An intelligent solid state relay
By designing an intelligent solid-state relay and utilizing semiconductor electronic switches and detection modules, the mechanical loss and electromagnetic interference problems of traditional relays are solved, achieving high reliability and low loss circuit control.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- JIANGSU SOLID POWER SEMICON CO LTD
- Filing Date
- 2021-10-29
- Publication Date
- 2026-04-24
AI Technical Summary
Traditional electromagnetic relays suffer from problems such as short lifespan due to mechanical losses, contact adhesion, electromagnetic interference, large size, and high cost, while solid-state relays suffer from problems such as high losses and unreliable driving.
The system employs intelligent solid-state relays, including switching devices, drive modules, current detection modules, and computing chips. It achieves power on/off switching through semiconductor electronic switches, and improves reliability by combining power polarity detection, fault detection, and temperature control.
It solves the problems of mechanical loss, contact adhesion and electromagnetic interference of traditional electromagnetic relays, improves the reliability of circuit switching, reduces losses and lowers costs.
Smart Images

Figure CN114024539B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of solid-state relay technology, and in particular to an intelligent solid-state relay. Background Technology
[0002] Relays, as safe and controllable power switches, are widely used in the power system field. With the development of industrial automation, new energy vehicles, photovoltaic power generation, wind power generation, and other fields, the application of relays is becoming increasingly widespread. Currently, DC or AC electromagnetic relays are widely used in systems. They employ the principle of a low-voltage coil generating a magnetic field, attracting the contact armature to connect and disconnect high-voltage circuits, thus achieving the function of low-voltage control of high-voltage and small-current control of large-current.
[0003] Traditional electromagnetic relays have the following main disadvantages: 1) They use mechanical contacts, resulting in mechanical losses and a short service life, which does not meet the requirements of frequent circuit switching in modern industrial automation systems; 2) They use contact switches, which generate strong arcing during switching. Although modern relays are designed with arc-extinguishing devices, they cannot completely prevent sparking; 3) They use electromagnetic coils as the control terminal, which generate strong electromagnetic interference during switching, and the control power supply generates large harmonics, significantly affecting the control circuit; 4) They use electromagnetic coils as the control terminal, which are driven by current, resulting in certain drive losses; 5) They use mechanical structures, which occupy a large volume, are heavy, and have high material costs; 6) They have many problems with contact adhesion and false adhesion, making it difficult to determine the cause of the problem. Summary of the Invention
[0004] To address the aforementioned problems and technical requirements, the inventors have proposed an intelligent solid-state relay. The technical solution of this invention is as follows:
[0005] A smart solid-state relay includes a switching device, a drive module, a current detection module, and a computing chip. The computing chip generates a drive signal based on a received input switching signal and transmits it to the drive module. The drive module controls the switching device to open or close based on the drive signal. The current detection module detects the current in the relay's main circuit and transmits the current signal to the computing chip. The computing chip calculates and outputs the voltage and / or current status signal of the relay's main circuit current based on the current signal. The voltage and / or current status signal of the relay's main circuit current is transmitted to an external controller through an output interface and a communication interface.
[0006] Furthermore, the switching device includes a pair of bidirectional semiconductor electronic switches, and the driving module controls the pair of bidirectional semiconductor electronic switches to work alternately to realize the switching on and off of AC power.
[0007] Furthermore, the relay also includes a power polarity detection module, and the drive module controls a pair of bidirectional semiconductor electronic switches to work alternately to realize the switching on and off of AC power, including:
[0008] The power polarity detection module detects the power polarity signal at the input terminal of the relay main circuit and transmits it to the computing chip. The computing chip controls the drive module to drive the corresponding semiconductor electronic switch according to the power polarity signal to realize the switching on and off of AC power.
[0009] Furthermore, the switching device includes a semiconductor electronic switch for switching the DC power supply on and off.
[0010] Furthermore, the current detection module includes a current sensing chip and a filter. The current sensing chip senses the current in the main circuit of the relay and transmits it to the computing chip after filtering by the filter.
