Static ceramic lighting assembly and preparation method thereof and lighting device

Abstract

The present invention relates to the field of lighting technology, and discloses a static ceramic lighting component, a preparation method thereof, and a lighting device. The static ceramic lighting component includes a heat sink copper block, on which a mounting countersunk hole is provided, and a high reflectivity material and a fluorescent ceramic are fixed in the mounting countersunk hole by diffusion welding. The preparation method of the static ceramic lighting component includes: placing the fluorescent ceramic in the mounting countersunk hole of the heat sink copper block for diffusion welding, so that the fluorescent ceramic is fixed in the mounting countersunk hole and forms a high thermal conductivity structure. The lighting device includes a semiconductor refrigerator with a temperature feedback control function connected as an integral whole and the above-mentioned static ceramic lighting component, wherein the cooling end of the semiconductor refrigerator is connected to a side of the heat sink copper block away from the mounting countersunk hole, and the temperature of the static lighting component is controlled to be in the temperature range of high efficiency operation of the fluorescent ceramic. The lighting device of the present application has good thermal conductivity, good heat dissipation, and a simple structure while ensuring excellent optical performance.

Description

Technical Field

[0001] The present invention relates to the field of lighting technology, and in particular to a static ceramic lighting component and a preparation method thereof and a lighting device. Background Art

[0002] Static ceramic lighting source devices are mainly used as light sources for laser headlights, searchlights, laser projection, medical lighting (such as endoscopes), life sciences or stage lighting, etc. It combines the characteristics of fluorescent ceramics with efficient light conversion, and excites fluorescent ceramics through blue-violet diode lasers or LEDs to achieve the conversion of blue light into high-brightness yellow light, green light or white light. It has extremely high structural stability and high brightness, and is an important development direction for high-efficiency, high-power lighting devices at present, with broad application prospects.

[0003] Since waste heat is inevitably generated during the conversion process, the conversion efficiency will drop sharply (thermal quenching) after the ceramic temperature rises to a higher temperature. Therefore, thermal management of static ceramic lighting devices is the key to device design.

[0004] For the current application direction, high brightness and integration are the mainstream. The existing ceramic static lighting devices are directly combined with semiconductor cooling chips. Although this method can reduce the thermal quenching caused by temperature, it is limited by the low reflectivity of the ceramic and the cold end of the cooling chip with low reflectivity, and the high loss rate of the excitation light. Figure 1 As shown, the other method is to use copper heat sinks for heat dissipation. The thermal conductivity of copper is about 400W / m·K, but the thermal conductivity of conventional ceramics is only 8-12W / m·K, which makes it difficult to quickly extract waste heat from ceramics. At the same time, in order to achieve good substrate reflectivity, multiple layers of low thermal conductivity (<5W / m·K) dielectric films and high reflective films are plated between the ceramic and the copper plate, further increasing the difficulty of extracting waste heat. Therefore, the current typical ceramic static lighting device can withstand low excitation power, and the heat dissipation structure is relatively large, which affects the promotion of static ceramic lighting devices to higher power and wider applications such as laser display.

[0005] Therefore, the current static ceramic lighting device has at least the following problems:

[0006] 1. It is difficult to quickly remove waste heat from ceramics, and the conversion efficiency drops sharply during use (thermal quenching);

[0007] 2. Complex film layers and low thermal conductivity hinder heat dissipation;

[0008] 3. Static ceramic lighting devices can withstand the problem of low excitation power and limited high-power operation;

[0009] 4. The problem of the static lighting device's heat dissipation structure being too large.

[0010] In view of this, the present invention is proposed. Summary of the invention

[0011] The object of the present invention is to provide a static ceramic lighting component and a preparation method thereof and a lighting device, aiming to improve the problems mentioned in the background technology.

[0012] The present invention is achieved in that:

[0013] In a first aspect, the present invention provides a static ceramic lighting assembly, including a heat sink copper block and a fluorescent ceramic. The heat sink copper block is provided with a mounting countersunk hole, and the fluorescent ceramic is fixed in the countersunk hole by diffusion welding.

