Antenna device

Abstract

The present invention discloses an antenna device, comprising: a lower shell; an intermediate shell, which is arranged on the lower shell and has a first heat sink formed on one side; a first accommodating space, which is formed by the lower shell and the intermediate shell; at least one first heating element, which is arranged in the first accommodating space; at least one heat dissipation support platform, which is arranged on the intermediate shell and has a second heat sink formed on at least one side; and an antenna module, which is supported on the at least one heat dissipation support platform.

Description

Technical Field

[0001] The invention relates to an antenna device. Background Art

[0002] The contents recorded in this section are only used to provide background information of the present invention and do not constitute prior art.

[0003] Wireless communication technology, such as MIMO (Multi-Input and Multi-Output) technology, is a technology that enables a breakthrough increase in data transmission capacity by using multiple antennas (ANTs). As a feasible antenna system, it can send and receive more data by increasing the channel capacity.

[0004] Therefore, by increasing the number of transmitting and receiving antennas at the same time, the channel capacity can be increased, so more data can be transmitted. For example, if the number of antennas is increased to 10, compared with the current single antenna system, when using the same frequency band, it is possible to ensure about 10 times the channel capacity.

[0005] In MIMO technology, as the number of ANTs increases, the number of transmitters and filters also increases. In addition, in order to expand the coverage of MIMO antennas, high power output is required. The power consumption and heat generated by such high power output will have a negative effect on reducing weight and size.

[0006] In particular, when installing a MIMO antenna composed of a stacked structure of modules consisting of RF (Radio Frequency) components and digital components in a limited space, the necessity of simplifying and miniaturizing the design is becoming increasingly apparent in order to maximize installation convenience or space utilization. In addition, in this case, it is necessary to design a heat dissipation structure in the installed communication components to effectively dissipate heat. Summary of the invention

[0007] 1. Technical issues to be resolved

[0008] Therefore, a main object of the present invention is to provide a MIMO antenna device having excellent heat dissipation characteristics.

[0009] The technical problems to be solved by the present invention are not limited to the above descriptions, and a person skilled in the art can clearly understand other technical problems not mentioned in this document through the following descriptions.

[0010] (II) Technical solution

[0011] According to one embodiment of the present invention, there is provided an antenna device, comprising: a lower shell; an intermediate shell, which is arranged on the lower shell and includes a first heat sink formed on one side; a first accommodating space, which is formed by the lower shell and the intermediate shell; at least one first heating element, which is arranged in the first accommodating space; at least one heat dissipation support platform, which is arranged on the intermediate shell and has a second heat sink formed on at least one side; and an antenna module, which is supported on the at least one heat dissipation support platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a front perspective view of an antenna device according to an embodiment of the present invention.

[0013] Figure 2 is a bottom perspective view of an antenna device according to an embodiment of the present invention.

[0014] Figure 3 is an exploded perspective view of an antenna device according to an embodiment of the present invention.

[0015] Figure 4 It is a three-dimensional diagram of the state in which the heat dissipation support platform and the intermediate shell are combined according to an embodiment of the present invention.

[0016] Figure 5 It is a top view of the state where the heat dissipation support platform and the intermediate shell are combined according to an embodiment of the present invention.

[0017] Figure 6 It is a front view of the state where the heat dissipation support platform and the intermediate shell are combined according to one embodiment of the present invention.

[0018] Figure 7 1 is a front perspective view of the interior of a heat dissipation support platform according to an embodiment of the present invention.

[0019] Figure 8 FIG. 4 is an exploded perspective view of a fan module according to an embodiment of the present invention.

[0020] Fig. 9 is a front perspective view of an antenna device according to another embodiment of the present invention.

[0021] Fig.10 is an exploded perspective view of an antenna device according to another embodiment of the present invention.

[0022] Fig.11 It is a top view of a state where a heat dissipation support platform and an intermediate shell are combined according to another embodiment of the present invention.

[0023] Fig.12 It is a front view of the state where the heat dissipation support platform and the intermediate shell are combined according to another embodiment of the present invention.

[0024] Fig.13 is a front perspective view of an antenna device according to yet another embodiment of the present invention.

