Electronic circuit and circuit rapid manufacturing process

Abstract

The present invention discloses an electronic circuit and a rapid circuit fabrication process, covering the field of electronic circuit technology. The rapid circuit fabrication process comprises: step S1, selecting a substrate; step S2, forming a removable first insulating layer on the surface of the substrate and converting the first insulating layer into a non-removable second insulating layer having a groove consistent with the target circuit; step S3, filling the groove with electronic paste and curing it to obtain the target circuit; and repeating steps S2-S3 until a circuit with a target number of layers is obtained, wherein the number of repetitions is greater than or equal to 0. In embodiments of the present invention, single-layer / multi-layer circuits are fabricated by directly forming circuit grooves on the substrate and then filling them with electronic paste, resulting in a simple process, high efficiency, and low cost.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic circuits, and in particular relates to an electronic circuit and a rapid circuit manufacturing process. Background Art

[0002] At present, in the process of circuit board circuit production, it is usually necessary to laminate a photosensitive dry film on a copper clad laminate with conductive holes. After exposure and development, the required circuit pattern is formed on the photosensitive dry film. The developed copper clad laminate is then immersed or sprayed with an etching solution. The copper surface of the copper clad laminate that is not protected by the photosensitive dry film is etched away by the etching solution, thereby forming the required circuit pattern on the copper clad laminate. Solder mask green oil is then applied. The process is cumbersome and requires a customized mask template, which increases the time required for circuit board production and thus increases the overall production cost. Summary of the Invention

[0003] In view of this, an object of the present invention is to provide a rapid circuit manufacturing process to solve the problems of complex procedures, low efficiency and high cost in the prior art.

[0004] In some illustrative embodiments, the rapid circuit manufacturing process includes: step S1, selecting a substrate; step S2, forming a removable first insulating layer on the surface of the substrate, and converting the first insulating layer into a non-removable second insulating layer having a groove consistent with the target circuit; step S3, filling the groove with electronic paste, and obtaining the target circuit after curing; repeating steps S2-S3 until a circuit with a target number of layers is obtained; wherein the number of repetitions is greater than or equal to 0.

[0005] In some optional embodiments, the first insulating layer is uncured solder resist ink, and the second insulating layer is cured solder resist ink; the first insulating layer is transformed into a non-removable second insulating layer having a groove consistent with the target circuit, including: using LCD, DLP or SLA photocuring technology to photocuring the area on the first insulating layer opposite to the target circuit to form an irremovable second insulating layer; removing the uncured first insulating layer to obtain the groove of the second insulating layer.

[0006] In some optional embodiments, the process of forming a removable first insulating layer on the surface of the substrate and transforming the first insulating layer into a non-removable second insulating layer having a groove consistent with the target circuit includes: performing surface planarization treatment on the first insulating layer and / or the second insulating layer.

[0007] In some optional embodiments, the first insulating layer and the second insulating layer are made of a hard material; and the surface planarization treatment of the first insulating layer and / or the second insulating layer includes: horizontally polishing the surface of the first insulating layer and / or the second insulating layer.

[0008] In some optional embodiments, the first insulating layer is a fluid material; the surface flattening treatment of the first insulating layer and / or the second insulating layer includes: pressing the first insulating layer with a horizontal mirror of a light-transmitting material; and, after forming the non-removable second insulating layer, separating the horizontal mirror from the second insulating layer.

[0009] In some optional embodiments, filling the groove with electronic paste to obtain the target circuit includes: pushing the electronic paste into the groove by scraping to obtain the target circuit.

[0010] In some optional embodiments, the electronic paste is pushed into the groove by scraping to obtain the target circuit, including: selecting a photosensitive film; using a scraper to push the electronic paste into the groove through the photosensitive film, and making the photosensitive film simultaneously cover the second insulating layer; using LCD, DLP or SLA photocuring technology, sequentially irradiating and developing the area on the photosensitive film consistent with the target circuit to remove the uncured photosensitive film; clearing the residual electronic paste on the second insulating layer that is not covered by the photosensitive film; curing the electronic paste in the groove in the second insulating layer; and demolding the remaining photosensitive film to obtain the target circuit.

[0011] In some optional embodiments, the electronic paste is pushed into the groove by scraping to obtain the target circuit, including: curing the electronic paste in the groove of the second insulating layer by LCD, DLP, SLA photocuring technology or laser sintering technology, and removing the residual uncured electronic paste on the second insulating layer.

[0012] In some optional embodiments, filling the groove with electronic paste to obtain the target circuit includes: curing the electronic paste and removing the electronic paste remaining on the surface of the second insulating layer by horizontal polishing to obtain the target circuit.

[0013] In some optional embodiments, filling the groove with electronic paste to obtain the target circuit includes: filling the groove with electronic paste in a negative pressure environment to obtain the target circuit.

[0014] Another object of the present invention is to provide an electronic circuit that can be realized by any of the above-mentioned rapid circuit manufacturing processes.

