A method and device for checking a metal bump in a chip design, and an electronic device

Abstract

Embodiments of the present application disclose a method and device for checking metal bumps in chip design and electronic equipment, and relate to the technical field of chip design. The method comprises: obtaining pre-set category information of simulation bumps, wherein the category information is information obtained by dividing simulation bumps corresponding to a plurality of metal bumps on a chip into different categories according to characteristic information of the metal bumps; receiving a command for displaying target simulation bumps corresponding to a target category in the category information; displaying the target simulation bumps corresponding to the target category according to the command, and hiding other simulation bumps except the target simulation bumps, so as to check the metal bumps corresponding to the target simulation bumps in the chip design process. The present application is suitable for checking the metal bumps corresponding to the target simulation bumps in the chip design process.

Description

TECHNICAL FIELD

[0001] The present application relates to the chip design technical field, and particularly relates to a chip design metal bump checking method and device and electronic equipment. BACKGROUND

[0002] With the rapid development of integrated circuits, the chip design scale increases, and flip chips are widely used. In chip design, small and medium-sized chips can rely on tools to automatically realize the placement of metal bumps (BUMP), but in large-scale chip design, due to the huge scale of BUMP, great difficulty is brought in BUMP physical implementation and checking, and it is also difficult to achieve the expected effect, and repeated iterations are often required. Among them, for the checking scheme of BUMP, in the prior art, the positions of BUMP in the early stage of chip design on the chip can be compared with the positions of BUMP in the current design stage, and the BUMP on the chip in the current stage can be checked accordingly.

[0003] For the positions of BUMP in the early stage on the chip, the corresponding BUMP can be selected from a large number of BUMP on the chip according to the name of BUMP by an automatic tool, or the BUMP can be selected by the recognition point coordinates of BUMP. However, no matter which way is used, the target BUMP needs to be searched in a large number of and dense BUMP, so that the checking efficiency of BUMP in the current design stage is low, and the efficiency of chip design is low. SUMMARY

[0004] Therefore, the embodiments of the present application provide a chip design metal bump checking method and device, electronic equipment and readable storage medium, which can improve the efficiency of chip design.

[0005] In a first aspect, the embodiments of the present application provide a chip design metal bump checking method, comprising: obtaining pre-set category information of simulation bumps, the category information being information of dividing simulation bumps corresponding to a plurality of metal bumps on a chip into different categories according to characteristic information of the metal bumps; receiving a command of displaying target simulation bumps corresponding to a target category in the category information; according to the command, displaying the target simulation bumps corresponding to the target category, and hiding other simulation bumps except the target simulation bumps, so as to check the metal bumps corresponding to the target simulation bumps in the chip design process.

[0006] According to a specific implementation manner of the embodiment of the present application, the receiving the command of displaying the target simulation bump corresponding to the target category in the category information comprises: displaying operation buttons corresponding to each of the categories on a graphical user interface; and receiving the command of displaying the target simulation bump corresponding to the target category in the category information by receiving a clicking operation of a user on the operation buttons.

[0007] According to a specific implementation manner of the embodiment of the present application, the displaying the target simulation bump corresponding to the target category comprises: determining a target display element corresponding to the target category according to a preset correspondence between the categories and display elements; the display element comprises a graphical shape and / or a color; and displaying the target simulation bump corresponding to the target category by using the target display element.

[0008] According to a specific implementation manner of the embodiment of the present application, the displaying the target simulation bump corresponding to the target category comprises: determining a target metal bump corresponding to the target simulation bump; determining a display position of the target simulation bump according to position information of the target metal bump on the chip; and displaying the target simulation bump corresponding to the target category at the determined display position.

[0009] According to a specific implementation manner of the embodiment of the present application, the characteristic information of the metal bump comprises at least one of the following: identification information, type information and voltage information.

