Heat dissipation component detection circuit, method and device, and electronic equipment

Abstract

The present disclosure relates to a heat dissipation component detection circuit, method, device, and electronic device, belonging to the field of electronic device heat dissipation technology. The circuit is disposed within the electronic device and is used to detect the thermal conductivity of the heat dissipation component within the electronic device; the circuit includes: a temperature detection circuit and a processor. The temperature detection circuit is used to output a temperature detection signal based on the internal temperature of the electronic device while the processor is operating at a set power. The processor is electrically connected to the temperature detection circuit and is used to determine whether the heat dissipation component within the electronic device is in an effective state or an ineffective state based on the temperature detection signal and a preset threshold.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation of electronic equipment, and in particular to a heat dissipation component detection circuit, method and device, and electronic equipment. Background Art

[0002] As electronic devices improve in performance, the number of CPU cores inside them is increasing. However, the heat generated by multiple cores increases the internal temperature of the device. Typically, electronic devices are equipped with heat sinks to reduce heat. To ensure the heat dissipation effectiveness of these heat sinks, they must be inspected during the production process to identify any failures. Summary of the Invention

[0003] The present disclosure provides a heat dissipation component detection circuit, method and device, and electronic equipment to detect the thermal conductivity of a heat dissipation component in an electronic device.

[0004] According to the first aspect of the embodiment of the present disclosure, a heat dissipation component detection circuit is provided, wherein the circuit is arranged inside an electronic device and is used to detect the thermal conductivity of the heat dissipation component in the electronic device; the circuit includes: a temperature detection circuit and a processor;

[0005] The temperature detection circuit is used to output a temperature detection signal according to the internal temperature of the electronic device when the processor is operating at a set power;

[0006] The processor is electrically connected to the temperature detection circuit and is used to determine whether the heat dissipation component in the electronic device is in an effective state or a failure state according to the temperature detection signal and a preset threshold.

[0007] In one embodiment, the temperature detection circuit includes a first detection circuit; the first detection circuit is arranged around the processor or packaged inside the processor.

[0008] In one embodiment, the first detection circuit includes a first thermal element; when the first detection circuit is disposed around the processor, a distance from the first thermal element to the processor is less than or equal to 5 mm.

[0009] In one embodiment, the first detection circuit is electrically connected to the processor;

[0010] The first detection circuit is configured to output a processor temperature detection signal to the processor in response to the processor operating at a set power and for a set period of time;

[0011] The processor is used to obtain a detection temperature value according to the processor temperature detection signal, and determine whether the heat dissipation component is in a valid state or a failed state according to the detection temperature value.

[0012] In one embodiment, the first detection circuit is electrically connected to the processor;

[0013] The first detection circuit is configured to output a first temperature detection signal to the processor at a first moment and output a second temperature detection signal to the processor at a second moment when the processor is operating at a set power;

[0014] The processor is configured to obtain a detection temperature value according to the first temperature detection signal and the second temperature detection signal, and determine whether the heat dissipation component is in a valid state or a failed state according to the detection temperature value.

[0015] In one embodiment, the temperature detection circuit further includes a second detection circuit located outside the processor;

[0016] The second circuit includes a second thermal element, and a distance between the second thermal element and the processor is greater than a distance between the first thermal element and the processor.

[0017] In one embodiment, the second detection circuit is electrically connected to the processor;

[0018] The second detection circuit is configured to output an ambient temperature detection signal to the processor in response to the processor operating at a set power and for a set period of time;

[0019] The processor is used to determine a detection temperature value according to the processor temperature detection signal and the ambient temperature detection signal, and to determine whether the heat dissipation component is in a valid state or a failed state according to the detection temperature value.

[0020] In one embodiment, the processor is specifically configured to:

[0021] In response to the detected temperature value being greater than or equal to the preset threshold, determining that the heat dissipation component is in a failure state; and / or

[0022] In response to the detected temperature value being less than the preset threshold, it is determined that the heat dissipation component is in a valid state.

[0023] In one embodiment, the circuit further includes a power management module for powering the processor and the temperature detection circuit, the preset threshold includes a maximum value and a minimum value, and the processor is specifically configured to:

[0024] In response to the detected temperature value being less than or equal to the minimum value, determining that the heat dissipation component is in a valid state; and / or

[0025] In response to the detected temperature value being greater than or equal to the maximum value, determining that the heat dissipation component is in an invalid state; and / or

[0026] In response to the detected temperature value being greater than the minimum value and less than the maximum value, the power management module is controlled to stop supplying power for a set period of time, and then the temperature detection signal output by the temperature detection circuit is received again, and the heat dissipation component is determined to be in a valid state or a failed state based on the temperature detection signal received again.

[0027] According to the second aspect of the embodiment of the present disclosure, a heat dissipation component detection method is provided. The method is applied to the heat dissipation component detection circuit provided in the first aspect, and the method includes:

[0028] receiving a temperature detection signal;

[0029] Acquire a detected temperature value according to the temperature detection signal;

[0030] The heat dissipation component is determined to be in a valid state or a failed state according to the detected temperature value and a preset threshold.

[0031] In one embodiment, receiving the temperature detection signal includes:

[0032] In response to operating at a set power for a set period of time, a processor temperature detection signal is received, and the processor temperature detection signal is used as the temperature detection signal.

[0033] In one embodiment, receiving the temperature detection signal includes:

[0034] During operation at the set power, a first temperature detection signal is received at a first moment, and a second temperature detection signal is received at a second moment.

