Gas supply device, photolithography device, and article manufacturing method

Abstract

The present invention provides a gas supply device, a photolithography device, and an article manufacturing method. A technology is provided that is advantageous for reducing the temperature distribution in a space with a simple structure. The gas supply device includes a frame constituting a gas blowing outlet and a cover having a gap between the frame and the cover and covering the frame. The cover has an opening portion through which the gas blown out from the blowing outlet passes. When the blowing outlet is viewed from the front in a plan view, the opening portion is smaller than the blowing outlet and is located in a position converging in the area of ​​the blowing outlet. The cover has a first portion that faces a portion of the blowing outlet and a first surface of the frame in a plan view and forms the opening portion, and a second portion that extends from the first portion and faces a second surface of the frame that is different from the first surface. The first portion guides a portion of the gas blown out from the blowing outlet to the gap, and the gap constitutes a flow path for the gas guided by the first portion.

Description

Technical Field

[0001] The present invention relates to a gas supply device, a photolithography device and an article manufacturing method. Background Art

[0002] In the exposure device used in the manufacturing process (photolithography process) of liquid crystal panels or semiconductor devices, the original plate and the substrate are respectively held on the original plate table and the substrate table, and are repeatedly scanned and moved. In order to improve the accuracy of the exposure accompanied by the scanning movement, it is necessary to accurately control the position of the original plate table and the substrate table. For this purpose, the position of the original plate table and the substrate table is measured by a high-precision measuring instrument. As a high-precision measuring instrument, there is an encoder or an interferometer. For these measuring instruments, if the refractive index of the air in the optical path changes, the optical path length will change. Therefore, in cases where high-precision position measurement is required, it is necessary to prevent the refractive index of the air in the optical path from changing (not to cause the air to shake). Since the refractive index changes with temperature, humidity, and pressure, it is important to keep these physical properties constant. Therefore, in the exposure device, the following structure is known: the substrate table and its measuring instrument are enclosed in a space (substrate table space), and the substrate table space is air-conditioned, thereby keeping the temperature, humidity, and pressure of the optical path of the measuring instrument constant. Furthermore, known configurations include methods that unidirectionally regulate the entire substrate stage space and methods that locally and centrally regulate air in the optical path of the measuring instrument. The above configurations also apply to the air conditioning of the space containing the master stage and its measuring instrument (the master stage space).

[0003] However, when the substrate worktable space or the master worktable space is air-conditioned, simply flowing air cannot maintain a constant refractive index in the measuring instrument's optical path. This is because the substrate worktable space contains numerous heat sources, and this heat can reach the measuring instrument's optical path. For example, the actuators and substrates used to drive the substrate worktable, as well as the electrical components of the various measurement systems, can serve as heat sources. Furthermore, heat can sometimes be transferred from components connected to the space outside the substrate worktable space to components within the substrate worktable, from which it diffuses and transfers to the measuring instrument's optical path. Furthermore, as the substrate worktable scans, even if the measuring instrument's optical path exists upstream of the air conditioning airflow, heat from downstream of the air conditioning airflow can sometimes diffuse and reach the measuring instrument's optical path. Furthermore, the air conditioning unit housing that supplies air sometimes develops a temperature distribution due to heat, and the air conditioning air within the housing itself also has a temperature distribution. The influence of these heat sources causes temperature fluctuations in the measuring instrument's optical path, reducing measurement accuracy. This reduced measurement accuracy also leads to a reduction in exposure accuracy.

[0004] Patent Document 1 discloses a configuration in which the temperature of the wall surface of the substrate stage space is measured and a gas controlled to a temperature approximately equal to that temperature is supplied to the entire substrate stage space. This configuration reduces the temperature gradient within the substrate stage space because the wall surface connecting to the space outside the substrate stage space and the temperature of the conditioned gas are approximately equal. Consequently, temperature fluctuations in the optical path of the measuring instrument are minimized.

[0005] Patent Document 2 discloses a configuration that utilizes the Bernoulli effect to draw conditioned air into a duct and then blows the air from the duct toward the optical path of a measuring instrument. This configuration allows heat from the space where the substrate stage moves, such as heat generated by the actuator or the circuit components that drive the actuator, to reach the optical path of the measuring instrument, thereby reducing temperature fluctuations.

[0006] Furthermore, the heat in the substrate stage space causes the air conditioner housing to have a temperature distribution. To prevent the air conditioning air in the housing from having a temperature distribution, a heat insulating material is sometimes attached to the housing wall.

[0007] Patent Document 3 discloses a configuration in which a closed space is formed on the wall of a housing and gas is supplied separately to the closed space. This configuration fills the closed space with gas to form a heat transfer reduction portion, thereby reducing heat transfer from outside the housing to inside the housing.

[0008] Prior art literature

[0009] Patent Document 1: Japanese Patent Application Laid-Open No. 9-82626

[0010] Patent Document 2: Japanese Patent Application Laid-Open No. 2015-95503

[0011] Patent Document 3: Japanese Patent Application Laid-Open No. 2013-161991 Summary of the Invention

[0012] Problems to be solved by the invention

[0013] However, in Patent Document 1, since the temperature of the entire air conditioning system is controlled by measuring the temperature of the wall surface, the temperature of the air conditioning system cannot be controlled locally relative to the local temperature distribution of the space where the substrate stage moves. Consequently, the gas with the local temperature distribution remains in the optical path leading to the measuring device, causing temperature fluctuations.

