Multilayer electronic components

Abstract

The present disclosure provides a multilayer electronic component. The multilayer electronic component includes: a main body, including a first dielectric layer and a second dielectric layer alternately arranged in a first direction; and external electrodes, respectively arranged on a first end surface and a second end surface opposite to each other. A first inner electrode exposed to the first end surface and a first dummy pattern spaced apart from the first inner electrode and exposed to the second end surface are arranged on the first dielectric layer. A second inner electrode exposed to the second end surface and a second dummy pattern spaced apart from the second inner electrode and exposed to the first end surface are arranged on the second dielectric layer. The first inner electrode and the second inner electrode respectively include a first main portion and a second main portion, and the first main portion and the second main portion are arranged in a staggered manner in the width direction.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0120559 filed on September 18, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a multilayer electronic assembly. Background Art

[0003] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip capacitor mounted on a printed circuit board of various electronic products (such as, for example, image devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smart phones, mobile phones, etc.) for charging or discharging the same.

[0004] Multilayer ceramic capacitors are used as components of various electronic devices because they are small in size, achieve high capacitance, and can be easily mounted. As various electronic devices, such as computers and mobile devices, become smaller and their output increases, the demand for miniaturized and increased capacitance multilayer ceramic capacitors is increasing.

[0005] Furthermore, recently, as interest in automotive electronic components has increased in the automotive industry, multilayer ceramic capacitors are also required to have high reliability and high strength characteristics for use in vehicles or infotainment systems.

[0006] As the number of stacked dielectric layers and internal electrodes increases, the accumulation of stepped portions due to the thickness difference between the internal electrodes and the dielectric layers may increase. This accumulation of stepped portions may cause warping of the end portions of the internal electrodes due to the dielectric layers stretching in the lateral direction during the densification process of the compressed body.

[0007] That is, the end portion of the inner electrode warps to fill the step, and the edge portion removes the empty space created by the step by recessing the cover and reducing the edge width. When the empty space created by the step is removed, the capacitor layer also stretches due to the reduced edge width. Due to the irregular stretching of the inner electrode structure as described above, the reliability (such as breakdown voltage) of the multilayer ceramic capacitor is reduced.

[0008] The generation and accumulation of such step portions may be problematic in both the length and width directions of the multilayer ceramic capacitor, and thus a method for suppressing the generation of the step portions is desired. Summary of the Invention

[0009] An aspect of the present disclosure may provide a multilayer electronic component that may solve the step problem.

[0010] Another aspect of the present disclosure may provide a multilayer electronic component having improved reliability.

[0011] Another aspect of the present disclosure may provide a multilayer electronic component having improved breakdown voltage.

[0012] According to one aspect of the present disclosure, a multilayer electronic component may include: a body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and opposite to each other in a third direction, the body including a first dielectric layer and a second dielectric layer alternately arranged in the first direction; and external electrodes respectively arranged on the third surface and the fourth surface, wherein a first inner electrode exposed to the third surface and a first dummy pattern spaced apart from the first inner electrode and exposed to the fourth surface are arranged on the first dielectric layer, and a first dummy pattern exposed to the fourth surface is arranged on the first dielectric layer. Two inner electrodes and a second dummy pattern spaced apart from the second inner electrode and exposed to the third surface are arranged on the second dielectric layer, the first inner electrode includes a first main portion and a first side portion and a second side portion, the first main portion is arranged to be spaced apart from the fifth surface and the sixth surface, the first side portion and the second side portion are respectively arranged on opposite side surfaces of the first main portion and exposed to the third surface, the second inner electrode includes a second main portion and a third side portion and a fourth side portion, the second main portion is arranged to be spaced apart from the fifth surface and the sixth surface, the third side portion and the fourth side portion are respectively arranged on opposite side surfaces of the second main portion and exposed to the fourth surface, and the first main portion and the second main portion are arranged in a staggered manner in the third direction.

[0013] According to another aspect of the present disclosure, a multilayer electronic component may include: a body including first and second dielectric layers, first and second inner electrodes, and first and second dummy patterns, the first and second dielectric layers being alternately arranged in a stacking direction, the first and second inner electrodes being arranged on the first and second dielectric layers, respectively, the first dummy pattern being arranged on the first dielectric layer and spaced apart from the first inner electrode, and the second dummy pattern being arranged on the second dielectric layer and spaced apart from the second inner electrode; and outer electrodes being respectively arranged on a first end surface and a second end surface of the body that are opposite to each other in a length direction, the first inner electrode and the first dummy pattern being exposed on the first and second end surfaces, respectively, the second inner electrode and the second dummy pattern being exposed on the second and first end surfaces, respectively, and outer edges of the first and second inner electrodes being divergent from each other in a width direction that is perpendicular to the length direction and the stacking direction.