[0035] In one embodiment, obtaining a detected temperature value according to a temperature detection signal includes:

[0036] acquiring a first detected temperature value according to the first temperature detection signal;

[0037] acquiring a second detected temperature value according to the second temperature detection signal;

[0038] The detected temperature value is obtained according to the difference between the second detected temperature value and the first detected temperature value.

[0039] In one embodiment, the receiving of the temperature detection signal further includes: receiving an ambient temperature detection signal in response to operating at the set power for the set time period.

[0040] In one embodiment, obtaining a detected temperature value according to a temperature detection signal includes:

[0041] Acquiring a processor temperature value according to the processor temperature detection signal;

[0042] Acquiring an ambient temperature value according to the ambient temperature detection signal;

[0043] The detected temperature value is obtained according to the difference between the processor temperature value and the ambient temperature value.

[0044] In one embodiment, determining whether the heat dissipation component is in a valid state or a failed state according to the detected temperature value and a preset threshold value includes:

[0045] In response to the detected temperature value being greater than or equal to the preset threshold, determining that the heat dissipation component is in a failure state;

[0046] In response to the detected temperature value being less than the preset threshold, it is determined that the heat dissipation component is in a valid state.

[0047] In one embodiment, determining whether the heat dissipation component is in a valid state or a failed state according to the detected temperature value and a preset threshold value includes:

[0048] In response to the detected temperature value being less than or equal to the minimum value, determining that the heat dissipation component is in a valid state;

[0049] In response to the detected temperature value being greater than or equal to the maximum value, determining that the heat dissipation component is in an invalid state;

[0050] In response to the detected temperature value being greater than the minimum value and less than the maximum value, the temperature detection signal is received again after stopping working for a set period of time, and the heat dissipation component is judged to be in an invalid state or a valid state according to the temperature detection signal received again.

[0051] According to a third aspect of an embodiment of the present disclosure, a heat dissipation component detection device is provided, which is applied to the heat dissipation component detection circuit provided in the first aspect above; the device includes:

[0052] A receiving module, used for receiving a temperature detection signal;

[0053] an acquisition module, configured to acquire a detected temperature value according to the temperature detection signal; and

[0054] The determination module is used to determine whether the heat dissipation component is in a valid state or a failed state according to the detected temperature value and a preset threshold.

[0055] According to a fourth aspect of an embodiment of the present disclosure, an electronic device is provided, comprising: a heat dissipation component and the heat dissipation component detection circuit provided by the first aspect above;

[0056] The heat dissipation component is connected to the processor in the heat dissipation component detection circuit;

[0057] The heat dissipation component detection circuit is used to determine whether the heat dissipation component is in an effective state or a failure state based on the temperature in the electronic device.

[0058] In one embodiment, the heat dissipation assembly includes: a heat conducting member connected to the processor, and a heat sink connected to the heat conducting member;

[0059] The radiator includes a heat pipe radiator or a temperature vapor chamber radiator.

[0060] The heat dissipation component detection circuit, method, device, and electronic device provided by the present disclosure have at least the following beneficial effects:

[0061] The heat dissipation component detection circuit provided by the embodiment of the present disclosure is arranged inside the electronic device, and determines whether the heat dissipation component is in an effective state based on the temperature of the processor and a preset threshold value. The use of this circuit for heat dissipation component detection can realize the detection of the entire device. In actual operation, it can be carried out after the heat dissipation component is installed inside the electronic device. In this way, there is no human operation in the overall detection process, which effectively improves the detection accuracy. In addition, by detecting the entire device after installation, failed heat dissipation components can be effectively screened out, avoiding the defect that the failed heat dissipation component cannot be detected when installed in the electronic device, and optimizing the user experience of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0063] Figure 1 is a schematic diagram showing a heat dissipation component detection circuit according to an exemplary embodiment;

[0064] Figure 2 is a schematic diagram of a heat dissipation component detection circuit according to another exemplary embodiment;

[0065] Figure 3 is a schematic diagram of a heat dissipation component detection circuit according to another exemplary embodiment;

[0066] Figure 4 is a flow chart of a detection method according to an exemplary embodiment;

[0067] Figure 5 is a flow chart of a detection method according to another exemplary embodiment;

[0068] Figure 6 is a flow chart of a detection method according to another exemplary embodiment;

[0069] Figure 7 is a block diagram of a detection device according to an exemplary embodiment.

[0070] Figure 8 is a block diagram of a detection device according to another exemplary embodiment.

[0071] Figure 9 is a block diagram of a detection device according to another exemplary embodiment;

[0072] Figure 10 is a partial schematic diagram of an electronic device according to an exemplary embodiment;

[0073] Figure 11 is a block diagram of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0074] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, like numbers in different figures represent like or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present disclosure. Rather, they are merely examples of apparatuses and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0075] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meaning understood by a person of ordinary skill in the art to which this disclosure belongs. The use of "a" or "an," and similar terms in this disclosure and the claims does not indicate a limitation of quantity, but rather indicates the presence of at least one. Unless otherwise indicated, the use of "include" or "comprises," and similar terms means that the elements or objects preceding "include" or "comprises" include the elements or objects listed after "include" or "comprises," and their equivalents, and does not exclude other elements or objects. The use of "connected" or "connected" and similar terms is not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect. As used in this disclosure and the claims, the singular forms "a," "the," and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein is intended to encompass any and all possible combinations of one or more of the associated listed items.

[0076] Heat pipes (HP) and vapor chambers (VC) are common heat dissipation components in electronic devices. Coolant circulates within these components. When the liquid coolant reaches a higher temperature area within the device, it absorbs heat and transforms into a gaseous state. When the gaseous coolant reaches a lower temperature area, it releases heat and transforms into a liquid state.

