Display panel and display panel manufacturing method

Abstract

The embodiments of the present application provide a display panel and a method for manufacturing a display panel, and relate to the field of display technology. A gasket structure whose thickness increases from the side close to the packaging cover plate toward the side away from the packaging cover plate is provided in the bonding area of ​​the substrate extending relative to the packaging cover plate, and a bonding pin is provided on the gasket structure. With such a design, during the process of cleaning the bonding pins before bonding, the organic cleaning solvent can flow toward the packaging cover plate through the inclined surface formed by the gasket structure, so that the part of the bonding pin close to the packaging cover plate can be effectively cleaned, so that the bonding pin has a clean surface during bonding, thereby ensuring the bonding effect. Ensure that the display panel has good contact with the flexible circuit board after bonding, and the signal transmission is stable, so as to improve the display stability of the display panel during use.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for manufacturing the display panel. Background Art

[0002] The stability of display effect is a key indicator to measure the quality of display panels. However, after a display panel has been used for a period of time, the display effect may deteriorate, which will greatly affect the user experience. Therefore, how to improve the display stability of the display panel during use is a technical problem that technicians in this field urgently need to solve. Summary of the invention

[0003] In order to overcome the technical problems mentioned in the above technical background, embodiments of the present application provide a display panel and a method for manufacturing the display panel.

[0004] In a first aspect of the present application, a display panel is provided, comprising a substrate and a packaging cover plate;

[0005] The substrate includes a bonding area extending relative to the package cover;

[0006] The display panel also includes a gasket structure and bonding pins arranged in the bonding area;

[0007] In the bonding area, the gasket structure is arranged along the extension direction of the long side of the packaging cover plate close to the bonding area;

[0008] In a direction perpendicular to the light emitting surface of the display panel, the thickness of the gasket structure at one end away from the packaging cover plate is greater than the thickness of the gasket structure at one end close to the packaging cover plate;

[0009] The bonding pin is located at a side of the pad structure away from the substrate.

[0010] In the above structure, a gasket structure is provided in the bonding area of ​​the substrate extending relative to the package cover plate, the thickness of the gasket structure at the end away from the package cover plate is greater than the thickness at the end close to the package cover plate, and a bonding pin is provided on the gasket structure. With such a design, in the process of cleaning the bonding pins before bonding, the organic cleaning solvent can flow toward the package cover plate through the inclined surface formed by the gasket structure, so that the part of the bonding pin close to the package cover plate can be cleaned, so that the bonding pin has a clean surface during bonding, thereby ensuring the bonding effect. It can avoid the technical problem that the bonding effect is poor due to the unclean part of the bonding pin close to the package cover plate, thereby causing unstable signal transmission and poor display stability of the display panel during use.

[0011] In a possible embodiment of the present application, the gasket structure includes a gasket base consisting of a layer of structure; or,

[0012] The gasket structure includes a gasket base composed of a multi-layer structure.

[0013] In a possible embodiment of the present application, the gasket base is made of an insulating material, and the insulating material includes polyimide.

[0014] In a possible embodiment of the present application, the gasket structure further includes a planarization layer located on a side of the gasket base away from the substrate.

[0015] Since there may be an uneven step difference on the side of the gasket base away from the substrate, the above arrangement can form a flat surface on the side of the gasket structure away from the substrate, so that the bonding pins made thereon can be well bonded with the gold fingers on the flexible circuit board.

[0016] In a possible embodiment of the present application, in a direction perpendicular to the light emitting surface of the display panel, a thickness of the gasket structure on a side away from the packaging cover plate is less than or equal to half of the thickness of the packaging cover plate.

[0017] Such an arrangement can prevent the height of the flexible circuit board from being higher than the height of the packaging cover plate in the direction perpendicular to the light-emitting surface of the display panel after bonding the flexible circuit board, thereby causing the flexible circuit board to interfere with the glass cover plate after sealing and affecting the installation of the glass cover plate.

[0018] In a possible embodiment of the present application, preferably, in a direction perpendicular to the display panel, the thickness of the gasket structure increases from a side close to the package cover plate toward a side away from the package cover plate. Such an arrangement can accelerate the flow of the organic cleaning solvent.

[0019] According to a second aspect of the present application, an electronic device is provided. The electronic device includes the display panel according to the first aspect.

