Semiconductor Refrigeration Chip Test Equipment

Abstract

The embodiment of the present invention provides a semiconductor refrigeration chip test tool, which relates to the field of semiconductor refrigeration technology. The semiconductor refrigeration chip test tool includes a positioning frame, a limit module, a heating module and a heat dissipation module. The limit module is set on the positioning frame, and then the heating module is set on the limit module, and then the heat dissipation module is detachably connected to the positioning frame, wherein the refrigeration chip is placed on the heating module, and the heat dissipation module is used to press the refrigeration chip, and the refrigeration chip, the heating module and the limit module are pressed together, thereby achieving the fixation of the refrigeration chip. When the refrigeration chip needs to be removed or replaced, only the heat dissipation module needs to be removed to expose the refrigeration chip, and both installation and removal are very convenient. Compared with the prior art, the present invention can realize the performance test of the semiconductor refrigeration chip, and can conveniently disassemble and assemble the refrigeration chip, and the test takes a short time and has good accuracy.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor refrigeration, and in particular to a semiconductor refrigeration chip testing tool. Background Art

[0002] Most traditional mechanical refrigeration equipment uses Freon refrigeration, but Freon refrigeration is polluting. In addition, mechanical refrigeration has defects such as large size, many system parts, high power consumption, the need to add refrigerant (coolant), and limited refrigeration limit temperature. Therefore, in some high-end manufacturing fields, mechanical refrigeration can no longer meet industrial requirements.

[0003] At present, with the development of semiconductor refrigeration technology, the use of semiconductor refrigeration chips for refrigeration has gradually become widely used. Semiconductor refrigeration chips rely on direct current to absorb and release heat at both ends of the thermocouple to achieve the purpose of cooling and heating, which meets environmental protection requirements. During the operation of the semiconductor refrigeration chip, its cold end releases the cold energy into the refrigeration room of the refrigeration equipment through the cold end radiator, and the hot end needs to dissipate the heat to the outside through the hot end radiator.

[0004] In actual applications, different semiconductor cooling chips need to be selected for different use environments and equipment. However, there is no relevant instrument test data for reference in the selection of semiconductor cooling chips, such as ceramic cooling chips, so the actual measurement can only be directly installed, which is time-consuming and has poor accuracy. When using test fixtures to test cooling chips, since conventional fixtures are disposable test structures, it is difficult to disassemble and assemble the cooling chips, resulting in a time-consuming and troublesome testing process. Summary of the invention

[0005] The purpose of the present invention includes, for example, providing a semiconductor refrigeration chip testing tool, which can realize the performance test of the semiconductor refrigeration chip, and can conveniently disassemble and assemble the refrigeration chip, and the test is time-saving and accurate.

[0006] The embodiments of the present invention can be implemented as follows:

[0007] An embodiment of the present invention provides a semiconductor refrigeration chip testing tool, comprising:

[0008] Positioning framework;

[0009] A limit module arranged on the positioning frame;

[0010] A heating module disposed on the limiting module;

[0011] and, a heat dissipation module detachably connected to the positioning frame;

[0012] The heating module and the heat dissipation module are respectively used to be arranged on the cold surface and the hot surface of the refrigeration chip, and the heat dissipation module is used to be pressed on the refrigeration chip to fix the refrigeration chip.

[0013] Furthermore, the positioning frame includes a top frame, a bottom plate and a column, the column is arranged at the edge of the bottom plate, the top frame is connected to the column, a clearance opening is opened on the top frame, the limit module is arranged on the bottom plate and passes through the clearance opening, and the heating module, the refrigeration chip and the heat dissipation module are stacked on the limit module in sequence.

[0014] Furthermore, a positioning rail is provided on the positioning frame, and two relative positioning slide blocks are provided on the positioning rail. The two relative positioning slide blocks are used to clamp on two sides of the heat dissipation module so that the heat dissipation module is fixed on the positioning frame.