[0025] Fig.14 is an exploded perspective view of an antenna device according to yet another embodiment of the present invention.

[0026] Fig.15 1 is a top view of a state where a heat dissipation support platform and an intermediate shell are combined according to another embodiment of the present invention.

[0027] Fig.16 It is a front view of a state where a heat dissipation support platform of an antenna device according to another embodiment of the present invention is combined with an intermediate housing. DETAILED DESCRIPTION

[0028] The embodiments of the present invention are described in detail below with reference to the accompanying drawings. When marking the figure numerals, the same figure numerals are used as much as possible even if the same components appear in different drawings. It should also be noted that throughout the specification, if it is considered that the detailed description of the relevant known components and functions may make the subject matter of the present invention unclear, the detailed description thereof will be omitted.

[0029] In the process of describing the components of the embodiments of the present invention, terms such as first, second, i), ii), a), b) may be used. These terms are only used to distinguish the corresponding components from other components, and do not limit their nature, order or sequence, etc. Throughout the entire specification, if a component "includes" or "has" another component, unless otherwise stated, it can be understood that a component also includes another component, rather than being understood as one component excluding another component.

[0030] In order to avoid confusion in understanding the present invention, the term "above" or "upward" refers to the area where the antenna cover 190 (see FIG. Figure 1 ) direction. In addition, 'below' or 'lower side' (downward) refers to the lower housing 110 (refer to Figure 1 ) direction. In addition, 'sideward' refers to a direction between the upper side and the lower side. In addition, "on..." includes the case where it is located above in contact with the reference surface and the case where it is located above without contacting the reference surface.

[0031] In the present invention, the 'first direction' refers to the direction from bottom to top. In addition, the 'second direction', as a direction different from the first direction, preferably refers to a direction perpendicular to the first direction. In addition, the 'third direction', as a direction different from the first direction and the second direction, preferably refers to a direction perpendicular to both the first direction and the second direction. In the present invention, it is assumed that the second direction is the width direction of the intermediate shell 140 and the third direction is the length direction of the intermediate shell 140 and is described, but it is not necessarily limited to this. As described above, the terms related to the direction are used for the convenience of explanation and to prevent confusion during understanding, and are not used to limit the scope of rights of the present invention.

[0032] In addition, the circuits illustrated in the drawings of the present invention are only abstractly represented to facilitate understanding and do not belong to the essential content of the invention. Therefore, the scope of rights of the present invention is not limited thereto.

[0033] Figure 1 is a front perspective view of an antenna device according to an embodiment of the present invention. Figure 2 is a bottom perspective view of an antenna device according to an embodiment of the present invention. Figure 3 is an exploded perspective view of an antenna device according to an embodiment of the present invention.

[0034] Reference Figures 1 to 3 The antenna device 100 may include a lower shell 110, an intermediate shell 140, a first accommodating space 120 formed by the lower shell 110 and the intermediate shell 140, a first heating element 122, a heat dissipation support platform 150 and all or part of an antenna module 160.

[0035] The lower housing 110 is located at the lowermost side of the antenna device 100. Figure 2 , the lower housing 110 may include a lower heat dissipation portion 112 .

[0036] The lower heat dissipation portion 112 may be a heat sink formed by at least one heat dissipation fin extending from one surface of the lower housing 110 toward the outside of the antenna device 100. However, the lower heat dissipation portion 112 may be in a curved shape such as a meander pattern as required.

[0037] The lower heat dissipation portion 112 may be formed by extrusion integrally with the lower housing 110 . However, the present invention is not limited thereto, and the lower heat dissipation portion 112 may be independently manufactured and detachably mounted on the lower housing 110 .

[0038] The intermediate housing 140 is disposed on the lower housing 110, at least a portion of which contacts the lower housing 110, and can form the first accommodation space 120. At this time, the intermediate housing 140 and the lower housing 110 can be combined by plugging.

[0039] One side of the intermediate housing 140 includes at least one first heat sink 142 protruding toward the second direction. The specific structure and effect of the first heat sink 142 will be described in detail below. Figures 4 to 6 Detailed description is given in .

[0040] The first accommodation space 120 is a space formed by combining the lower housing 110 and the middle housing 140. The first accommodation space 120 may be provided with a first heating element 122 and a digital board 130, etc.