[0077] In some embodiments, before a heat pipe or vapor chamber is installed in an electronic device, the heat pipe or vapor chamber is subjected to a thermal conductivity test. Specifically, a portion of the heat pipe or vapor chamber is connected to a heat source, and a plurality of test points are set in a portion of the heat pipe or vapor chamber away from the heat source, with different test points located at different positions. By testing the temperatures at different test points, the temperature difference between the different test points is determined, and then, based on the temperature difference, whether the heat pipe or vapor chamber has failed is determined.

[0078] However, different product models are suitable for heat dissipation components of different specifications. Therefore, heat dissipation component detection devices need to be set up separately for heat dissipation components of different specifications. In addition, in the above-mentioned detection method, setting the heat source, detection point, and detection temperature all rely on manual operation. Therefore, the overall detection method has a large error and cannot effectively screen out failed heat dissipation components. In addition, usually after the test is completed and before it is installed in the electronic device, there is still the possibility of heat dissipation components failing due to improper transportation and other temperature reasons. Therefore, the above-mentioned detection method has the problem of installing failed heat dissipation components in electronic devices, affecting the user experience.

[0079] Based on the above problems, the embodiments of the present disclosure provide a heat dissipation component detection circuit, method and device, and electronic equipment.

[0080] In a first aspect, embodiments of the present disclosure provide a heat dissipation component detection circuit, which is installed in an electronic device and is used to detect the thermal conductivity of the heat dissipation component in the electronic device. Figure 1 FIG. 1 is a schematic diagram of a heat dissipation component detection circuit according to an exemplary embodiment. Figure 1 As shown, the circuit includes: a temperature detection circuit 100 , a processor 200 and a power management module 300 .

[0081] The power supply 300 is electrically connected to the temperature detection circuit 100 and the processor 200 to supply power to the temperature detection circuit 100 and the processor 200. For example, the temperature detection circuit 100 and the processor 200 are connected to the power supply pins of the power management module 300.

[0082] The temperature detection circuit 100 is configured to output a temperature detection signal based on the internal temperature of the electronic device while the processor 200 is operating at a set power level. The processor 200 is configured to obtain a detected temperature value based on the temperature detection signal output by the temperature detection circuit 100 and determine whether the heat dissipation component is in an effective or ineffective state based on the detected temperature value and a preset threshold.

[0083] The processor 200 generates heat during operation, and the heat dissipation component dissipates heat from the processor 200. Therefore, when the processor 200 operates at a set power, the heat generated by the processor 200 and the heat dissipation effect of the heat dissipation component jointly determine the internal temperature of the electronic device. Furthermore, when the operating power of the processor 200 is fixed, the temperature changes inside the electronic device can reflect the actual thermal conductivity of the heat dissipation component.

[0084] The preset threshold is obtained based on statistics of pre-measured values and represents the critical temperature value between the effective and failed states of the heat dissipation component. Optionally, the processor cooperates with several known effective heat dissipation components and several known failed heat dissipation components to detect the temperature value of the processor while the processor is operating at a set power and for a set duration. Furthermore, a statistical analysis is performed on the detected temperature values to obtain the preset threshold. Thus, by comparing the preset threshold with the detected temperature value obtained based on the temperature detection signal, the processor 200 can determine whether the heat dissipation component is in an effective or failed state.

[0085] The heat dissipation component detection circuit provided by the embodiment of the present disclosure can realize the detection of the entire electronic device. In actual operation, it can be carried out after the heat dissipation component is installed inside the electronic device. In this way, there is no human operation in the overall detection process, which effectively improves the detection accuracy. In addition, by detecting the entire device after installation, failed heat dissipation components can be effectively screened out, avoiding defects that cannot be detected when the failed heat dissipation component is installed in the electronic device, and optimizing the user experience of the electronic device. In addition, the circuit is adaptable to heat dissipation components of different specifications, and there is no need to set up detection devices for heat dissipation components of different specifications, thereby reducing the cost of detection equipment.

[0086] Figure 2 and Figure 3 is a schematic diagram of a temperature detection circuit according to various exemplary embodiments.

[0087] In one embodiment, Figure 2 As shown, the temperature detection circuit 100 includes a first detection circuit 110. The first detection circuit 110 includes a first thermal sensor 111.

[0088] The resistance of the first thermistor 111 changes with the ambient temperature. For example, the first thermistor 111 may be a positive temperature coefficient (PTC) thermistor, where the resistance is positively correlated with the temperature. Alternatively, the first thermistor 111 may be a negative temperature coefficient (NTC) thermistor, where the resistance is negatively correlated with the temperature.

[0089] When the temperature of the environment in which the first thermistor 111 is located changes, causing its resistance to change, the voltage across the first thermistor 111 changes. The temperature of the environment in which the first thermistor 111 is located can be determined based on the voltage across the first thermistor 111. In this case, the voltage across the first thermistor 111 is the temperature detection signal output by the first detection circuit 110.

[0090] In the first detection circuit 110, a first thermistor 111 is connected in series with a voltage-dividing resistor 112. A first end 111a of the first thermistor 111 is grounded, and a second end 111b is connected to the voltage-dividing resistor 112. Furthermore, the voltage-dividing resistor 112 is connected to a power supply to receive a supply voltage. The second end 111b of the first thermistor 111 is also connected to the processor 200. Since the first end 111a is grounded, the voltage at the second end 111b is the voltage applied across the first thermistor 111. Consequently, the processor 200 receives the temperature detection signal output by the first detection circuit 110.

