Terminal connection structure and electronic component

Abstract

Provided is a terminal connection structure and an electronic component capable of suppressing adverse situations caused by the amount of use of a connecting member that connects a terminal and an electrode. The terminal connection structure of the present application has: each electrode (54, 58) provided to an electronic component (10); and each terminal (24, 34) having each connecting portion (60, 62) disposed along each electrode (54, 58). In addition, the terminal connection structure is provided with: a gap forming portion that forms each gap (76, 78) between each electrode (54, 58) and each connecting portion (60, 62); and a connecting member (80) provided to each gap (76, 78) and electrically connecting each connecting portion (60, 62) and each electrode (54, 58).

Description

Technical Field

[0001] This invention relates to terminal connection structures and electronic components. Background Technology

[0002] In recent years, the operating environment of electronic components used in automobiles, home appliances, and industrial equipment has changed dramatically. Modifications to specifications not currently required for these components have been implemented. Furthermore, the applications of these electronic components have become increasingly diverse. As a result, the requirements for electronic components mounted in these devices are extremely stringent in order to protect fragile electronic circuits from unexpected nozzles or high-energy pulses. Varistors, used as circuit protection components, are electronic components composed of abnormal voltage absorption elements. Varistors are classified into disk type, surface-mount type, and stacked (inner layer) type, depending on their application. WO2011 / 162181 discloses a surface-mount type varistor. This varistor includes a varistor element, with electrodes formed on the surface and back of the varistor element.

[0003] Each electrode is connected to a terminal, and the electrodes and terminals are joined by solder. Summary of the Invention

[0004] The higher the voltage and current required, the larger the size of the varistor. Recent advancements in space-saving and miniaturization of electronic components have created a demand for surface-mount varistors capable of handling high-voltage, high-current pulses. However, even with increased size when using existing surface-mount varistors for high-voltage, high-current pulses, the component itself heats up to approximately 1000°C when short-circuited by pulses such as lightning surges. Furthermore, in the terminal connection structures of these electronic components, insufficient solder joints (supply amount, filler amount) used to electrically connect electrodes and terminals compromise proper bonding strength.

[0005] Additionally, when a large number of connectors are used, excessive solder thickness can sometimes cause terminals or components to protrude from the outer casing. Furthermore, there are issues such as increased product size or higher costs.

[0006] Thus, when the thickness of the connector deviates, the joint strength of the joint will deviate.

[0007] Therefore, the object of the present invention is to suppress adverse conditions caused by the amount of connectors used to connect terminals and electrodes.

[0008] According to one aspect of the present invention, the device comprises: an electrode disposed on an element constituting a part; and a terminal having a connecting portion disposed along the electrode. Additionally, it comprises: a gap forming portion forming a gap between the electrode and the connecting portion; and a connector disposed in the gap and electrically connecting the connecting portion and the electrode.

[0009] According to this embodiment, a gap is formed between the terminal connection portion and the electrode by a gap forming portion, and the deviation in the amount of connector used to electrically connect the connection portion and the electrode is suppressed by the gap.

[0010] Therefore, compared to situations where a predetermined gap cannot be ensured between the electrode and the terminal, and the amount of connectors used between the electronics and the terminal varies with each connection (per individual or per batch), it is possible to suppress adverse conditions caused by the amount of connectors used to connect the terminals and electrodes. Attached Figure Description

[0011] Figure 1 This is a side view showing the electronic component involved in the first embodiment.

[0012] Figure 2 This is a perspective view showing the interior of the electronic component involved in the first embodiment.

[0013] Figure 3 This is a side view showing the interior of the electronic component according to the first embodiment.

[0014] Figure 4 This is a side view showing the interior of the electronic component according to the second embodiment.

[0015] Figure 5 This is a perspective view showing the interior of the electronic component involved in the third embodiment.

[0016] Figure 6 This is a side view showing the interior of the electronic component according to the third embodiment.

[0017] Figure 7 This is a side view showing the interior of the electronic component according to the fourth embodiment.

[0018] Figure 8 This is a side view showing the interior of the electronic component according to the fifth embodiment. Detailed Implementation

[0019] <First Implementation>

[0020] use Figures 1 to 3 The electronic component having the terminal connection structure according to the first embodiment will be described. Figure 1This is a side view showing the electronic component 10 according to the first embodiment.

