clicks) the input element M91 using the input device 96, the control unit 90 responds to the operation, ending the display of the second setting image on the display 95 and redisplaying the first setting image.

[0134] Reference Figure 6 The first setting image also displays an input element M92. Input element M92 is an input element used to determine setting information, such as a button. If the user operates (e.g., clicks) input element M92 using input device 96, the control unit 90 responds to the operation by storing setting information (e.g., correspondence information) in storage medium 92. More specifically, the control unit 90 stores unit setting information indicating the correspondence between processing unit 10 and processing category, and simulation board setting information indicating the correspondence between slot and processing category (i.e., the correspondence between simulation board DW and processing category) in storage medium 92. Thus, correspondence information (unit setting information and simulation board setting information) is determined.

[0135] This correspondence information specifies the simulation substrate DW that can be used in processing unit 10 via the processing category setting. More specifically, processing unit 10 can use simulation substrate DWs belonging to the same processing category as the processing unit 10. Figure 6 In the example, the processing category of processing unit 10A is "FEOL". Additionally, in Figure 7 In this example, the simulation board DWs housed in slots "14" to "20" and "22" to "25" are assigned a processing category of "FEOL". Therefore, in the simulation processing of the processing unit 10A, simulation board DWs housed in slots "14" to "20" and "22" to "25" can be used. In this example, multiple simulation board DWs are provided as simulation board DWs that can be used in the processing unit 10A.

[0136] Reference Figure 5 In the setting process, steps S13 to S16 can also be performed to generate setting information that is different from the corresponding relationship information. These will be described in detail later.

[0137] Reference Figure 4After the setting process (step S1), the control section 90 determines for each processing unit 10 whether or not a start condition of the simulation process is satisfied (step S2). Hereinafter, in explaining an example of the start condition of the simulation process, a life is introduced which is a life of the processing unit 10 in which the processing unit 10 can perform the processing of the substrate W without performing the simulation process. When the life of each processing unit 10 is exhausted, the control section 90 determines that the simulation process is required for the processing unit 10. That is, the start condition is satisfied when the life is exhausted.

[0138] As a specific index indicating the life, for example, a life sheet number described below can be used. The life sheet number is a number of sheets of the substrate W which the processing unit 10 has processed after the previous simulation process. As the life sheet number increases, the life decreases. For example, the control section 90 determines that the life is exhausted when the life sheet number becomes a predetermined life setting sheet number or more.

[0139] As an example of the specific operation, the control section 90 counts the life sheet number for each processing unit 10 each time the central robot CR carries the substrate W into the processing unit 10. Thus, the life sheet number can be measured for each processing unit 10. Then, the control section 90 determines for each processing unit 10 whether or not the number of sheets of the substrate W which has been processed after the previous simulation process, that is, the life sheet number is a predetermined life setting sheet number or more. The control section 90 determines that the start condition of the processing unit 10 is satisfied when the life sheet number is the life setting sheet number or more.

[0140] Alternatively, as an index indicating the life, a life time described below can be used. The life time is a time during which the processing unit 10 does not continue the processing of the substrate W. That is, the life time is a time during which the processing unit 10 does not perform the processing of the substrate W and continues to stand by. For example, the control section 90 can determine that the life is exhausted when the life time becomes a predetermined life setting time or more.

[0141] As an example of the specific operation, the control section 90 measures, as the life time, an elapsed time from the start of the processing of the last substrate W for each processing unit 10. The measurement of the life time is performed by, for example, a timer circuit. For example, the timer circuit is initialized when the substrate W is carried into the processing unit 10. The control section 90 determines for each processing unit 10 whether or not the life time is a predetermined life setting time or more. The control section 90 determines that the start condition of the processing unit 10 is satisfied when the life time is the life setting time or more.

[0142] When it is determined that the start condition is not satisfied for all the processing units 10, the control section 90 re-executes the step S2.

[0143] When it is determined that the start condition is satisfied for a processing unit 10, the control section 90 specifies the simulation board DW that can be used for the processing unit 10 for which the start condition is satisfied, based on the setting information (i.e., the correspondence relationship information) stored in the storage medium 92 (step S3: simulation board specifying process).

[0144] Figure 8 is a flowchart showing one example of the simulation board specifying process. The control section 90 specifies the simulation board DW belonging to the same processing category as the processing unit 10 for which the start condition is satisfied, based on the correspondence relationship information (step S31). For example, when the start condition is satisfied for the processing unit 10A, the control section 90 specifies one of the simulation boards DW belonging to the same processing category as the processing category of the processing unit 10A (i.e., "FEOL") as the simulation board DW that can be used for the processing unit 10A. Figure 6 In the example of Figure 7 , the processing categories of the slots of "14" to "20" and "22" to "25" are set to be the same as the processing category of the processing unit 10A (i.e., "FEOL"). That is, the simulation boards DW housed in the slots of "14" to "20" and "22" to "25" can be used.

[0145] Therefore, the control section 90 can specify the simulation board DW housed in any one of the slots of "14" to "20" and "22" to "25" as the simulation board DW used for the simulation processing of the processing unit 10A. For example, the control section 90 specifies the simulation board DW having the least number of uses among these simulation boards DW (step S32). For example, the number of uses corresponding to each simulation board DW is counted every time the simulation board DW is carried into the processing unit 10 to measure the number of uses of the simulation board DW. The simulation board DW having the least number of uses is specified, so that the deviation in the number of uses of each simulation board DW can be suppressed. That is, the plurality of simulation boards DW can be used more evenly. As a result, the replacement timing of each simulation board DW can be aligned.

[0146] Referring back to Figure 4 , the simulation processing is performed in the processing unit 10 for which the start condition is satisfied (step S4: simulation processing process). Here, as one example, the simulation board DW housed in the simulation board housing device BF is used. The central robot CR carries out the specified simulation board DW from the simulation board housing device BF in the simulation board specifying process, and carries the simulation board DW into the processing unit 10 for which the start condition is satisfied. The substrate holding section 12 of this processing unit 10 holds the simulation board DW, and rotates the simulation board DW. Then, the processing unit 10 ejects the processing liquid from the nozzle 13 toward the simulation board DW. As a result, the simulation processing is performed. Through this simulation processing, for example, the inside of the processing unit 10 can be cleaned.

