Inductive device

Abstract

An inductance device includes a first trace, a second trace, and a capacitor. The first trace includes a first sub-trace and a second sub-trace. The first sub-trace includes a plurality of first coils. The second sub-trace includes a plurality of second coils and is coupled to one end of the first sub-trace at a first node. The above-mentioned first coils and second coils are arranged at intervals and are located outside the inductance device. The second trace includes a third sub-trace and a fourth sub-trace. The third sub-trace includes a plurality of third coils. The fourth sub-trace includes a plurality of fourth coils and is coupled to one end of the third sub-trace at a second node. The above-mentioned third coils and fourth coils are arranged at intervals and are located outside the inductance device. The capacitor is coupled between the first node and the second node.

Description

Technical Field

[0001] The present disclosure relates to an electronic device, and particularly to an inductance device. Background Art

[0002] When a radio frequency (RF) device operates, it will generate second-harmonic, third-harmonic, and so on. These harmonics will have an adverse effect on the rest of the circuit. For example, the second-harmonic of a 2.4 GHz circuit will generate a 5 GHz signal, which will have an adverse effect on the system on a chip (SOC).

[0003] Generally, the way to solve the influence of the above harmonics on the circuit is to set a filter outside the circuit to filter out the above harmonics. However, the filter set outside the circuit will affect the performance of the circuit itself and incur additional costs. Summary of the Invention

[0004] One technical solution of the present disclosure relates to an inductance device, which includes a first trace, a second trace, and a capacitor. The first trace includes a first sub-trace and a second sub-trace. The first sub-trace includes a plurality of first coils. The second sub-trace includes a plurality of second coils and is coupled to one end of the first sub-trace at a first node. The above first coils and second coils are arranged at intervals and are located outside the inductance device. The second trace includes a third sub-trace and a fourth sub-trace. The third sub-trace includes a plurality of third coils. The fourth sub-trace includes a plurality of fourth coils and is coupled to one end of the third sub-trace at a second node. The above third coils and fourth coils are arranged at intervals and are located outside the inductance device. The capacitor is coupled between the first node and the second node.

[0005] Therefore, according to the technical content of the present disclosure, the capacitor in the inductor device shown in the embodiments of the present disclosure can form a function of filtering out low frequencies, so that the low-frequency signals induced by the inductor device cannot pass through while the high-frequency signals can pass directly. Taking the 2.4 GHz main operating frequency as an example of low-frequency signals, the inductive signals of the main operating frequency are canceled out by the folded inductor structure of the inductor device. Therefore, the folded inductor structure does not affect the characteristics of the inductor operating frequency. If there are high-frequency signals in the central inductor structure, such as the second harmonic of 5 GHz, due to the conduction of the high-frequency signal capacitor, the high-frequency signals pass through the capacitor by the folded inductor structure to form an inductive inductor around a circle, and then a 5 GHz harmonic signal more than ten times that of 2.4 GHz is induced in the inductor structure claimed in the present disclosure. The user then applies this 5 GHz signal in the circuit. For example, after amplifying the signal, the 5 GHz harmonic of the operating frequency is canceled out, and the application amplifier circuit can be optimized and adjusted by well-known circuit designers. In this way, the adverse effects on the 5 GHz circuit can be reduced. Furthermore, since the filter is provided inside the inductor device in the present disclosure, there is no need to provide a filter outside the inductor device, thereby avoiding the external filter from affecting the performance of the circuit itself or increasing additional costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] To make the above and other objects, features, advantages and embodiments of the present disclosure more obvious and understandable, the description of the drawings is as follows:

[0007] Figure 1 is a schematic diagram showing an inductor device according to an embodiment of the present disclosure.

[0008] Figure 2 is a partial schematic diagram of an inductor device as shown in Figure 1 according to an embodiment of the present disclosure.

[0009] Figure 3 is a schematic diagram showing an inductor device according to an embodiment of the present disclosure.

[0010] Figure 4 is a partial schematic diagram of an inductor device as shown in Figure 3 according to an embodiment of the present disclosure.

[0011] Figure 5 is a schematic diagram showing an inductor device according to an embodiment of the present disclosure.

[0012] Figure 6 is a schematic diagram of experimental data of an inductor device according to an embodiment of the present disclosure.

