Vibration element manufacturing method, vibration element, and vibration device

Abstract

Provided are a manufacturing method of a vibration element, a vibration element, and a vibration device, capable of suppressing reduction in driving characteristics and reliability. The manufacturing method of the vibration element includes: a preparation step of preparing a vibration element having a base portion, a vibration arm, and a weight application film, the vibration arm having an arm portion extending from the base portion and a weight application portion on a distal end side of the arm portion, the weight application portion having a first main surface and a second main surface in a front-rear relationship, the weight application film being disposed on the first main surface of the weight application portion, the first main surface having a first plane, a second plane, and an inclined plane, the second plane being on the second main surface side than the first plane, being parallel to the first plane, the inclined plane connecting the first plane and the second plane, an angle between the inclined plane and the first plane being 100° or less; and a removal step of removing a portion of the weight application film by irradiating an energy ray in a normal direction of the first plane.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a vibration element, a vibration element, and a vibration device. Background Art

[0002] Patent document 1 discloses a vibration element comprising: a base; a vibration arm extending from the base and having an arm portion and a weight portion; and a weight film formed on the weight portion. In addition, the upper surface of the weight portion is convex and has a first flat surface, a second flat surface located on both sides of the first flat surface and located on the lower surface side of the first flat surface, and an inclined surface connecting the first flat surface and the second flat surface. Furthermore, a weight film is formed over these first flat surfaces, second flat surfaces, and inclined surfaces. In such a vibration element, the frequency of the vibration element can be adjusted by irradiating the weight film with a laser to remove a portion of the weight film.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-128211

[0004] However, in the resonator element described in Patent Document 1, if laser light is irradiated onto the weight film on the inclined surface, the laser light will be reflected obliquely depending on the inclination angle of the inclined surface. This reflected laser light may irradiate unintended areas, causing unintended processing of the irradiated areas. For example, if the reflected laser light irradiates the weight film or wiring on an adjacent resonator arm and processes these areas, there is a problem of deteriorating the frequency accuracy and reliability of the resonator element. Summary of the Invention

[0005] The manufacturing method of the vibration element of the present invention includes: a preparation step of preparing a vibration element, the vibration element having a base, a vibration arm and a weighting film, the vibration arm having an arm extending from the base and a weighting part located on the end side of the arm, the weighting part having a first main surface and a second main surface in a positive and negative relationship, the weighting film being arranged on the first main surface of the weighting part, the first main surface having a first plane, a second plane and an inclined surface, the second plane being closer to the second main surface side than the first plane and parallel to the first plane, the inclined surface connecting the first plane and the second plane, and the angle formed by the inclined surface and the first plane being less than 100°; and a removal step of irradiating the weighting film with energy lines from the normal direction of the first plane to remove a portion of the weighting film.

[0006] The vibration element of the present invention comprises: a base; a vibration arm, which has an arm extending from the base and a weight-applying portion located on the end side of the arm, the weight-applying portion having a first main surface and a second main surface in a positive and negative relationship; and a weight-applying film, which is arranged on the first main surface of the weight-applying portion, the first main surface having a first plane, a second plane and an inclined surface, the second plane is closer to the second main surface side than the first plane and is parallel to the first plane, the inclined surface connects the first plane and the second plane, and the angle formed by the inclined surface and the first plane is less than 100°, and a processing mark is formed on the weight-applying film in which a portion is removed and recessed in the thickness direction of the vibration arm.

[0007] A vibration device according to the present invention includes the above-mentioned vibration element and a package that houses the vibration element. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a cross-sectional view showing the vibration device according to the first embodiment of the present invention.

[0009] Figure 2 Yes Figure 1 A top view of a vibration element included in a vibration device.

[0010] Figure 3 yes Figure 2 AA line section view in.

[0011] Figure 4 yes Figure 2 BB line section view in.

[0012] Figure 5 Schematic diagram showing the driving vibration mode of the vibration element.

[0013] Figure 6 Schematic diagram showing the detection vibration mode of the vibration element.

[0014] Figure 7 It is a cross-sectional view showing a weight portion included in the driving arm.

[0015] Figure 8 Yes Figure 7 A cross-sectional view of a modified example of the weight portion shown.

[0016] Figure 9 Yes Figure 7 A cross-sectional view of a modified example of the weight portion shown.

[0017] Figure 10 It is a diagram showing the manufacturing process of the vibration device.

[0018] Figure 11 This is a top view showing a vibration element formed on a quartz wafer.

[0019] Figure 12 is a sectional view showing a vibration element of a second embodiment of the present application.

[0020] KEY

[0021] 1: vibration element; 2: vibration piece; 3: weight film; 4: electrode film; 6: package; 7: circuit element; 8: support substrate; 10: quartz crystal piece; 10A: link beam; 10B: frame; 21: base; 22, 23: detection arm; 24, 25: link arm; 26, 27, 28, 29: drive arm; 30: processing mark; 32, 33, 36, 37, 38, 39: weight film; 41: drive signal electrode; 42: drive ground electrode; 43: first detection signal electrode; 44: first detection ground electrode; 45: second detection signal electrode; 46: second detection ground electrode; 61: base; 62: cover; 63: joint member; 81: substrate; 82: lead wire; 100: vibration device; 220, 230, 260, 270, 280, 290: groove; 221, 231, 261, 271, 281, 291: arm portion; 222, 232, 262, 272, 282, 292: weight portion; 263: upper surface; 264: lower surface; 265: thick wall portion; 266, 267: thin wall portion; 268, 269: inclined portion; 611, 611a, 611b, 611c: recess; C: center; CP: center plane; F0: plane; F1, F11, F12: first plane; F2, F21, F22: second plane; F3: inclined plane; F31: first inclined plane; F32: second inclined plane; G0, G1, G2: center of gravity; J: optical axis; L, L', L": laser light; S: internal space; a, b, c: arrow; ωz: angular velocity; θ: angle. DETAILED DESCRIPTION

[0022] Hereinafter, the manufacturing method of the vibration element, the vibration element, and the vibration device of the present application will be described in detail based on the embodiments shown in the drawings.

[0023] <First Embodiment>

[0024] Figure 1 is a sectional view showing a vibration device of a first embodiment of the present application. Figure 2 is a plan view showing a vibration element possessed by the vibration device of Figure 1 Figure 3 is an A-A line sectional view in Figure 2 Figure 4 is a B-B line sectional view in Figure 2 Figure 5 is a schematic view showing a drive vibration mode of the vibration element. Figure 6 ​​​Schematic diagram showing the detection vibration mode of the vibration element. Figure 7 It is a cross-sectional view showing a weight portion included in the driving arm. Figure 8 and Figure 9 They are respectively Figure 7 A cross-sectional view of a modified example of the weight portion shown. Figure 10 It is a diagram showing the manufacturing process of the vibration device. Figure 11 This is a top view showing a vibration element formed on a quartz wafer.

