EEPROM for camera module, camera module

Abstract

An EEPROM for a camera module and a camera module are disclosed. The EEPROM for the camera module includes at least a sensor chip and a capacitor. The capacitor is rectangular when viewed from above. The EEPROM includes a chip body and solder contacts located at the bottom of the chip body. The chip body is rectangular when viewed from above, and the length difference between the wide side of the chip body and the wide side of the capacitor is within a preset deviation range. This EEPROM for the camera module effectively reduces the size of the camera module.

Description

Technical Field

[0001] The present invention relates to the field of chip technology, and in particular to an EEPROM for a camera module and a camera module. Background Art

[0002] With the rapid development of mobile phones, the relative ratio of the screen and the front panel area of ​​the mobile phone, that is, the screen-to-body ratio, is becoming more and more extreme. The larger the battery, the more space other components are squeezed. The size of the mobile phone's camera module (also called fixed-focus module) is also becoming more and more extreme. The size of the front and rear camera modules needs to be as small as possible.

[0003] In addition to image sensors, other components in mobile phone camera modules include capacitors, resistors, motor drivers, and electrically erasable programmable read-only memory (EEPROM). EEPROM can burn certain information to improve the consistency of the entire batch of modules, allowing the modules to achieve higher image quality on the mobile phone. Due to the inherent size of the voice coil motor (VCM) motor (also known as voice coil motor), the autofocus module has relatively free space for component placement. In the case of extreme ornaments, since the camera module does not require a motor driver, the biggest bottleneck is the EEPROM. Summary of the invention

[0004] The technical problem solved by the present invention is how to provide an EEPROM for a camera module, thereby effectively reducing the size of the camera module.

[0005] To solve the above technical problems, an embodiment of the present invention provides an EEPROM for a camera module, wherein the camera module at least includes a sensor chip and a capacitor, wherein the capacitor is rectangular when viewed from above, and the EEPROM includes a chip body and solder contacts located at the bottom of the chip body, wherein the chip body is rectangular when viewed from above, and the length difference between the wide side of the chip body and the wide side of the capacitor is within a preset deviation range.

[0006] Optionally, the width of the chip body is equal to the width of the capacitor.

[0007] Optionally, the welding contact point includes a plurality of spherical welding contact points.

[0008] Optionally, the plurality of spherical solder contact points are arranged in sequence along a central axis of the chip body parallel to the long side.

[0009] Optionally, the plurality of spherical solder contact points are arranged in a staggered manner relative to a central axis of the chip body that is parallel to the long side.

[0010] Optionally, the welding contact point includes a plurality of strip-shaped welding contact points.

[0011] Optionally, the plurality of strip-shaped solder contact points are arranged in parallel in sequence and parallel to the wide side of the chip body.

[0012] An embodiment of the present invention further provides a camera module, which includes a sensor chip, a capacitor and a free area, wherein the size of the free area matches the size of any of the above-mentioned EEPROMs used for the camera module, and the free area is used to set the EEPROM.

[0013] Optionally, the idle area includes pads corresponding to respective solder contacts of the EEPROM.

[0014] An embodiment of the present invention further provides a camera module, which includes a sensor chip, a capacitor, and any one of the above-mentioned EEPROMs for the camera module.

[0015] Compared with the prior art, the technical solution of the embodiment of the present invention has the following beneficial effects:

[0016] The EEPROM for the camera module provided by the present invention increases the aspect ratio of the EEPROM so that the wide side of the EEPROM is close to the wide side of the capacitor, so that the EEPROM can be placed at the position where the capacitor is placed, thereby reducing the restriction of the EEPROM on the module size and effectively reducing the size of the camera module after the EEPROM is added.

[0017] Furthermore, several ball-shaped soldering contacts of the EEPROM are arranged in a staggered manner relative to the central axis of the chip body parallel to the long side. At this time, the soldering contacts form a triangular relationship, and the stability between the contacts is higher, which can effectively avoid the displacement of the EEPROM after soldering caused by the ball-shaped soldering contacts, and improve the stability of the chip after soldering. In addition, each solder ball is independently arranged, which will not hinder the wiring of other devices.

