Soldering needle device

Abstract

The present disclosure provides a welding needle device. The welding needle device is designed to include: a first surface and a second surface which are oppositely arranged, and a wire hole penetrating through the first surface and the second surface; the second surface includes a cut-off portion and a plurality of grooves, the cut-off portion is arranged around the wire hole, and the plurality of grooves are arranged around the cut-off portion; when a second solder joint is formed on the circuit layer, a stepped shape is formed between the cut-off portion and the grooves of the welding needle device to press the metal wire into a flat shape, and the welding needle device does not come into direct contact with the circuit layer, thereby avoiding abrasion caused by friction between the welding needle device and the circuit layer, reducing the influence of the abrasion of the welding needle device on the production capacity and yield of the wire bonding process, and reducing the loss cost due to the loss of the welding needle.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor technology, and more particularly to a capillary device. Background Art

[0002] Wire bonding is one of the processes for integrated circuit packaging. It is mainly a technology that uses metal wires with a wire diameter of 15 - 50 microns to connect the chip and the fingers (finger / lead) or substrate of the lead frame, enabling the tiny chip to communicate with the external circuit. According to the capillary conditions of different shapes, wire bonding can be divided into two types: ball bonding and wedge bonding. Both of these bonding methods have two welding points, namely the first solder joint (1st bond) at the chip end and the second solder joint (2nd bond) at the lead frame end or the substrate. Among them, the capillary is a device installed on the wire bonder. After the metal wire passes through the capillary and completes the first solder joint at the chip end under pressure, the robotic arm rises to draw the metal wire out of the capillary, and then moves the metal wire to the second solder joint on the lead frame or the substrate, while pressing down and cutting off the metal wire to complete a wire bonding cycle.

[0003] Ball bonding mainly goes through a high - voltage discharge process of Electronic Flame Off (EFO) to melt the wire protruding from the capillary. Due to surface tension, the metal liquid will solidify into a spherical shape. At this time, it is pressed down onto the chip, and then the lead wire is lifted upward, passes through a set path, winds around to the second solder joint, and directly introduces megasonic to the capillary and presses down to cut off the metal wire to form a second solder joint similar to a stitch. The size of the solder joint is about 2.5 - 5 times the wire diameter. However, during the process of cutting off the metal wire at the second solder joint, since the front end of the capillary contacts the surface of the finger of the lead frame or the substrate with ultrasonic vibration, over time, the problem of capillary wear occurs. Summary of the Invention

[0004] The present disclosure provides a capillary device, including: a first surface and a second surface arranged opposite to each other, and a wire hole penetrating through the first surface and the second surface;

[0005] The second surface includes a wire - cutting portion and a plurality of grooves. The wire - cutting portion is arranged around the wire hole, and the plurality of grooves are arranged around the wire - cutting portion.

[0006] In some alternative embodiments, the wire hole can be used to accommodate a metal wire extending from the first surface to the second surface, and the metal wire extends from the wire hole to the wire - cutting portion and the grooves.

[0007] In some alternative embodiments, the cutting line portion can be used to extrude the metal wire so that the extruded portion of the metal wire forms a flat shape.

[0008] In some alternative embodiments, the device further comprises: a clamping portion disposed opposite to the first surface;

[0009] When the cutting line portion extrudes the metal wire, the clamping portion can be used to clamp one end of the metal wire near the first surface and pull it in a direction away from the first surface, so that the metal wire breaks at the portion extruded by the cutting line portion.

[0010] In some alternative embodiments, an inclined portion is provided between the wire hole and the cutting line portion.

[0011] In some alternative embodiments, the included angle between the end face of the inclined portion and the inner wall of the wire hole is an obtuse angle.

[0012] In some alternative embodiments, the included angle between the end face of the inclined portion and the lower surface of the cutting line portion is an obtuse angle.

[0013] In some alternative embodiments, a stepped portion is provided between the cutting line portion and the groove.

[0014] In some alternative embodiments, the width of the groove tapers in the direction towards the cutting line portion.

[0015] In some alternative embodiments, a spacer portion is provided between two adjacent grooves.

[0016] In some alternative embodiments, the lower surface of the spacer portion is coplanar or substantially coplanar with the lower surface of the cutting line portion.