[0015] Compared with existing technologies, this solution has the following advantages:

[0016] The embodiment of the present invention manufactures single-layer / multi-layer circuits by directly manufacturing circuit grooves on a substrate and then filling them with electronic paste, which has the advantages of simple process, high efficiency and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a flow chart of a rapid circuit manufacturing process according to an embodiment of the present invention;

[0018] Figure 2 is a schematic diagram of a rapid circuit manufacturing process according to an embodiment of the present invention;

[0019] Figure 3 This is an example of a planarization process in a rapid circuit manufacturing process according to an embodiment of the present invention;

[0020] Figure 4 This is an example of a scraping electronic paste for a rapid circuit fabrication process according to an embodiment of the present invention;

[0021] Figure 5 This is a structural example 1 of a multilayer circuit according to an embodiment of the present invention;

[0022] Figure 6 This is a second structural example of a multilayer circuit according to an embodiment of the present invention;

[0023] Figure 7 This is a structural example of a rapid circuit fabrication system in an embodiment of the present invention. DETAILED DESCRIPTION

[0024] The following description and the accompanying drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, process and other changes. The examples represent only possible variations. Unless expressly required, individual components and functions are optional, and the order of operations may vary. Portions and features of some embodiments may be included in or replace portions and features of other embodiments. The scope of the embodiments of the invention includes the entire scope of the claims, and all available equivalents of the claims. In this article, these embodiments of the invention may be referred to individually or collectively by the term "invention", which is merely for convenience and is not intended to automatically limit the scope of the application to any single invention or inventive concept if more than one invention is in fact disclosed.

[0025] It should be noted that the various technical features in the embodiments of the present invention can be combined with each other without conflict.

[0026] The embodiment of the present invention proposes a rapid circuit manufacturing process, specifically, as follows Figure 1-2 , Figure 1 A flowchart of a rapid circuit manufacturing process according to an embodiment of the present invention; Figure 2 Schematic diagram of a rapid circuit manufacturing process in an embodiment of the present invention. The rapid circuit manufacturing process includes:

[0027] Step S1, selecting a substrate 1;

[0028] Among them, the substrate 1 can be a rigid substrate, a flexible non-stretchable substrate, a flexible stretchable substrate, etc.; specifically, a rigid substrate such as FR4, FR1, glass, plastic, etc.; a flexible non-stretchable substrate such as PET, PI, PVC, PP, PEN, PE, PC, etc.; a flexible stretchable substrate such as PU, stretch fabric, silicone, latex, etc.

[0029] Step S2, forming a removable first insulating layer 2 on the surface of the substrate 1, and transforming the first insulating layer 2 into a non-removable second insulating layer 3 having a groove 4 consistent with the target circuit;

[0030] At least one purpose of the first insulating layer 2 and the second insulating layer 3 is to form a groove 4 therebetween, consistent with the target circuit, for accommodating electronic paste, thereby forming an electronic circuit consistent with the target circuit. In this step, "removable" and "non-removable" refer to the same means, such as a developer, a specified solvent, water, etc.; for example, the first insulating layer can be removed by dissolving with a developer, but after being converted into the second insulating layer, it cannot be removed by dissolving with a developer. Specifically, the insulating layer can be made of photocurable solder resist ink, photocurable adhesive, photosensitive resin, thermosetting resin, thermosetting solder resist ink, polytetrafluoroethylene, etc.

[0031] Step S3, filling the groove 4 with electronic paste 5, and obtaining the target circuit after curing;

[0032] The method of filling the groove with the electronic paste in this step is not limited to direct writing, scraping, spraying, spin coating, printing, etc. Specifically, the electronic paste is not limited to low-melting-point metal, mixed paste of low-melting-point metal and high-melting-point metal, mixed paste of low-melting-point metal and polymer material, mixed paste of high-melting-point metal and polymer material, or mixed paste of low-melting-point metal, high-melting-point metal and polymer material; in some other embodiments, the low-melting-point metal and / or high-melting-point metal in the mixed paste can also be replaced by non-metallic conductive materials.

[0033] Repeat steps S2-S3 until a circuit with the target number of layers is obtained; wherein the number of repetitions is greater than or equal to 0. Preferably, the number of repetitions can be 0, 1, 2, 3, 4, 5, or 6; wherein, if it is repeated 0 times, i.e., no repetitions, a single-layer circuit can be fabricated by performing steps S1-S3 once; if it is repeated once, i.e., S2-S3 is continued after S3, a double-layer circuit board can be fabricated, and so on, which will not be repeated here.

[0034] The embodiment of the present invention manufactures single-layer / multi-layer circuits by directly manufacturing circuit grooves on a substrate and then filling them with electronic paste, which has the advantages of simple process, high efficiency and low cost.

[0035] In some embodiments, the first insulating layer 2 and the second insulating layer 3 in the embodiments of the present invention can be formed of solder resist ink (i.e., green oil, solder resist), thereby directly using the solder resist ink to form grooves on the substrate to accommodate the electronic paste. Subsequently, the electronic circuit can be obtained by filling the grooves with electronic paste. Compared with the traditional process of etching a circuit on a copper-clad laminate using a film mask, then coating the circuit to form a solder resist layer, and then using the film mask to selectively photocuring to form a patterned solder resist layer, this embodiment further reduces the process steps and costs, improves production efficiency, and ensures the stability and reliability of the electronic circuit.

[0036] Specifically, the first insulating layer 2 may be uncured solder resist ink, and the second insulating layer 3 may be cured solder resist ink; wherein, "uncured solder resist ink" may include uncured and pre-cured, the uncured solder resist ink is in a fluid state, and the pre-cured solder resist ink is in a hard solid state, but the pre-cured solder resist ink can be removed by a corresponding developer; "cured solder resist ink" refers to a completely cured solder resist ink, which cannot be removed by the above-mentioned developer.

[0037] On the other hand, the solder resist ink in the embodiments of the present invention may be a photocurable type, such as UV solder resist. Specifically, in the embodiments of the present invention, converting the first insulating layer 2 into a non-removable second insulating layer 3 having a groove 4 consistent with the target circuit can include: using LCD, DLP, or SLA photocuring technology to photocure the area of ​​the first insulating layer 2 opposite the target circuit, so that the area of ​​the first insulating layer 2 exposed to light forms the non-removable second insulating layer 3, while the area of ​​the first insulating layer 2 consistent with the target circuit, not exposed to light, remains the first insulating layer 2, i.e., forming the non-removable second insulating layer 3, and leaving a removable first insulating layer 2 consistent with the target circuit; then, removing the remaining first insulating layer 2, thereby forming a groove 4 consistent with the target circuit in the second insulating layer 3. The removal method is not limited to washing with a developer corresponding to the solder resist ink. Those skilled in the art will appreciate that removal of the remaining first insulating layer can also be achieved by laser etching, mechanical etching, or other methods.

