Chip tray

Abstract

The present invention discloses a chip tray for carrying chips, comprising a tray base, at least two first limit plates parallel to each other and at least two second limit plates parallel to each other, the first limit plate and the second limit plate both being vertically erected on the upper surface of the tray base and the first limit plate being vertically erected to the second limit plate, a receiving groove for accommodating the chip being formed between the tray base, two adjacent first limit plates and two adjacent second limit plates, the receiving groove being provided with a first support column and a second support column vertically erected on the upper surface of the tray base, the first support column and the second support column being parallel to each other and both being vertically connected to the two adjacent first limit plates, the contact surfaces of the first support column and the second support column with the chip being arc surfaces, so as to reduce the contact area between the chip and the chip tray.

Description

Technical Field

[0001] The present invention relates to the technical field of trays, and in particular to a chip tray. Background Art

[0002] After chip production is completed, the manufactured chips need to be transported to the appropriate location. The traditional method is to stack the chips together and transport them to the destination. During transportation, adjacent chips are collided by external forces, which can easily cause damage to the chips. Therefore, certain measures need to be taken to protect the chips when storing, loading, unloading and transporting them to avoid damage to the chips during storage, loading, unloading and transportation.

[0003] At present, the conventional method is to store the chip in the receiving slot of the chip tray. In order to prevent the chip from sticking to the bottom of the receiving slot, multiple hemispherical support blocks are usually set in the receiving slot to reduce the contact area between the chip and the chip tray. However, the chip is easily offset due to vibration during transportation, and then placed in the receiving slot at an angle, resulting in the failure of the robot arm to grab the chip in the subsequent process, affecting production.

[0004] The preceding description is intended to provide general background information and does not necessarily constitute prior art. Summary of the invention

[0005] The object of the present invention is to provide a chip tray which can prevent chips from being placed tilted.

[0006] The present invention provides a chip tray for carrying chips, comprising a tray base, at least two first limit plates parallel to each other and at least two second limit plates parallel to each other, the first limit plate and the second limit plate are both vertically erected on the upper surface of the tray base and the first limit plate is perpendicular to the second limit plate, a receiving groove for accommodating the chip is formed between the tray base, two adjacent first limit plates and two adjacent second limit plates, the receiving groove is provided with a first support column and a second support column vertically erected on the upper surface of the tray base, the first support column and the second support column are parallel to each other and vertically connect the two adjacent first limit plates, the contact surfaces of the first support column and the second support column with the chip are arc surfaces, so as to reduce the contact area between the chip and the chip tray.

[0007] Furthermore, the shortest distance from the first support column to the second limit plate is smaller than the distance between the first support column and the second support column, and the distance from the second support column to the second limit plate is smaller than the distance between the first support column and the second support column.

[0008] Furthermore, a distance between two adjacent first limiting plates is smaller than a distance between two adjacent second limiting plates.

[0009] Furthermore, the first support column and the second support column are both semi-cylinders, and the rectangular side surfaces of the first support column and the second support column are in contact with the upper surface of the tray base.

[0010] Furthermore, the bottom radii of the first support column and the second support column are equal.

[0011] Furthermore, the bottom radius dimensions of the first support column and the second support column are smaller than the height dimensions of the first limiting plate and the second limiting plate.

[0012] Furthermore, a support is provided on the lower surface of the pallet base, and a connecting seat matching the support is also provided on the upper surface of the pallet base, and the connecting seat can support the support so that multiple pallet bases can be stacked in the height direction.

[0013] Furthermore, the connecting seat is arranged at a position where the first limiting plate and the second limiting plate intersect.

[0014] Furthermore, the number of the supports is consistent with that of the connecting seats and the supports are arranged in a mirror image with respect to the tray bottom plate.

[0015] Furthermore, a cavity is formed between the tray bottom plate, the two adjacent first limiting plates, the first supporting column, the second supporting column and the chip, and at least one through hole connecting the inside and outside of the cavity is provided on the chip tray.