[0041] The first heating element 122 includes a substrate and a power supply unit (Power Supply Unit, PSU) installed on the substrate. In this case, the substrate can be implemented by a printed circuit substrate (PCB). In addition, the PSU is configured to provide working power to electronic components including multiple communication components. A docking protrusion (not shown) is provided on the PSU for docking installation through a docking hole (not shown) formed on the inner side of the lower shell 110, but is not necessarily limited to this. In addition, the heat generated by the PSU during operation will be transferred to at least one of the lower shell 110 and the intermediate shell 140 through the docking protrusion and the docking hole. Therefore, if the heat generated by the PSU is transferred to the lower shell 110, it can be dissipated to the outside through the lower heat dissipation portion 112, so that the first accommodating space 120 can be properly cooled.

[0042] If the heat generated by the PSU is transferred to the intermediate housing 140 , the heat will be dissipated through the first heat sink 142 , so that the first accommodation space 120 can be properly cooled.

[0043] A digital processing circuit is formed on the digital board 130. Specifically, the digital board 130 performs the function of transmitting to the base station by converting the digital signal received from the base station into an analog RF (Radio Frequency) signal and converting the analog RF signal received from the antenna module 160 into a digital signal.

[0044] At least one heat dissipation support platform 150 is disposed on the intermediate housing 140 . The heat dissipation support platform 150 is configured such that one end is supported by one surface of the intermediate housing 140 and at least a portion of the other end is electrically connected to the antenna module 160 .

[0045] At least one heat dissipation support platform 150 protrudes along the first direction and extends along the third direction. In addition, when a plurality of heat dissipation support platforms 150 are arranged, at least a portion of the plurality of heat dissipation support platforms 150 may be arranged to be spaced apart along the second direction. In addition, when a plurality of heat dissipation support platforms 150 are arranged, at least a portion of the plurality of heat dissipation support platforms 150 may be arranged so that at least one side thereof contacts each other. Therefore, the space may be effectively integrated.

[0046] The plurality of heat dissipation support platforms 150 are preferably arranged side by side with each other. Therefore, a space can be formed between the adjacent plurality of heat dissipation support platforms 150, so that air can circulate. Therefore, the heat generated by the electronic components can be discharged to the outside of the antenna device 100 through the flow path. However, the heat dissipation support platform 150 according to the present invention is not limited thereto, and the plurality of heat dissipation support platforms 150 can be arranged crosswise in a V-shape between the adjacent heat dissipation support platforms 150.

[0047] The cross section of the heat dissipation support platform 150 may be a rectangle, but is not limited thereto, and may be a trapezoidal shape with a decreasing height at at least one end.

[0048] The heat dissipation support platform 150 may include at least one second heat dissipation fin 154 protruding from at least one side surface toward the second direction and along the first direction. The specific structure and effect of the second heat dissipation fin 154 will be described in detail in Figures 4 to 6 Detailed description is given in .

[0049] The antenna module 160 includes a communication component, such as an antenna element 164, mounted on an antenna substrate 162. In this case, the antenna substrate 162 may be implemented by a printed circuit substrate (PCB). In addition, the antenna substrate has a structure in which cavity filters (not shown) corresponding to the number of antenna elements 164 are arranged on the back and then related substrates (not shown) are stacked.

[0050] The fan module 170 may be disposed on at least one side of the antenna device 100. The fan module 170 is configured to cool the antenna device 100 by providing cold air to the inside of the antenna device 100. To this end, the fan module 170 is disposed adjacent to one end of the heat dissipation support platform 150 extending in the third direction.

[0051] In one embodiment of the present invention, the fan module 170 is shown as being arranged only on one side of the antenna device 100. However, the present invention is not limited thereto, and may also be arranged on another side of the antenna device 100. That is, a plurality of fan modules 170 may be arranged adjacent to one end and the other end of the heat dissipation support platform 150 extending in the third direction, respectively.

[0052] In addition, the specific structure of the fan module 170 will be described in Figure 8 Detailed description in.