[0091] Optionally, the second terminal 111b is connected to the processor 200 in sequence through a signal amplification circuit and an analog-to-digital conversion circuit. The signal amplification circuit amplifies the voltage signal of the second terminal 111b, and the analog-to-digital conversion circuit converts the amplified voltage signal into a digital signal for subsequent processing by the processor 200.

[0092] In this embodiment, the first detection circuit 110 outputs a processor temperature detection signal according to the temperature of the processor 200. The processor 200 determines whether the heat dissipation component is in a valid state or a failed state according to the processor temperature detection signal output by the first detection circuit 110 and a preset threshold.

[0093] Optionally, the first detection circuit 110 is disposed around the processor 200. For example, the distance between the first thermistor 111 and the processor 200 is less than or equal to 5 mm. In this manner, the temperature of the environment surrounding the first thermistor 111 is substantially equal to the temperature of the processor 200. Alternatively, the first detection circuit 110 is encapsulated within the processor 200. In this manner, the temperature detection signal output by the first detection circuit 110 is the processor temperature detection signal.

[0094] based on Figure 2 The first detection circuit 110 is configured as shown, and the heat dissipation component detection circuit provided by the embodiment of the present disclosure operates as follows:

[0095] In a first manner, in response to the processor 200 operating at a set power and for a set duration, the first detection circuit 110 outputs a processor temperature detection signal to the processor 200. The processor 200 obtains a detected temperature value based on the temperature detection signal and determines whether the heat dissipation component is in an effective state or a failed state based on the detected temperature value.

[0096] The temperature of the processor 200 fluctuates sensitively, and the heat sink assembly primarily dissipates heat for the processor 200. Therefore, the thermal conductivity of the heat sink assembly alone can be used to reflect the thermal conductivity of the processor 200. The better the thermal conductivity of the heat sink assembly, the lower the temperature of the processor 200 when operating at a set power for a set duration. The worse the thermal conductivity of the heat sink assembly, the higher the temperature of the processor 200 when operating at a set power for a set duration.

[0097] As a second method, when the processor 200 is operating at a set power, the first detection circuit 110 outputs a first temperature detection signal to the processor 200 at a first moment and outputs a second temperature detection signal to the processor 200 at a second moment. In this case, the temperature detection signal output by the first detection circuit 110 includes the first temperature detection signal and the second temperature detection signal.

[0098] Optionally, the first moment is the start moment of the processor 200 operating at the set power, and the second moment is the end moment of the processor 200 operating at the set power. In this case, the first temperature detection signal represents the start temperature of the processor 200 operating at the set power, and the second temperature detection signal represents the end temperature of the processor 200 operating at the set power.

[0099] The processor 200 obtains a detected temperature value based on the first temperature detection signal and the second temperature detection signal. Specifically, the processor 200 obtains the first temperature value based on the first temperature detection signal, obtains the second temperature value based on the second temperature detection signal, and obtains the detected temperature value based on the difference between the second temperature value and the first temperature value (it should be noted that in the embodiment of the present disclosure, the detected temperature value is a positive number). Furthermore, the processor 200 determines whether the heat dissipation component is in an effective state or an ineffective state based on the detected temperature value.

[0100] The detected temperature value represents the actual temperature change of the processor 200 between the first moment and the second moment, when the processor is operating at the set power and is affected by the heat dissipation component. Therefore, a smaller detected temperature value indicates good thermal conductivity of the heat dissipation component, while a larger detected temperature value indicates poor thermal conductivity of the heat dissipation component.

[0101] The detected temperature value obtained in this manner eliminates the impact of the electronic device's ambient temperature on the processor temperature. In particular, when the ambient temperature of the electronic device is stable, the overall temperature difference between the first and second moments in the environment surrounding the electronic device is relatively small. Furthermore, by subtracting the first and second temperature values, the impact of ambient temperature on the temperature variation of processor 200 is offset, improving the accuracy of determining whether the heat dissipation component is effective.

[0102] It should be noted that when this method is used, the preset threshold is tested in the same manner as the temperature value is obtained. Specifically, while the processor 200 is operating at a set power, a first temperature value is obtained at a first moment, a second temperature value is obtained at a second moment, and the difference between the second temperature value and the first temperature value is obtained. Furthermore, the preset threshold is obtained by statistically analyzing the multiple differences.

[0103] In one embodiment, Figure 3 FIG. 1 is a schematic diagram of a temperature detection circuit according to another exemplary embodiment. Figure 3 As shown, the temperature detection circuit 100 includes a first detection circuit 110 and a second detection circuit 120 located outside the processor 200 .

[0104] The structure of the first detection circuit 110 is the same as that of the above embodiment, including a first thermistor 111 and a voltage divider resistor. In addition, the first detection circuit 110 is configured to output a processor temperature detection signal according to the temperature of the processor 200 .

[0105] Second detection circuit 120 includes a second thermistor 121 and a voltage divider resistor connected in series. The voltage signal across second thermistor 121 is the temperature detection signal output by second detection circuit 120. Second detection circuit 120 is configured to output an ambient temperature detection signal based on the ambient temperature within the electronic device. In this case, the temperature detection signal output by temperature detection circuit 100 includes both the processor temperature detection signal and the ambient temperature detection signal.

[0106] Optionally, the distance between the second thermistor 121 and the processor 200 is greater than the distance between the first thermistor 111 and the processor 200. For example, the first thermistor 111 is encapsulated inside the processor 200, and the second thermistor 121 is disposed outside the processor 200. Alternatively, the distance between the first thermistor 111 and the processor 200 is less than or equal to 5 mm, and the distance between the second thermistor 121 and the processor 200 is greater than 5 mm. Accordingly, the ambient temperature detection signal output by the second detection circuit 120 can accurately represent the overall ambient temperature inside the electronic device.