[0021] Examples of electronic components 10 include varistors, resistors, capacitors, thermistors, semiconductors, and various sensor elements that utilize these components. In this embodiment, the case where the electronic component 10 is a varistor will be described as an example. A varistor is an electronic component 10 with metal terminals that clamp a ceramic element between a pair of metal terminals, and it has the durability to withstand operating environments with high voltage and high current, such as lightning surges.

[0022] The electronic component 10 has a component body 12, for example, in a cuboid shape, made of molding resin or the like, used to seal a ceramic element for internal varistor function. On the bottom surface 14 of the component body 12, a first foot 18 protruding downward relative to one end in the direction of the long side 16, and a second foot 20 protruding downward relative to the other end in the direction of the long side 16 are formed.

[0023] A first terminal 24, constituting one of the metal terminals, extends from one end face 22 on one side of the long side direction 16 of the part body 12. The first terminal 24 is formed into a plate shape, for example, copper or iron, and its surface is plated with nickel or tin, etc.

[0024] The portion of the first terminal 24 extending from the part body 12 is bent along one end face 22 of the part body 12, and the first terminal 24 has a first extension 26 extending along one end face 22. The top end of the first extension 26 is folded back toward the center of the long side 16 of the part body 12, and the first top end 28 extending from the first extension 26 is disposed in the first recess 30 formed on the first foot 18.

[0025] Furthermore, a second terminal 34, constituting the other metal terminal, extends from the other end face 32 on the other side of the long side direction 16 of the part body 12. The second terminal 34 is formed into a plate shape, for example, copper or iron, and its surface is plated with nickel or tin, etc.

[0026] The portion of the second terminal 34 extending from the part body 12 is bent along the other end face 32 of the part body 12, and the second terminal 34 has a second extension 36 extending along the other end face 32. The top end of the second extension 36 is folded back toward the center of the long side 16 of the part body 12, and the second top end 38 extending from the second extension 36 is disposed in the second recess 40 formed on the second foot 20.

[0027] Figure 2 This is a perspective view showing the interior of the electronic component 10 according to the first embodiment. Figure 3 This is a side view showing the interior of the electronic component 10 according to the first embodiment.

[0028] Inside the component body 12 are provided elements 50 constituting the electronic component 10. Examples of elements 50 constituting the electronic component 10 include active elements and passive elements. In this embodiment, a varistor is used as the electronic component 10, and a passive element, namely a ceramic element, is used as the element 50. Therefore, inside the component body 12 are provided ceramic elements constituting the varistor, for example, those formed by mixing additives into zinc oxide (ZnO).

[0029] The element 50 is formed in a cylindrical or prismatic shape. A first electrode 54 is provided on one side 52 at one end of the element 50, and a second electrode 58 is provided on the other side 56 at the other end of the element 50 (see reference). Figure 3 ).

[0030] Each electrode 54, 58 is formed, as an example, by screen printing or coating, and is made of a material such as silver or silver-palladium. The first electrode 54 is fixed in close contact with one side 52, and the second electrode 58 is fixed in close contact with the other side 56 (see reference). Figure 3 ).

[0031] The first electrode 54 is formed in a circular shape with a smaller outer diameter than one side 52, and a portion of one side 52 is exposed in a circular ring shape on the outer periphery of the first electrode 54. The second electrode 58 is formed in a circular shape with a smaller outer diameter than another side 56, and a portion of the other side 56 is exposed in a circular ring shape on the outer periphery of the second electrode 58.

[0032] The end of the first terminal 24 extending into the interior of the component body 12 constitutes a first connection portion 60 arranged (in parallel) along the first electrode 54. Additionally, the end of the second terminal 34 extending into the interior of the component body 12 constitutes a second connection portion 62 arranged (in parallel) along the second electrode 58 (see reference). Figure 3 ).

[0033] The first connecting portion 60 of the first terminal 24 is subjected to a stamping process, such as... Figure 3 As shown, a first tip protrusion 64 is formed on the tip side of the first connecting portion 60. This first tip protrusion 64 is pressed into a V-shape by a stamping process and protrudes toward the first electrode 54. In addition, a first base protrusion 66 is formed on the base side of the first connecting portion 60, which is closer to the first extension portion 26 than the tip side. This first base protrusion 66 is pressed into a V-shape by a stamping process and protrudes toward the first electrode 54.

