heat dissipating device

Abstract

The present application provides a heat dissipation device. The heat dissipation device includes a vapor chamber unit; at least one first vapor cavity unit and at least one second vapor cavity unit disposed on the outer surface of the vapor chamber unit; at least one first tower fin group disposed on the outer surface of the vapor chamber unit to cover the first vapor cavity unit and the second vapor cavity unit, and partially expose the second vapor cavity unit; and at least one second tower fin group disposed on part of the surface of the first tower fin group to cover the exposed part of the second vapor cavity unit.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation, and in particular to a heat dissipation device with a vapor chamber and fin groups. BACKGROUND

[0002] According to modern needs, computers and various electronic devices are rapidly developed and their performance is continuously improved. However, in this process, the heat dissipation problem caused by high-performance hardware also comes along. Generally, computers and various electronic devices usually use heat dissipation elements to dissipate heat, such as using thermal paste or heat sinks to attach to the electronic components to be cooled to absorb and dissipate heat. However, this kind of heat dissipation method has limited effect, so heat dissipation elements using phase change of working fluid to promote heat conduction are developed.

[0003] The above-mentioned heat dissipation element uses the phase change and flow direction of the working fluid to achieve the purpose of heat transfer, but when facing high heat generated by high-power processors, it still cannot effectively dissipate high heat, and has the problem of poor heat dissipation efficiency.

[0004] Therefore, how to provide a heat dissipation device that can solve the above problems is one of the urgent problems to be overcome in the industry at present. SUMMARY

[0005] The purpose of the present application is to provide a heat dissipation device that can improve heat dissipation effect.

[0006] The heat dissipation device of the present application comprises: a vapor chamber unit; at least one first vapor chamber unit and at least one second vapor chamber unit arranged on the outer surface of the vapor chamber unit; at least one first tower fin group arranged on the outer surface of the vapor chamber unit to cover the first vapor chamber unit and the second vapor chamber unit, and partially expose the second vapor chamber unit; and at least one second tower fin group arranged on part of the surface of the first tower fin group to cover the exposed part of the second vapor chamber unit.

[0007] In the heat dissipation device as described above, at least one third vapor chamber unit is arranged on the outer surface of the vapor chamber unit.

[0008] In the heat dissipation device as described above, the number of the first vapor chamber unit, the second vapor chamber unit and the third vapor chamber unit is multiple, the first vapor chamber unit is arranged at both ends of the vapor chamber unit, the second vapor chamber unit is arranged between each first vapor chamber unit and at both ends of the vapor chamber unit, and the third vapor chamber unit is arranged on the middle part of the vapor chamber unit between the first vapor chamber unit or the second vapor chamber unit.

[0009] In the heat dissipation device as in the preceding, the third vapor cavity unit has a tube portion and a bent portion, one end of the tube portion is disposed on the outer surface of the vapor chamber unit, the bent portion is formed by bending and extending from the other end of the tube portion, and the direction of the bent portion bending and extending is toward the side edge of the vapor chamber unit.

[0010] In the heat dissipation device as in the preceding, further comprising at least a first vertical fin group and a second vertical fin group, the first vertical fin group is disposed on the outer surface of the vapor chamber unit and attached to one side of the tube portion of the third vapor cavity unit, and the second vertical fin group is disposed on the outer surface of the vapor chamber unit and attached to the other side of the tube portion of the third vapor cavity unit.

[0011] In the heat dissipation device as in the preceding, the fin arrangement direction of the first vertical fin group and the second vertical fin group is different from the fin arrangement direction of the first tower fin group or the second tower fin group.

[0012] In the heat dissipation device as in the preceding, the height of the second vertical fin group is higher than the height of the third vapor cavity unit extending from the outer surface, and the height of the first vertical fin group is lower than the height of the third vapor cavity unit extending from the outer surface.

[0013] In the heat dissipation device as in the preceding, further comprising at least a third vertical fin group, which is disposed on the first vertical fin group and the first tower fin group and attached to the side of the second tower fin group, and sleeved on the bent portion of the third vapor cavity unit, wherein the fin arrangement direction of the third vertical fin group is the same as the fin arrangement direction of the first vertical fin group or the second vertical fin group.

[0014] In the heat dissipation device as in the preceding, the third vertical fin group exposes the end of the bent portion extending toward the side edge of the vapor chamber unit.

[0015] In the heat dissipation device as in the preceding, the first vapor cavity unit is plate-shaped, and the second vapor cavity unit and the third vapor cavity unit are tube-shaped.