[0015] Further, the limiting module includes a limiting cylinder, a limiting block, a buffer plate, a first elastic member and a second elastic member, the limiting cylinder is arranged on the bottom plate, the first elastic member is arranged in the limiting cylinder and extends upward, the limiting block is arranged on the limiting cylinder and abuts against the first elastic member, the second elastic member is arranged on the buffer plate and extends upward, the buffer plate is arranged on the limiting block and abuts against the second elastic member, and the heating module is arranged on the buffer plate.

[0016] Furthermore, a locking piece is also provided on the bottom plate, and the locking piece is used to abut against the limiting module to lock the limiting module, the heating module, the refrigeration chip and the heat dissipation module.

[0017] Furthermore, thermal insulation cotton is arranged between the top frame and the bottom plate, and the thermal insulation cotton is wrapped around the limiting module.

[0018] Furthermore, the semiconductor refrigeration chip testing fixture also includes a first heat-conducting block and a second heat-conducting block, the first heat-conducting block and the second heat-conducting block are respectively used to be arranged on both sides of the refrigeration chip, and the first heat-conducting block is in contact with the heat dissipation module, and the second heat-conducting block is in contact with the heating module.

[0019] Furthermore, the heating module includes a heating power supply and a ceramic heating plate, the ceramic heating plate is embedded in the second heat conductive block, a thermal insulation material layer is arranged around the ceramic heating plate, the heating power supply is arranged outside the thermal insulation material layer and is connected to the ceramic heating plate through a wire.

[0020] Furthermore, the semiconductor refrigeration chip testing tool also includes a temperature measurement module, which includes a first thermocouple, a second thermocouple and a thermometer, the first thermocouple is connected to the second heat conductive block, and is used to measure a first temperature value of the cold surface of the refrigeration chip, the second thermocouple is connected to the first heat conductive block, and is used to measure a second temperature value of the hot surface of the refrigeration chip, and the thermometer is simultaneously connected to the first thermocouple and the second thermocouple, and is used to generate the steady-state refrigeration temperature based on the first temperature value and the second temperature value.

[0021] Furthermore, a fixed cover is provided at the bottom of the heat dissipation module, the first heat conductive block is embedded in the fixed cover and abuts against the heat dissipation module, and the second heat conductive block is attached to the heating module.

[0022] The beneficial effects of the embodiments of the present invention include, for example:

[0023] The semiconductor refrigeration chip testing tool provided by the embodiment of the present invention is provided by setting a limit module on the positioning frame, then setting a heating module on the limit module, and then detachably connecting a heat dissipation module to the positioning frame, wherein the refrigeration chip is placed on the heating module, and the heat dissipation module is used to press the refrigeration chip, and the refrigeration chip, the heating module and the limit module are pressed together as a whole, thereby achieving the fixation of the refrigeration chip. When the refrigeration chip needs to be removed or replaced, only the heat dissipation module needs to be removed to expose the refrigeration chip, and both installation and removal are very convenient. Compared with the prior art, the semiconductor refrigeration chip testing tool provided by the present invention can realize the performance test of the semiconductor refrigeration chip, and can conveniently disassemble and assemble the refrigeration chip, and the test takes a short time and has good accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 A schematic diagram of the exploded structure of a semiconductor refrigeration chip testing tool provided in an embodiment of the present invention;

[0026] Figure 2 A schematic diagram of the working principle of the semiconductor refrigeration chip testing tool provided by an embodiment of the present invention;

[0027] Figure 3 A schematic diagram of the overall structure of a semiconductor refrigeration chip testing tool provided by an embodiment of the present invention;

[0028] Figure 4 A schematic diagram of the partial decomposition structure of a semiconductor refrigeration chip testing tool provided in an embodiment of the present invention.

[0029] Icons: 100-semiconductor refrigeration chip test tooling; 110-refrigeration chip; 113-first heat-conducting block; 115-second heat-conducting block; 130-heating module; 131-heating power supply; 133-ceramic heating plate; 135-insulation material layer; 150-heat dissipation module; 151-fixed cover; 160-insulation cotton; 170-temperature measurement module; 171-first thermocouple; 173-second thermocouple; 175-thermometer; 180-positioning frame; 181-top frame; 183-bottom plate; 185-column; 186-locking piece; 187-allowance opening; 188-positioning slide rail; 189-positioning slide block; 190-limiting module; 191-limiting cylinder; 193-limiting block; 195-buffer plate; 197-first elastic member; 199-second elastic member. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0033] In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0034] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0035] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other. Specific embodiments

[0037] See also Figures 1 to 4 The present embodiment provides a semiconductor refrigeration chip testing tool 100, which can realize the performance test of the semiconductor refrigeration chip 110, and can conveniently disassemble and assemble the refrigeration chip 110, and the test takes a short time and has good accuracy.