[0011] Furthermore, the relay also includes a power supply module, which performs power conversion on the power input through the input interface and supplies power to the drive module, current detection module and computing chip.
[0012] Furthermore, the power module can perform fault self-checks and output a power fault signal. The computing chip shuts down the power module based on the power fault signal and outputs a fault signal to the output interface and communication interface.
[0013] Furthermore, the drive module also performs fault detection on the switching device and outputs a switch fault signal. The computing chip shuts down the drive module based on the fault signal and outputs a fault signal to the output interface and communication interface.
[0014] Furthermore, the drive module also performs voltage drop detection on the switching devices and outputs a voltage drop signal. The computing chip calculates the temperature of the relay based on the voltage drop signal and the current signal. If the temperature exceeds the temperature threshold, the computing chip outputs a fault signal to the output interface and the communication interface, and adjusts the current of the relay main circuit by controlling the drive module to ensure that the temperature does not exceed the temperature threshold. The temperature signal is transmitted to the external controller through the communication interface.
[0015] Furthermore, the communication interface is also used to input external communication signals.
[0016] The beneficial technical effects of this invention are:
[0017] This invention discloses an intelligent solid-state relay, which avoids the problems of traditional electromagnetic relays such as large size, heavy weight, contact adhesion, false closure, interference, and high cost. It also solves the problems of high loss, low operating current, unreliable drive, false on / off, and difficulty in turning off that are common with current solid-state relays, thus improving the reliability of circuit switching. Simultaneously, an intelligent control system is designed, forming an effective connection with external systems, providing a solid technical foundation for automated and intelligent control. Attached Figure Description
[0018] Figure 1This is a schematic diagram of the AC intelligent solid-state relay signal of Embodiment 1 of this application.
[0019] Figure 2 This is a block diagram of the AC intelligent solid-state relay structure according to Embodiment 1 of this application.
[0020] Figure 3 This is a timing diagram of the bidirectional electronic switch of the AC intelligent solid-state relay according to Embodiment 1 of this application.
[0021] Figure 4 This is a schematic diagram of the DC intelligent solid-state relay signal of Embodiment 2 of this application. Detailed Implementation
[0022] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.
[0023] This invention provides an intelligent solid-state relay, such as Figure 1-4 As shown, it mainly includes switching devices, a drive module, a current detection module, and a computing chip. The computing chip generates a drive signal based on the received input switching signal and transmits it to the drive module. The drive module controls the switching devices to open and close based on the drive signal. The current detection module detects the current in the relay main circuit and transmits the current signal to the computing chip. The computing chip calculates and outputs the voltage and / or current status signal of the relay main circuit current based on the current signal. The voltage and / or current status signal is transmitted to an external controller through the output interface and the communication interface.
[0024] Optionally, the switching device includes a pair of bidirectional semiconductor electronic switches, and the drive module controls the pair of bidirectional semiconductor electronic switches to work alternately to realize the switching on and off of AC power.
[0025] Preferably, the relay also includes a power polarity detection module, in which the drive module controls a pair of bidirectional semiconductor electronic switches to work alternately to switch the AC power supply on and off, including:
[0026] The power polarity detection module detects the power polarity signal at the input terminal of the relay main circuit and transmits it to the computing chip. The computing chip controls the drive module to drive the corresponding semiconductor electronic switch according to the power polarity signal to realize the switching on and off of AC power.
[0027] Optionally, the switching device includes a semiconductor electronic switch for switching the DC power supply on and off.
[0028] Optionally, the current detection module includes a current sensing chip and a filter. The current sensing chip senses the current in the main circuit of the relay and transmits it to the computing chip after filtering by the filter.
[0029] Preferably, the relay also includes a power supply module, which performs power conversion on the power input through the input interface and supplies power to the drive module, current detection module and computing chip.
[0030] Optionally, the power module can also perform fault self-test and output a power fault signal. The computing chip shuts down the power module based on the power fault signal and outputs a fault signal to the output interface and communication interface.
[0031] Preferably, the drive module also performs fault detection on the switching device and outputs a switch fault signal. The computing chip shuts down the drive module based on the fault signal and outputs a fault signal to the output interface and communication interface.