[0034] The first tip protrusion 64 and the first base protrusion 66 are formed by a strip that is transversely cut across the first terminal 24 in the width direction, and the first tip protrusion 64 and the first base protrusion 66 extend in a straight line in the transverse direction 68 (see reference). Figure 2 Furthermore, the protrusions constituting the first apical protrusion 64 and the first base protrusion 66 are formed into triangles when viewed from the side.

[0035] like Figure 3 As shown, the second connecting portion 62 of the second terminal 34 is subjected to stamping processing, and a second tip protrusion 70 is formed on the tip side of the second connecting portion 62. The second tip protrusion 70 is pressed into a V-shape by stamping processing and protrudes toward the second electrode 58. In addition, a second base protrusion 72 is formed on the base side of the second connecting portion 62, which is closer to the second extension portion 36 than the tip side. The second base protrusion 72 is pressed into a V-shape by stamping processing and protrudes toward the second electrode 58.

[0036] The second tip protrusion 70 and the second base protrusion 72 are formed by a strip that cuts across the second terminal 34 in the width direction, and the second tip protrusion 70 and the second base protrusion 72 extend in a straight line in the transverse direction 68. Furthermore, the strip that forms the second tip protrusion 70 and the second base protrusion 72 is triangular when viewed from the side.

[0037] Here, although this embodiment describes the case where each protrusion 64, 66, 70, and 72 is composed of triangular protrusions when viewed from the side, it is not limited to this. Each protrusion 64, 66, 70, and 72 may also be composed of trapezoidal protrusions when viewed from the side. In addition, the apex of the triangular protrusions when viewed from the side may also have rounded corners.

[0038] like Figure 3 As shown, the first tip protrusion 64 and the first base protrusion 66 are in contact with the surface of the first electrode 54, and the first tip protrusion 64 and the first base protrusion 66 constitute a gap forming portion that forms a first gap 76 between the first electrode 54 and the first connecting portion 60. The second tip protrusion 70 and the second base protrusion 72 are in contact with the surface of the second electrode 58, and the second tip protrusion 70 and the second base protrusion 72 constitute a gap forming portion that forms a second gap 78 between the second electrode 58 and the second connecting portion 62.

[0039] A connector 80 is provided on the first gap 76 formed between the first electrode 54 and the first connecting portion 60 to electrically connect the first electrode 54 and the first connecting portion 60. A connector 80 is provided on the second gap 78 formed between the second electrode 58 and the second connecting portion 62 to electrically connect the second electrode 58 and the second connecting portion 62.

[0040] As the connector 80, conductive resin (adhesive) or solder are listed as examples. In this embodiment, the connector 80 is described as being made of solder.

[0041] When each connecting portion 60, 62 of each terminal 24, 34 is electrically connected to its corresponding electrode 54, 58, a connector 80 made of solder is disposed between each electrode 54, 58 corresponding to each connecting portion 60, 62. In this state, for example, a soldering iron is pressed against each connecting portion 60, 62 of each terminal 24, 34, and the connecting portions 60, 62 are heated to melt the connector 80. Then, pressure is applied to each connecting portion 60, 62 using the soldering iron until each protrusion 64, 66, 70, 72 of each connecting portion 60, 62 contacts its corresponding electrode 54, 58. The connection method can utilize known techniques.

[0042] In this way, by filling the connectors 80 after they have been melted in the gaps 76 and 78, the connecting parts 60 and 62 of the terminals 24 and 34 are electrically connected to the corresponding electrodes 54 and 58.

[0043] Furthermore, the distance from the back surface of each connecting portion 60, 62 to the surface of the corresponding electrode 54, 58 can be kept constant. This ensures that the amount of connector 80 used to fill the gaps 76, 78 between each connecting portion 60, 62 and its corresponding electrode 54, 58 is appropriately managed. Additionally, the thickness 82 of the connector 80 connecting each connecting portion 60, 62 and its corresponding electrode 54, 58 is maintained at a predetermined size.