[0038] The semiconductor refrigeration chip test fixture 100 provided in this embodiment is used to test the refrigeration chip 110. The semiconductor refrigeration chip test fixture 100 includes a heating module 130, a heat dissipation module 150, a temperature measurement module 170, a positioning frame 180 and a limit module 190. The heating module 130 is arranged on the cold surface of the refrigeration chip 110, the heat dissipation module 150 is arranged on the hot surface of the refrigeration chip 110, and the temperature measurement module 170 is connected to the refrigeration chip 110. The heating module 130 is used to heat the refrigeration chip 110 and has a plurality of different heating powers. The heat dissipation module 150 is used to cool the refrigeration chip 110. The temperature measurement module 170 is used to measure the steady-state refrigeration temperature of the refrigeration chip 110, and the steady-state refrigeration temperature is used to characterize the performance of the refrigeration chip 110. The limit module 190 is arranged on the positioning frame 180, and the heating module 130 is arranged on the limit module 190.

[0039] In this embodiment, the cooling chip 110, the heating module 130, and the heat dissipation module 150 are all detachably stacked on the limiting module 190, wherein the bottom of the heat dissipation module 150 is detachably connected to the positioning frame 180, so that the heat dissipation module 150, the cooling chip 110, and the heating module 130 are pressed together. At the same time, when the cooling chip 110 needs to be replaced, it is only necessary to disassemble the heat dissipation module 150 and replace the cooling chip 110, which is very convenient.

[0040] In this embodiment, the temperature measurement module 170 includes a first thermocouple 171, a second thermocouple 173 and a thermometer 175. The first thermocouple 171 is arranged on the cold surface of the refrigeration chip 110, and is used to measure the first temperature value of the cold surface of the refrigeration chip 110. The second thermocouple 173 is arranged on the hot surface of the refrigeration chip 110, and is used to measure the second temperature value of the hot surface of the refrigeration chip 110. The thermometer 175 is connected to the first thermocouple 171 and the second thermocouple 173 at the same time, and is used to generate a steady-state refrigeration temperature according to the first temperature value and the second temperature value. Specifically, the first thermocouple 171 and the second thermocouple 173 are both extremely fine thermocouples, which are respectively connected to the hot surface and the cold surface of the refrigeration chip 110, so as to respectively measure the temperature values ​​of the hot surface and the cold surface of the refrigeration chip 110.

[0041] It should be noted that the steady-state refrigeration temperature mentioned in this embodiment refers to the difference between the first temperature value and the second temperature value, and the difference can characterize the heat exchange capacity of the refrigeration chip 110, that is, the performance of the refrigeration chip 110. At the same time, the heating module 130 has a plurality of different heating powers, and the steady-state refrigeration temperature under different power conditions is recorded by the power change of the heating module 130, so as to complete the test of the chip performance, select the model of the refrigeration chip 110 that best meets each product, and maximize the performance of the refrigeration chip 110.

[0042] In this embodiment, the heating module 130 includes a heating power supply 131 and a ceramic heating plate 133, the ceramic heating plate 133 is attached to the cold surface of the refrigeration chip 110, a heat preservation material layer 135 is arranged around the ceramic heating plate 133, the heating power supply 131 is arranged outside the heat preservation material layer 135, and is connected to the ceramic heating plate 133 through a wire. Specifically, the ceramic heating plate 133 can be attached to the cold surface of the refrigeration chip 110 through thermal conductive silicone grease, thereby heating the cold surface.

