Electronic component joint structure and manufacturing method thereof

Abstract

The present invention provides a method for manufacturing a bonding structure of an electronic component, comprising the following steps. A first electronic component including a first conductive bonding portion is provided. A second electronic component including a second conductive bonding portion is provided. A first organic polymer layer is formed on the first conductive bonding portion. A second organic polymer layer is formed on the second conductive bonding portion. The first electronic component and the second electronic component are bonded through the first conductive bonding portion and the second conductive bonding portion so that the first electronic component and the second electronic component are electrically connected. After bonding, the first organic polymer layer and the second organic polymer layer diffuse into the first conductive bonding portion and the second conductive bonding portion. A bonding structure of an electronic component is also provided.

Description

Technical Field

[0001] The present invention relates to a bonding structure and a manufacturing method thereof, and in particular to a bonding structure of an electronic component and a manufacturing method thereof. Background Art

[0002] Generally speaking, there are many factors that affect the quality of electronic products. For example, in the bonding structure of electronic components, the bonding surface often has oxidation problems due to process conditions, and the surface flatness of the components to be bonded and the material properties of the components themselves (such as the material composition and grain microstructure of the material itself) will also affect the bonding strength. Therefore, how to design a bonding structure of electronic components that can effectively improve the problem of bonding surface oxidation while improving the bonding strength, thereby achieving better product quality has become a major challenge for technicians in this field. Summary of the invention

[0003] The present invention is directed to a bonding structure of an electronic component and a manufacturing method thereof, which can effectively improve the problem of bonding surface oxidation while improving the bonding strength, thereby having better product quality.

[0004] According to an embodiment of the present invention, a method for manufacturing a bonding structure of an electronic component includes but is not limited to the following steps. A first electronic component including but not limited to a first conductive bonding portion is provided. A second electronic component including but not limited to a second conductive bonding portion is provided. A first organic polymer layer is formed on the first conductive bonding portion. A second organic polymer layer is formed on the second conductive bonding portion. The first electronic component and the second electronic component are bonded through the first conductive bonding portion and the second conductive bonding portion to electrically connect the first electronic component and the second electronic component. After bonding, the first organic polymer layer and the second organic polymer layer diffuse into the first conductive bonding portion and the second conductive bonding portion.

[0005] In one embodiment of the present invention, the first conductive bonding portion and the second conductive bonding portion are metal-to-metal bonding.

[0006] In one embodiment of the present invention, the method for forming the first organic polymer layer and the second organic polymer layer is to use an organic polymer solution to perform a wet process on the first conductive joint portion and the second conductive joint portion.

[0007] In one embodiment of the present invention, the step of performing the wet process includes but is not limited to immersing the first conductive joint part and the second conductive joint part in an organic polymer solution or spraying the first conductive joint part and the second conductive joint part with the organic polymer solution.

[0008] In one embodiment of the present invention, when the material of the first conductive joint portion and the material of the second conductive joint portion are copper, the organic polymer solution includes but is not limited to compounds having nitrogen-containing functional groups, sulfur-containing functional groups or a combination thereof.

[0009] In one embodiment of the present invention, the thickness of the organic polymer layer before bonding is at least less than 2 micrometers.

[0010] In one embodiment of the present invention, before the bonding, the first organic polymer layer completely covers the exposed surface of the first conductive bonding portion, and the second organic polymer layer completely covers the exposed surface of the second conductive bonding portion.

[0011] In one embodiment of the present invention, the amount of the first organic polymer layer and the amount of the second organic polymer layer are gradually reduced during the bonding process.

[0012] In one embodiment of the present invention, the material of the first organic polymer layer is the same as the material of the second organic polymer layer.

[0013] In one embodiment of the present invention, the material of the first organic polymer layer and the material of the second organic polymer layer are not conductive.

[0014] In one embodiment of the present invention, the first electronic component and the second electronic component are bonded together by a thermal compression process.

[0015] In one embodiment of the present invention, the first organic polymer layer is further formed on a surface of the first electronic component opposite to the first conductive joint portion, and the second organic polymer layer is further formed on a surface of the second electronic component opposite to the second conductive joint portion.

