Thermal management device

Abstract

The thermal management device disclosed in the present invention includes a first connector, a connecting block and a heat exchange core. The first connector is fixed to the connecting block, and a first connecting channel formed on the first connector is connected to the valve chamber of the thermal management device. The throttled refrigerant is connected to the first channel of the heat exchange core through the first connecting port located in the connecting block. Part of the first connector is located in the first channel, so that the structure of the thermal management device is relatively compact, which is conducive to miniaturization.

Description

Technical Field

[0001] The present invention relates to the technical field of thermal management, and in particular to a thermal management device. Background Art

[0002] The thermal management system includes a heat exchanger and an expansion valve, which are connected by pipes. The heat exchanger and the expansion valve take up a lot of space, and the pipes will also cause heat loss of the refrigerant, reducing the performance of the thermal management system. Summary of the Invention

[0003] The purpose of this application is to provide a thermal management device to facilitate the miniaturization of the thermal management device structure.

[0004] An embodiment of the technical solution of the present invention provides a thermal management device, which includes a valve core, a connecting block and a heat exchange core, wherein the connecting block is fixedly connected to the heat exchange core, and the connecting block is defined as being located above the heat exchange core;

[0005] The heat exchange core has a first channel, the connecting block has a first communication port, the first communication port is formed on the bottom wall of the connecting block, at least a portion of the first communication port faces the first channel, and the first communication port is connected to the first channel. The thermal management device has a valve cavity and a valve port, the wall forming the valve cavity includes the inner wall of the connecting block, the valve core can move in the valve cavity to adjust the opening of the valve port, and when the valve core opens the valve port, the valve cavity is connected to the first communication port through the valve port.

[0006] The thermal management device includes a first connector, which includes a main body, a first connecting part and a second connecting part. Along the axial direction of the first channel, the first connecting part is located on one side of the main body, and the second connecting part is located on the other side of the main body. The first connecting part is fixed to the connecting block, and the main body is located in the first channel. The first connector has a first communicating channel, and the first communicating channel is connected to the valve cavity.

[0007] The thermal management device provided in the embodiment of the present application includes a first connector, a throttling unit and a heat exchange core. The first connector is fixed to the connecting block, and the first connecting channel is connected to the valve cavity of the throttling unit. After the valve core opens the valve port, the throttled refrigerant is connected to the first channel of the heat exchange core through the first connecting port. In this way, the structure of the thermal management device is relatively compact, which is conducive to miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a perspective structural diagram of a first embodiment of a thermal management device;

[0009] Figure 2 is a schematic three-dimensional structural diagram of the first embodiment of the thermal management device from another perspective;

[0010] Figure 3 yes Figure 1 A schematic diagram of the first-person perspective structure of a partial explosion of a thermal management device;

[0011] Figure 4 yes Figure 1 A second-perspective perspective structural diagram of a partial explosion of a thermal management device;

[0012] Figure 5 1. It is a schematic diagram of the top view of the thermal management device;

[0013] Figure 6 yes Figure 5 Schematic diagram of the first cross-sectional structure along CC;

[0014] Figure 7 yes Figure 6 A schematic diagram of the enlarged structure of the middle part A;

[0015] Figure 8 yes Figure 6 A schematic diagram of the enlarged structure of the middle part B;

[0016] Figure 9 yes Figure 1 Schematic diagram of the three-dimensional structure of the middle throttling unit;

[0017] Figure 10 yes Figure 5 Schematic diagram of the second cross-sectional structure along CC;

[0018] Figure 11 yes Figure 5 Schematic diagram of the third cross-sectional structure along CC;

[0019] Figure 12 yes Figure 11 Schematic diagram of the three-dimensional structure of the heat exchange core plates. DETAILED DESCRIPTION

[0020] The thermal management device of the technical solution of the present invention can have multiple implementation modes, at least one of which can be applied to a vehicle thermal management system, and at least one of which can be applied to other thermal management systems such as a household thermal management system or a commercial thermal management system. The following is an example of a thermal management device applied to a vehicle thermal management system, with reference to the accompanying drawings.

[0021] See also Figures 1-9The thermal management device 1000 includes a heat exchange core, which includes a plurality of stacked plates, a first plate 1140 and a second plate 1210. Along the stacking direction of the plates, the plates are located between the first plate 1140 and the second plate 1210. Specifically, the heat exchange core includes a first heat exchange portion 1100, a connecting plate 1400, and a second heat exchange portion 1200. The second heat exchange portion is defined as being located above the first heat exchange portion. In this embodiment, the first plate 1140 is a part of the first heat exchange portion 1100, and the second plate 1210 is a part of the second heat exchange portion 1200. The first heat exchange portion 1100 also includes a top plate. The plurality of plates of the first heat exchange portion 1100 are stacked from the first plate 1140 to the top plate. The bottom plate of the first heat exchange portion 1100 is welded and fixed to the first plate 1140. The second heat exchange section 1200 includes a bottom plate, and a plurality of plates of the second heat exchange section 1200 are stacked from the bottom plate to the second plate body 1210. At least a portion of the connecting plate body 1400 is located between the top plate of the first heat exchange section 1100 and the bottom plate of the second heat exchange section 1200, and is welded and fixed to the top plate of the first heat exchange section 1100 and the bottom plate of the second heat exchange section 1200. In other embodiments, the thermal management device 1000 may also be provided without a top plate and a bottom plate, and the connecting plate body 1400 may be directly welded and fixed to the plates of the first heat exchange section 1100 and the plates of the second heat exchange section 1200. It should be noted that, for the convenience of description, the second heat exchange section 1200 is defined as being located above the first heat exchange section 1100. Of course, the connecting plate body may not be provided. The heat exchange core includes a first plate body 1140, a second plate body 1210, and a plurality of stacked plates located between the first plate body 1140 and the second plate body 1210 along the stacking direction of the plates. Along the stacking direction of the plates, these plates are located between the first plate body 1140 and the second plate body 1210, and several plates are stacked from the first plate body 1140 to the second plate body 1210.