[0107] In this embodiment, the processor 200 receives the processor temperature detection signal output by the first detection circuit 110 and the ambient temperature detection signal output by the second temperature detection circuit 120, and determines whether the heat dissipation component is effective based on the ambient temperature detection signal and the processor temperature detection signal.

[0108] Specifically, the first detection circuit 110 responds to the processor 200 to set the power and set the working time, and outputs a processor temperature detection signal to the processor 200; the second detection circuit 120 responds to the processor 200 to set the power and set the working time, and outputs an ambient temperature detection signal to the processor 200.

[0109] The processor 200 is configured to determine a detected temperature value based on the processor temperature detection signal and the ambient temperature detection signal. Specifically, the processor 200 determines the processor temperature value based on the processor temperature detection signal, determines the ambient temperature value based on the ambient temperature detection signal, and determines the detected temperature value based on the difference between the ambient temperature value and the processor temperature value. Furthermore, the processor 200 determines whether the heat dissipation component is in an effective or ineffective state based on the detected temperature value.

[0110] The processor temperature value represents the temperature of the processor 200 after a set period of time, affected by both its own heat and the ambient temperature. The ambient temperature value represents the overall ambient temperature within the electronic device. Subtracting the processor temperature value from the ambient temperature value offsets the effect of the ambient temperature on the temperature of the processor 200. Therefore, even if the temperature of the electronic device's environment fluctuates significantly over the set period of time, the detected temperature value obtained by the processor 200 accurately reflects the actual temperature reached by the processor 200 due to its own heat.

[0111] It should be noted that the further the second thermistor 121 in the second detection circuit 120 is from the processor 200, the more accurate the ambient temperature value obtained by the processor 200 based on the ambient temperature detection signal. Consequently, the accuracy of the ultimately obtained detected temperature value is higher, thereby improving the accuracy of determining whether the heat dissipation component is effective.

[0112] based on Figure 2 and Figure 3 The structure of the heat dissipation component detection circuit provided by the processor 200 has the following optional implementations when determining whether the heat dissipation component is in a valid state or a failed state according to the detected temperature value:

[0113] As a first approach, the processor 200 determines that the heat dissipation component is in a failed state in response to the detected temperature value being greater than or equal to a preset threshold, and / or determines that the heat dissipation component is in a valid state in response to the detected temperature value being less than a preset threshold.

[0114] As a second manner, in this manner, the preset threshold is a threshold range, and the preset threshold includes a maximum value and a minimum value.

[0115] In response to the detected temperature value being less than or equal to the minimum value, the processor 200 determines that the heat dissipation component is in a valid state. And / or,

[0116] The processor 200 determines that the heat dissipation component is in an invalid state in response to the detected temperature value being greater than or equal to the maximum value. And / or,

[0117] In response to the detected temperature value being greater than the minimum value and less than the maximum value, the processor 200 controls the power management module 300 to stop supplying power for a set period of time, and then receives the temperature detection signal output by the temperature detection circuit 100 again, and determines whether the heat dissipation component is in a valid state or a failed state based on the temperature detection signal received again.

[0118] Furthermore, when the temperature detection circuit 100 adopts Figure 2 In the illustrated method, before the electronic device cools down, the detected temperature value is determined solely based on the processor temperature detection signal. After cooling, the detected temperature value is determined based on the first temperature detection signal and the second temperature detection signal. In other words, different methods are used to obtain the detected temperature values before and after cooling. This improves the accuracy of determining failed heat dissipation components and further optimizes the user experience of the electronic device.

[0119] The heat sink detection circuit provided by the disclosed embodiments supports detecting the effectiveness of the heat sink assembly after it is installed in an electronic device. The entire detection process requires no human intervention and has high detection accuracy. Furthermore, the detection circuit supports heat sinks of different specifications, effectively reducing the cost of the detection equipment.

[0120] Based on the above heat dissipation component detection circuit, the embodiment of the present disclosure also provides a heat dissipation component detection method. Figure 4 FIG. 1 is a flow chart of a detection method according to an exemplary embodiment. Figure 4 As shown, the method includes:

[0121] Step 401: Receive a temperature detection signal.

[0122] In the first example, the heat sink detection circuit uses Figure 2 In the structure shown, step 401 specifically includes: in response to working at a set power for a set time, receiving a processor temperature detection signal, and using the processor temperature detection signal as a temperature detection signal.

[0123] In the second example, the heat sink detection circuit uses Figure 2 In the structure shown, step 401 specifically includes: during operation at a set power, receiving a first temperature detection signal at a first moment and receiving a second temperature detection signal at a second moment. Optionally, the first moment is the start moment of the set duration, and the second moment is the end moment of the set duration.

[0124] In the third example, the heat sink detection circuit uses Figure 3 In the structure shown, step 401 specifically includes: in response to operating at a set power for a set time, receiving a processor temperature detection signal and an ambient temperature detection signal. The processor temperature detection signal is a temperature detection signal output by a first detection circuit, and the ambient temperature detection signal is a temperature detection signal output by a second detection circuit.

[0125] Step 402: Acquire a detected temperature value according to the temperature detection signal.

[0126] In the case where step 401 adopts the first example, step 402 specifically includes: obtaining a detected temperature value based on the processor temperature detection signal. Optionally, determining the resistance value of the first thermistor based on the processor temperature detection signal, and then determining the detected temperature value based on a correspondence table between the resistance value and temperature of the first thermistor (e.g., a temperature characteristic correspondence table).