[0016] According to an embodiment of the present invention, a bonding structure of an electronic component includes but is not limited to a first electronic component and a second electronic component. The first electronic component includes but is not limited to a first conductive bonding portion. The second electronic component includes but is not limited to a second conductive bonding portion. The second conductive bonding portion is bonded to the first conductive bonding portion so that the first electronic component and the second electronic component are electrically connected. The grains in the first conductive bonding portion and the second conductive bonding portion have a structure with a refined grain distribution.

[0017] In one embodiment of the present invention, the structure of the refined grain distribution is that the grain size of the grains in the first conductive joint part and the second conductive joint part near the junction of the first conductive joint part and the second conductive joint part is smaller than the grain size of the grains far from the junction of the first conductive joint part and the second conductive joint part.

[0018] In one embodiment of the present invention, the bonding of the first electronic component and the second electronic component includes but is not limited to wafer-to-wafer bonding or circuit substrate-to-circuit substrate bonding.

[0019] In an embodiment of the present invention, the first conductive joint portion and the second conductive joint portion are respectively a conductive bump and a conductive pad.

[0020] In one embodiment of the present invention, there are a plurality of the first conductive bonding portions and the second conductive bonding portions, and cavities are formed between adjacent first conductive bonding portions and adjacent second conductive bonding portions.

[0021] In one embodiment of the present invention, there is no primer in the cavity.

[0022] In an embodiment of the present invention, the first conductive joint portion is in direct contact with the second conductive joint portion.

[0023] In one embodiment of the present invention, the above-mentioned bonding structure of the electronic component further includes but is not limited to a first organic polymer layer and a second organic polymer layer. The first organic polymer layer is located on the surface of the first electronic component opposite to the first conductive bonding portion. The second organic polymer layer is located on the surface of the second electronic component opposite to the second conductive bonding portion.

[0024] Based on the above, the present invention forms an organic molecular layer on the conductive joint portion on the electronic component to be joined, so that during the joining process, the organic molecular layer can protect the conductive joint portion on the electronic component to effectively improve the problem of oxidation of the joint surface. In addition, the joining will cause the organic polymer layer to diffuse into the conductive joint portion and form new compounds in the conductive joint portion to change the grain microstructure, from a columnar microstructure to a structure with a fine grain distribution, so as to strengthen the grain microstructure in the conductive joint portion and improve the joining strength. Therefore, the joining structure of the electronic component of the present invention and the manufacturing method thereof can effectively improve the problem of oxidation of the joint surface while improving the joining strength, and thus can have better product quality.

[0025] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figures 1A to 1C is a partial cross-sectional schematic diagram of a partial manufacturing method of a bonding structure of an electronic component according to an embodiment of the present invention;

[0027] Figure 1D is a schematic diagram of a partial grain structure of a first conductive bonding portion and a second conductive bonding portion of a bonding structure of an electronic component according to an embodiment of the present invention;

[0028] Figure 1EIt is a schematic diagram of a partial grain structure of a first conductive joint portion and a second conductive joint portion of a joint structure of an electronic component in the prior art;

[0029] FIG. 2A to FIG. 2C is a partial cross-sectional schematic diagram of a partial manufacturing method of a bonding structure of an electronic component according to another embodiment of the present invention;

[0030] FIG. 3A to FIG. 3C is a partial cross-sectional schematic diagram of a partial manufacturing method of a bonding structure of an electronic component according to another embodiment of the present invention;

[0031] FIG. 4A to FIG. 4C is a partial cross-sectional schematic diagram of a partial manufacturing method of a bonding structure of an electronic component according to yet another embodiment of the present invention;

[0032] FIG. 5A to FIG. 5C FIG. 4 is a partial cross-sectional schematic diagram of a partial manufacturing method of a bonding structure of an electronic component according to yet another embodiment of the present invention. DETAILED DESCRIPTION

[0033] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0034] The above and other technical contents, features and effects of the present invention will be clearly presented in the detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as "up", "down", "front", "back", "left", "right", etc., are only the directions with reference to the attached drawings. Therefore, the directional terms used are for illustration, not for limiting the present invention.