[0025] It should be noted that, for the sake of convenience, Figure 10 In the figures other than the figure, three mutually orthogonal axes, namely the X-axis, the Y-axis and the Z-axis, are shown. In addition, the direction along the X-axis is also referred to as the "X-axis direction", the direction along the Y-axis is also referred to as the "Y-axis direction", and the direction along the Z-axis is also referred to as the "Z-axis direction". In addition, the arrow side of each axis is also referred to as the positive side, and the opposite side is also referred to as the negative side. In addition, the positive side of the Z-axis is also referred to as "up", and the negative side is also referred to as "down". In addition, when viewed from above in the Z-axis direction, it is also referred to as "viewed from above". In addition, as described later, the X-axis, Y-axis and Z-axis are also equivalent to the crystal axes of quartz.

[0026] In addition, the term "parallel" as used in this specification includes not only cases where the surfaces or lines are parallel to each other but also cases where they deviate slightly from parallel within a range that can be considered parallel based on common technical knowledge. Similarly, the term "orthogonal" includes not only cases where the surfaces or lines are orthogonal to each other but also cases where they deviate slightly from orthogonal within a range that can be considered orthogonal based on common technical knowledge.

[0027] Figure 1 The illustrated vibration device 100 is a physical quantity sensor that detects angular velocity ωz about the Z-axis. By using the vibration device 100 as a physical quantity sensor, it can be widely installed in various electronic devices, mobile devices, and the like, resulting in a highly convenient vibration device 100 that is in high demand. The vibration device 100 includes a package 6, a circuit element 7 housed in the package 6, a support substrate 8, and a vibration element 1.

[0028] The package 6 includes a base 61 having a recessed portion 611 opening in its upper surface, and a cover 62 that blocks the opening of the recessed portion 611 and is bonded to the upper surface of the base 61 via a bonding member 63. An internal space S is formed within the package 6, and the circuit element 7, the support substrate 8, and the vibration element 1 are housed in the internal space S. The internal space S is airtight and is in a reduced pressure state, preferably a state closer to a vacuum. However, the atmosphere in the internal space S is not particularly limited and may be, for example, atmospheric pressure or a pressurized state.

[0029] Furthermore, recess 611 is composed of a plurality of recesses, including recess 611a, which opens on the top surface of base 61; recess 611b, which opens on the bottom surface of recess 611a and has a smaller opening width than recess 611a; and recess 611c, which opens on the bottom surface of recess 611b and has a smaller opening width than recess 611b. Furthermore, support substrate 8 is fixed to the bottom surface of recess 611a, supporting vibration element 1, and circuit element 7 is fixed to the bottom surface of recess 611c.

[0030] The circuit element 7 includes a drive circuit for driving the vibration element 1 and a detection circuit for detecting the angular velocity ωz applied to the vibration element 1 based on the signal output from the vibration element 1. The support substrate 8 is a substrate for mounting the vibration element 1 on the base 61. The support substrate 8 includes a frame-shaped substrate 81 and a plurality of leads 82 provided on the substrate 81. The substrate 81 is fixed to the bottom surface of the recess 611a. In addition, the vibration element 1 is fixed to the end of each lead 82, and the vibration element 1 is electrically connected to the circuit element 7 via each lead 82 and internal wiring formed on the base 61 (not shown).

[0031] The vibration element 1 is an angular velocity detection element that detects the angular velocity ωz. Figure 2 As shown, the vibration element 1 includes a vibration piece 2 , an electrode film 4 disposed on the vibration piece 2 , and a weight film 3 disposed on the electrode film 4 .

[0032] The vibration plate 2 is composed of a Z-cut quartz substrate. The Z-cut quartz substrate has an area on the XY plane defined by the X-axis as the electrical axis and the Y-axis as the mechanical axis of the crystal axis of the quartz, and has a thickness in the direction along the Z-axis as the optical axis. However, the vibration plate 2 can also be composed of a piezoelectric material other than quartz. Examples of piezoelectric materials other than quartz include lithium tantalate, lithium niobate, lithium borate, and barium titanate. In addition, depending on the structure of the vibration plate 2, the vibration plate 2 can also be composed of a quartz plate with a cutting angle other than Z-cut. In addition, the vibration plate 2 can also be composed of a material that does not have piezoelectricity, such as silicon. In this case, it is sufficient to arrange piezoelectric elements that expand and contract due to the passage of electricity on each arm described later.

[0033] The vibrating element 2 includes a base 21 located in the center of the element; a pair of detection arms 22 and 23 extending from the base 21 in the Y-axis direction; a pair of connecting arms 24 and 25 extending from the base 21 in the X-axis direction; a pair of driving arms 26 and 27 extending from the distal end of the connecting arm 24 in the Y-axis direction; and a pair of driving arms 28 and 29 extending from the distal end of the connecting arm 25 in the Y-axis direction. In this embodiment, the driving arms 26, 27, 28, and 29 correspond to the vibrating arms of the present invention.

[0034] The detection arm 22 includes an arm portion 221 extending from the base 21 toward the positive side in the Y-axis direction; a weight portion 222 located at the distal end of the arm portion 221 and having a greater width in the X-axis direction than the arm portion 221; and a pair of grooves 220 formed in the upper and lower surfaces of the arm portion 221. Similarly, the detection arm 23 includes an arm portion 231 extending from the base 21 toward the negative side in the Y-axis direction; a weight portion 232 located at the distal end of the arm portion 231 and having a greater width in the X-axis direction than the arm portion 231; and a pair of grooves 230 formed in the upper and lower surfaces of the arm portion 231. These detection arms 22 and 23 are formed symmetrically with respect to the base 21. The drive arm 26 includes an arm portion 261 extending from the distal end of the connecting arm 24 toward the positive side in the Y-axis direction; a weight portion 262 located at the distal end of the arm portion 261 and having a greater width in the X-axis direction than the arm portion 261; and a pair of grooves 260 formed in the upper and lower surfaces of the arm portion 261. Similarly, the drive arm 27 includes an arm portion 271 extending from the distal end of the connecting arm 24 toward the negative side in the Y-axis direction; a weight portion 272 located at the distal end of the arm portion 271 and having a greater width in the X-axis direction than the arm portion 271; and a pair of grooves 270 formed in the upper and lower surfaces of the arm portion 271. These drive arms 26 and 27 are formed symmetrically with respect to the connecting arm 24.