[0127] In the case of adopting the second example in step 401, Figure 5 is a flow chart of a detection method according to another exemplary embodiment. Figure 5 As shown, step 402 specifically includes:

[0128] Step 4021: Obtain a first detected temperature value according to a first temperature detection signal.

[0129] Step 4022: Obtain a second detected temperature value according to the second temperature detection signal.

[0130] Step 4023: Obtain a detected temperature value according to the difference between the second detected temperature value and the first detected temperature value.

[0131] Thus, the detected temperature value represents the temperature variation of the processor under the influence of the heat dissipation component when operating at the set power. Step 4023 eliminates the influence of ambient temperature, accurately reflecting the impact of the heat dissipation component on the temperature variation of the processor. The order of executing steps 4021 and 4022 is not limited; they can be performed simultaneously or step 4022 can be performed first.

[0132] In the case of adopting the third example in step 401, Figure 6 is a flow chart of a detection method according to another exemplary embodiment. Figure 6 As shown, step 402 specifically includes:

[0133] Step 4024: Obtain the processor temperature value according to the processor temperature detection signal.

[0134] Step 4025: Acquire the ambient temperature value according to the ambient temperature detection signal.

[0135] Step 4026: Obtain a detected temperature value based on the difference between the processor temperature value and the ambient temperature value.

[0136] Thus, the detected temperature value represents the temperature that the processor can reach after operating at a set power for a set period of time, under the influence of the heat dissipation component alone. Step 4026 eliminates the influence of the ambient temperature on the temperature of the processor after the processor has operated for the set period of time, accurately reflecting the influence of the heat dissipation component on the processor temperature.

[0137] Continue to refer to Figure 4 , after step 402, step 403 is performed, specifically as follows:

[0138] Step 403: Determine whether the heat dissipation component is in a valid state or a failed state according to the detected temperature value and a preset threshold.

[0139] In one example, step 403 specifically includes: in response to the detected temperature value being greater than or equal to a preset threshold, determining that the heat dissipation component is in a failed state, and / or in response to the detected temperature value being less than a preset threshold, determining that the heat dissipation component is in a valid state.

[0140] In one example, step 403 specifically includes: in response to the detected temperature value being less than or equal to a minimum value, determining that the heat dissipation component is in an effective state. And / or, in response to the detected temperature value being greater than or equal to a maximum value, determining that the heat dissipation component is in an ineffective state. And / or, in response to the detected temperature value being greater than the minimum value and less than the maximum value, suspending operation for a set period of time, then receiving a temperature detection signal again, and determining whether the heat dissipation component is in an ineffective state or an effective state based on the temperature detection signal received again.

[0141] In this way, if the detection value falls within the preset threshold, the electronic device is powered off and cooled, and a second test is performed after cooling. This further improves the accurate identification of effective and ineffective heat dissipation components, thereby ensuring that the heat dissipation components installed in electronic devices effectively achieve the desired heat dissipation effect and optimize the user experience.

[0142] In particular, when the temperature detection circuit 100 adopts Figure 2 In the illustrated method, before the electronic device cools down, the detected temperature value is determined solely based on the processor temperature detection signal. After cooling, the detected temperature value is determined based on the first temperature detection signal and the second temperature detection signal. In other words, different methods are used to obtain the detected temperature values before and after cooling, further improving the accuracy of determining a failed heat dissipation component.

[0143] Based on the above heat dissipation component detection method, an embodiment of the present disclosure further provides a heat dissipation component detection device, which is applied to the above heat dissipation component detection circuit. Figure 7 is a block diagram of a detection device according to an exemplary embodiment. Figure 7 As shown, the device includes:

[0144] Receiving module 701, used for receiving temperature detection signal;

[0145] an acquisition module 702, configured to acquire a detected temperature value according to a temperature detection signal; and

[0146] The determination module 703 is configured to determine whether the heat dissipation component is in a valid state or a failed state according to the detected temperature value and a preset threshold.

[0147] In one embodiment, the receiving module 701 is specifically configured to: in response to operating at a set power and for a set period of time, receive a processor temperature detection signal, and use the processor temperature detection signal as a temperature detection signal.

[0148] In one embodiment, the receiving module 701 is specifically configured to: receive a first temperature detection signal at a first moment and receive a second temperature detection signal at a second moment during operation at a set power.

[0149] In one embodiment, Figure 8 is a block diagram of a detection device according to another exemplary embodiment. Figure 8 As shown, the acquisition module 702 includes:

[0150] The first acquiring unit 7021 is configured to acquire a first detected temperature value according to the first temperature detection signal.

[0151] The second acquiring unit 7022 is configured to acquire a second detected temperature value according to the second temperature detection signal.

[0152] The third acquiring unit 7023 is configured to acquire a detected temperature value according to a difference between the second detected temperature value and the first detected temperature value.

[0153] In one embodiment, the receiving module 701 is further configured to: receive an ambient temperature detection signal in response to operating at a set power for a set period of time.

[0154] In one embodiment, Figure 9 is a block diagram of a detection device according to another exemplary embodiment. Figure 9 As shown, the acquisition module 702 includes:

[0155] The fourth acquiring unit 7024 is configured to acquire a processor temperature value according to the processor temperature detection signal.

[0156] A fifth acquiring unit 7025 is configured to acquire an ambient temperature value according to the ambient temperature detection signal;

[0157] The sixth acquiring unit 7026 is configured to acquire a detected temperature value according to a difference between the processor temperature value and the ambient temperature value.