[0010] In a second aspect, the embodiment of the present application provides a checking device for a metal bump in chip design, and has the characteristics that the device comprises: an acquisition module, configured to acquire category information of a simulation bump preset in advance, wherein the category information is information of dividing simulation bumps corresponding to a plurality of metal bumps on a chip into different categories according to characteristic information of the metal bump; a receiving module, configured to receive a command of displaying a target simulation bump corresponding to a target category in the category information; and a display module, configured to display the target simulation bump corresponding to the target category according to the command, and hide other simulation bumps except the target simulation bump, so as to check a metal bump corresponding to the target simulation bump in a chip design process.

[0011] According to a specific implementation manner of the embodiment of the present application, the receiving module is specifically configured to: display operation buttons corresponding to each of the categories on a graphical user interface; and receive the command of displaying the target simulation bump corresponding to the target category in the category information by receiving a clicking operation of a user on the operation buttons.

[0012] According to a specific implementation manner of the embodiment of the present application, the display device is specifically configured to: determine a target display element corresponding to the target category according to a preset correspondence between the categories and the display elements; the display element includes a graphic shape and / or color; and display the target simulation bump corresponding to the target category by using the target display element.

[0013] According to a specific implementation manner of the embodiment of the present application, the display device is specifically configured to: determine a target metal bump corresponding to the target simulation bump; determine a display position of the target simulation bump according to position information of the target metal bump on the chip; and display the target simulation bump corresponding to the target category at the determined display position.

[0014] According to a specific implementation manner of the embodiment of the present application, the characteristic information of the metal bump includes at least one of the following: identification information, type information, and voltage information.

[0015] In a third aspect, an electronic device is provided, including: a housing, a processor, a memory, a circuit board, and a power supply circuit, wherein the circuit board is arranged inside a space enclosed by the housing, and the processor and the memory are arranged on the circuit board; the power supply circuit is configured to supply power to each circuit or device of the electronic device; the memory is configured to store executable program code; and the processor is configured to run a program corresponding to the executable program code by reading the executable program code stored in the memory, and execute the method of any of the preceding implementation manners.

[0016] In a fourth aspect, a computer-readable storage medium is provided, which stores one or more programs executable by one or more processors to implement the method of any of the preceding implementation manners.

[0017] The chip design checking method and device, electronic device, and readable storage medium provided in the embodiment obtain category information of a simulation bump that is preset, wherein the category information is information that simulation bumps corresponding to a plurality of metal bumps on a chip are divided into different categories according to characteristic information of the metal bumps, and then a target simulation bump corresponding to a target category is displayed according to a received command, and other simulation bumps except the target simulation bump are hidden. Since the other simulation bumps except the target simulation bump are hidden, only the target simulation bump corresponding to the target category is displayed. In this way, a user can display the simulation bump in a targeted manner by using the method of the embodiment, and then, according to the displayed simulation bump, the metal bump corresponding to the target simulation bump can be checked in a chip design process, the interference of other simulation bumps is effectively reduced, and thus the efficiency of chip design is improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor.

[0019] Figure 1 The flowchart of the inspection method of the metal bump in the chip design provided by an embodiment of the present application is shown in the figure.

[0020] Figure 2 The schematic diagram of the graphical user interface of an embodiment of the present application is shown in the figure.

[0021] Figure 3 The structural schematic diagram of the inspection device of the metal bump in the chip design provided by an embodiment of the present application is shown in the figure.

[0022] Figure 4 The structural schematic diagram of the electronic device provided by an embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0023] The embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be clear that the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0024] In order for those skilled in the art to better understand the technical concepts, implementation schemes and beneficial effects of the embodiments of the present application, specific embodiments will be described in detail below.

[0025] In the first aspect, an embodiment of the present application provides an inspection method of a metal bump in a chip design, comprising: obtaining pre-set category information of simulation bumps, the category information being information of dividing simulation bumps corresponding one by one to a plurality of metal bumps on a chip into different categories according to characteristic information of the metal bumps; receiving a command of displaying target simulation bumps corresponding to a target category in the category information; according to the command, displaying the target simulation bumps corresponding to the target category and hiding other simulation bumps except the target simulation bumps, so as to check the metal bumps corresponding to the target simulation bumps in the chip design process, which can improve the efficiency of chip design.