[0035] The drive arm 28 includes an arm portion 281 extending from the distal end of the connecting arm 25 toward the positive side in the Y-axis direction; a weight portion 282 located at the distal end of the arm portion 281 and having a greater width in the X-axis direction than the arm portion 281; and a pair of grooves 280 formed on the upper and lower surfaces of the arm portion 281. Similarly, the drive arm 29 includes an arm portion 291 extending from the distal end of the connecting arm 25 toward the negative side in the Y-axis direction; a weight portion 292 located at the distal end of the arm portion 291 and having a greater width in the X-axis direction than the arm portion 291; and a pair of grooves 290 formed on the upper and lower surfaces of the arm portion 291. These drive arms 28 and 29 are formed symmetrically with respect to the connecting arm 25.

[0036] In addition, if Figure 3 as well as Figure 4 As shown, the electrode film 4 formed on the surface of the vibrating element 2 includes a driving signal electrode 41 , a driving ground electrode 42 , a first detection signal electrode 43 , a first detection ground electrode 44 , a second detection signal electrode 45 , and a second detection ground electrode 46 .

[0037] The drive signal electrodes 41 are arranged on both side surfaces of the arms 261 and 271 and on the upper and lower surfaces of the arms 281 and 291. Meanwhile, the drive ground electrodes 42 are arranged on the upper and lower surfaces of the arms 261 and 271 and on both side surfaces of the arms 281 and 291. Furthermore, the first detection signal electrodes 43 are arranged on the upper and lower surfaces of the arm 221, and the first detection ground electrodes 44 are arranged on both side surfaces of the arm 221. Meanwhile, the second detection signal electrodes 45 are arranged on the upper and lower surfaces of the arm 231, and the second detection ground electrodes 46 are arranged on both side surfaces of the arm 231. Although not shown, these electrodes 41 to 46 are each routed to the lower surface of the base 21 and electrically connected to corresponding leads among the plurality of leads 82.

[0038] The electrode film 4 is also disposed on the weight portions 222, 232, 262, 272, 282, and 292. Furthermore, in the weight portion 222, the electrode film 4 disposed therein electrically connects the first detection ground electrodes 44 disposed on both side surfaces of the arm portion 221. Similarly, in the weight portion 232, the electrode film 4 disposed therein electrically connects the second detection ground electrodes 46 disposed on both side surfaces of the arm portion 231. Furthermore, in the weight portion 262, the electrode film 4 disposed therein electrically connects the drive signal electrodes 41 disposed on both side surfaces of the arm portion 261. Similarly, in the weight portion 272, the electrode film 4 disposed therein electrically connects the drive signal electrodes 41 disposed on both side surfaces of the arm portion 271. In addition, in the weight-applying portion 282, the driving ground electrodes 42 arranged on the two side surfaces of the arm portion 281 are electrically connected to each other using the electrode film 4 arranged in this portion. Similarly, in the weight-applying portion 292, the driving ground electrodes 42 arranged on the two side surfaces of the arm portion 291 are electrically connected to each other using the electrode film 4 arranged in this portion.

[0039] The vibration element 1 of this structure detects the angular velocity ωz in the following manner. First, when a driving signal is applied between the driving signal electrode 41 and the driving ground electrode 42, the driving arms 26 to 29 are moved as follows. Figure 5 As shown by the arrow a in the figure, the vibration element 1 is subjected to bending vibration along the XY plane in the X-axis direction. Hereinafter, this driving mode is referred to as the driving vibration mode. Furthermore, when the angular velocity ωz is applied to the vibration element 1 in the driving vibration mode, a new excitation is generated. Figure 6 In the detection vibration mode, the Coriolis force in the Y-axis direction, which is perpendicular to the X-axis (vibration direction) and the Z-axis (input axis), acts on the drive arms 26 to 29, exciting vibrations in the direction indicated by arrow b. In response to this vibration, the detection arms 22 and 23 generate detection vibrations as bending vibrations in the direction indicated by arrow c.

[0040] Moreover, the charge generated in the detection arm 22 by detecting the vibration mode can be taken out as a first detection signal from between the first detection signal electrode 43 and the first detection ground electrode 44, and the charge generated in the detection arm 23 can be taken out as a second detection signal from between the second detection signal electrode 45 and the second detection ground electrode 46, and the angular velocity ωz can be detected based on these first and second detection signals.

[0041] like Figure 2 As shown, weight films 3 are disposed on the upper surfaces of weight portions 222, 232, 262, 272, 282, and 292. The weight films 3 on weight portions 262, 272, 282, and 292 are weights used to adjust the resonant frequency of the drive vibration mode (the resonant frequency of each drive arm 26 to 29) and the vibration balance, while the weight films 3 on weight portions 222 and 232 are weights used to adjust the resonant frequency of the detection vibration mode (the resonant frequency of each detection arm 22 and 23) and the vibration balance.

[0042] Next, the structures of the weight portions 262, 272, 282, and 292 will be described in detail. However, since the weight portions 262, 272, 282, and 292 have the same structure, for ease of explanation, the weight portion 262 will be described as a representative, and the structures of the other weight portions 272, 282, and 292 will be omitted.

[0043] like Figure 7 As shown, the weight portion 262 has an upper surface 263 serving as a first principal surface and a lower surface 264 serving as a second principal surface, which are disposed opposite each other in the Z-axis direction, which is the thickness direction of the drive arm 26. Furthermore, the weight portion 262 has a thick portion 265 located on an extension of the arm portion 261 in a plan view and having the same thickness as the arm portion 261; a pair of thin portions 266 and 267 located on either side of the thick portion 265 in the width direction, i.e., the X-axis direction, and having a thickness thinner than the thick portion 265; an inclined portion 268 located between the thick portion 265 and the thin portion 266, having a thickness decreasing from the thick portion 265 side toward the thin portion 266 side; and an inclined portion 269 located between the thick portion 265 and the thin portion 267, having a thickness decreasing from the thick portion 265 side toward the thin portion 267 side.

[0044] In addition, the thin-walled portions 266 and 267 are arranged offset toward the lower surface 264. Furthermore, on the lower surface 264 side, the thick-walled portion 265, the thin-walled portions 266 and 267, and the inclined portions 268 and 269 are continuously connected without steps. Therefore, the lower surface 264 of the weight portion 262 is formed by a flat surface formed by the XY plane. In contrast, on the upper surface 263 side, a step formed by the inclined portions 268 and 269 is formed between the thick-walled portion 265 and the thin-walled portions 266 and 267. Therefore, the upper surface 263 of the weight portion 262 has a convex shape. Thus, since the thin-walled portions 266 and 267 are offset toward the lower surface 264, the center of gravity G1 of the weight portion 262 is located on the lower surface 264 side relative to the XY plane, i.e., the center plane CP, which intersects with the center C of the drive arm 26 in the thickness direction.

