A broadband dielectric filter and a transceiver channel, base station and satellite having the same

Abstract

The present invention relates to the field of filter technology, and in particular to a broadband dielectric filter. The broadband dielectric filter comprises: a PCB bottom plate; N-cavity dielectric resonant blocks, which are provided with at least one and are welded side by side on the PCB bottom plate, and two adjacent resonant cavities among the N resonant cavities are internally magnetically coupled or an electroplated metal surface is added to the end surface to realize internal electrical coupling; a metal lead strip, which corresponds to the resonant cavity one by one, one end of which is inserted into the resonant cavity and the other end is led out of the resonant cavity; a metal pad, which is welded and connected to the other end of the metal lead strip, and is directly or indirectly welded on the PCB bottom plate; a lumped element, which is suitable for forming external coupling, and when two adjacent resonant cavities form internal magnetic coupling, the external coupling is electrical coupling, and when two adjacent resonant cavities form internal electrical coupling, the external coupling is magnetic coupling. The broadband dielectric filter provided by the present invention can introduce a transmission zero point out of the band, improve the suppression characteristics, and thus make the broadband dielectric filter applicable to modern communication systems.

Description

Technical Field

[0001] The present invention relates to the technical field of filters, and in particular to a broadband dielectric filter and a transceiver channel, a base station and a satellite having the same. Background Art

[0002] In recent years, with the rapid development of wireless technologies such as the new generation of mobile communications, satellite communications, the Internet of Things, and the new generation of integrated radar systems, the overall communication equipment has developed rapidly in the direction of miniaturization, high density, low cost, high performance, low latency, and low power consumption. With the widespread application of large-scale MIMO technology, microwave filters in wireless communication systems are also developing in the direction of miniaturization, high performance, and low cost. Since dielectric filters can be filled with materials with high dielectric constants, the overall filter size can be miniaturized. In the context of this new generation of communication system, dielectric filters with the advantages of low cost and miniaturization have become a hot research topic.

[0003] Existing dielectric filters are difficult to realize wideband filters with large bandwidths only through the coupling structure of their own electromagnetic fields. Distributed dielectric filters coupled through external lumped capacitors can achieve very wide passbands, but due to the dispersion effect of broadband, out-of-band suppression is deteriorated. In addition, due to the size limitation of the traditional distributed dielectric filter structure, the topology is often relatively simple and mostly exists in cascade form, making it difficult to achieve cross-coupling, introduce out-of-band zeros, and improve out-of-band characteristics. Summary of the invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the defect that the dielectric filter in the prior art is difficult to achieve a large bandwidth, thereby providing a broadband dielectric filter and a transceiver channel, base station and satellite having the same.

[0005] In order to solve the above technical problems, the broadband dielectric filter provided by the present invention comprises:

[0006] PCB base plate;

[0007] N-cavity dielectric resonator block, at least one of which is welded side by side on the PCB bottom plate, the N-cavity dielectric resonator block has N resonant cavities and N≧2, and two adjacent resonant cavities in the N resonant cavities are internally magnetically coupled or internally electrically coupled by adding electroplated metal surfaces on the end surfaces;

[0008] There are at least two metal lead bars corresponding to the resonant cavities one by one, one end of which is inserted into the resonant cavity and the other end is led out of the resonant cavity;

[0009] A metal pad is welded to the other end of the metal lead strip and is directly or indirectly welded to the PCB bottom plate;

[0010] The lumped element is welded between two adjacent metal pads and is suitable for forming external coupling. When two adjacent resonant cavities form internal magnetic coupling, the external coupling is electric coupling. When two adjacent resonant cavities form internal electric coupling, the external coupling is magnetic coupling.

[0011] Optionally, the lumped element is a lumped capacitor or a lumped inductor or a spiral inductor.

[0012] Optionally, also include:

[0013] A single-cavity dielectric resonator block has a single resonant cavity therein, the single-cavity dielectric resonator block is provided with at least one and all are welded on the PCB bottom plate, and the single-cavity dielectric resonator block and the N-cavity dielectric resonator block are arranged side by side.

