Handles for wafer carriers

Abstract

The present invention relates to a handle for a wafer carrier, the handle comprising: an insertable member configured to be inserted into an aperture of the wafer carrier; and a locking mechanism movable relative to the insertable member. When in an engaged state, a tab of the insertable member retains the insertable member in the aperture. When in a locked state, the locking mechanism maintains the tab in the engaged state, and a flexible member of the locking mechanism is positioned to maintain the locking mechanism in the locked state. A wafer carrier comprises the removable handle and the locking mechanism.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to and the benefit of U.S. Provisional Application No. 62 / 851,983, filed May 23, 2019, the entirety of which is incorporated herein by reference for all purposes. Technical Field

[0003] The present disclosure generally relates to a front-opening substrate container. More particularly, the present disclosure relates to a handle for a front-opening substrate container. Background Art

[0004] Semiconductor devices can be fabricated from wafer substrates. Wafer substrates, or simply wafers, undergo a series of manufacturing steps. For example, these manufacturing steps may include, but are not limited to, material layer deposition, doping, etching, or chemical or physical reactions of the substrate's materials. One or more wafers can be stored and transported in front-opening substrate containers before, during, or after manufacturing. During some manufacturing steps, wafers can be processed while still in the front-opening substrate container. Front-opening substrate containers protect the stored wafers from physical damage (e.g., impact) and contamination. Summary of the Invention

[0005] The present disclosure generally relates to a front-opening substrate container for storing or transporting wafers. More particularly, the present disclosure relates to a handle for a front-opening substrate container.

[0006] A handle for a wafer carrier is disclosed. The handle includes a body, an insertable member having a tab, and a locking mechanism having a flexible extension. The insertable member is configured to be inserted into an aperture of a wafer carrier. When in an engaged state, the insertable member is retained in the aperture. The locking mechanism is movable between a locked state and an unlocked state. When in the locked state, the locking mechanism maintains the tab in the engaged state, and the flexible extension is positioned to maintain the locking mechanism in the locked state.

[0007] In an embodiment, the tab is disposed on a first side of the insertable member.The insertable member includes a second side opposite the first side, and when in the locked state, the locking member extends along the second side.

[0008] In one embodiment, the handle includes a protrusion disposed at the first end of the body. The protrusion includes a first portion and a second portion extending in different directions. The protrusion is configured to engage a rail of the wafer carrier to help secure the handle to the wafer carrier.

[0009] A wafer carrier is disclosed. The wafer carrier includes an outer surface, a handle, and a locking mechanism. The wafer carrier further includes a protrusion extending from the outer surface. An aperture is defined by the protrusion and is between the outer surface and the extent of the protrusion. The handle is attached to the outer surface of the wafer carrier and includes a body. The body includes an insertable member that extends into the aperture of the wafer carrier to secure the handle to the outer surface. The insertable member includes a tab that, when in an engaged state, retains the insertable member in the aperture. The locking mechanism includes a flexible member and is movable relative to the insertable member between a locked state and an unlocked state. When in the locked state, the locking mechanism maintains the tab in the engaged state, and the flexible extension maintains the locking mechanism in the locked state.

[0010] In an embodiment, the locking mechanism moves from the unlocked state to the locked state in a direction parallel to a direction of insertion of the insertable component into the aperture.

[0011] In one embodiment, the wafer carrier includes a track extending along its outer surface, and the handle includes a protrusion disposed at a first end of the main body of the handle. The protrusion is configured to engage the track of the wafer carrier to help secure the handle. In one embodiment, the protrusion is moved to engage the track in the same direction as the insertable member is inserted into the aperture of the wafer carrier. In one embodiment, the engagement of the protrusion with the track inhibits movement of the handle away from or toward the first side of the wafer carrier.

[0012] In an embodiment, the wafer carrier is a front opening pod (FOUP). In an embodiment, the wafer carrier is a front opening ship pod (FOSB). BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present disclosure may be more fully understood from the following description of various illustrative embodiments considered in conjunction with the accompanying drawings.

[0014] Figure 1 is a right side perspective view of a wafer carrier according to an embodiment of the present disclosure.

[0015] Figure 2 yes Figure 1 1 is a left side perspective view of a wafer carrier without a front door as shown in FIG.

[0016] Figure 3 yes Figure 1 A front view of a wafer carrier without a front door is shown in FIG.

[0017] Figure 4 yes Figure 11 is a side view of a wafer carrier without a front door as shown in FIG.

[0018] Figure 5 yes Figure 1 A right side perspective view of a wafer carrier with the handle removed is shown in FIG.

[0019] Figure 6A is a side view of a removable handle for a wafer carrier according to an embodiment.

[0020] Figure 6B yes Figure 6A A front view of the detachable handle shown in FIG.

[0021] Figure 6C yes Figure 6A Rear view of the removable handle shown in .

[0022] Figure 7 is a perspective view of a locking mechanism for a removable handle of a wafer carrier according to an embodiment.

[0023] Figure 8A It is along line VIII-VIII Figure 3 A cross-sectional view of the wafer carrier shown in FIG.

[0024] Figure 8B yes Figure 8A An enlarged view of region B is shown in FIG.

[0025] Figure 8C yes Figure 8A An enlarged view of region C is shown in FIG.

[0026] Figure 9 It is along line IX-IX Figure 4 A cross-sectional view of a portion of a wafer carrier is shown.

[0027] Figure 10 is a perspective view of a portion of a wafer carrier according to an embodiment of the present disclosure.

[0028] Figure 11 yes Figure 10 1 is a front perspective view of the locking mechanism of the wafer carrier shown in FIG.

[0029] Figure 12 yes Figure 10 A side perspective view of the locking mechanism of the wafer carrier shown in FIG.

[0030] Figure 13 is a perspective view of a portion of a wafer carrier according to an embodiment of the present disclosure.

[0031] Figure 14 yes Figure 13 1 is a front perspective view of the locking mechanism of the wafer carrier shown in FIG.

[0032] Figure 15 yes Figure 13 1. Rear perspective view of the locking mechanism of the wafer carrier shown in FIG.

[0033] Figure 16 It is along line XVI-XVI Figure 13 A cross-sectional view of a portion of a wafer carrier is shown.

[0034] Figure 17 is a side view of a wafer including a handle and a locking mechanism according to an embodiment of the present disclosure.

[0035] Figure 18A yes Figure 17 A perspective view of the handle shown in FIG.

[0036] Figure 18B yes Figure 17 A front view of the handle shown in FIG.

[0037] Figure 18C yes Figure 17 A side view of the handle shown in FIG.

[0038] Figure 19 yes Figure 17 A perspective view of the locking mechanism interacting with the handle is shown in FIG.

[0039] Figure 20A yes Figure 17 An enlarged view of area D is shown in FIG.

[0040] Figure 20B yes Figure 17 An enlarged view of area E is shown in FIG.

[0041] Figure 21 It was taken along line 21A-21A Figure 17 A cross-sectional view of the wafer carrier shown in FIG.

[0042] Figure 22 is a perspective view of a wafer carrier with a handle in a detached state according to an embodiment.

[0043] Figure 23 yes Figure 22 1. A side view of the wafer carrier shown in FIG.

[0044] Figure 24A yes Figure 22 and 23 A perspective view of the handle shown in FIG.

[0045] Figure 24B yes Figure 22 and 23 A front view of the handle shown in FIG.

[0046] Figure 24C yes Figure 22 and 23 A side view of the handle shown in FIG.

[0047] Figure 25A yes Figure 23 An enlarged view of area F is shown in FIG.

[0048] Figure 25B yes Figure 23 An enlarged view of region G is shown in FIG.

[0049] Figure 26 According to the embodiment and provided at Figure 22 and 23 A partial cross-sectional view of a locking mechanism engaging a rail on a side wall of a wafer carrier is shown.

[0050] Figure 27 is a perspective view of a wafer carrier according to another embodiment.

[0051] Figure 28 yes Figure 27 Side view of a wafer carrier.

[0052] Figure 29 yes Figure 27 and 28 A perspective view of the handle shown in FIG.

[0053] Figure 30 is a close-up view of the handle attached to the side wall of the wafer carrier shown in 28.

[0054] While the present disclosure is susceptible to various modifications and alternative forms, details thereof have been shown by way of example in the drawings and will be described in detail. However, it should be understood that there is no intention to limit the aspects of the present disclosure to the specific illustrative embodiments described. On the contrary, it is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the present disclosure. DETAILED DESCRIPTION

[0055] As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. As used in this specification and the appended claims, the term "or" is generally employed in its sense including "and / or" unless the context clearly dictates otherwise.

[0056] The term "about" generally refers to a range of numbers that are considered equivalent to the recited value (eg, having the same function or result). In many instances, the term "about" may include numbers rounded to the nearest significant figure.

[0057] The use of numerical ranges using endpoints includes all numbers subsumed within that range (eg, 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5).

[0058] The following detailed description should be read with reference to the drawings, in which similar elements in different figures are numbered identically. The detailed description and the drawings (which are not necessarily to scale) depict illustrative embodiments and are not intended to limit the scope of the invention. The illustrative embodiments depicted are intended to be exemplary only. Selected features of any illustrative embodiment may be incorporated into additional embodiments unless otherwise expressly stated to the contrary.

[0059] Semiconductor devices are formed by fabricating wafer substrates. One or more wafer substrates, or simply wafers, may be stored within a wafer carrier during, before, or after fabrication. Front-opening substrate containers protect the wafers within the wafer carrier during storage or transport. For example, the wafer carrier protects the wafers from damage caused by impacts with other objects and each other. For example, the wafer carrier may be configured to minimize or prevent contaminated air from entering the wafer carrier when the front of the wafer carrier is closed. The wafer carrier is of a size and weight that allows a person (e.g., a technician, a handler, etc.) to carry it between locations.