[0016] In the heat dissipation device as in the preceding, the inner portions of the first vapor cavity unit, the second vapor cavity unit and the third vapor cavity unit respectively have hollow portions, the vapor chamber unit has a chamber inside, and the chamber and each of the hollow portions are in communication with each other.

[0017] In the heat dissipation device as in the preceding, the vapor chamber unit comprises an upper plate, a lower plate and a metal block, the upper plate and the lower plate are combined to form the chamber, and the metal block is disposed on the lower plate and extends to opposite sides of the chamber, and forms an airflow passage with the upper plate.

[0018] As the heat dissipation device, the chamber is filled with working fluid blocked by the metal block.

[0019] As the heat dissipation device, the vapor chamber unit further comprises at least two first capillary structures and at least two second capillary structures, each of the first capillary structures is arranged on the lower plate and contacts two sides of the metal block respectively, each of the second capillary structures is arranged on the lower plate and connects the first capillary structures, and extends to the projection position of the first vapor chamber unit or the second vapor chamber unit on the lower plate.

[0020] As the heat dissipation device, each of the second capillary structures further extends into the hollow part of the first vapor chamber unit or the second vapor chamber unit.

[0021] As the heat dissipation device, the vapor chamber unit further comprises a plurality of spacer metal blocks, which are arranged on the lower plate and extend to one of the other two opposite sides of the chamber.

[0022] As the heat dissipation device, the metal block and each of the first capillary structures are located near the geometric center of each of the third vapor chamber units, and are located above the heat source contacted by the vapor chamber unit.

[0023] As the heat dissipation device, the height of the first vapor chamber unit extending from the outer surface is lower than the height of the second vapor chamber unit extending from the outer surface.

[0024] As the heat dissipation device, the fin arrangement direction of the first tower fin group and the second tower fin group is the same as the direction of the first vapor chamber unit and the second vapor chamber unit extending from the outer surface of the vapor chamber unit.

[0025] As the heat dissipation device, the first tower fin group exposes the top surface of the first vapor chamber unit.

[0026] As the heat dissipation device, the second tower fin group exposes the top surface of the second vapor chamber unit.

[0027] The beneficial effects of the present application are that the special arrangement design of the first and second tower fin groups and the first, second and third vertical fin groups in the heat dissipation device of the present application can increase the heat dissipation efficiency between each fin, reduce the flow resistance of the airflow flowing through the fin group, and increase the fluid disturbance degree between each fin group, resulting in an increase in disorder, thereby greatly improving the overall heat dissipation performance, so it can be beneficial to be used on high-power processors. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 It is the overall schematic diagram of the heat dissipation device of the present application.

[0029] Figure 2FIG. 1 is an exploded perspective view of a heat dissipation device according to the present application.

[0030] Figure 3 FIG. 2 is another exploded perspective view of a heat dissipation device according to the present application.

[0031] Figure 4 FIG. 3 is a perspective view of a vapor chamber unit of a heat dissipation device according to the present application.

[0032] Figure 5 FIG. 4 is a top view of a lower plate of a vapor chamber unit of a heat dissipation device according to the present application.

[0033] Figure 6 FIG. 5 is a side view of a vapor chamber unit of a heat dissipation device according to the present application.

[0034] Figure 7 FIG. 6 is a cross-sectional view of a vapor chamber unit according to the present application. Figure 4

[0035] The reference numerals are as follows:

[0036] 1: heat dissipation device

[0037] 10: vapor chamber unit

[0038] 101: upper plate

[0039] 1011: outer surface

[0040] 102: lower plate

[0041] 103: cavity

[0042] 104: metal block

[0043] 105: air flow passage

[0044] 106: first capillary structure

[0045] 107: second capillary structure

[0046] 108: spacer metal block

[0047] 109: liquid passage

[0048] 11: first vapor cavity unit

[0049] 111, 121, 133: hollow portion

[0050] 112, 122, 132: projection position

[0051] 12: second vapor cavity unit

[0052] 13: third vapor cavity unit

[0053] 131: pipe body portion​

[0054] 132: Bending section

[0055] 21: First tower-shaped fin group

[0056] 211,212,221,331: Holes

[0057] 22: Second tower-shaped fin group

[0058] 31: First vertical fin group

[0059] 32: Second vertical fin group

[0060] 33: Third vertical fin group

[0061] 40: Heat source

[0062] C: Geometric Center

[0063] E: Area Detailed Implementation

[0064] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification, and can also implement or apply it through other different specific embodiments.