[0026] Figure 1 The flowchart of the inspection method of the metal bump in the chip design provided by an embodiment of the present application is shown in the figure. Figure 1As shown, the method for checking the metal bumps in the chip design of the embodiment can include:

[0027] S101, acquire the category information of the simulation bumps pre-set.

[0028] In the embodiment, the category information is information for dividing the simulation bumps corresponding to the plurality of metal bumps on the chip into different categories according to the characteristic information of the metal bumps.

[0029] For the packaging mode of flip chip, in the chip design process, metal bumps need to be implanted on the silicon wafer for the connection of the pins (PAD) of the silicon wafer and the pins after packaging.

[0030] The simulation bumps can be used to simulate the metal bumps, i.e., the metal bumps actually exist on the chip.

[0031] In the embodiment, the category information can be acquired according to the state of the BUMP placed on the corresponding position of the chip, and specifically, the category can be information for dividing the simulation bumps corresponding to the plurality of metal bumps on the chip into different categories according to the characteristic information of the placed metal bumps.

[0032] It can be understood that the simulation bumps are one-to-one corresponding to the placed BUMP, i.e., there are as many simulation bumps as the metal bumps on the chip after the placement is completed.

[0033] In the subsequent design process of the chip, once the BUMP in the subsequent design needs to be checked, the method in the embodiment can be used to display the simulation bumps and compare the information of the BUMP to be checked.

[0034] It can be understood that the chip design process includes the software design process and the chip production and test process.

[0035] The characteristic information of the metal bump can be at least one of identification information, type information and voltage information. The identification information is information capable of uniquely determining the metal bump, and when the categories are divided according to the identification information, each metal bump can be divided into a category; the type information can be the type of the signal transmitted by the pin corresponding to the metal bump, for example, the simulation bumps corresponding to the metal bumps of the pins transmitting the signal can be divided into a category; the voltage information can be voltage value information, and the simulation bumps corresponding to the metal bumps are divided into different categories according to the voltage information, in some examples, the simulation bumps corresponding to the metal bumps working in a predetermined first voltage range can be divided into a category, and the simulation bumps corresponding to the metal bumps working in a predetermined second voltage range can be divided into another category; in other examples, the simulation bumps corresponding to the metal bumps working in one power domain can be divided into a category, and the simulation bumps corresponding to the metal bumps working in another power domain can be divided into another category.

[0036] It can be understood that the above is only an exemplary description, and the division of the simulation bumps corresponding to the metal bumps into different categories according to the characteristic information of the metal bumps is within the protection scope of the present application.

[0037] S102, receiving a command of displaying a target simulation bump corresponding to a target category in the category information.

[0038] The simulation bumps are divided into different categories in S101.

[0039] If the user wants to view the simulation bumps according to the categories, a display command can be issued, and the target category can be the category to which the target simulation bump the user wants to view belongs.

[0040] S103, according to the command, displaying the target simulation bump corresponding to the target category, and hiding other simulation bumps except the target simulation bump, so as to check the metal bump corresponding to the target simulation bump in the chip design process.

[0041] The target simulation bump corresponding to the target category is displayed, and other simulation bumps except the target simulation bump are hidden, so that a more clear display result can be provided for the user, and accordingly, the metal bump corresponding to the target simulation bump is checked in the chip design process, thereby improving the chip design efficiency.

[0042] In the embodiment, the category information of the simulation bump is acquired, wherein the category information is information of dividing the simulation bumps corresponding to the multiple metal bumps on the chip one by one into different categories according to the characteristic information of the metal bumps, and according to the received command of displaying the target simulation bump corresponding to the target category, the target simulation bump corresponding to the target category is displayed, and other simulation bumps except the target simulation bump are hidden. Since other simulation bumps except the target simulation bump are hidden, only the target simulation bump corresponding to the target category is displayed, so that the user can display the simulation bump by the method of the embodiment, and accordingly, the metal bump corresponding to the target simulation bump can be checked in the chip design process according to the displayed simulation bump, the interference of other simulation bumps is effectively reduced, the chip design efficiency is improved, and the problem that the selected BUMP and other BUMPS on the chip are still on the chip and are displayed together, thereby causing the BUMP checking efficiency to be low in the chip design stage and further causing the chip design efficiency to be low, is avoided.