[0147] As described above, in the present embodiment, the simulation board DW that each processing unit 10 is able to use is carried in the processing unit 10, and each processing unit 10 performs simulation processing using the simulation board DW that it is able to use. As a more specific example, the simulation board DW belonging to the same processing category as the processing category of the processing unit 10 is carried in the processing unit 10 as a simulation board DW that can be used. In other words, the same simulation board DW is not carried in the processing unit 10 belonging to a different processing category. Therefore, it is possible to avoid the spread of contamination via the simulation board DW between the processing units 10 belonging to different processing categories.

[0148] In addition, in the example described above, the correspondence relationship between the processing units 10 and the simulation boards DW is set indirectly using the processing categories. Thereby, it is easy to set the correspondence relationship between the processing units 10 and the simulation boards DW.

[0149] For comparison, consider the case where a plurality of simulation boards DW that can be used are set directly for each processing unit 10. In this case, in the example described above, the user inputs the slots (11 slots) of "14" to "20" and "21" to "25" to the processing unit 10A in order, and thus 11 inputs are required for the processing unit 10A. The user inputs the same slots to each of the processing units 10B to 10F in order. Therefore, a total of 66 (= 6 x 11) inputs are required for the processing units 10A to 10F. In addition, the user inputs the slots (13 slots) of "1" to "13" to each of the processing units 10G to 10H in order. Thereby, a total of 78 (= 6 x 13) inputs are required for the processing units 10G to 10H.

[0150] On the other hand, if the correspondence relationship between the processing units 10 and the simulation boards DW is set indirectly using the processing categories, only one processing category is set for each of the processing units 10 and the simulation boards DW. Accordingly, it is only necessary to input the number of times of input of the sum (for example, 36) of the number of processing units 10 (for example, 12) and the number of simulation boards DW present in the container (for example, 24). Therefore, it is possible to simplify the input work. Thereby, it is possible to reduce the work error. In addition, since the correspondence relationship is easy to understand, it is also easy to input and check.

[0151] <Other setting information>

[0152] Hereinafter, other setting information related to simulation processing will be described.

[0153] <Container setting of simulation board>

[0154] In the above-described example, the number of slots of the simulation boards DW present in the container is set for each processing category. In this case, the number of slots of the simulation boards DW present in the container is set for each processing category. Therefore, it is possible to easily set the number of slots of the simulation boards DW present in the container. Figure 2In the example, a simulation substrate container BF is provided in the substrate processing apparatus 100. Therefore, the simulation substrate DW within the simulation substrate container BF can be used in simulation processing. On the other hand, when the container C holding the simulation substrate DW is moved into the loading port LP, the simulation substrate DW within the container C can also be used for simulation processing.

[0155] Therefore, the control unit 90 can also set the container for the simulation substrate DW used in the simulation process based on user input (step S13: Figure 5 In other words, input device 96 can also receive inputs specifying the container used in the simulation process. More specifically, input device 96 can receive inputs specifying whether to use any one of the movable container C and the fixed simulation substrate container BF housed on the loading port LP.

[0156] exist Figure 6 In the example, the first setup image shows input element M2. Input element M2 is the input element used to input the container for simulation processing. Figure 6 In the example, input element M2 includes input elements M21 to M25. Input elements M21 to M24 are displayed as "LP1", "LP2", "LP3", and "LP4", respectively, representing the load port LP. Input element M25 is displayed as "BF", representing the simulation substrate receiver BF.

[0157] If the user uses input device 96 to operate (e.g., click) any of input elements M21 to M25, the control unit 90 responds to the operation and sets the container used in the simulation process as an input element of the operation. Specifically, the control unit 90 generates container information representing the container used in the simulation process.

[0158] exist Figure 6 In the example, the input element M25 is shaded. This indicates that the simulation substrate receiver BF is set as the receiver used in the simulation process.

[0159] When determining the settings of the container, the user uses an input device 96, such as an operation input element M92. In response to the operation of the input element M92, the control unit 90 stores container information indicating the container used in the simulation process in the storage medium 92 as one of the setting information.

[0160] As mentioned above, users can input the containers used in the simulation process.

[0161] The control section 90 controls the indexer robot IR and the central robot CR based on the container information stored in the storage medium 92 when performing the simulation process. When the container indicated by the container information is the load port LP, the control section 90 causes the indexer robot IR to take out the simulation board DW held in the container holder C of the load port LP indicated by the container information, and causes the central robot CR to carry the simulation board DW into the processing unit 10. If the simulation process ends in the processing unit 10, the central robot CR and the indexer robot IR cooperate to return the simulation board DW to the original position in the original container holder C.

[0162] When the container indicated by the container information is the simulation board container BF, the control section 90 causes the central robot CR to take out the simulation board DW from the simulation board container BF, and causes the central robot CR to carry the simulation board DW into the processing unit 10. If the simulation process ends in the processing unit 10, the central robot CR returns the simulation board DW to the original position in the simulation board container BF.

[0163] As described above, the container of the simulation board DW used in the simulation process can be set. Thus, the usability of the board processing apparatus 100 can be improved.

[0164] <Start condition of simulation process>

[0165] In the example described above, the control section 90 determines whether the life time is equal to or more than the life set time for each processing unit 10, and determines that the start condition of the simulation process of the processing unit 10 is satisfied when the life time is equal to or more than the life set time. Hereinafter, this start condition is referred to as a first start condition.

[0166] In the example described above, the control section 90 determines whether the life number is equal to or more than the life set number for each processing unit 10, and determines that the start condition of the simulation process of the processing unit 10 is satisfied when the life number is equal to or more than the life set number. Hereinafter, this start condition is referred to as a second start condition.

[0167] The control section 90 can set the start condition of the simulation process based on the input of the user (step S14). Figure 5 In other words, the input device 96 can receive an input for specifying the start condition of the simulation process. More specifically, the input device 96 can receive an input for specifying at least one of the first start condition and the second start condition as the start condition.

[0168] If the user inputs at least one of the first start condition and the second start condition using the input device 96, the control section 90 sets the input start condition as the start condition of the simulation process of each processing unit 10.

[0169] Here, as an example, the first start condition is set by setting the life setting time used in the first start condition to a value greater than 0, and the second start condition is set by setting the life setting number of sheets used in the second start condition to a value greater than 0. Hereinafter, a specific example will be described.