[0035] In the detailed description of each embodiment, terms such as "first" and "second" may be used to describe different elements. These terms are only used to distinguish elements from each other, but in the structure, these elements should not be limited by these terms. For example, the first element may be referred to as the second element, and, similarly, the second element may be referred to as the first element without departing from the scope of protection of the present invention. In addition, in the manufacturing method, in addition to a specific process flow, the formation order of these elements or components should not be limited by these terms. For example, the first element may be formed before the second element. Alternatively, the first element may be formed after the second element. Alternatively, the first element and the second element may be formed in the same process or step.

[0036] In addition, the thickness of layers and regions in the drawings are exaggerated for clarity. The same or similar reference numerals represent the same or similar elements, and will not be described one by one in the following paragraphs.

[0037] Figures 1A to 1C1 is a partial cross-sectional schematic diagram of a partial manufacturing method of a bonding structure of an electronic component according to an embodiment of the present invention. In this embodiment, the manufacturing process of the bonding structure 100 of an electronic component may include but is not limited to the following steps. Figure 1D It is a partial grain structure diagram of a first conductive joint portion and a second conductive joint portion of a joint structure of an electronic component according to an embodiment of the present invention. Figure 1E It is a partial grain structure diagram of a first conductive joint portion and a second conductive joint portion of a joint structure of an electronic component in the prior art.

[0038] Please refer to Figure 1A , providing a first electronic component 110 and a second electronic component 120 , wherein the first electronic component 110 may include but is not limited to a first substrate 112 and a first conductive bonding portion 114 , and the second electronic component 120 may include but is not limited to a second substrate 122 and a second conductive bonding portion 124 .

[0039] In some embodiments, the first substrate 112 is, for example, a semiconductor wafer or a circuit substrate, and the second substrate 122 is, for example, a semiconductor wafer or a circuit substrate. For example, the first substrate 112 and the second substrate 122 are both, for example, semiconductor wafers, so the subsequent bonding of the first electronic component 110 and the second electronic component 120 can be wafer-to-wafer bonding, or the first substrate 112 and the second substrate 122 are both, for example, circuit substrates, so the subsequent bonding of the first electronic component 110 and the second electronic component 120 can be circuit substrate-to-circuit substrate bonding.

[0040] In some embodiments, the first conductive joint portion 114 and the second conductive joint portion 124 can be conductive bumps and conductive pads, respectively. Figure 1A As shown, the first conductive joint portion 114 and the second conductive joint portion 124 can both be conductive bumps, but the present invention is not limited thereto. It should be noted that the present invention does not limit the types of the first substrate 112, the second substrate 122, the first conductive joint portion 114 and the second conductive joint portion 124, which can be determined according to actual design requirements.

[0041] Please continue to refer to Figure 1A In order to protect the first electronic component 110 and the second electronic component 120 in the subsequent bonding process and effectively improve the problem of bonding surface oxidation, organic polymer layers can be formed on the portions of the first electronic component 110 and the second electronic component 120 to be bonded. For example, the first organic polymer layer 10 is formed on the first conductive bonding portion 114 of the first electronic component 110, and the second organic polymer layer 20 is formed on the second conductive bonding portion 124 of the second electronic component 120.

[0042] In this embodiment, the first organic polymer layer 10 may completely cover the exposed surface 114a of the first conductive joint portion 114, and the second organic polymer layer 20 may completely cover the exposed surface 124a of the second conductive joint portion 124. In other words, the first organic polymer layer 10 may completely cover the top surface and side walls of the first conductive joint portion 114, and the second organic polymer layer 20 may completely cover the top surface and side walls of the second conductive joint portion 124, but the present invention is not limited thereto.

[0043] In one embodiment, the organic polymer layer may have a smaller thickness before bonding. For example, the thickness 12 of the first organic polymer layer 10 and the thickness 22 of the second organic polymer layer 20 may be at least less than 2 micrometers (μm) before bonding, but the present invention is not limited thereto, and the thickness of the organic polymer layer may be adjusted according to actual conditions.

[0044] In one embodiment, the material of the first organic polymer layer 10 and the material of the second organic polymer layer 20 may not have conductivity. Furthermore, since the organic polymer layer is a thin molecular layer, even if the material of the first organic polymer layer 10 and the material of the second organic polymer layer 20 do not have conductivity, it will not substantially affect the electrical performance of the first electronic component 110 and the second electronic component 120 after being bonded, but the present invention is not limited thereto.