[0014] Optionally, also include:

[0015] A high-frequency PCB small board is arranged along the side-by-side direction of the N-cavity dielectric resonator block and is welded on the PCB bottom plate, and the metal pad is welded on the high-frequency PCB small board.

[0016] Optionally, also include:

[0017] The feeding pad is welded on the PCB bottom plate and connected to two ends of the high-frequency PCB small board along the side-by-side direction.

[0018] Optionally, also include:

[0019] The bottom port pad is located at a corner of the PCB bottom plate and connected to the feeding pad.

[0020] Optionally, the metal connecting strip is bent at a right angle.

[0021] Optionally, when two adjacent resonant cavities among the N resonant cavities are internally electrically coupled, the two electroplated metal surfaces are tooth-matched and a gap is left at the connection.

[0022] The transceiver channel provided in this embodiment includes the aforementioned broadband dielectric filter.

[0023] The base station or satellite provided in this embodiment includes the aforementioned transceiver channel.

[0024] The technical solution of the present invention has the following advantages:

[0025] 1. The broadband dielectric filter provided by the present invention is formed by connecting at least one N-cavity dielectric resonator block. The main feature of the N-cavity dielectric resonator block is that it contains multiple resonant cavities, which can be composed of different dielectric constants, and multiple dielectric resonator blocks can be freely combined. By utilizing the electromagnetic coupling inside the multi-cavity resonator block and the electromagnetic coupling introduced by the lumped elements connected to the outside of the dielectric resonator block, the topological structure is reasonably designed, the polarity of the coupling is selected, the electromagnetic hybrid coupling structure and the cross-coupling structure are realized, and the transmission zero point is introduced outside the band, which improves the suppression characteristics, so that the broadband dielectric filter can be applied to modern communication systems.

[0026] 2. The transceiver channel provided by the present invention has the above advantages because it includes the above broadband dielectric filter.

[0027] 3. The base station and satellite provided by the present invention also have the above advantages because they have the above-mentioned transceiver channels. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 It is a schematic structural diagram of an eighth-order broadband dielectric filter (magnetic inside and electric outside) according to an embodiment of the present invention;

[0030] Figure 2 It is a schematic structural diagram of an eighth-order broadband dielectric filter (electric inside and magnetic outside) according to an embodiment of the present invention;

[0031] Figure 3 Schematic diagram of the structure of a dual-cavity dielectric filter (internal magnetic coupling) according to an embodiment of the present invention;

[0032] Figure 4 The structure of the dual-cavity dielectric filter (internal electrical coupling) according to the embodiment of the present invention is shown in FIG. Figure 1 ;

[0033] Figure 5 The structure of the dual-cavity dielectric filter (internal electrical coupling) according to the embodiment of the present invention is shown in FIG. Figure 2 ;

[0034] Figure 6 It is a schematic diagram of the structure of a dual-cavity dielectric filter (magnetic inside and electric outside) according to an embodiment of the present invention;

[0035] Figure 7 It is a schematic diagram of the structure of a dual-cavity dielectric filter (electric inside and magnetic outside) according to an embodiment of the present invention;

[0036] Figure 8 This is a schematic diagram of the structure of a four-cavity dielectric filter according to an embodiment of the present invention;

[0037] Fig. 9 This is a frequency response curve diagram of the filter when a transmission zero point is introduced on the left side of the passband according to an embodiment of the present invention.

[0038] Description of reference numerals:

[0039] 1. PCB bottom plate; 2. N-cavity dielectric resonator block; 3. Metal lead strip; 4. Metal pad; 5. Lumped element; 6. Single-cavity dielectric resonator block; 7. High-frequency PCB small board; 8. Feed pad; 9. Bottom port pad; 10. Electroplated metal surface. DETAILED DESCRIPTION

[0040] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0044] Embodiment 1

[0045] Reference Figure 1-2This embodiment provides a broadband dielectric filter, including a PCB base plate 1, an N-cavity dielectric resonator block 2, a metal lead strip 3, a metal pad 4 and a lumped element 5.