[0016] The chip tray provided by the present invention supports the chip by two support columns that are both vertically connected to the side walls, so as to avoid the chip being tilted due to being supported by the support columns and the side walls of the receiving groove; and the upper surface of the support column is an arc surface to reduce the contact area with the chip and avoid the chip sticking. By making the support column perpendicular to the long side wall of the receiving groove, and the distance between the two support columns and the short side wall of the receiving groove is less than the distance between the two support columns, the chip is offset due to vibration, with one of the support columns as the fulcrum, one end abutting against the short side of the receiving groove, and when the other end is tilted, the tilted end acts as one side of the long lever arm in the lever state, and the torque is greater under the action of gravity, thereby causing the tilted end of the chip to sink and finally return to the flat position. By setting a through hole on the chip tray, it is avoided that a closed cavity is formed to generate an internal and external pressure difference to cause chip sticking. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of a chip tray according to an embodiment of the present invention;

[0018] Figure 2 for Figure 1 A cross-sectional view of the chip tray when supporting a chip. DETAILED DESCRIPTION

[0019] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0020] Please refer to Figure 1 to Figure 2 An embodiment of the present invention provides a chip tray for carrying a chip 10. The chip tray includes a tray base 20, at least two first limiting plates 30, and at least two second limiting plates 40. Two adjacent first limiting plates 30 are parallel to each other and have equal spacing, and two adjacent second limiting plates 40 are parallel to each other and have equal spacing. The first limiting plates 30 and the second limiting plates 40 are perpendicular to each other and are both vertically erected on the upper surface of the tray base 20. A receiving groove for receiving the chip 10 is formed between the two adjacent first limiting plates 30, the two adjacent second limiting plates 40 and the tray base 20, and the first limiting plates 30 and the second limiting plates 40 constitute the side walls of the receiving groove.

[0021] In this embodiment, the chip 10 is a rectangular chip, and the length of the long side is greater than the length of the short side. Correspondingly, the receiving slot is also a rectangular receiving slot, that is, the distance between two adjacent first limiting plates 30 is less than the distance between two adjacent second limiting plates 40. In other embodiments, the chip 10 and the receiving slot may also be square.

[0022] The first support column 50 and the second support column 60 are arranged in the receiving groove, and the first support column 50 and the second support column 60 are parallel to each other and vertically connect the two adjacent first limit plates 30. The chip 10 is supported by the first support column 50 and the second support column 60, and the upper surfaces of the first support column 50 and the second support column 60 are arc surfaces, so as to reduce the contact area between the chip 10 and the first support column 50 and the second support column 60, and avoid the chip 10 from sticking.

[0023] In this embodiment, the first support column 50 and the second support column 60 are both semi-cylinders, and the rectangular side surfaces of the first support column 50 and the second support column 60 are in contact with the upper surface of the tray base 20, and the arc-shaped side surfaces of the first support column 50 and the second support column 60 are in contact with the chip 10. The first support column 50 and the second support column 60 are semi-cylinders of equal height, that is, the bottom radii of the first support column 50 and the second support column 60 are equal, and the bottom radius of the first support column 50 and the second support column 60 is smaller than the height of the first limiting plate 30 and the second limiting plate 40, so that when the chip 10 is supported by the first support column 50 and the second support column 60, it is also limited by the side surfaces of the first limiting plate 30 and the second limiting plate 40.

[0024] In other embodiments, the first support column 50 and the second support column 60 may not be semi-cylinders, but other structures with arc-shaped upper surfaces. The heights of the first support column 50 and the second support column 60 may also be different, so that the chip 10 is not completely horizontal when placed on the first support column 50 and the second support column 60, but can still be limited by the first limiting plate 30 and the second limiting plate 40.

[0025] The shortest distance between the first support column 50 and the second limit plate 40 is smaller than the distance between the first support column 50 and the second support column 60, and the distance between the second support column 60 and the second limit plate 40 is smaller than the distance between the first support column 50 and the second support column 60. When the chip 10 is offset due to vibration and takes one of the support columns as a fulcrum, one end abuts against the short side of the receiving groove and the other end tilts up. The tilted end acts as one side of the long lever arm in the lever state, and the moment is greater under the action of gravity, thereby causing the tilted end of the chip 10 to sink and finally return to the flat position.

[0026] When the chip 10 is placed flat in the receiving groove, a cavity is formed between the chip 10, two adjacent first limiting plates 30, two adjacent second limiting plates 40, the first support column 50 and the second support column 60. At least one through hole 70 connecting the inside and outside of the cavity is provided on the chip tray to avoid the formation of a closed cavity to generate a pressure difference between the inside and the outside, which may cause the chip 10 to stick.

[0027] The lower surface of the pallet base 20 is provided with a plurality of supports 21, and the pallet base 20 can be placed on the bottom surface through the supports 21. The upper surface of the pallet base 20 is provided with a plurality of connecting seats 22, and the size of the connecting seats 22 matches the support 21. The connecting seats 22 can support the support 21, so that multiple pallet bases can be stacked in the height direction. The connecting seats 22 are arranged at the intersection of the first limiting plate 30 and the second limiting plate 40. The number of the supports 21 is consistent with the number of the connecting seats 22 and is arranged in a mirror image relative to the pallet base 20.