[0014] In Patent Document 2, when heat diffuses around the pipe due to the movement of the substrate stage, a localized temperature distribution occurs in the pipe, which in turn creates a localized temperature distribution in the gas within the pipe. As a result, the gas with this localized temperature distribution is blown into the optical path of the measuring instrument, causing temperature fluctuations. Furthermore, if thermal insulation is applied to prevent heat transfer to the pipe or housing, heat from the substrate stage space becomes difficult to recover. Consequently, this diffused heat may easily reach the optical path of the measuring instrument, causing temperature fluctuations in the optical path of the measuring instrument.

[0015] When a closed space is provided on a wall surface as in Patent Document 3, a gas supply system must be provided to supply a gas different from the gas used for air conditioning to the closed space, which complicates the structure.

[0016] The present invention provides a technology that is advantageous for reducing the temperature distribution in a space with a simple structure.

[0017] Solutions to Problems

[0018] According to the first aspect of the present invention, a gas supply device is provided, characterized in that the above-mentioned gas supply device comprises: a frame, which constitutes a gas blowing outlet; and a cover, which is provided with a gap between the cover and the above-mentioned frame and covers the above-mentioned frame, the above-mentioned cover has an opening portion, which allows the gas blown out from the above-mentioned blowing outlet to pass through, and when viewed in a plane when the above-mentioned blowing outlet is viewed from the front, the above-mentioned opening portion is smaller than the above-mentioned blowing outlet and is located at a position converged in the area of ​​the above-mentioned blowing outlet, the above-mentioned cover comprises: a first part, which is opposite to a part of the above-mentioned blowing outlet and the first surface of the above-mentioned frame when viewed in the above-mentioned plane and forms the above-mentioned opening portion; and a second part, which extends from the above-mentioned first part and faces a second surface of the above-mentioned frame different from the above-mentioned first surface, the above-mentioned first part guides a part of the gas blown out from the above-mentioned blowing outlet to the above-mentioned gap, and the above-mentioned gap constitutes a flow path for the gas guided by the above-mentioned first part.

[0019] According to the second aspect of the present invention, there is provided a photolithography apparatus for forming a pattern on a substrate, wherein the photolithography apparatus comprises: a substrate worktable for holding the substrate and moving the substrate; a measuring instrument for emitting measuring light and measuring the position of the substrate worktable using the measuring light reflected by the substrate worktable; and a gas supply device according to the first aspect, wherein the gas supply device is configured to supply the gas blown out from the blowing port through the opening to a first space including the substrate worktable and the measuring instrument.

[0020] According to the third aspect of the present invention, there is provided a photolithography apparatus which forms a pattern on a substrate using an original plate, and is characterized in that the above-mentioned photolithography apparatus comprises: an original plate workbench which holds the above-mentioned original plate and moves; a measuring instrument which emits measuring light and uses the measuring light reflected by the above-mentioned original plate workbench to measure the position of the above-mentioned original plate workbench; and a gas supply device involved in the above-mentioned first aspect, wherein the above-mentioned gas supply device is configured to supply the gas blown out from the above-mentioned blowing outlet through the above-mentioned opening to the first space including the above-mentioned original plate workbench and the above-mentioned measuring instrument.

[0021] According to the fourth aspect of the present invention, there is provided a method for manufacturing an article, characterized in that the method comprises: a process of forming a pattern on a substrate using the photolithography device involved in the second aspect or the third aspect; and a process of processing the substrate on which the pattern has been formed, and manufacturing an article from the processed substrate.

[0022] Effects of the Invention

[0023] According to the present invention, it is possible to provide a technique that is advantageous in reducing the temperature distribution in a space with a simple configuration. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a diagram showing a configuration example of a gas supply device.

[0025] Figure 2(a) to Figure 2(c) It is a diagram showing a configuration example of a gas supply device.

[0026] 3( a ) and 3 ( b ) are diagrams showing an example of arrangement of an adjustment unit in a gas supply device.

[0027] Figure 4 It is a diagram showing an example of arrangement of a gas supply device.

[0028] 5( a ) and 5 ( b ) are diagrams showing an example of arrangement of an exhaust mechanism in a gas supply device.

[0029] Figure 6 It is a diagram showing an example of arrangement of an exhaust mechanism in a gas supply device.

[0030] Figure 7 It is a diagram showing an example of arrangement of a gas supply device in an exposure apparatus.

[0031] Figure 8 It is a diagram showing an example of arrangement of a gas supply device in an exposure apparatus.

[0032] 9( a ) and 9 ( b ) are diagrams showing an example of arrangement of a gas supply device in an exposure apparatus.

[0033] Figure 10It is a diagram showing the configuration of a gas supply device in an exposure apparatus.

[0034] Figure 11 It is a diagram showing the configuration of a gas supply device in an exposure apparatus.