[0065] Please also refer to Figure 1 , Figure 2 and Figure 3 , Figure 1 This is an overall schematic diagram of the heat dissipation device 1 of the present invention. Figure 2 This is an exploded view showing the second tower-shaped fin group 22 and the third vertical fin group 33 in the heat dissipation device 1 of the present invention. Figure 3 An exploded view showing the first tower-shaped fin group 21, the first vertical fin group 31, and the second vertical fin group 32, in order to conceal the second tower-shaped fin group 22 and the third vertical fin group 33 in the heat dissipation device 1 of the present invention. Figure 4 This is a schematic diagram of the overall heat dissipation device 1 of the present invention, specifically the heat dissipation plate unit 10. The heat dissipation device 1 of the present invention includes a heat dissipation plate unit 10 and multiple fin groups (such as first and second tower-type fin groups 21 and 22, first, second, and third vertical fin groups 31, 32, and 33, etc.) stacked on the heat dissipation plate unit 10. The fin group mentioned herein refers to a structure formed by multiple fins arranged at intervals. Its technical content will be further described below.

[0066] In this embodiment, as Figure 4As shown, at least one first steam chamber unit 11, at least one second steam chamber unit 12, and at least one third steam chamber unit 13 are provided on the outer surface 1011 of the heat spreader unit 10. Specifically, the first steam chamber unit 11, the second steam chamber unit 12, and the third steam chamber unit 13 are formed by extending outward from the outer surface 1011 of the heat spreader unit 10, and the direction of extension can be arbitrary, preferably perpendicular to the outer surface 1011, but the present invention is not limited thereto. In addition, the first steam chamber unit 11, the second steam chamber unit 12, and the third steam chamber unit 13 can be integrally formed with the heat spreader unit 10, or welded to the outer surface 1011 of the heat spreader unit 10 by a welding process, but the present invention is not limited thereto.

[0067] In one embodiment, the number of the first vapor chamber unit 11, the second vapor chamber unit 12, and the third vapor chamber unit 13 may each be multiple, for example... Figure 4 The invention shows six first steam chamber units 11, four second steam chamber units 12, and four third steam chamber units 13, but the invention is not limited thereto, and the number can be increased or decreased according to needs.

[0068] In one embodiment, the first vapor chamber unit 11 is plate-shaped, such as a vapor chamber type heat dissipation element. The second vapor chamber unit 12 and the third vapor chamber unit 13 are tube-shaped, such as heat pipe type heat dissipation elements, and their radial cross-section can be circular, elliptical, or polygonal. The invention is not limited to the above description.

[0069] In this embodiment, a plurality of first steam chamber units 11 are spaced apart at both ends of the heat spreader unit 10. For example, the plurality of first steam chamber units 11 are respectively disposed at both ends of the heat spreader unit 10 along the long side direction and are spaced apart along the short side direction of the heat spreader unit 10. A plurality of second steam chamber units 12 are disposed between each of the first steam chamber units 11 and at both ends of the heat spreader unit 10, for example, spaced apart between each of the first steam chamber units 11 along the short side direction of the heat spreader unit 10. A third steam chamber unit 13 is disposed in the middle of the heat spreader unit 10, that is, between the first steam chamber units 11 located at both ends of the heat spreader unit 10 and the second steam chamber units 12. More specifically, the third steam chamber unit 13 may be disposed on the line connecting the second steam chamber units 12 located at both ends of the heat spreader unit 10, and this line may be parallel to the long side of the heat spreader unit 10. The positions of the first steam chamber unit 11, the second steam chamber unit 12 and the third steam chamber unit 13 can be modified according to requirements, and the present invention is not limited thereto.

[0070] In this embodiment, the third steam chamber unit 13 has a tube body 131 and a bent portion 132. One end of the tube body 131 is disposed on the outer surface 1011 of the heat spreader unit 10. The bent portion 132 is formed by bending and extending the other end of the tube body 131. The direction of bending and extending of the bent portion 132 can be towards the outside of the heat spreader unit 10 (e.g., towards the side of the heat spreader unit 10), and the bending angle can be approximately a right angle, but the present invention is not limited thereto.