[0170] In the example of FIG. 10, in the table of the first setting image, "life setting time" and "life setting number of sheets" are displayed as items thereof. In the example of FIG. 11, in the item of "life setting time", life setting times TA to TH are displayed in vertical alignment corresponding to the processing units 10A to 10H, respectively. In the example of FIG. 12, in the item of "life setting number of sheets", life setting numbers of sheets NA to NH are displayed in vertical alignment corresponding to the processing units 10A to 10H, respectively. Figure 6 Figure 6 In the example of FIG. 10, in the table of the first setting image, "life setting time" and "life setting number of sheets" are displayed as items thereof. In the example of FIG. 11, in the item of "life setting time", life setting times TA to TH are displayed in vertical alignment corresponding to the processing units 10A to 10H, respectively. In the example of FIG. 12, in the item of "life setting number of sheets", life setting numbers of sheets NA to NH are displayed in vertical alignment corresponding to the processing units 10A to 10H, respectively. Figure 6 In the example of FIG. 10, in the table of the first setting image, "life setting time" and "life setting number of sheets" are displayed as items thereof. In the example of FIG. 11, in the item of "life setting time", life setting times TA to TH are displayed in vertical alignment corresponding to the processing units 10A to 10H, respectively. In the example of FIG. 12, in the item of "life setting number of sheets", life setting numbers of sheets NA to NH are displayed in vertical alignment corresponding to the processing units 10A to 10H, respectively.

[0171] Similarly, the life setting number of sheets greater than 0 means that the second start condition is adopted as the start condition for the processing unit 10. That is, the user sets the life setting number of sheets to a value greater than 0 using the input device 96, and thereby can set the second start condition for the corresponding processing unit 10.

[0172] In the example of FIG. 11, the regions of the respective life setting times TA to TH function as input elements M31 for inputting the life setting times. If the user operates (e.g., clicks) one of the input elements M31 using the input device 96, the life setting time corresponding to the one input element M31 can be input. If the user inputs the life setting time using the input device 96 in this state, the control section 90 sets the input time as the life setting time of the processing unit 10 corresponding to the one input element M31.

[0173] Figure 6 If the user inputs the life setting times for all the processing units 10, the control section 90 can set the life setting times for all the processing units 10.

[0174] If the user inputs the life setting times for all the processing units 10, the control section 90 can set the life setting times for all the processing units 10.

[0175] ​​In addition, the region showing the respective life setting numbers of sheets NA to NH functions as an input element M32 for inputting the life setting number of sheets. If the user operates (for example, clicks) one input element M32 using the input device 96, the life setting number of sheets corresponding to the one input element M32 can be input. If the user inputs the life setting number of sheets using the input device 96 in this state, the control section 90 sets the input number of sheets as the life setting number of sheets of the processing unit 10 corresponding to the one input element M32.

[0176] If the user inputs the life setting number of sheets for all the processing units 10, the control section 90 can set the life setting number of sheets for all the processing units 10.

[0177] When the life setting time and the life setting number of sheets are set, the user operates, for example, the input element M92 using the input device 96. The control section 90 stores, in response to the operation of the input element M92, the life information showing the life setting time and the life setting number of sheets corresponding to the processing unit 10 in the storage medium 92 as one of the setting information.

[0178] As described above, the life setting time and the life setting number of sheets can be set for each processing unit 10.

[0179] The control section 90 first reads the life information from the storage medium 92 when judging whether the start condition of the simulation processing is satisfied (step S2: Figure 4 ) or not.

[0180] In addition, when the life setting number of sheets NA of the processing unit 10A is greater than 0, the control section 90 measures the life number of sheets nA of the processing unit 10A and judges whether the life number of sheets nA is equal to or greater than the life setting number of sheets NA of the processing unit 10A. Then, when the life number of sheets nA is equal to or greater than the life setting number of sheets NA, the control section 90 judges that the start condition of the simulation processing of the processing unit 10A is satisfied. The same judgment is made for the processing units 10B to 10H.

[0181] As described above, since the first start condition and the second start condition can be set as start conditions, the availability of the substrate processing apparatus 100 can be improved. Furthermore, in the example described above, since a lifetime setting time and a lifetime setting number of sheets can be set for each processing unit 10, an appropriate lifetime setting time and a lifetime setting number of sheets can be set for the processing unit 10.

[0182] Furthermore, in the example above, the first start condition is set by setting the lifespan setting time to a value greater than 0, and the second start condition is set by setting the lifespan setting number of sheets to a value greater than 0. However, dedicated input elements for setting the start conditions can also be displayed in the first setting image. For example, input elements for inputting the first start condition and input elements for inputting the second start condition can also be displayed in the first setting image as start conditions.

[0183] <Display of lifespan and number of sheets>

[0184] exist Figure 6 In the example, the table for the first set image displays "Lifetime" and "Number of Lifetime Sheets" as its items. In the "Lifetime" item, the current lifetime and lifetime setting time are displayed for each processing unit 10. For example, corresponding to processing unit 10A, the lifetime tA and lifetime setting time TA are displayed side-by-side using " / ". The same applies to processing units 10B through 10H.

[0185] On the display 95, the current lifetime time and lifetime set time are displayed for each processing unit 10, so that the user can predict the time when to perform simulation processing for each processing unit 10.

[0186] Additionally, in the "Lifetime Count" section, the current lifetime count and lifetime set count are displayed for each processing unit 10. For example, corresponding to processing unit 10A, the lifetime count nA and lifetime set count NA are displayed side-by-side using " / ". The same applies to processing units 10B through 10H.

[0187] The display 95 shows the current number of lifetime frames and the set lifetime frame count, so the user can predict when to perform simulation processing for each processing unit 10.

[0188] <Simulation Process Procedure>

[0189] The contents of the simulation processing (hereinafter, referred to as a simulation processing procedure) can be different for each processing unit 10. For example, the simulation processing procedure for the processing unit 10 for FEOL can be different from the simulation processing procedure for the processing unit 10 for MEOL. The simulation processing procedure is information that specifies the steps in the simulation processing, for example, including information that specifies various conditions of the simulation processing such as the kind of the processing liquid ejected from the nozzle 13, the ejection time of the processing liquid, and the rotation speed of the substrate W.

[0190] If the simulation processing procedure is set for each processing unit 10, it is possible to set a suitable simulation processing procedure for each.

