MEMS packaging method

By using a vacuum oven and inverted mold technology in the MEMS packaging process and using epoxy resin to seal the small holes in the packaging shell, the problems of increased product thickness and rising costs are solved, ensuring the stability and competitiveness of the product.

CN114195091BActive Publication Date: 2025-10-24SUZHOU GOODARK ELECTRONICS CO LTD
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Patent Information

Application Number
CN202111444955.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-11-30
Publication Date
2025-10-24
Estimated Expiration
2041-11-30

AI Technical Summary

Technical Problem

The existing MEMS packaging technology leads to increased product thickness and rising costs, which affects product competitiveness and market promotion. In addition, the small holes after packaging are easily affected by high-temperature reflow, resulting in signal deterioration.

Method used

Using traditional plastic encapsulation resin materials combined with a vacuum oven and an inverted sealing mold, molten epoxy resin is squeezed through the small holes under vacuum conditions to seal the small holes in the packaging shell, forming a resin layer of about 0.1mm to prevent the small holes from expanding during high-temperature reflow, and the small holes are sealed through high-temperature insulation curing.

Benefits of technology

This achieves the goal of plugging small holes without increasing product size and cost, avoiding the problem of small holes expanding during high-temperature reflow, maintaining product stability and reducing packaging costs.

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Abstract

The application relates to a MEMS packaging method, which comprises the following steps: mounting a chip set on a substrate, connecting gold wires between the chip set and the substrate by bonding after baking; dotting tin paste on copper foils around the substrate, arranging a packaging shell cover on the tin paste of the substrate, melting the tin paste by reflow soldering to weld the packaging shell and the substrate, sticking the upper surface of the top surface of the packaging shell to a flip mold with epoxy resin, extruding the epoxy resin into the cavity of the packaging shell and plugging the small holes after heating, curing the product to solidify the epoxy resin in the cavity of the packaging shell and the small holes, performing laser printing on the product according to requirements, and cutting the product into single finished products by using a cutting machine. The method can achieve the purpose of plugging the small holes, does not increase the size of the product, does not increase the production cost of the product, and has strong practicability.
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Citation Information

Patent Citations

  • Micro-electro-mechanical system packaging structure and manufacturing method thereof

    CN111498791A

  • Semiconductor acceleration sensor device and method for manufacturing the same

    CN1710427A