[0071] In this embodiment, as Figure 3 As shown, the first tower-shaped fin assembly 21 can be disposed on the outer surface 1011 of the heat spreader unit 10 to accommodate the first vapor chamber unit 11 and the second vapor chamber unit 12. For example, the first tower-shaped fin assembly 21 can have holes 211 and 212 penetrating its two sides to respectively accommodate the first vapor chamber unit 11 and the second vapor chamber unit 12. The shape of the hole 211 can be approximately the shape of the first vapor chamber unit 11, so that it can be completely fitted, and the first vapor chamber unit 11 can be completely accommodated in the hole 211. The shape of the hole 212 can be approximated to the shape of the second steam chamber unit 12, for example, the shape of the cross section along the radial direction. However, since the height of the first steam chamber unit 11 extending from the outer surface 1011 is lower than the height of the second steam chamber unit 12 extending from the outer surface 1011, after the holes 211 and 212 of the first tower-shaped fin assembly 21 respectively accommodate the first steam chamber unit 11 and the second steam chamber unit 12, part of the second steam chamber unit 12 is still exposed above the first tower-shaped fin assembly 21.

[0072] In one embodiment, the number of first tower-shaped fin groups 21 may be two, which are respectively disposed at the two ends of the heat spreader unit 10 to accommodate the first steam chamber unit 11 and the second steam chamber unit 12. However, the present invention is not limited thereto, and the number of first tower-shaped fin groups 21 may also be changed according to the design requirements.

[0073] In one embodiment, the fin arrangement direction of the first tower-shaped fin group 21 may be the same as the direction in which the first vapor chamber unit 11 and the second vapor chamber unit 12 extend from the outer surface 1011 of the heat spreader unit 10, so as to maximize the heat dissipation efficiency of the first vapor chamber unit 11 and the second vapor chamber unit 12.

[0074] In this embodiment, the first vertical fin group 31 is disposed on the outer surface 1011 of the heat spreader unit 10, for example, along the long side of the heat spreader unit 10 and attached to one side of the tube body portion 131 of the third steam chamber unit 13. Specifically, there may be two first vertical fin groups 31, which are disposed along two long sides of the heat spreader unit 10 and attached to the side of the tube body portion 131 of different third steam chamber units 13 adjacent to the long side of the heat spreader unit 10. The second vertical fin group 32 is also disposed on the outer surface 1011 of the heat spreader unit 10 and attached to the other side of the tube body portion 131 of the third steam chamber unit 13. Specifically, there may be one second vertical fin group 32, which is disposed between two third steam chamber units 13 and simultaneously attached to the side of the tube body portion 131 of different third steam chamber units 13 away from the long side of the heat spreader unit 10.

[0075] In one embodiment, the fin arrangement direction of the first vertical fin group 31 may be the same as or different from the fin arrangement direction of the second vertical fin group 32. However, the fin arrangement directions of the first vertical fin group 31 and the second vertical fin group 32 must be different from the fin arrangement direction of the first tower-shaped fin group 21. This is mainly because the fin arrangement direction of the first tower-shaped fin group 21 is designed to maximize the heat dissipation efficiency of the first vapor chamber unit 11 and the second vapor chamber unit 12, while the fin arrangement directions of the first vertical fin group 31 and the second vertical fin group 32 are designed to simultaneously dissipate heat from the heat spreader unit 10 and the tube body portion 131 of the third vapor chamber unit 13.

[0076] In one embodiment, the height of the second vertical fin assembly 32 is higher than the height of the third vapor chamber unit 13 extending from the outer surface 1011, and the height of the first vertical fin assembly 31 is lower than the height of the third vapor chamber unit 13 extending from the outer surface 1011. Specifically, since the third vapor chamber unit 13 has a bend 132, the first vertical fin assembly 31 must be accommodated between the heat spreader unit 10 and the bend 132, resulting in the height of the first vertical fin assembly 31 being lower than the height between the bend 132 and the outer surface 1011 of the third vapor chamber unit 13. Furthermore, since the placement of the second vertical fin assembly 32 is not obstructed by the bend 132, to improve heat dissipation efficiency, the height of the second vertical fin assembly 32 can be higher than the overall height of the third vapor chamber unit 13 extending from the outer surface 1011.