[0060] The wafer carrier may be, for example, but not limited to, a front-opening pod (FOUP) or a front-opening ship pod (FOSB). Generally speaking, a FOUP is used to transport substrate wafers within a manufacturing facility, while a FOSB is used to transport substrate wafers over longer distances (e.g., between manufacturing facilities or from one manufacturing facility to another). For example, a FOUP may be configured to prevent contaminated air from entering the FOUP when the front of the FOUP is open. For example, a FOUP may also be configured to selectively allow gas to enter the FOUP, such as, but not limited to, process gas used for manufacturing or filtered gas used to generate positive air pressure within the FOUP.

[0061] Disclosed embodiments relate to a wafer carrier including a handle. The handle allows a person to safely carry the wafer carrier. Advantageously, the disclosed wafer carrier includes a handle having, among other features, a locking mechanism and a track that reduces the risk of accidental removal of the handle and reduces the amount of flexing / deformation of the wafer carrier while being carried, thereby improving the safety of the wafer carrier's contents.

[0062] A locking mechanism prevents the handle from being accidentally removed from the wafer carrier. Advantageously, the handle can be installed with a relatively low force applied to the wafer carrier compared to existing configurations that can, for example, cause damage to the wafer carrier. The handle of the present disclosure allows for a structure with increased strength relative to integrally formed handles and allows the handle to be separated for cleaning, which increases wafer carrier cleanability.

[0063] Figures 1 to 4A wafer carrier according to an embodiment is shown. Figures 1 to 4 The wafer carrier shown in FIG. 1 is an embodiment of a wafer carrier 1 . Figure 1 is a right side perspective view of the wafer carrier 1 . Figure 2 is a left side perspective view of the wafer carrier 1 . Figure 3 1 is a front view of the wafer carrier 1. Figure 4 is a side view of a wafer carrier 1. According to various embodiments, the wafer carrier 1 may be a FOUP. In other embodiments, the wafer carrier 1 may be a FOSB.

[0064] The wafer carrier 1 includes a first handle 100A, a second handle 100B ( Figure 2 ), the first locking mechanism 150A for the first handle 100A ( Figure 4 ) and the second locking mechanism 150B for the second handle 100B ( Figure 2 ).

[0065] Each handle 100A, 100B is preferably configured to be non-destructively removable. Handles 100A, 100B have the same structure and are configured to be attached or removed in the same manner, except that they are mirror images of each other. Features of the first handle 100A and the first locking mechanism 150A are described and labeled in the figures with the suffix "A", while features of the second handle 100B and the second locking mechanism 150B are described and labeled in the figures with the suffix "B". Unless expressly described or shown otherwise, it should be understood that the handle 100B and the locking mechanism 150B include corresponding "B" features for each "A" feature described or shown for the handle 100A and the locking mechanism 150A, respectively.

[0066] The wafer carrier 1 includes a front door 7 and top 10, right side 12 ( Figure 1 and 4 )、Left 14( Figure 2 ), rear portion 16 and bottom portion 18. The front door 7 and sides 10, 12, 14, 16, 18 form an enclosed interior space 6 ( Figure 3 The wafer carrier 1 has a front opening 9 at the front 8 of the wafer carrier 1 ( Figure 2 ). The front door 7 covers the front opening 9 ( Figure 1 ) and the wafer carrier 1 can be entered by moving (eg, opening, removing) the front door 7. Figure 2 and 3 The wafer carrier 1 is illustrated with the front door 7 removed (eg, open).

[0067] The sides 10, 12, 14, 16, 18 and the front door 7 define the outer surface 22 of the wafer carrier 1. In an embodiment, the sides 10, 12, 14, 16, 18 are a single, unitary structure. For example, the sides 10, 12, 14, 16, 18 can be molded as a single, continuous piece of material or molded from multiple pieces that are permanently joined together. In an embodiment, the wafer carrier 1 is made of a generally non-reactive and leak-resistant (e.g., having low permeability) material, such as, but not limited to, high-purity polycarbonate.

[0068] like Figure 3 As shown in FIG, wafer tines 20 are disposed within the wafer carrier 1 for storing a plurality of wafers (not shown) in the interior space 6. Wafers are inserted into the spaces of the wafer tines 20 and stacked in a vertical direction relative to the page within the wafer carrier 1. In embodiments, the wafer carrier 1 may include different known structures for holding wafers within the interior space 6 of the wafer carrier 1 in addition to the wafer tines 20 shown. A front door 7 covers the front opening 9 of the wafer carrier 1 to enclose the interior space 6. The wafers are protected within the interior space 6 by the wafer carrier 1. The front door 7 is configured to form a seal with the sides 10, 12, 14, and 18 to prevent air from leaking into the interior space 6 of the wafer carrier 1 and contaminating the stored wafers.

[0069] The top portion 10 includes an automation interface 26, and the bottom portion 18 includes a base 24. The automation interface 26 may also be referred to as a top handling flange. In an embodiment, the automation interface 26 allows a standard automation accessory (not shown), such as, but not limited to, a robotic arm, to be connected to the wafer carrier 1 for moving the wafer carrier 1. For example, a robotic arm can be used to move the wafer carrier 1 between different manufacturing equipment. The handles 100A, 100B are configured so as not to extend into the volume around the wafer carrier 1 typically reserved for automation accessories. In an embodiment, the base 24 can be used to connect the wafer carrier 1 to different manufacturing equipment.

[0070] In an embodiment, the wafer carrier 1 may include one or more ports 28. For example, the ports 28 may be inlets for providing gas to the wafer carrier 1 (e.g., open when the ports 28 are fluidically connected to a fluid source), or outlets (e.g., purge ports) for allowing gas to flow out of the wafer carrier 1. For example, the ports 28 may be inlets for generating a positive pressure within the wafer carrier 1 when the front door 7 is open, or for circulating one or more process gases through the wafer carrier 1 during a manufacturing step. For example, the base 24 is connected to (e.g., positioned on, attached to, etc.) appropriate manufacturing equipment (not shown) at different manufacturing steps, and gas is injected into the wafer carrier 1 via the ports 28 and circulated through the wafer carrier 1.

[0071] The first handle 100A is attached to one side 12 ( Figure 1), and the second handle 100B is attached to a different side 14 ( Figure 2 The handles 100A, 100B allow a person to carry the wafer carrier 1 between locations by hand.

[0072] The wafer carrier 1 is configured to prevent accidental removal of the handles 100A, 100B. Each of the handles 100A, 100B includes a locking mechanism 150A, 150B ( Figure 2 and 4 For example, accidental detachment of the handles 100A, 100B from the wafer carrier 1 while being carried may cause the wafer carrier 1 to fall and damage the wafers stored in the wafer carrier 1 .

[0073] Figure 5 is a right side perspective view of the wafer carrier 1 with the handle 100A removed. When attached ( Figure 1 ), the handle 100A extends along the side 12 of the wafer carrier 1.

[0074] like Figure 5 As shown in FIG, the wafer carrier 1 includes protrusions 30A, 40A and rails 50A, 60A disposed along the side 12. The protrusions 30A, 40A each extend from the outer surface 22 of the wafer carrier 1. The handle 100A is fixed to the wafer carrier 1 via the protrusions 30A, 40A and the rails 50A, 60A. Figure 2 As shown in FIG. 1 , protrusions 30B, 40B and rails 50B, 60B are provided along opposite sides 14 of the wafer carrier 1 for securing the second handle 100B to the wafer carrier 1 .

[0075] Apertures 32A, 42A are formed by protrusions 30A, 40A. Aperture 32A is defined by protrusion 30A and is positioned between the outer surface 22 of wafer carrier 1 and extent 34A of protrusion 30A. Aperture 42A is defined by protrusion 40A and is positioned between the outer surface 22 of wafer carrier 1 and extent 44A of protrusion 40A. Each aperture 32A, 42A extends along side 12 of wafer carrier 1 from front 8 to rear 16 of wafer carrier 1.

[0076] Figures 6A to 6C is a view of a handle 100A according to an embodiment. Figure 6A It is a side view of the handle 100A. Figure 6B is a front view of the handle 100A. For example, Figure 4 and Figure 6B is a similar view of handle 100A. Figure 6C It is a rear view of the handle 100A.

[0077] The handle 100A includes a body 110A having a first end 112A and a second end 114A. The grip 120A is disposed between the first end 112A and the second end 114A of the body 110A. Figure 6A As shown in FIG. 1 , the grip 120A has a first end 122A that is closer to the first end 112A of the body 110A and a second end 124A that is closer to the second end 114A of the body 110A.

[0078] When the handle 100A is attached to the outer surface 22 of the wafer carrier 1, the handle 100A is configured to allow a person to grasp the grip 120A of the handle 100A to carry the wafer carrier 1. The grip 120A is configured to be easily grasped and handled when the handle 100A is attached to the side 12. For example, Figure 1 and 3 As shown in FIG, the handle 120A is spaced apart from the side 12 and extends in a direction that allows enough space for a person to grasp and hold the handle 120A. Figures 6A to 6C As shown in FIG, the grip 120A defines a portion of the body 110A of the handle 100A.

[0079] In an embodiment, the grip 120A may include a color indicator 126A ( Figure 6B For example, a colored indicator can be used to indicate the contents of the wafer carrier 1 (e.g., the specific type of wafers contained in the wafer carrier 1, the current manufacturing stage of the wafers in the wafer carrier 1, or the like). In an embodiment, the colored indicator 126A can be integral with the body 110A of the handle 100A to avoid the formation of difficult-to-clean surfaces (e.g., cracks, grooves, etc.) because the detachability of the handles 100A, 100B allows the handles 100A, 100B to be replaced when a different colored indicator for the wafer carrier 1 is desired. For example, the colored indicator 126A in this embodiment can be provided by coloring the body 110A itself or by a colored material integrally formed in the body 110A.