[0028] The chip tray provided in this embodiment reduces the contact area with the chip 10 by setting the upper surface of the support column to an arc surface, thereby avoiding the adhesion of the chip 10. The chip 10 is supported by two support columns that are both vertically connected to the long side wall, and the distance between the two support columns and the short side wall of the receiving groove is less than the distance between the two support columns. The chip 10 is prevented from being placed obliquely on the long side wall. When the chip 10 is offset due to vibration and uses one of the support columns as a fulcrum, one end abuts against the short side wall of the receiving groove, and the other end is tilted, the tilted end acts as one side of the long force arm in the lever state, and the moment is greater under the action of gravity, thereby causing the tilted end of the chip 10 to sink and finally return to the flat position. By setting a through hole on the chip tray, the formation of a closed cavity to generate an internal and external pressure difference to cause chip adhesion is avoided. In addition, by the support 21 and the connecting seat 22 arranged in a mirror image relative to the tray base 20, multiple tray bases 20 can be stacked in the height direction, which is convenient for material transportation.

[0029] In the accompanying drawings, the sizes and relative sizes of layers and regions are exaggerated for clarity. It should be understood that when an element, such as a layer, region, or substrate, is referred to as being "formed on," "disposed on," or "located on" another element, the element may be disposed directly on the other element, or there may be intervening elements. Conversely, when an element is referred to as being "formed directly on" or "disposed directly on" another element, there are no intervening elements.

[0030] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0031] In this document, unless otherwise specified or limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0032] In this document, the directions or positional relationships indicated by terms such as "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", "vertical", and "horizontal" are based on the directions or positional relationships shown in the accompanying drawings and are only for the clarity of the technical solution and the convenience of description, and therefore should not be understood as limitations on the present invention.

[0033] In this document, the ordinal adjectives “first”, “second”, etc. used to describe elements are only used to distinguish elements with similar attributes, and do not mean that the elements described in this way must follow a given order, or time, space, level or other limitations.

[0034] As used herein, unless otherwise specified, “plurality” or “several” means two or more.

[0035] In this document, the terms "comprises," "comprising," or any other variations thereof, are intended to cover a non-exclusive inclusion of elements other than those listed and may also include additional elements not expressly listed.

[0036] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A chip tray, comprising a tray base, at least two mutually parallel first limit plates and at least two mutually parallel second limit plates, wherein the first limit plates and the second limit plates are both vertically erected on the upper surface of the tray base and the first limit plate is perpendicular to the second limit plate, and a receiving groove for receiving the chip is formed between the tray base, two adjacent first limit plates and two adjacent second limit plates, characterized in that: The receiving groove is provided with a first support column and a second support column vertically erected on the upper surface of the tray base, the first support column and the second support column are parallel to each other and vertically connect the two adjacent first limit plates, and the contact surfaces of the first support column and the second support column with the chip are arc surfaces, so as to reduce the contact area between the chip and the chip tray; The shortest distance from the first support column to the second limit plate is smaller than the distance between the first support column and the second support column, and the distance from the second support column to the second limit plate is smaller than the distance between the first support column and the second support column; The distance between two adjacent first limiting plates is smaller than the distance between two adjacent second limiting plates; A cavity is formed between the tray base, the two adjacent first limiting plates, the first supporting column, the second supporting column and the chip, and at least one through hole connecting the inside and outside of the cavity is provided on the chip tray.

2. The chip tray according to claim 1, characterized in that: The first supporting column and the second supporting column are both semi-cylinders, and the rectangular side surfaces of the first supporting column and the second supporting column are in contact with the upper surface of the tray base.

3. The chip tray according to claim 2, characterized in that: The bottom radii of the first supporting column and the second supporting column are equal.

4. The chip tray according to claim 3, characterized in that: The bottom radius of the first supporting column and the second supporting column is smaller than the height of the first limiting plate and the second limiting plate.

5. The chip tray according to claim 1, characterized in that: A support is provided on the lower surface of the pallet base, and a connecting seat matching the support is also provided on the upper surface of the pallet base. The connecting seat can support the support so that multiple pallet bases can be stacked in the height direction.

6. The chip tray according to claim 5, characterized in that: The connecting seat is arranged at a position where the first limiting plate and the second limiting plate intersect.

7. The chip tray according to claim 6, characterized in that: The number of the supports is the same as that of the connecting seats and the supports are arranged in a mirror image with respect to the tray base.

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