[0077] In one embodiment, after the first tower-shaped fin group 21, the first vertical fin group 31, and the second vertical fin group 32 are respectively disposed on the outer surface 1011 of the heat spreader unit 10, please refer to further details. Figure 2A second tower-shaped fin group 22 and a third vertical fin group 33 can be respectively provided on the first tower-shaped fin group 21 and the first vertical fin group 31. Specifically, the second tower-shaped fin group 22 can be provided on a part of the surface of the first tower-shaped fin group 21, and completely or partially cover the exposed part of the second vapor chamber unit 12. For example, the second tower-shaped fin group 22 has holes 221 penetrating both sides of it. The shape of the holes 221 can be approximately the shape of the second vapor chamber unit 12, such as the shape of the cross section along the radial direction, to accommodate the part of the second vapor chamber unit 12 that is not covered by the first tower-shaped fin group 21, so that the second vapor chamber unit 12 does not protrude or protrudes from the top surface of the second tower-shaped fin group 22. In one embodiment, the fin arrangement direction of the second tower-shaped fin group 22 may be the same as that of the first tower-shaped fin group 21, that is, the same as the direction in which the second vapor chamber unit 12 extends from the outer surface 1011 of the heat spreader unit 10, but different from the fin arrangement directions of the first vertical fin group 31 and the second vertical fin group 32. In another embodiment, there may be two second tower-shaped fin groups 22, respectively disposed on portions of the surface of the first tower-shaped fin group 21 located at both ends of the heat spreader unit 10. However, the present invention is not limited thereto, and the number of second tower-shaped fin groups 22 may be changed according to requirements. In addition, the second vertical fin group 32 may be adjacent to the second tower-shaped fin group 22 and located between the two second tower-shaped fin groups 22.

[0078] The third vertical fin group 33 is simultaneously disposed on the first vertical fin group 31 and the first tower-shaped fin group 21, and is attached to the side of the second tower-shaped fin group 22, and is fitted with the bent portion 132 of the third vapor chamber unit 13. Specifically, the third vertical fin group 33 has holes 331 penetrating both sides of it, and the shape of the holes 331 can approximate the shape of the bent portion 132 of the third vapor chamber unit 13, for example, the shape of the cross section along the radial direction, to accommodate the bent portion 132. In one embodiment, the fin arrangement direction of the third vertical fin group 33 is the same as the fin arrangement direction of the first vertical fin group 31 or the second vertical fin group 32. In addition, the number of third vertical fin groups 33 can be two, respectively disposed on the two first vertical fin groups 31 and spanning the surface of the first tower-shaped fin group 21 located at both ends of the heat spreader unit 10, with the second tower-shaped fin group 22 sandwiched between them. However, the present invention is not limited thereto, and the number of third vertical fin groups 33 can also be changed according to the requirements of the design.

[0079] In this embodiment, after the fin groups are arranged on the outer surface 1011 of the heat spreader unit 10, the top surface of the second tower-shaped fin group 22 can be flush with the top surfaces of the second vertical fin group 32 and the third vertical fin group 33, and the sides of the first tower-shaped fin group 21, the second tower-shaped fin group 22, and the third vertical fin group 33 can be flush. Furthermore, although the fin arrangement direction of the first tower-shaped fin group 21 and the second tower-shaped fin group 22 is different from the fin arrangement direction of the first vertical fin group 31 and the second vertical fin group 32, the gaps between the fins of the first tower-shaped fin group 21 and the second tower-shaped fin group 22 are connected to the gaps between the fins of the first vertical fin group 31 and the second vertical fin group 32, allowing airflow (e.g. from...) Figure 1 (Flowing in from the left) can flow smoothly and sequentially through ( Figure 1 Left side) First tower-shaped fin group 21 / Second tower-shaped fin group 22, First vertical fin group 31 / Second vertical fin group 32, and then flowing through ( Figure 1 (Right side) First tower-shaped fin group 21 / second tower-shaped fin group 22, to dissipate heat from the tube body 131 of the first vapor chamber unit 11, the second vapor chamber unit 12, and the third vapor chamber unit 13. Additionally, airflow can simultaneously originate from ( Figure 1 (Left side) The third vertical fin group 33 flows in from one end and from the other end ( Figure 1 (From the right side) it flows out to dissipate heat from the bend 132 of the third vapor chamber unit 13.

[0080] In one embodiment, the holes 211 of the first tower-shaped fin group 21 can expose the top surface of the first steam chamber unit 11, the holes 221 of the second tower-shaped fin group 22 can expose the top surface of the second steam chamber unit 12, and the holes 331 of the third vertical fin group 33 can expose the end of the bent portion 132 of the third steam chamber unit 13 extending toward the side of the heat spreader unit 10, but the present invention is not limited thereto.