[0035] Figure 12 It is a diagram showing the configuration of an exposure apparatus including a gas supply device. DETAILED DESCRIPTION

[0036] The following embodiments are described in detail with reference to the accompanying drawings. The following embodiments do not limit the inventions described in the claims. While various features are described in the embodiments, not all of these features are essential components of the invention, and any combination of these features is possible. Furthermore, identical or similar components are denoted by the same reference numerals in the accompanying drawings, and repeated descriptions are omitted.

[0037] The present invention relates to a gas supply device that facilitates the reduction (homogenization) of temperature distribution within a space. An example of applying the gas supply device of the present invention to a photolithography apparatus for forming a pattern on a substrate is described below. The photolithography apparatus includes, for example, an exposure device or an imprinting device. The exposure device exposes a photoresist supplied to a substrate via an original plate, thereby forming a latent image corresponding to the pattern of the original plate on the photoresist. The imprinting device applies hardening energy to the imprinting material supplied to the substrate by bringing the formable material (imprinting material) into contact with a mold, thereby forming a hardened material pattern that is a transfer of the concave and convex pattern of the mold.

[0038] Hereinafter, an example in which the gas supply device is applied to an exposure apparatus as an example of a photolithography apparatus will be described.

[0039] <First embodiment>

[0040] exist Figure 1 The structure of the gas supply device 10 in the embodiment is shown in FIG. Figure 12 , which is a diagram showing the structure of an exposure apparatus having a gas supply device 10. In this specification and the accompanying drawings, directions are expressed in an XYZ coordinate system in which a horizontal plane is set as an XY plane. Generally speaking, a substrate W, which is a substrate to be exposed, is placed on a substrate workbench 4 in such a manner that its surface is parallel to the horizontal plane (XY plane). Therefore, hereinafter, directions orthogonal to each other in a plane along the surface of the substrate W are referred to as the X-axis and the Y-axis, and a direction perpendicular to the X-axis and the Y-axis is referred to as the Z-axis. In addition, hereinafter, directions parallel to the X-axis, the Y-axis, and the Z-axis in the XYZ coordinate system are referred to as the X-direction, the Y-direction, and the Z-direction, respectively.

[0041] The exposure device includes an illumination optical system 1, an original plate worktable 3, a projection optical system 2, a substrate worktable 4, and a control unit 6. The illumination optical system 1 uses light from a light source 5 to illuminate the original plate M held on the original plate worktable 3. The projection optical system 2 projects the pattern of the original plate M onto the substrate W held on the substrate worktable 4. The original plate worktable 3 holds the original plate and moves. The substrate worktable 4 holds the substrate and moves. The substrate worktable 4 and the original plate worktable 3 are scanned and driven by the control unit 6 based on their respective position information. The position of the substrate worktable 4 is measured by the first measuring device 8a, and the position of the original plate worktable 3 is measured by the second measuring device 8b. The first measuring device 8a and the second measuring device 8b can be encoders or interferometers. For example, when the first measuring device 8a is an interferometer, the first measuring device 8a emits measurement light toward the substrate worktable 4, detects the measurement light reflected by the interferometer reflector provided on the end face of the substrate worktable 4, and thereby measures the position of the substrate worktable 4. In addition, in Figure 12 , only one first measuring instrument 8a is shown, but a plurality of first measuring instruments 8a may be provided so as to be able to measure the XY position, rotation amount, and tilt amount of the substrate stage 4. The second measuring instrument 8b may also be configured similarly to the first measuring instrument 8a.

[0042] The first space 21 is separated from the second space 22 by a wall 30. The first space 21 is, for example, a space inside an exposure device. In this case, the wall 30 may be formed by a structure or chamber that supports the projection optical system 2 and the substrate workbench 4. The wall 30 may also be formed by a path for moving gas, such as a shelf, a frame, or a pipe for the substrate to enter. The space in the first space 21 that is air-conditioned by the gas supply device 10 arranged on the side of the substrate workbench 4 is referred to as the first space 21a, and the space that is air-conditioned by the gas supply device 10 arranged on the side of the original plate workbench 3 is referred to as the first space 21b. The second space 22 refers to a space different from the first space 21, and is typically a space outside the exposure device, but may also be a space inside the exposure device.

[0043] The substrate stage 4 and the first measuring instrument 8a are arranged in the first space 21a, and the master stage 3 and the second measuring instrument 8b are arranged in the first space 21b. The gas supply device 10 supplies the gas G whose temperature is regulated by the air conditioner 7 to the first spaces 21a and 21b. The frame 12a forms the blowing port 11 in a manner that blows the gas G toward the first space 21a. In addition, the frame 12c (second frame) is formed so as to extend from the blowing port 11 above the first optical path 34a, which is the optical path of the measurement light of the first measuring instrument 8a, and guide the gas G blown out from the blowing port 11 toward the first optical path 34a. Similarly, the frame 12b forms the blowing port 11 in a manner that blows the gas G toward the first space 21b. The housing 12d (second housing) extends from the outlet 11 above the second optical path 34b, which is the optical path of the measurement light of the second measuring device 8b, and guides the gas G blown out from the outlet 11 to the second optical path 34b.