[0017] In some alternative embodiments, the plurality of grooves are arranged around the cutting line portion, including: the plurality of grooves are arranged around the cutting line portion at equal distances.

[0018] In the solder pin device provided by the present disclosure, by designing the solder pin device to include: a first surface and a second surface disposed opposite to each other, and a wire hole penetrating through the first surface and the second surface; the second surface includes a cutting line portion and a plurality of grooves, the cutting line portion is arranged around the wire hole, and the plurality of grooves are arranged around the cutting line portion; when forming a second solder joint on the circuit layer, a stepped shape is formed between the cutting line portion and the grooves of the solder pin device to press the metal wire into a flat shape, and the solder pin device does not come into direct contact with the circuit layer, thereby avoiding wear caused by friction between the solder pin device and the circuit layer, reducing the influence of the wear of the solder pin device on the production capacity and yield of the wire bonding process, and reducing the loss cost due to the loss of the solder pin. Description of the Drawings

[0019] Other features, objects, and advantages of the present disclosure will become more apparent from the following detailed description of non - limiting embodiments read in conjunction with the accompanying drawings:

[0020] Figure 1 is a schematic longitudinal cross - sectional structure diagram of an embodiment of a solder needle device according to the present disclosure;

[0021] Figure 2 is according to Figure 1 a schematic bottom - view structure diagram of the embodiment solder needle device;

[0022] Figure 3 is according to Figure 1 a schematic partial - structure diagram of the embodiment solder needle device;

[0023] Figure 4 is a schematic longitudinal structure diagram of another embodiment of the solder needle device according to the present disclosure in the wire - bonding process;

[0024] Figure 5 is Figure 1 a schematic diagram of the dimensional markings of the solder needle device corresponding to each main structure;

[0025] Figure 6 is Figure 2 a schematic diagram of the dimensional markings of the solder needle device corresponding to each main structure.

[0026] Symbol description:

[0027] 10a - first surface; 10b - second surface; 11 - wire hole; 12 - cutting line part; 13 - groove; 14 - inclined part; 15 - spacing part; 16 - stepped part; 17 - clamping part; 21 - metal wire; 22 - circuit layer; θ is the angle between the end face of the inclined part 14 and the inner wall of the wire hole 11; μ is the angle between the end face of the inclined part 14 and the lower surface of the cutting line part 12; h is the height of the stepped part 16; t is the length of the groove 13; m is the width of the spacing part 15 at the end near the cutting line part 12; n is the width of the spacing part 15 at the end far from the cutting line part 12; p is the width of the groove 13 at the end near the cutting line part 12; q is the width of the groove 14 at the end far from the cutting line part 12. Detailed implementation manners

[0028] The following describes the specific implementation manners of the present disclosure in conjunction with the drawings and embodiments. Those skilled in the art can easily understand the technical problems solved by the present disclosure and the technical effects produced through the content recorded in this specification. It can be understood that the specific embodiments described herein are only for explaining the relevant invention and are not intended to limit the invention. Additionally, for ease of description, only parts related to the relevant invention are shown in the drawings.

[0029] It should be noted that the structures, proportions, sizes, etc. shown in the accompanying drawings of the specification are only used to cooperate with the content recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present disclosure can be implemented. Therefore, they do not have substantial technical significance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that the present disclosure can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present disclosure. At the same time, the terms such as "upper", "first", "second", and "one" cited in this specification are only for the convenience of clear narration and are not used to limit the scope under which the present disclosure can be implemented. The change or adjustment of their relative relationships should also be regarded as the scope under which the present disclosure can be implemented without substantial change in the technical content.

[0030] It should also be noted that the longitudinal section corresponding to the embodiment of the present disclosure can be the section corresponding to the front view direction, the transverse section can be the section corresponding to the right view direction, and the horizontal section can be the section corresponding to the top view direction.

[0031] In addition, without conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other.

[0032] Reference Figure 1 and Figure 2 , Figure 1 is a schematic structural diagram of the longitudinal section of an embodiment of the solder pin device of the present disclosure, Figure 2 is according to Figure 1 the schematic bottom view structure diagram of the solder pin device of the embodiment.