[0022] The first heat exchange section 1100 and the second heat exchange section 1200 each include a plurality of stacked plates. The plate structures of the first heat exchange section 1100 and the second heat exchange section 1200 can be the same or different, and the sizes can be the same or different. The following description will take the same structure as an example. In the first heat exchange section 1100, adjacent plates are stacked to form a first inter-plate flow channel and a second inter-plate flow channel. Except for the two plates closest to the first plate body 1140 and the top plate of the first heat exchange section, one side of the remaining plates is a first inter-plate flow channel and the other side is a second inter-plate flow channel. In this embodiment, the adjacent plates have the same structure. For ease of description, one of the two adjacent plates is defined as a first plate and the other as a second plate. For example, a first plate and one of the two second plates adjacent to the first plate form a first inter-plate flow channel, and the second plate forms a second inter-plate flow channel with the other second plate. The first inter-plate flow channel and the second inter-plate flow channel are relatively disconnected. The fluid in the first inter-plate channel and the fluid in the second inter-plate channel can exchange heat. It should be noted that the relative non-connectivity between the first and second inter-plate flow channels refers to a lack of connectivity within the first heat exchange portion 1100. Once the thermal management device 1000 becomes part of the thermal management system, connectivity may exist. The thickness of the main body of the first plate 1140, second plate 1210, and connecting plate 1400 described herein is greater than the thickness of the main body of the plate, which enhances the mechanical strength of the thermal management device. Of course, the thickness of the main body of the first plate 1140, second plate 1210, and connecting plate 1400 may also be less than or equal to the thickness of the plate. The side of the first and second plates 1140, 1210 close to the plate may also come into contact with the refrigerant or coolant.

[0023] Thermal management device 1000 includes a refrigerant flow channel, a coolant flow channel, a first inlet 1001, a first outlet 1002, a second inlet 1006, a second outlet 1005, a coolant inlet 1003, and a coolant outlet 1004. First inlet 1001 and second inlet 1006 serve as the inlets of the refrigerant flow channel, while first outlet 1002 and second outlet 1005 serve as the outlets of the refrigerant flow channel. The coolant flow channel connects coolant inlet 1003 and coolant outlet 1004. Coolant inlet 1003, coolant outlet 1004, and the coolant flow channel are formed in second heat exchange portion 1200, first inlet 1001 is formed in connecting plate 1400, and first outlet 1002, second inlet 1006, and second outlet 1005 are formed in first connecting block 1600 fixed to first plate 1140. Along the stacking direction of the plates, the coolant inlet 1003 and the coolant outlet 1004 are located on one side of the thermal management device 1000, while the first outlet 1002, the second inlet 1006, and the second outlet 1005 are located on the opposite side of the thermal management device 1000. The second inlet 1006 and the second outlet 1005 are located on the same wall of the first connecting block 1600, which facilitates the connection of the thermal management device to other components. The second inlet 1006 and the second outlet 1005 can also be formed in a pipe fixedly connected to the first plate 1140 or in the first plate 1140 itself. The coolant inlet 1003 and the coolant outlet 1004 can also be formed in a pipe or block structure fixed to the second plate 1210, or in the second plate 1210 itself.

[0024] See also Figure 3 、 Figure 4 and Figure 6The refrigerant flow channels include a first flow channel, a second flow channel, and a third flow channel. The first and second flow channels are formed in the first heat exchange section 1100. The first inter-plate flow channel of the first heat exchange section 1100 is part of the first flow channel, and the second inter-plate flow channel of the first heat exchange section 1100 is part of the second flow channel. The first heat exchange section 1100 has at least a fifth channel 1160, a second channel 1120, a third channel 1130, and a fourth channel 1150. These channels extend along the direction in which the plates of the first heat exchange section are stacked. The first flow channel includes the fifth channel 1160, the first inter-plate channel located between the plates, and the second channel 1120. The first inter-plate channel of the first heat exchange section 1100 connects the fifth channel 1160 and the second channel 1120. In this embodiment, the first inlet 1001 formed on the connecting plate body 1400 is connected to the fifth channel 1160. The refrigerant enters the fifth channel 1160 from the first inlet 1001, and then enters the first inter-plate channel of the first heat exchange part 1100. After heat exchange with the refrigerant in the second inter-plate channel of the first heat exchange part 1100, it enters the second channel 1120. The second channel 1120 has an opening on the top plate of the first heat exchange part 1100. The refrigerant leaves the first heat exchange part 1100 through the opening on the top plate of the first heat exchange part 1100 and enters the second heat exchange part 1200; the second channel 1120 also has an opening on the first plate body 1140. The refrigerant can also enter the channel of the first connecting block 1600 through the opening of the first plate body 1140 and leave the first heat exchange part 1100 through the second outlet 1005. The second flow channel includes a third channel 1130, a second inter-plate channel located between the plates, and a fourth channel 1150. The second inter-plate channel of the first heat exchange unit 1100 connects to the third channel 1130 and the fourth channel 1150. The second inlet 1006 is connected to the third channel 1130. The refrigerant in the second flow channel enters the second inter-plate channel of the first heat exchange unit 1100 through the third channel 1130, exchanges heat with the refrigerant in the first inter-plate channel, and then enters the fourth channel 1150. The refrigerant in the fourth channel 1150 is discharged from the thermal management device through the first outlet 1002.

[0025] The first connecting block 1600 is welded to the first plate 1140. The thermal management device further includes a second connecting channel 1610. The walls forming the second connecting channel 1610 include the walls of the first connecting block 1600 and the walls of the first plate 1140. The second connecting channel 1610 connects to the first outlet 1002 and the fourth channel 1150. Refrigerant in the fourth channel 1150 exits the thermal management device via the second connecting channel 1610 and the first outlet 1002. The first connecting block 1600 includes a connecting channel connecting the second inlet 1006 and the third channel 1130. The first connecting block 1600 also includes a connecting channel connecting the second outlet 1005 and the second channel 1120. In this embodiment, the first outlet 1002, the second outlet 1005, and the second inlet 1006 are all formed on the outer wall of the first connecting block 1600.