[0020] According to a third aspect of the present application, a method for manufacturing a display panel is provided, the method comprising:

[0021] Providing a substrate, wherein the substrate comprises a bonding manufacturing area and a non-bonding manufacturing area;

[0022] The thickness of the gasket structure at one end away from the non-bonding manufacturing area is greater than the thickness of the gasket structure at one end close to the non-bonding manufacturing area;

[0023] Making a bonding pin on a side of the pad structure away from the substrate;

[0024] A packaging cover is manufactured on the non-bonding manufacturing area, wherein the bonding manufacturing area is exposed relative to the packaging cover.

[0025] In a possible embodiment of the present application, the substrate is a base substrate, and the step of manufacturing a gasket structure in the bonding manufacturing area of ​​the substrate includes:

[0026] Making a gasket structure in the bonding production area of ​​the substrate base plate;

[0027] The step of making bonding pins on the side of the gasket structure away from the substrate includes: making the array driving layer in the non-bonding area of ​​the substrate and on the side of the gasket structure away from the substrate to form bonding pins on the gasket structure.

[0028] In a possible embodiment of the present application, the substrate is an array substrate, and the step of manufacturing a gasket structure in the bonding manufacturing area of ​​the substrate includes:

[0029] Making a gasket structure in the bonding production area of ​​the display substrate;

[0030] The step of making a bonding pin on a side of the pad structure away from the substrate comprises:

[0031] A bonding pin is made on a side of the pad structure away from the array substrate, and the bonding pin is connected to a corresponding electrical signal lead in the display substrate.

[0032] In a possible embodiment of the present application, the gasket structure includes a gasket base, and the step of manufacturing a gasket structure in the bonding manufacturing area of ​​the substrate includes:

[0033] Aligning a mesh area of ​​a mask plate with the bonding production area of ​​the substrate, wherein in the mesh area, the opening ratio of the mesh increases from a side close to the non-bonding production area toward a side away from the non-bonding production area;

[0034] An insulating material is deposited onto the bonding area through the mesh area of ​​the mask to form the pad base.

[0035] In a possible embodiment of the present application, the gasket structure includes a gasket base, and the step of manufacturing a gasket structure in the bonding manufacturing area of ​​the substrate includes:

[0036] Aligning an opening area of ​​a mask plate with a bonding production area of ​​the substrate;

[0037] In the horizontal direction, while the opening area of ​​the mask plate is gradually moved toward a side away from the non-bonding production area, insulating material is deposited at least twice in the bonding production area through the opening area of ​​the mask plate to form a gasket base composed of multiple insulating layers in the bonding production area.

[0038] In a possible embodiment of the present application, the gasket structure includes a gasket base, and the step of manufacturing a gasket structure in the bonding manufacturing area of ​​the substrate includes:

[0039] A plurality of stacked insulating layers are sequentially manufactured in the bonding area of ​​the substrate by evaporation and / or coating, and the gasket base is constituted by the plurality of stacked insulating layers, wherein in the direction from the bonding area to the non-bonding area, a lower insulating layer among adjacent insulating layers protrudes relative to an upper insulating layer among adjacent insulating layers.

[0040] In a possible embodiment of the present application, the step of manufacturing a gasket structure in the bonding manufacturing area of ​​the substrate further includes:

[0041] Making a planarization layer on a side of the gasket base away from the substrate;

[0042] When the substrate is a base substrate, the step of making a bonding pin on a side of the pad structure away from the substrate comprises:

[0043] When manufacturing the array driving layer in the non-bonding manufacturing area of ​​the substrate and the side of the pad structure away from the substrate, the bonding pins are formed on the side of the planarization layer away from the substrate;

[0044] When the substrate is an array substrate, the step of making bonding pins on a side of the gasket structure away from the base substrate includes:

[0045] Making a through hole penetrating the planarization layer and the gasket base;

[0046] The bonding pins are made on a side of the planarization layer away from the substrate, and are connected to corresponding electrical signal leads in the array substrate through the through holes.