[0014] In an optional embodiment, the fluorescent ceramic is YAG ceramic, and a connection transition layer is further provided between the fluorescent ceramic and the wall of the mounting countersunk hole, the connection transition layer is at least one of aluminum, gold and silver, and the connection transition layer and the fluorescent ceramic are fixed in the mounting countersunk hole by diffusion welding;

[0015] In an optional embodiment, the fluorescent ceramic is the fluorescent ceramic disclosed in the patent application with patent application number CN201811146024.2;

[0016] In an optional embodiment, the fluorescent ceramic is in the form of a sheet, the thickness of which is 0.05 to 0.4 mm, and the thickness of the connecting transition layer is 0.05 to 0.5 mm;

[0017] In an optional embodiment, the depth of the mounting countersunk hole is less than the sum of the thickness of the connecting transition layer and the thickness of the fluorescent ceramic; more preferably, the depth of the mounting countersunk hole is 0.5-0.6 mm.

[0018] In a second aspect, an embodiment of the present invention provides a method for preparing a static ceramic lighting assembly, comprising:

[0019] The fluorescent ceramic is placed in the mounting countersunk hole of the heat sink copper block for diffusion welding to fix the fluorescent ceramic in the mounting countersunk hole.

[0020] In an optional embodiment, before the fluorescent ceramic is placed in the mounting countersunk hole, the process also includes: first placing a connection transition layer in the mounting countersunk hole so that the connection transition layer is located between the fluorescent ceramic and the wall of the mounting countersunk hole; or after a connection transition layer is formed on the surface of the fluorescent ceramic to be combined with the wall of the mounting countersunk hole, the fluorescent ceramic is placed in the mounting countersunk hole, and then diffusion welding is performed to form a high thermal conductivity overall structure.

[0021] In an optional embodiment, the fluorescent ceramic is the fluorescent ceramic disclosed in the patent application with patent application number CN201811146024.2.

[0022] In an optional embodiment, the fluorescent ceramic is in the form of a sheet with a thickness of 0.05 to 0.4 mm, and the thickness of the connecting transition layer is 0.05 to 0.5 mm.

[0023] In an optional embodiment, the depth of the mounting countersunk hole is less than the sum of the thickness of the connecting transition layer and the thickness of the fluorescent ceramic; more preferably, the depth of the mounting countersunk hole is 0.5-0.6 mm.

[0024] In an optional embodiment, the temperature of the diffusion welding is 700-1200° C., the pressure is 0.1-10 MPa, and the diffusion welding insulation time is 30-90 min.

[0025] In an optional embodiment, the fluorescent ceramic is in the form of a sheet with a thickness of 0.05 to 0.4 mm, and the thickness of the connecting transition layer is 0.05 to 0.5 mm.

[0026] In an optional embodiment, the internal roughness of the mounting counterbore is <100 nm.

[0027] In an alternative embodiment, the surface roughness of the fluorescent ceramic is <150 nm.

[0028] In a third aspect, an embodiment of the present invention provides a lighting device, comprising a semiconductor refrigerator with a temperature feedback control function and the above-mentioned static ceramic lighting component or a static ceramic lighting component prepared by the above-mentioned preparation method, which are connected as one body, and the cooling end of the semiconductor refrigerator is connected to the side of the heat sink copper block away from the mounting countersunk hole.

[0029] In an optional embodiment, the heat sink copper block is connected to the semiconductor cooler via thermal conductive silicone grease coated on the surface of the heat sink copper block.

[0030] In an optional embodiment, the lighting device further includes a fan, and the fan, the semiconductor cooler and the ceramic lighting assembly are sequentially arranged and connected as a whole, with the air inlet side of the fan facing the heat dissipation end of the semiconductor cooler.

[0031] In an optional embodiment, the semiconductor cooler is connected to the fan base via semiconductor silicone grease coated on the heat dissipation end thereof.

[0032] The present invention has the following beneficial effects:

[0033] Since the fluorescent ceramic is set in the mounting countersunk hole in the heat sink copper block by using diffusion welding connection technology, a close connection between atoms is achieved, forming a highly smooth surface close to the roughness of the substrate, which can further enhance the total reflectivity, and can increase the total reflection without using coating, so that the utilization rate of light is further improved, and it has a high thermal conductivity close to that of metal, and there is no problem of low thermal conductivity of the transition film layer affecting the extraction of waste heat. The heat generated by the fluorescent ceramic can be quickly extracted to the heat sink copper block, which can reduce thermal quenching caused by excessive temperature. Therefore, the static high-static ceramic lighting assembly provided by the present application has good thermal conductivity while ensuring excellent optical performance, and its structure is simple, there is no problem of complex film layers, and it has good heat dissipation; therefore, the lighting device assembled by the static ceramic lighting assembly of the present application does not have the problem of enlarging the volume of the heat dissipation structure in order to achieve sufficient heat dissipation capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0035] Figure 1 It is a schematic diagram of the structure of a typical static ceramic lighting device at present;