[0013] In accordance with the usual operating mode, the various features and components in the figures are not drawn to scale. They are drawn in a way that best presents the specific features and components relevant to the present disclosure. Additionally, the same or similar component symbols are used to refer to similar components / parts among different figures.

[0014] Symbol Explanation

[0015] 1000, 1000A - 1000B: Inductive device

[0016] 1100, 1100A - 1100B: First trace

[0017] 1110, 1110A - 1110B: First sub - trace

[0018] 1111, 1111A: First coil

[0019] 1120, 1120A - 1120B: Second sub - trace

[0020] 1121, 1121A: Second coil

[0021] 1200, 1200A - 1200B: Second trace

[0022] 1210, 1210A - 1210B: Third sub - trace

[0023] 1211, 1211A: Third coil

[0024] 1220, 1220A - 1220B: Fourth sub - trace

[0025] 1221, 1221A: Fourth coil

[0026] 1300, 1300A: Connector

[0027] 1410: Fifth trace

[0028] 1411: Fifth coil

[0029] 1420: Sixth trace

[0030] 1421: Sixth coil

[0031] 1500, 1500A: Partial structure

[0032] 1600, 1600A: Partial structure

[0033] 1710A: First connector

[0034] 1720A: Second connector

[0035] 1810A: Third connector

[0036] 1820A: The fourth connecting member

[0037] C: Capacitance

[0038] C1 - C3: Curves

[0039] N1: The first node

[0040] N2: The second node Detailed implementation manners

[0041] Figure 1 is a schematic diagram showing an inductance device 1000 according to an embodiment of the present disclosure. As shown in the figure, the inductance device 1000 includes a first trace 1100, a second trace 1200, and a capacitance C. Furthermore, the first trace 1100 includes a first sub - trace 1110 and a second sub - trace 1120. One end of the first sub - trace 1110 is coupled to one end of the second sub - trace 1120 at the first node N1. The second trace 1200 includes a third sub - trace 1210 and a fourth sub - trace 1220. One end of the third sub - trace 1210 is coupled to one end of the fourth sub - trace 1220 at the second node N2. The capacitance C is coupled between the first node N1 and the second node N2.

[0042] Figure 2 is a schematic diagram showing a partial structure 1500 of an inductance device 1000 as shown in Figure 1 according to an embodiment of the present disclosure. As shown in the figure, the first sub - trace 1110 includes a plurality of first coils 1111. The second sub - trace 1120 includes a plurality of second coils 1121. The first coils 1111 and the second coils 1121 are arranged at intervals and are located outside the inductance device 1000. For example, the first coils 1111 are formed by winding the first sub - trace 1110, and the second coils 1121 are formed by winding the second sub - trace 1120. The first coils 1111 and the second coils 1121 are arranged at intervals with each other. For example, their arrangement order is "first coil 1111, second coil 1121, first coil 1111, second coil 1121... etc.". Please refer to Figure 1 and Figure 2 , the first coils 1111 and the second coils 1121 are located in the partial structure 1500, and the partial structure 1500 is located outside (or the periphery) of the overall inductance device 1000.

[0043] Similarly, please refer to Figure 1The partial structure 1600 at the upper right corner, the third sub-trace 1210 includes a plurality of third coils 1211, and the fourth sub-trace 1220 includes a plurality of fourth coils 1221. The coupling and arrangement manners of the third coils 1211 and the fourth coils 1221 are the same as those of the first coil 1111 and the second coil 1121. For the sake of conciseness of this disclosure specification, they are not elaborated herein.

[0044] It should be noted that Figure 1 There are related structures similar to the partial structure 1500 and the partial structure 1600 at the lower left corner and the lower right corner of the inductance device 1000 of

[0045] In an embodiment, both the first sub-trace 1110 and the second sub-trace 1120 include a first end and a second end. As shown in the figure, the second end (such as the lower end) of the first sub-trace 1110 is coupled to the second end (such as the lower end) of the second sub-trace 1120 at the first node N1. For example, the first end of the first sub-trace 1110 is located at the upper side in the figure. The first sub-trace 1110 winds to the left in the figure, then, the first sub-trace 1110 winds downward along the left side, and then, after winding to the lower left corner in the figure, it winds to the node N1 at the lower side in the figure. The second end of the first sub-trace 1110 is finally coupled to the node N1. At the node N1, the second end of the second sub-trace 1120 is coupled to the node N1. The second sub-trace 1120 winds to the left in the figure, then, the second sub-trace 1120 winds upward along the left side, and then, after winding to the upper left corner in the figure, it winds to the connecting member 1300 at the upper side in the figure, and winds to the first end of the second sub-trace 1120 located at the upper side. From the above structural configuration, it can be seen that the first sub-trace 1110 and the second sub-trace 1120 form a folded inductor.