[0045] The convex upper surface 263 includes a plane F0 formed by the XY plane and an inclined surface F3 inclined relative to plane F0. Furthermore, plane F0 includes a first plane F1 that is coplanar with the upper surface of the diaphragm 2 and a pair of second planes F21 and F22 located on either side of first plane F1 in the X-axis direction and closer to the lower surface 264 than first plane F1. First plane F1 is formed by the upper surface of the thick-walled portion 265, second plane F21 is formed by the upper surface of the thin-walled portion 266, and second plane F22 is formed by the upper surface of the thin-walled portion 267. These first plane F1 and second planes F21 and F22 are parallel to each other and formed by the XY plane that is orthogonal to the Z-axis direction, which is the thickness direction of the diaphragm 2. It should be noted that, for convenience, the second planes F21 and F22 will be collectively referred to as the second plane F2.

[0046] The inclined surface F3 includes a first inclined surface F31 located between and connecting the first plane F1 and the second plane F21, and a second inclined surface F32 located between and connecting the first plane F1 and the second plane F22. The first inclined surface F31 is formed by the upper surface of the inclined portion 268, and the second inclined surface F32 is formed by the upper surface of the inclined portion 269. The first inclined surface F31 and the second inclined surface F32 are each formed by a plane obtained by rotating the XY plane about the Y axis.

[0047] As will be explained later in the manufacturing method of the resonator device 100, the outer shape of the resonator element 2 is formed by dry etching a quartz wafer that has been pre-polished to the thickness of the resonator element 2, specifically patterning it by deep groove etching using the Bosch process. This patterning also forms the convex shape of the upper surface 263. Therefore, on the upper surface 263, the first flat surface F1 is formed by a polished surface, while the other surfaces, namely the second flat surfaces F21 and F22 and the first and second inclined surfaces F31 and F32, are formed by etched surfaces.

[0048] Next, the weighting film 3 will be described. Figure 2 As shown, the weighting film 3 has: a weighting film 32, which is arranged on the weighting portion 222 of the detection arm 22; a weighting film 33, which is arranged on the weighting portion 232 of the detection arm 23; a weighting film 36, which is arranged on the weighting portion 262 of the driving arm 26; a weighting film 37, which is arranged on the weighting portion 272 of the driving arm 27; a weighting film 38, which is arranged on the weighting portion 282 of the driving arm 28; and a weighting film 39, which is arranged on the weighting portion 292 of the driving arm 29.

[0049] The weighting films 36, 37, 38, and 39 are used to adjust the resonant frequency and vibration balance of the driving vibration mode. The resonant frequency and vibration balance are adjusted by partially removing them under irradiation with the laser light L, which is the energy line. Furthermore, the weighting films 32 and 33 are used to adjust the resonant frequency and vibration balance of the detection vibration mode. The resonant frequency and vibration balance are adjusted by partially removing them under irradiation with the laser light L, which is the energy line.

[0050] Next, the structures of the weight films 36, 37, 38, and 39 will be described. However, since the weight films 36, 37, 38, and 39 have the same structure, for the sake of convenience, the weight film 36 will be described as a representative example, and the structures of the other weight films 37, 38, and 39 will be omitted.

[0051] like Figure 7 As shown, the weighting film 36 is arranged on the upper surface 263 of the weighting portion 262, and is not arranged on the lower surface 264 and the side surface. In addition, the weighting film 36 is provided over the entire area in the width direction of the weighting portion 262, i.e., the X-axis direction, except for a portion on the base end side of the weighting portion 262. Therefore, the center of gravity G2 of the weighting film 36 is located on the upper surface 263 side relative to the center plane CP of the driving arm 26. That is, the center of gravity G2 is located on the opposite side of the center of gravity G1 of the weighting portion 262 relative to the center plane CP. As a result, the center of gravity G0 of the entire structure composed of the weighting portion 262 and the weighting film 36 can be brought close to the center plane CP, and preferably, the center of gravity G0 is made consistent with the center plane CP as shown in the figure. Therefore, the useless vibration of the driving arm 26 in the driving vibration mode, especially the bending vibration in the Z-axis direction, can be reduced, vibration leakage can be reduced, and the detection accuracy of the angular velocity ωz can be improved.

[0052] The position, size, and range of the weight film 36 are not limited to those shown. For example, the weight film 36 may be disposed on the lower surface 264 or side surfaces of the weight portion 262, in addition to the upper surface 263. In this case, the thickness and placement of the weight film 36 can be adjusted so that the center of gravity G2 of the weight film 36 is located closer to the upper surface 263 than the center plane CP. Furthermore, the weight film 36 may be disposed over the entire length of the weight portion 262, i.e., along the Y-axis.

[0053] The material constituting the weight film 3 is not particularly limited; for example, metals, inorganic compounds, and resins can be used, but metals or inorganic compounds are preferably used. Metals or inorganic compounds can be formed easily and accurately using vapor phase film deposition. Furthermore, the weight film 3 composed of a metal or inorganic compound can be removed efficiently and accurately by irradiation with laser light L, which serves as an energy beam.

[0054] In addition, as the laser L, for example, pulsed lasers such as YAG, YVO4, and excimer lasers, and continuous oscillation lasers such as carbon dioxide lasers can be used. In addition, as energy rays, in addition to the laser L, ion beams such as FIB (Focused Ion Beam) and IBF (Ion Beam Figuring) can also be used. It should be noted that in the present embodiment, a pulsed laser is used as the laser L. That is, the weight film 36 is processed by continuously irradiating the laser L that is focused into a spot shape. In this way, by using a pulsed laser as the laser L, the irradiation time and the irradiation interval can be changed while the intensity of the laser L remains unchanged and constant, thereby controlling the irradiation amount of the laser L per unit area of ​​the weight film 36, that is, the energy. Therefore, the laser L is stable, and the weight film 36 can be processed with high precision.

[0055] like Figure 7 As shown, if the weighting film 36 is irradiated with laser light L, part or all of the irradiated portion is removed, forming a processing mark 30 that is recessed from the surface. It should be noted that if part of the portion irradiated with laser light L is removed, the weighting film 36 in that portion is thinned, and as shown in the figure, the processing mark 30 is composed of a recessed portion. Alternatively, if the entire portion irradiated with laser light L is removed, the processing mark 30 is composed of a through-hole. The processing mark 30 may be any of the above. In addition, as described above, since a pulsed laser is used as the laser light L, the processing mark 30 is in the form of a roughly circular dot. However, the top view shape of the processing mark 30 is not particularly limited.

[0056] Here, the laser light L is irradiated onto the weight film 36 in the Z-axis direction, which is perpendicular to the plane F0. Therefore, when the laser light L is irradiated onto the weight film 36 on the plane F0, the laser light L is reflected in the Z-axis direction. Therefore, the reflected laser light L does not accidentally irradiate other parts of the vibration element 1.