[0036] Figure 2 A schematic diagram of the structure of a static ceramic lighting assembly provided in an embodiment of the present application from a first viewing angle;

[0037] Figure 3 A schematic diagram of the structure of a static ceramic lighting assembly provided in an embodiment of the present application from a second viewing angle;

[0038] Figure 4 A schematic diagram of the structure of the lighting device provided in an embodiment of the present application.

[0039] Icons: 100 - lighting device; 110 - static ceramic lighting assembly; 111 - heat sink copper block; 112 - mounting countersunk hole; 113 - first screw hole; 120 - semiconductor refrigerator; 130 - fan; 131 - second screw hole; 140 - screw. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the technical scheme in the embodiments of the present invention will be described clearly and completely below. If the specific conditions are not specified in the embodiments, they are carried out according to conventional conditions or conditions recommended by the manufacturer. If the manufacturer of the reagents or instruments used is not specified, they are all conventional products that can be purchased commercially.

[0041] The static ceramic lighting assembly and its preparation method and lighting device provided by the present invention are described in detail below.

[0042] like Figure 2 and Figure 3 As shown, the static ceramic lighting assembly 110 provided in the embodiment of the present application includes a heat sink copper block 111 and fluorescent ceramics. The heat sink copper block 111 is provided with a mounting countersunk hole 112, and the fluorescent ceramics are fixed in the mounting countersunk hole 112 by diffusion welding.

[0043] The fluorescent ceramic is set in the mounting countersunk hole 112 in the heat sink copper block 111 by using diffusion welding connection technology to achieve close connection between atoms, which can further enhance the total reflectivity and form a highly smooth surface close to the roughness of the substrate. The coating method is not required to increase the total reflection, so that the utilization rate of light is further improved. It has a high thermal conductivity close to that of metal, and there is no problem of low thermal conductivity of the transition film layer affecting the extraction of waste heat. The heat generated by the fluorescent ceramic can be quickly extracted to the heat sink copper block 111, which can reduce thermal quenching caused by slow heat dissipation and avoid low thermal conductivity efficiency.

[0044] Preferably, the fluorescent ceramic is YAG ceramic, and a connecting transition layer is provided between the fluorescent ceramic and the bottom and hole wall of the mounting countersunk hole 112. The above-mentioned hole wall includes a bottom wall, or a bottom wall and a side wall. The connecting transition layer is at least one of aluminum, gold and silver. The connecting transition layer and the fluorescent ceramic are fixed in the mounting countersunk hole 112 by diffusion welding.

[0045] The connection transition layer is arranged between the fluorescent ceramic and the copper to enhance the tensile strength of the joint between the fluorescent ceramic and the copper. When the connection transition layer is a fully reflective material, the utilization rate of light can be further improved.

[0046] It should be noted that in other embodiments of the present application, different types of fluorescent ceramics can be selected, and in order to enhance the tensile strength of the connection between the fluorescent ceramic and copper, the connection transition layer can also be other materials other than aluminum, gold or silver that match the fluorescent ceramic, as long as the effect of enhancing the tensile strength can be achieved.

[0047] Preferably, the fluorescent ceramic is a high thermal conductivity complex phase fluorescent ceramic for which the company has applied for a patent, and the specific patent application number is CN201811146024.2; the thermal conductivity of this fluorescent ceramic is above 25 to 40 W / m·K, which is 3 to 5 times that of conventional ceramics.

[0048] Preferably, to ensure that the static ceramic lighting assembly 110 has better performance, the fluorescent ceramic is in the form of a sheet with a thickness of 0.05 to 0.4 mm, and the thickness of the connecting transition layer is 0.05 to 0.5 mm.

[0049] Preferably, to facilitate installation and not block the scattering angle, the depth of the mounting countersunk hole is less than the sum of the thickness of the connecting transition layer and the thickness of the fluorescent ceramic. More preferably, the depth of the mounting countersunk hole is 0.5-0.6 mm.