[0018] Furthermore, setting several welding contact points of the EEPROM as welding rods can also effectively prevent chip displacement after welding caused by the arc-shaped contact surface of the solder ball, thereby improving the stability of the chip after welding. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A top view of a first camera module in the prior art is provided;

[0020] Figure 2 A top view of a second camera module in the prior art is provided;

[0021] Figure 3 A top view of a third camera module in the prior art is provided;

[0022] Figure 4 A top view of a camera module in an embodiment of the present invention is provided;

[0023] Figure 5 A top view showing the distribution of solder contacts of an EEPROM in the prior art;

[0024] Figure 6 A bottom view showing the distribution of solder contacts of an EEPROM in the prior art;

[0025] Figure 7 A side view showing the distribution of solder contacts of an EEPROM in the prior art;

[0026] Figure 8 A schematic diagram of a spherical welding contact point according to an embodiment of the present invention;

[0027] Fig. 9 A top view of the distribution of solder contacts of an EEPROM in an embodiment of the present invention;

[0028] Fig.10 A top view showing the distribution of solder contacts of another EEPROM in an embodiment of the present invention;

[0029] Fig.11 A bottom view showing the distribution of solder contacts of another EEPROM in an embodiment of the present invention;

[0030] Fig.12 A side view showing the distribution of solder contacts of another EEPROM in an embodiment of the present invention;

[0031] Fig.13 A schematic diagram of the distribution of strip solder contacts of an EEPROM according to an embodiment of the present invention. DETAILED DESCRIPTION

[0032] As mentioned in the background technology, the size of current camera modules (also called fixed-focus modules) is limited mainly by the size of EEPROM. The three existing camera modules are: low-pixel (image capacity is 2 megabytes (M)) fixed-focus modules. Since the image sensor does not have a built-in one-time programmable memory (OTP) or the built-in OTP capacity is small, the EEPROM can only be placed by increasing the area of ​​the module.

[0033] For low-pixel (image capacity of 5M, 8M, 13M) fixed-focus modules, the image sensor has a built-in OTP. When the capacity is large enough, it can replace EEPROM to burn the module information. However, OTP is different from EEPROM. It cannot be erased after writing, and the writing speed is slow. The module factory's burning efficiency will be reduced, and it may also cause poor burning and cause the module to be scrapped. Therefore, during use, mobile phone manufacturers will also add EEPROM to such fixed-focus modules to improve storage capacity.

[0034] The high-pixel (image capacity is 16M, 20M, 24M, 32M) fixed-focus module adopts an image sensor stacking solution to make the image sensor size as small as possible to match peripheral components. This will greatly increase the cost of the image sensor, and the stacked chip is more likely to heat up, resulting in a decrease in image quality.

[0035] For the existing camera modules listed above, if you need to add EEPROM, please refer to the attached Figures 1 to 3 , Figures 1 to 3 Provided are top views of three camera modules in the prior art. Figures 1 to 3 Taking the camera sensor chip GC5035 (shown as 103) as an example, when only GC5035103 and 6 capacitors (shown as 102) are packaged, the packaged camera module ( Figure 1 The length and width of the 101 are 5.17 millimeters (mm) and 4.73 mm respectively. The arrangement of the capacitor and the camera chip is as follows Figure 1 When GC5035103 is packaged with 6 capacitors (102 in the figure) and EEPROM 202, the arrangement is as follows Figure 2 As shown, the packaged camera module (i.e. Figure 2 The length and width of the 201) are 5.72mm and 4.73mm respectively. For specific dimensions, please refer to Figure 2 When GC5035103 is packaged with 7 capacitors (102 in the figure) and EEPROM 202, the arrangement is as follows Figure 3 As shown, the packaged camera module (i.e. Figure 3 The length and width of 301 are 4.37mm and 6.48mm respectively. For specific dimensions, please refer to Figure 3 It should be noted that the length and width of the chip are accurate to two decimal places. Due to the omission of some digits, there may be measurement errors.

[0036] According to the attached Figures 1 to 3 It can be seen that for the existing camera module, if it is necessary to add EEPROM, since the current standard size of EEPROM does not match the size of other devices in the current camera module, the EEPROM can only be placed by increasing the area of ​​the module.

