Chip shielding interconnection adapter plate and preparation method thereof

Abstract

The present invention discloses a chip shielding interconnection adapter board and a preparation method thereof, the preparation method comprising the following steps: respectively laminating an LCP wiring bottom plate, an LCP bonding layer, and an LCP wiring top plate in alignment, forming substrate interconnection copper pillars by laser drilling and chemical copper deposition; vertically fixing the LCP substrate chip shielding cavity by using a shielding cavity fixing tool; mounting the chip and active / passive devices, wire bonding, and using a potting tool to complete potting to realize the production of a chip shielding interconnection adapter board. The present invention provides a chip shielding interconnection adapter board and a preparation method thereof, the adapter board utilizes the bendable flexible substrate characteristics of LCP to effectively shield and interconnect specific functional chips, and realizes high-density interconnection with external devices by potting, has the advantages of good shielding effect, simple process implementation, high integration, etc., and can meet the miniaturization, multi-function, and high-reliability integration requirements of multi-chip circuit systems.

Description

Technical Field

[0001] The invention belongs to the field of microelectronic packaging, and in particular relates to a chip shielding interconnection adapter plate and a preparation method thereof. Background Art

[0002] With the rapid development of electronic systems that are lightweight, multifunctional, miniaturized, and low-cost, the continuous progress of integrated circuit technology has led to an increase in the complexity of chip design, resulting in a considerable amount of work being done in the field of multi-chip packaging, in which multiple integrated circuit (IC) chips are tightly packaged in a small package. In this package, noise interference, such as analog digital circuit block interference or electromagnetic interference (EMI), is a problem that needs to be solved urgently. Since noise interference may seriously affect the performance of chip operation, shielding specific function chips in these multi-chip packages is an important solution. Summary of the invention

[0003] The purpose of the present invention is to provide a chip shielding interconnection adapter plate and a preparation method thereof, so as to solve the problems such as noise interference between multiple chips. The specific function chips can be effectively shielded and interconnected, and high-density interconnection with external devices can be achieved through encapsulation. It has the advantages of good shielding effect, simple process implementation, high integration, etc., and can meet the miniaturization, multi-function, and high-reliability integration requirements of multi-chip circuit systems.

[0004] To solve the above problems, the technical solution of the present invention is:

[0005] A method for preparing a chip shielding interconnection adapter plate comprises the following steps:

[0006] S1: Provide a plurality of LCP substrates, including at least an LCP bottom plate and an LCP top plate;

[0007] S2: etching transmission line patterns on both sides of the LCP substrate and plating a metal layer on the transmission line patterns to form an LCP wiring substrate;

[0008] S3: etching transmission line patterns on both sides of the LCP top plate and plating a metal layer on the transmission line patterns to form an LCP wiring top plate, and performing a first groove on the LCP top plate where active / passive devices need to be installed to form a first cavity;

[0009] S4: providing an LCP adhesive layer, adhering it to the lower surface of the LCP wiring top plate, performing a second groove along the periphery of the chip mounting area of ​​the LCP wiring top plate, forming a chip mounting area and a chip shielding side panel area located at the periphery of the chip mounting area on the wiring layer of the LCP wiring top plate, performing a third groove on the lower surface of the LCP wiring top plate, and removing the LCP adhesive layer in the chip shielding side panel area;

[0010] S5: providing a plurality of LCP adhesive layers, and aligning and laminating the LCP wiring top plate, the plurality of LCP substrates, and the LCP wiring bottom plate to form an LCP adapter board;

[0011] S6: performing laser drilling and chemical copper deposition on the LCP adapter board to form substrate interconnection copper pillars;

[0012] S7: vertically fix the chip shielding side panel area by using a shielding cavity fixing tool to form a chip shielding cavity surrounding the chip mounting area;

[0013] S8: mounting the chip on the chip mounting area, mounting the active / passive device in the first cavity, and wire bonding the chip to the LCP adapter board;

[0014] S9: Encapsulate the chips and active / passive components.