[0045] In some embodiments, the first organic polymer layer 10 and the second organic polymer layer 20 may be formed by using an organic polymer solution to perform a wet process on the first conductive joint portion 114 of the first electronic component 110 and the second conductive joint portion 124 of the second electronic component 120 .

[0046] For example, in one embodiment, the wet process is performed by immersing the first conductive joint portion 114 of the first electronic component 110 and the second conductive joint portion 124 of the second electronic component 120 into an organic polymer solution. However, the present invention is not limited thereto, and in another embodiment, the wet process is performed by spraying the first conductive joint portion 114 of the first electronic component 110 and the second conductive joint portion 124 of the second electronic component 120 with an organic polymer solution.

[0047] Furthermore, since the functional groups of the organic polymer solution can be selective for metals, the organic polymer layer can be formed only on the surfaces of the metal materials on the first electronic component 110 and the second electronic component 120 by using the organic polymer solution for the wet process, while the organic polymer layer will not be formed on the surfaces of the dielectric materials on the first electronic component 110 and the second electronic component 120. In other words, the above wet process can select the organic polymer solution with the corresponding functional groups according to the metal materials in the first electronic component 110 and the second electronic component 120 to form the desired organic polymer layer on the surfaces of the metal materials thereon.

[0048] Therefore, in some embodiments, when the material of the first conductive joint portion 114 of the first electronic component 110 and the second conductive joint portion 124 of the second electronic component 120 are metals, the organic polymer solution can form the first organic polymer layer 10 and the second organic polymer layer 20 on the first conductive joint portion 114 and the second conductive joint portion 124, respectively. For example, the material of the first conductive joint portion 114 and the material of the second conductive joint portion 124 are copper, nickel or gold, wherein when the material of the first conductive joint portion 114 and the material of the second conductive joint portion 124 are copper, the organic polymer solution can include but is not limited to compounds having nitrogen-containing functional groups, sulfur-containing functional groups or combinations thereof.

[0049] For example, a compound having a nitrogen-containing functional group is a compound having benzotriazole or amine, wherein the structural formula of the compound having benzotriazole can be represented by the following formula (1), formula (2), formula (3), and formula (4), and the structural formula of the compound having amine can be represented by the following formula (5) and formula (6). A compound having a sulfur-containing functional group is a compound having silane, wherein the structural formula of the compound having silane can be represented by the following formula (7). However, the present invention is not limited thereto, and the compound having a nitrogen-containing functional group or a sulfur-containing functional group can be any other suitable compound.

[0050] Formula (1)

[0051]

[0052] Formula (2)

[0053]

[0054] Formula (3)

[0055]

[0056] Formula (4)

[0057]

[0058] Formula (5)

[0059]

[0060] Wherein n is 1 or more.

[0061] Formula (6)

[0062]

[0063] Formula (7)

[0064]

[0065] In one embodiment, the first electronic component 110 and the second electronic component 120 can use the same organic polymer solution for wet processing, so the material of the first organic polymer layer 10 and the material of the second organic polymer layer 20 can be the same, so that the first organic polymer layer 10 and the second organic polymer layer 20 can be diffused evenly during subsequent diffusion to achieve better product quality.

[0066] It should be noted that the present invention does not limit the concentration of the organic polymer solution, and the concentration of the organic polymer solution can be adjusted according to actual design requirements.

[0067] Please also refer to Figure 1B and Figure 1C In this embodiment, the first electronic component 110 and the second electronic component 120 are bonded by the first conductive bonding part 114 and the second conductive bonding part 124, so that the first electronic component 110 and the second electronic component 120 are electrically connected, wherein after bonding, the first organic polymer layer 10 and the second organic polymer layer 20 diffuse into the first conductive bonding part 114 and the second conductive bonding part 124, so that the grains in the first conductive bonding part 114 and the second conductive bonding part 124 have a structure with a refined grain distribution. For example, Figure 1D As shown, the structure of the fine grain distribution can be that the grain size of the grains in the first conductive joint portion 114 and the second conductive joint portion 124 near the joint B1 of the first conductive joint portion 114 and the second conductive joint portion 124 is smaller than the grain size of the grains far from the joint B1 of the first conductive joint portion 114 and the second conductive joint portion 124. Therefore, compared with the prior art (such as Figure 1EAs shown, the grain size of the grains in the first conductive joint 1141 and the second conductive joint 1241 near the joint B2 between the first conductive joint 1141 and the second conductive joint 1241 is similar to the grain size of the grains far away from the joint B2 between the first conductive joint 1141 and the second conductive joint 1241. The joining structure 100 of the electronic component of this embodiment can effectively improve the problem of oxidation of the joining surface while improving the joining strength, thereby having better product quality.