[0044] The gas supply device 10 includes at least one of the housings 12a, 12b, 12c, and 12d. The gas G supplied from the air conditioner 7 is supplied to the first spaces 21a and 21b, the first optical path 34a, and the second optical path 34b. The gas G in the first spaces 21a and 21b is exhausted to the second space 22 by the exhaust mechanism 18, and a portion of the gas G is returned to the air conditioner 7.

[0045] The air conditioner 7 supplies the gas G to the gas supply device 10. The air conditioner 7 may include a temperature measuring device for measuring the temperature of the gas G, a temperature regulator for regulating the temperature of the gas G, and the like in addition to a fan, a duct, and a valve.

[0046] In the first spaces 21a and 21b, there are heat sources originating from the substrate stage 4 or the master stage 3. For example, the actuators driving the substrate stage 4 or master stage 3, the actuator control boards, and electrical components related to position control can serve as heat sources. Furthermore, the walls 30 that constitute the first spaces 21a and 21b, as well as the components 32 and 33 connected to the walls 30, also receive heat from the second space 22 outside of them and serve as heat sources. Heat diffuses from these heat sources and reaches the first optical path 34a or the second optical path 34b, causing temperature fluctuations in the first optical path 34a or the second optical path 34b. Furthermore, heat is transferred to the housing 12a, 12b, 12c, or 12d. While the gas G within these housings 12a to 12d has a temperature distribution, the gas G is supplied to the first optical path 34a or the second optical path 34b, causing temperature fluctuations. Furthermore, the scanning movement of the substrate stage 4 or the original plate stage 3 disrupts the air conditioning in the first spaces 21a and 21b, causing heat to diffuse and potentially reach the first and second optical paths 34a and 34b. Similarly, heat reaches the housings 12a, 12b, 12c, and 12d. When the gas G within the housings 12a to 12d has a temperature distribution, the gas G is supplied to the first and second optical paths 34a and 34b, causing temperature fluctuations. To reduce the temperature fluctuations in the first and second optical paths 34a and 34b caused by this heat, the gas supply device 10 supplies the gas G with a reduced temperature distribution to the first and second optical paths 34a and 34b. This reduces the temperature distribution in the first and second optical paths 34a and 34b.

[0047] like Figure 1As shown, the gas supply device 10 includes: a frame 12 constituting a gas outlet 11 for guiding the gas G to the first space 21; and a cover 13 surrounding at least a portion of the side surface of the frame 12 and covering the frame 12. The cover 13 is provided with a gap 14 between itself and the frame 12, and is configured to cover the frame 12. In addition, the cover 13 has an opening 15 through which the gas blown out from the outlet 11 passes. When viewed from the front (viewed from the Y direction) in a plan view, the opening 15 is smaller than the outlet 11 and is located in a position converging within the area of ​​the outlet 11. The cover 13 has an air guide member 16, which is a first portion that faces a portion of the outlet 11 and the end face (first face) of the frame 12 in a plan view when viewed from the Y direction and forms the opening 15. The cover 13 further includes a second portion 162 that extends from the air guide member 16 and faces the outer side surface (second surface) of the frame 12 that is different from the end surface of the frame 12. The air guide member 16 guides a portion of the gas G blown out from the air outlet 11 toward the gap 14. The air guide member 16 is formed so as to shield a portion of the gas G blown out from the air outlet 11, and the shielded gas is guided toward the gap 14. The gap 14 constitutes a flow path for the gas guided by the air guide member 16.

[0048] The gas supply device 10 is connected to external devices including a fan or compressor, piping such as pipes, tubes, or hoses, adjustment components such as valves, throttles, and regulators, a temperature measuring device for measuring the temperature of the gas G, and a temperature regulator for adjusting the temperature of the gas G. Alternatively, the gas supply device 10 may include the above-mentioned components within the housing 12. The temperature of the gas G can be adjusted, for example, by the temperature measuring device and the temperature regulator.

[0049] In this embodiment, when the gas G is blown out from the blowout port 11, a portion of the gas G is caused to flow toward the gap 14 by the air guide member 16. Thus, the gap 14 becomes an air layer with a heat-insulating effect relative to the inside of the gas supply device 10, reducing the influence of heat from the outside. Furthermore, the gap 14 becomes an air layer with a temperature-regulating effect relative to the outside of the gas supply device 10. For example, assume that there is a heat source outside the gas supply device 10, that is, in the first space 21. Assume that heat diffuses from this heat source and reaches the gas supply device 10. In the absence of the cover 13, a temperature distribution is formed in the frame 12, and this temperature distribution also causes a temperature distribution in the gas G inside the frame 12. On the other hand, if the cover 13 is provided, a portion of the gas G flows toward the gap 14 between the cover 13 and the frame 12. The heat that reaches the cover 13 is recovered by the gas G and discharged from the gap 14. As a result, heat can be prevented from reaching the frame 12, and the temperature distribution of the gas G can be reduced.

[0050] The same can be said for the heat in first space 21. The heat in first space 21 is recovered by gas G via cover 13 and discharged from gap 14. This is an effect that cannot be achieved with a structure in which a heat insulating material is attached to frame 12 or the like.