[0037] Therefore, there is an urgent need to provide an EEPROM for a camera module to effectively reduce the size of the camera module after adding the EEPROM.

[0038] To solve the above problems, an embodiment of the present invention provides an EEPROM for a camera module, wherein the camera module at least includes a sensor chip and a capacitor, wherein the capacitor is rectangular when viewed from above, and the EEPROM includes a chip body and solder contacts located at the bottom of the chip body, wherein the chip body is rectangular when viewed from above, and the length difference between the wide side of the chip body and the wide side of the capacitor is within a preset deviation range.

[0039] Through this method, the size of the EEPROM can be matched with the size of the capacitor, so that the camera module can use the position where the capacitor is placed or the empty space near the capacitor to place the EEPROM without increasing the size of the module, thereby effectively reducing the size of the camera module.

[0040] In order to make the above-mentioned objects, features and beneficial effects of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0041] An embodiment of the present invention provides an EEPROM for a camera module, wherein the camera module at least includes a sensor chip and a capacitor, wherein the capacitor is rectangular when viewed from above, and the EEPROM includes a chip body and solder contacts located at the bottom of the chip body, wherein the chip body is rectangular when viewed from above, and the length difference between the wide side of the chip body and the wide side of the capacitor is within a preset deviation range.

[0042] In this embodiment, the chip body of the EEPROM is set to a rectangle with a width close to that of the capacitor, so that when the sensor chip, capacitor, and EEPROM are packaged, the occupied width of the EEPROM is close to that of the capacitor, thereby further reducing the size of the camera module after packaging.

[0043] Optionally, the preset deviation range is used to limit the width of the chip body of the EEPROM and the width of the capacitor, and can be specifically defined according to the manufacturing process of the EEPROM and the size requirements of the camera module. When the preset deviation range is smaller than the length difference between the wide side of the existing EEPROM chip body and the wide side of the capacitor, the size of the camera module can be reduced. The preset deviation range can be a specific value, such as 0.05mm, 0.1mm, 0.5mm, etc., or it can be a relative ratio, for example, the preset deviation range can be a specific ratio of the smaller value of the long side and the wide side (for example, 1%, 3%, 5%, etc.).

[0044] Optionally, the length of the wide side of the chip body is equal to the length of the wide side of the capacitor. Equality here includes that the two are completely equal, and also includes that the error between the two is within the error range allowed by processing.

[0045] See also Figure 4 , Figure 4 A schematic diagram of the arrangement of components in a camera module in an embodiment of the present invention is provided; this embodiment is also based on Figures 1 to 3 For example, when the EEPROM 402 is made into a rectangular shape instead of a traditional nearly square shape, and the wide side of the EEPROM 402 is close to the wide side of the capacitor, the EEPROM 402 and the capacitor can be combined according to Figure 4 Arranged in a way to effectively save space. Figure 4 The length and width of the camera module 401 after packaging are 5.21 mm and 4.95 mm respectively. Figures 1 to 3 The size of existing camera modules in the market is smaller.

[0046] In this embodiment, by increasing the aspect ratio of the EEPROM, the wide side of the EEPROM is made close to the wide side of the capacitor, so that the EEPROM can be placed in the position where the capacitor is placed, thereby reducing the limitation of the EEPROM on the module size and effectively reducing the size of the camera module after adding the EEPROM.

[0047] See also Figures 5 to 7 , Figures 5 to 7 The top view, bottom view and side view are respectively showing the distribution of solder contacts of an EEPROM in the prior art; the EEPROM may include four solder contacts corresponding to four pins of a power supply voltage VCC, a common ground terminal VSS, a clock signal SCL and a data signal SDA.

