Flotation device

Abstract

The present invention relates to an air flotation device. The air flotation device opens an air flow channel on the surface of a plate body and controls the outlet pressure of the air flow channel to be close, that is, the absolute value of the difference between the outlet pressures of any two air flow channels is 0-1 MPa, thereby forming an air flotation cushion composed of multiple air columns above the plate body. A substrate can be placed on the air flotation cushion and heated by the outlet air of the air flow channel, thereby achieving uniform heating of the substrate and avoiding differences in the film thickness of a photoresist film layer on the substrate caused by uneven heating.

Description

Technical Field

[0001] The present invention relates to the field of display panel manufacturing, and in particular to an air flotation device. Background Art

[0002] In the photo development process, photoresist (PR) is coated to form a photoresist pattern. After coating, the VCD process (vacuum treatment process) removes about 70% of the solvent in the photoresist. Then, soft baking is used to further remove the solvent and solidify the PR, increasing the adhesion between the PR and the substrate. Solvent volatilization during exposure is reduced to prevent mask atomization. Pre-baking the PR for initial solidification can also prevent over-development during development.

[0003] The equipment used in the existing Soft Bake is a Hot Plate. In the chamber, multiple Heaters and Hot Purges are used to heat the base (GLS). Figure 1 , the substrate 1 is placed on a plurality of proximity pins 2 arranged at intervals to perform a soft bake process.

[0004] During soft baking, the vaporization process of the solvent releases heat from the surface of substrate 1. Since the adjacent pins 2 are in direct contact with substrate 1, the heat conduction rate at the contact point between the adjacent pins 2 and substrate 1 differs from that at other non-contact points. This temperature difference leads to a difference in the final film thickness.

[0005] The pin head 21, which connects the adjacent pin 2 to the substrate 1, is made of Peek (polyetheretherketone), while the pin body 22 is made of SUS (stainless steel). To address the uneven heat transfer rate (pin mura) caused by differences in the adjacent pins 2, conventional processes use pins made entirely of Peek material to mitigate pin mura. However, pin mura still occurs with some specialized PR materials and cannot be improved. Summary of the Invention

[0006] The present invention aims to solve the problem of uneven heating during the pre-baking of a photoresist layer, which leads to thickness differences.

[0007] To achieve the above-mentioned purpose, the present invention provides an air flotation device, comprising: a plate body, a surface of which is provided with a plurality of air flow channels passing through the plate body, one end of the air flow channel being an air inlet end, and the other end of the air flow channel being an air outlet end; at least one air source, the air inlet ends of the plurality of air flow channels being respectively connected to the air supply end of the air source, and the air source being used to supply air to the air flow channels; the absolute value of the difference in outlet pressure between any two outlet ends of the air flow channels being 0 to 1 MPa.

[0008] Optionally, a support member is provided on the outer side of each of the two ends of the plate body; one end of the support member is located above the plane where the surface of the plate body corresponding to the air outlet end of the air flow channel is located.

[0009] Optionally, the plate body includes a first surface and a second surface arranged opposite to each other, the first surface corresponds to the air inlet end of the air flow channel, and the second surface corresponds to the air outlet end of the air flow channel; the support member includes a first part arranged along the air flow direction in the air flow channel and a second part connected to one end of the first part; the second part extends away from one end of the first part to above the second surface.

[0010] Optionally, the orthographic projection of an end of the second portion away from the first portion on the plane where the second surface is located covers a portion of the air outlet end of the air flow channel.

[0011] Optionally, an orthographic projection of an end of the second portion away from the first portion on a plane where the second surface is located is located outside the plurality of air flow channels.

[0012] Optionally, the gas source is connected to a heater for heating the gas in the gas source.

[0013] Optionally, the air source is connected to the air inlet end of the air flow channel through an air pipe, one air pipe is connected to the air inlet end of at least one air flow channel, and an air pump is provided on the air pipe.

[0014] Optionally, a valve body is provided on the trachea for adjusting the airflow pressure in the trachea.

[0015] Optionally, the trachea is provided with a pressure gauge for monitoring the airflow pressure in the trachea.

[0016] Optionally, the inner diameter of the air flow channel gradually decreases from the air inlet end to the air outlet end.

[0017] The beneficial effect of the present invention is that the present invention provides an air flotation device, which opens an air flow channel on the surface of the plate body and controls the outlet pressure of the air flow channel to be close, that is, the absolute value of the difference between the outlet pressures of any two air flow channels is 0~1Mpa, thereby forming an air flotation (Air Float) air cushion composed of multiple air columns above the plate body. The substrate can be placed on the air flotation air cushion and heated by the outlet air of the air flow channel, thereby achieving uniform heating of the substrate, avoiding the difference in film thickness of the photoresist film layer on the substrate caused by uneven heating. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The technical solutions and other beneficial effects of the present invention will be made apparent by describing in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0019] Figure 1 It is a structural diagram of an existing substrate heating device;

[0020] Figure 2 is a schematic structural diagram of an air flotation device according to an exemplary embodiment of the present invention;

[0021] Figure 2a 1 is a schematic diagram of the structure of an air flotation device according to an exemplary embodiment of the present invention;

[0022] Figure 3 is a schematic structural diagram of an air flotation device according to another exemplary embodiment of the present invention;

[0023] Figure 3a is a schematic structural diagram of an air flotation device according to another exemplary embodiment of the present invention;

[0024] Figure 4 It is a structural schematic diagram of an air flotation device according to another exemplary embodiment of the present invention.