[0068] In some embodiments, when the material of the first conductive joint portion 114 and the second conductive joint portion 124 is copper, the grain size of the first conductive joint portion 114 and the second conductive joint portion 124 near the junction B1 of the first conductive joint portion 114 and the second conductive joint portion 124 can be 0.1 micrometer to 0.4 micrometer, and the grain size of the first conductive joint portion 114 and the second conductive joint portion 124 away from the junction B1 of the first conductive joint portion 114 and the second conductive joint portion 124 can be greater than 1 micrometer. In comparison, in the prior art, the first conductive joint portion 114 and the second conductive joint portion 124 have a larger grain size than the first conductive joint portion 114. The grain size of the grains in the first conductive joint part 1141 and the second conductive joint part 1241 close to the joint B2 between the first conductive joint part 1141 and the second conductive joint part 1241 can be 0.5 microns to 1 micron, while the grain size of the grains in the first conductive joint part 1141 and the second conductive joint part 1241 away from the joint B2 between the first conductive joint part 1141 and the second conductive joint part 1241 can be greater than 1 micron. Therefore, the joining structure 100 of the electronic component of this embodiment can effectively improve the problem of oxidation of the joining surface while improving the joining strength, thereby having better product quality.

[0069] In some embodiments, the first conductive joint portion 114 and the second conductive joint portion 124 may be joined under a low temperature process, and the temperature of the low temperature process is, for example, between 200°C and 250°C. Generally, when the bonding is performed under a low temperature process, it is difficult for the copper grains at the bonding interface to be recrystallized due to the working temperature and pressure, resulting in the grains at the interface being relatively large and of different sizes. The manufacturing method of the joining structure 100 of the electronic component of the present embodiment can make the grains in the first conductive joint portion 114 and the second conductive joint portion 124 have a structure with a refined grain distribution. Therefore, even if the bonding is performed under a low temperature process, the grain size B1 at the bonding interface will have better uniformity, but the present invention is not limited to this.

[0070] Furthermore, an organic molecular layer (such as the first organic molecular layer 10 and the second organic molecular layer 20) is formed on the conductive bonding parts (such as the first conductive bonding parts 114 and the second conductive bonding parts 124) on the electronic components to be bonded (such as the first electronic component 110 and the second electronic component 120). Therefore, during the bonding process, the organic molecular layer (such as the first organic molecular layer 10 and the second organic molecular layer 20) can protect the conductive bonding parts (such as the first conductive bonding parts 114 and the second conductive bonding parts 124) on the electronic components (such as the first electronic component 110 and the second electronic component 120) to effectively improve the problem of bonding surface oxidation. In addition, the bonding causes the organic polymer layer (such as the first organic molecular layer 10 and the second organic molecular layer 20) to diffuse into the conductive bonding part (such as the first conductive bonding part 114 and the second conductive bonding part 124) and form new compounds in the conductive bonding part (such as the first conductive bonding part 114 and the second conductive bonding part 124) to change the grain microstructure, from the columnar microstructure to a structure with more refined grain distribution, so as to strengthen the grain microstructure in the conductive bonding part (such as the first conductive bonding part 114 and the second conductive bonding part 124) and improve the bonding strength. Therefore, the bonding structure of the electronic component of the present embodiment and the manufacturing method thereof can effectively improve the problem of bonding surface oxidation while improving the bonding strength, thereby having better product quality.