[0048] Please refer to Table 1, which shows the relevant parameter values ​​of this type of EEPROM and one of the EEPROM instances (Typ), where the unit of each dimension is millimeter (mm):

[0049] Table 1

[0050] Reference Numbers Minimum value (Min) Example value (Typ) Maximum value (Max) A 0.250 0.275 0.300 A1 0.1875 0.200 0.2125 A2 0.0425 0.050 0.0575 A3 0.02 0.025 0.03 b 0.160 D 0.610 0.630 0.670 E 0.600 0.620 0.660 e - 0.400 - e1 - 0.400 - F - 0.110 - G - 0.115 -

[0051] In one embodiment, the solder contacts include a plurality of spherical solder contacts (also called solder balls).

[0052] After the EEPROM is designed into a rectangular shape, the EEPROM can be connected to the welding board through several welding contacts at the bottom of the chip body to be connected to the camera module. The welding contacts can be as follows Figure 8 The solder balls shown, such as Figure 8 As shown, the contact surface between the solder ball and the solder plate is an arc-shaped contact surface.

[0053] Optionally, the plurality of spherical solder contact points are arranged in sequence along a central axis of the chip body parallel to the long side, for example, evenly arranged along the central axis parallel to the long side.

[0054] See also Fig. 9 , Fig. 9 FIG. 1 is a top view of the distribution of solder contacts of an EEPROM in an embodiment of the present invention; that is, each solder contact can be arranged according to Fig. 9 The central axis parallel to the long side is arranged in sequence. At this time, the length of the wide side of the EEPROM should be the shortest.

[0055] Optionally, the EEPROM may include four solder contacts corresponding to four pins of a power supply voltage VCC, a common ground terminal VSS, a clock signal SCL and a data signal SDA.

[0056] Optionally, the plurality of spherical solder contacts are arranged in a staggered manner relative to the central axis of the chip body parallel to the long side. Further, for two solder contacts that are adjacent in position or continuous in arrangement, one solder contact is located on one side of the central axis, and the other solder contact is located on the other side of the central axis.

[0057] See also Figures 10 to 12 , Figures 10 to 12 They are respectively a top view, a bottom view and a side view of the distribution of solder contacts of another EEPROM in an embodiment of the present invention; the EEPROM may include four solder contacts corresponding to four pins of a power supply voltage VCC, a common ground terminal VSS, a clock signal SCL and a data signal SDA.

[0058] Please refer to Table 2, which shows the relevant parameter values ​​of this type of EEPROM and one of the EEPROM instances (Typ), where the unit of each dimension is millimeter (mm):

[0059] Table 2

[0060] Reference Numbers Minimum value (Min) Example value (Typ) Maximum value (Max) A 0.220 0.245 0.270 A1 0.1575 0.170 0.1825 A2 0.0425 0.050 0.0575 A3 0.02 0.025 0.03 b 0.150 D 1.090 1.110 1.150 E 0.300 0.320 0.360 e - 0.300 - e1 - 0.3195 - e2 - 0.110 -

[0061] Combining the length (see D in Table 1 or 2) and width (see E in Table 1 or 2) of the EEPROM in Table 1 and Table 2, it can be seen that there is a difference between the size of the existing EEPROM and the size of the EEPROM provided in this embodiment.

[0062] It should be noted that the number and arrangement order of the solder contacts of the EEPROM include but are not limited to: Figures 5 to 12 The situation shown.

[0063] In this embodiment, the plurality of solder contacts of the EEPROM are arranged relative to the central axis of the chip body parallel to the long side. Fig.10 and11 As shown, the soldering contacts are arranged in a staggered manner from top to bottom. At this time, the soldering contacts form a triangular relationship, and the stability between the contacts is higher, which can effectively avoid the displacement of the EEPROM after soldering due to the spherical soldering contacts, and improve the stability of the chip after soldering. In addition, each solder ball is set independently and will not hinder the wiring of other devices.

[0064] In one embodiment, the welding contact points include a plurality of strip-shaped welding contact points (also called welding rods).

[0065] Optionally, the plurality of strip-shaped solder contact points are arranged in parallel in sequence and parallel to the wide side of the chip body.

[0066] See also Fig.13 , Fig.13 The figure is a schematic diagram of the distribution of strip-shaped welding contacts of an EEPROM according to an embodiment of the present invention, wherein the shaded area is welding rods. A plurality of welding rods are sequentially distributed along the long sides.