[0047] Compared with the prior art, the embodiment of the present application provides a display panel and a method for manufacturing the display panel, in which a gasket structure is arranged in a bonding area of ​​the substrate extending relative to the package cover plate, the thickness of the gasket structure at the end away from the package cover plate is greater than the thickness at the end close to the package cover plate, and a bonding pin is arranged on the gasket structure. With such a design, in the process of cleaning the bonding pins before bonding, the organic cleaning solvent can flow toward the package cover plate through the inclined surface formed by the gasket structure, so as to clean the part of the bonding pin close to the package cover plate, so that the bonding pin has a clean surface during bonding, thereby ensuring the bonding effect, ensuring that the display panel after bonding has good contact with the flexible circuit board, making the signal transmission stable, and thereby improving the display stability of the display panel during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0049] Figure 1 It is a schematic diagram of the planar structure of a display panel in the prior art;

[0050] Figure 2 A schematic diagram of the planar structure of a display panel provided in an embodiment of the present application;

[0051] Figure 3 A schematic diagram of the film layer structure of a display panel provided in an embodiment of the present application;

[0052] Figure 4 A schematic diagram of a structure of a gasket structure provided in an embodiment of the present application;

[0053] Figure 5 Another structural schematic diagram of the gasket structure provided in the embodiment of the present application;

[0054] Figure 6 A flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0055] Figure 7 A display panel manufacturing process diagram provided for the first implementation of the embodiment of the present application;

[0056] Figure 8 A display panel manufacturing process diagram provided for the second implementation of the embodiment of the present application;

[0057] Fig. 9 A schematic structural diagram of a mask plate provided in an embodiment of the present application;

[0058] Fig.10 A schematic diagram is provided for an embodiment of the present application showing that an opening area of ​​a mask plate gradually moves toward a side away from a package cover plate. DETAILED DESCRIPTION

[0059] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0060] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0061] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0062] In the description of this application, it should be noted that the terms "upper", "lower", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0063] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0064] In response to the technical problems mentioned in the background technology, the inventors disassembled and analyzed a large number of display panels with the above-mentioned degraded display effect and found that one of the important reasons for the degraded display effect is the poor transmission of electrical signals. For this reason, the inventors checked the circuits of the display panels with problems and found that the poor bonding at the bonding position between the display panel and the flexible circuit board is a key factor causing the poor transmission of electrical signals.

[0065] The inventors further studied why the display panel and the flexible circuit board have poor bonding. They found that the bonding effect between the display panel and the flexible circuit board is reduced. Furthermore, the inventors found that the area where the bonding effect is reduced is mainly concentrated in the bonding pin area close to the package cover. Figure 1 , analyze the causes of the above problems.

[0066] Please refer to Figure 1The display panel 1' includes a display substrate 10' and a packaging cover plate 20' located on the display substrate 10', and the display substrate 10' includes a bonding area 101' extending relative to the packaging cover plate 20', wherein the bonding area 101' includes a bonding pin area 1011' for arranging bonding pins 10111'. With the improvement of the screen-to-body ratio requirement, the space of the non-display area is further compressed, and the size of the bonding area 101' is getting smaller and smaller, wherein the distance between the bonding pin area 1011' and the packaging cover plate 20' is getting smaller and smaller, even as small as 0.13mm or less. Since there are multiple processes and multiple transportations in the process from the production of the bonding pin 10111' to the bonding, dust, dirt, foreign matter and other impurities will inevitably be generated on the surface of the bonding pin 10111', so the bonding pin 10111' needs to be cleaned before bonding. Specifically, the impurities on the surface of the bonding pin 10111' are generally removed by clamping a dust-free cloth dipped in a cleaning solution (e.g., alcohol) with a cleaning chuck. However, since the thinnest thickness of the dust-free cloth is about 0.15 mm, it is difficult to completely remove all the impurities on the bonding pin 10111' near the package cover plate 20' when the above method is used to clean the impurities on the surface of the bonding pin 10111'. As a result, after the display panel 1' is bonded to the flexible circuit board, there are bonding indentations, the conductive particle deformation ratio of the conductive adhesive layer (e.g., anisotropic conductive film (ACF)) between the display panel and the flexible circuit board after bonding does not meet the standard, the reliability test fails, and even the display panel has poor display during use after leaving the factory. Among them, technical problems such as bonding indentation, conductive particle deformation ratio not meeting the standard in the conductive adhesive layer between the display panel and the flexible circuit board after bonding, and reliability test failure can be discovered and repaired at any time during the production process of the display panel. However, after the display panel leaves the factory, if poor display occurs, the display effect of the display panel will be unstable, which will cause a bad user experience for customers and affect the market competitiveness of the product.

[0067] In order to solve the technical problems mentioned above, the embodiment of the present application innovatively sets a gasket structure in the bonding area extending relative to the package cover plate, the thickness of the gasket structure at the end away from the package cover plate is greater than the thickness at the end close to the package cover plate, and a bonding pin is set on the gasket structure. The specific implementation scheme of the present application will be described in detail below in conjunction with the accompanying drawings.