[0191] In addition, in the example described above, the indexer robot IR includes a plurality of (for example, two) hands H, and the central robot CR also includes a plurality of (for example, two) hands H. In the simulation substrate DW transport, either hand H can be used, but the hand H used for the simulation substrate DW transport can also be different depending on the processing category.

[0192] Specifically, in the case where the central robot CR uses one hand H in the simulation substrate DW transport for FEOL, the other hand H can be used in the simulation substrate DW transport for MEOL. Figure 9 is a diagram showing an example of the correspondence relationship between the hand H and the processing category. In Figure 9 In the example of, in the simulation substrate DW transport for FEOL, the upper hand H1 (refer to Figure 2 ) is used as one hand H, and in the simulation substrate DW transport for MEOL, the lower hand H2 (refer to Figure 2 ) is used as the other hand H.

[0193] Accordingly, even if the contamination generated in the simulation substrate DW spreads to the hand H in contact with the simulation substrate DW, the contamination of the hand H does not spread to the simulation substrate DW of a different processing category. This is because the hand H is not used for the simulation substrate DW transport of a different processing category. That is, it is possible to avoid the spread of contamination between the processing units 10 of different processing categories via the hand H.

[0194] In the case where the simulation substrate DW inside the container C is used, the indexer robot IR can also use different hands H in the simulation substrate DW transport depending on the processing category (also refer to Figure 9 ).

[0195] Hereinafter, a simulation flow procedure is introduced as a procedure including the simulation processing procedure and the substrate transport condition. The substrate transport condition includes information on which hand H is used in the simulation substrate DW transport.

[0196] The control section 90 can also set the simulation flow recipe based on the input of the user (step S15: Figure 5 ). That is, the input device 96 can also receive the input of the simulation flow recipe (simulation processing recipe and substrate carrying condition).

[0197] In the example of Fig. 10, in the table of the first setting image, as an item thereof, "simulation flow recipe" is displayed. The simulation flow recipe refers to a recipe that specifies a series of action steps in the substrate processing apparatus 100 at the time of performing the simulation processing, and includes the simulation processing recipe and the substrate carrying condition. In the example of Fig. 10, in the item of "simulation flow recipe", the simulation flow recipes FRA to FRH are displayed in vertical alignment one-to-one corresponding to the processing units 10A to 10H. Figure 6 Figure 6

[0198] The area that displays each of the simulation flow recipes FRA to FRH functions as an input element M4 for inputting the simulation flow recipe. If the user operates (for example, clicks) one input element M4 using the input device 96, the simulation flow recipe corresponding to the one input element M4 can be input. If the user inputs the simulation flow recipe using the input device 96 in this state, the control section 90 sets the input simulation flow recipe as the simulation flow recipe of the processing unit 10 corresponding to the one input element M4.

[0199] In addition, the simulation processing recipe included in the simulation flow recipe can be a processing recipe that specifies the processing steps of the substrate W, or can also be a processing recipe dedicated to the simulation processing.

[0200] The user inputs the simulation flow recipe for each of the processing units 10 using the input device 96, and thereby sets the hand H used in the carrying of the simulation substrate DW in accordance with the processing category. In other words, the user inputs the simulation flow recipe for each of the processing units 10, and thereby makes the hand H used in the carrying of the simulation substrate DW to the processing unit 10 for FEOL and the hand H used in the carrying of the simulation substrate DW to the processing unit 10 for MEOL different from each other.

[0201] In determining the setting of the simulation flow recipe, the user operates the input element M92 using the input device 96, for example. The control section 90 stores the flow recipe information indicating the simulation flow recipe corresponding to the processing unit 10 in the storage medium 92 as one of the setting information in response to the operation of the input element M92.

[0202] As described above, the simulation flow recipe can be set for each of the processing units 10.

[0203] ​​The control section 90 reads the flow recipe information from the storage medium 92 when the start condition of the simulation process is satisfied, and controls the substrate processing apparatus 100 based on the simulation flow recipe of the processing unit 10 for which the start condition of the simulation process is satisfied. Thus, the simulation substrate DW is carried by the hand H specified in the substrate carrying condition, and the simulation process specified in the simulation process recipe is performed in the processing unit 10. For example, when the start condition of the processing unit 10A is satisfied, the simulation substrate DW for FEOL is carried out of the container by the hand H for FEOL, and the simulation substrate DW is carried into the processing unit 10A, and the processing unit 10A performs the simulation process according to the simulation process recipe for FEOL. When the simulation process ends, the simulation substrate DW is returned to the original position in the original container by the hand H for FEOL.

[0204] According to this, the simulation process suitable for the processing unit 10A for FEOL can be performed. In addition, the simulation substrate DW for FEOL is carried by the hand H for FEOL, and thus the spread of contamination via the hand H between the processing units 10 belonging to different processing categories can be avoided.

[0205] <Simulation Process Number>

[0206] Sometimes, the maximum number of the processing contents (steps) that can be specified in the simulation flow recipe is determined in advance. In this case, the number of steps that exceeds the maximum number cannot be specified in the simulation flow recipe. Here, in order to perform the simulation process with the number of steps that exceeds the maximum number, the substrate processing apparatus 100 can perform the series of actions corresponding to the simulation flow recipe continuously plural times.

[0207] Figure 10 is a time chart showing an example of the simulation process sequence. In the example of Figure 10 , a time chart showing the simulation process sequence in the processing unit 10A is shown. The block shown by "→ 10A" shows the period during which the simulation substrate DW is carried from the container to the processing unit 10A, the block shown by "DP" shows the period during which the simulation process is performed in the processing unit 10A, and the block shown by "10A→" shows the period during which the simulation substrate DW is carried from the processing unit 10A to the container. These three periods in succession show the period during which the action OP is performed according to the simulation flow recipe of the processing unit 10A. In the example of Figure 10 , in the simulation process sequence of the processing unit 10A, the action OP is performed twice in succession. That is, the simulation process using two simulation substrates DW is performed in succession.

[0208] Thus, by performing the simulation process a plurality of times in succession, it is possible to perform the simulation process for a total number of steps exceeding the maximum value. For example, in a case where 200 steps are prescribed in the simulation flow procedure, by executing the simulation flow procedure three times, it is possible to execute 600 steps. Thus, it is possible to perform the necessary simulation process. More specifically, for example, it is possible to extend the total ejection time of the processing liquid, and thus it is possible to appropriately complete the cleaning process in the processing unit 10A.