[0050] Preferably, the size and shape of the fluorescent ceramic, and the size and shape of the connecting transition layer are exactly the same as those of the mounting countersunk hole in the direction parallel to the bottom of the mounting countersunk hole. In this way, when the fluorescent ceramic and the connecting transition layer are placed in the mounting countersunk hole, the edge of the fluorescent ceramic and the edge of the connecting transition layer are exactly in contact with the side wall of the mounting countersunk hole. After diffusion welding, the fluorescent ceramic can be more firmly fixed on the heat sink copper block and the thermal conductivity effect can be further improved.

[0051] The method for preparing the static ceramic lighting assembly 110 provided in the embodiment of the present application includes:

[0052] The fluorescent ceramic is placed in the mounting countersunk hole 112 of the heat sink copper block 111 and diffusion welded to fix the fluorescent ceramic in the mounting countersunk hole 112 .

[0053] Specifically include:

[0054] 1. A mounting countersunk hole 112 is set on the heat sink copper block 111, and then the mounting countersunk hole 112 is polished to make the surface roughness of the hole wall less than 100 nm.

[0055] 2. Dry the prepared fluorescent ceramic powder at a certain temperature, put the dried powder into a mold and apply 10-30 tons of pressure to form it, place the formed cake in a sintering furnace, and sinter it at a high temperature of more than 1300°C. After sintering, cut and grind the ceramic product to make its surface smooth with a roughness of <150nm; obtain a double-sided polished sheet of 0.05-0.4mm (for example, 0.05mm, 0.1mm, 0.2mm or 0.4mm).

[0056] 3. Place a connection transition layer made of at least one material among aluminum, gold and silver, which has been polished to a roughness of <100nm and a thickness of 0.05-0.5mm (for example, 0.05mm, 0.1mm, 0.2mm, 0.4mm or 0.5mm) and is exactly sized to match the mounting countersunk hole 112, into the mounting countersunk hole 112; then place the polished fluorescent ceramic sheet into the mounting countersunk hole 112.

[0057] Alternatively, this step may also be to plate a connection transition layer on the surface of the fluorescent ceramic to be connected to the mounting countersunk hole, place the fluorescent ceramic plated with the connection transition layer in the mounting countersunk hole, and the surface plated with the connection transition layer contacts the mounting countersunk hole.

[0058] 4. Place the heat sink copper block with the connecting transition layer and the fluorescent ceramic in the mounting countersunk hole 112 in a vacuum diffusion welding furnace for diffusion welding, control the diffusion welding temperature to 700-1200°C (for example, 700°C, 800°C, 1000°C or 1200°C), the pressure to 0.1-10MPa (for example, 0.1MPa, 1MPa, 5MPa or 10MPa), and the diffusion welding time to be the insulation time of 30-90min (for example, 30min, 60min or 90min).

[0059] During the preparation process, polishing the hole wall, polishing the fluorescent ceramic slice and polishing the connection transition layer can significantly improve the tensile strength of the joint after diffusion welding.

[0060] like Figures 2 to 4 As shown, the lighting device 100 provided in the embodiment of the present application includes a semiconductor cooler 120 connected as one body and a static ceramic lighting assembly 110 provided in the embodiment of the present application or a static ceramic lighting assembly 110 prepared by the preparation method provided in the embodiment of the present application, and the cooling end of the semiconductor cooler 120 is connected to the side of the heat sink copper block 111 away from the mounting countersunk hole 112.

[0061] The semiconductor refrigerator 120 utilizes the Peltier effect of semiconductor materials, that is, when a piece of N-type semiconductor material and a piece of P-type semiconductor material are connected to form a thermocouple, after a direct current is connected in this circuit, energy transfer can be generated, and the current flows from the N-type element to the joint of the P-type element to absorb heat and become a cold end; the current flows from the P-type element to the joint of the N-type element to release heat and become a hot end. When the refrigeration sheet made by utilizing this effect passes through a thermocouple formed by two different semiconductor materials in series, heat can be absorbed and released at both ends of the thermocouple respectively, thereby achieving the purpose of refrigeration. The amount of heat absorption and heat release is determined by the size of the current and the number of element pairs of the semiconductor materials N and P, so controlling the size of the current can control the temperature of the refrigeration end.

[0062] Furthermore, the lighting device 100 further includes a fan 130 , and the fan 130 , the semiconductor cooler 120 and the ceramic lighting assembly are sequentially connected as a whole, and the air inlet side of the fan 130 faces the heat dissipation end of the semiconductor cooler 120 .