[0051] Thus, in this embodiment, since heat is recovered from the gap 14, the flow of gas G, and the structure of the cover 13, it is preferable that the gap 14 is large and the flow of gas G is fast. In addition, since the heat recovered by the gas G is discharged from the gap 14, it is preferable that the outlet of the gap 14 is arranged away from the opening 15. In addition, the shape of the opening 15 can be set arbitrarily, and the supply range of the gas G blown out from the blowing port 11 can be adjusted to any range. Furthermore, since it is a structure that utilizes a part of the gas G, there is no need to prepare gas separately, and there is no need to add a separate gas supply device. Therefore, according to this embodiment, effective air conditioning in the exposure device can be achieved with a simple structure.

[0052] Reference Figure 2(a) to Figure 2(c) Several configuration examples of the gas supply device 10 will be described. Figure 2(a) to Figure 2(c) In each of the figures, the left figure is a cross-sectional view when the gas supply device 10 is viewed from the X direction, and the right figure is a front view when the gas supply device 10 is viewed from the Y direction.

[0053] The structure shown in Figure 2(a) is Figure 1 The same structure. The cover 13 is configured to cover the entire frame 12. In this case, the cover 13 can be formed, for example, in accordance with the outer shape of the frame 12. However, the entire frame 12 may not be covered by the cover 13. Whether an effective air-conditioning effect can be obtained depends on the temperature distribution in the first space 21. It is better to configure the cover 13 for the part where the influence of heat from the first space 21 is to be reduced. Preferably, the cover 13 can be configured to be larger within the range extended from the part. Therefore, since it can cope with a wide range of temperature distribution in the first space 21 by covering the entire frame 12, it is more preferred.

[0054] In FIG2 (a), the gap 14 is provided between the end face of the frame 12 and the air guide member 16 (the first part) and between the outer side surface of the frame 12 and the second part 162. In addition, the cover 13 is fixed to the frame 12 at multiple locations by means of gaskets, bolts, etc. In the example of FIG2 (a), the outlet of the flow path formed by the gap 14 is formed at both ends in the Z direction and both ends in the X direction. In this case, it is particularly effective for the temperature distribution near the air outlet 11 or in the Z direction of the frame 12.

[0055] In contrast, Figure 2(b) shows an example in which the cover 13 is arranged only in front of the blow-out port 11 (the surface of the gas outlet). In Figure 2(b), the gap 14 is provided between the end face of the frame 12 and the air guide member 16 (the first part), but is not provided between the outer side surface of the frame 12 and the second part 162. Therefore, in the example of Figure 2(b), the outlet of the flow path formed by the gap 14 is not formed at the end in the Z direction, but is formed only at the two end portions in the X direction. The configuration of Figure 2(b) is effective for the temperature distribution near the blow-out port 11. In this way, the configuration of the cover 13 can be arbitrarily set according to the temperature distribution of the first space 21.

[0056] In addition, the shape of the opening 15 can be formed in accordance with the shape of the area where the gas is blown out from the gas supply device 10. In Figure 2(a), the shape of the opening 15 is set to be square, but it can also be a triangle, a trapezoid, a concave-convex shape, a shape that combines straight lines and curves, or a shape with multiple openings. In the case where the opening 15 adopts a complex shape, it is also possible that the gas G is not blown out from the opening 15 with a uniform flow rate distribution. In this case, the pressure loss at the gas outlet can be increased by forming a filter, a sintered body, a punched metal, etc. in the gas outlet portion of the blowing port 11, so that the gas G is blown out with a uniform flow rate distribution.

[0057] The air guide member 16 is configured to shield a portion of the gas G relative to the blow-out port 11 and can guide the gas G toward the gap 14. For example, as shown in FIG2(a) and FIG2(b), when the blow-out port 11 is viewed from the front (viewed from the Y direction), the opening 15 is smaller than the blow-out port 11 and is located in a position that converges within the area of ​​the blow-out port 11. In addition, the shape of the opening 15 can shield a portion of the gas G even if it is a structure that is only partially smaller than the blow-out port 11, as long as the gas G can be guided toward the gap 14. In addition, as shown in FIG2(c), the cover 13 can also have a third portion 163 that extends from the air guide member 16 toward the interior of the blow-out port 11 and faces the inner side surface (third surface) of the frame 12 that is different from the end surface and the outer side surface. By extending the air guide member 16 in this way so that it enters the interior of the frame 12, the gas can be more effectively guided toward the gap 14.

[0058] exist Figure 2(a) to Figure 2(c) In the embodiment, the air guide member 16 is formed around the entire periphery of the air outlet 11. However, the air guide member 16 may be formed only in a portion of the air outlet 11. The air guide member 16 only needs to guide the gas G to a portion of the gap 14. Preferably, the gas G is distributed throughout the entire gap 14. The reason for this being preferable is that the gas G forms the gap 14 into a heat-insulating air layer and a temperature-regulating air layer.