[0053] The antenna device 100 may further include a mesh portion 180. The mesh portion 180 is disposed on the other side of the antenna device 100 to be adjacent to the other end of the heat dissipation support platform 150 extending in the third direction. Cool air can be sucked in or exhaled through the mesh portion 180. Thus, the heated air inside the antenna device 100 can be exhaled to the outside, thereby appropriately cooling the antenna device 100.

[0054] The mesh portion 180 includes at least one hole, and the at least one hole may be a regular hexagonal shape. In this case, the antenna device 100 may have effects such as structural stability and material cost saving. However, the present invention is not limited thereto, and the at least one hole may have various shapes and sizes.

[0055] The antenna device 100 may further include a radome 190. The radome 190 is disposed on the antenna module 160 and covers at least a portion of the antenna module 160. The radome 190 plays a role in protecting the antenna module 160 from external wind pressure and the like.

[0056] Figure 4 It is a three-dimensional diagram of the state in which the heat dissipation support platform and the intermediate shell are combined according to an embodiment of the present invention. Figure 5 It is a top view of the state where the heat dissipation support platform and the intermediate shell are combined according to an embodiment of the present invention. Figure 6 It is a front view of the state where the heat dissipation support platform and the intermediate shell are combined according to one embodiment of the present invention.

[0057] Reference Figures 4 to 6 , the features of the first heat sink 142 and the heat dissipation support platform 150 involved in one embodiment of the present invention are described.

[0058] A plurality of first heat sinks 142 may be arranged spaced apart along the second direction between the adjacent plurality of heat sink support platforms 150. The first heat sink 142 extends in a direction parallel to the flow path formed by the plurality of heat sink support platforms 150. Therefore, when cold air is provided through the flow path, no resistance opposite to the flow direction of the cold air is generated. Thus, effective heat dissipation can be achieved.

[0059] The plurality of first heat sinks 142 may include at least two heat sinks 142a having a first height. Moreover, the plurality of first heat sinks 142 may include at least two heat sinks 142b having a height greater than the first height and equal to the second height between the at least two heat sinks 142a. Further, the plurality of first heat sinks 142 may further include at least one heat sink 142c having a height greater than the second height and equal to the third height between the at least two heat sinks 142b. However, the first heat sink 142 according to an embodiment of the present invention is not necessarily limited thereto, and may further include a heat sink having a height greater than the third height and equal to the fourth height. At this time, the first to fourth heights refer to the height of the first heat sink 142 at the point farthest from one side of the intermediate housing 140.

[0060] like Figure 6 As shown, the plurality of first heat sinks 142 formed between adjacent heat dissipation support platforms 150 have a shape in which the middle portion is the most protruding as a whole.

[0061] In addition, electronic components are arranged directly below the highest heat sink and along the extending direction of the highest heat sink in the first accommodation space 120. Therefore, heat is best dissipated at the portion closest to the heating element, thereby maximizing heat dissipation efficiency.

[0062] in addition, Figures 4 to 6 The figure shows a configuration in which the plurality of heat dissipation support platforms 150 are parallel to each other and the first heat dissipation fins 142 extend parallel to the plurality of heat dissipation support platforms 150, but the configuration is not necessarily limited thereto. For example, even if the plurality of adjacent heat dissipation support platforms are spaced apart in a V-shape, the first heat dissipation fins 142 can extend along the extension direction of the flow path.

[0063] The heat dissipation support platform 150 includes at least one second heat dissipation fin 154 protruding from at least one side surface toward the second direction. The second heat dissipation fin 154 extends along the third direction.

[0064] The second heat dissipation fins 154 may include a plurality of second heat dissipation fins 154 a , 154 b , and 154 c arranged side by side along the first direction.

[0065] The plurality of second heat sinks 154 may include at least two heat sinks 154a having a first width. In addition, the plurality of second heat sinks 154 may include at least two heat sinks 154b located between the at least two heat sinks 154a and having a width greater than the first width and equal to the second width. Further, the plurality of second heat sinks 154 further include at least one heat sink 154c located between the at least two heat sinks 154b and having a width greater than the second width and equal to the third width. However, the second heat sink 154 according to an embodiment of the present invention is not necessarily limited thereto, and may further include a heat sink having a width greater than the third width and equal to the fourth width. At this time, the first to fourth widths are equivalent to the width of the second heat sink 154 at the farthest point from one side of the heat dissipation support platform 150.