[0038] LCD photocuring technology uses a light source and an LCD digital mask to achieve light patterning, while DLP photocuring technology achieves light patterning directly through light projection. SLA photocuring technology achieves light patterning through controlled laser scanning. Compared to traditional mask plates, LCD, DLP, and SLA photocuring technologies, driven by digital electronics, can achieve light patterning through software control, eliminating the need for a platemaking process. This significantly improves circuit production efficiency and can meet the user's personalized circuit design needs.

[0039] In other embodiments of the present invention, a heat-curable solder resist ink may be selected and then selectively cured by patterned thermal radiation, such as infrared laser, or in conjunction with a heat-insulating mask.

[0040] In the embodiment of the present invention, the method of filling the groove 4 with the electronic paste 5 is not limited to direct writing, doctor blade coating, spray coating, spin coating, printing, etc. Specifically, the electronic paste is not limited to low-melting-point metal, mixed paste of low-melting-point metal and high-melting-point metal, mixed paste of low-melting-point metal and polymer material, mixed paste of high-melting-point metal and polymer material, or mixed paste of low-melting-point metal, high-melting-point metal and polymer material; in some other embodiments, the low-melting-point metal and / or high-melting-point metal in the mixed paste can also be replaced by non-metallic conductive materials.

[0041] Specifically, when solder resist ink is used as the insulating layer, the surface of the second insulating layer formed can show good alienation properties for pure metal electronic paste, that is, the surface does not adhere to the electronic paste. Therefore, when filling the electronic paste into the groove, there is no need to worry too much about the residual problem of the electronic paste on the surface of the insulating layer. The filling method can be direct writing, scraping, spraying, spin coating, printing, etc. Even if there is residue on the surface of the insulating layer, it can be easily removed by wiping, so that the electronic paste only forms a circuit in the groove. Preferably, the electronic paste can be filled in by scraping. Compared with other methods, the scraping method has the advantages of simple process, low requirements, high efficiency and strong reliability. In other embodiments, the insulating layer can also be formed by other surface-selective materials that have similar effects on pure metal electronic paste, such as polytetrafluoroethylene.

[0042] For electronic pastes containing polymer materials, since they have a difficult time showing alienation properties on the surface of the insulating layer, they can be selectively filled directly into the grooves by direct writing, spraying, etc., which can avoid the formation of residues on the surface of the insulating layer outside the grooves. In other embodiments, for electronic pastes containing polymer materials, scraping can also be used for filling. In order to avoid the formation of residues on the surface of the insulating layer, the surface flatness of the insulating layer can be improved. In this way, the scraper pushes the electronic paste into the grooves while simultaneously scraping away the residual electronic paste on the surface of the insulating layer.

[0043] That is, in the embodiment of the present invention, before filling the groove with electronic paste, the surface of the insulating layer can be flattened, which helps to avoid or reduce the electronic paste on the surface of the insulating layer. The flattening treatment can be performed on the first insulating layer, or on the second insulating layer, or the first insulating layer and the second insulating layer can be flattened in sequence; the flattening method is not limited to laser cutting, horizontal polishing, etc. Preferably, the horizontal polishing method has lower requirements on equipment than laser cutting, and the process is simpler and easier to implement. Specifically, horizontal polishing is applied to the hard first insulating layer or the second insulating layer, and the surface of the insulating layer can be polished by a polishing member, or it can be achieved by controlling the insulating layer to be polished on the polishing surface.

[0044] like Figure 3In other embodiments, the surface of the insulating layer can also be flattened by the following means: a horizontal mirror 6 made of a transparent material (e.g., glass, film, or composite material) is pressed onto the fluid first insulating layer 2 to flatten the first insulating layer 2. After the first insulating layer 2 is hardened, the horizontal mirror is separated from the insulating layer to obtain an insulating layer with a flat surface. The hardening of the first insulating layer 2 is not limited to pre-curing or full curing.

[0045] Preferably, the horizontal mirror 6 is made of a composite substrate, including a translucent release film 61 and a translucent rigid plate 62. The first insulating layer is pressed using one side of the release film of the composite substrate to facilitate the subsequent separation of the two, and the rigid strength of the rigid plate of the composite substrate ensures the uniformity of the force during pressing, thereby ensuring the flatness of the pressing.

[0046] Preferably, after pressing the first insulating layer 2 in a fluid state through the horizontal mirror 6, the area on the first insulating layer 2 opposite to the target circuit is photocured through the horizontal mirror 6 through LCD, DLP or SLA photocuring technology, and then the horizontal mirror 6 is separated from the second insulating layer 3, and the remaining first insulating layer 2 is removed, thereby obtaining a second insulating layer 3 with a groove 4 and a smooth surface.

[0047] like Figure 4 In some optional embodiments, the electronic paste 5 is pushed into the groove 4 by scraping to obtain the target circuit, which includes: selecting a photosensitive film 7; using a scraper 8 to push the electronic paste 5 into the groove 4 through the photosensitive film 7, and simultaneously covering the second insulating layer with the photosensitive film 7; sequentially irradiating and developing the area of ​​the photosensitive film corresponding to the target circuit using LCD, DLP, or SLA light curing technology; removing the remaining electronic paste on the second insulating layer that is not covered by the photosensitive film; curing the electronic paste in the groove of the second insulating layer; and demolding the remaining photosensitive film to obtain the target circuit. The order of the curing and demolding steps can be reversed.