[0015] Preferably, the output power ratio of the second groove carving is 300-500, and the frequency is 2000kHz-4000kHz.

[0016] Preferably, the output power ratio of the second groove carving is 50-80, and the frequency is 20000kHz-40000kHz.

[0017] Based on the same inventive concept, the present invention also provides a chip shielding interconnection adapter board, including an LCP adapter board, a chip and active / passive devices;

[0018] The LCP adapter board is formed by laminating a plurality of LCP substrates, and at least includes an LCP wiring bottom board, an LCP wiring top board, and a plurality of interconnected copper pillars connecting the plurality of LCP substrates in a thickness direction. The LCP wiring bottom board includes an LCP substrate and a metal wiring layer covering both sides of the LCP substrate. The LCP wiring top board includes an LCP substrate and a metal wiring layer covering both sides of the LCP substrate. A through first cavity is provided at a location where active / passive devices need to be installed on the LCP wiring top board. An upper wiring layer of the LCP wiring top board is provided with a chip mounting area. The outer periphery of the chip mounting area is vertically bent upward to form a chip shielding cavity. The chip is mounted on the chip mounting area. The active / passive device is mounted in the first cavity. The chip and the LCP adapter board are connected by bonding wires. A glue layer is potted on the chip and the active / passive device.

[0019] Preferably, the chip shielding cavity is vertically fixed by a shielding cavity fixing tool, and the shielding cavity fixing tool includes a shielding cavity fixing base, a shielding cavity fixing cover plate and a shielding cavity fixing pad block. The shielding cavity fixing cover plate is covered on the upper surface of the shielding cavity fixing base. A cavity is opened at a position corresponding to the chip mounting area of ​​the shielding cavity fixing base, and the shielding cavity fixing pad block is arranged in the cavity. When in use, the chip shielding cavity is clamped in a gap formed by the shielding cavity fixing base and the shielding cavity fixing pad block, so as to keep the chip shielding cavity and the LCP top plate in a vertical state.

[0020] Due to the adoption of the above technical solution, the present invention has the following advantages and positive effects compared with the prior art:

[0021] The bendable flexible LCP material is used as the substrate substrate, and the designed shielding cavity fixing tooling is used to make a chip shielding layer area in a specific area of ​​the LCP substrate. The specific functional chips can be effectively shielded and interconnected, and high-density interconnection with external devices can be achieved through potting. At the same time, the adapter board is not limited to two layers of LCP substrates, and can achieve lamination of two or more layers, and achieve effective shielding and interconnection of different types of chips. It has the advantages of good shielding effect, simple process implementation, high integration, etc., and can meet the miniaturization, multi-function, and high-reliability integration requirements of multi-chip circuit systems. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A flow chart of a method for preparing a chip shielding interconnect adapter plate provided by an embodiment of the present invention;

[0023] Figure 2a to 2g for Figure 1 A schematic structural diagram of a chip shielding interconnection adapter board formed corresponding to each step;

[0024] Figure 3a to 3c for Figure 1 A schematic diagram of a top view structure of a chip shielding interconnection adapter plate formed corresponding to each step;

[0025] Figure 4 A schematic structural diagram of a chip shielding interconnect adapter board provided in an embodiment of the present invention;

[0026] Figure 5 A schematic diagram of the three-dimensional structure of a chip shielding interconnect adapter plate provided in an embodiment of the present invention;

[0027] Figure 6 It is a schematic diagram of the structure of the shielding cavity fixing tooling;

[0028] Figure 7 It is a schematic diagram of the structure of the potting tooling.