[0046] In addition, both the third sub-trace 1210 and the fourth sub-trace 1220 include a first end and a second end. As shown in the figure, the second end (such as the lower end) of the third sub-trace 1210 is coupled to the second end (such as the lower end) of the fourth sub-trace 1220 at the second node N2. For example, the first end of the third sub-trace 1210 is located at the upper side in the figure. The third sub-trace 1210 winds to the right in the figure, then, the third sub-trace 1210 winds downward along the right side, and then, after winding to the lower right side in the figure, it winds to the node N2 at the lower side in the figure. The second end of the third sub-trace 1210 is finally coupled to the node N2. At the node N2, the second end of the fourth sub-trace 1220 is coupled to the node N2. The fourth sub-trace 1220 winds to the right in the figure, then, the fourth sub-trace 1220 winds upward along the right side, and then, after winding to the upper right side in the figure, it winds to the connecting member 1300 at the upper side in the figure, and winds to the first end of the fourth sub-trace 1220 located at the upper side. Similarly, from the above structural configuration, it can be seen that the third sub-trace 1210 and the fourth sub-trace 1220 form a zigzag inductance structure. In an embodiment, the first end of the third sub-trace 1210 is coupled to the first end of the first sub-trace 1110 through the connecting member 1300.

[0047] Please refer to Figure 2 , the first trace 1110 further includes a fifth sub-trace 1410 and a sixth sub-trace 1420. The fifth sub-trace 1410 includes a plurality of fifth coils 1411. The above-mentioned fifth coils 1411 are located above the first coil 1111 and are coupled to the first coil 1111. For example, one end of the fifth coil 1411 is coupled to one end of the first coil 1111 at the innermost node N3 of the fifth coil 1411. The other end of the fifth coil 1411 is coupled to the other end of the first coil 1111 at the outermost node N5 of the fifth coil 1411.

[0048] In addition, the sixth sub-trace 1420 includes a plurality of sixth coils 1421. The above-mentioned sixth coils 1421 are located above the second coil 1121 and are coupled to the second coil 1121. The fifth coils 1411 and the sixth coils 1421 are arranged at intervals and are located outside the inductance device 1000. For example, one end of the sixth coil 1421 is coupled to one end of the second coil 1121 at the innermost node N4 of the sixth coil 1421. The other end of the sixth coil 1421 is coupled to the other end of the second coil 1121 at the outermost node N6 of the sixth coil 1421.

[0049] In an embodiment, the first coil 1111 and the second coil 1121 are located on the first layer, and the fifth coils 1411 and the sixth coils 1421 are located on the second layer. For example, the fifth coils 1411 and the sixth coils 1421 are located above the first coil 1111 and the second coil 1121. However, the present disclosure is not limited to Figure 2Taking the structure shown as a limit, in other embodiments, the fifth coil 1411 and the sixth coil 1421 may also be disposed below the first coil 1111 and the second coil 1121, depending on actual requirements.

[0050] In another embodiment, as Figure 2 shown, the first coil 1111 and the fifth coil 1411 partially overlap. In addition, the second coil 1121 and the sixth coil 1421 partially overlap. Furthermore, from other perspectives, the first coil 1111 and the sixth coil 1421 partially overlap. Additionally, the second coil 1121 and the fifth coil 1411 partially overlap.

[0051] It should be noted that the present disclosure is not limited to Figure 1 and Figure 2 the structure shown, which is only used to exemplarily show one of the implementation manners of the present disclosure.