[0025] The direction of the arrow in the figure indicates the direction of air flow in the air flow channel.

[0026] The parts numbers in the figure are as follows:

[0027] 1. Base, 2. Adjacent pins, 100, 100', air flotation device, 110, plate, 110a, first surface, 110b, second surface, 111, 111', air flow channel, 111a, air inlet end, 111b, air outlet end, 120, air source, 121, air pipe, 122, air pump, 123, valve body, 124, pressure gauge, 130, heater, 140, air column, 150, air cushion, 160, support member, 160a, first part, 160b, second part. DETAILED DESCRIPTION

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0029] The air flotation device provided by the present invention forms an air flow channel on the surface of a plate body and controls the outlet pressure of the air flow channel to be close. That is, the absolute value of the difference in the outlet pressure of any two air flow channels is 0-1 MPa. This forms an air float cushion composed of multiple air columns above the plate body. The substrate can be placed on the air float cushion and heated by the air flow from the air flow channel, thereby achieving uniform heating of the substrate and avoiding the film thickness difference of the photoresist layer on the substrate caused by uneven heating. As a typical application, the air flotation device can be used in the substrate manufacturing process of display panels, such as liquid crystal display panels and OLED display panels.

[0030] In one embodiment of the present invention, referring to Figure 2 The air flotation device 100 includes a plate body 110, an air source 120, and a heater 130. A plurality of air flow channels 111 are formed on the surface of the plate body 110, each of which has an air inlet 111a at one end and an air outlet 111b at the other end. The air inlet 111a of each of the plurality of air flow channels 111 is connected to the air supply end of the air source 120, respectively. The air source 120 is used to supply air to the air flow channels 111. The absolute value of the difference in outlet pressure between the outlet ends 111b of any two air flow channels 111 is 0 to 1 MPa. That is, the outlet pressure between the outlet ends 111b of any two air flow channels 111 is the same (the difference is 0) or similar (the absolute value of the difference is up to 1 MPa). The outlet pressure is the air supply pressure of the air supply end of the air source 120.

[0031] When using, refer to Figure 2a, the air source 120 supplies air to the air inlet end 111a of the air flow channel 111 of the plate body 110, and the air is discharged from the air outlet end 111b of the air flow channel 111. The air flow in the air flow channel 111 is discharged from the air outlet end 111b of the air flow channel 111 and forms an air column 140. The air flow discharged from the air outlet ends 111b of multiple air flow channels 111 forms multiple air columns 140, and the multiple air columns 140 are combined to form an air cushion 150. Since the outlet pressures of the air outlet ends 111b of any two air flow channels 111 are the same (the difference is 0) or the outlet pressures are similar (the absolute value of the difference is 1 MPa at most), the heights of any two air columns 140 are similar, and the height of the air column 140 is the top of the air column 140. The distance between the end and the outlet end 111b of the air flow channel 111 makes the side of the air cushion 150 away from the plate 110 flat. The substrate 1 is placed on the air cushion 150. The air cushion 150 formed by the multiple air columns 140 can provide air-floating support for the substrate 1, so that the substrate 1 is suspended above the plate 110. The heater 130 heats the gas in the gas source 120. The gas source 120 provides hot gas to the air flow channel 111. The hot gas is discharged through the outlet end 111b of the air flow channel 111 to heat the substrate 1 placed on the air cushion 150. Since the heating is performed by the hot gas flow, the uniform heating of the substrate 1 can be ensured, avoiding the problem of uneven film thickness caused by uneven heating. In this embodiment, the distance between the opposing surfaces of the substrate 1 and the plate 110 is 30 to 40 μm.

[0032] The air source 120 is connected to the air inlet end 111a of the air flow channel 111 via an air pipe 121. In this embodiment, one air pipe 121 is connected to the air inlet end 111a of one air flow channel 111, and one end of the air pipe 121 away from the air inlet end 111a is connected to the air supply end of the air source 120. In other improvements, one air pipe 121 can be connected to the air inlet ends 111a of two or more air flow channels 111.

[0033] The air pipe 121 is provided with an air pump 122, which can increase the outlet pressure of the air at the outlet end 111b of the air flow channel 111, thereby increasing the height of the air column 140. The air pipe 121 is provided with a valve body 123 for regulating the air flow pressure within the air pipe 121. The valve body 123 is a solenoid valve that cooperates with the air pump 122 to adjust the outlet pressure of the air at the outlet end 111b of the air flow channel 111, thereby adjusting the height of the air column 140 and the distance between the base 1 and the plate 110 as needed. The air pipe 121 is provided with a pressure gauge 124 for monitoring the air flow pressure within the air pipe 121. The valve body 123 adjusts the air flow pressure within the air pipe 121 based on the air flow pressure value within the air pipe 121 displayed by the pressure gauge 124.