[0209] As described above, the substrate processing apparatus 100 can perform a plurality of times a series of actions OP including the transfer of the simulation substrate DW to the processing unit 10, the simulation process in the processing unit 10, and the transfer of the simulation substrate DW to the container.

[0210] Thus, the control section 90 can set the number of consecutive actions OP (i.e., the number of processing sheets of the simulation substrate DW used in the simulation process) based on the input of the user (step S16: Figure 5 ). That is, the input device 96 can also receive the input of the number of processing sheets of the simulation substrate DW used in the simulation process (hereinafter, referred to as a processing sheet number setting value).

[0211] In the example of Figure 6 , in the table of the first setting image, as an item thereof, there is displayed a "processing sheet number setting value". In the example of Figure 6 , in the item of the "processing sheet number setting value", there are displayed the processing sheet number setting values MA to MH in vertical alignment corresponding to the processing unit 10A to the processing unit 10H, respectively.

[0212] Each of the areas indicated by the processing sheet number setting values MA to MH functions as an input element M5 for setting the processing sheet number setting value. If the user operates (e.g., clicks) one of the input elements M5 using the input device 96, it is possible to input the processing sheet number setting value corresponding to the one input element M5. If the user inputs the processing sheet number setting value using the input device 96 in this state, the control section 90 sets the input number as the processing sheet number setting value of the processing unit 10 corresponding to the one input element M5.

[0213] At the time of setting the processing sheet number setting value, the user operates the input element M92 using the input device 96, for example. The control section 90 stores the simulation process sheet number information indicating the processing sheet number setting value corresponding to the processing unit 10 in the storage medium 92 as one of the setting information in response to the operation of the input element M92.

[0214] As described above, it is possible to set the processing sheet number setting value for each of the processing units 10.

[0215] When the start conditions for simulation processing are met, the control unit 90 reads the process procedure information and the number of sheets to be processed from the storage medium 92. Then, based on the simulation process procedure of the processing unit 10 when the start conditions for simulation processing are met, the control unit 90 repeatedly executes the operation OP of the number of sheets to be processed a set number of times in the substrate processing apparatus 100. For example, when the start conditions for processing unit 10A are met, the substrate processing apparatus 100 repeatedly executes the simulation process procedure corresponding to processing unit 10A for the number of sheets to be processed set value MA a set number of times.

[0216] Furthermore, the substrate processing apparatus 100 can reuse the same simulation substrate DW only a certain number of times during the simulation processing step, or it can use different simulation substrate DWs in the same simulation processing step. For example, the case where the processing number setting MA corresponding to the processing unit 10A is 3 sheets will be described. In the simulation processing step, one simulation substrate DW used for FEOL can also be reused for 3 simulation processes. Alternatively, three different simulation substrate DWs with fewer uses can be used sequentially for simulation processing. When using different simulation substrate DWs, multiple simulation substrate DWs can be used more evenly.

[0217] As described above, the number of consecutive operation OPs (the number of sheets processed by the simulation substrate DW) is set for each processing unit 10, so that simulation processing can be performed with a number of steps suitable for the processing unit 10.

[0218] <Display of the number of simulated sheets>

[0219] exist Figure 6 In the example, the table in the first setting image displays "Number of Simulation Processing Sheets" as an item. The number of simulation processing sheets indicates the number of times the simulation processing is completed during the execution of the simulation processing step (i.e., the number of simulation substrate DW sheets processed in the simulation processing step). In the "Number of Simulation Processing Sheets" item, the current number of simulation processing sheets and the processing sheet set value are displayed for each processing unit 10. For example, corresponding to processing unit 10A, the number of simulation processing sheets mA and the processing sheet set value MA are displayed side-by-side using " / ". The same applies to processing units 10B to 10H.

[0220] The display 95 shows the current number of simulation sheets processed and the set value of the number of sheets processed, so that the user can predict when the simulation processing procedure will be completed in the processing unit 10.

[0221] <Execution time of simulation processing steps>

[0222] The substrate processing apparatus 100 sometimes performs substrate processing on a plurality of substrates W as one unit (hereinafter, referred to as a processing task) continuously. The number of substrates W in the processing task is, for example, equal to or less than the number of substrates W that can be accommodated in the cassette C, and is determined in advance. Here, as an example, the number of substrates W in the processing task is 25.

[0223] In the substrate processing of the processing task by the substrate processing apparatus 100, first, the control section 90 performs the scheduling described below. That is, the control section 90 performs scheduling that determines how each structure in the substrate processing apparatus 100 acts at what time in order to sequentially perform processing on the plurality of substrates W in the processing task. The control section 90 controls the substrate processing apparatus 100 according to the result of the scheduling, and thus the substrate processing apparatus 100 sequentially processes the plurality of substrates W in the processing task.

[0224] In this way, during the process in which the substrate processing apparatus 100 sequentially processes the substrates W in the processing task, the substrate processing apparatus 100 can not perform the simulation processing until the processing of the processing task ends, in the case where the start condition of the simulation processing is satisfied. That is, the substrate processing apparatus 100 can perform the simulation processing during the period between the processing performance period of the processing task and the processing performance period of the next processing task. If the simulation processing ends, the substrate processing apparatus 100 processes the substrates W of the next processing task.

[0225] Figure 11 is a timing chart that shows an example of substrate processing. In Figure 11 In the example of Figure 11 In the example of Figure 11 In the example of

[0226] In the example of Figure 11 In the execution of the processing of the processing task PJ1, the start condition of the simulation processing DP of the processing unit 10A is satisfied in the example of Figure 11 In the example of Figure 11As shown, the simulation processing DP will not be executed until the processing of processing task PJ1 in processing unit 10A is completed. The simulation processing DP is performed during the period between the end time of processing of the last substrate W in processing task PJ1 by processing unit 10A and the start time of processing of the first substrate W in the next processing task PJ2 by ​​processing unit 10A.

[0227] Therefore, there is no need to change the steps of substrate processing performed on substrate W in processing task PJ1, so there is no need to reschedule, thereby reducing the processing load of the control unit 90.

[0228] On the other hand, the substrate processing apparatus 100 can perform simulation processing during the execution of processing task PJ. Figure 12 This is a timing diagram illustrating an example of substrate processing. In Figure 12 In the example, during the execution of processing task PJ, the start condition of the simulation processing DP of processing unit 10A is met.