[0080] The handle 100A further includes a first insertable component 130A and a second insertable component 140A. Figure 6A , the first insertable member 130A is positioned between the first end 112A and the handle 120A. In embodiments, the first insertable member 130A may be disposed at the end 122A of the handle 120A, at the first end 112A, or between the first end 112A and the handle 120A. The insertable member 130A includes a tab 132A, a front side 134A, and a back side 136A opposite the front side 134A. The tab 132A is on and extends away from the front side 134A of the insertable member 130A. The insertable member 130A has an end 138A ( Figure 6B and 8CIn an embodiment, the tab 132A is positioned on the front side 134A of the insertable component 130A closer to the end 138A than to the body 110A. For example, the tab 132A is positioned on the front side 134A and extends along the end 138A.

[0081] like Figure 6A As shown in FIG, second insertable member 140A is disposed between grip 120A and second end 114A. In embodiments, second insertable member 140A may be disposed at end 124A of grip 120A, at second end 114A, or between second end 114A and grip 120A. Similar to first insertable member 130A, second insertable member 140A also includes tab 142A, front side 144A, and back side 146A. In embodiments, one or both of first insertable member 130A and second insertable member 140A may be integral with body 110A (e.g., formed as a single, continuous piece of material). For example, handle 100A, when molded (e.g., injection molded), includes at least body 110A and insertable member 130A formed as a single piece. In this embodiment, the insertable member 130A is formed to have a desired amount of flexibility relative to the main body 110A to allow for attachment and detachment of the handle 100A, as described below.

[0082] In an embodiment, the insertable components 130A, 140A are positioned along a different portion of the body 110A than the grip 120A (i.e., not along the grip 120A). This provides space for gripping the grip 120A and can help prevent a person from accidentally contacting one of the insertable components 130A, 140A while handling the grip 120A. For example, such accidental contact could ultimately damage or loosen the insertable components 130A, 140A.

[0083] The handle 100A further includes a first protrusion 170A and a second protrusion 180A. The first protrusion 170A is positioned at the first end 112A of the body 110A. Figure 4 As shown in FIG, the first protrusion 170A is configured to be flush with or below the outer surface 22 of the top 10 of the wafer carrier 1 when the wafer carrier 1 is viewed from the side. For example, the first protrusion 170A is configured not to extend above the outer surface 22 of the top 10 of the wafer carrier 1. This prevents the protrusion 170A from interfering with the space for standard automated attachment operations when being attached to the automation interface 26 or when already attached to the automation interface 26. The second protrusion 180A is positioned at the second end 114A of the body 110A. The first protrusion 170A is configured to engage the first rail 50A of the wafer carrier 1. The second protrusion 180A is configured to engage the second rail 60A of the wafer carrier 1.

[0084] Figure 1The handle 100A is shown attached to the outer surface 22 of the wafer carrier 1, and Figure 5 The handle 100A is shown disassembled. Figure 1 and 5 By making the handle 100A (such as Figure 5 , 180A) is moved in a first direction D1 relative to the wafer carrier 1 to attach the handle 100A. In an embodiment, the first direction D1 extends from the rear 16 to the front 8 of the FOUP. For example, the first direction D1 may be substantially parallel to the side 12 of the wafer carrier 1. When the handle 100A is moved in the first direction D1 relative to the wafer carrier 1, each of the insertable members 130A, 140A is inserted into its corresponding aperture 32A, 42A, and each protrusion 170A, 180A engages with a corresponding one of the rails 50A, 60A. The inserted insertable members 130A, 140A and the engaged protrusions 170A, 180A secure the handle 100A to the wafer carrier 1. The attached handle 100A (as shown in Figure 4 The disassembly of the attached handle 100A is described in more detail below.

[0085] The insertable member 130A is configured to flex relative to the main body 110A (ie, bend relative to the main body 110A). More specifically, the insertable member 130A is configured to extend in a direction perpendicular to the direction D1 in which it extends from the main body 110A (eg, Figure 6B flex in a direction into or out of the page). In an embodiment, this flexible configuration allows for (repeated) flexing of the insertable member 130A toward and away from the outer surface 22 of the wafer carrier 1. In an embodiment, when the insertable member 130A is inserted into the aperture 32A, the tab 132A contacts the protrusion 30A and the insertable member 130A is forced to flex toward the outer surface 22 of the wafer carrier 1 so that the insertable member 130A fits into the aperture 32A. For example, the flexing of the insertable member 130A allows the insertable member 130A to be inserted into the aperture 32A. Thus, when the insertable member 130A is moved into and into the aperture 32A, the tab 132A contacts the protrusion 30A, which applies pressure to the insertable member 130A and causes the insertable member 130A to flex toward the outer surface 22 of the wafer carrier 1.

[0086] Once the tab 132A travels through the aperture 32A, the tab 132A flexes further away from the outer surface 22 of the wafer carrier 1. More specifically, the tension of the flexed insertable component 130A causes the tab 132A to flex further away from the outer surface 22 of the wafer carrier 1. The flexure of the tab 132A places the tab 132A in an engaged state. The tab 132A in its engaged state holds the insertable component 130A in the aperture 32A. More specifically, the tab 132A in its engaged state prevents the insertable component 130A from being removed from the aperture 32A. When the handle 100A is moved (e.g., pulled) in a direction D2 opposite to the insertion direction D1, the tab 132A engages the front outer surface 36A ( Figure 4 ) to prevent the removal of the insertable component 130A. For example, the tab 132A is hooked on the front outer surface 36A of the protrusion 30A. Figure 4 , the front exterior surface 36A faces away from the main body 110A of the handle 100A (eg, in direction D1 ).

[0087] In an embodiment, tabs 132A also have an unengaged state. When in the unengaged state, tabs 132A are configured to allow the insertable component 130A to be removed from aperture 32A. For example, tabs 132A in the unengaged state allow the insertable component 130A to be moved relative to protrusion 30A in a direction D2 opposite to the insertion direction D1. In an embodiment, wafer carrier 1 is configured to allow removal of handle 100A when all tabs 132A, 142A of the insertable components 130A, 140A of handle 100A are in the unengaged state.

[0088] Movement of the handle 100A to insert the insertable member 130A into the aperture 32A (e.g., movement in the first direction D1) also moves the first protrusion 170A relative to the first rail 50A and the second protrusion 180A relative to the second rail 60A. More specifically, such movement of the handle 100A causes the first protrusion 170A to engage the first rail 50A and the second protrusion 180A to engage the second rail 60A. The engagement of each protrusion 170A, 180A with its corresponding rail 50A, 60A is configured to prevent the handle 100A from moving away from the wafer carrier 1 (e.g., Figure 3 For example, the engagement of the protrusions 170A, 180A with their rails 50A, 60A can mitigate forces pulling the handle 100A away from the side 12 of the wafer carrier 1 and can mitigate outward deflection of the side 12 by distributing the pulling forces to the corners of the wafer carrier 1.

[0089] Insertable member 140A and tab 142A are inserted into corresponding protrusion 40A and aperture 42A of wafer carrier 1 in a manner similar to insertable member 130A and tab 132A. In one embodiment, handle 100A can be configured such that a single movement of handle 100A in first direction D1 inserts insertable members 130A, 140A and engages protrusions 170A, 180A. In one embodiment, handle 100A can be configured such that a single movement of handle 100A in first direction D1 inserts insertable members 130A, 140A, moves tabs 132A, 142A into an engaged state, and engages protrusions 170A, 180A.

[0090] Figure 7 is a perspective view of a locking mechanism 150A according to an embodiment. The locking mechanism 150A is configured to prevent unintended removal of the handle 100A from the wafer carrier 1. For example, when in a locked state, the locking mechanism 150A is configured to ensure that accidental contact with the insertable components 130A, 140A or forces on the handle 100A (e.g., the weight of a complete wafer carrier 1, a push from the wafer carrier 1, etc.) cannot force the tab 132A out of its engaged state.

[0091] Locking mechanism 150A includes a front end 152A, a rear end 154A, a contact surface 156A, and a flexible extension 160A. Locking mechanism 150A also has a length L extending from front end 152A to rear end 154A. Contact surface 156A is positioned between front end 152A and flexible extension 160A of locking mechanism 150A. In one embodiment, the maximum thickness T1 of locking mechanism 150A between front end 152A and flexible extension 160A is at contact surface 156A. The thickness T1 of locking mechanism 150A is perpendicular to its length L.

[0092] like Figure 4 As shown in FIG. 1 , the locking mechanism 150A is held in a guide 116A of the main body 110A of the handle 100A. The locking mechanism 150A is held in the guide 116A to be slidably attached to the main body 110A. For example, the guide 116A allows the locking mechanism 150A to move along a first direction D1 while preventing the locking mechanism 150A from moving in a direction perpendicular to the first direction D1 (e.g., Figure 3 In the embodiment, the locking mechanism 150A includes an upper limiting member 164A and a lower limiting member 166A ( Figure 7 The locking mechanism 150A is slidably attached to the main body 110A of the handle 100A via the guide 116A and two restraints 164A, 166A. The upper restraint 164A is positioned above the guide 116A (e.g., at Figure 4 In the direction away from the page, in Figure 4, the guide 116A is closer to the outer surface 22 than the upper limiter 164A), and the lower limiter 166A is positioned below the guide 116A (e.g., at Figure 4 16A is closer to the outer surface 22 than the guide 116A). A height 162A is defined between the lower surface of the upper limit 164A and the upper surface of the lower limit 166A. For example, when the handle 100A is viewed from the side (e.g., Figure 6A ), the guide member 116A is positioned between the upper restraint member 164A and the lower restraint member 166A. In an embodiment, one upper restraint member 164A and one lower restraint member 166A can be provided along each side of the locking mechanism 150A.

[0093] In an embodiment, one of the restraints 166A is bendable (e.g., bendable in the direction of width W) to allow the locking mechanism 150A to be formed separately from the handle 100A and then snapped into the guide 116A. The restraints 164A, 166A are configured to prevent removal of the locking mechanism 150A after it has been snapped into the guide 116A. In another embodiment, the handle 100A may be formed (e.g., molded, etc.) with the locking mechanism 150A integral with the body 110A and in the guide 116A, and the portion connecting the locking mechanism 150A to the body 110A may be broken so that the locking mechanism 150A becomes slidably attached to the body 110A.