[0048] In this embodiment, the photosensitive film can be used to selectively pattern the electronic paste. The area of ​​the photosensitive film that is consistent with the target circuit is illuminated, thereby solidifying the photosensitive film in this area and forming a protective layer for the electronic paste in the lower groove. The uncured photosensitive film is then developed using a developer for the photosensitive film, removing the photosensitive film in the area opposite to the target circuit, thereby exposing the second insulating layer. The remaining electronic paste on the second insulating layer is then removed by wiping or other means, and the electronic paste is then solidified. The solidified photosensitive film is then demolded to obtain the electronic circuit. On the other hand, by driving the scraper to synchronously drive the photosensitive film coating and the filling of the electronic paste, it is beneficial to discharge the gas in the groove and improve the filling quality of the electronic paste.

[0049] In some optional embodiments, the target circuit is obtained by pushing the electronic paste into the groove by scraping, which can also be achieved by the following means: first, the electronic paste can be a light-curing or heat-curing electronic paste; for light-curing electronic paste, the electronic paste in the groove of the second insulating layer can be cured by LCD, DLP, or SLA light-curing technology, and then the uncured electronic paste remaining on the second insulating layer can be removed by wiping or other means to obtain an electronic circuit consistent with the target circuit. For heat-curing electronic paste, the electronic paste in the groove of the second insulating layer can be selectively cured by laser scanning sintering, and then the uncured electronic paste remaining on the second insulating layer can be removed by wiping or other means to obtain an electronic circuit consistent with the target circuit.

[0050] In other embodiments, the electronic paste remaining on the surface of the second insulating layer can be removed by the following method, including: curing the electronic paste as a whole, and then removing the electronic paste remaining on the surface of the second insulating layer by horizontal polishing; wherein the depth of the horizontal polishing in this embodiment is greater than the thickness of the electronic paste remaining on the surface of the second insulating layer and less than the thickness of the electronic paste in the groove. Through this embodiment, the overall cured electronic paste is flattened and thinned, thereby removing the electronic paste remaining on the surface of the second insulating layer. Preferably, this embodiment is suitable for thermally curing electronic paste, and the electronic paste can be cured by conventional thermal baking, high-temperature sintering, etc.

[0051] In some optional embodiments, filling the groove with electronic paste to obtain the target circuit includes filling the groove with electronic paste in a negative pressure environment to obtain the target circuit. In this embodiment, by providing a negative pressure or vacuum environment for filling, gas in the groove can be further discharged, thereby improving the filling quality of the electronic paste.

[0052] In the embodiment of the present invention, for a multi-layer circuit board, steps S2-S3 can be repeated to obtain a multi-layer circuit stacked layer by layer; wherein, in the case where there is a need for conductive connection between the multi-layer circuits, the corresponding positions between the circuit layers can be via structures, and the via structures are part of each layer of the circuit and are integrated by groove filling.

[0053] Figure 5 The first example of a multi-layer circuit in an embodiment of the present invention is shown, in which the first circuit layer D1 and the second circuit layer D2 are connected through a via G. First, the first via G1 on the first circuit layer D1 is realized when the first circuit layer D1 is formed, and then the second via G2 on the second circuit layer D2 is realized when the second circuit layer D2 is made. The electronic paste 5 in the first via G1 and the second via G2 realizes the conductive connection between the first circuit layer D1 and the second circuit layer D2.

[0054] Figure 6 The second example of a multi-layer circuit in an embodiment of the present invention is shown. The third circuit layer D3 is conductively connected to the fifth circuit layer D5 through the fourth circuit layer D4 through the via G. The principle is consistent with the above embodiment. Since the fourth circuit layer D4 does not need to be conductively connected to the third circuit layer D3 and the fifth circuit layer D5, it is only necessary to set vias in the via area, that is, to connect the third circuit layer D3 and the fifth circuit layer D5 through the via structures G3, G4 and G5.

[0055] The expressions “first”, “second”, etc. in the embodiments of the present invention are only used to distinguish two or more similar components, and do not limit their order or number of layers.

[0056] The present invention also provides a thermosetting electronic paste, which is composed of 1% to 60% liquid metal solid-supported powder, 30% to 70% conductive powder (such as a high-melting-point metal), 0.1% to 2% additives, 1% to 10% base resin, and 2% to 30% solvent, by weight. This allows the conductive circuits made of the electronic paste to have excellent comprehensive properties (such as molding characteristics, initial electrical properties, and anti-stripping properties). The liquid metal solid-supported powder includes liquid metal droplets and a solid-supported powder coated on the outside of the liquid metal droplets, and the melting point of the liquid metal in the liquid metal droplets is lower than room temperature.

[0057] Exemplarily, the weight percentage of liquid metal solid powder in the electronic paste is 1%, 2%, 5%, 8%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55% or 60%; the weight percentage of conductive powder is 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65% or 70%; the weight percentage of base resin is 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9% or 10%; the weight percentage of solvent is 2%, 5%, 10%, 12%, 15%, 17%, 20%, 24%, 27% or 30%; the weight percentage of additive is 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.7%, 1%, 1.5% or 2%.

[0058] Preferably, the solid-supported powder in the embodiments of the present invention is lightweight and has a large specific surface area, so as to provide a good coating effect on the liquid metal. Optionally, the solid-supported powder has a particle size range of 7 nm to 4 μm and a specific surface area of ​​100 m2 / g to 3000 m2 / g. Exemplarily, the solid-supported powder in the embodiments of the present invention includes one or more of fumed silica, silica aerogel, carbon aerogel, graphene, carbon nanotubes, carbon black, graphite, fullerene, diatomaceous earth, wollastonite, and sepiolite.