[0044] Furthermore, since the element 50, which is covered with molding resin and connected to each terminal 24, 34, therefore, as Figure 1 As shown, the part body 12 is formed.

[0045] (Functions and effects)

[0046] Next, the effects produced by the first embodiment will be explained.

[0047] The terminal connection structure of this embodiment includes: electrodes 54 and 58 disposed on the element 50 constituting the electronic component 10; and terminals 24 and 34 having connection portions 60 and 62 disposed along the electrodes 54 and 58. Furthermore, the terminal connection structure includes: a gap forming portion that forms gaps 76 and 78 between the electrodes 54 and 58 and the connection portions 60 and 62; and a connector 80 disposed in the gaps 76 and 78, electrically connecting the connection portions 60 and 62 to the electrodes 54 and 58.

[0048] According to this structure, gaps 76 and 78 are formed between each connecting portion 60 and 62 of each terminal 24 and 34 and their corresponding electrodes 54 and 58 through gap forming portions. These gaps 76 and 78 suppress deviations in the amount (filling amount) of connector 80 used to electrically connect each connecting portion 60 and 62 to their corresponding electrodes 54 and 58, thereby enabling the thickness of connector 80 to be managed at a constant level.

[0049] Here, when it is not possible to ensure a predetermined gap between the electrode and the terminal, the number of connectors used between the electrode and the terminal can vary with each connection (per individual or per batch). However, in this embodiment, compared to the above situation, it is possible to suppress adverse conditions caused by the number of connectors 80 used to connect each terminal 24, 34 to each electrode 54, 58.

[0050] Furthermore, without implementing process management for managing the load of connector 80, the usage of connector 80 can be set to an appropriate amount.

[0051] Here, when the terminals 24, 34 and the electrodes 54, 58 are connected by the connector 80, i.e., solder, the metal contained in the solder and the electrodes 54, 58 form an alloy layer through the contact portion, thereby bonding the terminals 24, 34 and the electrodes 54, 58. This alloy layer is harder and less resistant to stress than the solder. Therefore, when the thickness dimension 82 of the solder layer formed by the solder is small, peeling is likely to occur at the joint portion between the terminals 24, 34 and the electrodes 54, 58.

[0052] In contrast, in this embodiment, by suppressing deviations in the amount of solder in the connector 80 that connects the terminals 24, 34 and the electrodes 54, 58, the thickness 82 of the solder layer formed by the solder can be maintained at a predetermined size. This ensures a certain number of solder regions in the solder layer that are softer than the alloy layer, thus suppressing the formation of cracks.

[0053] On the other hand, the thermal stress applied to the joints of terminals 24 and 34 and electrodes 54 and 58 due to temperature changes increases as the thickness of the solder layer increases. Therefore, when the thickness of the solder layer deviates from the specified range, the joint strength relative to the thermal stress deviates.

[0054] In particular, when the electronic component 10 is a varistor, it heats up to approximately 1000°C due to the large current generated when it is input by lightning surges or similar events. Therefore, deviations in the bonding strength relative to thermal stress have a significant impact on the durability of the electronic component 10.

[0055] Therefore, in this embodiment, by suppressing the deviation of the solder layer thickness dimension 82, the deviation of the bonding strength of the joints of each terminal 24, 34 and each electrode 54, 58 can be suppressed, and the durability of the electronic component 10 to temperature changes can be improved.

[0056] In addition, in this embodiment, the gap forming portion includes protrusions 64, 66, 70, and 72 protruding from each of the connecting portions 60 and 62.

[0057] According to this structure, by forming protrusions 64, 66, 70, and 72 on each of the connecting portions 60 and 62, gaps 76 and 78 can be formed between each connecting portion 60 and 62 and their corresponding electrodes 54 and 58. Each protrusion 64, 66, 70, and 72 acts as a wall to suppress the excessive wetting and expansion of the solder, which serves as the connector 80, onto each of the electrodes 54 and 58, thus ensuring the solder layer thickness dimension 82. By ensuring the solder layer thickness dimension 82, a certain amount of solder area that is softer than the alloy layer within the solder layer can be ensured, thereby improving durability against thermal cycling.