[0066] like Figure 5 As shown, the plurality of second heat sinks 154 may be arranged in a form in which the width thereof becomes smaller at one end of the heat dissipation support platform 150 .

[0067] like Figure 6 As shown, the plurality of second heat sinks 154 may be configured as a whole to have a shape in which the middle portion is the most protruding.

[0068] The heat dissipation support platform 150 has a second accommodation space 151 inside. A plurality of electronic components may be arranged in the second accommodation space 151. Therefore, the antenna device 100 may effectively integrate these electronic components in the internal space and effectively dissipate heat. Figure 7 The internal structure of the heat dissipation support platform 150 will be described.

[0069] Figure 71 is a front perspective view of the interior of a heat dissipation support platform according to an embodiment of the present invention.

[0070] Reference Figure 7 The heat dissipation support platform 150 includes a second accommodating space 151 , a second heating element 153 , a second heat sink 154 and an RF signal connection portion 155 .

[0071] The second accommodation space 151 is a hollow space formed inside the heat dissipation support table 150. The second accommodation space 151 may be provided with a second heating element 153.

[0072] The second heating element 153 may be, for example, an FPGA module. The FPGA module may include an FPGA substrate 153a disposed in the second accommodation space 151 and a plurality of FPGAs 153b disposed on the FPGA substrate 153a.

[0073] As an electronic component, FPGA153b is an electronic component that needs heat dissipation. Figures 4 to 6 As shown, according to the antenna device 100 according to an embodiment of the present invention, the heat generated by the FPGA module will be released through the second heat sink 154 .

[0074] At least one RF signal connection portion 155 may be disposed on at least one side of the heat dissipation support platform 150, and the RF signal connection portion 155 may transmit the electrical signal generated by the electronic component disposed in the second accommodation space 151 to the antenna module 160. Thus, the heat dissipation support platform 150 may electrically connect the electronic component disposed in the first accommodation space 120 and the antenna module 160. To this end, at least a portion of the RF signal connection portion 155 may be made of metal.

[0075] Not only the FPGA 153 b but also a multi-band filter (MBF) can be arranged in the second accommodation space 151 .

[0076] In addition, an amplifier (power amplifier) ​​may be arranged in the second receiving space 151 .

[0077] Figure 8 FIG. 4 is an exploded perspective view of a fan module according to an embodiment of the present invention.

[0078] Reference Figure 8 , the air blowing fan module 170 may be disposed at one end where the flow path is formed.

[0079] The fan module 170 may include at least one blade 172 , a fan housing 174 , a fan cover 176 and a protective protrusion 178 .

[0080] At least one blade 172 rotates in a predetermined direction and provides cool air to the inside of the antenna device 100 .

[0081] The fan housing 174 is provided to surround at least a portion of at least one blade 172. The fan housing 174 may be formed to extend from at least one surface of the antenna device 100.

[0082] The fan cover 176 may be provided to be combined with the fan housing 174 and to accommodate at least one blade 172 between the fan cover 176 and the fan housing 174 .

[0083] The protective protrusion 178 protrudes from at least a portion of the air blower cover 176 toward the outside of the antenna device 100. The protective protrusion 178 protrudes most on the side where the air blower module 170 is arranged. Therefore, it is possible to prevent the port arranged on one side of the antenna device 100 from being damaged by external impact. For example, when the antenna device 100 is overturned by external wind force, etc., it is possible to prevent the port from colliding with the bottom surface.

[0084] Fig. 9 is a front perspective view of an antenna device according to another embodiment of the present invention. Fig.10 is an exploded perspective view of an antenna device according to another embodiment of the present invention.

[0085] Reference Fig. 9 and Fig.10 According to another embodiment of the antenna device 200 of the present invention, in addition to one side surface, another side surface may also include a mesh portion 180 . Fig. 9 and Fig.10 Although the mesh portion 180 is shown as being disposed on three side surfaces excluding the fan module 170 , the mesh portion 180 is not necessarily limited thereto, and may be disposed on at least two side surfaces excluding the fan module 170 .