[0043] Furthermore, the semiconductor refrigeration chip test fixture 100 also includes a first heat-conducting block 113 and a second heat-conducting block 115, which are respectively arranged on both sides of the refrigeration chip 110, and a fixing cover 151 is arranged at the bottom of the heat dissipation module 150, the first heat-conducting block 113 is embedded in the fixing cover 151 and abuts against the heat dissipation module 150, and the second heat-conducting block 115 is attached to the heating module 130. Specifically, the first heat-conducting block 113 and the second heat-conducting block 115 are both copper blocks with excellent thermal conductivity, wherein the first heat-conducting block 113 is attached to the lower surface of the heat dissipation module 150 through thermal grease, and the second heat-conducting block 115 is attached to the surface of the ceramic heating plate 133 through thermal grease. The fixing cover 151 is made of bakelite and can play a role in fixing the first heat-conducting block 113.

[0044] It should be noted that in this embodiment, the sizes of the refrigeration chip 110, the first heat-conducting block 113, the second heat-conducting block 115 and the ceramic heating plate 133 are the same, for example, all are 40×40 mm, so as to ensure the consistency of heat transfer. In addition, in this embodiment, the first thermocouple 171 extends into the second heat-conducting block 115 and is connected to the second heat-conducting block 115, and the second thermocouple 173 extends into the first heat-conducting block 113 and is connected to the first heat-conducting block 113 to ensure the accuracy of temperature measurement. At the same time, the ceramic heating plate 133 is embedded in the second heat-conducting block 115 to achieve uniform heating.

[0045] In this embodiment, the heating module 130 is arranged on the limiting module 190, and the heat dissipation module 150 is detachably arranged on the positioning frame 180. The positioning frame 180 includes a top frame 181, a bottom plate 183 and a column 185, the column 185 is arranged on the edge of the bottom plate 183, the top frame 181 is connected to the column 185, a clearance opening 187 is opened on the top frame 181, the limiting module 190 is arranged on the bottom plate 183 and passes through the clearance opening 187, and the heating module 130, the cooling chip 110 and the heat dissipation module 150 are stacked on the limiting module 190 in sequence.

[0046] It is worth noting that the bottom plate 183 and the top frame 181 are both rectangular blocks, there are four columns 185, and the four columns 185 are respectively arranged at the four top corners of the bottom plate 183. The limiting module 190 is arranged at the center position of the bottom plate 183 and extends out from the clearance opening 187 on the top frame 181, so as to facilitate the installation of the ceramic heating plate 133, the cooling chip 110 and the heat dissipation module 150.

[0047] In this embodiment, a positioning rail 188 is further provided on the positioning frame 180, and two relative positioning sliders 189 are provided on the positioning rail 188. The two relative positioning sliders 189 are used to clamp on both sides of the heat dissipation module 150, so that the heat dissipation module 150 is fixed on the positioning frame 180. Specifically, a protrusion is provided on the opposite side of the positioning slider 189, and the protrusion is plugged with the bottom of the heat dissipation module 150, so as to limit the bottom of the heat dissipation module 150, so that the heat dissipation module 150, the cooling chip 110, and the heating module 130 are pressed on the limiting module 190 in sequence.

[0048] The limiting module 190 includes a limiting cylinder 191, a limiting block 193, a buffer plate 195, a first elastic member 197 and a second elastic member 199. The limiting cylinder 191 is arranged on the bottom plate 183, the first elastic member 197 is arranged in the limiting cylinder 191 and extends upward, the limiting block 193 is arranged on the limiting cylinder 191 and abuts against the first elastic member 197, the second elastic member 199 is arranged on the buffer plate 195 and extends upward, the buffer plate 195 is arranged on the limiting block 193 and abuts against the second elastic member 199, and the heating module 130 is arranged on the buffer plate 195. Specifically, the buffer plate 195 is a bakelite board, the second elastic member 199 includes 4 springs, the 4 springs are evenly distributed on the limiting block 193, and the buffer plate 195 is abutted, and the first elastic member 197 also includes 4 springs, the 4 springs are pressed in the limiting cylinder 191, and the limiting block 193 is abutted.