[0034] In another embodiment, reference Figure 3The air flotation device 100' includes a plate 110, an air source 120, a heater 130, and at least two support members 160. A support member 160 is provided on the outer sides of each end of the plate 110. The plate 110 includes a first surface 110a and a second surface 110b that are oppositely disposed. The first surface 110a corresponds to the air inlet end 111a of the air flow channel 111, and the second surface 110b corresponds to the air outlet end 111b of the air flow channel 111. The support member 160 includes a first portion 160a disposed along the air flow direction in the air flow channel 111 and a second portion 160b connected to one end of the first portion 160a. The second portion 160b extends away from one end of the first portion 160a to above the second surface 110b. In this embodiment, the air flow direction in the air flow channel 111 is set vertically, the first part 160a is set vertically, and the second part 160b is set horizontally perpendicular to the air flow direction. The second parts 160b of the two support members 160 cooperate to form a support for the substrate 1, and the air cushion 150 formed by the two support members 160 and multiple air columns 140 cooperates to support the substrate 1, thereby ensuring the stability of the substrate 1, and further ensuring the uniformity of the outlet airflow at the outlet end 111b of the air flow channel 111 to heat the substrate 1.

[0035] In this embodiment, the orthographic projection of the end of the second portion 160b away from the first portion 160a on the plane where the second surface 110b is located covers part of the air outlet end 111b of the air flow channel 111, for example, covers 0.5 to 2 air outlet ends 111b of the air flow channels 111 close to the side wall of the plate body 110. In this way, the support member 160 can be ensured. Although the second portion 160b of the support member 160 contacts the edge of the substrate 1 to form heat conduction, the heat conduction is only limited to the edge of the substrate 1. Since the interior of the substrate 1 is only heated by the airflow, the thickness difference of the photoresist film layer will not be generated inside the substrate 1 due to the heat conduction temperature difference, thereby ensuring the uniformity and flatness of the photoresist film layer.

[0036] As another embodiment, refer to Figure 3a The orthographic projection of the end of the second portion 160b away from the first portion 160a on the plane where the second surface 110b is located is located outside the air flow channel 111, that is, the orthographic projection of the end of the second portion 160b away from the first portion 160a on the plane where the second surface 110b is located does not cover the air outlet end 111b of any air flow channel 111, thereby ensuring full utilization of the air flow channel 111.

[0037] In another embodiment of the present invention, referring to Figure 4The inner diameter of the air flow channel 111' gradually decreases from the air inlet end 111a to the air outlet end 111b, that is, a trapezoidal cross-section structure of the air flow channel 111' is formed. Such a structural design can further increase the outlet pressure of the air outlet end 111b.

[0038] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make multiple improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. An air flotation device, characterized in that: include: The plate body has a plurality of air flow channels formed on its surface, one end of the air flow channel is an air inlet end, and the other end of the air flow channel is an air outlet end; as well as At least one air source, the air inlet ends of the plurality of air flow channels are respectively connected to the air supply ends of the air source, the air source is used to supply air to the air flow channels, and the air flow in the air flow channels is discharged from the air outlet ends to form air columns; The absolute value of the difference between the outlet pressures of any two outlet ends of the air flow channels is 0-1 MPa; A support member is respectively provided on the outer sides of both ends of the plate; One end of the support member is located above the plane of the plate surface corresponding to the air outlet end of the air flow channel; The plate body includes a first surface and a second surface arranged opposite to each other, the first surface corresponds to the air inlet end of the air flow channel, and the second surface corresponds to the air outlet end of the air flow channel; The support member includes a first portion arranged along the airflow direction in the airflow channel and a second portion connected to one end of the first portion; The second portion extends away from one end of the first portion to above the second surface, and the support member cooperates with the air cushion formed by the plurality of air columns to support the base.

2. The air flotation device according to claim 1, wherein The orthographic projection of one end of the second portion away from the first portion on the plane where the second surface is located covers a portion of the air outlet end of the air flow channel.

3. The air flotation device according to claim 1, wherein An orthographic projection of an end of the second portion away from the first portion on a plane where the second surface is located is located outside the plurality of air flow channels.

4. The air flotation device according to claim 1, wherein The gas source is connected to a heater for heating the gas in the gas source.

5. The air flotation device according to claim 4, wherein: The air source is connected to the air inlet end of the air flow channel through an air pipe, one air pipe is connected to the air inlet end of at least one air flow channel, and an air pump is provided on the air pipe.

6. The air flotation device according to claim 5, wherein: The air pipe is provided with a valve body for adjusting the air flow pressure in the air pipe.

7. The air flotation device according to claim 6, wherein: The trachea is provided with a pressure gauge for monitoring the airflow pressure in the trachea.

8. The air flotation device according to claim 1, wherein The inner diameter of the air flow channel gradually decreases from the air inlet end to the air outlet end.

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