[0046] Among them, at least one N-cavity dielectric resonator block 2 is provided and soldered side by side on the PCB bottom plate 1, the N-cavity dielectric resonator block 2 has N resonant cavities and N≧2, and two adjacent resonant cavities in the N resonant cavities are internally magnetically coupled or the end surfaces are additionally provided with electroplated metal surfaces 10 to realize internal electrical coupling. Figure 3-Figure 7 In the example shown, N=2; Figure 8 Where N=4; in other embodiments, N can be any integer ≧2. Except for the top surface, all other surfaces of the N-cavity dielectric resonator block 2, including the inner surface of the resonant cavity, are electroplated with metal. The shapes of the N-cavity dielectric resonator block 2 and the resonant cavity are not limited here, and can be a rectangular parallelepiped or a cube or a cylinder or an ellipsoid or an anisotropic shape, etc. For example, in this embodiment, the shape of the N-cavity dielectric resonator block 2 is a rectangular parallelepiped, and the shape of the resonant cavity is a cylinder. For the N-cavity dielectric resonator block 2, two adjacent resonant cavities are internally magnetically coupled or an electroplated metal surface 10 is added to the end surface to achieve internal electrical coupling: for example Figure 3 As shown in , it is an internal magnetic coupling type dual-cavity dielectric resonator block. The intensity of magnetic coupling is controlled only by controlling the distance between the two resonant cavities. The magnetic coupling can be enhanced by properly adjusting the distance. Figure 4 As shown in the figure, it is an internally electrically coupled dual-cavity dielectric resonant block. The electroplated metal surface 10 shown in the figure is a rectangular surface. The electroplated metal surface 10 and the metallized through-hole on the inner surface form a 1 / 4 wavelength resonant cavity. The two resonant cavities achieve strong electrical coupling through the gap between the rectangular surfaces; for example Figure 5 As shown in the figure, it is another internally electrically coupled dual-cavity dielectric resonator block. Figure 4 The difference is that the electroplated metal surface 10 adopts the form of interdigitation, that is, the two electroplated metal surfaces 10 are matched with each other through a tooth shape and a gap is left at the joint, so that stronger electrical coupling can be achieved. In this embodiment, two adjacent resonant cavities can adopt any of the above internal coupling forms.

[0047] There are at least two metal lead bars 3 corresponding to the resonant cavities, one end of which is inserted into the resonant cavity and the other end is led out of the resonant cavity. The structure of the metal lead bar 3 is not limited, and can be a conventional strip structure or a bent deformed strip structure, for example Figure 1 What is shown in the figure is a right-angle bent deformation structure, the purpose of which is to cooperate with other structures for installation.

[0048] The metal pad 4 is welded to the other end of the metal lead strip 3 and is directly or indirectly welded to the PCB bottom plate 1. Figure 1 and Figure 2In the figure, the high-frequency PCB small plate 7 is indirectly welded to the PCB bottom plate 1, that is, the metal pad 4 is welded to the high-frequency PCB small plate 7, and the high-frequency PCB small plate 7 is welded to the PCB bottom plate.