[0094] The body 110A of the handle 100A includes a through hole 118A and a holding space 119A. In an embodiment, the holding space 119A is provided at the rear portion 102A (102A) of the body 110A facing the outer surface 22 of the side 12 of the wafer carrier 1 when the handle 100A is attached. Figure 6A ). For example, when the handle 100A is attached to the side 12 of the wafer carrier 1, the retaining space 119A is positioned between the body 110A and the outer surface 22 of the side 12 of the wafer carrier 1. The through hole 118A is connected to the retaining space 119A. The through hole 118A is adjacent to the insertable component 130A between the ends 112A and 114A of the body 110A of the handle 100A. The retaining space 119A is positioned between the through hole 118A and the insertable component 130A. The locking mechanism 150A is configured to extend through the through hole 118A into the retaining space 119A.

[0095] like Figure 6A and 6C , the holding space 119A is open along the rear portion 102A of the handle 100A. However, in an embodiment, the holding space 119A is enclosed along the rear portion 102A of the handle 100A. For example, in this embodiment, the through-hole can extend through the body 110A, and the holding space 119A can be a larger volume within the through-hole.

[0096] Figure 8A It is along Figure 3 Cross-sectional view of the wafer carrier 1 along line VIII-VIII in FIG. Figure 8B yes Figure 8A Magnified view of area B in FIG. Figure 8C yes Figure 8A For clarity and easier comparison, as shown in Figure 8B The area B shown in FIG. Figure 8A Reverse and rotate, and as Figure 8C The area C shown in FIG is relative to Figure 8A Rotate.

[0097] The locking mechanism 150A has a locked state and an unlocked state. Each of the handles 100A and 100B includes a locking mechanism 150A and 150B ( Figure 1 and 2 The locking mechanism 150A of the first handle 100A is Figure 8A and 8C The locking mechanism 150B of the second handle 100B is shown in the locked state. Figure 8A and 8B is shown as unlocked. Figure 8B The locking mechanism 150B in the embodiment moves from its unlocked state to its locked state (which is caused by Figure 8C 150A in FIG. 1 ). The locking mechanism 150A is shown in FIG. 150B . The locking mechanism 150A is shown in FIG. 150B . The locking mechanism 150A is shown in FIG. 150A ... Figure 8C The locking mechanism 150A in the embodiment moves from its locked state to its unlocked state (which is determined by Figure 8B 150A is shown in FIG.

[0098] The locking mechanism 150A is configured to be movable relative to the insertable member 130 A. For example, the locking mechanism 150A is selectively movable because the flexible extension 160A inhibits movement of the locking mechanism 150A in the locked state until acted upon by an external force, as discussed in further detail below.

[0099] exist Figure 8B119B, the locking mechanism 150B is in an unlocked state. The locking mechanism 150B in the unlocked state allows the tab 132B to move from its engaged state. For example, the locking mechanism 150B allows the insertable component 130B to flex by an amount that allows the tab 132B to move from its engaged state. When in the unlocked state, the contact surface 156B of the locking mechanism 150B may still contact the back surface 136B of the insertable component 130B. In another embodiment, when in the unlocked state, the contact surface 156B may not contact the insertable component 130B. The locking mechanism 150B in its unlocked state allows the insertable component 130B to flex away from the protrusion 30B, which disengages the tab 132B from the protrusion 30B. In an embodiment, the locking mechanism 150B is in the locked state when the flexible member 160B is positioned outside the retaining space 119B. The locking mechanism 150B moves in the direction D1 and moves to the locked state when the flexible member 160B is positioned in the holding space 119B.

[0100] exist Figure 8C , tab 132A is in an engaged state and locking mechanism 150A is in a locked state. For example, Figure 8C The tab 132A in the handle 100A is positioned so as to contact the front outer surface 36A of the protrusion 30A when the handle 100A is moved in direction D2 (e.g., pulled), which prevents the insertable component 130A from being removed from the aperture 32A. The locking mechanism 150A in the locked state is configured to maintain the tab 132A in the engaged state. The tab 132A extends from the insertable component 130A in a first direction D3 and moves out of the engaged state by moving in the opposite direction D4. In the locked state, the position of the locking mechanism 150A prevents the tab 132A from moving from the engaged state. In the locked state, the position of the contact surface 156A of the locking mechanism 150A limits the movement of the tab 132A in the opposite direction D4 by limiting the deflection of the insertable component 130A. For example, in the locked state, the position of the contact surface 156A of the locking mechanism 150A prevents the tab 132A from being removed from the engaged state. In an embodiment, when locking mechanism 150A is in the locked state, contact surface 156A of locking mechanism 150A contacts insertable component 130A. This contact by locking mechanism 150A prevents deflection of insertable component 130A. In an embodiment, locking mechanism 150A can maintain tab 132A in an engaged state without contacting insertable component 130A. For example, a minimum amount of deflection of insertable component 130A may be required to move tab 132A from the engaged state. In the locked state, contact surface 156A of locking mechanism 150A prevents insertable component 130A from reaching the minimum amount of deflection.

[0101] The locking mechanism 150A extends into the aperture 32A and along the back side 136A of the tab 132A. The insertable component 130A is disposed between the contact surface 156A of the locking mechanism 150A and the inner surface 38A of the protrusion 30A. The thickness T1 of the locking mechanism 150A maintains the tab 132A in engagement by limiting flexure of the insertable component 130A. Figure 8C 1. In FIG. 1, a thickness T1 of the locking mechanism 150A prevents the insertable member 130A from flexing and moving the tab 132A. The thickness T1 extends perpendicular to a direction D1 in which the insertable member 130A extends from the body 110A of the handle 100A into the aperture 32A.

[0102] Flexible extension 160A is configured to bend (e.g., bend relative to the rest of locking mechanism 150A) in response to an external force F1. For example, external force F1 may be applied by a person attempting to move locking mechanism 150A. Retention space 119A prevents accidental contact from applying external force F1 to flexible extension 160A. The positioning of flexible extension 160A prevents locking mechanism 150A from moving in direction D2, which is opposite to first direction D1.

[0103] The locking mechanism 150A is selectively movable because the flexible extension 160A is configured to restrict movement from the locked state unless deflected by an external force F1. The locking mechanism 150A moves from the unlocked state to the locked state by moving in a direction D1. Movement of the locking mechanism 150A in the first direction D1 causes the flexible extension 160A to move through the through-hole 118A and into the retaining space 119A. In one embodiment, the locking mechanism 150A enters the locked state when the flexible extension 160A is positioned in the retaining space 119A.

[0104] The size of holding space 119A relative to through-hole 118A allows flexible extension 160A to be at least partially unflexed. The normal geometry of flexible extension 160A within holding space 119A (i.e., when not acted upon by external force F1) is not aligned with (e.g., matches, fits within) through-hole 118A in direction D2. This misalignment prevents flexible extension 160A from fitting into through-hole 118A and prevents movement of locking mechanism 150A in direction D2 (which would otherwise move locking mechanism 150A from the locked position). Therefore, the position of flexible extension 160A within holding space 119A maintains locking mechanism 150A in the locked state. External force F1 flexes flexible extension 160A and causes it to align with through-hole 118A in direction D2, which allows flexible extension 160A to fit into through-hole 118A. Thus, by applying an external force F1 to the flexible extension 160A and moving the locking mechanism 150A in a direction D2 (which moves the flexible extension 160A from the retaining space 119A into the through-hole 118A), the locking mechanism 150A moves from the locked state to the unlocked state. In an embodiment, the locking mechanism 150A enters the unlocked state when the flexible extension 160A is positioned outside the retaining space 119A. In an embodiment, the locking mechanism 150A enters the unlocked state when the flexible extension 160A is positioned outside both the through-hole 118A and the retaining space 119A.

[0105] In an embodiment, the misalignment between the flexible extension 160A and the through hole 118A in the second direction D2 is due to the width W of the locking mechanism 150A. Figure 7 As shown in FIG, locking mechanism 150A has a width W defined by flexible extension 160A. In an embodiment, flexible extension 160A is configured to be flexed by an external force F1, causing width W of locking mechanism 150A to change (e.g., decrease). For example, when external force F1 flexes flexible extension 160A, locking mechanism 150A has a width W1. In an embodiment, external force F1 can compress flexible extension 160A to reduce width W of locking mechanism 150A. Flexible extension 160A is configured to be compressed without permanent deformation.

[0106] like Figure 6B As shown in FIG. 1 , the through hole 118A has a width W2 and the holding space 119A has a width W3. The width W3 of the holding space 119A is greater than the width W2 of the through hole 118A. Figure 8B 150B shown in FIG) moves to a locked position (as shown by Figure 8CWhen locking mechanism 150A is engaged (as shown in FIG. 1 ), flexible extension 160A moves from through-hole 118A into retaining space 119A. The larger width W3 of retaining space 119A (relative to width W2 of through-hole 118A) allows flexible extension 160A to remain at least partially inflexible within retaining space 119A. This inflexibility of flexible extension 160A results in a width W of locking mechanism 150A (e.g., along flexible extension 160A) greater than width W2 of through-hole 118A. Consequently, the normal width W of locking mechanism 150A in the locked state (i.e., when not acted upon by external force F1) is greater than width W2 of through-hole 118A. When external force F1 deflects flexible extension 160A, width W1 of locking mechanism 150A becomes equal to or less than width W2 of through-hole 118A. Thus, the locking mechanism 150A moves from the unlocked state to the locked state by flexing the flexible extension 160A to reduce the width W of the locking mechanism 150A and then moving the locking mechanism 150A in the second direction D2.

[0107] Thus, when positioned in retaining space 119A, the geometry of flexible extension 160A maintains locking mechanism 150A in a locked state. For example, when locking mechanism 150A moves from an unlocked state to a locked state by moving in a first direction D1, the geometry of flexible extension 160A in retaining space 119A then prevents locking mechanism 150A from moving in the opposite direction D2. In an embodiment, the geometry of flexible extension 160A that maintains locking mechanism 150A in the locked state is the width W of locking mechanism 150A, as described above.