[0059] Optionally, the liquid metal in the embodiment of the present invention is a metal element or alloy having a melting point lower than room temperature, such as a gallium-indium alloy, a gallium-tin alloy, a gallium element, a gallium-indium-tin alloy, or a gallium-indium-tin-zinc alloy.

[0060] Optionally, the diameter of the liquid metal droplets in the embodiment of the present invention is 0.1μm to 10μm. Among them, when the diameter of the liquid metal droplets is less than 0.1μm, it is difficult to prepare, and the liquid metal solid powder is difficult to break under the bending destructive force, and thus there is an inability to compensate for the increase in resistance caused by the reduction in effective contact of the conductive powder; when the diameter of the liquid metal droplets is greater than 10μm, the liquid metal droplets have a large specific gravity and severe phase separation. They are mainly deposited at the bottom of the forming coating, and the surface distribution amount is too small. In addition, when the number of liquid metal droplets with too large a diameter increases further, a certain number of the solid powder shells coated on the outside of the liquid metal droplets will be destroyed in advance during the forming process, which will not only reduce the overall adhesion of the liquid metal conductive slurry, but also easily cause short circuit risks when making complex patterns with low line spacing, and will also increase the resistance changes of the conductive lines during bending, stretching or twisting.

[0061] Optionally, the base resin in the embodiment of the present invention is one or more of polyester resin, polyurethane resin, polyacrylic resin, vinyl chloride vinyl acetate resin, epoxy resin, epoxy acrylic resin, epoxy acrylate resin, polyester acrylate resin, phenolic resin, nitrocellulose, ethyl cellulose, alkyd resin, and amino resin. The above base resins are selected because, on the one hand, they can coexist stably with liquid metal for a long time, have a pH close to neutral, contain no strong alkaline or acidic components, and will not significantly react chemically with liquid metal. On the other hand, the above base resins can ensure that the liquid metal conductive paste has good compatibility and no significant phase separation.

[0062] Optionally, the conductive powder in the embodiment of the present invention includes one or more of silver powder, copper powder, silver-coated copper powder, iron powder, and iron-nickel powder. For example, the conductive powder can be flaky silver powder, spherical silver powder, rod-shaped silver powder, needle-shaped silver powder, dendritic silver powder, etc.

[0063] Optionally, the solvent in the embodiment of the present invention is one or more of ethyl acetate, butyl acetate, isoamyl acetate, n-butyl glycolate, petroleum ether, acetone, butanone, cyclohexanone, methyl isobutyl ketone, diisobutyl ketone, toluene, xylene, butyl carbitol, alcohol ester 12, DBE, ethylene glycol butyl ether, ethylene glycol ethyl ether, dipropylene glycol methyl ether, diethylene glycol ethyl ether acetate, diethylene glycol butyl ether acetate, ethylene glycol butyl ether acetate, n-hexane, cyclohexane, n-heptane, n-octane, and isooctane.

[0064] Optionally, the auxiliary agent in the embodiment of the present invention may include one or more of a dispersant, a wetting agent, a defoaming agent, a leveling agent, etc. The dispersant includes one or more of anionic surfactants, nonionic surfactants and polymer surfactants.

[0065] An embodiment of the present invention also proposes a photocurable electronic paste, which includes, by weight percentage, 5% to 30% main resin, 10% to 60% conductive powder, 2% to 30% electron radiation curing agent, 1% to 40% liquid metal, 10% to 30% active diluent and 0% to 10% auxiliary agent, wherein the liquid metal is a metal element or alloy with a melting point lower than room temperature.

[0066] Among them, the main resin serves as the film-forming material, the conductive powder and liquid metal serve as the conductive functional phase, the electron radiation curing agent is used to promote the curing of the main resin, the active diluent is used to dissolve the main resin to the required viscosity, and the additive is used to improve the comprehensive performance of the electronic paste.

[0067] Exemplarily, the weight percentage of the main resin in the electronic paste is 5%, 10%, 15%, 20%, 25% or 30%; the weight percentage of the conductive powder is 10%, 20%, 30%, 40%, 50% or 60%; the weight percentage of the electron radiation curing agent is 2%, 5%, 10%, 15%, 20%, 25% or 30%; the weight percentage of the liquid metal is 1%, 5%, 10%, 15%, 20%, 25%, 30%, 35% or 40%; the weight percentage of the active diluent is 10%, 15%, 20%, 25% or 30%; the weight percentage of the auxiliary agent is 0%, 2%, 4%, 6%, 8% or 10%.

[0068] During the curing process of the manufactured conductive circuit, due to the presence of the electron radiation curing agent, the main resin can be polymerized and cross-linked by electron beam irradiation, and then transformed into a solid, thereby achieving the curing of the conductive circuit and then realizing the conductive function. In addition, since the liquid metal therein is liquid at room temperature and has good fluidity, it can increase the contact area between the conductive powders, thereby improving the electrical performance of the electronic circuit.

[0069] Optionally, the main resin in the embodiment of the present invention includes one or a combination of silicone resin, acrylic resin, polyurethane resin, polyurethane-modified acrylic resin, and epoxy acrylate.

[0070] Optionally, the conductive powder in the embodiment of the present invention includes one or more of silver powder, copper powder, silver-copper powder, carbon powder, gold powder, palladium powder, platinum powder, and nickel powder.