[0067] Optionally, the plurality of welding rods may be parallel to the wide side of the chip body.

[0068] Setting several welding contact points of the EEPROM as welding rods can also effectively prevent the chip from being displaced after welding due to the arc-shaped contact surface of the solder ball, thereby improving the stability of the chip after welding.

[0069] Optionally, the method of connecting the EEPROM to the camera module in the present invention can be implemented through surface mounting technology (Surface Mounted Technology, referred to as SMT).

[0070] An embodiment of the present invention further provides a camera module, which includes a sensor chip, a capacitor and a free area, wherein the size of the free area matches the size of any of the above-mentioned EEPROMs used for the camera module, and the free area is used to set the EEPROM.

[0071] Optionally, the idle area includes pads corresponding to respective solder contacts of the EEPROM.

[0072] That is, a camera module for placing the EEPROM of any of the above embodiments can be provided, and a free area for placing the EEPROM is vacated in the camera module, so that the EEPROM can be connected to the camera module when needed to improve the data storage capacity of the camera module. The free area and the EEPROM are corresponding rectangles, and the size of the free area can be slightly larger than the size of the EEPROM to ensure welding.

[0073] Pads corresponding to the respective soldering contacts of the EEPROM may be further provided in the vacant area to facilitate soldering of the respective soldering contacts of the EEPROM.

[0074] An embodiment of the present invention further provides a camera module, which includes a sensor chip, a capacitor, and any one of the above-mentioned EEPROMs for the camera module.

[0075] A camera module including the EEPROM of any of the above embodiments may also be provided, that is, the EEPROM is directly packaged into the camera module. A device distribution of the camera module is as follows Figure 4 shown.

[0076] It should be understood that the term "and / or" in this article is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article indicates that the associated objects before and after are in an "or" relationship.

[0077] The "plurality" appearing in the embodiments of the present application refers to two or more.

[0078] The first, second, etc. descriptions appearing in the embodiments of the present application are only used for illustration and distinction of the description objects. There is no order, nor do they indicate any special limitation on the number of devices in the embodiments of the present application, and cannot constitute any limitation on the embodiments of the present application.

[0079] The "connection" that appears in the embodiments of the present application refers to various connection methods such as direct connection or indirect connection to achieve communication between devices, and the embodiments of the present application do not impose any limitations on this.

[0080] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. An EEPROM for a camera module, the camera module comprising at least a sensor chip and a capacitor, the capacitor being rectangular in a top view, the EEPROM comprising a chip body and solder contacts at the bottom of the chip body, characterized in that: The chip body is rectangular when viewed from above, and the length difference between the wide side of the chip body and the wide side of the capacitor is within a preset deviation range; wherein the preset deviation range is defined according to the manufacturing process of the EEPROM and the size requirements of the camera module.

2. The EEPROM according to claim 1, characterized in that The length of the wide side of the chip body is equal to the length of the wide side of the capacitor.

3. The EEPROM according to claim 1, characterized in that: The welding contacts include a plurality of spherical welding contacts.

4. The EEPROM according to claim 3, characterized in that: The plurality of spherical solder contact points are arranged in sequence along a central axis of the chip body parallel to the long side.

5. The EEPROM according to claim 3, characterized in that: The plurality of spherical solder contact points are arranged in a staggered manner relative to a central axis of the chip body parallel to the long side.

6. The EEPROM according to claim 1, characterized in that: The welding contact points include a plurality of strip-shaped welding contact points.

7. The EEPROM according to claim 6, characterized in that: The plurality of strip-shaped solder contact points are arranged in parallel in sequence and parallel to the wide side of the chip body.

8. A camera module, characterized in that: The camera module includes a sensor chip, a capacitor and a free area, the size of the free area matches the size of the EEPROM used for the camera module as claimed in any one of claims 1 to 7, and the free area is used to set the EEPROM.

9. The camera module according to claim 8, characterized in that: The idle area includes pads corresponding to respective solder contacts of the EEPROM.

10. A camera module, characterized in that: The camera module comprises a sensor chip, a capacitor and the EEPROM for the camera module as claimed in any one of claims 1 to 7.

Images