[0071] In one embodiment, since the first organic polymer layer 10 and the second organic polymer layer 20 diffuse into the first conductive joint portion 114 and the second conductive joint portion 124, the amount of the first organic polymer layer 10 and the amount of the second organic polymer layer 20 gradually decrease when joining. In other words, the thickness 12 of the first organic polymer layer 10 and the thickness 22 of the second organic polymer layer 20 gradually become thinner.

[0072] In this embodiment, if Figure 1C As shown, the first organic polymer layer 10 and the second organic polymer layer 20 located at the joint surface of the first electronic component 110 and the second electronic component 120 can be completely diffused into the first conductive joint portion 114 and the second conductive joint portion 124, so that the first conductive joint portion 114 and the second conductive joint portion 124 can directly contact each other after joining.

[0073] On the other hand, the first organic polymer layer 10 and the second organic polymer layer 20 located on the side walls of the first electronic component 110 and the second electronic component 120 may be partially diffused into the first conductive joint portion 114 and the second conductive joint portion 124, and the first organic polymer layer 10 and the second organic polymer layer 20 may form a continuous side wall. In other words, there is no interface between the first organic polymer layer 10 and the second organic polymer layer 20. However, the present invention is not limited to this. In other embodiments not shown, the first organic polymer layer 10 and the second organic polymer layer 20 located on the side walls of the first electronic component 110 and the second electronic component 120 may also be completely diffused into the first conductive joint portion 114 and the second conductive joint portion 124, so that no organic polymer layer may remain on the joint structure 100 of the electronic component. It should be noted that for the sake of clarity, Figure 1B to Figure 1C The change in the sidewall thickness of the first organic polymer layer 10 and the second organic polymer layer 20 is not shown.

[0074] In one embodiment, the first electronic component 110 and the second electronic component 120 can be bonded by a thermal compression process, so the temperature and pressure provided in the process can further promote the diffusion of the first organic polymer layer 10 and the second organic polymer layer 20 into the first conductive bonding portion 114 and the second conductive bonding portion 124, and form new compounds in the conductive bonding portion to change the grain microstructure, thereby further ensuring that the bonding strength can be effectively improved. However, the present invention is not limited to this, and in other embodiments, the first electronic component 110 and the second electronic component 120 can also be bonded by other suitable processes.

[0075] In one embodiment, when the material of the first conductive bonding portion 114 and the second conductive bonding portion 124 are metal, the first conductive bonding portion 114 and the second conductive bonding portion 124 may be metal-to-metal bonded, but the present invention is not limited thereto.

[0076] In this embodiment, there may be a plurality of first conductive bonding portions 114 and second conductive bonding portions 124, and a cavity C may be formed between adjacent first conductive bonding portions 114 and second conductive bonding portions 124, such as Figure 1C Furthermore, since the first conductive joint portion 114 and the second conductive joint portion 124 have been effectively protected by the aforementioned manufacturing method, the cavity C may not have an underfill to further save costs, but the present invention is not limited thereto.

[0077] FIG. 2A to FIG. 2C It is a partial cross-sectional schematic diagram of a partial manufacturing method of a bonding structure of an electronic component according to another embodiment of the present invention. FIG. 3A to FIG. 3CFIG. 4 is a partial cross-sectional schematic diagram of a partial manufacturing method of a bonding structure of an electronic component according to another embodiment of the present invention.

[0078] Please also refer to FIG. 2A to FIG. 2C and FIG. 3A to FIG. 3C ,and Figures 1A to 1C Similar, FIG. 2A to FIG. 2C The electronic component bonding structure 200 and FIG. 3A to FIG. 3C The electronic component bonding structure 300 is an example of bonding of circuit substrates to circuit substrates.

[0079] Furthermore, FIG. 2A to FIG. 2C The first substrate 212 of the first electronic component 210 of the embodiment may be an IC (integrated circuit) substrate, and the second substrate 222 of the second electronic component 220 may be a fine line substrate, wherein the definition of a fine line substrate is, for example, a chip scale package (CSP) with a circuit design below 15um, a ball grid array (BGA), a square glass substrate, and a wafer substrate, but the present invention is not limited thereto. In addition, FIG. 2A to FIG. 2C The first conductive joint portion 214 of the first electronic component 210 of the embodiment is a conductive pad, and the second conductive joint portion 224 of the second electronic component 220 is a conductive bump.