[0052] Figure 3 is a schematic diagram showing an inductance device 1000A according to an embodiment of the present disclosure. Figure 4 is a partial schematic diagram showing an inductance device 1000A as Figure 3 shown according to an embodiment of the present disclosure. It should be noted that compared with Figure 1 the inductance device 1000, Figure 3 and Figure 4 the first coil 1111A, the second coil 1121A, the third coil 1211A and the fourth coil 1221A of the inductance device 1000A are arranged differently. Please refer to Figure 3 and Figure 4 , the first coil 1111A and the second coil 1121A are disposed on the first side of the inductance device 1000A, and the third coil 1211A and the fourth coil 1221A are disposed on the second side of the inductance device 1000A. In one embodiment, the above-mentioned first side and the second side are located on opposite sides of the inductance device 1000A. For example, the first coil 1111A and the second coil 1121A are disposed on the left side of the inductance device 1000A, and the third coil 1211A and the fourth coil 1221A are disposed on the right side of the inductance device 1000A.

[0053] Please refer to Figure 3 and Figure 4, in one embodiment, the inductive device 1000A further includes a first connector 1710A and a second connector 1720A. The first connector 1710A is coupled to the first sub-trace 1110A and the first coil 1111A. The second connector 1720A is coupled to the second sub-trace 1120A and the second coil 1121A. In another embodiment, the first sub-trace 1110A and the second sub-trace 1120A are located on the first layer, and the first connector 1710A and the second connector 1720A are located on the second layer. For example, the first connector 1710A and the second connector 1720A are located above the first sub-trace 1110A and the second sub-trace 1120A. However, the present disclosure is not limited to Figure 2 the structure shown. In other embodiments, the first connector 1710A and the second connector 1720A may also be disposed below the first sub-trace 1110A and the second sub-trace 1120A, depending on actual requirements.

[0054] In one embodiment, the inductive device 1000A further includes a third connector 1810A and a fourth connector 1820A. The third connector 1810A is coupled to the third sub-trace 1210A and the third coil 1211A. The fourth connector 1820A is coupled to the fourth sub-trace 1220A and the fourth coil 1221A. In another embodiment, the third sub-trace 1210A and the fourth sub-trace 1220A are located on the first layer, and the third connector 1810A and the fourth connector 1820A are located on the second layer. For example, the third connector 1810A and the fourth connector 1820A are located above the third sub-trace 1210A and the fourth sub-trace 1220A. However, the present disclosure is not limited to Figure 2 the structure shown. In other embodiments, the third connector 1810A and the fourth connector 1820A may also be disposed below the third sub-trace 1210A and the fourth sub-trace 1220A, depending on actual requirements.

[0055] It should be noted that in Figure 3 and Figure 4 the embodiments, the component numbers similar to those in Figure 1 and Figure 2 have similar structural features. For the sake of brevity of the specification, they will not be elaborated herein. In addition, the present disclosure is not limited to Figure 3 and Figure 4 the structures shown, which are only used to exemplarily show one of the implementation manners of the present disclosure.

[0056] Figure 5 is a schematic diagram showing an inductive device 1000B according to an embodiment of the present disclosure. It should be noted that compared with Figure 1 the inductive device 1000 and Figure 3 the inductive device 1000A of Figure 5The first sub-wire 1110B, the second sub-wire 1120B, the third sub-wire 1210B, and the fourth sub-wire 1210B of the inductance device 1000B are arranged differently. For example, Figure 5 the inductance device 1000B does not have Figure 1 the fifth sub-wire 1410 and the sixth sub-wire 1420 in the partial structure 1500 of the inductance device 1000. In addition, Figure 5 the inductance device 1000B does not have Figure 3 the partial structure 1500A and the partial structure 1600A of the inductance device 1000A.

[0057] It should be noted that in Figure 5 the embodiment, the component numbers similar to Figure 1 and Figure 3 have similar structural features. For the sake of simplicity of the specification, they will not be elaborated here. In addition, the present disclosure is not limited to the structure shown in Figure 5 , which is only used to exemplarily show one of the implementation manners of the present disclosure.

[0058] Figure 6 is a schematic diagram of experimental data showing an inductance device according to an embodiment of the present disclosure. As shown in the figure, using the architecture configuration of the present disclosure, the experimental curves of its S-parameters (scattering parameters) are C1, C2, and C3. The curve C1 is the Figure 1 experimental curve of the inductance device 1000, the curve C2 is the Figure 3 experimental curve of the inductance device 1000A, and the curve C3 is the Figure 5 experimental curve of the inductance device 1000B. It can be seen from the figure that whether it is the curve C1, the curve C2, or the curve C3, the signal at 2.4 GHz can be effectively filtered out and the signal at 5 GHz can be passed through. In addition, the S-parameter difference between the signal at 2.4 GHz and the signal at 5 GHz can reach up to 25 dB, from which it can also be seen that the inductance device of the present disclosure indeed has good filtering ability.