[0059] To ensure that the gas G flows throughout the gap 14, the position of the cover 13 relative to the frame 12 can be adjusted to adjust the size of the gap 14. As shown in Figures 3(a) and 3(b), the gas supply device 10 can further include an adjustment unit 17 that adjusts the flow rate of the gas flowing through the flow path formed by the gap 14. The adjustment unit 17 has the function of partially increasing or decreasing the size of the gap 14 and can be comprised of, for example, a plate or block that can move up and down relative to the gap. For example, as shown in Figure 3(a), the adjustment unit 17 can be positioned at the outlet of the gap 14 to adjust the size of the gap 14b at that location, thereby adjusting the flow rate or flow velocity of the gas G flowing through the gap 14a. This allows the gas G to flow throughout the gap 14. Alternatively, as shown in Figure 3(b), the adjustment unit 17 can be positioned midway along the path of the gap 14 to adjust the size of the gap 14b at that location, thereby adjusting the flow rate or flow velocity of the gas G flowing through the gap 14a. In addition, when the structure shown in FIG. 2( b ) is adopted, the adjustment portion 17 may be arranged at the end portion of the gap 14 in the X direction.

[0060] The thermal insulation effect and the temperature regulation effect vary depending on the size of the gap 14 and the flow rate or flow velocity of the gas G flowing through the gap 14. In terms of forming the gap 14 into a thermal insulation air layer and a temperature regulation air layer by the gas G, it is preferable that the size of the gap 14 is large, and the flow rate or flow velocity of the gas G flowing through the gap 14 is also preferably large. However, it is important to achieve a balance with the amount of gas G blown out from the blowout port 11 to the first space 21. The adjustment unit 17 is effective in achieving this balance. For example, if the gap 14 is simply increased, the amount of gas G blown out from the blowout port 11 to the first space 21 will decrease. In this case, the adjustment unit 17 is used to adjust the gap 14b to be smaller. Thus, even if the gap 14 is increased, the adjustment unit 17 can prevent the amount of gas G blown out from the blowout port 11 to the first space 21 from decreasing. In addition, when the frame 12 has a complex structure, it is sometimes difficult to control the size of the gap 14 by the shape of the cover 13. In this case, the flow rate of the gas G fed into the gap 14 can also be adjusted by providing the adjustment portion 17 .

[0061] The specific size of gap 14 is determined based on the temperature difference between gas G and first space 21, the permissible temperature variation of gas G, and other factors. For example, if the temperature difference between gas G and first space 21 and the permissible temperature variation of gas G are between 1 / 100°C and 1 / 10°C, the size of gap 14 can be, for example, between 1 / 10 mm and 2 mm. If the temperature difference between gas G and first space 21 is between 1 / 10°C and 1°C, the size of gap 14 can be, for example, between 2 mm and 20 mm.

[0062] <Second embodiment>

[0063] 5(a) and 5(b) are diagrams showing the configuration of a gas supply device 10 in the second embodiment. Components not specifically mentioned in the following description are the same as those in the first embodiment.

[0064] In the second embodiment, as shown in Figures 5(a) and 5(b), an exhaust mechanism 18 is disposed near the housing 12. The exhaust mechanism 18 is connected to the second space 22 and discharges at least a portion of the gas G within the first space 21 into the second space 22, which is separated from the first space 21. In particular, the exhaust mechanism 18 discharges at least a portion of the gas G that has passed through the flow path formed by the gap 14 into the second space 22. This discharges heat recovered from the first space 21 by the gas G passing through the gap 14 into the second space 22, preventing it from returning to the first space 21. If the recovered heat returns to the first space 21, it will reach the cover 13 again, creating an opportunity for the heat to be transmitted to the interior of the housing 12. Therefore, by preventing the recovered heat from returning to the first space 21, the heat is effectively prevented from being transmitted to the interior of the housing 12. Therefore, the configuration of this embodiment has the effect of reducing the temperature distribution of the gas G entering the housing 12 compared to a configuration without the exhaust mechanism 18.

[0065] From the perspective of discharging the gas G that has recovered heat through the aforementioned gap 14, the exhaust mechanism 18 may be disposed near the frame 12, but is preferably disposed near the outlet of the flow path formed by the gap 14. In addition, the number of exhaust mechanisms 18 may be one as shown in FIG5(a) or multiple as shown in FIG5(b). From the perspective of discharging the gas G that has recovered heat through the gap 14, it is more preferable to configure multiple exhaust mechanisms 18 corresponding to the multiple outlets of the gap 14. In addition, it is also possible as shown in FIG5(a). Figure 6 As shown, the exhaust mechanism 18 is directly connected to the gap 14 at the outlet of the gap 14 .

[0066] <Third embodiment>

[0067] In the first and second embodiments described above, the cover 13 of the gas supply device 10 is entirely contained in the first space 21. However, the gas supply device 10 may be arranged so that part of the cover 13 is located in the first space 21 and part of the cover 13 is located in the second space 22. Figure 4 yes Figure 1 A modification of . Figure 4In the example shown in FIG. 1 , the front end of the cover 13 (i.e., the inlet of the flow path formed by the gap 14) communicates with the first space 21. Meanwhile, the rear end of the cover 13 (i.e., the outlet of the flow path formed by the gap 14) protrudes toward the second space 22 from the wall 31 that separates the first space 21 and the second space 22, and communicates with the second space 22. In this case, since the heat recovered by the gas G passing through the gap 14 is directly discharged to the second space 22, it is more effective in reducing the thermal impact within the first space 21.