[0080] on the other hand, FIG. 3A to FIG. 3C The first substrate 312 of the first electronic component 310 and the second substrate 322 of the second electronic component 320 of the embodiment may be double-sided circuit substrates. FIG. 3A to FIG. 3C The first conductive joint portion 314 of the first electronic component 310 of the embodiment is a conductive bump, and the second conductive joint portion 324 of the second electronic component 320 is a conductive bump.

[0081] FIG. 4A to FIG. 4C FIG. 1 is a partial cross-sectional schematic diagram of a partial manufacturing method of a bonding structure of an electronic component according to another embodiment of the present invention. FIG. 3A to FIG. 3C Similar, but with the difference that FIG. 4A to FIG. 4CThe first organic polymer layer 10 of the bonding structure 300a of the electronic element can be further formed on the surface 310a of the first electronic component 310 relative to the first conductive bonding part 314, and the second organic polymer layer 20 can be further formed on the surface 320a of the second electronic component 320 relative to the second conductive bonding part 324. Therefore, the first organic polymer layer 10 and the second organic polymer layer 20 can respectively protect the conductive components on the surface 310a of the first electronic component 310 relative to the first conductive bonding part 314 and the conductive components on the surface 320a of the second electronic component 320 relative to the second conductive bonding part 324, thereby reducing the probability of oxidation. In this embodiment, the first organic polymer layer 10 may be formed only on the first conductive connector 316 on the surface 310a of the first conductive joint 314, and the second organic polymer layer 20 may be formed only on the second conductive connector 326 on the surface 320a of the second conductive joint 324, but the present invention is not limited to this. In other embodiments, the coverage of the first organic polymer layer 10 and the second organic polymer layer 20 can be adjusted.

[0082] FIG. 5A to FIG. 5C FIG. 1 is a partial cross-sectional schematic diagram of a partial manufacturing method of a bonding structure of an electronic component according to yet another embodiment of the present invention. FIG. 4A to FIG. 4C Similar, but with the difference that FIG. 5A to FIG. 5C The first organic polymer layer 10 of the bonding structure 300b of the electronic component may be fully covered on the surface 310a of the first electronic component 310 opposite to the first conductive bonding portion 314, and the second organic polymer layer 20 may be fully covered on the surface 320a of the second electronic component 320 opposite to the second conductive bonding portion 324. In this embodiment, the first organic polymer layer 10 may cover the first substrate 312 of the first electronic component 310, and the second organic polymer layer 20 may cover the second substrate 322 of the second electronic component 320.

[0083] It should be noted that the present invention is not limited to the types of circuit substrates in the above embodiments. As long as the circuit substrates can have conductive joints for mutual bonding, they all fall within the protection scope of the present invention.

[0084] In summary, the present invention forms an organic molecular layer on the conductive joint portion on the electronic component to be joined, so that during the joining process, the organic molecular layer can protect the conductive joint portion on the electronic component to effectively improve the problem of oxidation of the joint surface. In addition, the joining will cause the organic polymer layer to diffuse into the conductive joint portion and form new compounds in the conductive joint portion to change the grain microstructure, from a columnar microstructure to a structure with more refined grain distribution, so as to strengthen the grain microstructure in the conductive joint portion and improve the joining strength. Therefore, the joining structure of the electronic component of the present invention and the manufacturing method thereof can effectively improve the problem of oxidation of the joint surface while improving the joining strength, and thus can have better product quality.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for manufacturing a bonding structure of an electronic component, characterized in that: include: providing a first electronic component including a first conductive junction; providing a second electronic component including a second conductive junction; forming a first organic polymer layer on the first conductive joint portion; as well as forming a second organic polymer layer on the second conductive joint portion, The first electronic component and the second electronic component are joined by the first conductive joint part and the second conductive joint part so as to electrically connect the first electronic component and the second electronic component, wherein after the joining, the first organic polymer layer and the second organic polymer layer diffuse into the first conductive joint part and the second conductive joint part, and the grains in the first conductive joint part and the second conductive joint part have a structure of fine grain distribution.