[0049] In this embodiment, the first elastic member 197 and the second elastic member 199 are both four compression springs, which provide an upward elastic force to the buffer plate 195, and through the conduction of force, the bottom of the heat dissipation module 150 is abutted against the positioning slider 189, thereby preventing the positioning slider 189 from sliding out to both sides.

[0050] It should be noted that, here, an upward elastic force can be applied to the positioning slider 189 by compressing the spring, and a protrusion is provided on the opposite side of the two positioning sliders 189. The protrusion and the bottom of the heat dissipation module 150 are limitedly engaged under the action of the elastic force. When the heat dissipation module 150 needs to be removed, the heat dissipation module 150 is pressed downward to compress the spring part so that the protrusion and the bottom of the heat dissipation module 150 are released from the limit, and then the positioning slider 189 is slid to both sides, so that the heat dissipation module 150 can be easily taken out, and then the first heat conductive block 113 is removed to expose the refrigeration chip 110 to the outside.

[0051] In this embodiment, a locking member 186 is further provided on the bottom plate 183, and the locking member 186 is used to abut against the limit module to lock the limit module, the heating module 130, the refrigeration chip 110 and the heat dissipation module 150. Specifically, a threaded hole is provided on the bottom plate 183, and the locking member 186 is a screw structure, which can abut against the limit cylinder 191 or the limit block 193 upward, thereby achieving the abutment of the upper structure, and cooperates with the first elastic member 197 and the second elastic member 199 to apply elastic force on the positioning slider 189, thereby achieving the overall fixation.

[0052] In this embodiment, a heat-insulating cotton 160 is further arranged between the bottom plate 183 and the top frame 181 , and the heat-insulating cotton is wrapped around the limiting module 190 , thereby playing a heat-insulating role and avoiding heat loss.

[0053] This embodiment also provides a semiconductor refrigeration chip 110 testing method, which is applicable to the semiconductor refrigeration chip testing tool 100 as described above, and the method includes the following steps:

[0054] S1: heating the cold surface of the cooling chip 110 by the heating module 130 .

[0055] Specifically, the heating module 130 has multiple different heating powers, and the heating power of the heating module 130 needs to be adjusted to achieve heating of the cold surface. For example, the heating power of the ceramic heating plate 133 can be adjusted by adjusting the output power of the heating power supply 131, so as to achieve heating of the cold surface of the refrigeration chip 110 with different powers, thereby facilitating the completion of the test.

[0056] S2: measuring the steady-state cooling temperature of the cooling chip 110 through the temperature measurement module 170 .

[0057] Specifically, the temperature measurement module 170 is used to measure the steady-state refrigeration temperature of the refrigeration chip 110 under different heating powers, and the steady-state refrigeration temperature is used to characterize the performance of the refrigeration chip 110. In this embodiment, the first thermocouple 171 can be used to measure the first temperature value of the cold surface of the refrigeration chip 110, and the second thermocouple 173 can be used to measure the second temperature value of the hot surface of the refrigeration chip 110, and then the first temperature value and the second temperature value are subtracted through the thermometer 175 to obtain the steady-state refrigeration temperature.

[0058] After measuring the steady-state refrigeration temperature, the performance of the refrigeration chip 110 can be directly visualized and outputted through the central control computer, or recorded and subsequently determined by the operator. The refrigeration chip 110 can be selected based on the result.

[0059] In summary, the semiconductor refrigeration chip test fixture 100 and the test method provided in this embodiment are to set the heat dissipation module 150 on the hot surface of the refrigeration chip 110, set the heating module 130 on the cold surface of the refrigeration chip 110, heat the refrigeration chip 110 with different heating powers through the heating module 130, and then measure the steady-state refrigeration temperature of the refrigeration chip 110 under different heating powers through the temperature measurement module 170, wherein the steady-state refrigeration temperature is used to characterize the performance of the refrigeration chip 110. In this embodiment, by setting the heating module 130, the power change of the heating module 130 is used to record the steady-state refrigeration temperature under different power conditions, thereby completing the test of the chip performance, selecting the model of the refrigeration chip 110 that best meets the corresponding product of each product, and maximizing the performance of the refrigeration chip 110. Furthermore, by setting the limiting module 190 on the positioning frame 180, and then setting the heating module 130 on the limiting module 190, and then detachably connecting the heat dissipation module 150 on the positioning frame 180, the cooling chip 110 is placed on the heating module 130, and the heat dissipation module 150 is used to press the cooling chip 110, and the cooling chip 110, the heating module 130 and the limiting module 190 are pressed together, thereby achieving the fixing of the cooling chip 110. When the cooling chip 110 needs to be removed or replaced, only the heat dissipation module 150 needs to be removed to expose the cooling chip 110, and both installation and removal are very convenient.