[0063] The fan 130 is provided for further rapid cooling. Usually, the temperature difference between the hot and cold ends of the semiconductor refrigerator 120 can reach between 40 and 65 degrees. If the hot end temperature is lowered by actively dissipating heat through the fan 130, the cold end temperature will also drop accordingly, thereby reaching a lower temperature, so that the device can always maintain a stable temperature operation.

[0064] Preferably, the heat sink copper block 111 is connected to the semiconductor refrigerator 120 via thermal conductive silicone grease coated on its surface; the semiconductor refrigerator 120 is connected to the fan 130 via semiconductor silicone grease coated on its heat dissipation end.

[0065] Both ends of the semiconductor cooler 120 are coated with thermal conductive silicone grease to achieve connection and facilitate heat conduction.

[0066] Furthermore, the lighting device 100 also includes multiple screws, the heat sink copper block 111 is provided with multiple first screw holes 113 corresponding to the number of the multiple screws around the mounting countersunk hole 112, the edge of the fan 130 is provided with multiple second screw holes 131 corresponding to the multiple first screw holes 113, and the multiple screws 140 pass through the multiple first screw holes 113 and the multiple second screw holes 131 one by one.

[0067] The static ceramic lighting assembly 110 and the fan 130 on both sides of the semiconductor cooler 120 are connected as a whole by screws, so that the overall structure is more solid.

[0068] When blue light is irradiated on the lighting device 100, the fluorescent ceramic will be excited to emit yellow light. The close contact between the fluorescent ceramic and the heat sink copper block 111 will further reflect the yellow light, increase the reflection efficiency, and improve the utilization rate. At this time, the cooling plate and the fan 130 are also powered on to work, and the heat generated by the fluorescent ceramic is discharged through the heat sink copper block 111, while the cooling plate transfers the heat to the other side for active heat dissipation through the fan 130, thereby reducing the temperature of the lighting ceramic.

[0069] The features and performance of the present invention are further described in detail below in conjunction with the embodiments.

[0070] Example

[0071] A 7*7*2 heat sink copper block 111 is prepared, with 1mm threaded holes on all sides for fixing with the subsequent fan 130, a cube mounting countersunk hole 112 with a hole diameter of 3*3*1mm is opened in the middle, and the mounting countersunk hole 112 is polished to make the hole wall roughness <100nm.

[0072] A 3*3*0.5mm aluminum connection transition layer with a surface roughness of <100nm and a 0.1mm fluorescent ceramic sheet with a surface roughness of <150nm are placed in the mounting countersunk hole 112, and then the heat sink copper block 111 is placed in a vacuum diffusion welding furnace for diffusion welding. The diffusion welding temperature is 1200°C, and a pressure of 1MPa is applied to the inside. The diffusion welding time is a holding time of 30min.

[0073] After sintering, a layer of thermal conductive silicone grease is coated on the back of the heat sink copper block 111 and connected to the cold end of the semiconductor refrigerator 120. A layer of thermal conductive silicone grease is also coated on the heat dissipation end of the semiconductor refrigerator 120 and connected to the back of the fan 130. The screw holes on the heat sink copper block 111 are screwed to connect to the fan 130, making the overall structure more solid.

[0074] The power supply is configured according to the model of the cooling plate. This embodiment adopts the semiconductor cooler 120 of TEC1-12706T125, which works at a working voltage of 12V.

[0075] In summary, the static ceramic lighting assembly 110 and the preparation method thereof provided in the present application use diffusion welding connection technology to set the fluorescent ceramic in the mounting countersunk hole 112 in the heat sink copper block 111, thereby realizing close connection between atoms, which can further enhance the total reflectivity, and can avoid the need to use coating to increase total reflection, thereby further improving the utilization rate of light. In addition, there is no problem of low thermal conductivity of the transition film layer affecting the extraction of waste heat, and the heat generated by the fluorescent ceramic can be quickly extracted to the heat sink copper block 111, thereby reducing thermal quenching caused by slow heat dissipation and avoiding low thermal conductivity efficiency.

[0076] Comparative Example 1

[0077] This comparative example is basically the same as the embodiment, except that brazing is used instead of diffusion welding.

[0078] Comparative Example 2

[0079] The comparative example is basically the same as the embodiment, except that the diffusion welding is replaced by bonding with transparent glue material.