[0057] In contrast, if the weight film 36 on the inclined surface F3 is irradiated with laser light L, the laser light L is reflected in the X-axis direction according to the inclination angle of the inclined surface F3. Depending on the reflection angle, the reflected laser light may unintentionally irradiate other parts of the vibration element 1, forming unintentional processing marks 30 in the irradiated parts. For example, if the laser light L' reflected by the weight film 36 on the inclined surface F3 irradiates the weight film 32 of the adjacent detection arm 22, thereby removing a portion of the weight film 32, there is a possibility that the detuned frequency deviates from the set value or the vibration balance of the detection vibration mode is deteriorated.

[0058] In addition, if the laser light L' reflected by the weight film 36 on the inclined surface F3 irradiates the electrode film 4 of the adjacent detection arm 22, thereby removing a portion of the first detection signal electrode 43 and the first detection ground electrode 44, these electrodes 43 and 44 may become disconnected, making it impossible to detect the angular velocity ωz or becoming a defective product with significantly reduced detection accuracy. Therefore, the manufacturing yield of the vibration device 100 is reduced. In addition, even if the product is qualified at the time of shipment, it is conceivable that during use on the user side, a disconnection may occur starting from the unintentional processing mark 30, causing the vibration device 100 to malfunction, thereby reducing the reliability of the vibration device 100.

[0059] Therefore, in the vibration element 1, the angle θ formed by the first plane F1 and the inclined surface F3 is set to be less than 100°, so that the laser light L' reflected by the weight film 36 on the inclined surface F3 does not irradiate the other arms, especially the electrode film 4 and the weight film 3 on the adjacent arm. In this way, the inclined surface F3 becomes a steep slope, and the laser light L irradiated by the weight film 36 on the inclined surface F3 is reflected roughly toward the bottom, that is, the negative side in the Z-axis direction. Therefore, it is possible to effectively prevent the laser light L' reflected by the weight film 36 on the inclined surface F3 from irradiating the electrode film 4 and the weight film 3 on the other arms, making it difficult for the above-mentioned problems to occur. Therefore, the vibration element 1 is obtained with excellent vibration characteristics and reliability. It should be noted that in this embodiment, the laser light L' reflected by the weight film 36 on the inclined surface F3 is irradiated to the second plane F2. Therefore, when the laser L is irradiated on the weighting film 36 on the inclined surface F3, processing marks 30 are formed not only on the weighting film 36 on the inclined surface F3, but also on the weighting film 36 on the second plane F2. However, this process is an adjustment process of the driving arm 26, so even if processing marks 30 are formed on the second plane F2, it will not be a special problem.

[0060] Furthermore, because inclined surface F3 is a steep surface, the angle of incidence of laser light L' reflected from weight film 36 on inclined surface F3 onto second plane F2 is sufficiently reduced. Laser light L' incident on weight film 36 on second plane F2 is reflected generally upward, i.e., toward the positive side in the Z-axis direction. Consequently, laser light L" reflected from weight film 36 on second plane F2 is effectively prevented from irradiating electrode film 4 or weight film 3 on other arms.

[0061] In particular, in this embodiment, no matter which part of the weighting film 36 on the inclined surface F3 is irradiated with the laser light L, the reflected laser light L' is irradiated onto the second plane F2. Figure 7 As shown, the second plane F2 is configured to intersect the optical axis J of the laser light L' reflected from the upper end of the weight film 36 on the inclined surface F3. This effectively prevents the laser light L' from irradiating the electrode film 4 and weight film 3 on other arms. Furthermore, since the laser light L' can be reflected approximately directly upward on the second plane F2, the reflected laser light L" can be prevented from becoming stray light. Consequently, the laser light L' can be effectively prevented from irradiating the electrode film 4 and weight film 3 on arms other than the drive arm 26.

[0062] However, this is not limiting. The second plane F2 need not intersect the optical axis of the laser light L' reflected from the upper end of the weight film 36 on the inclined surface F3. In this case, the optical axis J of the laser light L' reflected from this portion can be made to not intersect with the other arms. This effectively prevents the laser light L' from irradiating the electrode film 4 and weight film 3 on the other arms.

[0063] As described above, it is possible to fully prevent laser light L' reflected from the weight film 36 on the inclined surface F3 from irradiating the electrode film 4 or weight film 3 located outside the drive arm 26. However, due to manufacturing problems, for example, there is a possibility that the laser light L will be reflected in an unintended direction due to fine irregularities that may occur on the surface of the weight film 36. As a result, there is a possibility that laser light L' reflected from the weight film 36 on the inclined surface F3 or laser light L" reflected again on the second plane F2 will irradiate the electrode film 4 or weight film 3 located on arms other than the drive arm 26.

[0064] Therefore, in this process, it is preferred that the laser light L not be irradiated on the weight film 36 on the inclined surface F3, but that the laser light L be irradiated on the weight film 36 located on at least one of the first plane F1 and the second plane F2. In other words, it is preferred that processing marks 30 not be formed on the weight film 36 on the inclined surface F3, but that processing marks 30 be formed on at least one of the first plane F1 and the second plane F2. This makes it less likely that the laser light L' reflected from the weight film 36 on the inclined surface F3 will irradiate the electrode film 4 or the weight film 3 on the other arm, as described above. Consequently, the vibration element 1 has excellent vibration characteristics and reliability.

[0065] It should be noted that the angle θ is not particularly limited as long as it is 100° or less, but is preferably 93° or less. As a result, the above-mentioned effects are more significant, and the vibration element 1 has excellent vibration characteristics and reliability. In addition, as Figure 8 As shown, the angle θ can be 90° or as Figure 9 As shown, it is less than 90°. Figure 8 as well as Figure 9 With this structure, the laser light L does not irradiate the weight film 36 on the inclined surface F3. Therefore, the aforementioned problem caused by the laser light L' reflected by the weight film 36 on the inclined surface F3 is substantially eliminated. As a result, the vibration element 1 has excellent vibration characteristics and reliability.

[0066] As described above, plane F0 includes a first plane F1 and second planes F2 located on either side of the plane F1 in the X-axis direction. This configuration allows for a larger area to be irradiated with laser light L, resulting in a weighting film 36 with a larger adjustable width. Furthermore, by selecting the surface to be irradiated with laser light L from the first plane F1 and the second plane F2, the position of the center of gravity G0 in the X-axis direction can be adjusted, making it easier to adjust the mass balance of the entire structure in the width direction.

[0067] It should be noted that since the second plane F2 is formed by an etched surface, it is prone to forming minute irregularities on its surface, resulting in a higher surface roughness than the first plane F1, which is formed by a polished surface. Therefore, similar to the inclined surface F3, the surface roughness of the weight film 36 on the second plane F2 is also likely to be higher. Furthermore, the second plane F2 is located closer to the lower surface 264 than the first plane F1. Therefore, compared to the laser light L reflected by the weight film 36 on the first plane F1, the laser light L reflected by the weight film 36 on the second plane F2 is more likely to be diffusely reflected, potentially impinging on the electrode film 4 or weight film 3 on other arms.