[0068] To better describe the technical solution provided by the embodiments of this application, please refer to Figure 2 and Figure 3 , Figure 2 FIG. 1 shows a schematic diagram of a planar structure of a display panel provided in an embodiment of the present application. Figure 3A schematic diagram of the film layer structure of a display panel provided in an embodiment of the present application is shown.

[0069] In this embodiment, the display panel 1 may include a substrate 10 and a package cover plate 20, wherein the package cover plate 20 is located on the light emitting surface side of the substrate 10. The substrate 10 may include a bonding area 101 extending relative to the package cover plate 20, and the display panel 1 may further include a gasket structure 30 and bonding pins 10111 disposed in the bonding area 101, wherein the substrate 10 may be a base substrate, or an array substrate after an array driving layer is formed on the base substrate.

[0070] In the bonding area 101, the gasket structure 30 is arranged along the direction of the long side of the package cover plate 20 close to the bonding area 101, and in the direction perpendicular to the display panel 1, the thickness of the gasket structure 30 at the end away from the package cover plate 20 is greater than the thickness of the gasket structure 30 at the end close to the package cover plate 20. The bonding pin 10111 is located on the side of the gasket structure 30 away from the substrate 10.

[0071] In the above structure, during the process of cleaning the bonding pins 10111 before bonding, the organic cleaning solvent can flow toward the package cover plate 20 through the inclined surface formed by the gasket structure 30, so that the portion of the bonding pins 10111 close to the package cover plate 30 can be cleaned, so that the bonding pins 10111 have a clean surface during bonding, thereby ensuring the bonding effect. In this way, it can be ensured that the display panel 1 has good contact with the flexible circuit board (not shown in the figure) after bonding, so that the signal transmission is stable, so as to improve the display stability of the display panel 1 during use.

[0072] Furthermore, the gasket structure 30 may include a gasket base 31, wherein the gasket base 31 may be formed of a single layer structure or a multi-layer structure. Figure 4 When the gasket base 31 is formed by a one-layer structure, the gasket base 31 can be formed by one-time evaporation or coating. Specifically, the mesh area of ​​the mask plate can be aligned with the bonding area 101, wherein the mesh opening rate in the mesh area of ​​the mask plate increases from the side close to the package cover plate 20 toward the side away from the package cover plate 20. The gasket base 31 is formed by depositing the manufacturing material through the mesh area of ​​the mask plate to the bonding area 101 of the substrate 10. Please refer to Figure 5 When the gasket base 31 is formed with a multi-layer structure, the gasket base 31 can be formed by multiple evaporation or coating methods; the opening area of ​​the mask plate can be gradually moved to the side away from the packaging cover plate 20, and during the movement, the deposition of the manufacturing material can be performed multiple times in the bonding area 101 through the opening area of ​​the mask plate.

[0073] In the embodiment of the present application, the pad base 31 may be made of an insulating material, and the insulating material may include polyimide. Polyimide has a wide operating temperature range and high insulation performance, which can ensure that the bonding pins 10111 made thereon have stable electrical characteristics.

[0074] Further, please refer again to Figure 4 and Figure 5 The gasket structure 30 also includes a planarization layer 32 located on the side of the gasket base 31 away from the substrate 10, wherein the planarization layer 32 can also be made of an insulating material. In the embodiment of the present application, the planarization layer 32 can be made of the same material as the planarization layer made in the substrate 10.

[0075] Through the above arrangement, the side of the gasket structure 30 away from the substrate 10 can form a flat surface, so that the bonding pins 10111 made thereon can be well bonded with the gold fingers on the flexible circuit board.

[0076] Furthermore, in a direction perpendicular to the display panel 1 , the thickness of the side of the gasket structure 30 away from the packaging cover plate 20 is less than or equal to one half of the thickness of the packaging cover plate 20 .

[0077] With such an arrangement, after the flexible circuit board is bonded, it can be avoided that the height of the flexible circuit board is higher than the height of the packaging cover plate 20 in the direction perpendicular to the light-emitting surface of the display panel 1, thereby causing the flexible circuit board to interfere with the top glass cover plate (not shown in the figure) after sealing, thereby affecting the attachment of the top glass cover plate.