[0108] Flexible extension 160A can be flexed to move locking mechanism 150A from the unlocked state to the locked state. In an embodiment, one or both of through-hole 118A and flexible extension 160A can be configured so that the force that moves locking mechanism 150A in first direction D1 also flexes flexible extension 160A to fit through through-hole 118A. For example, when in the unlocked state, one or more of the surfaces of through-hole 118A and flexible extension 160A that face each other when locking mechanism 150A is in the unlocked position can be inclined.

[0109] The upper surface 158A of the locking mechanism 150A is generally flat relative to the insertable component 130A. However, in an embodiment, the locking mechanism 150A may have a concave upper surface 158A and a length L that positions the contact surface 156A outside the aperture 32A when the flexible extension 160A is positioned in the retaining space 119A. The convex shape of the upper surface 158A allows sufficient flexing of the insertable component 130A to move the tab 132A from its engaged state to its unengaged state. In this embodiment, the locking mechanism 150A can be moved from its locked state to its unlocked state by moving in a direction D2 opposite to the first direction D1. When the flexible extension 160A is positioned in the retaining space 119A, the locking mechanism 150A is in the unlocked state, and when the flexible extension 160A is positioned outside the retaining space 119A, it is in the locked state. In this embodiment, the flexible extension 160A can be configured to inhibit movement of the locking mechanism 150A in direction D1 when in the locked state, as similarly discussed above, except with respect to movement in direction D2. For example, in this embodiment, the flexible extension 160A is prevented from being inserted into the through-hole 118A in the same manner as discussed above, except with respect to direction D1 rather than direction D2.

[0110] like Figure 4 and 8C , when the handle 100A is pulled in the disassembly direction D2, the tab 132A in the engaged state is configured to contact the front outer surface 36A of the protrusion 30A to prevent the insertable component 130A from being removed from the aperture 32A. However, in an embodiment, a recess (not shown) may be provided within the aperture 32A, and the tab 132A may be configured to prevent the removal of the insertable component 130A by engaging with the recess. For example, the recess may be provided in the inner surface 38A of the protrusion 30A or in the outer surface 22 of the wafer carrier 1. In this embodiment, the insertable component 130A may only partially extend through the aperture 32A. In this embodiment, when in its locked state, a portion of the locking mechanism 150A may be disposed between the protrusion 30A and the insertable component 130A. In an embodiment, the tab 132A may be provided at a different location away from the outer surface 22 of the wafer carrier 1 (e.g., different from Figure 8C For example, in embodiments, the tab 132A may extend from the insertable member 130A toward the outer surface 22 of the wafer carrier 1 (e.g., in direction D4, etc.), or in a direction perpendicular to the direction away from the outer surface 22 of the wafer carrier 1 (e.g., in direction D5, etc.). Figure 9 Extending in the direction D5, etc.

[0111] As discussed above, the insertable component 130A is configured to automatically flex the tab 132A into an engaged state when inserted through the aperture 32A. However, in embodiments, the insertable component 130A may not be configured to flex the tab 132A into an engaged state. In embodiments, the locking mechanism 150A may flex the insertable component 130A to flex the tab 132A into an engaged position. For example, the tab 132A may be on the front surface 134A of the insertable component 130A, and the insertable component may need to flex in the second direction D2 to flex the tab 132A into the engaged state. When moving to the locked state, the locking mechanism 150A may be configured to push the insertable component 130A in the second direction D2 to flex the tab 132A into the engaged state.

[0112] Figure 9 It is along Figure 4 1 is a cross-sectional view of a portion of the wafer carrier 1 taken along line IX-IX in FIG. The first protrusion 170A of the handle 100A engages with the first rail 50A of the wafer carrier 1. More specifically, the first protrusion 170A is configured to interlock with the first rail 50A.

[0113] The protrusion 170A includes a first portion 172A and a second portion 174A directly connected to the first portion 172A. The first portion 172A extends away from the body 110A of the handle 100A in a first direction D4, and the second portion 174A extends away from the first portion 172A in a different direction D5. The direction D4 of the first portion 172A is non-planar with the first end 112A of the body 110A. In one embodiment, the first rail 50A extends away from the outer surface 22 of the side 12 of the wafer carrier 1. The first rail 50A includes an inner surface 52A and a groove 54A. The groove 54A is defined by the inner surface 52A. The protrusion 170A extends into the groove 54A of the rail 50A. The contact between the inner surface 52A and the rail 50A and the second portion 174A of the protrusion 170A is configured to prevent the attached handle 100A from moving away from the outer surface 22 of the wafer carrier 1 (e.g., movement in direction D3). The second track 60A and second protrusion 180A have a similar structure and engagement as described for the first track 50A and first protrusion 170A, except rotated because the protrusion 180A is disposed along the second end 114A of the handle 100A.

[0114] like Figure 3As shown in FIG, wafer tines 20 are attached to sides 12, 14 of wafer carrier 1. A force pulling on handle 100A (e.g., in direction D3) can cause sides 12 to deflect outward, which can affect the profile of wafer tines 20 and damage wafers in wafer tines 20. For example, rails 50A, 60A and protrusions 170A, 180A provide more rigid contact points (e.g., at or near the corners) for attaching handle 100A to outer surface 22 of wafer carrier 1. More rigid contact points can help mitigate outward deflection of sides 12 by distributing pulling forces from handle 100A to the corners of wafer carrier 1.

[0115] The groove 54A defined by the first rail 50A is Figure 9 The middle portion of the first rail 50A faces upward (i.e., in direction D5). However, in embodiments, the orientation of the first rail 50A and the second portion 174A can be reversed. For example, in this embodiment, the groove 54A can face downward (i.e., opposite to direction D5). In embodiments, the second rail 60A and the second protrusion 180A can also be modified in this manner.

[0116] The handle 100A of the wafer carrier 1 has two insertable components 130A, 140A, two protrusions 170A, 180A, and one locking mechanism 150A. However, in embodiments, the handle 100A may have a different number of insertable components 130A, 140A, protrusions 170A, 180A, and locking mechanisms 150A. In embodiments, the handle 100A may include one or more insertable components 130A, 140A. In embodiments, the handle 100A may include one or more protrusions 170A, 180A. In this embodiment, the wafer carrier 1 may include a corresponding number of protrusions 30A, 40A and rails 50A, 60A. In embodiments, the wafer carrier 1 may include multiple locking mechanisms 150A for the handle 100A. For example, in embodiments, the wafer carrier 1 may provide a corresponding locking mechanism for each of the insertable components 130A, 140A of the handle 100A.

[0117] exist Figures 1 to 9 The handles 100A, 100B and locking mechanisms 150A, 150B shown in and described above are for a wafer carrier 1. However, it should be understood that the handles 100A, 100B, locking mechanisms 150A, 150B, and tabs 30A, 30B may be similarly applied to other types of wafer carriers, such as, but not limited to, a front opening shipping box (FOSB) in a similar manner as shown and described for the wafer carrier 1. In an embodiment, a front opening shipping box (FOSB) may include at least tabs 30A, 30B, handles 100A, 100B, and locking mechanisms 150A, 150B for the handles 100A, 100B.

[0118] Figures 10 to 12A locking mechanism 350A according to another embodiment will be described. Figure 10 is a perspective view of a portion of a FOUP 300. Figure 11 is a front perspective view of the locking mechanism 350A. Figure 12 is a rear perspective view of the locking mechanism 350A.

[0119] FOUP 300 contains similar Figures 1 to 5 Therefore, FOUP 300 also includes a second locking mechanism for a second handle 100B of wafer carrier 1 similar to locking mechanism 350A.

[0120] Figure 10 The locking mechanism 350A is shown in a locked position. In the unlocked position, the locking mechanism 350A is separated from the handle 100A and the wafer carrier 1, and is moved to the locked position by coupling the locking mechanism 350A to the handle 100A. The locking mechanism 350A has a locked state and an unlocked state. The locking mechanism 350A is moved from the unlocked state to the locked state by being coupled to the handle 100A. When in the locked state, the locking mechanism 350A maintains the tab 132A of the insertable component 130A in its engaged state. Figure 10 Tab 132A is not labeled because it is Figure 10 100A is obscured from view by the locking mechanism 350A. More specifically, the locking mechanism 350A, in its locked state, is configured to prevent movement of the tab 132A that would remove the tab 132A from its engaged state. The locking mechanism 350A moves from the locked state to the unlocked state by disengaging from the handle 100A.

[0121] like Figure 11 and 12 As shown in FIG. , the locking mechanism 350A has a front end 352A, a rear end 354A, an inner surface 366A, and a length L2. The locking mechanism 350A has a generally concave shape. The locking mechanism 350A includes a first tab 356A disposed at the front end 352A and a second tab 357A disposed at the rear end 354A. The first tab 356A and the second tab 357A have similar structures. The first tab 356A and the second tab 357A each extend from the inner surface 366A of the locking mechanism 350A. In an embodiment, the first tab 356A and the second tab 357A each extend from the inner surface 366A in a direction parallel to the length L2 of the locking mechanism 350A. The locking mechanism 350A is coupled to the handle 100A using the first tab 356A and the second tab 357A.

[0122] When the locking mechanism 350A is in its locked state, the first tab 356A contacts the back side 136A ( Figure 6C), and the second tab 357A is inserted into the through-hole 118A of the handle 100A. For example, when in the locked state, the first tab 356A is hooked on the end 138A of the insertable component 130A, and the second tab 357A is hooked in the through-hole 118A. In an embodiment, the through-hole 118A for the tab 357A may alternatively be a blind hole. When coupled to the handle 100A, the first tab 356A presses against the back side 136A of the insertable component 130A. In the locked state, this pressure on the insertable component 130A by the locking mechanism 350A prevents the insertable component 130A from flexing toward the outer surface 22 of the wafer carrier 1 and prevents the tab 132A from moving out of the engaged state. Thus, the locking mechanism 350A maintains the engaged state of the tab 132A.