[0068] Therefore, in this process, it is particularly preferable to irradiate the weight film 36 on the second plane F2 with the laser light L, while irradiating the weight film 36 on the first plane F1 with the laser light L. In other words, it is preferable to form the processing mark 30 on the weight film 36 on the first plane F1, rather than on the weight film 36 on the second plane F2. This makes it less likely that the laser light L reflected from the weight film 36 will unintentionally irradiate the electrode film 4 or weight film 3 on the other arm.

[0069] The structure of the vibration device 100 has been described above. Next, a method for manufacturing the vibration device 100 will be described, and a method for manufacturing the vibration element 1 will also be described. Figure 10 As shown, the manufacturing method of the vibration device 100 includes: a preparation step of preparing the vibration element 1; a first frequency adjustment step of adjusting the frequency of the vibration element 1 on the quartz wafer 10; an assembly step of assembling the vibration element 1 on the base 61; a second frequency adjustment step of adjusting the frequency of the vibration element 1 on the base 61; and a sealing step of bonding the cover 62 to the base 61. The manufacturing method of the vibration element 1 includes the preparation step and the removal step consisting of the first and second frequency adjustment steps.

[0070] [Preparation process]

[0071] First, a quartz wafer 10 is prepared, and both main surfaces are subjected to various grinding processes such as lapping and polishing to flatten both main surfaces of the quartz wafer 10 and adjust the thickness of the quartz wafer 10 to the thickness of the resonator element 2. Next, the quartz wafer 10 is patterned using dry etching, particularly the Bosch process, to form a plurality of resonator elements 2 on the quartz wafer 10. In the resonator element 2 thus formed, the first flat surface F1 of the upper surface 263 of the weight portion 262 is formed as a polished surface, while the other second flat surfaces F21 and F22 and the first and second inclined surfaces F31 and F32 are formed as etched surfaces, respectively.

[0072] Next, an electrode film 4 is formed on the surface of the vibrating piece 2 by sputtering or the like, and further a weighting film 3 is formed on the electrode film 4 by vapor deposition or the like. Figure 11 As shown in FIG, a plurality of vibration elements 1 are formed integrally on the quartz wafer 10. Figure 11 In the figure, the vibration element 1 is simplified for the convenience of explanation, and each vibration element 1 is connected to the frame 10B via a connecting beam 10A.

[0073] [First frequency adjustment step]

[0074] Next, the resonant frequency and vibration balance of the vibration element 1 are adjusted on the quartz wafer 10. Specifically, laser light L is irradiated onto the weighting films 36, 37, 38, and 39, partially removing these films and reducing the mass of the driving arms 26, 27, 28, and 29. This adjusts the resonant frequency of the driving vibration mode of the vibration element 1, and also adjusts the vibration balance of the driving arms 26, 27, 28, and 29, thereby reducing vibration leakage in the driving vibration mode. Furthermore, laser light L is irradiated onto the weighting films 32 and 33, partially removing these films and reducing the mass of the detection arms 22 and 23. This adjusts the resonant frequency of the detection vibration mode of the vibration element 1, bringing the detuned frequency within a specified range, and also adjusts the vibration balance of the detection arms 22 and 23, thereby reducing vibration leakage in the detection vibration mode.

[0075] The method for irradiating the laser light L has been described above, so its explanation is omitted. This effectively prevents the laser light L reflected by the weighting film 36 from irradiating unintended portions of the resonator element 1 or other resonator elements 1 formed on the quartz wafer 10, thereby preventing the irradiated portions from being unintendedly processed. Consequently, degradation of the vibration characteristics and reliability of the resonator element 1 can be effectively suppressed.

[0076] In addition, this process can be performed as needed, and can be omitted if it is not necessary. In addition, when performing this process, it is possible to select whether it is necessary to remove each weighting film 32, 33, 36, 37, 38, and 39. If removal is necessary, the amount of removal and the formation position of the processing mark 30 can be selected. In addition, this process can also adjust the resonant frequency and vibration balance of the vibration element 1 by a method different from that of the present embodiment. As a different method, for example, a method of removing the weighting film 3 by using an ion beam as an energy line instead of the laser L can be cited. In this case, it is difficult to shrink the ion beam into a point shape like the laser L, so it is sufficient to use a mask or the like to prevent the ion beam from being irradiated to unnecessary parts.

[0077] [Assembly process]

[0078] Next, the vibration element 1 is folded off from the quartz wafer 10 , and the folded vibration element 1 is bonded to the base 61 via the supporting substrate 8 .

[0079] [Second frequency adjustment step]

[0080] In the assembly process, by fixing the vibration element 1 to the base 61, the resonant frequency and vibration balance of the driving vibration mode and the detection vibration mode of the vibration element 1 may change relative to these resonant frequencies and vibration balances on the quartz wafer 10. In addition, sometimes the resonant frequency and vibration balance are roughly adjusted in the first frequency adjustment process, and fine-tuned in this process. Therefore, in this process, a part of the weighting film 3 is removed using the same method as the above-mentioned first frequency adjustment process to adjust the resonant frequency and vibration balance of the vibration element 1. It should be noted that this process can be omitted if it is not necessary. In addition, the resonant frequency and vibration balance of the vibration element 1 can also be adjusted by a method different from the first frequency adjustment process. When using a different method, as described above, it is preferred not to irradiate the weighting film 3 on the inclined surface F3 with energy lines.

[0081] [Sealing process]

[0082] Next, under vacuum conditions, the cover 62 is seam-welded to the upper surface of the base 61 via a joining member 63 composed of, for example, a seam ring. As a result, the internal space S is hermetically sealed, and the vibration device 100 is obtained.

[0083] The above describes a method for manufacturing the resonator device 100. This manufacturing method can prevent unintended portions of the resonator element 1 from being processed by the laser light L during manufacturing, thereby preventing degradation in the driving characteristics and reliability of the resonator element 1.

[0084] The above describes in detail the vibration device 100 and the method for manufacturing the vibration device 100. The vibration element 1 included in the vibration device 100 includes: a base 21; a driving arm 26 serving as a vibration arm, which includes an arm portion 261 extending from the base 21 and a weight portion 262 located at the distal end of the arm portion 261. The weight portion 262 has an upper surface 263 serving as a first principal surface and a lower surface 264 serving as a second principal surface in a front-to-rear relationship; and a weight film 36 disposed on the upper surface 263 of the weight portion 262. The upper surface 263 includes: a first plane F1; a second plane F2 located closer to the lower surface 264 than the first plane F1 and parallel to the first plane F1; and an inclined surface F3 connecting the first plane F1 and the second plane F2, with the angle formed with the first plane F1 being less than 100 degrees. Furthermore, a processing mark 30 is formed on the weight film 36 , in which a portion is removed and recessed in the thickness direction of the driving arm 26 .