[0078] In the embodiment of the present application, the side of the gasket structure 30 away from the substrate 10 can be a flat inclined surface or an uneven inclined surface (for example, a curved surface or a step surface). Preferably, the side of the gasket structure 30 away from the substrate 10 is a flat inclined surface. Such an arrangement allows the thickness of the gasket structure 30 to increase from the side close to the packaging cover plate 20 toward the side away from the packaging cover plate 20. On the one hand, the flow of the organic cleaning solvent can be accelerated, and on the other hand, the bonding pins made on its surface have a flat surface, which is convenient for good bonding with the gold fingers on the flexible circuit board.

[0079] In the embodiment of the present application, after the bonding pins 10111 are cleaned with an organic cleaning solvent, the organic cleaning solvent remaining on the display panel 1 can be removed by plasma to ensure that the surface of the bonding pins 10111 is clean.

[0080] In the above structure provided by the embodiment of the present application, in the process of cleaning the bonding pins before bonding, the organic cleaning solvent (such as alcohol) can flow toward the package cover plate 20 through the inclined surface formed by the gasket structure 30, so that the portion of the bonding pin 10111 close to the package cover plate 20 can be cleaned, so that the bonding pin 10111 has a clean surface during bonding, thereby ensuring the bonding effect. This avoids the technical problem that the bonding effect is poor due to the unclean portion of the bonding pin 10111 close to the package cover plate 20, thereby causing unstable signal transmission, and then causing poor display stability of the display panel during use. In this way, the display stability of the display panel 1 can be effectively improved, the user experience can be improved, and the market competitiveness of the product can be increased.

[0081] An embodiment of the present application also provides an electronic device, which may include the display panel 1 described above. The display panel 1 can provide a stable display effect for the electronic device to improve the user experience during use and increase the market competitiveness of the electronic device.

[0082] The present application also provides a method for manufacturing a display panel. Figure 6 , Figure 6 The following is a schematic diagram of the process of manufacturing a display panel. Figure 6 A display panel manufacturing method is introduced in detail.

[0083] Step S11, providing a substrate.

[0084] The substrate can be a base substrate or an array substrate after an array driving layer is formed on the base substrate, wherein the base substrate can be a glass substrate or a flexible substrate, and the substrate includes a bonding production area and a non-bonding production area, wherein the non-bonding production area can be used to produce a display area, and the bonding production area can be used to produce a bonding area.

[0085] Step S12, manufacturing a gasket structure in the bonding manufacturing area of ​​the substrate.

[0086] The gasket structure is arranged along the extension direction of the boundary between the non-bonding manufacturing area and the bonding manufacturing area. In the direction perpendicular to the substrate, the thickness of the gasket structure at one end away from the non-bonding manufacturing area is greater than the thickness of the gasket structure at one end close to the non-bonding manufacturing area. In this embodiment, the side of the gasket structure close to the non-bonding manufacturing area may not start from the boundary between the non-bonding manufacturing area and the bonding manufacturing area, and it is sufficient that the bonding pins to be manufactured subsequently are located on the gasket structure. In addition, the side of the gasket structure close to the non-bonding manufacturing area is at a certain distance from the boundary between the non-bonding manufacturing area and the bonding manufacturing area, which can ensure that no interference will occur during the subsequent cover packaging.

[0087] Step S13, making bonding pins on a side of the pad structure away from the substrate.

[0088] Step S14, manufacturing a packaging cover plate on the non-bonding manufacturing area, wherein the bonding manufacturing area is exposed relative to the packaging cover plate.

[0089] In the first implementation of the embodiment of the present application, the substrate is a base substrate 100, please refer to Figure 7 As shown in the process flow chart, the above method can be specifically implemented through the following steps.

[0090] First, a base substrate 100 is provided.

[0091] Next, the pad structure 30 is directly fabricated on the bonding region 1002 of the substrate.

[0092] Then, an array driving layer 1003 is manufactured in the non-bonding manufacturing area 1001 of the base substrate 100 and the side of the gasket structure 30 away from the base substrate. In the process of manufacturing the array driving layer 1003, the metal layer in the array driving layer (for example, the first metal layer M1, the second metal layer M2, the third metal layer M3 or the third metal layer M4) covers the side of the gasket structure 30 away from the base substrate 100, and in the process of patterning the corresponding metal layer, a bonding pin 10111 is manufactured on the side of the gasket structure away from the substrate 100. For example, when the bonding pin 10111 is manufactured using the third metal layer M3, the manufactured bonding pin 10111 can be directly connected to the electrical signal lead 10031 (for example, the source or drain of the TFT transistor) manufactured using the third metal layer M3. After the array driving layer 1003 is manufactured, a pixel light emitting layer 1004 can also be manufactured on the array driving layer 1003 in the non-bonding manufacturing area 1001.