[0229] Upon the fulfillment of the start condition, the control unit 90 reschedules the remaining substrates W for processing task PJ. That is, in order to perform simulation processing in the processing unit 10A, the control unit 90 reschedules. Based on the result of this rescheduling, the control unit 90 operates the substrate processing apparatus 100, thereby achieving... Figure 12 As illustrated, during the operation of processing task PJ, processing unit 10A performs simulation processing DP. After simulation processing DP is completed, substrate W is sequentially moved back into processing unit 10A for further processing.

[0230] Therefore, based on the fulfillment of the start conditions for simulation processing, simulation processing DP can be performed more quickly without waiting for the processing of processing task PJ to finish.

[0231] Therefore, the control unit 90 can perform simulation processing between processing tasks PJ based on the user's input settings. Figure 11 ), or perform simulation processing between substrates W within the processing task PJ ( Figure 12 (Step S17: Refer to) Figure 5 In other words, input device 96 can receive the timing input for the simulation processing.

[0232] exist Figure 6 In the example, the first setup image displays the input element M6, which indicates the execution time of the simulation process. Figure 6 In the example, input element M6 includes input element M61 for input processing tasks PJ and input element M62 for input processing tasks PJ and substrates W within the substrates W as the execution time of the simulation processing.

[0233] If the user operates (e.g., clicks) the input element using the input device 96, the control section 90 sets the processing task PJ as the execution timing of the simulation processing in response to the operation. If the user operates (e.g., clicks) the input element M62 using the input device 96, the control section 90 sets the substrate W as the execution timing of the simulation processing in response to the operation.

[0234] In setting the execution timing of the simulation processing, the user operates the input element M92 using the input device 96, for example. The control section 90 stores the execution timing information indicating the execution timing of the simulation processing in the storage medium 92 as one of the setting information in response to the operation of the input element M92.

[0235] As described above, the execution timing of the simulation processing can be set.

[0236] The control section 90 reads the execution timing information from the storage medium 92 when the start condition of the simulation processing is satisfied, and causes the corresponding processing unit 10 to perform the simulation processing at the execution timing based on the execution timing information.

[0237] According to this, the usability of the substrate processing apparatus 100 can be improved.

[0238] <Automatic Start and End of Simulation Processing>

[0239] In the example described above, the control section 90 judges whether the start condition of the simulation processing is satisfied, and automatically performs the simulation processing based on the result of the judgment. Hereinafter, this action will be referred to as automatic simulation processing.

[0240] The input device 96 can receive the input of the start and end of the automatic simulation processing. In the example described above, the input element M71 and the input element M72 are displayed in the first setting image. The input element M71 is an input element for instructing the start of the automatic simulation processing, such as a button. The input element M72 is an input element for instructing the end of the automatic simulation processing, such as a button. Figure 6 If the user operates (e.g., clicks) the input element M71 using the input device 96, the control section 90 starts the automatic simulation processing in response to the operation. Thus, the simulation processing is automatically performed in the processing unit 10 in which the start condition of the simulation processing is satisfied.

[0241] If the user operates (e.g., clicks) the input element M72 using the input device 96, the control section 90 ends the automatic simulation processing in response to the operation.

[0242] <Check Processing>

[0243]

[0244] ​The control section 90 can perform a check process that judges whether the various setting information generated in the setting process (step S1) is appropriate. For example, the control section 90 performs the check process in response to an operation of the input element M92 by the user. Alternatively, the control section 90 can perform the check process in response to an operation of the input element M71 by the user.

[0245] Figure 13 FIG. 8 is a flowchart showing an example of the check process. First, the control section 90 judges whether the input element M92 or the input element M71 is operated (step S51). When it is judged that neither the input element M92 nor the input element M71 is operated, the control section 90 re-executes step S51.

[0246] When the input element M92 or the input element M71 is operated, the control section 90 performs a check judgment of whether the setting information is appropriate (step S52), and judges whether the check result is appropriate (step S53).

[0247] <Correspondence Information>

[0248] For example, the control section 90 checks whether the correspondence information showing the correspondence between the processing units 10 and the simulation substrates DW is appropriate, as whether the setting information is appropriate. More specifically, the control section 90 judges whether all types of processing categories (two types of "FEOL" and "MEOL" in this case) set to the plurality of processing units 10 are set to the plurality of simulation substrates DW. The control section 90 judges that the correspondence information is appropriate when all types of processing categories are set to the plurality of simulation substrates DW.

[0249] On the contrary, the control section 90 judges that the correspondence information is inappropriate when at least one processing category is not set to any of the plurality of simulation substrates DW. For example, when only one of "FEOL" and "MEOL" is set to all of the simulation substrates DW, the control section 90 judges that the correspondence information is inappropriate.

[0250] <Simulation Flow Recipe>

[0251] The control section 90 can also check, for example, whether the flow recipe information showing the simulation flow recipe is appropriate, as whether the setting information is appropriate. For example, in the substrate transfer conditions within the simulation flow recipe shown by the flow recipe information, information that a certain hand H is used in the transfer of the simulation substrate DW is specified. The control section 90 judges whether the hand H used in the transfer of the simulation substrate DW is classified by processing category. That is, it judges whether one hand H is set to the processing unit 10 for FEOL and another hand H is set to the processing unit 10 for MEOL.

[0252] When the hand H of a processing category different from the processing category of the processing unit 10 is specified in the flow recipe of the processing category, the control unit 90 determines that the flow recipe information is inappropriate. Specifically, when another hand H for MEOL is specified in any of the flow recipe information of the processing unit 10 for FEOL, the control unit 90 determines that the flow recipe information is inappropriate.

[0253] <Other>

[0254] The control unit 90 can also determine whether other setting information is appropriate. For example, the control unit 90 can determine that the setting information is inappropriate when no setting information for each setting information is input.

[0255] <Check Result>

[0256] When the above check result is appropriate, the control unit 90 stores the setting information in the storage medium 92 (step S54). Thus, the setting information is determined.

[0257] On the other hand, when the check result is inappropriate, the control unit 90 displays the check result on the display 95 of the user interface 94 (step S55). That is, when the check result is inappropriate, the setting information is not determined, and the user interface 94 notifies the user of the check result and prompts re-input. If the user recognizes the check result, the user uses the input device 96 to perform input for re-setting the setting information.

[0258] Thus, appropriate setting information can be stored in the storage medium 92. In other words, erroneous setting can be suppressed.