[0032] Preferably, the drive module also detects the voltage drop of the switching device and outputs a voltage drop signal. The computing chip calculates the temperature of the relay based on the voltage drop signal and the current signal. If the temperature exceeds the temperature threshold, the computing chip outputs a fault signal to the output interface and the communication interface, and adjusts the current of the relay main circuit by controlling the drive module to ensure that the temperature does not exceed the temperature threshold. The temperature signal is transmitted to the external controller through the output interface and the communication interface.
[0033] Optionally, the communication interface can also be used to input external communication signals.
[0034] Optionally, the relay also includes a power indicator and a fault indicator. The power indicator lights up when there is power input at the input interface; the arithmetic chip also lights up the fault indicator when outputting a fault signal.
[0035] Example 1
[0036] Figure 1-3 This illustration shows an AC intelligent solid-state relay according to Embodiment 1 of the present invention. The AC intelligent solid-state relay includes a pair of bidirectional semiconductor electronic switches, a drive module, a current detection module, a computing chip, a power supply polarity detection module, and a power supply module. Preferably, the semiconductor electronic switches in this embodiment employ specially designed low-frequency, low-conduction-loss chips, which can reduce relay losses.
[0037] The power polarity detection module detects the power polarity signal at the input terminal of the relay main circuit and transmits it to the computing chip. The computing chip controls the drive module to drive the corresponding semiconductor electronic switch according to the power polarity signal to realize the switching on and off of AC power; in this embodiment, such as Figure 3 As shown, there are two drive modules, each controlling one of the two semiconductor electronic switches; alternatively, as shown... Figure 2 The diagram shows a pair of bidirectional semiconductor electronic switches being driven alternately by a single driving module.
[0038] Specifically, the AC intelligent solid-state relay detects the voltage polarity at the AC input terminal of the main circuit in real time during operation, such as... Figure 3 As shown, when the voltage polarity is positive, the driving circuit of semiconductor electronic switch ① is activated, receiving the input signal to drive electronic switch ① and control semiconductor electronic switch ①; when the voltage polarity is negative, the driving circuit of semiconductor electronic switch ② is activated, receiving the input signal to drive electronic switch ② and control semiconductor electronic switch ②. The alternating operation of this pair of opposite semiconductor electronic switches achieves the switching control of the AC power supply.
[0039] The current detection module includes a current sensing chip and a filter. The current sensing chip senses the current in the main circuit of the relay and transmits the current signal to the computing chip after filtering. The computing chip calculates and outputs the voltage and / or current status signal of the main circuit current of the relay based on the current signal. The voltage and / or current status signal of the main circuit current of the relay is transmitted to the external controller through the output interface and the communication interface.
[0040] The power module converts the power input through the input interface and supplies power to the drive module, current detection module, and computing chip. Furthermore, the power module can perform self-diagnosis and output a power fault signal. Based on the power fault signal, the computing chip shuts down the power module and outputs a fault signal to the output interface and communication interface.
[0041] The driver module also performs fault detection on the semiconductor electronic switch and outputs a switch fault signal. The computing chip shuts down the driver module based on the fault signal and outputs a fault signal to the output interface and communication interface. Furthermore, the driver module also performs voltage drop detection on the semiconductor electronic switch and outputs a voltage drop signal. The computing chip calculates the relay temperature using a mathematical model based on the voltage drop signal and the current signal. If the temperature exceeds the temperature threshold, the computing chip outputs a fault signal to the output interface and communication interface, and adjusts the current in the relay's main circuit by controlling the driver module to ensure the temperature does not exceed the temperature threshold; otherwise, the relay operates normally. The temperature signal is transmitted to the external controller through the output interface and communication interface.
[0042] The communication interface is also used to input external communication signals.
[0043] The relay also includes a power indicator and a fault indicator. The power indicator lights up when there is power input at the input interface; the arithmetic chip also lights up the fault indicator when it outputs a fault signal.