[0093] Finally, a packaging cover plate 20 is manufactured on the non-bonding manufacturing area 1001 .

[0094] In the second implementation of the embodiment of the present application, the substrate is an array substrate. Figure 8 As shown in the process flow chart, the above method can be specifically implemented through the following steps.

[0095] First, an array substrate 11 is manufactured.

[0096] The array substrate 11 includes a base substrate 100 and an array driving layer 1003 fabricated in a non-bonding manufacturing area 1001 and a bonding manufacturing area 1002 of the base substrate 100 , wherein the array driving layer 1003 includes an electrical signal lead 10031 .

[0097] Next, the spacer structure 30 is directly manufactured on the bonding manufacturing area 1002 of the array substrate.

[0098] After the gasket structure 30 is manufactured, a through hole 33 penetrating the gasket structure 30 is formed in the gasket structure 30 by etching, wherein the penetration direction is perpendicular to the direction of the array substrate 11 , and the electrical signal lead 10031 in the array driving layer 1003 corresponds to the bottom of the through hole 33 .

[0099] Then, a bonding pin 10111 is made on the side of the gasket structure 30 away from the array substrate, and the bonding pin 10111 is connected to the corresponding electrical signal lead in the array substrate. Specifically, the bonding pin 10111 can be connected to the electrical signal lead 10031 located in the bonding production area 1002 through a through hole 33 passing through the gasket structure 30.

[0100] Finally, a packaging cover plate 20 is manufactured on the non-bonding manufacturing area 1001 .

[0101] Specifically, after the pixel light emitting layer 1004 is manufactured on the array driving layer 1003 of the non-bonding manufacturing area 1001 , a packaging cover plate 20 is manufactured on the non-bonding manufacturing area 1001 .

[0102] In one implementation of the embodiment of the present application, the gasket structure 30 may include a gasket base 31 , based on which, step S12 may be implemented in the following manner.

[0103] First, a mesh area of ​​a mask is aligned with the bonding region 1002 of the substrate 100 .

[0104] For details, please refer to Fig. 9 , Fig. 9 A possible structural schematic diagram of the mask plate 5 is shown, wherein the mesh area 50 of the mask plate 5 has a comparable size to the bonding production area 1002, wherein in the mesh area 50, the opening ratio of the mesh 501 increases from the side close to the non-bonding production area 1001 toward the side away from the non-bonding production area 1001, wherein the opening ratio of the mesh 501 refers to the opening area per unit area.

[0105] Then, an insulating material is deposited onto the bonding area 1002 of the substrate 10 through the mesh area of ​​the mask to form a pad base 31 .

[0106] In this embodiment, the gasket base 31 may be formed by one-time evaporation or coating. The gasket base 31 formed in this embodiment is a one-layer structure.

[0107] In another implementation of the embodiment of the present application, the gasket structure 30 may include a gasket base 31 , based on which, step S12 may be implemented in the following manner.

[0108] First, the opening area 60 of a mask plate 5 is aligned with the bonding area 1002 of the substrate 10 .

[0109] Then, in the horizontal direction, the opening area 60 of the mask plate 5 is gradually moved to the side away from the non-bonding production area 1001, and during the movement, multiple depositions of insulating materials are performed in the bonding production area 1002 through the opening area 60 of the mask plate 5 to form a gasket base 31 composed of multiple insulating layers in the bonding production area 1002.

[0110] For details, please refer to Fig.10 , Fig.10 A schematic diagram is shown of gradually moving the opening area 60 of the mask plate 5 toward a side away from the non-bonding production area 1001. By performing multiple evaporation or coating during the above-mentioned movement process, a gasket base 31 with a thickness gradually increasing from the side close to the non-bonding production area 1001 toward the side away from the package non-bonding production area 1001 can be formed in the bonding production area 1002.

[0111] In other implementations of the embodiments of the present application, the gasket structure 30 may include a gasket base 31 , based on which, step S12 may also be implemented in the following manner.