[0085] Thus, during the process of forming the processing mark 30, it is possible to effectively prevent the laser light L reflected by the weighting film 36 from irradiating unintended portions of the vibration element 1 or other vibration elements 1 formed on the quartz wafer 10, thereby preventing the irradiated portions from being unintendedly processed. Consequently, it is possible to effectively prevent degradation of the vibration characteristics and reliability of the vibration element 1.

[0086] Furthermore, as described above, the angle formed by the first plane F1 and the inclined surface F3 is preferably not more than 93°. Thus, during the step of forming the processing mark 30, it is possible to more effectively prevent the laser light L reflected by the weighting film 36 from irradiating unintended portions of the vibration element 1 or other vibration elements 1 formed on the quartz wafer 10, thereby preventing the irradiated portions from being unintendedly processed.

[0087] Furthermore, as described above, the processing mark 30 is not formed on the weight film 36 disposed on the inclined surface F3, but is formed on the weight film 36 disposed on at least one of the first plane F1 and the second plane F2. Thus, during the step of forming the processing mark 30, it is possible to more effectively prevent the laser light L reflected by the weight film 36 from irradiating unintended portions of the vibration element 1 or other vibration elements 1 formed on the quartz wafer 10, thereby preventing the irradiated portions from being unintendedly processed.

[0088] Furthermore, as described above, the processing mark 30 is not formed on the weight film 36 disposed on the second plane F2, but is formed on the weight film 36 disposed on the first plane F1. Thus, during the step of forming the processing mark 30, it is possible to more effectively prevent the laser light L reflected by the weight film 36 from irradiating unintended portions of the vibration element 1 or other vibration elements 1 formed on the quartz wafer 10, thereby preventing the irradiated portions from being unintendedly processed.

[0089] Furthermore, as described above, in a plan view, the second plane F2 is positioned on both sides of the first plane F1 in the width direction, orthogonal to the Y-axis direction, which is the direction in which the arm portion 261 extends. With this configuration, by selecting the surface to be irradiated with the laser beam L from the first plane F1 and the second plane F2, the position of the center of gravity G0 in the X-axis direction can be adjusted, making it easier to adjust the mass balance of the entire structure in the width direction.

[0090] As described above, the vibration device 100 includes the vibration element 1 and the package 6 that houses the vibration element 1. This allows the vibration device 100 to utilize the effects of the vibration element 1 and provide excellent vibration characteristics and reliability.

[0091] Furthermore, as described above, the manufacturing method of the vibration element 1 comprises: a preparation step of preparing the vibration element 1, wherein the vibration element 1 comprises: a base 21; a driving arm 26 as a vibration arm, the driving arm 26 having an arm portion 261 extending from the base 21 and a weight portion 262 located at the distal end of the arm portion 261, the weight portion 262 having an upper surface 263 as a first principal surface and a lower surface 264 as a second principal surface in a front-to-rear relationship; and a weight film 36 disposed on the upper surface 263 of the weight portion 262, and further, The upper surface 263 has: a first plane F1; second planes F21 and F22, which are closer to the lower surface 264 than the first plane F1 and are parallel to the first plane F1; and first and second inclined surfaces F31 and F32, which connect the first plane F1 with the second planes F21 and F22, and form an angle of less than 100° with the first plane F1; and a removal process, in which the laser L as an energy line is irradiated onto the weighting film 36 from the normal direction of the first plane F1, that is, the Z-axis direction, to remove a part of the weighting film 36.

[0092] Thus, during the removal process, it is possible to effectively prevent the laser light L reflected by the weighting film 36 from irradiating unintended portions of the vibration element 1 or other vibration elements 1 formed on the quartz wafer 10, thereby preventing the irradiated portions from being unintendedly processed. Consequently, it is possible to effectively prevent degradation of the vibration characteristics and reliability of the vibration element 1.

[0093] Furthermore, as described above, the angle formed by the first plane F1 and the inclined surface F3 is preferably not more than 93°. This effectively prevents the laser light L reflected by the weighting film 36 from irradiating unintended portions of the vibration element 1 or other vibration elements 1 formed on the quartz wafer 10 during the removal process, thereby preventing the irradiated portions from being unintendedly processed.

[0094] Furthermore, as described above, in the removal step, the weight film 36 disposed on at least one of the first plane F1 and the second plane F2 is removed, rather than the weight film 36 disposed on the inclined surface F3. Thus, in the removal step, it is possible to more effectively prevent the laser light L reflected by the weight film 36 from irradiating unintended portions of the vibration element 1 or other vibration elements 1 formed on the quartz wafer 10, thereby preventing the irradiated portions from being unintendedly processed.

[0095] Furthermore, as described above, in the removal step, the weight film 36 disposed on the first plane F1 is removed, rather than the weight film 36 disposed on the second plane F2. This effectively prevents the laser light L reflected by the weight film 36 from irradiating unintended portions of the vibration element 1 or other vibration elements 1 formed on the quartz wafer 10, thereby preventing the irradiated portions from being unintendedly processed.

[0096] Furthermore, as described above, in a plan view, the second plane F2 is positioned on both sides of the first plane F1 in the width direction perpendicular to the extending direction of the arm portion 261. With this configuration, by selecting the surface to be irradiated with the laser light L from the first plane F1 and the second plane F2, the position of the center of gravity G0 in the X-axis direction can be adjusted, making it easier to adjust the mass balance of the entire structure in the width direction.

[0097] The above describes this embodiment. It should be noted that the vibration element 1 of this embodiment includes driving arms 26, 27, 28, and 29 as vibration arms, but this is not limiting. For example, at least one of the driving arms 26, 27, 28, and 29 may be a vibration arm. Alternatively, or in addition to the driving arms 26, 27, 28, and 29, at least one of the detection arms 22 and 23 may be a vibration arm. That is, at least one of the detection arms 22 and 23 may have the same structure as the weight portion 262 and weight film 36 described above. Furthermore, in the method for manufacturing the vibration element 1, the removal step includes a first frequency adjustment step and a second frequency adjustment step, but this is not limiting. It is sufficient that at least one of the first and second frequency adjustment steps is included. That is, the removal step can be performed on the quartz wafer 10 or while mounted on the base 61. Furthermore, in the first and second frequency adjustment steps, the vibration balance and frequency are adjusted, respectively, but this is not limiting; only one of these may be adjusted.

[0098] For example, in this embodiment, second planes F2 are formed on both sides of first plane F1 in the X-axis direction. However, the configuration of second plane F2 is not limited to this. For example, second plane F2 may be formed on one or both sides of first plane F1 in the Y-axis direction, or may be formed in a frame-like shape surrounding first plane F1 when viewed from above. Alternatively, one of second planes F21 and F22 may be omitted. This omission broadens first plane F1, providing the advantage of increasing the irradiation area when laser light L is irradiated only onto first plane F1.