[0033] As Figure 1 and Figure 2 shown, the solder pin device 100A includes: a first surface 10a and a second surface 10b which are oppositely arranged, and a wire hole 11 penetrating through the first surface 10a and the second surface 10b.

[0034] The second surface 10b includes a cut-off line part 12 and a plurality of grooves 13. The cut-off line part 12 is arranged around the wire hole 11, and the plurality of grooves 13 are arranged around the cut-off line part 12.

[0035] In some optional implementation manners, the plurality of grooves 13 are arranged around the cut-off line part 12, which may include: the plurality of grooves 13 are arranged around the cut-off line part 12 at equal intervals.

[0036] In some optional implementation manners, as Figure 1 shown, an inclined part 14 is arranged between the wire hole 11 and the cut-off line part 12. The inclined part 14 can prevent the metal wire from breaking due to abutting against a right angle during the wire bonding process.

[0037] In some optional implementation manners, the included angle between the end face of the inclined part 14 and the inner wall of the wire hole 11 is an obtuse angle.

[0038] In some alternative embodiments, the angle between the end face of the inclined portion 14 and the lower surface of the cut line portion 12 is an obtuse angle.

[0039] In some alternative embodiments, as Figure 1 shown, a stepped portion 16 is provided between the cut line portion 12 and the groove 13. The stepped portion 16 can press down a relatively large volume of the metal wire, making it easier to cut the metal wire.

[0040] In some alternative embodiments, as Figure 2 shown, the width of the groove 13 tapers in the direction towards the cut line portion 12.

[0041] Figure 3 is a partial structural schematic diagram of the bonding needle device according to Figure 1 the embodiment. In some alternative embodiments, as Figure 2 and Figure 3 shown, a spacing portion 15 is provided between two adjacent grooves 13.

[0042] In some alternative embodiments, the lower surface of the spacing portion 15 is coplanar or substantially coplanar with the lower surface of the cut line portion 12.

[0043] Here, two surfaces being substantially coplanar can be considered as: the height difference between the two surfaces is not greater than 5 micrometers (μm), not greater than 2 micrometers (μm), not greater than 1 micrometer (μm), or not greater than 0.5 micrometer (μm).

[0044] Continuing to refer to Figure 4 , Figure 4 is a longitudinal structural schematic diagram of another embodiment of the bonding needle device according to the present disclosure in the wire bonding process. Figure 4 The bonding needle device 400A shown is similar to Figure 1 the bonding needle device 100A shown therein, except that the bonding needle device 400A further includes: a clamping portion 17, which is disposed opposite to the first surface 10a.

[0045] The clamping portion 17 can be used to clamp one end of the metal wire 21 near the first surface 10a and pull it in a direction away from the first surface 10a when the cut line portion 12 presses on the metal wire 21, so that the metal wire 21 breaks at the place where it is pressed by the cut line portion 12.

[0046] The wire hole 11 can be used to accommodate the metal wire 21 extending from the first surface 10a to the second surface 10b, and the metal wire 21 extends from the wire hole 11 to the cut line portion 12 and the groove 13.

[0047] The cross-section part 12 can be used to extrude the metal wire 21 so that the extruded part of the metal wire 21 forms a flat shape. The flat shape formed at the extruded part of the metal wire 21 can prevent the cross-section part 12 from directly contacting the circuit layer 22, and avoid the loss of the cross-section part 12 caused by direct friction. In addition, the fish-tail forming during the formation of the second solder joint in the ball bonding is relatively unstable, and the speed of cutting the tail wire is too fast, which is likely to cause the situation that the wire tail cannot be left and the wire bonding equipment stops due to the broken tail. By extruding the metal wire 21 through the cross-section part 12 to form a flat extrusion part, the situation that the wire bonding equipment stops due to the formation of a fish-tail shape like in the ball bonding can be avoided.

[0048] Here, as Figure 4 shown, the cross-section part 12 extrudes the metal wire 21 corresponding to the circuit layer 22 so that the metal wire 21 is extruded to form a flat shape between the cross-section part 12 and the circuit layer 22.

[0049] Here, the circuit layer 22 can be a substrate, a redistribution layer, or a circuit layer on the active surface of an electronic component for external electrical connection.