[0043] In some examples, before the simulation bumps corresponding to the multiple metal bumps on the chip are divided into different categories according to the characteristic information of the metal bumps (S101), the method further includes:

[0044] Obtaining characteristic information of a plurality of metal bumps on a chip.

[0045] The characteristic information of the metal bumps can include a name, position information, and can also include identification information, type information, and / or voltage information.

[0046] To provide a more convenient interaction mode for a user and improve user experience, in some examples, a command to display a target simulation bump corresponding to a target category in the category information is received (S102), including:

[0047] S102a, displaying operation buttons corresponding to each category on a graphical user interface.

[0048] The graphical user interface of the embodiment is used to display the target simulation bump.

[0049] S102b, receiving a command to display a target simulation bump corresponding to a target category by receiving a click operation of the user on the operation button.

[0050] The click operation of the user can be clicking by a touch device such as a stylus, or directly clicking by a finger.

[0051] To improve the display effect of the target simulation bump, in some examples, displaying the target simulation bump corresponding to the target category includes:

[0052] A1, determining a target display element corresponding to the target category according to a preset correspondence between categories and display elements.

[0053] The display element in the embodiment includes a graphical shape and / or color.

[0054] The preset correspondence between categories and display elements can be different display elements for different categories, or the same display element.

[0055] In one example, the plurality of metal bumps are divided into category A and category B, and category A can be set to correspond to a rectangle and green, and category B can be set to correspond to a rectangle and red; alternatively, category A can be set to correspond to a circle and green, and category B can be set to correspond to a rectangle and red.

[0056] A2, displaying the target simulation bump corresponding to the target category in the target display element.

[0057] The target simulation bump is displayed using the target display element determined in step A1.

[0058] To make the simulation bump correspond to the position of the metal bump in the chip, thereby facilitating user inspection, in yet other examples, displaying the target simulation bump corresponding to the target category includes:

[0059] B1, determine a target metal bump corresponding to the target simulation bump.

[0060] B2, according to the position information of the target metal bump on the chip, determine the display position of the target simulation bump.

[0061] The position information can be relative position information of the target metal bump on the chip. Since the target metal bump is on the surface of the chip, in some examples, the relative position information of the target metal bump on the chip can be identified in the form of two-dimensional coordinates, for example, the coordinate origin is set at the center of the surface of the chip, and the position information of the target metal bump can be two-dimensional coordinates relative to the coordinate origin.

[0062] The position information of the target metal bump can be used as the display position of the target simulation bump.

[0063] B3, display the target simulation bump corresponding to the target category at the determined display position.

[0064] The scheme of the present application will be described in detail below with reference to a specific embodiment, see Figure 2 .

[0065] First, according to the distribution information of BUMP on the chip, the name of BUMP and the coordinates of the identification point corresponding to BUMP are derived, as shown in Table 1.

[0066] Wherein, BUMP name is the name of the metal bump, BP_1, VDD CR_SOC and VSS are specific metal bump names, and X and Y are X and Y coordinates of the metal bump.

[0067] Referring to Table 2, in this embodiment, Domain is the power domain, power is the voltage of the power domain, and ground is the ground of the power domain; the power domains to which the metal bumps VDD and VSS belong are PwrDomain A, and the power domains to which the metal bumps VDDA and VSSA belong are PwrDomain B.

[0068] The identification point is used to identify the position of BUMP in the chip.

[0069] Table 1

[0070] BUMP name X(um) Y(um) BP_1 10.2 50.6 VDDCR_SOC 50.8 200.8 VSS 200.5 500.3

[0071] Table 2

[0072] Domain power ground PwrDomain A VDD VSS PwrDomain B VDDA VSSA

[0073] Second, parse the derived BUMP information, and divide a plurality of simulation bumps into different layers.