[0059] As can be seen from the above embodiments of the present disclosure, applying the present disclosure has the following advantages. The inductance device shown in the embodiments of the present disclosure can sense the high-frequency signal of the central inductance, such as the second harmonic. After being amplified by an additional circuit, the adverse effect of the second harmonic of the original circuit can be canceled out. For example, through the technical effect that the capacitance of the inductance device is mainly used to allow high frequencies to pass through and block low frequencies, in this way, the same inductance device can have two different signal sensing methods for high and low frequencies. Furthermore, since the present disclosure arranges the filter inside the integrated circuit (IC), there is no need to arrange a filter outside the inductance device, thereby avoiding the influence of the external filter on the performance of the circuit itself and its additional cost.

Claims

1. An inductance device, comprising: A first trace, comprising: A first sub-trace, comprising a plurality of first coils; and A second sub-trace, comprising a plurality of second coils, and coupled to one end of the first sub-trace at a first node, wherein the plurality of first coils and the plurality of second coils are arranged at intervals and are located outside the inductance device; A second trace, comprising: A third sub-trace, comprising a plurality of third coils; and A fourth sub-trace, comprising a plurality of fourth coils, and coupled to one end of the third sub-trace at a second node, wherein the plurality of third coils and the plurality of fourth coils are arranged at intervals and are located outside the inductance device; and A capacitor, coupled between the first node and the second node.

2. The inductance device according to claim 1, wherein the first sub-trace comprises: A first end; And A second end; Wherein the second sub-trace comprises: A first end; and A second end, coupled to the second end of the first sub-trace at the first node; Wherein the third sub-trace comprises: A first end; and A second end; Wherein the fourth sub-trace comprises: A first end; and A second end, coupled to the second end of the third sub-trace at the second node.

3. The inductance device according to claim 2, wherein the first trace further comprises: A fifth sub-trace, comprising: A plurality of fifth coils, located above the plurality of first coils and coupled to the plurality of first coils; and A sixth sub-trace, comprising: A plurality of sixth coils, located above the plurality of second coils and coupled to the plurality of second coils, wherein the plurality of fifth coils and the plurality of sixth coils are arranged at intervals and are located outside the inductance device.

4. The inductance device according to claim 3, wherein the plurality of first coils and the plurality of second coils are located on a first layer, and the plurality of fifth coils and the plurality of sixth coils are located on a second layer, wherein one end of the plurality of fifth coils and one end of the plurality of first coils are coupled at the innermost side of the plurality of fifth coils, and the other end of the plurality of fifth coils and the other end of the plurality of first coils are coupled at the outermost side of the plurality of fifth coils.

5. The inductance device according to claim 4, wherein one end of the plurality of sixth coils and one end of the plurality of second coils are coupled at the innermost side of the plurality of sixth coils, and the other end of the plurality of sixth coils and the other end of the plurality of second coils are coupled at the outermost side of the plurality of sixth coils.

6. The inductance device according to claim 5, wherein the plurality of first coils and the plurality of fifth coils partially overlap, and the plurality of second coils and the plurality of sixth coils partially overlap.

7. The inductance device according to claim 6, wherein the plurality of first coils and the plurality of sixth coils partially overlap, and the plurality of second coils and the plurality of fifth coils partially overlap.

8. The inductance device according to claim 1, wherein the plurality of first coils and the plurality of second coils are disposed on a first side of the inductance device, and the plurality of third coils and the plurality of fourth coils are disposed on a second side of the inductance device, wherein the first side and the second side are located on opposite sides of the inductance device.

9. The inductance device according to claim 8, further comprising: a first connector, coupling the first sub-wire and the plurality of first coils; and a second connector, coupling the second sub-wire and the plurality of second coils; wherein the first sub-wire and the second sub-wire are located on a first layer, and the first connector and the second connector are located on a second layer, wherein the first layer is different from the second layer.

10. The inductance device according to claim 9, further comprising: a third connector, coupling the third sub-wire and the plurality of third coils; and a fourth connector, coupling the fourth sub-wire and the plurality of fourth coils; wherein the third sub-wire and the fourth sub-wire are located on the first layer, and the third connector and the fourth connector are located on the second layer.

Images