[0081] Please refer to the following for further information. Figure 5 , Figure 6 and Figure 7 This is to illustrate the internal structure of the heat exchanger unit 10. For example... Figure 6 As shown, the heat spreader unit 10 can be formed by combining an upper plate 101 and a lower plate 102 to form a chamber 103 inside. The first steam chamber unit 11 has a hollow portion 111 inside, the second steam chamber unit 12 has a hollow portion 121 inside, and the third steam chamber unit 13 has a hollow portion 133 inside, wherein the hollow portions 111, 121, and 133 are interconnected with the chamber 103.

[0082] like Figure 5As shown, the heat spreader unit 10 may further include a metal block 104, which may be disposed on the lower plate 102, specifically located in the chamber 103 and extending to opposite sides of the chamber 103. For example, the metal block 104 may be strip-shaped with its two ends extending to opposite long sides of the chamber 103. Figure 7 As shown, although the metal block 104 is disposed on the lower plate 102, it does not contact the upper plate 101, but forms a gap between them, which can serve as an airflow channel 105. Specifically, the chamber 103 is filled with working fluid, and the height of the working fluid after filling is lower than the height of the metal block 104 after it is disposed on the lower plate 102. This causes the working fluid to be blocked by the metal block 104 and located at both ends of the chamber 103. In the liquid state, they cannot flow to each other, but in the gaseous state, they can flow to each other through the airflow channel 105.

[0083] In one embodiment, the heat spreader unit 10 further includes at least two first capillary structures 106 and at least two second capillary structures 107. Each first capillary structure 106 may be disposed on the lower plate 102 and respectively contact the two sides of the metal block 104, that is, each first capillary structure 106 can use the metal block 104 as its boundary and is partitioned by the metal block 104. Each second capillary structure 107 may be disposed on the lower plate 102, with one end connected to the first capillary structure 106 and the other end extending to the vicinity of the projection positions 112 and 122 of the first vapor chamber unit 11 or the second vapor chamber unit 13 on the lower plate 102. Specifically, in this embodiment, a plurality of liquid channels 109 can be formed on the surface of the lower plate 102. The plurality of liquid channels 109 can be regarded as capillary layers for filling working fluid. For example, the liquid channels 109 can be formed by sintered particles, metal mesh, trenches or combinations thereof. The sintered particles refer to a tissue or structure with multiple capillary pores or interconnected pores formed by sintering metal powder. The metal mesh refers to a woven mesh with multiple meshes made of metal. The trenches refer to multiple pillars etched into the surface of the lower plate 102 by wet etching. The gaps between the multiple pillars can form multiple interconnected trenches. The first capillary structure 106 and the second capillary structure 107 are structures formed on the plurality of liquid channels 109. For example, they can be structures made of fiber, sintered particles or metal mesh. The first capillary structure 106 is rectangular, and the second capillary structure 107 can be elongated. In other embodiments, when each of the second capillary structures 107 is a fiber or a metal mesh, the other end of each of the second capillary structures 107, in addition to extending to the projected positions 112, 122, can also extend upward into the hollow portions 111, 121 of the first vapor chamber unit 11 or the second vapor chamber unit 12. In this case, the second capillary structure 107 located in the hollow portions 111, 121 is either not fixed or fixed to the inner wall (not shown) of the first vapor chamber unit 11 or the second vapor chamber unit 12.

[0084] In one embodiment, the metal block 104 and each of the first capillary structures 106 may be located near the geometric center of the third vapor chamber unit 13, such as... Figure 5The third vapor chamber unit 13 is located near the geometric center C formed by the projection positions 132 on the lower plate 102, and each first capillary structure 106 is specifically housed within the polygon formed by the projection positions 132, but this invention is not limited thereto. Additionally, the lower plate 102 of the heat spreader unit 10 can contact a heat source 40, the position of which can specifically correspond to the vicinity of the geometric center C, so that the metal block 104 and each first capillary structure 106 can be located above the heat source 40. In other embodiments, the position of the heat source 40 may not only correspond to the vicinity of the geometric center C, but may also be located below the entire lower plate 102, and this invention is not limited thereto. The function of the liquid channel 109 or the first capillary structure 106 is to collect the liquid working fluid, while the function of the second capillary structure 107 is to transfer the liquid working fluid in the hollow parts 111 and 121 to the first capillary structure 106 so that the first capillary structure 106 can continuously use the liquid working fluid to correspond to the heat source 40, so that the liquid working fluid can be properly distributed and easily heated and evaporated into gas.