[0058] Furthermore, the protrusions 64, 66, 70, and 72 that constitute the gap forming part and the connecting parts 60 and 62 can be integrated into one unit, thus simplifying the structure.

[0059] Furthermore, as in this embodiment, protrusions 64, 66, 70, and 72 can be formed on each of the terminals 24 and 34 by stamping, thus making the processing easier.

[0060] In addition, in this embodiment, each protrusion 64, 66, 70, 72 includes a strip that cross-cuts each terminal 24, 34.

[0061] According to this structure, the filling range of the connector 80 can be limited by the transversely cut protrusions of each terminal 24, 34. Therefore, the amount of connector 80 used can be managed more accurately. In addition, each terminal 24, 34 can be stably connected in a state parallel to each electrode 54, 58.

[0062] Furthermore, the electronic component 10 in this embodiment can also achieve the aforementioned effects.

[0063] Furthermore, in the electronic component 10 of this embodiment, each electrode 54, 58 includes a first electrode 54 disposed on one side 52 of the component 50 and a second electrode 58 disposed on the other side 56 of the component 50. Additionally, each terminal 24, 34 includes a first terminal 24 electrically connected to the first electrode 54 and a second terminal 34 electrically connected to the second electrode 58.

[0064] According to this structure, the first terminal 24 and the first electrode 54, the second terminal 34 and the second electrode 58 can each maintain the same distance and be connected parallel to each of the surfaces 52 and 56 of the element 50, thereby preventing short circuits of the element 50 caused by lightning surges, etc. Furthermore, an electronic component 10 can be formed that can suppress adverse conditions caused by the amount of connectors 80 used to connect the terminals 24 and 34 and the electrodes 54 and 58, and that clamps the element 50 with each electrode 54 and 58.

[0065] Furthermore, in the electronic component 10 of this embodiment, the element 50 is a ceramic element constituting a varistor.

[0066] Based on this structure, a varistor with ceramic elements can be formed.

[0067] Furthermore, although the first embodiment describes the connection between the protrusions 64, 66, 70, 72 provided on each terminal 24, 34 and the corresponding electrodes 54, 58, it is not limited to this structure. For example, it may be configured as shown in the second embodiment.

[0068] <Second Implementation>

[0069] Figure 4 A side view showing the interior of the electronic component 100 according to the second embodiment is shown, corresponding to the first embodiment. Figure 3 The image.

[0070] Use Figure 4 The second embodiment will be described. Furthermore, for parts that are the same as or equivalent to the first embodiment, identical symbols will be used, and descriptions will be omitted; only the different parts will be described.

[0071] Compared to the first electrode 54 and second electrode 58 of the first embodiment, the electronic component 100 with the terminal connection structure of the second embodiment has smaller external dimensions for each electrode 54, 58. Therefore, each protrusion 64, 66, 70, 72 formed on each terminal 24, 34 is in contact with the component 50 at the outer periphery of the corresponding electrode 54, 58.

[0072] Furthermore, the protrusion dimension 102 of each protrusion 64, 66, 70, 72 originating from the corresponding connecting portion 60, 62 is greater than the thickness dimension 104 of each electrode 54, 58. Consequently, gaps 76, 78 are formed between each connecting portion 60, 62 of each terminal 24, 34 and its corresponding electrode 54, 58, and the height dimension of each gap 76, 78 is the value obtained by subtracting the thickness dimension 104 from the protrusion dimension 102.

[0073] (Functions and effects)

[0074] In this embodiment, the parts that are the same as or equivalent to those in the first embodiment can have the same effects as those in the first embodiment.

[0075] Furthermore, in the terminal connection structure of this embodiment, each protrusion 64, 66, 70, 72 is in contact with the element 50 at the outer periphery of each electrode 54, 58. In addition, the protrusion dimension 102 of each protrusion 64, 66, 70, 72 originating from each connection portion 60, 62 is greater than the thickness dimension 104 of each electrode 54, 58.

[0076] According to this structure, the terminals 24 and 34 are not in direct contact with their corresponding electrodes 54 and 58. Therefore, the thermal stress generated by the difference in thermal expansion between the connector 80 and the terminals 24 and 34 is difficult to be applied to the electrodes 54 and 58, thus improving the durability against thermal cycling.