[0026] The first inter-plate flow channel of the second heat exchange section 1200 is part of the third flow channel, and the second inter-plate flow channel of the second heat exchange section 1200 is part of the coolant flow channel. The second heat exchange section 1200 includes at least a first channel 1240, a sixth channel 1230, a seventh channel, and an eighth channel. The first and sixth channels 1240, 1230 are part of the third flow channel, while the seventh and eighth channels are part of the coolant flow channel. The third flow channel includes the first channel 1240 and the sixth channel 1230, located in the first inter-plate flow channel of the second heat exchange section 1200. The first inter-plate channel of the second heat exchange section 1200 connects the first channel 1240 and the sixth channel 1230. The coolant flow channel includes the seventh channel, the second inter-plate channel located in the second heat exchange section 1200, and the eighth channel. The second inter-plate channel of the second heat exchange section 1200 connects the seventh and eighth channels. In this embodiment, the coolant inlet 1003 is connected to the seventh channel, and the coolant outlet 1004 is connected to the eighth channel. The coolant enters the seventh channel from the coolant inlet 1003, and then enters the second inter-plate channel of the second heat exchange part 1200, and exchanges heat with the refrigerant in the third channel, and then enters the eighth channel and is discharged from the thermal management device through the coolant outlet 1004.

[0027] The connecting plate body 1400 includes a first through-hole 1410 and a second through-hole 1420. The first through-hole 1410 and the second through-hole 1420 extend through the connecting plate body 1400 and have openings on the upper and lower walls of the connecting plate body 1400, respectively. The second through-hole 1420 connects the sixth channel 1230 with the fourth channel 1150, that is, the second through-hole 1420 connects the third flow channel and the second flow channel. Specifically, the opening of the sixth channel 1230 formed on the bottom plate of the second heat exchange unit at least partially faces and communicates with the second through-hole 1420. The opening of the fourth channel 1150 formed on the top plate of the first heat exchange unit at least partially faces and communicates with the second through-hole 1420. Thus, the fourth channel 1150 communicates with the sixth channel 1230 through the second through-hole 1420. In this embodiment, the opening formed by the sixth channel 1230 on the bottom plate of the second heat exchange unit and the fourth channel 1150 on the top plate of the first heat exchange unit are arranged in an alternating manner. The second through hole 1420 extends in a narrow and long shape, which facilitates smoother flow of the refrigerant through the second through hole 1420. Of course, the opening formed by the sixth channel 1230 on the bottom plate of the second heat exchange unit and the opening formed by the fourth channel 1150 on the top plate of the first heat exchange unit 1100 can also be arranged opposite each other. After heat exchange in the second heat exchange unit 1200, the refrigerant in the third flow channel enters the fourth channel 1150 through the second through hole 1420 and then exits the thermal management device through the first outlet 1002.

[0028] The first through hole 1410 is in communication with the second channel 1120. Specifically, the opening of the second channel 1120 formed in the top plate of the first heat exchange unit at least partially faces the first through hole 1410 and is in communication with the first through hole 1410. Of course, a seal is provided between the top plate of the first heat exchange unit and corresponding positions of the connecting plate body 1400 to prevent refrigerant leakage from the connection between the first heat exchange unit 1100 and the connecting plate body 1400. A seal is also provided between the bottom plate of the second heat exchange unit 1200 and corresponding positions of the connecting plate body 1400 to prevent refrigerant leakage from the connection between the bottom plate of the second heat exchange unit 1200 and the connecting plate body 1400.

[0029] See also Figure 6-Figure 9The thermal management device includes a driving part 1300, a connecting block 1310, a valve core 1320, and a valve mouth part 1350. The connecting block is defined as being located above the heat exchange core. The connecting block 1310 is fixed to the second plate body 1210. Specifically, the bottom wall of the connecting block 1310 is directly or indirectly fixed to the upper wall of the second plate body 1210. The connecting block can be an integral structure or a split structure, and the split structure is fixed or limit-connected. The first channel 1240 has a first channel opening 1241 on the upper wall of the second plate body. The connecting block 1310 has a first communicating port 13113. The first communicating port 13113 is formed on the bottom wall of the connecting block 1310. At least part of the first communicating port 13113 faces the first channel opening 1241, and the first communicating port 13113 is connected to the first channel opening 1241. The connecting block 1310 has a first accommodating cavity, and the thermal management device has a valve cavity 1360. The first accommodating cavity has an opening in the side wall of the connecting block 1310. Along the axial direction of the first channel 1240, the side wall of the connecting block 1310 is located between the upper and bottom walls of the connecting block 1310. A portion of the driving unit 1300 is located in the first accommodating cavity. The valve opening portion 1350 is fixed to the driving unit 1300 or is part of the connecting block 1310. The valve opening portion 1350 is formed with a valve opening 1351. In this embodiment, the walls forming the valve cavity 1360 include the inner wall of the connecting block 1310, the wall of the valve seat 1370, and the wall of the valve opening portion 1350. The valve core 1320 is a valve needle. The driving unit 1300 can drive the valve needle to move relative to the valve opening portion 1350 within the valve cavity 1360, thereby adjusting the opening of the valve opening 1351 and opening and closing the valve opening 1351.