[0029] Description of reference numerals:

[0030] 100: LCP wiring bottom board; 101: LCP substrate; 102: metal wiring layer; 200: LCP wiring top board; 201: LCP substrate; 202: metal wiring layer; 203: first cavity; 204: chip mounting area; 205: chip shielding side panel area; 206: chip shielding cavity; 207: chip interconnection pad; 300: LCP adhesive layer; 400: interconnection copper pillar; 500: chip; 600: active / passive device; 700: lead; 800: shielding cavity fixing tool; 801: shielding cavity fixing base; 802: shielding cavity fixing cover plate; 803: shielding cavity fixing pad; 900: potting tool; 901: glue layer; 902: potting base; 903: potting dam. DETAILED DESCRIPTION

[0031] The following is a further detailed description of a chip shielding interconnection adapter board and a preparation method thereof proposed by the present invention in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description and claims.

[0032] Embodiment 1

[0033] See also Figure 1 , Figure 2a to 2g and Figure 3a to 3c As shown, this embodiment provides a method for preparing a chip shielding interconnection adapter plate, comprising the following steps:

[0034] S1: Provide a plurality of LCP substrates, including at least an LCP bottom plate and an LCP top plate;

[0035] S2: See Figure 2a As shown, a transmission line pattern is etched on both sides of the LCP substrate and a metal layer is plated on the transmission line pattern to form an LCP wiring substrate 100. The LCP wiring substrate 100 includes an LCP substrate 101 located in the middle and a metal wiring layer 102 covering both sides of the LCP substrate 101. The specific forming process of the metal wiring layer 102 is laser marking positioning, double-sided photolithography, wet etching, and chemical nickel-palladium-gold plating.

[0036] S3: etching transmission line patterns on both sides of the LCP top plate and plating a metal layer on the transmission line patterns to form an LCP wiring top plate 200, wherein the LCP wiring top plate 200 comprises an LCP substrate 201 in the middle and a metal wiring layer 202 covering both sides of the LCP substrate 201, wherein the specific forming process of the metal wiring layer 202 is laser marking positioning, double-sided photolithography, wet etching, and chemical nickel-palladium-gold plating, and a first groove is made at the LCP top plate where active / passive devices need to be installed to form a first cavity 203;

[0037] S4: providing an LCP adhesive layer 300, pasting it on the lower surface of the LCP wiring top plate 200, performing a second groove along the periphery of the chip mounting area of ​​the LCP wiring top plate 200, forming a chip mounting area 204 and a chip shielding side panel area 205 located on the periphery of the chip mounting area on the wiring layer of the LCP wiring top plate 200, performing a third groove on the lower surface of the LCP wiring top plate 200, and removing the LCP adhesive layer 300 in the chip shielding side panel area 205;

[0038] As a preferred example of this embodiment, the output power ratio of the second groove is 300-500, and the frequency is 2000kHz-4000kHz; the output power ratio of the second groove is 50-80, and the frequency is 20000kHz-40000kHz.

[0039] S5: See Figure 2b As shown, a plurality of LCP adhesive layers 300 are provided, and an LCP wiring top plate 200, a plurality of LCP substrates and an LCP wiring bottom plate 100 are aligned and laminated to form an LCP adapter board. In this embodiment, only an example of laminating two layers of LCP substrates is shown, that is, the LCP wiring bottom plate 100 and the LCP wiring top plate 200 with the LCP adhesive layer 300 are directly laminated, but this embodiment does not limit the number of layers of the LCP substrate. In different embodiments, a plurality of LCP substrates can also be used for alignment and lamination to produce an LCP adapter board with a multi-layer substrate structure;

[0040] S6: See Figure 2c As shown, the LCP adapter board is laser-drilled and chemically copper-deposited to form substrate interconnection copper pillars 400;

[0041] S7: See Figure 2d As shown, the chip shielding side panel area 205 is vertically fixed by using the shielding cavity fixing tool 800 to form a chip shielding cavity 206 surrounding the chip mounting area 204; the specific method is as follows:

[0042] Bend the chip shielding side panel area 205 vertically upwards, and fix it with a shielding cavity fixing tool 800 after bending. The structure of the shielding cavity fixing tool 800 is shown in FIG. Figure 6 As shown, it includes a shielding cavity fixed base 801, a shielding cavity fixed cover plate 802 and a shielding cavity fixed pad block 803. The shielding cavity fixed cover plate 802 is covered on the upper surface of the shielding cavity fixed base 801. A cavity is opened at a position corresponding to the shielding cavity fixed base 801 and the chip mounting area 204. The shielding cavity fixed pad block 803 is arranged in the cavity. When in use, the chip shielding cavity 206 is clamped in the gap formed by the shielding cavity fixed base 801 and the shielding cavity fixed pad block 803, so as to keep the chip shielding cavity 206 in a vertical state with the LCP top plate.

[0043] S8: See Figure 2e As shown, the chip 500 is mounted on the chip mounting area 204, the active / passive device 600 is mounted in the first cavity 203, and the chip 500 is wire-bonded with the LCP adapter board 700;

[0044] S9: See Figure 2f As shown, the chip and active / passive devices are potted, and a potting tool 900 is used to fill a glue layer 901 on the chip 500 and the active / passive device 600. In this embodiment, the glue layer 901 can preferably be silica gel, see Figure 7 As shown, the potting tool 900 includes a potting base 902 and a potting dam 903. The potting dam 903 is provided with a through-hole for glue filling, and the area of ​​the glue filling hole covers all the chips 500 and the active / passive components 600. During potting, the potting base 902 is placed on the LCP adapter board, and silica gel is poured onto the chips 500 and the active / passive components 600 from the glue filling hole. Figure 2g As shown, after the silicone gel solidifies, the potting tool 900 is removed.

[0045] The present embodiment provides a method for preparing a chip shielding interconnection adapter plate, which adopts a bendable flexible LCP material as a substrate substrate, and uses a designed shielding cavity fixing tool to make a chip shielding layer area in a specific area of ​​the LCP substrate, so that specific functional chips can be effectively shielded and interconnected, and high-density interconnection with external devices can be achieved through encapsulation. At the same time, the adapter plate is not limited to two layers of LCP substrates, and can achieve lamination of two or more layers, and achieve effective shielding and interconnection of different types of chips. It has the advantages of good shielding effect, simple process implementation, high integration, etc., and can meet the miniaturization, multi-function, and high-reliability integration requirements of multi-chip circuit systems.

[0046] Embodiment 2

[0047] See also Figure 4 and Figure 5 As shown, based on the same inventive concept, this embodiment provides a chip shielding interconnection adapter board, including an LCP adapter board, a chip 500 and an active / passive device 600;

[0048] See also Figure 2a to 2gAs shown, the LCP adapter board is formed by laminating a plurality of LCP substrates, including at least an LCP wiring bottom plate 100, an LCP wiring top plate 200, and a plurality of interconnecting copper pillars 400 that connect the plurality of LCP substrates along the thickness direction. In this embodiment, the LCP adapter board is formed by stacking the LCP wiring bottom plate 100 and the LCP wiring top plate 200, but this embodiment does not limit the number of layers of the LCP substrate. In different embodiments, multi-layer LCP substrates can also be used for alignment lamination to produce an LCP adapter board with a multi-layer substrate structure; the LCP wiring bottom plate 100 includes an LCP substrate 101 and a LCP substrate covered on the LCP substrate. The metal wiring layers 102 on both sides, the LCP wiring top plate 200 includes an LCP substrate 201 and metal wiring layers 202 covering both sides of the LCP substrate, the LCP wiring top plate 200 is provided with a through first cavity 203 where active / passive devices need to be installed, the upper wiring layer of the LCP wiring top plate 200 is provided with a chip mounting area, the outer periphery of the chip mounting area is vertically bent upward to form a chip shielding cavity 206, the chip is mounted on the chip mounting area, the active / passive device 600 is mounted in the first cavity 203, the chip and the LCP adapter board are connected by bonding wires, and the chip and the active / passive device are potted with a glue layer.