[0074] In this embodiment, according to the characteristics of the metal bumps, the multiple simulation bumps are respectively divided into different layers by means of the concept of layers. The layers in this embodiment correspond to the categories in the above-mentioned embodiment.

[0075] The simulation bumps can also be divided into corresponding layers according to power domains. For this purpose, the names of the power domains need to be input.

[0076] In the third step, the coordinates of the identification points are positioned on the corresponding layers to generate corresponding graphics.

[0077] In the fourth step, the names of the layers are modified, and different colors are used to define different layers.

[0078] In the case of dividing a BUMP into a layer, the name of the layer can be modified as the name of the BUMP; in the case of dividing the layers according to the types of the bumps, the name of the layer can be modified as the name related to the type; in the case of dividing the layers according to the power domains, the name of the layer can be modified as the name of the power domain.

[0079] In the fifth step, the GDS and the setting file of the layers are exported.

[0080] The GDS (Graphic Data System) is a database format, which saves the shape of the layer and the layer number and the like. The setting file of the layer saves the color and the name corresponding to the layer and the like.

[0081] In the sixth step, the GDS and the setting file of the physical layer are imported, and the graphical user interface appears, as shown in FIG. 6. Figure 2 The file saved in the fifth step can be imported into the device when needed, so as to check the BUMP in the process of designing the chip.

[0082] Figure 2 The right side layer setting is the graphical setting interface, and the left side display console is the display console. The corresponding BUMP can be displayed by selecting the information on the right side layer setting. In the right side layer setting interface, the layer number is the layer number, which can be 1000, 1001 and the like; the layer color is the layer color, and color1, color2 and the like can be specific colors. In this embodiment, the layer color can render the BUMP into the color corresponding to the layer color when the BUMP is displayed; the BUMP name is the name of the metal bump, and VDDCR_SOC, VDDCR_CPU, VSS, BP_1, PwrDomainAVDD and PwrDomain VSS are specific names of the metal bump.

[0083] The embodiment can effectively display the position of the BUMP, the interface is more friendly, the reverse extraction and positioning of the BUMP are actively affected, various power domains are better distinguished, the embodiment is suitable for various BUMP scenes, and product competitiveness is improved to a certain extent.

[0084] In a second aspect, an embodiment of the present application provides a chip design metal bump checking device, comprising: an acquisition module configured to acquire pre-set simulation bump category information, wherein the category information is information of dividing simulation bumps corresponding to a plurality of metal bumps on a chip into different categories according to metal bump characteristic information; a receiving module configured to receive a command of displaying target simulation bumps corresponding to a target category in the category information; and a display module configured to display the target simulation bumps corresponding to the target category according to the command and hide other simulation bumps except the target simulation bumps, so as to check the metal bumps corresponding to the target simulation bumps in a chip design process, thereby improving the efficiency of chip design.

[0085] Figure 3 A structure diagram of the chip design metal bump checking device provided by an embodiment of the present application is shown in FIG. 1. Figure 3 The chip design metal bump checking device can comprise: an acquisition module 11 configured to acquire pre-set simulation bump category information, wherein the category information is information of dividing simulation bumps corresponding to a plurality of metal bumps on a chip into different categories according to metal bump characteristic information; a receiving module 12 configured to receive a command of displaying target simulation bumps corresponding to a target category in the category information; and a display module 13 configured to display the target simulation bumps corresponding to the target category according to the command and hide other simulation bumps except the target simulation bumps, so as to check the metal bumps corresponding to the target simulation bumps in a chip design process.

[0086] The device can be used to execute the method embodiment shown in FIG. 2. Figure 1 The device can be used to execute the method embodiment shown in FIG. 2.