2. The method for manufacturing a joint structure of an electronic component according to claim 1, characterized in that: The first conductive bonding portion and the second conductive bonding portion are metal-to-metal bonded.

3. The method for manufacturing a joint structure of an electronic component according to claim 1, characterized in that: The first organic polymer layer and the second organic polymer layer are formed by using an organic polymer solution to perform a wet process on the first conductive joint portion and the second conductive joint portion.

4. The method for manufacturing a joint structure of an electronic component according to claim 3, characterized in that: The steps of performing the wet process include: Immersing the first conductive joint part and the second conductive joint part in the organic polymer solution; or The organic polymer solution is sprayed onto the first conductive bonding portion and the second conductive bonding portion.

5. The method for manufacturing a joint structure of an electronic component according to claim 3, characterized in that: When the material of the first conductive joint portion and the material of the second conductive joint portion are copper, the organic polymer solution includes a compound having a nitrogen-containing functional group, a sulfur-containing functional group or a combination thereof.

6. The method for manufacturing a joint structure of an electronic component according to claim 1, characterized in that: The thickness of the organic polymer layer before the bonding is at least less than 2 microns.

7. The method for manufacturing a joint structure of an electronic component according to claim 1, characterized in that: Before performing the above described joining: The first organic polymer layer completely covers the exposed surface of the first conductive joint portion; and The second organic polymer layer completely covers the exposed surface of the second conductive joint portion.

8. The method for manufacturing a joint structure of an electronic component according to claim 1, characterized in that: During the bonding, the amount of the first organic polymer layer and the amount of the second organic polymer layer gradually decrease.

9. The method for manufacturing a joint structure of an electronic component according to claim 1, characterized in that: The material of the first organic polymer layer is the same as that of the second organic polymer layer.

10. The method for manufacturing a joint structure of an electronic component according to claim 1, characterized in that: The material of the first organic polymer layer and the material of the second organic polymer layer are not conductive.

11. The method for manufacturing a joint structure of an electronic component according to claim 1, characterized in that: The first electronic component and the second electronic component are bonded by a thermal compression process.

12. The method for manufacturing a bonding structure of an electronic component according to claim 1, wherein: The first organic polymer layer is further formed on a surface of the first electronic component opposite to the first conductive joint portion; and The second organic polymer layer is further formed on a surface of the second electronic component opposite to the second conductive bonding portion.

13. A bonding structure of an electronic component, characterized in that: include: A first electronic component including a first conductive bonding portion; A second electronic component including a second conductive bonding portion; A first organic polymer layer, located on a side wall of the first electronic component; as well as The second organic polymer layer is located on the side wall of the second electronic component, wherein: The second conductive joint portion is joined to the first conductive joint portion so that the first electronic component is electrically connected to the second electronic component; The crystal grains in the first conductive joint portion and the second conductive joint portion have a structure of fine grain distribution.

14. The electronic component bonding structure according to claim 13, characterized in that: The structure of the refined grain distribution is that the grain size of the grains in the first conductive joint part and the second conductive joint part near the joint of the first conductive joint part and the second conductive joint part is smaller than the grain size of the grains far from the joint of the first conductive joint part and the second conductive joint part.

15. The electronic component bonding structure according to claim 13, characterized in that: The bonding of the first electronic component and the second electronic component includes wafer-to-wafer bonding or circuit substrate-to-circuit substrate bonding.

16. The electronic component bonding structure according to claim 13, characterized in that: The first conductive joint portion and the second conductive joint portion are a conductive bump and a conductive pad respectively.

17. The electronic component bonding structure according to claim 13, characterized in that: There are a plurality of the first conductive bonding parts and the second conductive bonding parts, and cavities are formed between adjacent first conductive bonding parts and adjacent second conductive bonding parts.

18. The electronic component bonding structure according to claim 17, characterized in that: There is no primer in the cavity.

19. The electronic component bonding structure according to claim 13, characterized in that: The first conductive joining portion is in direct contact with the second conductive joining portion.

20. The electronic component bonding structure according to claim 13, characterized in that: The first organic polymer layer is also located on the surface of the first electronic component opposite to the first conductive joint portion; and The second organic polymer layer is also located on the surface of the second electronic component opposite to the second conductive bonding portion.

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