[0077] The solder, acting as a connector, wets and extends only to each terminal 24, 34 and each electrode 54, 58, thereby forming a fillet. Thus, a fillet facing the opposite direction to the existing solder fillet is formed, that is, a fillet with a contact angle of 90° or more formed by each electrode 54, 58 and the solder, which alleviates the stress applied to each electrode 54, 58.

[0078] In addition, the area where each electrode 54, 58 and the solder serving as the connector 80 are in contact is increased, thus the joint strength is strengthened.

[0079] <Third Implementation Method>

[0080] Figure 5 A perspective view showing the interior of the electronic component 200 according to the third embodiment is shown, corresponding to the first embodiment. Figure 2 The image. Figure 6 A side view showing the interior of the electronic component 200 according to the third embodiment is shown, corresponding to the first embodiment. Figure 3 The image.

[0081] Use Figure 5 as well as Figure 6 The third embodiment will be described. Furthermore, for parts that are the same as or equivalent to those in the first embodiment, the same symbols will be used, and descriptions will be omitted; for parts that are different, descriptions will be provided.

[0082] Compared with the first terminal 24 and second terminal 34 of the first embodiment, the electronic component 200 with the terminal connection structure of the third embodiment has different shapes for the protrusions 64, 66, 70, and 72 formed on each terminal 24 and 34 (see reference). Figure 5 ).

[0083] Each top protrusion 64, 70 provided on each connecting portion 60, 62 of each terminal 24, 34 is constituted by a top protrusion 202 that protrudes from a portion of the corresponding connecting portion 60, 62. At least one pair of top protrusions 202 are separately provided in the width direction across the transverse direction 68 of each terminal 24, 34 (see reference). Figure 5 A space is formed between the paired apical protrusions 202 and 202.

[0084] Furthermore, each base end protrusion 66, 72 provided on each connecting portion 60, 62 of each terminal 24, 34 is composed of a top protrusion 204 that is raised from a portion of the corresponding connecting portion 60, 62. At least one pair of base end protrusions 204 are provided separately in the width direction across the transverse direction 68 of each terminal 24, 34, and a space is formed between the pairs of base end protrusions 204, 204.

[0085] Each protrusion 64, 66, 70, and 72 is formed by stamping. During stamping, a punch with a hemispherical tip applies pressure to each connecting portion 60 and 62 of each terminal 24 and 34, thereby pressing out a portion of each connecting portion 60 and 62. This forms a circular recess 206 on the surface of each connecting portion 60 and 62 (see reference). Figure 5 Each of the connecting portions 60 and 62 has a protrusion 64, 66, 70, and 72 formed in a hemispherical shape on its back side. Furthermore, although in this embodiment each of the protrusions 64, 66, 70, and 72 is connected to each of the electrodes 54 and 58, it is also possible, as in the second embodiment, for each of the protrusions 64, 66, 70, and 72 to be connected to the outer periphery of each of the electrodes 54 and 58 of the element 50.

[0086] (Functions and effects)

[0087] In this embodiment, the parts that are the same as or equivalent to those in the first embodiment can have the same effects as those in the first embodiment.

[0088] Furthermore, in the terminal connection structure of this embodiment, each protrusion 64, 66, 70, 72 includes a raised portion 202, 204 that protrudes a portion of each connecting portion 60, 62. Each raised portion 202, 204 forms a gap with each connecting portion 60, 62 of each terminal 24, 34.

[0089] According to this structure, protrusions 64, 66, 70, and 72 can be formed by stamping each connecting part 60 and 62, thus making the processing easy.

[0090] In addition, in the terminal connection structure of this embodiment, each raised portion 202, 204 is provided in multiple separate locations on the transverse direction 68 that cuts through each terminal 24, 34.

[0091] According to this structure, a space can be formed between the protrusions 202 and 204 arranged in the transverse direction 68. Therefore, when there are many connectors 80 filling the gaps 76 and 78, the remaining connectors 80 can be released through the space between the protrusions 202 and 204 toward the long side of the terminals 24 and 34.

[0092] Therefore, even when the filler of connector 80 is large, it is possible to maintain the connector 80 provided on each electrode 54, 58 in an appropriate amount.