[0087] In the embodiment, the category information of the simulation bump is acquired, the category information is information of dividing simulation bumps corresponding to the plurality of metal bumps on the chip into different categories according to the characteristic information of the metal bump, a target simulation bump corresponding to a target category is displayed according to a received command of displaying the target simulation bump corresponding to the target category, and other simulation bumps except the target simulation bump are hidden. Since the other simulation bumps except the target simulation bump are hidden, only the target simulation bump corresponding to the target category is displayed. In this way, the user can display the simulation bump according to the method of the embodiment, and then can check the metal bump corresponding to the target simulation bump in the chip design process according to the displayed simulation bump, effectively reducing the interference of other simulation bumps, thereby improving the efficiency of chip design, and avoiding the problem that the selected BUMP and other BUMPS on the chip are still on the chip and are displayed together, thereby reducing the checking efficiency of the BUMP in the chip design stage, and further reducing the efficiency of chip design.

[0088] As an optional implementation, the receiving module is specifically configured to display operation buttons corresponding to the categories on a graphical user interface, and receive a command of displaying a target simulation bump corresponding to a target category by receiving a click operation of a user on the operation buttons.

[0089] As an optional implementation, the display device is specifically configured to determine a target display element corresponding to the target category according to a preset correspondence between the categories and the display elements, the display element includes a graphical shape and / or a color, and the target simulation bump corresponding to the target category is displayed by using the target display element.

[0090] As an optional implementation, the display device is specifically configured to determine a target metal bump corresponding to the target simulation bump, determine a display position of the target simulation bump according to position information of the target metal bump on the chip, and display the target simulation bump corresponding to the target category at the determined display position.

[0091] As an optional implementation, the characteristic information of the metal bump includes at least one of the following: identification information, type information, and voltage information.

[0092] The device of the above embodiment can be used to execute the technical solutions of the above method embodiments, and the implementation principles and technical effects are similar, which will not be described here.

[0093] Figure 4The structural schematic diagram of the electronic device provided by an embodiment of the present application can include a shell 61, a processor 62, a memory 63, a circuit board 64 and a power supply circuit 65, wherein the circuit board 64 is arranged inside a space enclosed by the shell 61, the processor 62 and the memory 63 are arranged on the circuit board 64; the power supply circuit 65 is configured to supply power to each circuit or device of the electronic device; the memory 63 is configured to store executable program codes; the processor 62 is configured to run a program corresponding to the executable program codes by reading the executable program codes stored in the memory 63, and is configured to execute the inspection method of the metal bump in any chip design provided by the foregoing embodiments, so that the corresponding beneficial technical effects can also be achieved, which have been described in detail above and will not be repeated here.

[0094] The electronic device described above exists in various forms, including but not limited to:

[0095] (1) Ultra-mobile personal computer device: This kind of device belongs to the category of personal computers, has computing and processing functions, and generally also has the feature of mobile Internet. This kind of terminal includes PDA, MID and UMPC device, etc., such as iPad.

[0096] (2) Server: A device providing computing services. The components of a server include a processor, a hard disk, a memory, a system bus, etc. The server is similar to a general computer architecture, but requires high processing capability, stability, reliability, security, scalability and manageability due to the need to provide high-reliability services.

[0097] (3) Other electronic devices with data interaction function.

[0098] Correspondingly, the embodiment of the present application also provides a computer readable storage medium, which stores one or more programs, and the one or more programs can be executed by one or more processors to implement the inspection method of the metal bump in any chip design provided by the foregoing embodiments, so that the corresponding technical effects can also be achieved, which have been described in detail above and will not be repeated here.

[0099] It is to be noted that, in the present document, relational terms such as first and second, and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0100] Each of the embodiments in the present specification is described in a related manner, and the same or similar parts between the embodiments can be referred to each other. Each of the embodiments focuses on the difference from other embodiments.

[0101] Especially, for the device embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and the relevant parts can be referred to the part of the description of the method embodiments.

[0102] For the convenience of description, the above device is described in various units / modules respectively according to functions. Of course, in the implementation of the present application, the functions of each unit / module can be implemented in the same or multiple software and / or hardware.