[0068] Figure 7 1 is a diagram showing an example of a gas supply device 10 disposed near the substrate stage 4 in order to perform air conditioning on the entire first space 21a in the exposure apparatus. Figure 7 As shown in FIG. 1 , the gas supply device 10 is arranged on the wall forming the first space 21a or on the interface between the first space 21a and the second space 22. A portion of the gas G flows through the frame 12c to the first optical path 34a. A portion of the gas G also flows between the projection optical system 2 and the substrate workbench 4 through the frame 12c. In addition, the gas supply device 10 can also be arranged on one side and the other side of the wall or interface forming the first space 21a. For example, Figure 8 As shown in the figure, the gas supply device 10 can also be arranged on the walls that are orthogonal to each other. The gas G supplied from the gas supply device 10 is discharged to the second space 22 by the exhaust mechanism 18. In addition, when the airtightness of the first space 21a is not high, the gas G can also leak into the second space 22 from the gap of the first space 21a. According to this embodiment, the temperature distribution of the gas G flowing out from the gas blowing port 11 can be reduced (homogenized) by the gas supply device 10. As a result, the temperature distribution of the gas G passing through the frame 12c is reduced. Therefore, the temperature distribution in the first optical path 34a is reduced, and the temperature fluctuation is reduced.

[0069] An example of the arrangement of the gas supply device 10 in the exposure apparatus will be described with reference to Figures 9(a) and 9(b). In the example of Figure 9(a), the gas supply device 10 is arranged in the opening of the wall 31 that separates the first space 21a from the second space 22. In the example of Figure 9(a), the inlet of the flow path formed by the gap 14 formed by the cover 13 is located in the first space 21a, while the outlet of the flow path formed by the gap 14 formed by the cover 13 is located in the second space 22. In the example of Figure 9(b), the entire gas supply device 10 is arranged in the second space 22. In this case, the gas G blowing port 11 (and the opening of the cover) are arranged close to the opening formed in the wall 31, and the gas supply device 10 supplies gas to the first space 21a through this opening. Figure 9(a) shows a configuration that can more efficiently discharge the heat recovered by the gas G passing through the gap 14. On the other hand, according to the configuration of FIG. 9( b ), the gas supply device 10 can efficiently supply the gas G having a lowered temperature distribution in the second space 22 to the first space 21 a .

[0070] <Fourth embodiment>

[0071] exist Figure 10 Detailed description is given of a configuration example of the gas supply device 10 in the fourth embodiment. Figure 10 1 is a diagram showing an example of a gas supply device 10 disposed near the substrate stage 4 in order to perform air conditioning on the entire first space 21a in the exposure apparatus. The gas supply device 10 includes a frame 12c (second frame), which is also shown in FIG. Figure 12 and Figure 7 As shown, it extends from the outlet 11 above the first optical path 34a, which is the optical path of the measurement light of the first measuring device 8a, and is formed to guide the gas G blown out from the outlet 11 to the first optical path 34a.

[0072] Since the gas supply device 10 is arranged near the first optical path 34a, it is easily affected by the temperature change near the first optical path 34a. Figure 10 As shown in FIG. 1 , the cover 13a is arranged at a height position between the first optical path 34a and the frame 12c so as to surround a portion of the outer side of the frame 12c. The cover 13a may have a similar shape to the blow-out port formed by the frame 12c. Figure 1 、 Figure 2(a) to Figure 2(c) The cover 13 described above is similar in structure to the above. This can reduce the occurrence of temperature distribution in the gas G inside the cover 13a (ie, inside the housing 12c).

[0073] <Fifth embodiment>

[0074] The above Figure 79(a) and 9(b) illustrate examples of gas supply device configurations, such as those shown in FIG. 9(a) and FIG. 9(b), which describe a gas supply device 10 disposed near the substrate stage 4 for air conditioning the entire first space 21a in the exposure apparatus. However, these configurations are also applicable to a gas supply device 10 disposed near the original plate stage 3 for air conditioning the entire first space 21b in the exposure apparatus.

[0075] As an example, in Figure 11 , an example of the structure of a gas supply device 10 arranged near the original plate workbench 3 in order to air-condition the entire first space 21b in the exposure device is shown. The original plate workbench 3 and the second measuring instrument 8b are arranged in the first space 21b. The gas G from the air conditioner 7 is supplied to the first space 21b by the gas supply device 10. The blowing port 11 of the gas G relative to the first space 21b is composed of a frame 12b, and the blowing port of the gas G relative to the second optical path 34b of the second measuring instrument 8b is composed of a frame 12d. The gas G in the first space 21b is discharged to the second space 22 by the exhaust mechanism 18, and a part of the gas G returns to the air conditioner 7. In the first space 21b, there is a heat source caused by the actuator and the like in the original plate workbench 3.

[0076] exist Figure 11 In the embodiment, the cover 13 surrounds at least a portion of the side surface of the frame 12b and is arranged to cover the frame 12b. The cover 13 is arranged to cover the frame 12b with a gap 14 provided between the cover 13 and the frame 12b.

[0077] In this way, the gas supply device 10 disposed near the original workbench 3 can also be connected with the relevant Figure 1 The structure described above is similar to that described above, and can effectively deal with the heat generated by the original plate stage 3.