[0071] Optionally, the active diluent in the embodiment of the present invention includes one or more of methyl methacrylate, ethyl acrylate, n-butyl acrylate, isobutyl acrylate, hydroxyethyl methacrylate, tetrahydrofuranyl acrylate, lauryl acrylate, methoxyethyl acrylate, and isobornyl acrylate.

[0072] Optionally, the liquid metal in the embodiment of the present invention includes one or more of gallium-indium alloy, gallium-tin alloy, single substance gallium, gallium-indium-tin alloy, and gallium-indium-tin-zinc alloy.

[0073] Example 1

[0074] Electronic paste: room temperature liquid metal, that is, low melting point metal that is liquid at room temperature, such as gallium indium alloy;

[0075] Insulation layer: light-curing solder resist ink;

[0076] The rapid circuit production process includes:

[0077] Step S101. Select a substrate;

[0078] Step S102: forming a solder resist layer on the surface of the substrate;

[0079] Step S103: Using LCD, DLP, or SLA light curing technology, light cure the area on the solder mask layer opposite to the target circuit.

[0080] Step S104: removing the uncured solder resist layer to form a groove consistent with the target circuit;

[0081] Step S105: Pushing the liquid metal into the groove by a scraper to form an electronic circuit;

[0082] Among them, due to the alienation property of liquid metal and solder mask layer, no or very little residue will remain on the solder mask layer, and the residue can be removed by simply wiping.

[0083] Example 2

[0084] Electronic paste: room temperature solid metal, that is, low melting point metal that is solid at room temperature, such as bismuth indium tin alloy;

[0085] Insulation layer: light-curing solder resist ink;

[0086] The difference between this circuit rapid manufacturing process and the embodiment is that, between steps S104 and S105, it further includes:

[0087] The room temperature solid metal is heated to transform it into a liquid state, and then the groove is filled with the metal through S105; wherein the liquid metal in the groove is transformed into a solid state after cooling.

[0088] Example 3

[0089] Electronic paste: mixed paste doped with polymer materials;

[0090] Insulation layer: light-curing solder resist ink;

[0091] The rapid circuit production process includes:

[0092] Step S201. Select a substrate;

[0093] Step S202: forming a solder resist layer on the surface of the substrate;

[0094] Step S203: pre-curing the formed solder resist layer to transform it into a removable hard structure;

[0095] Step S204: horizontally polishing the surface of the hard solder resist layer to obtain a solder resist layer with a smooth surface;

[0096] Step S205: light-curing the area on the solder mask layer opposite to the target circuit using LCD, DLP, or SLA light-curing technology;

[0097] Step S206: removing the uncured solder resist layer to form a groove consistent with the target circuit;

[0098] Step S207: Push the electronic paste into the groove using a scraper to form an electronic circuit.

[0099] After step S207 , the method may further include: curing the electronic paste.

[0100] In this embodiment, the pre-cured solder mask layer is flattened to improve the surface flatness of the solder mask layer. When the electronic paste is pushed into the groove by a scraper, the scraper can be against the surface of the solder mask layer as much as possible, thereby avoiding or reducing the residue of electronic paste on the surface of the solder mask layer.

[0101] Step S204 may also be placed after step S206 and before step S207; or, a step may be added between steps S206 and S207 to achieve a further polishing process on the completely cured solder resist layer.

[0102] Example 4

[0103] Electronic paste: mixed paste doped with polymer materials;

[0104] Insulation layer: light-curing solder resist ink;

[0105] This circuit rapid manufacturing process, this embodiment is basically the same as embodiment 3, the difference is that the following technical solution is used to replace steps S203 and S204 of embodiment 3;

[0106] Step S203 'using a horizontal mirror to suppress the solder mask in a fluid state;

[0107] And between steps S205 and S206, an operation of separating the horizontal mirror surface from the solder resist layer is added.

[0108] Example 5

[0109] Electronic paste: mixed paste doped with polymer materials;

[0110] Insulation layer: light-curing solder resist ink;

[0111] The rapid circuit production process includes:

[0112] Step S301. Select a substrate;

[0113] Step S302: forming a solder resist layer on the surface of the substrate;

[0114] Step S303: Using LCD, DLP, or SLA light curing technology, light cure the area on the solder mask layer opposite to the target circuit.

[0115] Step S304: removing the uncured solder resist layer to form a groove consistent with the target circuit;

[0116] Step S305: Pushing the electronic paste into the groove through the photosensitive film by controlling the scraper, and making the photosensitive film cover the surface of the solder mask layer simultaneously;

[0117] Step S306: Perform light curing on the area on the photosensitive film that is consistent with the target circuit using LCD, DLP, or SLA light curing technology;

[0118] Step S307: removing the uncured photosensitive film to expose the solder mask layer and residual electronic paste thereunder;

[0119] Step S308: removing the residual electronic paste on the solder mask layer;

[0120] Step S309: Demolding the cured photosensitive film to remove the cured photosensitive film to obtain the electronic circuit.

[0121] After step S309 , the method may further include: curing the electronic paste.

[0122] In this embodiment, by using a photosensitive film, the overall impact of the residual electronic paste on the solder mask layer can be effectively reduced, making the residual electronic paste easy to remove. In addition, by simultaneously covering the photosensitive film with the electronic paste, the filling quality in the groove can be further improved, avoiding the defect of empty filling in the gap.

[0123] Example 6

[0124] Electronic paste: a mixed paste doped with polymer materials, the mixed paste is light-curing type;

[0125] Insulation layer: light-curing solder resist ink;

[0126] The rapid circuit production process includes:

[0127] Step S401. Select a substrate;

[0128] Step S402: forming a solder resist layer on the surface of the substrate;

[0129] Step S403: Using LCD, DLP, or SLA light curing technology, light cure the area on the solder mask layer opposite to the target circuit.