[0259] <Processing Category>

[0260] In the above example, "FEOL" and "MEOL" are used as the processing categories of the simulation substrate DW. Here, further, "FREE" is also used as the processing category of the simulation substrate DW. "FREE" is a category indicating that the simulation substrate DW can be used for any processing unit 10. That is, "FREE" is a category indicating that the simulation substrate DW can be used for both the processing unit 10 for FEOL and the processing unit 10 for MEOL.

[0261] Figure 14 is a drawing showing an example of a second setting image for setting the processing category of the simulation substrate DW. In the above example, the processing category of the simulation substrate DW is set by selecting one of the processing categories of the processing units 10. Figure 14In the example of FIG. 9, in the item of "processing category", "FEOL", "MEOL", and "FREE" are displayed in a horizontal row corresponding to each slot. The areas in which "FREE" is displayed function as input elements M15 for inputting "FREE" as the processing category. The input elements M15 are, for example, buttons. If the user operates (for example, clicks) one of the input elements M15 using the input device 96, the control unit 90 sets the processing category of the dummy wafer DW corresponding to the one input element M15 to "FREE" in response to the operation.

[0262] According to this, the usability of the substrate processing apparatus 100 can be improved.

[0263] <Initialization of the correspondence information>

[0264] If the dummy wafer DW is repeatedly used, contaminants gradually accumulate on the dummy wafer DW, and thus the dummy wafer DW is sometimes replaced.

[0265] Here, as an example, a case in which the dummy wafer DW held in the cassette C held in the load port LP is used for simulation processing is described. For example, in a case in which the substrate processing apparatus 100 does not have a dummy wafer holder BF, or in a case in which the load port LP is set as the holder used for simulation processing, the dummy wafer DW held in the cassette C is used for simulation processing.

[0266] The cassette C holding the dummy wafer DW is carried into the load port LP by an external carrying device (not shown) of the substrate processing apparatus 100, and is carried out of the load port LP to the outside of the substrate processing apparatus 100. The external carrying device, for example, carries the cassette C holding the used dummy wafer DW out of the load port LP and carries another cassette C holding another dummy wafer DW into the load port LP in a case in which the dummy wafer DW is replaced.

[0267] The dummy wafer DW held in the other cassette C is different from the dummy wafer DW held in the original cassette C, and thus the setting of the processing category of the previous processing can not necessarily be directly applied.

[0268] Accordingly, the control unit 90 can initialize the correspondence information when the dummy wafer DW is carried out of the substrate processing apparatus 100 to the outside, and as a more specific example, initialize the correspondence information when the cassette C holding the dummy wafer DW is carried out of the load port LP.

[0269] Figure 15is a flowchart showing initialization processing of the correspondence information. The control section 90 judges whether or not the dummy substrate DW is carried out from the substrate processing apparatus 100, specifically, whether or not the container C housing the dummy substrate DW is carried out from the load port LP (step S61). For example, the control section 90 can make this judgment based on information from a control device that controls the external carrier.

[0270] When the container C is not carried out from the load port LP, the control section 90 re-executes step S61.

[0271] When the container C is carried out from the load port LP to the outside, the control section 90 initializes the correspondence information (step S62). For example, the control section 90 initializes the dummy substrate setting information showing the correspondence between the dummy substrate DW and the processing category. As a more specific example, the control section 90 deletes the dummy substrate setting information stored in the storage medium 92.

[0272] When the container C housing the new dummy substrate DW is carried into the load port LP, the user inputs the processing category of the dummy substrate DW in the container C through the input device 96. The control section 90 sets the processing category of the dummy substrate DW according to this input. In this way, the user can appropriately re-set the dummy substrate DW according to the new dummy substrate DW.

[0273] As described above, the correspondence information is initialized in response to the carrying to the outside of the dummy substrate DW, so it is possible to avoid the dummy processing using the previous correspondence information.

[0274] < Dummy Processing >

[0275] In the above example, the cleaning processing in the processing unit 10 is adopted as the dummy processing, but it is not necessarily limited to this. In any case, it is possible to adopt any processing that ejects the processing liquid from the nozzle 13 toward the dummy substrate DW as the dummy processing.

[0276] For example, in order to adjust the processing environment of the processing unit 10, it is also possible to perform the dummy processing. Specifically, sometimes the processing unit 10 supplies the substrate W with a processing liquid at a high temperature. If the temperature of the processing liquid is lower than a prescribed temperature, the processing of the substrate W is not sufficient, so the temperature management of the processing liquid is important. If the processing unit 10 does not process the substrate W for a long time after the processing of the substrate W is completed, the temperature in the processing unit 10 decreases. If the processing unit 10 supplies the substrate W with a processing liquid at a high temperature in this state, the heat of the processing liquid is taken away by the surroundings, so there is a concern that the substrate W is supplied with a processing liquid at a low temperature.

[0277] Therefore, when the life time is equal to or longer than the life time set time, the high-temperature processing liquid can be ejected from the nozzle 13 toward the dummy substrate DW as dummy processing in the processing unit 10. That is, the processing unit 10 supplies the dummy substrate DW with the same processing liquid as that supplied to the substrate W. Thus, the temperature in the processing unit 10 can be raised to the predetermined temperature, and the processing environment can be adjusted.

[0278] Further, if the life time becomes longer, the processing liquid adhering to the inner circumferential surface of the cup 14 flows downward or evaporates, and the inner circumferential surface of the cup 14 is in a state of being dried. If the processing liquid scattered from the substrate W collides with the inner circumferential surface in a state where the processing liquid does not adhere to the inner circumferential surface of the cup 14, the processing liquid is greatly splashed back. Thus, there is a concern that particles adhere to the substrate W. Therefore, when the life time is equal to or longer than the life time set time, the processing liquid is supplied to the dummy substrate DW as dummy processing in the processing unit 10. The processing liquid can be the same processing liquid as that supplied to the substrate W, and for example, can be a cleaning liquid. In the dummy processing, the inner circumferential surface of the cup 14 receives the processing liquid, and thus the inner circumferential surface of the cup 14 is wetted. Thus, the processing environment can be adjusted. Therefore, in the processing performed immediately after the substrate W, the processing liquid can be suppressed from being splashed back from the cup 14. Thus, particles can be suppressed from adhering to the substrate W.