[0093] <Fourth Implementation>

[0094] Figure 7 A side view showing the interior of the electronic component 300 according to the fourth embodiment is shown, corresponding to the first embodiment. Figure 3 The image.

[0095] Use Figure 7 The fourth embodiment will be described. Furthermore, for parts that are the same as or equivalent to those in the first embodiment, identical symbols will be used, and descriptions will be omitted; only the different parts will be described.

[0096] The electronic component 300 with the terminal connection structure of the fourth embodiment differs from the first terminal 24 and the second terminal 34 of the first embodiment in that the protrusions 64, 66, 70, and 72 formed on each terminal 24 and 34 are different.

[0097] At the top end of each connecting portion 60, 62, a top bending portion 304 is formed, which is bent at an angle toward the direction 302 closer to the element 50 by bending processing. The top bending portion 304 forms top protrusions 64, 70 that protrude toward the corresponding electrodes 54, 58.

[0098] Furthermore, at the base end of each connecting portion 60, 62, a base end bend 306 is formed, which is bent at an inclination toward the direction 302 close to the element 50 by bending. The base end bend 306 forms base end protrusions 66, 72 that protrude toward the corresponding electrodes 54, 58.

[0099] In addition, the portions of the terminals 24 and 34 extending from the base protrusions 66 and 72 toward the outer side of the component body 12 extend parallel to the surfaces 52 and 56 of the element 52.

[0100] Therefore, gaps 76 and 78 that are trapezoidal when viewed from the side are formed between the connecting portions 60 and 62 of each terminal 24 and 34 and the corresponding electrodes 54 and 58.

[0101] Furthermore, although in this embodiment the gaps 76 and 78 formed between the connecting portions 60 and 62 of each terminal 24 and 34 and their corresponding electrodes 54 and 58 are trapezoidal when viewed from the side, this is not a limitation. For example, by bending the top and base portions of each connecting portion 60 and 62 vertically (at right angles), the gaps 76 and 78 formed between the connecting portions 60 and 62 of each terminal 24 and 34 and their corresponding electrodes 54 and 58 can be made trapezoidal when viewed from the side. Alternatively, by bringing the top bends 304 and 304 and the base bends 306 and 306 closer together, the gaps 76 and 78 formed between the connecting portions 60 and 62 of each terminal 24 and 34 and their corresponding electrodes 54 and 58 can be made triangular when viewed from the side.

[0102] (Functions and effects)

[0103] In this embodiment, the parts that are the same as or equivalent to those in the first embodiment can have the same effects as those in the first embodiment.

[0104] In addition, in the terminal connection structure of this embodiment, each protrusion 64, 66, 70, 72 includes each bent portion 304, 306 whose end of each connecting portion 60, 62 is bent toward the direction 302 close to the element 50.

[0105] According to this structure, by bending each connecting part 60, 62, each protrusion 64, 66, 70, 72 can be formed, thus making the processing easy.

[0106] Furthermore, by changing the length of each bent portion 304, 306 or the bending angle of each bent portion 304, 306, the height of each gap 76, 78 can be adjusted. Therefore, compared to the first to third embodiments, the thickness 82 of the connector 80 filled in each gap 76, 78 can be increased.

[0107] <Fifth Implementation>

[0108] Figure 8 A side view showing the interior of the electronic component 400 according to the fifth embodiment is shown, corresponding to the first embodiment. Figure 3 The image.

[0109] Use Figure 8The fifth embodiment will be described. Furthermore, for parts that are the same as or equivalent to the first and fourth embodiments, the same symbols will be used, and descriptions will be omitted; for parts that are different, descriptions will be provided.

[0110] The electronic component 400 with the terminal connection structure of the fifth embodiment differs from the first terminal 24 and the second terminal 34 of the first embodiment and the fourth embodiment in that the protrusions 64, 66, 70, and 72 formed on each terminal 24 and 34 are different.

[0111] That is, each protrusion 64, 66, 70, 72 formed on each connecting portion 60, 62 of each terminal 24, 34 has an extension 402 extending along the element 50 from each bend 304, 306. Each extension 402 extends in parallel with the corresponding electrode 54, 58, and is configured to be in contact with the corresponding electrode 54, 58. Each bend 304, 306 forms a gap with each connecting portion 60, 62 of each terminal 24, 34.