[0112] Multiple stacked insulating layers are sequentially manufactured in the bonding area of ​​the substrate by evaporation and / or coating, wherein the stacked insulating layers can all be manufactured by evaporation; or all be manufactured by coating; or part of the insulating layers can be manufactured by evaporation and the other part by coating.

[0113] In the process of sequentially manufacturing adjacent insulating layers in the stacked insulating layers, in the direction from the bonding region toward the non-bonding region, the lower insulating layer in the adjacent insulating layers protrudes relative to the upper insulating layer in the adjacent insulating layers.

[0114] It is understandable that the above three implementations are only three possible solutions for making the gasket base 31 listed in the present application, and it should not be understood that the present application can only be implemented in these two ways. In other implementations of the present application, other methods can also be used to make the gasket base 31, for example, by first making a whole layer of gasket film layer, and then etching to form a gasket base 31 with a thickness increasing from the side close to the non-bonding manufacturing area 1001 to the side away from the non-bonding manufacturing area 1001.

[0115] In an embodiment of the present application, after manufacturing the gasket base 31, step S12 may also include a process of manufacturing a planarization layer 32 on the side of the gasket base 31 away from the substrate, and the planarization layer 32 is used to form a flat surface on the side of the gasket structure 30 away from the substrate 10, so that the bonding pins 10111 manufactured subsequently can be well bonded with the gold fingers on the flexible circuit board.

[0116] Further, in the first implementation of the embodiment of the present application, the substrate 100 is a base substrate, and step S13 can be implemented in the following manner.

[0117] When the array driving layer is manufactured in the non-bonding manufacturing area 1001 of the base substrate and the side of the gasket structure 30 facing away from the base substrate, the bonding pins 10111 are formed on the side of the planarization layer 32 away from the base substrate.

[0118] In a second implementation of the embodiment of the present application, the substrate 100 is an array substrate, and step S13 can be implemented in the following manner.

[0119] First, a through hole is made that penetrates the planarization layer 32 and the pad base 31, and then a bonding pin 10111 is made on the side of the planarization layer 32 away from the array substrate, and connected to the corresponding electrical signal lead in the array substrate through the through hole. Specifically, in the process of making the bonding pin 10111, the metal layer making the bonding pin 10111 realizes the connection between the bonding pin 10111 and the corresponding electrical signal lead in the array substrate by filling the through hole.

[0120] The embodiments of the present application provide a display panel and a method for manufacturing a display panel, wherein a gasket structure is provided in a bonding area of ​​a substrate extending relative to a packaging cover plate, the thickness of the gasket structure at one end away from the packaging cover plate is greater than the thickness at one end close to the packaging cover plate, and a bonding pin is provided on the gasket structure. With such a design, during the process of cleaning the bonding pins before bonding, an organic cleaning solvent can flow toward the packaging cover plate through the inclined surface formed by the gasket structure, so that the portion of the bonding pin close to the packaging cover plate can be effectively cleaned, so that the bonding pin has a clean surface during bonding, thereby ensuring the bonding effect. In this way, the technical problem that the bonding effect is poor due to the unclean portion of the bonding pin close to the packaging cover plate, thereby causing unstable signal transmission and poor display stability of the display panel during use can be avoided. In this way, it can be ensured that the display panel has good contact with the flexible circuit board after bonding, so that the signal transmission is stable, thereby improving the display stability of the display panel during use.

[0121] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A display panel, characterized in that: Including a substrate and a packaging cover; The substrate includes a bonding area extending relative to the package cover; The display panel also includes a gasket structure and bonding pins arranged in the bonding area; In the bonding area, the gasket structure is arranged along the extension direction of the long side of the packaging cover plate close to the bonding area; In a direction perpendicular to the display panel, the thickness of the gasket structure at one end away from the packaging cover plate is greater than the thickness of the gasket structure at one end close to the packaging cover plate, wherein the side of the gasket structure away from the substrate is an inclined surface; The bonding pin is located at a side of the pad structure away from the substrate.

2. The display panel according to claim 1, wherein: The gasket structure comprises a gasket base consisting of a layer of structure; or, The gasket structure includes a gasket base composed of a multi-layer structure.

3. The display panel according to claim 2, wherein: The gasket base is made of insulating material, and the insulating material includes polyimide.

4. The display panel according to claim 2, wherein: The pad structure further includes a planarization layer located on a side of the pad base away from the substrate.