[0130] Step S404: removing the uncured solder resist layer to form a groove consistent with the target circuit;

[0131] Step S405: Pushing the electronic slurry into the groove with a scraper to form an electronic circuit;

[0132] Step S406. Selectively photocuring the electronic paste in the groove using LCD, DLP, or SLA photocuring technology;

[0133] Step S407: Remove the uncured electronic paste on the surface of the solder resist layer to obtain the target circuit.

[0134] In this embodiment, since step S403 and step S406 can be implemented by the same patterned photocuring technology, the complexity of the device structure can be reduced, and implementation and function reuse can be facilitated.

[0135] Example 7

[0136] Electronic paste: a mixed paste doped with polymer materials, which is a heat-curing type;

[0137] Insulation layer: light-curing solder resist ink;

[0138] The difference between this circuit rapid manufacturing process and embodiment 6 is that step S406 is replaced by laser scanning and curing.

[0139] Example 8

[0140] The difference between this embodiment and the aforementioned embodiments 1-7 is that the step of scraping the electronic paste is performed in a negative pressure environment / vacuum environment, so as to further remove the residual gas in the groove to facilitate the filling of the electronic paste.

[0141] The technical features in the above embodiments of the present invention can be combined with each other under the premise of causing technical conflicts.

[0142] The present invention also discloses an electronic circuit in an embodiment, which can be realized by any of the above-mentioned circuit rapid manufacturing processes. The electronic circuit is not limited to a single-layer circuit or a multi-layer circuit.

[0143] The present invention also discloses a rapid circuit fabrication system for implementing any of the aforementioned rapid circuit fabrication processes. Specifically, the rapid circuit fabrication system includes:

[0144] A substrate fixing unit for carrying and fixing the substrate;

[0145] A first coating unit is used for coating a surface of a substrate to form a first insulating layer;

[0146] a light patterning irradiation unit for performing a light curing process on the area of ​​the formed first insulating layer opposite to the target circuit, so that the irradiated area on the first insulating layer is transformed into a second insulating layer;

[0147] a first cleaning unit for cleaning the first insulating layer remaining in the second insulating layer, thereby forming a groove consistent with the target circuit in the second insulating layer;

[0148] The second coating unit is used to fill the grooves in the second insulating layer with electronic paste.

[0149] The first insulating layer can be removed by corresponding means, but the second insulating layer cannot be removed by the same means.

[0150] When the rapid circuit production system of this embodiment is used to produce a multi-layer circuit board, the production of the multi-layer circuit board can be achieved by repeatedly using the first coating unit, the light patterning irradiation unit, the first cleaning unit, and the second coating unit.

[0151] Optionally, the implementation of the first coating unit is not limited to scraping, spraying, spin coating, printing, direct writing, etc.;

[0152] Optionally, the implementation of the light patterning irradiation unit is not limited to LCD digital mask technology, DLP digital projection technology, and SLA laser scanning technology;

[0153] Optionally, the implementation of the first cleaning unit is not limited to mechanical wiping, wind pressure, applying corresponding developer, solvent, water, etc., or a combination thereof; for example, a wiping cloth soaked with developer.

[0154] Optionally, the second coating unit may be implemented by methods other than scraping, spraying, spin coating, printing, direct writing, etc.;

[0155] Specifically, the substrate in the embodiments of the present invention is not limited to a rigid substrate, a flexible non-stretchable substrate, a flexible stretchable substrate, etc.; specifically, rigid substrates such as FR4, FR1, glass, plastic, etc.; flexible non-stretchable substrates such as PET, PI, PVC, PP, PEN, PE, PC, etc.; flexible stretchable substrates such as PU, stretch fabric, silicone, latex, etc.

[0156] Specifically, the material of the insulating layer in the embodiment of the present invention is not limited to curable solder resist ink, light curing glue, photosensitive resin, thermosetting resin, thermosetting solder resist ink, polytetrafluoroethylene, etc.

[0157] Specifically, the electronic paste applicable to the rapid circuit production system in the embodiment of the present invention is not limited to low-melting-point metals, mixed pastes of low-melting-point metals and high-melting-point metals, mixed pastes of low-melting-point metals and polymer materials, mixed pastes of high-melting-point metals and polymer materials, and mixed pastes of low-melting-point metals, high-melting-point metals and polymer materials; in some other embodiments, the low-melting-point metals and / or high-melting-point metals in the above-mentioned mixed pastes can also be replaced by non-metallic conductive materials.

[0158] In some embodiments, a first insulating layer may be formed on the surface of the substrate in advance; therefore, in some cases, the first coating unit in the above-mentioned rapid circuit production system may be omitted.

[0159] In some embodiments, the rapid circuit production system may also include: an electronic paste curing unit for curing the electronic paste in the groove; its implementation method is not limited to thermal baking, high-temperature sintering, laser sintering, LCD / DLP / SLA light curing technology, thermal radiation and other methods.

[0160] In some embodiments, the rapid circuit fabrication system may further include: a surface planarization unit for performing surface planarization treatment on the insulating layer and / or electronic paste; wherein the implementation method of the surface planarization unit is not limited to horizontal polishing, laser cutting, etc.

[0161] In some embodiments, the light patterning irradiation unit in the rapid circuit manufacturing system can also be used to perform patterned curing on the photosensitive film.

[0162] In some embodiments, the rapid circuit fabrication system may further include: a second cleaning unit for removing uncured photosensitive film.

[0163] In some embodiments, the rapid circuit production system may also include: a sealed shell, the interior of which is used to accommodate various unit components; further, the rapid circuit production system may also include: a negative pressure system, which is used to keep the interior of the sealed shell in a negative pressure or vacuum state during the process of filling the electronic paste into the groove.