[0123] The locking mechanism 350A extends a length greater than its normal length L2 (i.e., its length when no external forces F2, F3 are applied to the locking mechanism 350A). The length for coupling to and from the handle 100A is greater than the length L2. The locking mechanism 350A is configured to be flexible so that external forces (e.g., forces F2, F3) can increase the length L2 of the locking mechanism 350A. In an embodiment, the portion of the locking mechanism 350A at the first end 352 is a flexible extension 353A. When no external forces F2, F3 are applied to the locking mechanism 350A, the extendable extension 353A maintains its geometry and maintains the length L2. The position of the extendable portion 353A keeps the locking mechanism 350A coupled to the handle 100A. Thus, the geometry of the extendable portion 353A maintains the locking mechanism 350A in its locked state.

[0124] When the locking mechanism 350A is in its locked state, it can be moved to its unlocked state (i.e., disengaged) by applying an external force (e.g., force F2, force F3) to the inner surface 366A of the locking mechanism 350A along the first end 352A or the second end 354A. For example, the external forces F2, F3 cause the extendable extension 353A to extend and increase the length L2 of the locking mechanism 350A. The greater length L2 causes the locking mechanism 350A to disengage from the handle 100A.

[0125] Figures 10 to 12The illustrated embodiment of the locking mechanism 350A in FIG. 1 is separate from the handle 100A when in the unlocked state (i.e., detached from the handle 100A in the unlocked state). However, in embodiments, the handle 100A and the locking mechanism 350A may be a single, unitary piece. In this embodiment, the rear end 354A may be integrally connected to the main body 110A of the handle 100A. The front end 353A may be flexible relative to the insertable member 130A such that the front end 353A is configured to be pulled away from the insertable member 130A in a direction D3 to allow the tab 30A to fit between the front end 353A and the insertable member 130A to remove the handle 100A from the wafer carrier 1.

[0126] The locking mechanism 350A is Figures 10 to 12 30B, a pair of handles 100A, 100B, and a pair of locking mechanisms 350A.

[0127] Figures 13 to 16 A locking mechanism 450A according to another embodiment will be described. Figure 13 is a perspective view of a portion of FOUP 400. Figure 14 is a front perspective view of the locking mechanism 450A. Figure 15 is a rear perspective view of the locking mechanism 450A. Figure 16 It is along Figure 13 Partial cross-sectional view of FOUP 400 taken along line XVI-XVI in FIG.

[0128] FOUP 400 contains similar Figures 1 to 4 Thus, the FOUP 400 includes a second locking mechanism for the second handle 100B of the wafer carrier 1 that is similar to the locking mechanism 450A.

[0129] The locking mechanism 450A has a locked state and an unlocked state. Figure 13 and 16 The locking mechanism 450A is shown in a locked state. The locking mechanism 450A is moved from the unlocked state to the locked state by being inserted into the aperture 32A in a direction D2 opposite to the insertion direction D1 of the insertable component 130A into the aperture 32A. The locking mechanism 450A is moved from the locked state to the unlocked state by moving in the direction D1.

[0130] like Figures 14 to 16 As shown in FIG. , the locking mechanism 450A has a front end 452A, a rear end 454A, a length L3, a lip 453A, a biasing member 458A, and a flexible extension 460A. The flexible extension 460A includes a first arm 462A having a first tab 463A and a second arm 464A having a second tab 465A. In one embodiment, the length L3 of the locking mechanism 450A extends parallel to the direction in which the insertable member 130A extends from the main body 110A of the handle 100A. The length L3 of the locking mechanism 450A is perpendicular to its thickness T2.

[0131] When the locking mechanism 450A is in its locked state, the biasing member 458A contacts the outer surface 22 of the wafer carrier 1 and pushes the contact surface 456A into contact with the backside 136A of the insertable member 130A. The insertable member 130A is compressed between the contact surface 456A of the locking mechanism 450A and the inner surface 38A of the protrusion 30A. The biasing member 464A is configured to provide the locking member 450A with a thickness T2 that prevents deflection of the insertable member 130A. The biasing member 464A is configured to provide the locking member 450A with a thickness T2 that prevents deflection of the insertable member 130A. In an embodiment, the biasing member 464A is configured to provide the locking mechanism 450A with a thickness T2 that prevents deflection of the insertable member to at least the minimum amount that allows the tab 132A to move from its engaged position. This prevents the insertable member 130A from deflecting the tab 132A from its engaged state. Thus, the locking mechanism 450A maintains the engagement of the tab 132A in its locked state.

[0132] Lip 453A is positioned at front portion 452A of locking mechanism 450A. Lip 453A is configured to limit how far locking mechanism 450A can be inserted into aperture 32A. Lip 453A extends above contact surface 456A. When locking mechanism 450A is moved to the locked state, lip 453A contacts end 138A of insertable component 130A and further prevents insertion of locking mechanism 450A. For example, lip 453A can prevent locking mechanism 450A from being fully inserted into or through aperture 32A.

[0133] When in the locked position, tabs 463A, 465A contact the inner surface 121A of handle 100A, and no external force F4 is applied to arms 462A, 464A. More specifically, tabs 463A, 465A are hooked onto one or more inner surfaces 121A of handle 100A. For example, retaining space 119A may define inner surface 121A of handle 100A. Contact of tabs 463A, 465A on the inner surface prevents movement of locking mechanism 450A in first direction D1. Flexible extension 460A is configured so that external force F4 causes arms 462A, 464A to flex closer together, reducing width W4 and moving arms 462A, 464A away from their corresponding inner surface 121A. For example, external force F4 may be applied by a person attempting to move locking mechanism 450A to the unlocked position.

[0134] Thus, the size and positioning of the arms 462A, 464A of the flexible extension 460A maintains the locking mechanism in its locked position. For example, the width W4 of the flexible extension 460A along the tabs 463A, 465A prevents the locking mechanism 450A from moving from its locked state.

[0135] like Figure 16 , the contact surface 456A is configured to push against the insertable member 130A in direction D3. However, as discussed above, in embodiments, the insertable tab 132A is configured to extend from the insertable member 130A in a direction other than away from the outer surface 22 of the wafer carrier 1 (e.g., other than direction D3). In this embodiment, the locking mechanism 450A can be configured to push against the insertable member 130A in the appropriate direction so that the tab 132A of the insertable member 130A is maintained in its engaged state. For example, the locking mechanism 450A can extend between the protrusion 30A and the front side 134A of the insertable member 130A and be configured to push the insertable member 130A toward the outer surface 22 of the wafer carrier 1, or configured to push the insertable member 130A in a direction perpendicular to the directions D1 and D3.

[0136] The locking mechanism 450A is Figures 13 to 16 4 and described above as being for a FOUP 400. However, it should be understood that the handle 100A, locking mechanism 450A, and tab 30A may be similarly applied to other types of wafer carriers, such as, but not limited to, a front opening ship box (FOSB).

[0137] Figures 17 to 21 Various embodiments of a wafer carrier 500 and a handle 510 are shown according to another embodiment of the present disclosure.

[0138] Figure 17FIG. 5 is a side view of a wafer carrier 500 including a handle 510 and locking mechanisms 520A, 520B according to another embodiment of the present disclosure. The wafer carrier 500 may be a FOUP or FOSB as described herein and may have many of the same features as the wafer carrier 1 described herein. In one embodiment, the wafer carrier 500 is a FOUP. The handle 510 includes the same features as described above with particular reference to FIG. Figures 6A to 6C Those skilled in the art will appreciate that wafer carrier 500 includes a second handle having the same features as handle 510 on an opposite sidewall of wafer carrier 500, which is not shown here for the sake of brevity.

[0139] like Figure 17 As shown in FIG, the handle 510 engages with rails 50A, 60A disposed on the sidewall 506 of the wafer carrier 500. The rails 50A, 60A are previously used herein, such as, for example, in Figure 5 519A and 519B are best seen in the figure. The handle 510 includes a handle body 512, and a first locking mechanism 520A disposed at an upper end 524 of the handle body 512 and a second locking mechanism 520B disposed at a lower end 526 of the handle body 512. Each of the locking mechanisms 520A, 520B is configured to be retained within a vertical guide 530A, 530B disposed at each of the upper end 524 and the lower end 526 of the handle body 512 so that it can slide within the vertical guides 530A, 530B to transition from an unlocked state to a locked state. The locking mechanisms 520A, 520B can be retained in the locked state by the retaining spaces 519A, 519B. Figure 17 , locking mechanism 520A is depicted in an unlocked state and locking mechanism 520B is depicted in a locked state.

[0140] Figures 18A to 18C Different views of the handle 510 are shown. Figure 18A The handle 510 is shown including locking mechanisms 520A, 520B, each in an unlocked state. Figure 18B is a front view of the handle 510 with the locking mechanisms 520A, 520B removed so that the vertical guides 530A, 530B in which the locking mechanisms 520A, 520B are retained and the transition from the unlocked state to the locked state are visible. Figure 18Cis a side view of handle 510. Like handle 100A described herein, handle 510 includes an upper protrusion 580A and a lower protrusion 580B configured to engage and slide along rails 50A, 60A. Upper and lower protrusions 580A, 580B have shapes that complement those of rails 50A, 60A. In some embodiments, upper and lower protrusions 580A, 580B have a downwardly extending L-shape that defines guides 582A, 582B, which facilitates retaining upper and lower protrusions 580A, 580B on and sliding along rails 50A, 60A.

[0141] Figure 19 The locking mechanism 520A is shown in isolation. Figure 20A and 20B Close-up views of a first locking mechanism 520A disposed at an upper end 524 of the handle body 512 and a second locking mechanism 520B disposed at a lower end 526 of the handle body 512 are shown, respectively. Figure 21 is a cross-sectional view showing the locking mechanism 520B in a locked state.

[0142] The locking mechanisms 520A, 520B are configured to prevent the handle 510 from being accidentally removed from the wafer carrier 500. The locking mechanisms 520A, 520B are configured to hold the handle 510 in place on the vertical guides 530A, 530B (at Figure 18B ), so as to be able to slide within the vertical guides 530A, 530B when transitioning from the unlocked state to the locked state. Figure 20A The locking mechanism 520A is shown in an unlocked state. Figure 20B The locking mechanism 520B is shown in a locked state.