[0030] The thermal management device includes a first connector, which includes a main body 1530, a first connector 1510, and a second connector 1520. Along the axial direction of the first channel 1240, the first connector 1510 is located on one side of the main body 1530, and the second connector 1520 is located on the other side of the main body 1530. The first connector 1510 is fixedly connected to the connecting block 1310, and the second connector 1520 is fixedly connected to the bottom plate of the second heat exchange unit 1200. The main body 1530 is located in the first channel 1240, or in other words, the first channel 1240 accommodates the main body 1530. The first connector has a first connecting channel 1501, which is connected to the valve chamber 1360. The fixing of the first connector to the connecting block mentioned here not only includes the first connector and the connecting block being separately provided and fixed by welding or other means, but also includes the case where the connecting block and the first connector are an integral structure. In this embodiment, the first connector is formed as a tube body 1500, and the tube body 1500 has a tube body cavity, which is the first connecting channel 1501. The connecting block 1310 has a first channel 1311, and the first channel 1311 includes a first sub-channel 13111 and a concave cavity 13112. The concave cavity 13112 forms the above-mentioned first connecting port 13113 on the bottom wall of the connecting block 1310, and at least part of the first connecting port 13113 has a first channel opening 1241 facing the first channel, and the concave cavity 13112 is connected to the first channel 1240. Along the movement direction of the valve core 1320, the valve cavity 1360 is located on one side of the valve port 1351, and at least part of the first sub-channel 13111 is located on the other side of the valve port 1351. When the valve core 1320 opens the valve port 1351, the valve cavity 1360 is connected to the first sub-channel 13111 through the valve port 1351. The connecting block 1310 includes a recess 1315 , which forms the above-mentioned cavity 13112 . The first sub-channel 13111 has an opening at the bottom wall of the recess 1315 . The first sub-channel 13111 is connected to the cavity 13112 . The inner diameter of the cavity 13112 is larger than the inner diameter of the first sub-channel 13111 . The connecting block 1310 includes a first matching portion 1313, which is fixedly connected to the first connecting portion 1510. The first connecting portion 1510 and the first matching portion 1313 are sealed at the connection. In this embodiment, the first matching portion 1313 has a first hole 13130, and the first hole 13130 has an opening on the bottom wall of the recess 1315. The first hole 13130 accommodates the first connecting portion 1510, and the first connecting portion 1510 is formed on the outer wall of the tube body; in other embodiments, the first matching portion 1313 can also be located in the tube body cavity, and the first matching portion 1313 is sealed and fixed to the inner wall of the tube body 1500. At this time, the first hole 13130 is connected to the first connecting channel 1501, and the first connecting channel is connected to the valve cavity 1360.Connecting block 1310 also includes a second channel 1312. Second channel 1312 has a channel opening in the wall forming valve cavity 1360. Second channel 1312 communicates with valve cavity 1360. Second channel 1312 has an opening facing first communicating channel 1501, and the tube body cavity communicates with second channel 1312. The provision of recess 1315 in connecting block 1310 not only reduces the weight of connecting block 1310 but also, because the inner diameter of recess 13112 is larger than that of first channel 1311, reduces the flow resistance of the throttled refrigerant as it enters first channel 1311 and recess 13112 into first channel 1240.

[0031] See also Figure 8 The second connection part 1520 is fixed to the bottom plate of the second heat exchange part 1200. Specifically, the thermal management device includes a first partition 1280, and the first partition 1280 is formed on the bottom plate of the second heat exchange part 1200. The first partition 1280 includes a second matching part 1281. The area surrounded by the second matching part 1281 includes a second hole. At least part of the second connection part 1520 is located in the second hole. The second matching part 1281 is fixedly connected to the second connection part 1520. The connection between the second matching part 1281 and the second connection part 1520 is sealed. The opening of the first connecting channel 1501 formed at the second connection part is located in the first through hole, and then the first through hole 1410 is connected to the tube body cavity. In one specific embodiment, the first partition 1280 includes a flange facing the first through-hole 1410. The area enclosed by the flange of the first partition 1280 is the second hole or a portion of the second hole. The second mating portion is formed on the inner wall of the flange of the first partition, and the second connecting portion 1520 is located in the second hole. The second connecting portion 1520 is formed on the outer wall of the tube body. The opening of the first connecting channel 1501 formed by the second connecting portion 1520 is located in the first through-hole 1410, and the tube body cavity is connected to the first through-hole. Of course, the flange of the first partition can also be located in the tube body cavity. In this case, the second connecting portion 1520 is a portion of the inner wall of the tube body 1500, and the second mating portion is the outer wall of the flange of the first partition. In other embodiments, the flange of the first partition can also be located in the first hole, which will not be described in detail. In addition, the second mating portion 1281 can also be formed on the connecting plate body 1400. Specifically, the second mating portion 1281 is the hole wall of the second through-hole.

[0032] In one application scenario of the thermal management device, the first inlet 1001 is connected to the outlet of the condenser, and the first outlet 1002 of the thermal management device is connected to the inlet of the compressor. After the high-temperature and high-pressure refrigerant releases heat in the condenser, the relatively low-temperature and high-pressure refrigerant enters the refrigerant flow channel of the thermal management device 1000 from the first inlet, that is, the first flow channel of the first heat exchange part 1100, and then enters the first connecting channel 1501, the second channel 1312, and the valve cavity 1360 through the first through hole 1410. The refrigerant enters the first channel 1311 after throttling and pressure reduction at the valve port 1351, and then enters the first channel 1240, that is, the third flow channel. The refrigerant absorbs the heat of the coolant in the third flow channel, lowering the temperature of the coolant, and then enters the sixth channel 1230. The refrigerant in the third flow channel enters the fourth channel 1150 through the second through hole 1420 of the connecting plate body 1400, and then discharges the thermal management device 1000 from the first outlet 1002. It can be seen that the refrigerant in the second heat exchange part is discharged from the thermal management device through the fourth channel 1150 and does not participate in heat exchange in the first heat exchange part 1100. The refrigerant discharged from the second outlet 1005 enters the second inlet 1006 after throttling and evaporation. The refrigerant in the second inlet 1006 enters the third channel 1130 and then is discharged from the thermal management device 1000 through the fourth channel 1150. The refrigerant in the second flow channel and the refrigerant in the first flow channel can exchange heat in the first heat exchange part 1100, further reducing the refrigerant temperature in the first flow channel and increasing the refrigeration temperature in the second flow channel, which is beneficial to reducing the content of liquid refrigerant. Thermal management device 1000 comprises two heat exchange sections, secured by a connecting plate 1400. The first heat exchange section 1100 performs refrigerant-to-refrigerant heat exchange, while the second heat exchange section 1200 performs refrigerant-to-coolant heat exchange. Refrigerant in the first heat exchange section 1100 enters the valve chamber through a tube 1500, which is embedded within the heat exchange core. The connecting block is secured to the second plate 1210. The throttled refrigerant exchanges heat with the coolant in the second heat exchange section 1200, lowering the coolant's temperature. Tube 1500's placement behind the second heat exchange section 1200 significantly reduces the length of the thermal management device along the direction of plate stacking. The inclusion of tube 1500 within the heat exchange core not only further reduces the size of thermal management device 1000 but also effectively minimizes external damage to tube 1500, thereby extending the device's lifespan.