[0049] The lumped element 5 is welded between two adjacent metal pads 4 and is suitable for forming external coupling. When the two adjacent resonant cavities form internal magnetic coupling, the external coupling is electric coupling. When the two adjacent resonant cavities form internal electric coupling, the external coupling is magnetic coupling. The lumped element 5 can be a lumped capacitor or a lumped inductor or a spiral inductor. The lumped capacitor is used to form electric coupling, and the lumped inductor and the spiral inductor are used to form magnetic coupling. The internal coupling and external coupling of two adjacent resonant cavities constitute electromagnetic hybrid coupling: for example, Figure 1 The dual-cavity dielectric resonator block in the system is in the form of internal magnetic coupling and external electric coupling. Figure 2 The dual-cavity dielectric resonator block is in the form of internal electric coupling and external magnetic coupling; Figure 6 The dual-cavity dielectric resonant block is in the form of internal magnetic coupling and external electric coupling; Figure 7 The dual-cavity dielectric resonator block in the embodiment is in the form of internal electrical coupling and external magnetic coupling. The external coupling strength is mainly achieved by changing the externally loaded lumped element 5. The overall dominance of the resonator block is determined by the comparison between the internal coupling strength and the external coupling strength. If the internal coupling strength is greater than the external coupling strength, the overall dominance of the resonator block is consistent with the internal coupling, and vice versa. Figure 6 If the internal magnetic coupling strength is less than the external electric coupling strength, the resonant block as a whole presents an electromagnetic hybrid coupling dominated by electric coupling. When the resonant block as a whole presents an electromagnetic hybrid coupling dominated by magnetic coupling, a transmission zero is introduced on the right side of the passband to improve out-of-band suppression; when the resonant block as a whole presents an electromagnetic hybrid coupling dominated by electric coupling, a transmission zero is introduced on the left side of the passband to improve out-of-band suppression; for example, Fig. 9 That is, the frequency response curve of the filter when a transmission zero is introduced on the left side of the passband. In addition, when the number of resonant cavities is set to at least three, cross coupling is formed between two non-adjacent resonant cavities.

[0050] The broadband dielectric filter of this embodiment is provided with an N-cavity dielectric resonator block 2, and can realize an electromagnetic hybrid coupling dielectric resonator block and a cross-coupling dielectric resonator block by adjusting the polarity and strength of the internal and external coupling, and introduce an out-of-band transmission zero point for the broadband dielectric filter. The dielectric resonator blocks can also be reasonably selected according to the requirements of the filter index, and connected through lumped elements 5, with higher degrees of freedom and modular design. The broadband dielectric filter has the characteristics of small size, wide bandwidth, high out-of-band suppression, low cost, etc., and can be used in modern communication systems.

[0051] As an improved solution of the above technical solution, it also includes:

[0052] The single-cavity dielectric resonator block 6 has a single resonant cavity, and the single-cavity dielectric resonator block 6 has at least one and is soldered on the PCB bottom plate 1. The single-cavity dielectric resonator block 6 and the N-cavity dielectric resonator block 2 are arranged side by side. Figure 1 and Figure 2 In the figure, it is a combination of one two-cavity dielectric resonator block and six single-cavity dielectric resonator blocks 6. It should be noted that when a combination of a single-cavity dielectric resonator block 6 and an N-cavity dielectric resonator block 2 is used, the lumped element 5 between the single-cavity dielectric resonator blocks 6 or between the single-cavity dielectric resonator blocks 6 and the N-cavity dielectric resonator blocks 2 can be a lumped capacitor or a lumped inductor or a spiral inductor, but the lumped element 5 corresponding to the N-cavity dielectric resonator block 2 needs to be determined according to its internal coupling form, for example Figure 1 If the internal structure is magnetically coupled, the lumped element 5 needs to be a lumped capacitor. Figure 2 If the internal part is electrically coupled, the lumped element 5 needs to be a lumped inductor or a spiral inductor. By combining the single-cavity dielectric resonator block 6 with the N-cavity dielectric resonator block 2, the degree of freedom of device design can be further improved to better meet the use requirements.

[0053] As an improved solution of the above technical solution, it also includes:

[0054] The high-frequency PCB small board 7 is arranged along the side-by-side direction of the N-cavity dielectric resonator block 2 and welded on the PCB bottom plate 1, and the metal pad 4 is welded on the high-frequency PCB small board 7; the feed pad 8 is welded on the PCB bottom plate 1 and connected to the two ends of the high-frequency PCB small board 7 along the side-by-side direction; the bottom port pad 9 is located at the corner of the PCB bottom plate 1 and connected to the feed pad 8. The use of the high-frequency PCB small board 7 can realize a modular design, and the required components can be welded on it in advance and then assembled with other parts; otherwise, it is not easy to assemble first and then weld the components on such a precise device. The function of the feed pad 8 and the bottom port pad 9 is to vertically guide the electrical signal from the lower layer of the PCB bottom plate 1 to the upper layer of the PCB bottom plate 1 through the metallized vias. The connection structure is simple and easy to process.