[0143] Reference Figure 19 The locking mechanism 520A includes a first end 552A and a second end 554A, and a flexible extension 560A positioned between the first end 552A and the second end 554A. The locking mechanism 520A includes an upper restraint 564A and a lower restraint 566A disposed at the first end 552A. In an embodiment, one upper restraint 564A and one lower restraint 566A may be disposed along each side of the locking mechanism 520A. In an embodiment, one of the restraints 566A is bendable (e.g., bendable in the direction of the width W) to allow the locking mechanism 520A to be formed separately from the handle 510 and then snapped into the vertical guide 530A. The upper restraint 564A and the lower restraint 566A are configured to prevent the locking mechanism 520A from being removed after being snapped into the vertical guide 530A.

[0144] like Figure 20A and 20BAs best seen in FIG, the locking mechanisms 520A, 520B are slidably attached to the handle body 512 by the interaction of two restraints 564A, 564B and 566A, 566B with the vertical guides 530A, 530B. Respectively, the upper restraints 564A, 564B are positioned above the upper surface of the walls defining the vertical guides 530A, 530B, and the lower restraints 566A, 566B are positioned below the lower surface of the walls defining the vertical guides 530A, 530B, such that the walls defining the vertical guides 530A, 530B are positioned between the upper restraints 564A, 564B and the lower restraints 566A, 566B of the locking mechanisms 520A, 520B.

[0145] The flexible extension 560A is configured to flex inwardly toward the centerline x in response to an applied force from a first state having a first width to a second state having a second width less than the first width. In the second state, the flexible extension 560A can be received within the retaining space 519A when the locking mechanism 520A transitions to the locked state.

[0146] Figure 20B and 21 is a different view showing the locking mechanism 520B in a locked state. As previously indicated, the locking mechanism 520B includes the same features as the locking mechanism 520A described herein. Figure 20B and 21 , when locking mechanism 520B is in the locked state, flexible extension 560B is retained within retention space 519B. Upon releasing the force applied to flexible extension 560B, the flexible extension can transition from the second state to the first state, thereby retaining flexible extension 560B in retention space 519B. To transition locking mechanism 520B from the locked state to the unlocked state, force can be applied again to flexible extension 560B, causing flexible extension 560B to be in the second state and having a width less than the width of retention space 519B, thereby allowing it to be removed.

[0147] Additionally, in some embodiments, second end 554A is sized to be received and retained within a corresponding aperture provided in track 50A when locking mechanism 520A is in the locked state. Locking mechanism 520B engages track 60A in the same manner. In some embodiments, track 60A may be provided with an aperture sized to receive and retain the second end of locking mechanism 520B when locking mechanism 520B is in the locked state.

[0148] Figures 22 to 26Various views of a wafer carrier 600 and a handle 610 are shown according to another embodiment of the present disclosure. The wafer carrier 600 includes many of the same features as the wafer carriers 1 and 500 described herein. The wafer carrier 600 can be a FOUP or a FOSB. In one embodiment, the wafer carrier 600 is a FOUP.

[0149] Figure 22 The wafer carrier 600 is shown including a handle 610 prior to attachment to rails 50A, 60 disposed on a sidewall 606 of the wafer carrier 600 . Figure 23 Wafer carrier 600 is shown including a handle 610 attached to a sidewall 606 of the wafer carrier. Those skilled in the art will appreciate that wafer carrier 600 includes a second handle having the same features as handle 610 on an opposite sidewall of wafer carrier 600, which is not shown here for simplicity.

[0150] like Figure 23 , the handle 510 engages with rails 50A, 60A disposed on the sidewall 606 of the wafer carrier 600. The rails 50A, 60A are previously used herein, for example, in Figure 5 The handle 610 includes a handle body 612, a first locking mechanism 520A disposed at an upper end 624 of the handle body 612, and a second locking mechanism 520B disposed at a lower end 626 of the handle body 612. The locking mechanisms 520A and 520B are described in detail in Figure 19 Each of the locking mechanisms 520A, 520B is configured to be retained within a vertical guide 630A, 630B provided at each of the upper end 624 and the lower end 626 of the handle body 612 so that it can slide within the vertical guide 630A, 630B to transition from an unlocked state to a locked state.

[0151] exist Figures 22 to 26 In the embodiment shown in FIG, the retaining space 619B and the vertical groove 630B are offset from the centerline x2 extending through the lower end 626 of the handle body 612. Figures 17 to 21 In the previously described embodiment, the retaining space 619B and the vertical groove 630B are centered about the centerline x2 extending through the lower end 526 of the handle body 512. Instead of cooperating with an aperture provided in the track 60A, when the locking mechanism 520B is in the locked state, the second end 554B of the locking mechanism 520B abuts the end of the track 60A, as will be described in more detail below. In some cases, the retaining space 619A and the vertical groove 630A located at the upper end 624 of the handle 610 can also be located on the upper end 524 of the handle body, so that when the locking mechanism 520A is in the locked state, the second end 554A abuts the end of the track 50A.

[0152] Figures 24A to 24C Different views of the handle 610 are shown. Figure 24A The handle 610 is shown including the locking mechanisms 520A, 520B, each in an unlocked state. Figure 24B is a front view of the handle 610 with the locking mechanisms 520A, 520B removed so that the vertical guides 630A, 630B in which the locking mechanisms 520A, 520B are retained and the transition from the unlocked state to the locked state are visible. Figure 24C 6 is a side view of handle 610. Like handles 100A and 510 described herein, handle 610 includes upper and lower protrusions 680A, 680B configured to engage and slide along rails 50A, 60A. Upper and lower protrusions 680A, 680B have shapes that complement those of rails 50A, 60A. In some embodiments, upper and lower protrusions 680A, 680B have downwardly extending L-shapes that define guides 682A, 682B, which facilitate retaining upper and lower protrusions 680A, 680B on and sliding along rails 50A, 60A when handle 610 is secured to sidewall 606 of wafer carrier 600.

[0153] Figure 25A and 25B 6 is a close-up view showing the locking mechanisms 520A, 520B in a locked state. The locking mechanisms 520A, 520B can be retained in the locked state by the retaining spaces 619A, 619B. Upon releasing the force applied to the flexible extensions 560A, 560B, the flexible extensions 560A, 560B can transition from the second state to the first state, thereby retaining the flexible extensions 560A, 560B in the retaining spaces 619A, 619B. To transition the locking mechanisms 520A, 520B from the locked state to the unlocked state, force can be applied again to the flexible extensions 560A, 560B, causing the flexible extensions 560A, 560B to be in the second state and have a width less than the width of the retaining spaces 619A, 619B, thereby allowing them to be removed.

[0154] Figure 26 FIG is a partial cross-sectional view of the upper end 624 of the handle body 612 showing the locking mechanism 520A in a locked state and engaged with the track 50A. Figure 26 6, the flexible extension 560A is received and retained in the retaining space 619A, and the second end 554A of the locking mechanism 520A abuts the distal end 558 of the track 50A. This prevents the handle 610 from being accidentally removed from the track 50A.

[0155] Figures 27 to 30Various views of a wafer carrier 700 and a handle 710 are shown according to another embodiment of the present disclosure. The wafer carrier 700 includes many of the same features as the wafer carriers 1, 500, and 600 described herein. The wafer carrier 700 can be a FOUP or a FOSB. In one embodiment, the wafer carrier 700 is a FOUP.

[0156] Figure 27 The wafer carrier 700 is shown including the handle 710 prior to attachment to rails 50A, 60A disposed on the sidewalls 706 of the wafer carrier 700 . Figure 28 The wafer carrier 700 is shown including a handle 710 attached to a sidewall 706 of the wafer carrier 700 . Figure 30 is a view of the handle 710 in isolation. Those skilled in the art will appreciate that the wafer carrier 700 includes a second handle having the same features as the handle 710 on an opposite sidewall of the wafer carrier 700, which is not shown here for simplicity.

[0157] like Figure 28 and 29 , the handle 710 engages with rails 50A, 60A disposed on the sidewall 706 of the wafer carrier 700. The rails 50A, 60A are previously used herein, for example, in Figure 5 60A. The handle 710 is described with the rails 50A, 60A best seen in FIG. 60B. The handle 710 includes a handle body 712, and a first locking arm 720A disposed at an upper end 724 of the handle body 712 and a second locking arm 720B disposed at a lower end 726 of the handle body 712. The distal end 760A, 760B of each of the locking arms 720A, 720B is configured to engage the distal end 758A, 758B of each of the rails 50A, 60A. In some embodiments, the distal ends 760A, 760B may be configured as barbs, detents, or other protrusions that can engage with the distal ends 758A, 758B of the rails 50A, 60A with a retaining force. Figure 28 and 29 ).

[0158] Each of the locking arms 720A, 720B is flexible so that it can flex outward and away from the sides of the carrier and ride along the outer surface 750 of each of the rails 50A, 60A when the handle 710 is attached to the wafer carrier 700. Upon reaching the distal ends 758A, 758B of the rails 50A, 60A, each of the flexible arms 720A, 720B is configured to flex inwardly back toward the sidewall 706 of the wafer carrier 700 so that the distal ends 760A, 760B of each of the flexible arms 720A, 720B engage and remain thereon, as shown in FIG. Figure 29 Best visible.

[0159] Aspects: Any of Aspects 1-13 can be combined with any of Aspects 14-23.

[0160] Aspect 1. A handle for a chip carrier, the chip carrier including a protrusion extending from an outer surface of the chip carrier, the protrusion defining a gap between the outer surface of the chip carrier and the range of the protrusion for attaching the handle, the handle comprising: a main body, which includes: a first end and a second end opposite to the first end, and an insertable member, which is disposed between the first end and the second end of the main body and is configured to be inserted into the gap to fix the handle to the chip carrier, the insertable member including a tab that holds the insertable member in the gap when in an engaged state; and a locking mechanism that is movable between a locked state and an unlocked state relative to the insertable member, the locking mechanism including a flexible extension, and in the locked state, the locking mechanism maintains the tab in the engaged state, and the flexible extension is positioned to maintain the locking mechanism in the locked state.