[0164] In some embodiments, the rapid circuit production system may further include: a motion component, which is used to control the movement of each unit component; wherein the motion component is not limited to X, Y, Z axis moving components, rotating components, pipeline units, etc.

[0165] like Figure 7Preferably, the circuit rapid production system in the embodiment of the present invention includes: a shell 101, a base 102, an ink scraping assembly 103, an LCD light curing assembly 104, a polishing assembly 105, a first cleaning assembly 106, a heat drying assembly 107, and a motion assembly 108 for driving the polishing assembly 105, the first cleaning assembly 106, and the heat drying assembly 107 to move relative to the substrate. The base 102 is used to secure the substrate and is located on the bottom surface of the housing 101. The LCD light curing assembly 104 is used to form patterned light irradiation and is located on the side wall of the housing 101. A rotating shaft 109 is located on the side of the base 102 near the LCD light curing assembly 104, which allows the base 102 to drive the substrate to rotate along the rotating shaft, thereby aligning the substrate with the light irradiation direction of the LCD light curing assembly 104. The polishing assembly 105, the first cleaning assembly 106, and the drying assembly 107 are located above the base 102 and are driven by the motion assembly 108 to move in any direction along the X, Y, and Z axes to perform corresponding operations on the substrate on the base 102. The ink scraping assembly 103 includes a base plate 1031, an ink cup 1032 inverted on the base plate 1031, and a push-pull cylinder 1033 that drives the ink cup 1032 to move linearly. The bottom plate 1031 is flush with and connected to the base 102 in a horizontal state, and the ink cup 1032 contains electronic paste.

[0166] Among them, the LCD photocuring component contains a light source and an LCD screen that cooperates with the light source. The LCD screen realizes regional light transmittance and light blocking according to the graphic appearance of the target circuit, thereby realizing patterned selection of the light source, thereby achieving light irradiation of the target pattern.

[0167] During operation, the substrate coated with the first insulating layer is first fixed on the base 102, and then rotated upward 90 degrees by the rotating shaft 109 so that the substrate is perpendicular to the light irradiation direction of the LCD light curing component 104. After the target area of ​​the first insulating layer on the substrate is transformed into the second insulating layer, the substrate is restored to a horizontal state by the rotating shaft 109. Then, the first cleaning component 106 is driven by the moving component 108 to erase the uncured first insulating layer on the substrate, so that the substrate forms a second insulating layer with grooves consistent with the target circuit; then The push-pull cylinder 1033 is controlled to drive the ink cup 1032 to reciprocate toward the substrate, so that the electronic paste inside the ink cup 1032 is driven by the pressure of the edge of the ink cup 1033 to fill the groove, completing the filling of the target circuit. The motion component 108 drives the hot drying component 107 to move directly above the substrate, and the hot drying component is started to solidify the electronic paste. Then, the polishing component 105 is driven to achieve overall horizontal thinning of the substrate surface, thereby removing the electronic paste remaining on the surface of the second insulating layer and completing the production of the electronic circuit.

[0168] The above working method is only an example of a circuit rapid production system, and its working method can also be combined in other ways. For example, after the second insulating layer is cured, when the base 102 returns to a horizontal state, the insulating layer can be polished as a whole horizontally by the polishing component 105.

[0169] In other embodiments, when using this rapid circuit fabrication system to fabricate multi-layer circuit boards, after each layer is completed, the base can be lowered or the squeegee assembly can be raised to allow for the fabrication of higher layers. The corresponding height-driving mechanism can be implemented using conventional techniques in the art and will not be further described here.

[0170] Furthermore, the above-mentioned circuit rapid production system is a preferred embodiment of the present invention, and the unit components therein may be replaced by other alternative solutions, and the above-mentioned other functional unit components may be added according to actual needs.

[0171] The rapid circuit production system in the embodiment of the present invention has the advantages of small space occupation, simple structure and easy implementation, which can meet the needs of desktop-level electronic circuit production. By adopting light-patterned components to replace traditional mask plates, it saves the tedious mask making process, improves the production efficiency of electronic circuits, and can meet the user's personalized design needs.

Claims

1. A rapid circuit manufacturing process, characterized in that: include: Step S1, selecting a substrate; Step S2, forming a removable first insulating layer on the surface of the substrate, and transforming the first insulating layer into a non-removable second insulating layer having a groove consistent with the target circuit; wherein the first insulating layer is uncured solder resist ink, and the second insulating layer is cured solder resist ink; Step S3, filling the groove with electronic paste, and curing to obtain the target circuit; Repeat steps S2-S3 until a circuit with a target number of layers is obtained; wherein the number of repetitions is greater than or equal to 0; Step S2 includes: performing a light curing process on the area of ​​the first insulating layer opposite to the target circuit by LCD, DLP or SLA light curing technology to form a non-removable second insulating layer; removing the uncured first insulating layer to obtain the groove of the second insulating layer; Among them, step S3 includes: selecting a photosensitive film; using a scraper to push the electronic paste into the groove through the photosensitive film, and making the photosensitive film simultaneously cover the second insulating layer; using LCD, DLP or SLA light curing technology, the area on the photosensitive film consistent with the target circuit is illuminated and developed to remove the uncured photosensitive film; clearing the residual electronic paste on the second insulating layer that is not covered by the photosensitive film; curing the electronic paste in the groove in the second insulating layer; demolding the remaining photosensitive film to obtain the target circuit.

2. An electronic circuit, characterized in that The electronic circuit is realized by the circuit rapid manufacturing process as claimed in claim 1.

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