[0086] The mesh portion 180 can be arranged not only on one side of the antenna device 200 but also on other sides, so as to provide a larger volume of cold air. Therefore, even without adding the fan module 170, the antenna device 200 can dissipate heat more effectively.

[0087] Fig.11 4 is a top view of a connection state between a heat dissipation support platform and an intermediate housing according to another embodiment of the present invention. Fig.12 It is a front view of the connection state between the heat dissipation support platform and the intermediate shell according to another embodiment of the present invention.

[0088] Reference Fig.11 and reference Fig.12 According to another embodiment of the present invention, the second heat sink 254 of the antenna device 200 may be relatively inconspicuous. The protruding length of the second heat sink 254 may be appropriately selected according to the type and arrangement of the substrate formed inside the heat dissipation support platform 250 and the electronic components mounted on the substrate.

[0089] In addition, the second heat dissipation fins 254 may include a plurality of second heat dissipation fins 254a, 254b arranged side by side along the first direction.

[0090] The plurality of second heat sinks 254 may include at least two heat sinks 254a having a first width. Furthermore, the plurality of second heat sinks 254 may include at least two heat sinks 254b located between the at least two heat sinks 254a and having a width greater than the first width and equal to the second width. Furthermore, the plurality of second heat sinks 254 may further include at least one heat sink (not shown) located between the at least two heat sinks 254b and having a width greater than the second width and equal to a third width. At this time, the first to third widths refer to the widths of the heat sink 254 at the farthest point from one side of the heat dissipation support platform 250.

[0091] like Fig.11 As shown, the heat sink 254 according to another embodiment of the present invention has a shorter length relative to the portion with the maximum width. That is, the plurality of second heat sinks 254 can be arranged to have a reduced width at a location spaced apart from one end of the heat dissipation support platform 250 .

[0092] Fig.13 is a front perspective view of an antenna device according to yet another embodiment of the present invention. Fig.14 is an exploded perspective view of an antenna device according to yet another embodiment of the present invention.

[0093] Fig.13 and reference Fig.14 In yet another embodiment of the present invention, another antenna device 300 further includes a clamping portion 378 .

[0094] The clamping portion 378 is configured to protrude from at least a portion of the fan module 370 toward the outside of the antenna device 300, and is generally in the form of a handle. The clamping portion 378 protrudes more than the port arranged on one side of the antenna device 300 where the fan module 170 is arranged. Therefore, the port can be protected from external impact.

[0095] The clamping portion 378 is preferably formed into a shape that is convenient for the user to hold. Therefore, when the user moves the antenna device 300, the user can hold the clamping portion 378 to move it, thereby achieving excellent user convenience.

[0096] Fig.15 1 is a top view of a state where a heat dissipation support platform and an intermediate shell are combined according to another embodiment of the present invention. Fig.16 It is a front view of a state where a heat dissipation support platform of an antenna device according to another embodiment of the present invention is combined with an intermediate housing.

[0097] Reference Fig.15 and Fig.16According to another embodiment of the present invention, the plurality of first heat sinks 342 of the antenna device 300 may have the same height. This may be designed differently according to the heat transferred by the intermediate housing 340 and the arrangement of the electronic components arranged in the first accommodation space (not shown).

[0098] According to another embodiment of the second heat sink 354 of the present invention, the plurality of second heat sinks 354 may include at least two heat sinks 354a having a first width. Moreover, the plurality of second heat sinks 354 may include at least two heat sinks 354b located between the at least two heat sinks 354a and having a width greater than the first width and equal to the second width. Further, the plurality of second heat sinks 354 may further include at least one heat sink (not shown) located between the at least two heat sinks 354b and having a width greater than the second width and equal to the third width. At this time, the first to third widths refer to the widths of the heat sink 354 at the location farthest from one side of the heat dissipation support platform 350.

[0099] The above description is only used to illustrate the technical idea of ​​this embodiment. For ordinary technicians in this technical field, various modifications and changes can be made within the scope of the essential features of this embodiment. Therefore, this embodiment is used to illustrate the present invention rather than to limit the technical idea of ​​this embodiment, and the scope of the technical idea of ​​this embodiment is not limited to the above embodiment. The protection scope of this embodiment will be interpreted according to the claims, and all technical ideas with equivalent scopes shall be interpreted as belonging to the scope of rights of this embodiment.