[0279] As described above, the substrate processing method and the substrate processing apparatus 100 have been explained in detail, but the above explanation is merely an example, and the substrate processing apparatus 100 is not limited thereto. It should be understood that numerous modifications not illustrated can be conceived without departing from the scope of the present disclosure. The structures explained in each of the embodiments and each of the modifications can be appropriately combined or omitted as long as they do not contradict each other.

[0280] For example, "FEOL" and "MEOL" are used as the processing category. However, in the case where the processing unit 10 for a later process of the manufacturing process (so-called Back End Of Line (BEOL)) is provided, "BEOL" can also be used as the processing category.

[0281] Further, as the processing category, it is not necessarily required to use a category indicating a processing stage dividing the manufacturing process of the semiconductor device. In any case, in the case where different contaminations are generated in different processing units 10, a category distinguishing the processing units 10 can be used as the processing category. As a specific example, in the processing units 10 supplying different kinds of processing liquids, different contaminations can be generated, and thus a category distinguishing the kinds of the processing liquids that can be supplied can be used as the processing category. Alternatively, in the case where substrates having different kinds of film structures are carried into the processing units 10, different contaminations can be generated, and thus a category distinguishing the kinds of the film structures of the carried-in substrates can be used as the processing category.

Claims

1. A substrate processing apparatus, wherein, Possessing: an input device; a plurality of processing units; a conveyance section that conveys a simulation board between a container that contains a plurality of simulation boards and each of a plurality of the processing units; and a control section that, based on an input to the input device, creates setting information indicating a usable simulation board among a plurality of the simulation boards for each of a plurality of the processing units, specifies a first simulation board that is usable in a first processing unit among a plurality of the processing units based on the setting information, causes the conveyance section to convey the first simulation board from the container to the first processing unit, and causes the first processing unit to perform a simulation process on the first simulation board, the control section sets a processing category for each of a plurality of the processing units based on an input to the input device, the control section sets a processing category for each of a plurality of the simulation boards based on an input to the input device, the control section specifies a simulation board belonging to the same processing category as a processing category set for the first processing unit as the first simulation board, the processing category includes a plurality of categories indicating different processing stages among a plurality of processing stages that divide a manufacturing process of a semiconductor device.

2. The substrate processing apparatus according to claim 1, wherein the processing category for a plurality of the simulation boards includes a category indicating that it is usable for any one of a plurality of the processing units.

3. The substrate processing apparatus according to claim 1 or 2, wherein the control section sets, based on an input to the input device, a hand included in the conveyance section for conveyance of the first simulation board among a plurality of hands according to the processing category.

4. The substrate processing apparatus according to claim 1 or 2, wherein the control section sets two or more simulation boards among a plurality of the simulation boards as usable for the first processing unit, and specifies a simulation board that is used the least number of times among the two or more simulation boards as the first simulation board.

5. The substrate processing apparatus according to claim 1 or 2, wherein the control section sets, based on an input to the input device, which one of a plurality of the simulation boards housed in a first container that is portable and is loaded on a conveyance-in section of the substrate processing apparatus and a second container that is fixedly provided in the substrate processing apparatus.

6. The substrate processing apparatus according to claim 1 or 2, wherein the control section sets, based on an input to the input device, at least one of a first start condition and a second start condition as a start condition for each of a plurality of the processing units, the first start condition indicating that a life time during which each of a plurality of the processing units does not continue a process on a board is equal to or more than a life setting time, and the second start condition indicating that a number of processes on a board in each of a plurality of the processing units is equal to or more than a life setting number.

7. The substrate processing apparatus according to claim 6, wherein the control section sets at least one of the life setting time and the life setting number based on an input to the input device.

8. The substrate processing apparatus according to claim 1 or 2, wherein the control section sets, based on an input to the input device, a number of processes of a simulation substrate used in the simulation processing for each of the plurality of processing units, in the simulation processing, the carrying section carries the first simulation substrate of the set number of processes into the first processing unit one by one, and the first processing unit performs the simulation processing on the first simulation substrates carried in one by one, respectively.

9. The substrate processing apparatus according to claim 1 or 2, wherein the control section causes the plurality of processing units to perform processing on a plurality of substrates decided in advance as one unit of a processing task one by one for each of the substrates, the control section sets, based on an input to the input device, whether the simulation processing is performed during execution of processing of the processing task and execution of processing of a next processing task or the simulation processing is performed within the execution of processing of the processing task.

10. The substrate processing apparatus according to claim 1 or 2, wherein the control section performs, in response to an input to the input device, a check processing that checks whether the set information is appropriate.

11. The substrate processing apparatus according to claim 1 or 2, wherein the control section performs, in response to an input to the input device, a check processing that checks whether all types of the processing category set in the plurality of processing units are set for the plurality of simulation substrates.

12. The substrate processing apparatus according to claim 1 or 2, wherein in the simulation processing, the first processing unit supplies a cleaning liquid to the first simulation substrate.

13. The substrate processing apparatus according to claim 1 or 2, wherein in the simulation processing, the first processing unit supplies a processing liquid identical to a processing liquid supplied to a substrate by the first processing unit to the first simulation substrate.

14. The substrate processing apparatus according to claim 1 or 2, wherein the control section initializes the set information when the plurality of simulation substrates are carried out to the outside of the substrate processing apparatus.

15. A substrate processing method, wherein, provided with: a setting step of setting, based on an input of a user, a simulation substrate that can be used among a plurality of simulation substrates housed in a housing from among a plurality of processing units provided in a substrate processing apparatus, generating set information indicating a simulation substrate that can be used in each of the plurality of processing units, a simulation substrate specifying step of specifying, based on the set information, a first simulation substrate that can be used in a first processing unit among the plurality of processing units from among the plurality of simulation substrates, and a simulation processing step of carrying, by a carrying section provided in the substrate processing apparatus, the first simulation substrate from the housing to the first processing unit, and performing, by the first processing unit, simulation processing on the first simulation substrate; the setting step includes: a step of setting, based on an input of a user, a processing category for each of the plurality of processing units, and a step of setting, based on an input of a user, a processing category for each of the plurality of simulation substrates. ​ In the simulation substrate specific process, a simulation substrate belonging to the same processing category as the processing category of the first processing unit is specified as the first simulation substrate. The processing category includes a plurality of categories indicating different processing stages among a plurality of processing stages that divide the manufacturing process of the semiconductor device.

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