[0033] See also Figure 11 and Figure 12 , Figure 11 and Figure 12This is merely a schematic representation of this embodiment and does not necessarily reflect the actual structure. It is merely a convenient illustration of the connection between the heat exchange core and the connection block. The first plate of the second heat exchange section 1200 includes a first opening 1204 and at least one second opening 1205. The wall forming the first opening 1204 includes a second flange 1290, which is folded from the main body of the first plate of the second heat exchange section 1200 toward the connection block. Multiple first plates are stacked, and the second flanges 1290 are inserted into the adjacent upper second flanges, with a seal provided between adjacent flanges. The inner walls of the second flanges 1290 of the multiple plates form the walls of the first connecting channel 1501. The portion of the second flange 1290 adjacent to the connection block 1310 is located in the first hole, so that the first connecting channel 1501 communicates with the valve chamber 1360. The first connecting portion is formed on the second flange 1290 adjacent to the connection block 1310. In this embodiment, along the radial direction of the first channel 1240, four second orifices 1205 are distributed on the outside of the first orifice 1204, and the second orifices 1205 form the first channel 1240. In other embodiments, each plate includes at least one second orifice 1205. The opening of the concave cavity 13112 on the bottom wall of the connecting block at least partially faces the second orifice 1205, thereby achieving communication between the valve cavity 1360 and the first channel 1240. In other embodiments, the first matching portion 1313 can also be inserted into the inner wall of the second flange 1290 and sealed and fixed. It can be seen that among the plates of the second heat exchange part 1200, the plate closest to the first heat exchange part includes the first orifice but does not include the second orifice.

[0034] See also Figure 10 The first accommodating chamber has an opening on the upper wall of the connecting block 1310. Part of the driving unit 1300 is located in the first accommodating chamber. The second channel 1312 includes a first sub-section 13121 and a second sub-section 13122. The first sub-section 13121 is closer to the valve chamber 1360 than the second sub-section 13122. The first sub-section 13121 has an opening in the wall forming the valve chamber 1360. The first sub-section 13121 is arranged obliquely relative to the direction of movement of the valve core 1320. The second sub-section 13122 has an opening facing the first connecting channel 1501. The second sub-section 13122 is coaxial with or parallel to the first channel 1240. The first mating portion 1313 protrudes from the bottom wall of the recess toward the first channel. At least a portion of the first mating portion is located in the recess 13112. The first hole formed by the first mating portion 1313 has an opening on the bottom wall of the connecting block 1310.

[0035] In this embodiment, the thermal management device 1000 includes a second heat exchange part 1200. At this time, the first plate body 1140 is welded and fixed to the bottom plate of the heat exchange core. The first partition 1280 is formed on the first plate body 1140. The flange of the first partition 1280 protrudes toward the first channel 1240. The first inlet 1001 is formed on the second connecting part 1520. In other embodiments, the first inlet 1001 can also be formed on the first plate body 1140 or formed on a pipe or connecting block fixedly connected to the first plate body 1140. The refrigerant enters the first connecting channel 1501 and the valve cavity 1360 from the first inlet 1001, enters the first channel 1240 after throttling, and then undergoes heat exchange in the heat exchange core. Finally, it is discharged from the thermal management device through the first outlet 1002. The first outlet is formed on the first plate body 1140.

[0036] In a feasible embodiment, the connecting block 1310 may not be provided with the second channel 1312 , and the first hole formed by the first matching portion 1313 has an opening in the wall forming the valve cavity, and the first connecting portion 1510 and the first matching portion 1313 are fixed and sealed.

[0037] In another feasible embodiment, the connecting block 1310 may also not include the recess, and the first channel 1311 has an opening facing the first channel on the bottom wall of the connecting block 1310, and the throttled refrigerant can directly enter the first channel 1240 from the first sub-channel 13111. Similarly, the first hole formed by the first matching portion 1313 has an opening on the bottom wall of the connecting block 1310, so that the processing of the connecting block 1310 is relatively simple.

[0038] It should be noted that the above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. Although this specification has described the present invention in detail with reference to the above embodiments, it should be understood by those skilled in the art that the present invention can still be modified or replaced by equivalents, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A thermal management device, comprising a valve core, a connecting block, and a heat exchange core, wherein the connecting block is fixedly connected to the heat exchange core, and the connecting block is defined as being located above the heat exchange core; The heat exchange core has a first channel, the connecting block has a first communication port, the first communication port is formed on the bottom wall of the connecting block, at least a portion of the first communication port faces the first channel, and the first communication port is connected to the first channel. The thermal management device has a valve cavity and a valve port, the wall forming the valve cavity includes the inner wall of the connecting block, the valve core can move in the valve cavity to adjust the opening of the valve port, and when the valve core opens the valve port, the valve cavity is connected to the first communication port through the valve port. The thermal management device includes a first connector, which includes a main body, a first connecting part and a second connecting part. Along the axial direction of the first channel, the first connecting part is located on one side of the main body, and the second connecting part is located on the other side of the main body. The first connecting part is fixed to the connecting block, and the main body is located in the first channel. The first connector has a first communicating channel, and the first communicating channel is connected to the valve cavity.

2. The thermal management device according to claim 1, characterized in that The connecting block has a first channel, the first channel forming the first communication port on the bottom wall of the connecting block, the first channel including a first sub-channel, along the movement direction of the valve core, the valve cavity is located on one side of the valve port, and at least part of the first sub-channel is located on the other side of the valve port; The connecting block includes a first matching portion, the first matching portion is fixed to the first connecting portion, the first matching portion has a first hole, the first hole accommodates the first connecting portion, or the first hole is connected to the valve cavity, and the first hole is connected to the first communicating channel.