[0158] In one embodiment, the determining module 703 is specifically configured to:

[0159] In response to the detected temperature value being greater than or equal to a preset threshold, determining that the heat dissipation component is in a failure state; and / or,

[0160] In response to the detected temperature value being less than a preset threshold, the heat dissipation component is determined to be in a valid state.

[0161] In one embodiment, the determining module 703 is specifically configured to:

[0162] In response to the detected temperature value being less than or equal to the minimum value, determining that the heat dissipation component is in a valid state; and / or,

[0163] In response to the detected temperature value being greater than or equal to the maximum value, determining that the heat dissipation component is in an invalid state; and / or,

[0164] In response to the detected temperature value being greater than the minimum value and less than the maximum value, the operation is stopped for a set period of time and then a temperature detection signal is received again, and the heat dissipation component is determined to be in a failed state or a valid state according to the temperature detection signal received again.

[0165] Based on the heat dissipation component detection circuit provided above, an embodiment of the present disclosure further provides an electronic device. The electronic device can be a mobile phone, a tablet computer, a wearable device (smart bracelet, smart watch, etc.), an in-vehicle device, or a medical device.

[0166] Figure 10 FIG is a partial schematic diagram of an electronic device according to an exemplary embodiment. Figure 10 As shown, the electronic device includes a heat dissipation component 400 and the heat dissipation component detection circuit provided above.

[0167] The heat dissipation assembly 400 includes a heat conductor 410 and a heat sink 420. The heat conductor 410 is connected to the processor 200 in the heat dissipation assembly detection circuit, and is also connected to the heat sink 420. Thus, heat from the processor 200 is transferred to the heat sink 420 via the heat conductor 410, and then transferred to a portion away from the processor 200 via the heat sink 420 for heat exchange, thereby achieving heat dissipation.

[0168] The heat conducting member 410 is selected from at least one of a heat conducting sheet and a heat conducting gel. The heat sink 420 is selected from a heat pipe heat sink or a vapor chamber heat sink. The heat sink 420 is disposed over the processor 200 to increase the heat dissipation area of the heat sink 420 and optimize the heat dissipation effect.

[0169] The heat dissipation component detection circuit determines whether the heat dissipation component is active or inactive based on the temperature within the electronic device. This electronic device supports post-assembly heat dissipation component detection, effectively screening out failed heat dissipation components, improving the heat dissipation performance of the electronic device and optimizing the user experience.

[0170] Figure 11 FIG is a block diagram of an electronic device according to an exemplary embodiment. Figure 11As shown, the electronic device 1100 may include one or more of the following components: a processing component 1102, a memory 1104, a power component 1106, a multimedia component 1108, an audio component 1110, an input / output (I / O) interface 1112, a sensor component 1114, a communication component 1116, and an image acquisition component.

[0171] The processing component 1102 generally controls the overall operation of the electronic device 1100, such as operations associated with display, phone calls, data communications, camera operation, and recording operations. The processing component 1102 may include one or more processors 1110 to execute instructions. In addition, the processing component 1102 may include one or more modules to facilitate interaction between the processing component 1102 and other components. For example, the processing component 1102 may include a multimedia module to facilitate interaction between the multimedia component 1108 and the processing component 1102.

[0172] The memory 1104 is configured to store various types of data to support operations on the electronic device 1100. Examples of such data include instructions for any application or method operating on the electronic device 1100, contact data, phone book data, messages, pictures, videos, etc. The memory 1104 can be implemented by any type of volatile or non-volatile storage device, or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0173] The power supply component 1106 provides power to the various components of the electronic device 1100. The power supply component 1106 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the electronic device 1100.

[0174] The multimedia component 1108 includes a screen that provides an output interface between the electronic device 1100 and the target object. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the target object. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of a touch or slide action, but also detect the duration and pressure associated with the touch or slide operation.

[0175] The audio component 1110 is configured to output and / or input audio signals. For example, the audio component 1110 includes a microphone (MIC), which is configured to receive external audio signals when the electronic device 1100 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode. The received audio signal can be further stored in the memory 1104 or transmitted via the communication component 1116. In some embodiments, the audio component 1110 also includes a speaker for outputting audio signals.

[0176] The I / O interface 1112 provides an interface between the processing component 1102 and a peripheral interface module, such as a keyboard, a click wheel, a button, etc.

[0177] Sensor assembly 1114 includes one or more sensors for providing various status assessments for electronic device 1100. For example, sensor assembly 1114 can detect the open / closed state of electronic device 1100, the relative positioning of components, such as the display screen and keypad of electronic device 1100. Sensor assembly 1114 can also detect changes in the position of electronic device 1100 or a component, the presence or absence of contact between a target object and electronic device 1100, the orientation or acceleration / deceleration of electronic device 1100, and changes in the temperature of electronic device 1100. As another example, sensor assembly 1114 also includes a light sensor, which is disposed below the OLED display screen.

[0178] The communication component 1116 is configured to facilitate wired or wireless communication between the electronic device 1100 and other devices. The electronic device 1100 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 1116 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 1116 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0179] In an exemplary embodiment, the electronic device 1100 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0180] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow from the general principles of the disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