[0085] In one embodiment, the thickness of the first capillary structure 106 is greater than the thickness of the second capillary structure 107, so as to receive more liquid working fluid from the second capillary structure 107, thereby improving the heat dissipation effect on the heat source 40, but the present invention is not limited thereto.

[0086] In one embodiment, the heat spreader unit 10 further includes a plurality of spacer metal blocks 108, which are respectively disposed on the lower plate 102. Specifically, each spacer metal block 108 extends from one of the shorter sides of opposite sides of the chamber 103 and extends between each of the second capillary structures 107, and between the projection position 112 of the first vapor chamber unit 11 and the projection position 122 of the second vapor chamber unit 12. The function of each spacer metal block 108 is to separate the working fluid into different areas where the second capillary structures 107 are located, so as to avoid the working fluid being overly concentrated in certain areas and resulting in poor overall heat dissipation, and to prevent the first vapor chamber unit 11 and the second vapor chamber unit 12 from competing for the working fluid. In one embodiment, the spacer metal block 108 does not contact the upper plate 101, but forms a gap with the upper plate 101. The gap can serve as an airflow channel (for example, an airflow channel 105 similar to the gap between the metal block 104 and the upper plate 101), but the present invention is not limited thereto.

[0087] In one embodiment, a plurality of liquid channels 109 are formed on the surface of the lower plate 102 where no metal blocks 104 and spacer metal blocks 108 are provided, but the present invention is not limited thereto.

[0088] When the heat dissipation device 1 of the present invention is in operation, the working fluid in the heat spreader unit 10 can be more appropriately and evenly distributed in the chamber 103 by means of the metal block 104, the spacer metal block 108, and the assistance of the first capillary structure 106 and the second capillary structure 107, and the working fluid can easily collect above the heat source 40. After absorbing the heat energy generated by the heat source 40, the working fluid in the liquid state vaporizes into a gaseous state. The gaseous working fluid can flow through the airflow channel 105 to the hollow portions 111, 121, and 133 of the first, second, and third vapor chamber units 11, 12, and 13. At this time, heat dissipation can be achieved by means of the first and second tower-type fin groups 21 and 22 and the first, second, and third vertical fin groups 31, 32, and 33, respectively, so as to condense the gaseous working fluid back into a liquid state and directly flow back (or flow back through the second capillary structure 106 extending to the hollow portions 111 and 121) to the lower plate 102 for the next heat dissipation cycle.

[0089] In summary, through the special arrangement design of the first and second tower-type fin groups 21 and 22 and the first, second, and third vertical fin groups 31, 32, and 33 in the heat dissipation device 1 of the present invention, the heat dissipation device 1 of the present invention can not only increase the heat dissipation efficiency between each fin, but also reduce the flow resistance of airflow through the fin groups and increase the degree of fluid disturbance between each fin group, resulting in an increase in turbulence, thereby significantly improving the overall heat dissipation performance. Therefore, it is beneficial for use in high-power processors.

[0090] The above embodiments are merely illustrative of the technical principles, features, and effects of the present invention, and are not intended to limit the scope of implementation of the present invention. Those skilled in the art can modify and alter the above embodiments without departing from the spirit and scope of the present invention. However, any equivalent modifications and alterations made using the teachings of this invention should still be covered by the scope of the claims. The scope of protection of this invention should be as set forth in the claims.

Claims

1. A heat dissipation device, characterized in that, include: Heat exchanger unit; At least one first steam chamber unit, at least one second steam chamber unit, and at least one third steam chamber unit are disposed on the outer surface of the heat spreader unit; At least one first tower-shaped fin assembly is disposed on the outer surface of the heat spreader unit to cover the first vapor chamber unit and the second vapor chamber unit, and the second vapor chamber unit is partially exposed. At least one second tower-shaped fin assembly is disposed on a portion of the surface of the first tower-shaped fin assembly to cover the exposed portion of the second vapor chamber unit; At least one first vertical fin group and one second vertical fin group are disposed on the outer surface of the heat spreader unit and attached to opposite sides of the third vapor chamber unit, wherein the fin arrangement direction of the first vertical fin group and the second vertical fin group is different from the fin arrangement direction of the first tower-shaped fin group or the second tower-shaped fin group; and At least one third vertical fin group is simultaneously disposed on the first vertical fin group and the first tower-shaped fin group and attached to the side of the second tower-shaped fin group, wherein the fin arrangement direction of the third vertical fin group is the same as the fin arrangement direction of the first vertical fin group or the second vertical fin group.