[0044] Example 2
[0045] Figure 4This illustration shows a DC intelligent solid-state relay according to Embodiment 2 of the present invention. The DC intelligent solid-state relay includes a semiconductor electronic switch, a drive module, a current detection module, a computing chip, and a power supply module. The main difference between this embodiment and Embodiment 1 lies in the configuration of the switching device. In this embodiment, the DC intelligent solid-state relay uses only a single semiconductor electronic switch to control the switching of the DC power supply. Therefore, this embodiment does not require a power polarity detection module, and only one drive module is needed to control the switching of the semiconductor electronic switch. Preferably, the semiconductor electronic switch in this embodiment also uses a specially designed low-frequency, low-conduction-loss chip, which can reduce relay losses.
[0046] Furthermore, the settings for the current detection module, computing chip, power supply module, and other modules are the same as in Embodiment 1, and the specific working principles of each module are also the same as in Embodiment 1, so they will not be repeated here.
[0047] The above descriptions are merely preferred embodiments of this application, and the present invention is not limited to the above embodiments. It is understood that other improvements and variations directly derived or conceived by those skilled in the art without departing from the spirit and concept of the present invention should be considered to be included within the protection scope of the present invention.
Claims
1. A smart solid-state relay, characterized in that, It includes a switching device, a driving module, a current detection module, and a computing chip; the computing chip generates a driving signal based on the received input switching signal and transmits it to the driving module, and the driving module controls the switching device to turn on or off according to the driving signal; The current detection module detects the current in the relay's main circuit and transmits the current signal to the computing chip. The computing chip calculates and outputs the voltage and / or current status signal of the relay's main circuit current based on the current signal. The voltage and / or current status signal is transmitted to an external controller through the output interface and communication interface. The drive module also detects the voltage drop of the switching device and outputs a voltage drop signal. The computing chip calculates the relay temperature based on the voltage drop signal and the current signal. If the temperature exceeds a temperature threshold, the computing chip outputs a fault signal to the output interface and communication interface, and controls the drive module to adjust the current in the relay's main circuit so that the temperature does not exceed the temperature threshold. The input switch signal is input via the input interface.
2. The intelligent solid-state relay according to claim 1, characterized in that, The switching device includes a pair of bidirectional semiconductor electronic switches, and the driving module controls the pair of bidirectional semiconductor electronic switches to work alternately to realize the switching on and off of AC power.
3. The intelligent solid-state relay according to claim 2, characterized in that, The relay also includes a power polarity detection module, and the drive module controls the pair of bidirectional semiconductor electronic switches to work alternately to realize the switching on and off of AC power, including: The power polarity detection module detects the power polarity signal at the input terminal of the relay main circuit and transmits it to the computing chip. The computing chip controls the driving module to drive the corresponding semiconductor electronic switch according to the power polarity signal to realize the switching on and off of AC power.
4. The intelligent solid-state relay according to claim 1, characterized in that, The switching device includes a semiconductor electronic switch for switching the DC power supply on and off.
5. The intelligent solid-state relay according to any one of claims 1-4, characterized in that, The current detection module includes a current sensing chip and a filter. The current sensing chip senses the current in the main circuit of the relay and transmits it to the computing chip after filtering by the filter.
6. The intelligent solid-state relay according to any one of claims 1-4, characterized in that, The relay also includes a power supply module, which performs power conversion on the power input through the input interface and supplies power to the drive module, current detection module and computing chip.
7. The intelligent solid-state relay according to claim 6, characterized in that, The power module can also perform fault self-test and output a power fault signal. The computing chip shuts down the power module according to the power fault signal and outputs a fault signal to the output interface and the communication interface.
8. The intelligent solid-state relay according to any one of claims 1-4, characterized in that, The driving module also performs fault detection on the switching device and outputs a switching fault signal. The computing chip shuts down the driving module according to the fault signal and outputs a fault signal to the output interface and the communication interface.
9. The intelligent solid-state relay according to any one of claims 1-4, characterized in that, Temperature signals are transmitted to an external controller via the output interface and communication interface.
10. The intelligent solid-state relay according to claim 1, characterized in that, The communication interface is also used to input external communication signals.
Citation Information
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