3. The thermal management device according to claim 2, characterized in that: The connection block includes a recess having a cavity, the cavity being a portion of the first channel, the cavity forming the first communication port on the bottom wall of the connection block, and the first sub-channel having an opening on the bottom wall of the recess; The first hole has an opening on the bottom wall of the recess, or at least a portion of the first matching portion protrudes toward the first channel relative to the bottom wall of the recess.

4. The thermal management device according to any one of claims 1 to 3, characterized in that: The heat exchange core comprises a plurality of stacked first plates, each of the first plates comprising a first orifice and at least one second orifice, the second orifice being disconnected from the first orifice, a plurality of the first orifices being stacked to form the first communicating channel, a plurality of the second orifices being stacked to form the first duct, and the first connector being a wall forming the first orifice; Alternatively, the first plate includes a second orifice, a plurality of the second orifices are stacked to form the first channel, the first connector is formed as a tube, and the first communicating channel is the tube cavity.

5. The thermal management device according to claim 4, characterized in that: The first plate includes four second openings, which are distributed around the first opening. The first plate includes a first flange, which is folded from the main body of the first plate toward the connecting block. The first flange is inserted into the first flange adjacent to it and sealed and fixed. The first connecting portion is formed on the first flange adjacent to the connecting block.

6. The thermal management device according to any one of claims 1-3 and 5, characterized in that: The connecting block has a second channel, the second channel has a channel opening in a wall forming the valve cavity, the second channel is in communication with the valve cavity, the connecting block includes a first matching portion, the first matching portion is fixedly connected to the first connecting portion, the second channel has an opening facing the first communicating channel, the second channel is in communication with the first communicating channel; The thermal management device includes a driving part, the connecting block includes a first accommodating cavity, at least a portion of the driving part is located in the first accommodating cavity, and the valve core is a valve needle.

7. The thermal management device according to claim 4, characterized in that: The connecting block has a second channel, the second channel has a channel opening in a wall forming the valve cavity, the second channel is in communication with the valve cavity, the connecting block includes a first matching portion, the first matching portion is fixedly connected to the first connecting portion, the second channel has an opening facing the first communicating channel, the second channel is in communication with the first communicating channel; The thermal management device includes a driving part, the connecting block includes a first accommodating cavity, at least a portion of the driving part is located in the first accommodating cavity, and the valve core is a valve needle.

8. The thermal management device according to claim 6, characterized in that: The first accommodating cavity has an opening on the upper wall of the connecting block, and the second channel includes a first sub-portion and a second sub-portion, the first sub-portion being closer to the valve cavity than the second sub-portion, the first sub-portion having an opening in a wall forming the valve cavity, the first sub-portion being inclined relative to the movement direction of the valve core, the second sub-portion having an opening facing the first communicating channel, and the second sub-portion being coaxial or parallel to the first hole; Alternatively, the first accommodating cavity has an opening on the side wall of the connecting block, and the second channel is coaxial with or parallel to the first hole.

9. The thermal management device according to claim 7, characterized in that: The first accommodating cavity has an opening on the upper wall of the connecting block, and the second channel includes a first sub-portion and a second sub-portion, the first sub-portion being closer to the valve cavity than the second sub-portion, the first sub-portion having an opening in a wall forming the valve cavity, the first sub-portion being inclined relative to the movement direction of the valve core, the second sub-portion having an opening facing the first communicating channel, and the second sub-portion being coaxial or parallel to the first hole; Alternatively, the first accommodating cavity has an opening on the side wall of the connecting block, and the second channel is coaxial with or parallel to the first hole.

10. The thermal management device according to any one of claims 1-3, 5, 7-9, characterized in that: The heat exchange core includes a first plate, a second plate, and a plurality of stacked plates. The connecting block is fixedly or positionally connected to the second plate. The heat exchange core includes a refrigerant flow channel and a coolant flow channel. The refrigerant flow channel and the coolant flow channel are relatively disconnected. The first plate body includes a first partition, the first partition includes a second matching portion, the second matching portion forms a second hole, the second matching portion is fixedly connected to the second connecting portion, and the connection between the second matching portion and the second connecting portion is sealed; The heat management device has a first inlet, which is communicated with the first communication channel. The first inlet is formed on the second connection portion or on the first plate or on a pipe or block fixedly connected to the first plate.

11. The thermal management device according to claim 4, characterized in that: The heat exchange core includes a first plate, a second plate, and a plurality of stacked plates. The connecting block is fixedly or positionally connected to the second plate. The heat exchange core includes a refrigerant flow channel and a coolant flow channel. The refrigerant flow channel and the coolant flow channel are relatively disconnected. The first plate body includes a first partition, the first partition includes a second matching portion, the second matching portion forms a second hole, the second matching portion is fixedly connected to the second connecting portion, and the connection between the second matching portion and the second connecting portion is sealed; The heat management device has a first inlet, which is communicated with the first communication channel. The first inlet is formed on the second connection portion or on the first plate or on a pipe or block fixedly connected to the first plate.

12. The thermal management device according to claim 6, characterized in that: The heat exchange core includes a first plate, a second plate, and a plurality of stacked plates. The connecting block is fixedly or positionally connected to the second plate. The heat exchange core includes a refrigerant flow channel and a coolant flow channel. The refrigerant flow channel and the coolant flow channel are relatively disconnected. The first plate body includes a first partition, the first partition includes a second matching portion, the second matching portion forms a second hole, the second matching portion is fixedly connected to the second connecting portion, and the connection between the second matching portion and the second connecting portion is sealed; The heat management device has a first inlet, which is communicated with the first communication channel. The first inlet is formed on the second connection portion or on the first plate or on a pipe or block fixedly connected to the first plate.