[0100] CROSS-REFERENCE TO RELATED APPLICATIONS

[0101] Pursuant to Section 119(a) of the United States Patent Act (35 U.S.C. 119(a)), this patent application claims priority to Patent Application No. 10-2019-0077894 filed with the Korean Patent Office on June 28, 2019 and Patent Application No. 10-2020-0005720 filed with the Korean Patent Office on January 16, 2020, all of which are included in this patent application as references. At the same time, based on the above reasons, this patent application can also claim priority in other countries outside the United States, so all of which are also included in this patent application as references.

Claims

1. An antenna device, comprising: Lower housing; An intermediate housing, which is arranged on the lower housing and has a first heat sink formed on one side; A first accommodating space, which is formed by the lower shell and the intermediate shell; at least one first heating element, which is arranged in the first accommodation space; At least one heat dissipation support platform, which is arranged on the intermediate housing and has a second heat dissipation fin formed on at least one side; as well as an antenna module supported on the at least one heat dissipation support platform, The heat dissipation support platform protrudes in a first direction, and at least two heat dissipation support platforms are arranged at intervals along a second direction different from the first direction. A plurality of the first heat sinks are arranged between adjacent heat sink support platforms at intervals along the second direction, and the first heat sinks protrude in a height direction of the heat sink support platform. The plurality of first heat sinks include at least two heat sinks having a first height and at least one heat sink between the at least two heat sinks having the first height and having a height greater than the first height and equal to a second height.

2. The antenna device according to claim 1, characterized in that The heat dissipation support platform extends along a third direction different from the first direction and the second direction, and further includes at least one second heat dissipation fin protruding from a side surface of the heat dissipation support platform toward the second direction and extending along the third direction.

3. The antenna device according to claim 2, characterized in that A plurality of second heat sinks are arranged at intervals along the height direction of the heat dissipation support platform.

4. The antenna device according to claim 3, characterized in that: The plurality of second heat dissipation fins include at least two heat dissipation fins having a first width and at least one heat dissipation fin between the at least two heat dissipation fins having the first width and having a width greater than the first width and equal to a second width.

5. The antenna device according to claim 1, characterized in that: The heat dissipation support platform extends along a third direction different from the first direction and the second direction, and at least one side of the antenna device further includes a supply fan module, which is arranged adjacent to one end of the heat dissipation support platform in the direction in which the heat dissipation support platform extends and cools the heat dissipation support platform.

6. The antenna device according to claim 5, characterized in that A protection protrusion is included which protrudes outward from at least one side of the fan module.

7. The antenna device according to claim 5, characterized in that: The fan module further includes at least one clamping portion protruding from at least one side.

8. The antenna device according to claim 1, characterized in that The heat dissipation support platform extends along a third direction different from the first direction and the second direction, and at least one side surface of the antenna device further includes a mesh portion arranged adjacent to the other end of the heat dissipation support platform in the extending direction of the heat dissipation support platform.

9. The antenna device according to claim 1, characterized in that: A power supply unit is arranged on the first accommodation space.

10. The antenna device according to claim 1, characterized in that: The heat dissipation support platform is configured to electrically connect the antenna module and the elements arranged in the first accommodation space.

11. The antenna device according to claim 10, characterized in that: The heat dissipation support platform comprises a second accommodating space located inside; a substrate arranged in the second accommodating space; and at least one FPGA element mounted on the substrate.

12. The antenna device according to claim 1, characterized in that The antenna module includes a PCB and an antenna element mounted on the PCB.

13. The antenna device according to claim 1, characterized in that: It further includes a digital board which is arranged in the first receiving space and is formed with a digital processing circuit.

14. The antenna device according to claim 1, characterized in that The lower housing includes a lower heat dissipation portion protruding downward from at least one surface of the lower housing.

15. The antenna device according to claim 1, characterized in that Further included is a radome disposed on the antenna module.

16. The antenna device according to claim 2, characterized in that: The heat dissipation support platform and the second heat sink are formed by integral extrusion.

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