[0161] Aspect 2. The handle of aspect 1, wherein the handle is configured to be attached to and detached from the wafer carrier non-destructively.

[0162] Aspect 3. The handle of any one of Aspects 1 or 2, wherein the tab is disposed on a first side of the insertable member, and when in the locked state, the locking mechanism extends along a second side of the insertable member opposite the first side.

[0163] Aspect 4. The handle of any one of aspects 1 to 3, wherein when in the locked state, a thickness of the locking mechanism maintains the tab in the engaged state.

[0164] Aspect 5. The handle of any one of aspects 1 to 4, wherein when the locking mechanism is in the locked state, the geometry of the flexible extension maintains the locking mechanism in the locked state.

[0165] Aspect 6. A handle according to any one of Aspects 1 to 5, wherein the flexible extension is configured to bend to a smaller geometry or a different position, and allows the locking mechanism to move from the locked state in response to an external force causing the flexible extension to bend to the smaller geometry or the different position.

[0166] Aspect 7. The handle according to any one of aspects 1 to 6, wherein the body includes a guide disposed in the body adjacent to the insertable member, the locking mechanism being retained by the guide such that the locking mechanism is slidably attached to the body.

[0167] Aspect 8. The handle of any one of aspects 1 to 7, wherein the insertable member is disposed at an end of the grip, at the first end, or between the grip and the first end.

[0168] Aspect 9. The handle according to any one of Aspects 1 to 8 further comprises: a protrusion extending from the first end of the body in a first direction and a second direction in the order, the first direction being away from the body and not in a planar relationship with the first end of the body, and the second direction being different from the first direction, wherein the protrusion is configured to engage the rail of the wafer carrier to secure the handle to the wafer carrier.

[0169] Aspect 10. The handle of any one of aspects 1 to 9, wherein the insertable member is deflectable relative to the remainder of the body, and the tab is movable to the engaged state due to the deflection of the insertable member.

[0170] Aspect 11. The handle of any one of aspects 1 to 10, wherein the locking mechanism extends through the body.

[0171] Aspect 12. The handle of any one of aspects 1 to 11, wherein the locking mechanism extends through a through hole in the body, and when in the locked state, the flexible extension causes the width of the locking mechanism to be greater than a corresponding width of the through hole.

[0172] Aspect 13. The handle of any one of aspects 1 to 12, wherein the body includes a grip disposed between the first end and the second end of the body.

[0173] Aspect 14. A chip carrier comprising: an outer surface; a protrusion extending from the outer surface, the protrusion defining a gap between the outer surface and the extent of the protrusion; a handle attached to the outer surface via the gap, the handle comprising: a body comprising a first end, a second end opposite the first end, and an insertable member disposed between the first end and the second end and extending into the gap to secure the handle to the outer surface, the insertable member comprising a tab that holds the insertable member in the gap when in an engaged state; and a locking mechanism movable between a locked state and an unlocked state relative to the insertable member, the locking mechanism comprising a flexible extension, and when in the locked state, the locking mechanism maintains the tab in the engaged state, and the flexible extension is positioned to maintain the locking mechanism in the locked state.

[0174] Aspect 15. The wafer carrier of aspect 14, wherein when in the locked state, the locking mechanism extends between the insertable member and the outer surface, and a thickness of the locking mechanism maintains the tab in the engaged state.

[0175] Aspect 16. The wafer carrier of any one of aspects 14 and 15, wherein the insertable member extends into the aperture in a first direction, and the thickness of the locking mechanism extends in a second direction perpendicular to the first direction.

[0176] Aspect 17. The wafer carrier of any one of aspects 14 to 16, wherein when in the locked state, the locking mechanism extends between the insertable member and the outer surface.

[0177] Aspect 18. A wafer carrier according to any one of aspects 14 to 17, wherein the insertable component is inserted into the aperture in a first direction, and the locking mechanism moves from the unlocked state to the locked state in a second direction parallel to the first direction.

[0178] Aspect 19. A wafer carrier according to any one of Aspects 14, 15, 17 and 18, further comprising: a rail extending along the outer surface, wherein the handle includes a protrusion extending from the first end of the body in a first direction and a second direction in the sequence, the first direction being away from the body and not in a planar relationship with the first end of the body, and the second direction being different from the first direction, wherein the protrusion engages the rail to secure the handle to the outer surface.

[0179] Aspect 20. The wafer carrier of aspect 19, wherein the protrusion of the handle is moved to engage the rail in the same direction as the insertable component is inserted into the aperture.

[0180] Aspect 21. A wafer carrier according to any one of Aspects 19 and 20, further comprising: a first side, the outer surface being defined by the first side, and the handle extending along the first side, and the engagement of the protrusion with the track inhibiting movement of the handle away from or toward the first side.

[0181] Aspect 22. The wafer carrier of any one of aspects 19 to 21, further comprising: a groove defined by an inner surface of the rail, the protrusion extending into the groove.

[0182] Aspect 23. The wafer carrier of any one of aspects 14 to 22, wherein the wafer carrier is one of a front-opening wafer box and a front-opening shipping box.

[0183] Having thus described several illustrative embodiments of the present disclosure, it will be readily apparent to those skilled in the art that still other embodiments can be made and used within the scope of the claims appended hereto. The foregoing description has set forth many of the advantages of the present disclosure encompassed by this document. However, it should be understood that the present disclosure is in many respects merely illustrative. Changes may be made in the details, particularly in the shape, size, and arrangement of parts, without exceeding the scope of the present disclosure. The scope of the present disclosure is, of course, defined by the language in which the appended claims are expressed.

Claims

1. A handle for a wafer carrier, the wafer carrier including a protrusion extending from an outer surface of the wafer carrier, the protrusion defining an aperture between the outer surface of the wafer carrier and an extent of the protrusion for attaching the handle, the handle comprising: The body, which contains: a first end and a second end opposite to the first end, and an insertable member disposed between the first end and the second end of the body and configured to be inserted into the aperture to secure the handle to the wafer carrier, the insertable member including a tab that retains the insertable member in the aperture when in an engaged state; a locking mechanism movable between a locked state and an unlocked state relative to the insertable member, the locking mechanism including a flexible extension, and in the locked state, the locking mechanism restricts flexure of the insertable member and restricts movement of the tab, and the flexible extension is positioned in the aperture to prevent external force from being applied to the locking mechanism in the locked state; Wherein the body includes a guide disposed in the body adjacent to the insertable member, the locking mechanism is retained by the guide such that the locking mechanism is slidably attached to the body.

2. The handle of claim 1, wherein the handle is configured to be attached to and detached from the wafer carrier non-destructively. 3 . The handle of claim 1 , wherein the tab is disposed on a first side of the insertable member, and when in the locked state, the locking mechanism extends along a second side of the insertable member opposite the first side. 4 . The handle of claim 1 , wherein a thickness of the locking mechanism maintains the tab in the engaged state when in the locked state.

5. The handle of claim 1, wherein when the locking mechanism is in the locked state, the geometry of the flexible extension maintains the locking mechanism in the locked state. 6 . The handle of claim 1 , wherein the flexible extension is configured to be deflectable to allow the locking mechanism to move from the locked state in response to an external force deflecting the flexible extension.

7. The handle of claim 1, wherein the insertable member is disposed at an end of the handle, at the first end, or between a grip on the handle and the first end.

8. The handle of claim 1 , further comprising: a protrusion extending sequentially from the first end of the body in a first direction and a second direction, the first direction being away from the body and not in a plane with the first end of the body, and the second direction being different from the first direction, The protrusions extending sequentially in the first and second directions from the first end of the body are configured to engage a rail of the wafer carrier to secure the handle to the wafer carrier.

9. The handle of claim 1, wherein the insertable member is deflectable relative to the remainder of the body, and the tab is movable to the engaged condition due to the deflection of the insertable member.

10. The handle of claim 1, wherein the locking mechanism extends through the body.

11. The handle of claim 1 , wherein the locking mechanism extends through a through hole in the body, and when in the locked state, the flexible extension causes a width of the locking mechanism to be greater than a corresponding width of the through hole.

12. The handle of claim 1, wherein the body includes a grip disposed between the first end and the second end of the body.

13. A wafer carrier comprising: External surface; a projection extending from the outer surface, the projection defining an aperture between the outer surface and an extent of the projection; a handle attached to the outer surface via the aperture, the handle comprising: a body comprising a first end, a second end opposite the first end, and an insertable member disposed between the first end and the second end and extending into the aperture to secure the handle to the exterior surface, the insertable member including a tab that retains the insertable member in the aperture when in an engaged state; and a locking mechanism movable between a locked state and an unlocked state relative to the insertable member, the locking mechanism including a flexible extension, and when in the locked state, the locking mechanism restricts flexure of the insertable member and restricts movement of the tab, and the flexible extension is positioned in the aperture to prevent external force from being applied to the locking mechanism in the locked state; Wherein the body includes a guide disposed in the body adjacent to the insertable member, the locking mechanism is retained by the guide such that the locking mechanism is slidably attached to the body.

14. The wafer carrier of claim 13, wherein when in the locked state, the locking mechanism extends between the insertable member and the outer surface, and a thickness of the locking mechanism maintains the tab in the engaged state.

15. The wafer carrier of claim 13, wherein the insertable member is inserted into the aperture in a first direction and the locking mechanism moves from the unlocked state to the locked state in a second direction parallel to the first direction.

16. The wafer carrier of claim 13, further comprising: a track extending along said outer surface, wherein the handle includes a protrusion extending from the first end of the body in a first direction and a second direction in sequence, the first direction being away from the body and not in a plane with the first end of the body, and the second direction being different from the first direction, and The protrusions extending sequentially in the first and second directions from the first end of the body engage the rail to secure the handle to the outer surface.

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