5. The display panel according to claim 2, wherein: In a direction perpendicular to the display panel, a thickness of a side of the gasket structure away from the packaging cover plate is less than or equal to half of the thickness of the packaging cover plate.

6. The display panel according to claim 2, wherein: In a direction perpendicular to the display panel, the thickness of the gasket structure increases gradually from a side close to the packaging cover plate toward a side away from the packaging cover plate.

7. A method for manufacturing a display panel, characterized in that: The method comprises: Providing a substrate, wherein the substrate comprises a bonding manufacturing area and a non-bonding manufacturing area; A gasket structure is manufactured in the bonding manufacturing area of ​​the substrate, wherein in a direction perpendicular to the substrate, the thickness of the gasket structure at one end away from the non-bonding manufacturing area is greater than the thickness of the gasket structure at one end close to the non-bonding manufacturing area, wherein the side of the gasket structure away from the substrate is an inclined surface; Making a bonding pin on a side of the pad structure away from the substrate; A packaging cover is manufactured on the non-bonding manufacturing area, wherein the bonding manufacturing area is exposed relative to the packaging cover.

8. The method for manufacturing a display panel according to claim 7, wherein: The substrate is a base substrate, and the step of manufacturing a gasket structure in the bonding manufacturing area of ​​the substrate includes: Making a gasket structure in the bonding production area of ​​the substrate base plate; The step of making a bonding pin on a side of the pad structure away from the substrate comprises: An array driving layer is manufactured in the non-bonding manufacturing area of ​​the substrate and on the side of the pad structure away from the substrate to form bonding pins on the pad structure.

9. The method for manufacturing a display panel according to claim 7, wherein: The substrate is an array substrate, and the step of manufacturing a gasket structure in the bonding manufacturing area of ​​the substrate includes: Making a gasket structure in the bonding area of ​​the array substrate; The step of making a bonding pin on a side of the pad structure away from the substrate comprises: A bonding pin is made on a side of the pad structure away from the array substrate, and the bonding pin is connected to a corresponding electrical signal lead in the array substrate.

10. The method for manufacturing a display panel according to claim 7, wherein: The gasket structure includes a gasket base, and the step of manufacturing a gasket structure in the bonding manufacturing area of ​​the substrate includes: Aligning a mesh area of ​​a mask plate with the bonding production area of ​​the substrate, wherein in the mesh area, the opening ratio of the mesh increases from a side close to the non-bonding production area toward a side away from the non-bonding production area; An insulating material is deposited onto the bonding area through the mesh area of ​​the mask to form the pad base.

11. The method for manufacturing a display panel according to claim 7, wherein: The gasket structure includes a gasket base, and the step of manufacturing a gasket structure in the bonding manufacturing area of ​​the substrate includes: Aligning an opening area of ​​a mask plate with a bonding production area of ​​the substrate; In the horizontal direction, while the opening area of ​​the mask plate is gradually moved toward a side away from the non-bonding production area, insulating material is deposited at least twice in the bonding production area through the opening area of ​​the mask plate to form a gasket base composed of multiple insulating layers in the bonding production area.

12. The method for manufacturing a display panel according to claim 7, wherein: The gasket structure includes a gasket base, and the step of manufacturing a gasket structure in the bonding manufacturing area of ​​the substrate includes: A plurality of stacked insulating layers are sequentially manufactured in the bonding area of ​​the substrate by evaporation and / or coating, and the gasket base is constituted by the plurality of stacked insulating layers, wherein in the direction from the bonding area to the non-bonding area, a lower insulating layer among adjacent insulating layers protrudes relative to an upper insulating layer among adjacent insulating layers.

13. The method for manufacturing a display panel according to any one of claims 10 to 12, characterized in that: The step of manufacturing a gasket structure in the bonding manufacturing area of ​​the substrate further includes: Making a planarization layer on a side of the gasket base away from the substrate; When the substrate is a base substrate, the step of making a bonding pin on a side of the pad structure away from the substrate comprises: When manufacturing the array driving layer in the non-bonding manufacturing area of ​​the substrate and the side of the pad structure away from the substrate, the bonding pins are formed on the side of the planarization layer away from the substrate; When the substrate is an array substrate, the step of making bonding pins on a side of the gasket structure away from the base substrate includes: Making a through hole penetrating the planarization layer and the gasket base; The bonding pins are made on a side of the planarization layer away from the substrate, and are connected to corresponding electrical signal leads in the array substrate through the through holes.

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