[0099] <Second embodiment>

[0100] Figure 12 It is a cross-sectional view showing a vibration element according to a second embodiment of the present invention.

[0101] The vibration device 100 of this embodiment is the same as the vibration device 100 of the first embodiment described above, except that the structure of the weighting parts 262, 272, 282, and 292 of the vibration element 1 is different. Therefore, in the following description, the vibration device 100 of the second embodiment will be described mainly with respect to the differences from the first embodiment described above, and descriptions of the same matters will be omitted. Figure 12 In the embodiment, the same reference numerals are used for the same structures as those in the above-mentioned embodiment. In addition, since the weighting portions 262, 272, 282, and 292 are identical in structure to each other, the weighting portion 262 will be described representatively below for ease of description, and the descriptions of the weighting portions 272, 282, and 292 will be omitted.

[0102] like Figure 12 As shown, in this embodiment, the weight portion 262 has a concave upper surface 263, unlike the first embodiment described above. The concave upper surface 263 includes a plane F0 formed by the XY plane and an inclined surface F3 inclined relative to plane F0. Furthermore, plane F0 includes a pair of first planes F11 and F12 that are flush with the upper surface of the diaphragm 2 and spaced apart in the X-axis direction, and a second plane F2 located between the pair of first planes F11 and F12 and closer to the lower surface 264 than the first planes F11 and F12. The first planes F11 and F12 and the second plane F2 are parallel to each other and formed by the XY plane, which is perpendicular to the Z-axis direction, which is the thickness direction of the diaphragm 2.

[0103] The inclined surface F3 includes a first inclined surface F31 located between and connecting the first plane F11 and the second plane F2, and a second inclined surface F32 located between and connecting the first plane F12 and the second plane F2. Furthermore, the angle θ formed between the first planes F11 and F12 and the first and second inclined surfaces F31 and F32 is equal to or less than 100°. With this structure, the laser light L incident on the weight film 36 on the inclined surface F3 is reflected within the recess formed in the upper surface 263. This prevents the reflected laser light L' from incident on the electrode film 4 and weight film 3 on the other arms.

[0104] As described above, in the resonator element 1 of this embodiment, when viewed from above, the first planes F11 and F12 are arranged on either side of the second plane F2 in the width direction, orthogonal to the Y-axis direction, in which the arm portion 261 extends. With this structure, the laser light L incident on the weight film 36 on the inclined surface F3 is reflected within the recess formed in the upper surface 263. This prevents the reflected laser light L' from incident on the electrode film 4 or weight film 3 on the other arms.

[0105] According to the second embodiment, the same effects as those of the first embodiment can be achieved.

[0106] It should be noted that in this embodiment, the first planes F11 and F12 are formed on both sides of the second plane F2 in the X-axis direction. However, the arrangement of the first planes is not limited to this. For example, one of the first planes F11 and F12 may be omitted. Furthermore, the first planes may be formed on one or both sides of the second plane F2 in the Y-axis direction, or may be formed in a frame shape surrounding the second plane F2 when viewed from above.

[0107] While the above description of the manufacturing method, vibration element, and vibration device of the present invention is based on the illustrated embodiments, the present invention is not limited thereto, and the structures of the various parts can be replaced with any other structure having the same function. Furthermore, other arbitrary structural components may be added to the present invention. Furthermore, the above embodiments may be appropriately combined.

[0108] In addition, the vibration element 1 is not limited to the above-mentioned embodiment. For example, it can also be an H-shaped angular velocity detection element having a pair of detection arms extending from the base to the positive side of the Y-axis direction and a pair of driving arms extending from the base to the negative side of the Y-axis direction. In this case, in the driving vibration mode, the pair of driving arms vibrate in opposite phases to each other in the X-axis direction. When the angular velocity around the Y-axis is applied in this state, the Coriolis force acts and the pair of detection arms vibrate in opposite phases to each other in the Z-axis direction. Therefore, the angular velocity around the Y-axis can be detected based on the signal output from the detection arm. In addition, the vibration element 1 is not limited to an angular velocity detection element. For example, it can be a detection element that detects physical quantities other than angular velocity, or an oscillation element such as an oscillator.

Claims

1. A method for manufacturing a vibration element, comprising: a preparation step of preparing a vibration element, the vibration element including a base, a vibration arm, and a weight film, the vibration arm including an arm extending from the base and a weight portion located at a distal end of the arm portion, the weight portion including a first principal surface and a second principal surface in a front-to-rear relationship, the weight film being disposed on the first principal surface of the weight portion, the first principal surface having a first plane, a second plane, and an inclined surface, the second plane being closer to the second principal surface than the first plane and parallel to the first plane, the inclined surface connecting the first plane and the second plane, and an angle formed between the inclined surface and the first plane being 100° or less; and a removing step of irradiating the weight film with energy rays from a normal direction of the first plane to remove a portion of the weight film; In the removing step, the weight film arranged on the first plane is removed without removing the weight film arranged on the inclined surface and the second plane.

2. The method for manufacturing a vibration element according to claim 1, wherein: An angle formed by the first plane and the inclined surface is less than or equal to 93°.

3. The method for manufacturing a vibration element according to claim 1 or 2, wherein: In a plan view, the second plane is arranged on both sides of the first plane in a width direction perpendicular to an extending direction of the arm portion.

4. The method for manufacturing a vibration element according to claim 1 or 2, wherein: In a plan view, the first plane is arranged on both sides of the second plane in a width direction perpendicular to an extending direction of the arm portion.

5. A vibration element comprising: base; a vibration arm including an arm portion extending from the base portion and a weight portion located at a distal end of the arm portion, the weight portion including a first main surface and a second main surface in a front-to-rear relationship; and a weight film disposed on the first main surface of the weight portion, The first main surface has a first plane, a second plane, and an inclined surface. The second plane is closer to the second main surface than the first plane and is parallel to the first plane. The inclined surface connects the first plane and the second plane. The angle formed by the inclined surface and the first plane is less than 100 degrees. A processing mark is formed on the weight film, in which a portion is removed and recessed in the thickness direction of the vibration arm. The processing mark is not formed on the weight film arranged on the inclined surface and the second plane, but is formed on the weight film arranged on the first plane. The vibration element according to claim 5 , wherein: An angle formed by the first plane and the inclined surface is less than or equal to 93°.

7. The vibration element according to claim 5 or 6, wherein: In a plan view, the second plane is arranged on both sides of the first plane in a width direction perpendicular to an extending direction of the arm portion.

8. The vibration element according to claim 5 or 6, wherein: In a plan view, the first plane is arranged on both sides of the second plane in a width direction perpendicular to an extending direction of the arm portion.

9. A vibration device, characterized in that: Include: The vibration element according to any one of claims 5 to 8; and A package houses the vibration element.

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