[0080] Comparative Example 3

[0081] This comparative example is substantially the same as the embodiment, except that the diffusion soldering temperature is 1300°C.

[0082] Comparative Example 4

[0083] This comparative example is substantially the same as the embodiment, except that the diffusion soldering temperature is 600°C.

[0084] Comparative Example 5

[0085] This comparative example is basically the same as the embodiment, except that the diffusion soldering holding time is 20 minutes.

[0086] Comparative Example 6

[0087] This comparative example is basically the same as the embodiment, except that the diffusion soldering holding time is 120 minutes.

[0088] Experimental example

[0089] The luminous efficacy, joint firmness, and thermal conductivity performance of the static ceramic lighting assembly prepared by testing the examples and comparative examples 1-6 are recorded in the following table.

[0090] There is no national standard for the testing method of luminous efficiency at present. The definition of luminous efficiency refers to 8.3 in GBT 24823-2017. The luminous efficiency is measured by diffusely reflecting the light emitted by the device inside the integrating sphere and then entering the spectrometer to calculate its luminous flux. However, since this device needs to be excited by blue light before emitting light, its initial luminous flux is the luminous flux of diffusely reflected blue light in the integrating sphere. The other comparative examples are measured in the same way to measure the luminous efficiency values, and the embodiment is used as a standard sample for comparison with other comparative examples.

[0091] The test method for firmness is based on GB-6329-1996. Fix one end of the product and place the other end under the tensile testing machine. Press the tensile testing machine down at a constant speed until the joint breaks. At this time, the maximum value on the joint surface on the meter is calculated and the firmness is recorded.

[0092] The thermal conductivity is tested using the standard test method for thermal diffusivity using the flash method in ASTM E1461-2013.

[0093] Table 1 Performance tests of the products of the embodiments and comparative examples

[0094]

[0095]

[0096] It can be seen from the above table that the static ceramic lighting assembly obtained by the embodiment provided in the present application has very good luminous efficiency performance, joint firmness performance and thermal conductivity. Compared with Comparative Examples 1 and 2, it is found that its luminous efficiency performance and thermal conductivity performance are significantly better than those of Comparative Examples 1 and 2, indicating that the luminous efficiency performance and thermal conductivity performance of the lighting assembly obtained by the diffusion welding connection method adopted in the present application are better than those of bonding and brazing; by comparing the embodiment with Comparative Examples 3 and 4, it can be seen that various performances of the product are significantly better than those of Comparative Examples 3 and 4, indicating that a ceramic lighting assembly with better performance can be obtained at the appropriate diffusion welding temperature required by the present application. Parts, if the diffusion welding temperature is higher or lower than the range required by the present application, the performance of the obtained ceramic lighting parts is significantly slightly worse than the performance of the ceramic lighting parts made within the preferred temperature range required by the present application; By comparing the embodiment with comparative examples 5 and 6, it can be seen that the performance of the embodiment is significantly better than that of comparative examples 5 and 6, indicating that a ceramic lighting component with better performance can be obtained under the appropriate insulation time required by the present application, and if the diffusion welding insulation time is longer or shorter than the range required by the present application, the performance of the obtained ceramic lighting parts is significantly slightly worse than the performance of the ceramic lighting parts made within the preferred insulation time required by the present application.

[0097] In summary, the lighting device 100 provided in the present application has the following beneficial effects:

[0098] 1. The fluorescent ceramic is connected to the heat sink copper block 111 by diffusion welding technology, and no coating is required. Due to the close contact between atoms, it can achieve the purpose of full reflection and rapid heat conduction, reduce the preparation cost and improve thermal stability;

[0099] 2. A connection transition layer is provided between the heat sink copper block and the fluorescent ceramic, which can improve the stability of the connection between the fluorescent ceramic and the heat sink copper block. When the connection transition layer is a fully reflective material, the utilization rate of light can be further improved.

[0100] 3. The active heat dissipation device combined with the cooling sheet and the fan 130 can reduce the usage and volume of the heat sink copper block 111, expand the application scope of the lighting device 100 or be applicable to miniaturized high-performance light sources;

[0101] 4. Based on the Peltier effect, the device has a small thermal inertia, a fast cooling effect, does not require any refrigerant, and can work continuously.