[0055] The dielectric resonator block provided in this embodiment is mainly used in the design of dielectric filters, and the provided dielectric filters are used for wireless communication RF front ends, WeChat communication RF front ends, and RF front ends of Radi equipment.

[0056] Embodiment 2

[0057] This embodiment provides a transceiver channel, including the aforementioned broadband dielectric filter.

[0058] Embodiment 3

[0059] This embodiment provides a base station or a satellite, comprising the aforementioned transceiver channel.

[0060] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A broadband dielectric filter, characterized in that: include: PCB base plate (1); An N-cavity dielectric resonator block (2) is provided with at least one and is welded side by side on the PCB bottom plate (1); the N-cavity dielectric resonator block (2) has N resonant cavities and N≧2; two adjacent resonant cavities among the N resonant cavities are internally magnetically coupled or electroplated metal surfaces (10) are added to the end surfaces to achieve internal electrical coupling; when two adjacent resonant cavities among the N resonant cavities are internally electrically coupled, the two electroplated metal surfaces (10) are tooth-shaped matched and a gap is left at the joint; At least two metal lead bars (3) are provided and correspond to the resonant cavities one by one, one end of which is inserted into the resonant cavity and the other end is led out of the resonant cavity; A metal pad (4) is welded to the other end of the metal lead strip (3) and is directly or indirectly welded to the PCB bottom plate (1); A lumped element (5), wherein the lumped element (5) is a lumped capacitor or a lumped inductor, wherein the lumped capacitor is used to form an electric coupling, and the lumped inductor is used to form a magnetic coupling, and is welded between two adjacent metal pads (4) and is suitable for forming an external coupling, wherein when two adjacent resonant cavities form an internal magnetic coupling, the external coupling is an electric coupling, and when two adjacent resonant cavities form an internal electric coupling, the external coupling is a magnetic coupling.

2. The broadband dielectric filter according to claim 1, characterized in that: The lumped element (5) is a spiral inductor, and the spiral inductor is used to form magnetic coupling.

3. The broadband dielectric filter according to claim 1, characterized in that: Also includes: A single-cavity dielectric resonator block (6) is provided with a single resonant cavity therein, the single-cavity dielectric resonator block (6) is provided with at least one and all are welded on the PCB bottom plate (1), and the single-cavity dielectric resonator block (6) and the N-cavity dielectric resonator block (2) are arranged side by side.

4. The broadband dielectric filter according to claim 3, characterized in that: Also includes: A high-frequency PCB small board (7) is arranged in a parallel direction along the N-cavity dielectric resonant block (2) and is welded on the PCB bottom board (1); and the metal pad (4) is welded on the high-frequency PCB small board (7).

5. The broadband dielectric filter according to claim 4, characterized in that: Also includes: A feeding pad (8) is welded on the PCB bottom plate (1) and connected to two ends of the high-frequency PCB small plate (7) along a side-by-side direction.

6. The broadband dielectric filter according to claim 5, characterized in that: Also includes: The bottom port pad (9) is located at a corner of the PCB bottom plate (1) and is connected to the feeding pad (8).

7. The broadband dielectric filter according to claim 3, characterized in that: The metal connecting strip (3) is bent at a right angle.

8. A transceiver channel, characterized in that: A broadband dielectric filter comprising any one of claims 1 to 7.

9. A base station, characterized in that: It comprises the transceiver channel as claimed in claim 8.

10. A satellite, characterized in that: It comprises the transceiver channel as claimed in claim 8.

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