[0050] Figure 5 For Figure 1 the schematic diagram of the dimension marks of the wire bonding device corresponding to each main structure, as Figure 5 shown, where:

[0051] θ is the angle between the end face of the inclined part 14 and the inner wall of the wire hole 11, 90° < θ < 180°;

[0052] μ is the angle between the end face of the inclined part 14 and the lower surface of the cross-section part 12, 90° < μ < 180°;

[0053] h is the height of the stepped part 16, 10 μm ≤ h ≤ 17 μm;

[0054] t is the length of the groove 13, 10 μm ≤ t ≤ 16 μm.

[0055] Figure 6 For Figure 2 the schematic diagram of the dimension marks of the wire bonding device corresponding to each main structure, as Figure 6 shown, where:

[0056] m is the width of the spacer part 15 near the cross-section part 12 end, 1.93 μm ≤ m ≤ 3.50 μm;

[0057] n is the width of the spacer part 15 far from the cross-section part 12 end, 3.14 μm ≤ n ≤ 5.44 μm;

[0058] p is the width of the groove 13 near the cross-section part 12 end, 3.86 μm ≤ p ≤ 7.00 μm;

[0059] q is the width of the groove 14 away from the end of the intercepting line portion 12, and 6.28 microns ≤ q ≤ 10.88 microns.

[0060] Although the present disclosure has been described and illustrated with reference to specific embodiments thereof, such description and illustration do not limit the present disclosure. Those skilled in the art will clearly understand that various changes can be made and equivalent components can be substituted within the embodiments without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The drawings may not necessarily be drawn to scale. There may be differences between the technical reproduction and the actual implementation in the present disclosure due to variables in the manufacturing process and the like. There may be other embodiments of the present disclosure that are not specifically described. The specification and the drawings should be regarded as illustrative rather than restrictive. Modifications can be made to adapt a particular situation, material, composition of matter, method, or process to the objectives, spirit, and scope of the present disclosure. All such modifications fall within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations can be combined, subdivided, or reordered without departing from the teachings of the present disclosure to form equivalent methods. Accordingly, unless specifically indicated herein, the order and grouping of the operations do not limit the present disclosure.

Claims

1. A welding needle device, comprising: A first surface and a second surface disposed opposite to each other, and a wire hole penetrating through the first surface and the second surface; The second surface includes a cut-off line portion and a plurality of grooves, the cut-off line portion is disposed around the wire hole, and the plurality of grooves are disposed around the cut-off line portion; An interval portion is provided between two adjacent grooves, and the lower surface of the interval portion is coplanar or substantially coplanar with the lower surface of the cut-off line portion; The grooves extend along the radial direction of the wire hole, and the interval portion extends along the radial direction of the wire hole; t is the length of the groove, 10 μm ≤ t ≤ 16 μm; p is the width of the groove near the cut-off line portion, 3.86 μm ≤ p ≤ 7.00 μm; q is the width of the groove far from the cut-off line portion, 6.28 μm ≤ q ≤ 10.88 μm; m is the width of the interval portion near the cut-off line portion, 1.93 μm ≤ m ≤ 3.50 μm; n is the width of the interval portion far from the cut-off line portion, 3.14 μm ≤ n ≤ 5.44 μm.

2. The device according to claim 1, wherein, The wire hole can be used to accommodate a metal wire extending from the first surface to the second surface, and the metal wire extends from the wire hole to the cut-off line portion and the grooves.

3. The device according to claim 2, wherein, The cut-off line portion can be used to squeeze the metal wire so that a flat shape is formed at the squeezed portion of the metal wire.

4. The device according to claim 3, wherein, The device further includes: a clamping portion, disposed opposite to the first surface; When the cut-off line portion squeezes the metal wire, the clamping portion can clamp one end of the metal wire near the first surface and pull it in a direction away from the first surface, so that the metal wire breaks at the portion squeezed by the cut-off line portion.

5. The device according to claim 1, wherein, An inclined portion is provided between the wire hole and the cut-off line portion.

6. The device according to claim 1, wherein, A stepped portion is provided between the cut-off line portion and the grooves.

7. The device according to claim 1, wherein, The width of the groove tapers in the direction towards the cut-off line portion.

8. The device according to claim 1, wherein, The plurality of grooves are disposed around the cut-off line portion, including: The plurality of grooves are equidistantly disposed around the cut-off line portion.

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