Claims

1. A heat dissipation component detection circuit, characterized in that: The circuit is arranged inside the electronic device and is used to detect the thermal conductivity of the heat dissipation component in the electronic device; the circuit includes: a temperature detection circuit and a processor; The temperature detection circuit is used to output a temperature detection signal according to the internal temperature of the electronic device when the processor is operating at a set power; The processor is electrically connected to the temperature detection circuit, and is used to determine whether the heat dissipation component in the electronic device is in an effective state or a failure state according to the temperature detection signal and a preset threshold; The temperature detection circuit includes a first detection circuit; the first detection circuit is arranged around the processor or encapsulated inside the processor, and the first detection circuit is electrically connected to the processor; The heat dissipation component detection circuit further includes a power management module for supplying power to the processor and the temperature detection circuit, and the preset threshold value includes a maximum value and a minimum value; The processor is specifically configured to: in response to the detected temperature value being greater than the minimum value and less than the maximum value, control the power management module to stop supplying power for a set period of time, and then receive the temperature detection signal output by the temperature detection circuit again, and determine whether the heat dissipation component is in an effective state or a failed state according to the temperature detection signal received again; The detected temperature value is determined according to a processor temperature detection signal, and the first detection circuit outputs a processor temperature detection signal to the processor in response to the processor operating at a set power and for a set period of time; The temperature detection signal output by the temperature detection circuit received again includes: a first temperature detection signal and a second temperature detection signal; the first detection circuit outputs the first temperature detection signal to the processor at a first moment and outputs the second temperature detection signal to the processor at a second moment when the processor is operating at a set power; The detected temperature value is determined by the following steps: A first detected temperature value is obtained according to the first temperature detection signal, a second detected temperature value is obtained according to the second temperature detection signal, and the detected temperature value is obtained according to a difference between the second detected temperature value and the first detected temperature value.

2. The circuit according to claim 1, wherein: The first detection circuit includes a first thermal element; when the first detection circuit is arranged around the processor, the distance between the first thermal element and the processor is less than or equal to 5 mm.

3. The circuit according to claim 2, characterized in that The temperature detection circuit further includes a second detection circuit located outside the processor; The second detection circuit includes a second thermosensitive element, and a distance from the second thermosensitive element to the processor is greater than a distance from the first thermosensitive element to the processor.

4. The circuit according to claim 3, characterized in that The second detection circuit is electrically connected to the processor; The second detection circuit is configured to output an ambient temperature detection signal to the processor in response to the processor operating at a set power and for a set period of time; The processor is used to determine a detection temperature value according to the processor temperature detection signal and the ambient temperature detection signal, and to determine whether the heat dissipation component is in a valid state or a failed state according to the detection temperature value.

5. The circuit according to claim 1 or 4, characterized in that The processor is specifically configured to: In response to the detected temperature value being less than or equal to the minimum value, determining that the heat dissipation component is in a valid state; and / or In response to the detected temperature value being greater than or equal to the maximum value, it is determined that the heat dissipation component is in an invalid state.

6. A method for detecting a heat dissipation component, characterized in that: The method is applied to the heat dissipation component detection circuit according to any one of claims 1 to 5, and the method comprises: receiving a temperature detection signal; Acquire a detected temperature value according to the temperature detection signal; Determining whether the heat dissipation component is in a valid state or a failed state according to the detected temperature value and a preset threshold; The determining whether the heat dissipation component is in a valid state or a failed state according to the detected temperature value and a preset threshold value includes: In response to the detected temperature value being greater than the minimum value and less than the maximum value, stopping operation for a set period of time and then receiving the temperature detection signal again, and determining whether the heat dissipation component is in a failed state or a valid state according to the temperature detection signal received again; Wherein, the detected temperature value is determined according to the processor temperature detection signal; the temperature detection signal received again includes: a first temperature detection signal and a second temperature detection signal; The method further includes: receiving a processor temperature detection signal in response to the processor operating at a set power for a set period of time; receiving a first temperature detection signal at a first moment and a second temperature detection signal at a second moment during the processor operating at the set power; The acquiring of the detected temperature value according to the temperature detection signal comprises: acquiring a first detected temperature value according to the first temperature detection signal; acquiring a second detected temperature value according to the second temperature detection signal; The detected temperature value is obtained according to the difference between the second detected temperature value and the first detected temperature value.

7. The method according to claim 6, characterized in that The receiving of the temperature detection signal further includes: receiving an ambient temperature detection signal in response to operating at the set power for the set time period.

8. The method according to claim 7, characterized in that The acquiring of the detected temperature value according to the temperature detection signal comprises: Acquiring a processor temperature value according to the processor temperature detection signal; Acquiring an ambient temperature value according to the ambient temperature detection signal; The detected temperature value is obtained according to the difference between the processor temperature value and the ambient temperature value.

9. The method according to claim 6 or 8, characterized in that The determining whether the heat dissipation component is in a valid state or a failed state according to the detected temperature value and a preset threshold value includes: In response to the detected temperature value being less than or equal to the minimum value, determining that the heat dissipation component is in a valid state; and / or In response to the detected temperature value being greater than or equal to the maximum value, it is determined that the heat dissipation component is in an invalid state.

10. A heat dissipation component detection device, characterized in that: The device is applied to the heat dissipation component detection circuit according to any one of claims 1 to 5, and the device comprises: A receiving module, used for receiving a temperature detection signal; an acquisition module, configured to acquire a detected temperature value according to the temperature detection signal; and The determination module is used to determine whether the heat dissipation component is in a valid state or a failed state according to the detected temperature value and a preset threshold.

11. An electronic device, characterized in that: The electronic device comprises: a heat dissipation component and a heat dissipation component detection circuit according to any one of claims 1 to 5; The heat dissipation component is connected to the processor in the heat dissipation component detection circuit; The heat dissipation component detection circuit is used to determine whether the heat dissipation component is in an effective state or a failure state based on the temperature in the electronic device.

12. The electronic device according to claim 11, wherein: The heat dissipation assembly includes: a heat conducting member connected to the processor, and a heat sink connected to the heat conducting member; The radiator includes a heat pipe radiator or a temperature vapor chamber radiator.

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