[0103] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiments can be completed by a computer program instructing related hardware. The program can be stored in a computer readable storage medium, and when the program is executed, the processes of the above-mentioned embodiments can be included. The storage medium can be a magnetic disc, an optical disc, a read-only memory (ROM) or a random access memory (RAM), etc.

[0104] The above description is merely specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any changes or replacements within the technical scope disclosed in the present application can be easily thought by those skilled in the art, and should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method for inspecting metal bumps in chip design, characterized in that: include: Acquiring preset category information of the simulated bumps, wherein the category information is information for classifying the simulated bumps corresponding one-to-one to the plurality of metal bumps on the chip into different categories according to characteristic information of the metal bumps; receiving a command for displaying a target simulated bump corresponding to a target category in the category information; According to the command, the target simulated bump corresponding to the target category is displayed, and other simulated bumps except the target simulated bump are hidden, so that the metal bump corresponding to the target simulated bump can be inspected during the chip design process; The displaying of the target simulated bump corresponding to the target category includes: Determining a target metal bump corresponding to the target simulated bump; Determining a display position of the target simulated bump according to position information of the target metal bump on the chip; The target simulation convex block corresponding to the target category is displayed at the determined display position.

2. The method according to claim 1, characterized in that The receiving a command for displaying a target simulated bump corresponding to a target category in the category information includes: Displaying operation buttons corresponding to each of the categories on a graphical user interface; By receiving a click operation of the user on the operation button, a command for displaying a target simulated bump corresponding to the target category in the category information is received.

3. The method according to claim 1, characterized in that The displaying of the target simulated bump corresponding to the target category includes: Determine the target display element corresponding to the target category according to the preset correspondence between the categories and display elements; the display element includes: graphic shape and / or color; The target simulated bump corresponding to the target category is displayed using the target display element.

4. The method according to claim 1, wherein The characteristic information of the metal bump includes at least one of the following: Identification information, type information and voltage information.

5. A device for inspecting metal bumps in chip design, characterized in that: include: an acquisition module, configured to acquire preset category information of the simulated bumps, wherein the category information is information for classifying the simulated bumps corresponding one-to-one to the plurality of metal bumps on the chip into different categories according to characteristic information of the metal bumps; a receiving module, configured to receive a command for displaying a target simulated bump corresponding to a target category in the category information; a display module configured to display the target simulated bump corresponding to the target category according to the command and hide other simulated bumps except the target simulated bump, so as to inspect the metal bump corresponding to the target simulated bump during chip design; Wherein, the display module is specifically used for: Determining a target metal bump corresponding to the target simulated bump; Determining a display position of the target simulated bump according to position information of the target metal bump on the chip; The target simulation convex block corresponding to the target category is displayed at the determined display position.

6. The device according to claim 5, characterized in that The receiving module is specifically configured to: Displaying operation buttons corresponding to each of the categories on a graphical user interface; By receiving a click operation of the user on the operation button, a command for displaying a target simulated bump corresponding to the target category in the category information is received.

7. The device according to claim 5, characterized in that The display module is specifically used for: Determine the target display element corresponding to the target category according to the preset correspondence between the categories and display elements; the display element includes: graphic shape and / or color; The target simulated bump corresponding to the target category is displayed using the target display element.

8. The device according to claim 5, characterized in that The characteristic information of the metal bump includes at least one of the following: Identification information, type information and voltage information.

9. An electronic device, characterized in that: include: A housing, a processor, a memory, a circuit board, and a power supply circuit, wherein the circuit board is placed inside the space enclosed by the housing, and the processor and the memory are arranged on the circuit board; the power supply circuit is used to supply power to various circuits or devices of the above-mentioned electronic device; the memory is used to store executable program code; the processor runs a program corresponding to the executable program code by reading the executable program code stored in the memory, and is used to execute any one of the aforementioned claims 1-4.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores one or more programs, and the one or more programs can be executed by one or more processors to implement the method according to any one of claims 1 to 4.

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