[0060] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A semiconductor refrigeration chip testing tool, characterized in that: include: Positioning framework; A limit module arranged on the positioning frame; A heating module disposed on the limiting module; and, a heat dissipation module detachably connected to the positioning frame; The heating module and the heat dissipation module are respectively used to be arranged on the cold surface and the hot surface of the refrigeration chip, and the heat dissipation module is used to be pressed on the refrigeration chip to fix the refrigeration chip; The positioning frame comprises a top frame, a bottom plate and a column, wherein the column is arranged at the edge of the bottom plate, the top frame is connected to the column, a clearance opening is provided on the top frame, the limiting module is arranged on the bottom plate and passes through the clearance opening, and the heating module, the refrigeration chip and the heat dissipation module are sequentially stacked on the limiting module; The positioning frame is also provided with a positioning slide rail, and the positioning slide rail is provided with two relative positioning slide blocks, and the two relative positioning slide blocks are used to clamp on both sides of the heat dissipation module so that the heat dissipation module is fixed on the positioning frame; The limiting module comprises a limiting cylinder, a limiting block, a buffer plate, a first elastic member and a second elastic member, the limiting cylinder is arranged on the bottom plate, the first elastic member is arranged in the limiting cylinder and extends upward, the limiting block is arranged on the limiting cylinder and abuts against the first elastic member, the second elastic member is arranged on the buffer plate and extends upward, the buffer plate is arranged on the limiting block and abuts against the second elastic member, and the heating module is arranged on the buffer plate; The bottom plate is also provided with a locking member, and the locking member is used to abut against the limiting module to lock the limiting module, the heating module, the refrigeration chip and the heat dissipation module.

2. The semiconductor refrigeration chip testing tool according to claim 1, characterized in that: Thermal insulation cotton is also arranged between the top frame and the bottom plate, and the thermal insulation cotton is wrapped around the limiting module.

3. The semiconductor refrigeration chip testing tool according to claim 1 or 2, characterized in that: The semiconductor refrigeration chip testing tool also includes a first heat-conducting block and a second heat-conducting block, wherein the first heat-conducting block and the second heat-conducting block are respectively used to be arranged on both sides of the refrigeration chip, and the first heat-conducting block is in contact with the heat dissipation module, and the second heat-conducting block is in contact with the heating module.

4. The semiconductor refrigeration chip testing tool according to claim 3, characterized in that: The heating module includes a heating power supply and a ceramic heating plate, the ceramic heating plate is embedded in the second heat-conducting block, a thermal insulation material layer is arranged around the ceramic heating plate, the heating power supply is arranged outside the thermal insulation material layer and is connected to the ceramic heating plate through a wire.

5. The semiconductor refrigeration chip testing tool according to claim 3, characterized in that: The semiconductor refrigeration chip testing tool also includes a temperature measurement module, which includes a first thermocouple, a second thermocouple and a thermometer. The first thermocouple is connected to the second heat conductive block and is used to measure a first temperature value of the cold surface of the refrigeration chip. The second thermocouple is connected to the first heat conductive block and is used to measure a second temperature value of the hot surface of the refrigeration chip. The thermometer is connected to the first thermocouple and the second thermocouple at the same time and is used to generate a steady-state refrigeration temperature based on the first temperature value and the second temperature value.

6. The semiconductor refrigeration chip testing tool according to claim 5, characterized in that: The bottom of the heat dissipation module is also provided with a fixed cover, the first heat conduction block is embedded in the fixed cover and abuts against the heat dissipation module, and the second heat conduction block is attached to the heating module.

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