13. The thermal management device according to any one of claims 1-3, 5, 7-9, characterized in that: The heat exchange core includes a first plate, a second plate, and a plurality of stacked plates, the connecting block and the second plate are fixedly or positionally connected; the heat exchange core includes a first heat exchange portion and a second heat exchange portion, the first heat exchange portion is located below the second heat exchange portion, the first plate is a part of the first heat exchange portion, and the second plate is a part of the second heat exchange portion; The thermal management device comprises a refrigerant flow channel and a coolant flow channel, the coolant flow channel being formed in the second heat exchange portion, the refrigerant flow channel comprising a first flow channel, a second flow channel, and a third flow channel, the first flow channel and the second flow channel being formed in the first heat exchange portion, the third flow channel being formed in the second heat exchange portion, the refrigerant in the first flow channel and the refrigerant in the second flow channel being capable of heat exchange in the first heat exchange portion, the refrigerant in the third flow channel and the coolant in the coolant flow channel being capable of heat exchange in the second heat exchange portion, and the first hole being a portion of the third flow channel; The heat exchange core has a first inlet and a first outlet, the first inlet is connected to the first flow channel, the first outlet is connected to the second flow channel, the first flow channel can be connected to the valve cavity through the first connecting channel, and the third flow channel is connected to the second flow channel.

14. The thermal management device according to claim 13, characterized in that: The thermal management device includes a connecting plate, at least a portion of which is located between the first heat exchange portion and the second heat exchange portion, the connecting plate including a first through hole and a second through hole, an opening of the third flow channel formed on the bottom plate of the second heat exchange portion communicating with the second through hole, and an opening of the second flow channel formed on the top plate of the first heat exchange portion communicating with the second through hole; The second matching portion is formed on the connecting plate body, the second hole is the first through hole or a portion of the first through hole, the first communicating channel is connected to the first through hole, and the opening of the first flow channel formed on the top plate of the first heat exchange portion is connected to the first through hole; Alternatively, the second matching portion is formed on the bottom plate of the second heat exchange portion, and the first communicating channel is communicated with the first through hole.

15. The thermal management device according to claim 14, characterized in that: The thermal management device has a coolant outlet and a coolant inlet; The third flow channel includes the first channel, the sixth channel, and the first inter-plate channel of the second heat exchange portion, the first inter-plate channel of the second heat exchange portion communicating with the first channel and the sixth channel, and the sixth channel having an opening facing the second through hole on the bottom plate of the second heat exchange portion; The first flow channel includes a fifth channel, a second channel, and a second inter-plate channel of the first heat exchange portion, the second inter-plate channel of the first heat exchange portion communicating with the fifth channel and the second channel, the first inlet communicating with the fifth channel, and the second channel having an opening formed on the top plate of the first heat exchange portion facing the first through hole; The second flow channel includes a third channel, a fourth channel, and a first inter-plate channel of the first heat exchange portion, the first inter-plate channel of the first heat exchange portion communicating with the third channel and the fourth channel, the fourth channel having an opening facing the second through hole on the top plate of the first heat exchange portion, and the first outlet communicating with the fourth channel; The coolant flow channel includes a seventh channel, an eighth channel, and a second inter-plate channel of the second heat exchange portion, the second inter-plate channel of the second heat exchange portion communicating with the seventh channel and the eighth channel, the coolant inlet communicating with the seventh channel, and the coolant outlet communicating with the eighth channel; The first inlet is formed on the connecting plate body, and the connecting plate body has a connecting channel connecting the first inlet and the fifth channel; the first outlet is located on one side of the thermal management device, and the coolant outlet and coolant inlet are located on the other side of the thermal management device.

16. The thermal management device according to claim 15, characterized in that The thermal management device has a second outlet and a second inlet, and includes a first connecting block. The thermal management device also has a second connecting channel, and the walls forming the second connecting channel include the walls of the first connecting block and the walls of the first plate body. The second connecting channel is connected to the first outlet, and the second connecting channel is connected to the fourth channel. The second inlet, the second outlet and the first outlet are all formed on the outer wall of the first connecting block. The second outlet is connected to the second channel, and the second inlet is connected to the third channel.

17. The thermal management device according to claim 4, characterized in that The heat exchange core includes a first plate, a second plate, and a plurality of stacked plates, the connecting block and the second plate are fixedly or positionally connected; the heat exchange core includes a first heat exchange portion and a second heat exchange portion, the first heat exchange portion is located below the second heat exchange portion, the first plate is a part of the first heat exchange portion, and the second plate is a part of the second heat exchange portion; The thermal management device comprises a refrigerant flow channel and a coolant flow channel, the coolant flow channel being formed in the second heat exchange portion, the refrigerant flow channel comprising a first flow channel, a second flow channel, and a third flow channel, the first flow channel and the second flow channel being formed in the first heat exchange portion, the third flow channel being formed in the second heat exchange portion, the refrigerant in the first flow channel and the refrigerant in the second flow channel being capable of heat exchange in the first heat exchange portion, the refrigerant in the third flow channel and the coolant in the coolant flow channel being capable of heat exchange in the second heat exchange portion, and the first hole being a portion of the third flow channel; The heat exchange core has a first inlet and a first outlet, the first inlet is connected to the first flow channel, the first outlet is connected to the second flow channel, the first flow channel can be connected to the valve cavity through the first connecting channel, and the third flow channel is connected to the second flow channel.

18. The thermal management device according to claim 17, characterized in that The thermal management device includes a connecting plate, at least a portion of which is located between the first heat exchange portion and the second heat exchange portion, the connecting plate including a first through hole and a second through hole, an opening of the third flow channel formed on the bottom plate of the second heat exchange portion communicating with the second through hole, and an opening of the second flow channel formed on the top plate of the first heat exchange portion communicating with the second through hole; The second matching portion is formed on the connecting plate body, the second hole is the first through hole or a portion of the first through hole, the first communicating channel is connected to the first through hole, and the opening of the first flow channel formed on the top plate of the first heat exchange portion is connected to the first through hole; Alternatively, the second matching portion is formed on the bottom plate of the second heat exchange portion, and the first communicating channel is communicated with the first through hole.