2. The heat dissipation device as described in claim 1, characterized in that, There are multiple first steam chamber units, second steam chamber units, and third steam chamber units. The first steam chamber units are disposed at both ends of the heat spreader unit. The second steam chamber units are disposed between any two first steam chamber units and at both ends of the heat spreader unit. The third steam chamber unit is disposed in the middle of the heat spreader unit between the first steam chamber units or the second steam chamber units.

3. The heat dissipation device as described in claim 1, characterized in that, The third steam chamber unit has a tube body and a bend. One end of the tube body is located on the outer surface of the heat spreader unit. The bend is formed by bending and extending the other end of the tube body, and the direction of bending and extending the bend is toward the side of the heat spreader unit.

4. The heat dissipation device as described in claim 3, characterized in that, The first vertical fin assembly is disposed on the outer surface of the heat spreader unit and attached to one side of the tube portion of the third steam chamber unit, and the second vertical fin assembly is disposed on the outer surface of the heat spreader unit and attached to the other side of the tube portion of the third steam chamber unit.

5. The heat dissipation device as described in claim 4, characterized in that, The height of the second vertical fin group is higher than the height of the third vapor chamber unit extending from the outer surface, and the height of the first vertical fin group is lower than the height of the third vapor chamber unit extending from the outer surface.

6. The heat dissipation device as described in claim 4, characterized in that, The third vertical fin assembly also incorporates the bent portion of the third steam chamber unit.

7. The heat dissipation device as described in claim 6, characterized in that, The third vertical fin assembly exposes the end of the bent portion extending toward the side of the heat spreader unit.

8. The heat dissipation device as described in claim 1, characterized in that, The first steam chamber unit is plate-shaped, while the second and third steam chamber units are tube-shaped.

9. The heat dissipation device as described in claim 1, characterized in that, The first steam chamber unit has a first hollow portion inside, the second steam chamber unit has a second hollow portion inside, the third steam chamber unit has a third hollow portion inside, and the heat spreader unit has a chamber inside, and the chamber is interconnected with the first hollow portion, the second hollow portion and the third hollow portion.

10. The heat dissipation device as described in claim 9, characterized in that, The temperature distribution plate unit includes an upper plate, a lower plate, and a metal block. The upper plate and the lower plate are combined to form the chamber. The metal block is disposed on the lower plate and extends to the opposite sides of the chamber, forming an airflow channel with the upper plate.

11. The heat dissipation device as described in claim 10, characterized in that, The chamber is filled with working fluid that is blocked by the metal block.

12. The heat dissipation device as described in claim 11, characterized in that, The heat spreader unit also includes at least two first capillary structures and at least two second capillary structures. Each first capillary structure is disposed on the lower plate and contacts both sides of the metal block. Each second capillary structure is disposed on the lower plate and connects to the first capillary structure, and extends to the projection position of the first vapor chamber unit or the second vapor chamber unit on the lower plate.

13. The heat dissipation device as described in claim 12, characterized in that, Each of the second capillary structures also extends into the hollow portion of the first vapor chamber unit or the second vapor chamber unit.

14. The heat dissipation device as described in claim 12, characterized in that, The temperature distribution plate unit also includes a plurality of spacer metal blocks, which are disposed on the lower plate and extend to one of the opposite sides of the chamber.

15. The heat dissipation device as described in claim 12, characterized in that, The metal block and each of the first capillary structures are located near the geometric center of each of the third vapor chamber units, and are located above the heat source that is in contact with the heat spreader unit.

16. The heat dissipation device as claimed in claim 1, characterized in that, The height of the first vapor chamber unit extending from the outer surface is lower than the height of the second vapor chamber unit extending from the outer surface.

17. The heat dissipation device as claimed in claim 1, characterized in that, The fin arrangement direction of the first tower-shaped fin group and the second tower-shaped fin group is the same as the direction in which the first vapor chamber unit and the second vapor chamber unit extend from the outer surface of the heat spreader unit.

18. The heat dissipation device as claimed in claim 1, characterized in that, The first tower-shaped fin assembly is exposed on the top surface of the first vapor chamber unit.

19. The heat dissipation device as claimed in claim 1, characterized in that, The second tower-shaped fin assembly is exposed on the top surface of the second vapor chamber unit.

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