[0049] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, if these changes fall within the scope of the claims of the present invention and their equivalents, they still fall within the protection scope of the present invention.

Claims

1. A method for preparing a chip shielding interconnection adapter plate, characterized in that: The steps include: S1: Provide a plurality of LCP substrates, including at least an LCP bottom plate and an LCP top plate; S2: etching transmission line patterns on both sides of the LCP substrate and plating a metal layer on the transmission line patterns to form an LCP wiring substrate; S3: etching transmission line patterns on both sides of the LCP top plate and plating a metal layer on the transmission line patterns to form an LCP wiring top plate, and performing a first groove on the LCP top plate where active / passive devices need to be installed to form a first cavity; S4: providing an LCP adhesive layer, adhering it to the lower surface of the LCP wiring top plate, performing a second groove along the periphery of the chip mounting area of ​​the LCP wiring top plate, forming a chip mounting area and a chip shielding side panel area located at the periphery of the chip mounting area on the wiring layer of the LCP wiring top plate, performing a third groove on the lower surface of the LCP wiring top plate, and removing the LCP adhesive layer in the chip shielding side panel area; S5: providing a plurality of LCP adhesive layers, and aligning and laminating the LCP wiring top plate, the plurality of LCP substrates, and the LCP wiring bottom plate to form an LCP adapter board; S6: performing laser drilling and chemical copper deposition on the LCP adapter board to form substrate interconnection copper pillars; S7: vertically fix the chip shielding side panel area by using a shielding cavity fixing tool to form a chip shielding cavity surrounding the chip mounting area; S8: mounting the chip on the chip mounting area, mounting the active / passive device in the first cavity, and wire bonding the chip to the LCP adapter board; S9: Encapsulate the chips and active / passive components.

2. The method for preparing the chip shielding interconnection adapter plate according to claim 1, characterized in that: The output power ratio of the second groove is 300-500, and the frequency is 2000kHz-4000kHz.

3. The method for preparing the chip shielding interconnection adapter plate according to claim 1, characterized in that: The output power ratio of the second groove is 50-80, and the frequency is 20000kHz-40000kHz.

4. A chip shielding interconnection adapter board, characterized in that: Including LCP adapter board, chips and active / passive devices; The LCP adapter board is formed by laminating a plurality of LCP substrates, and at least includes an LCP wiring bottom board, an LCP wiring top board, and a plurality of interconnected copper pillars connecting the plurality of LCP substrates in a thickness direction. The LCP wiring bottom board includes an LCP substrate and a metal wiring layer covering both sides of the LCP substrate. The LCP wiring top board includes an LCP substrate and a metal wiring layer covering both sides of the LCP substrate. A through first cavity is provided at a location where active / passive devices need to be installed on the LCP wiring top board. An upper wiring layer of the LCP wiring top board is provided with a chip mounting area. The outer periphery of the chip mounting area is vertically bent upward to form a chip shielding cavity. The chip is mounted on the chip mounting area. The active / passive device is mounted in the first cavity. The chip is connected to the LCP adapter board through bonding wires. A glue layer is potted on the chip and the active / passive device.

5. The chip shielding interconnection adapter board according to claim 4, characterized in that: The chip shielding cavity is vertically fixed by a shielding cavity fixing tool, and the shielding cavity fixing tool includes a shielding cavity fixing base, a shielding cavity fixing cover plate and a shielding cavity fixing pad block. The shielding cavity fixing cover plate is covered on the upper surface of the shielding cavity fixing base. A cavity is opened at a position corresponding to the chip mounting area of ​​the shielding cavity fixing base. The shielding cavity fixing pad block is arranged in the cavity. When in use, the chip shielding cavity is clamped in a gap formed by the shielding cavity fixing base and the shielding cavity fixing pad block to keep the chip shielding cavity and the LCP wiring top plate in a vertical state.

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