[0078] In addition, the fourth embodiment may also be Figure 10 The structure of the present invention can be applied to the gas supply device 10 arranged near the original plate stage 3. In other words, the cover 13a can be arranged at a height position between the second optical path 34b and the frame 14d so as to surround a portion of the outer side of the frame 12d. This can reduce the temperature distribution of the gas G inside the cover 13a (i.e., inside the frame 12d) caused by temperature changes near the second optical path 34b.

[0079] <Embodiment of the method for producing an article>

[0080] The method for manufacturing an article in an embodiment of the present invention is suitable for manufacturing articles such as micro devices such as semiconductor devices or elements with fine structures. The method for manufacturing an article in this embodiment may include a process of transferring the pattern of the original plate to a substrate using the above-mentioned photolithography device (exposure device or imprinting device, engraving device, etc.) to form a pattern, and a process of processing the substrate to which the pattern has been transferred by this process. Furthermore, the manufacturing method may include other well-known processes (oxidation, film formation, evaporation, doping, flattening, etching, resist stripping, slicing, lamination, packaging, etc.). The method for manufacturing an article in this embodiment is advantageous over previous methods in at least one of the performance, quality, productivity, and production cost of the article.

[0081] The present invention is not limited to the above-described embodiment, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the following claims are attached to disclose the scope of the invention.

[0082] Description of Reference Signs

[0083] 10: Gas supply device, 11: Blowing port, 12: Frame, 13: Cover, 14: Gap, 15: Opening, 16: Air guide member.

Claims

1. A gas supply device, characterized in that: The gas supply device includes: a frame constituting a gas blowing outlet; and a cover, the cover having a gap between the cover and the frame and covering the frame, The cover has an opening portion, and the opening portion allows the gas blown out from the blowing port to pass through. When the blowout port is viewed from the front, the opening is smaller than the blowout port and is located within the region of the blowout port. The cover comprises: a first portion, which faces a portion of the air outlet and the first surface of the frame when viewed in the plane, and forms the opening; and a second portion, which extends from the first portion and faces a second surface of the frame that is different from the first surface. The first portion guides a portion of the gas blown out from the blowout port toward the gap, and the gap constitutes a flow path for the gas guided by the first portion.

2. The gas supply device according to claim 1, wherein The gap is provided between the first surface and the first portion and between the second surface of the frame and the second portion.

3. The gas supply device according to claim 1, wherein The gap is provided between the first surface and the first portion, but is not provided between the second surface of the frame and the second portion.

4. The gas supply device according to claim 1, wherein The cover further includes a third portion extending from the first portion toward the interior of the air outlet and facing a third surface of the frame body that is different from the first surface and the second surface.

5. The gas supply device according to claim 1, wherein The gas supply device further includes an adjustment unit that adjusts a flow rate of the gas flowing through the gap.

6. A photolithography apparatus for forming a pattern on a substrate, characterized in that: The above-mentioned lithography apparatus comprises: a substrate worktable that holds the substrate and moves; a measuring device that emits measuring light and measures the position of the substrate stage using the measuring light reflected by the substrate stage; and The gas supply device according to any one of claims 1 to 5, The gas supply device is configured to supply the gas blown out from the blowout port through the opening to a first space including the substrate stage and the measuring instrument.

7. The lithographic apparatus according to claim 6, wherein: The photolithography apparatus further includes an exhaust mechanism that exhausts at least a portion of the gas in the first space to a second space separated from the first space.

8. The lithographic apparatus according to claim 7, wherein: The gas supply device is disposed in the first space, and the exhaust mechanism exhausts the gas passing through the flow path to the second space.

9. The lithographic apparatus according to claim 8, wherein: The outlet of the flow path is connected to the exhaust mechanism.

10. The lithographic apparatus according to claim 6, wherein: The inlet of the flow path communicates with the first space, and the outlet of the flow path communicates with a second space separated from the first space.

11. The lithographic apparatus according to claim 6, wherein: The photolithography apparatus includes a wall separating the first space from the second space. The gas supply device is disposed in the second space and supplies gas to the first space through the opening formed in the wall.

12. The lithographic apparatus according to claim 6, wherein: The housing includes a second housing extending from the outlet above the optical path of the measurement light and configured to guide the gas blown out from the outlet toward the optical path. The cover is further arranged at a height position between the optical path and the second housing.

13. The lithographic apparatus according to claim 6, wherein: The gas supply device supplies the gas whose temperature is adjusted by the air conditioner to the first space.

14. A photolithography apparatus for forming a pattern on a substrate using an original plate, characterized in that: The above-mentioned lithography apparatus comprises: The original workbench, which keeps the above original and moves; a measuring device that emits measuring light and measures the position of the original plate stage using the measuring light reflected by the original plate stage; and The gas supply device according to any one of claims 1 to 5, The gas supply device is configured to supply the gas blown out from the blowout port through the opening to a first space including the original plate stage and the measuring instrument.

15. A method for manufacturing an article, characterized in that: The above-mentioned method for manufacturing an article has the following characteristics: A process of patterning a substrate using the photolithography apparatus according to claim 6; and The process of processing the substrate on which the pattern is formed, An article is manufactured from the substrate subjected to the above processing.

Images