[0112] In addition, the top of the extension 402 of each protrusion 66, 72 formed on the base end side of each connecting part 60, 62 extends outward toward the outer side of the part body 12.

[0113] (Functions and effects)

[0114] In this embodiment, the parts that are the same as or equivalent to those in the first and fourth embodiments can also have the same effects as those in the first and fourth embodiments.

[0115] In addition, in the terminal connection structure of this embodiment, each protrusion 64, 66, 70, 72 has an extension 402 extending along the element 50 from each bend 304, 306.

[0116] According to this structure, protrusions 64, 66, 70, and 72 can be formed by stamping each connecting part 60 and 62, thus making the processing easy.

[0117] Furthermore, the extensions 402 of each of the protrusions 64, 66, 70, and 72 are connected to the corresponding electrodes 54 and 58. Therefore, compared to the fourth embodiment, the contact area between each terminal 24 and 34 and its corresponding electrode 54 and 58 is increased. This stabilizes the arrangement of each terminal 24 and 34 on its corresponding electrode 54 and 58, thus facilitating the connection operation performed by the connector 80.

[0118] In any implementation, the part body 12 formed of molding resin may be eliminated depending on the intended use or required performance, or the part body 12 may be replaced with a protective film made of epoxy resin or the like.

[0119] Furthermore, although the protrusions 64, 66, 70, and 72 formed on each of the terminals 24 and 34 are configured in a pair via each top protrusion 64, 70 and each base protrusion 66, 72, this is not a limitation. For example, a protrusion may be provided between each top protrusion 64, 70 and each base protrusion 66, 72, and there may be two or more protrusions.

[0120] The embodiments of the present invention have been described above. However, the above embodiments are merely some examples of the application of the present invention and are not intended to limit the technical scope of the present invention to the specific structures of the above embodiments.

[0121] Symbol Explanation

[0122] 10, 100, 200, 300, 400: Electronic components

[0123] 24: First terminal

[0124] 34: Second terminal

[0125] 50: Components

[0126] 54: First electrode

[0127] 58: Second electrode

[0128] 60: First connecting part

[0129] 62: Second connecting part

[0130] 64: First apical protrusion

[0131] 66: First base protrusion

[0132] 68: Transverse direction

[0133] 70: Second apical protrusion

[0134] 72: Second base protrusion

[0135] 76: First gap

[0136] 78: Second gap

[0137] 80: Connector

[0138] 102: Prominent Dimensions

[0139] 104: Thickness dimension

[0140] 202: Top ridge

[0141] 204: Basement ridge

[0142] 304: Top Curved Section

[0143] 306: Base bending portion

[0144] 402: Extension

Claims

1. A terminal connection structure, wherein, have: Electrodes, which are disposed on the components constituting the part; A terminal having a connection portion configured along the electrode; A gap forming portion, which forms a gap between the electrode and the connecting portion; A connector is disposed in the gap and electrically connects the connecting portion and the electrode; The gap is trapezoidal or rectangular when viewed from the side. The gap forming portion includes a protrusion that protrudes compared to the connecting portion; The protrusion includes a strip that cross-cuts the terminal; The element, which is connected to the terminal via the electrode, is covered with molding resin.

2. The terminal connection structure as described in claim 1, wherein, The protrusion includes a curved portion whose end of the connector bends toward the element.

3. The terminal connection structure as described in claim 2, wherein, The protrusion includes an extension that extends along the element from the bend.

4. The terminal connection structure as described in any one of claims 2 to 3, wherein, The protrusion is in contact with the element at the outer periphery of the electrode. The protrusion dimension of the protrusion starting from the connection portion is greater than the thickness dimension of the electrode.

5. An electronic component having a terminal connection structure as described in any one of claims 1 to 4.

6. The electronic component as claimed in claim 5, wherein, The electrode includes a first electrode disposed on one side of the element and a second electrode disposed on the other side of the element. The terminals include a first terminal electrically connected to the first electrode and a second terminal electrically connected to the second electrode.

7. The electronic component as claimed in claim 6, wherein, The element is a ceramic element that constitutes a varistor.

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