19. The thermal management device according to claim 18, characterized in that The thermal management device has a coolant outlet and a coolant inlet; The third flow channel includes the first channel, the sixth channel, and the first inter-plate channel of the second heat exchange portion, the first inter-plate channel of the second heat exchange portion communicating with the first channel and the sixth channel, and the sixth channel having an opening facing the second through hole on the bottom plate of the second heat exchange portion; The first flow channel includes a fifth channel, a second channel, and a second inter-plate channel of the first heat exchange portion, the second inter-plate channel of the first heat exchange portion communicating with the fifth channel and the second channel, the first inlet communicating with the fifth channel, and the second channel having an opening formed on the top plate of the first heat exchange portion facing the first through hole; The second flow channel includes a third channel, a fourth channel, and a first inter-plate channel of the first heat exchange portion, the first inter-plate channel of the first heat exchange portion communicating with the third channel and the fourth channel, the fourth channel having an opening facing the second through hole on the top plate of the first heat exchange portion, and the first outlet communicating with the fourth channel; The coolant flow channel includes a seventh channel, an eighth channel, and a second inter-plate channel of the second heat exchange portion, the second inter-plate channel of the second heat exchange portion communicating with the seventh channel and the eighth channel, the coolant inlet communicating with the seventh channel, and the coolant outlet communicating with the eighth channel; The first inlet is formed on the connecting plate body, and the connecting plate body has a connecting channel connecting the first inlet and the fifth channel; the first outlet is located on one side of the thermal management device, and the coolant outlet and coolant inlet are located on the other side of the thermal management device.

20. The thermal management device according to claim 19, characterized in that The thermal management device has a second outlet and a second inlet, and includes a first connecting block. The thermal management device also has a second connecting channel, and the walls forming the second connecting channel include the walls of the first connecting block and the walls of the first plate body. The second connecting channel is connected to the first outlet, and the second connecting channel is connected to the fourth channel. The second inlet, the second outlet and the first outlet are all formed on the outer wall of the first connecting block. The second outlet is connected to the second channel, and the second inlet is connected to the third channel.

21. The thermal management device according to claim 6, characterized in that The heat exchange core includes a first plate, a second plate, and a plurality of stacked plates, the connecting block and the second plate are fixedly or positionally connected; the heat exchange core includes a first heat exchange portion and a second heat exchange portion, the first heat exchange portion is located below the second heat exchange portion, the first plate is a part of the first heat exchange portion, and the second plate is a part of the second heat exchange portion; The thermal management device comprises a refrigerant flow channel and a coolant flow channel, the coolant flow channel being formed in the second heat exchange portion, the refrigerant flow channel comprising a first flow channel, a second flow channel, and a third flow channel, the first flow channel and the second flow channel being formed in the first heat exchange portion, the third flow channel being formed in the second heat exchange portion, the refrigerant in the first flow channel and the refrigerant in the second flow channel being capable of heat exchange in the first heat exchange portion, the refrigerant in the third flow channel and the coolant in the coolant flow channel being capable of heat exchange in the second heat exchange portion, and the first hole being a portion of the third flow channel; The heat exchange core has a first inlet and a first outlet, the first inlet is connected to the first flow channel, the first outlet is connected to the second flow channel, the first flow channel can be connected to the valve cavity through the first connecting channel, and the third flow channel is connected to the second flow channel.

22. The thermal management device according to claim 21, characterized in that The thermal management device includes a connecting plate, at least a portion of which is located between the first heat exchange portion and the second heat exchange portion, the connecting plate including a first through hole and a second through hole, an opening of the third flow channel formed on the bottom plate of the second heat exchange portion communicating with the second through hole, and an opening of the second flow channel formed on the top plate of the first heat exchange portion communicating with the second through hole; The second matching portion is formed on the connecting plate body, the second hole is the first through hole or a portion of the first through hole, the first communicating channel is connected to the first through hole, and the opening of the first flow channel formed on the top plate of the first heat exchange portion is connected to the first through hole; Alternatively, the second matching portion is formed on the bottom plate of the second heat exchange portion, and the first communicating channel is communicated with the first through hole.

23. The thermal management device according to claim 22, characterized in that The thermal management device has a coolant outlet and a coolant inlet; The third flow channel includes the first channel, the sixth channel, and the first inter-plate channel of the second heat exchange portion, the first inter-plate channel of the second heat exchange portion communicating with the first channel and the sixth channel, and the sixth channel having an opening facing the second through hole on the bottom plate of the second heat exchange portion; The first flow channel includes a fifth channel, a second channel, and a second inter-plate channel of the first heat exchange portion, the second inter-plate channel of the first heat exchange portion communicating with the fifth channel and the second channel, the first inlet communicating with the fifth channel, and the second channel having an opening formed on the top plate of the first heat exchange portion facing the first through hole; The second flow channel includes a third channel, a fourth channel, and a first inter-plate channel of the first heat exchange portion, the first inter-plate channel of the first heat exchange portion communicating with the third channel and the fourth channel, the fourth channel having an opening facing the second through hole on the top plate of the first heat exchange portion, and the first outlet communicating with the fourth channel; The coolant flow channel includes a seventh channel, an eighth channel, and a second inter-plate channel of the second heat exchange portion, the second inter-plate channel of the second heat exchange portion communicating with the seventh channel and the eighth channel, the coolant inlet communicating with the seventh channel, and the coolant outlet communicating with the eighth channel; The first inlet is formed on the connecting plate body, and the connecting plate body has a connecting channel connecting the first inlet and the fifth channel; the first outlet is located on one side of the thermal management device, and the coolant outlet and coolant inlet are located on the other side of the thermal management device.

24. The thermal management device according to claim 23, characterized in that The thermal management device has a second outlet and a second inlet, and includes a first connecting block. The thermal management device also has a second connecting channel, and the walls forming the second connecting channel include the walls of the first connecting block and the walls of the first plate body. The second connecting channel is connected to the first outlet, and the second connecting channel is connected to the fourth channel. The second inlet, the second outlet and the first outlet are all formed on the outer wall of the first connecting block. The second outlet is connected to the second channel, and the second inlet is connected to the third channel.

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