[0102] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A static ceramic lighting assembly, characterized in that: It comprises a heat sink copper block and a fluorescent ceramic, wherein the heat sink copper block is provided with a mounting countersunk hole, and the fluorescent ceramic is fixed in the mounting countersunk hole by diffusion welding; The temperature of the diffusion welding is 700-1200° C., and the diffusion welding holding time is 30-90 minutes, so as to achieve close connection between atoms and form a highly smooth surface close to the roughness of the substrate, which can further enhance the total reflectivity.

2. The static ceramic lighting assembly according to claim 1, characterized in that: The fluorescent ceramic is YAG ceramic, and a connection transition layer is provided between the fluorescent ceramic and the wall of the mounting countersunk hole. The connection transition layer is at least one of aluminum, gold and silver. The connection transition layer is fixed in the mounting countersunk hole together with the fluorescent ceramic by diffusion welding.

3. The static ceramic lighting assembly according to claim 2, characterized in that: The fluorescent ceramic is in sheet form with a thickness of 0.05-0.4 mm, and the thickness of the connecting transition layer is 0.05-0.5 mm.

4. The static ceramic lighting assembly according to claim 2, characterized in that: The depth of the mounting countersunk hole is less than the sum of the thickness of the connecting transition layer and the thickness of the fluorescent ceramic.

5. The static ceramic lighting assembly according to claim 1, characterized in that: The depth of the mounting countersunk hole is 0.5-0.6 mm.

6. A method for preparing a static ceramic lighting component, characterized in that: include: Placing the fluorescent ceramic in the mounting countersunk hole of the heat sink copper block for diffusion welding, so that the fluorescent ceramic is fixed in the mounting countersunk hole; The temperature of diffusion welding is 700~1200℃, and the insulation time of diffusion welding is 30~90min, which can achieve close connection between atoms and form a highly smooth surface close to the roughness of the substrate, which can further enhance the total reflectivity.

7. The method for preparing a static ceramic lighting assembly according to claim 6, characterized in that: Before the fluorescent ceramic is placed in the mounting countersunk hole, the method also includes: first placing a connection transition layer in the mounting countersunk hole so that the connection transition layer is located between the fluorescent ceramic and the hole wall of the mounting countersunk hole; or after forming a connection transition layer on the surface of the fluorescent ceramic to be combined with the hole wall of the mounting countersunk hole, placing the fluorescent ceramic in the mounting countersunk hole, and then performing diffusion welding to form a high thermal conductivity overall structure.

8. The method for preparing a static ceramic lighting assembly according to claim 7, characterized in that: The pressure of diffusion welding is 0.1~10MPa.

9. The method for preparing a static ceramic lighting assembly according to claim 7, characterized in that: The fluorescent ceramic is in sheet form with a thickness of 0.05-0.4 mm, and the thickness of the connecting transition layer is 0.05-0.5 mm.

10. The method for preparing a static ceramic lighting component according to claim 7, characterized in that: The depth of the mounting countersunk hole is less than the sum of the thickness of the connecting transition layer and the thickness of the fluorescent ceramic.

11. The method for preparing a static ceramic lighting assembly according to claim 7, characterized in that: The depth of the mounting countersunk hole is 0.5-0.6 mm.

12. The method for preparing a static ceramic lighting assembly according to claim 7, characterized in that: The internal roughness of the mounting countersunk hole is less than 100 nm.

13. The method for preparing a static ceramic lighting component according to claim 7, characterized in that: The surface roughness of the fluorescent ceramic is less than 150 nm.

14. A lighting device, characterized in that: It comprises a semiconductor refrigerator with a temperature feedback control function and a static ceramic lighting component as described in any one of claims 1 to 5 or a static ceramic lighting component made by the preparation method as described in any one of claims 6 to 12, the cooling end of the semiconductor refrigerator is connected to a side of the heat sink copper block away from the mounting countersunk hole.

15. The lighting device according to claim 14, characterized in that: The heat sink copper block is connected to the semiconductor refrigerator via the thermal conductive silicone grease coated on the surface of the heat sink copper block.

16. The lighting device according to claim 15, characterized in that: The lighting device further comprises a fan, and the fan, the semiconductor refrigerator and the ceramic lighting assembly are sequentially connected as a whole, and the air inlet side of the fan faces the heat dissipation end of the semiconductor refrigerator.

17. The lighting device according to claim 16, characterized in that: The semiconductor refrigerator is connected to the base of the fan through semiconductor silicone grease coated on the heat dissipation end of the semiconductor refrigerator.

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