[0014] According to another aspect of the present disclosure, a multilayer electronic component may include: a body including first and second dielectric layers, first and second inner electrodes, and first and second dummy patterns, the first and second dielectric layers being alternately arranged in a stacking direction, the first and second inner electrodes being arranged on the first and second dielectric layers, respectively, the first dummy pattern being arranged on the first dielectric layer and spaced apart from the first inner electrode, and the second dummy pattern being arranged on the second dielectric layer and spaced apart from the second inner electrode; and external electrodes being respectively arranged on first and second end surfaces of the body that are opposite to each other in a length direction, the first inner electrode and the first dummy pattern being exposed at the first and second end surfaces, respectively, the second inner electrode and the second dummy pattern being exposed at the second and first end surfaces, respectively, and at least one of the first and second dummy patterns having a width that varies in the length direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0016] Figure 1 is a schematic perspective view showing a multilayer electronic component according to an exemplary embodiment of the present disclosure;

[0017] Figure 2 It is shown in Figure 1 A perspective view of a main body of a multilayer electronic component excluding external electrodes;

[0018] Figure 3 is a plan view of a first dielectric layer according to an exemplary embodiment of the present disclosure;

[0019] Figure 4 is a plan view of a second dielectric layer according to an exemplary embodiment of the present disclosure;

[0020] Figure 5 is a plan view showing that a first dielectric layer and a second dielectric layer overlap each other according to an exemplary embodiment in the present disclosure;

[0021] Figure 6 It is along Figure 1 A cross-sectional view taken along line II';

[0022] Figure 7 When Figure 2 When observing from the direction P Figure 2 a diagram of the subject of ; and

[0023] Figure 8 It is along Figure 1 A cross-sectional view taken along line II-II'. DETAILED DESCRIPTION

[0024] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0025] In the drawings, the X direction refers to the second direction or length direction of the body, the Y direction refers to the third direction or width direction of the body, and the Z direction refers to the first direction, thickness direction or stacking direction of the body.

[0026] Multilayer electronic components

[0027] Figure 1 is a schematic perspective view illustrating a multilayer electronic component according to an exemplary embodiment in the present disclosure.

[0028] Figure 2 It is shown in Figure 1 A perspective view of a body of a multilayer electronic component excluding external electrodes.

[0029] Figure 3 is a plan view of a first dielectric layer according to an exemplary embodiment of the present disclosure.

[0030] Figure 4 is a plan view of a second dielectric layer according to an exemplary embodiment of the present disclosure.

[0031] Figure 5 is a plan view illustrating that a first dielectric layer and a second dielectric layer overlap each other according to an exemplary embodiment in the present disclosure.

[0032] Figure 6 It is along Figure 1 A cross-sectional view taken along line II'.

[0033] Figure 7 When Figure 2 When observing from the direction P Figure 2 Schematic diagram of the subject.

[0034] Figure 8 It is along Figure 1 A cross-sectional view taken along line II-II'.

[0035] In the following, reference will be made to Figures 1 to 8 A multilayer electronic assembly 100 according to an exemplary embodiment in the present disclosure is described.

[0036] A multilayer electronic component 100 according to an exemplary embodiment of the present disclosure may include: a body 110 having a first surface 1 and a second surface 2 opposite to each other in a first direction (Z direction), a third surface 3 and a fourth surface 4 connected to the first surface and the second surface and opposite to each other in a second direction (X direction), and a fifth surface 5 and a sixth surface 6 connected to the first surface, the second surface, the third surface, and the fourth surface and opposite to each other in a third direction (Y direction), and including first dielectric layers 111a and second dielectric layers 111b alternately arranged in the first direction (Z direction); and external electrodes 131 and 132 arranged on the third surface and the fourth surface, respectively, wherein a first internal electrode 121 exposed to the third surface and a first dummy pattern d1 spaced apart from the first internal electrode and exposed to the fourth surface are arranged on the first dielectric layer 111a, and the second internal electrode exposed to the fourth surface 122 and a second dummy pattern d2 spaced apart from the second inner electrode and exposed to the third surface are arranged on the second dielectric layer 111b, the first inner electrode 121 includes a first main portion 121m and a first side portion 121s1 and a second side portion 121s2, the first main portion 121m is arranged to be spaced apart from the fifth surface and the sixth surface, the first side portion 121s1 and the second side portion 121s2 are respectively arranged on opposite side surfaces of the first main portion and exposed to the third surface, the second inner electrode 122 includes a second main portion 122m and a third side portion 122s3 and a fourth side portion 122s4, the second main portion 122m is arranged to be spaced apart from the fifth surface and the sixth surface, the third side portion 122s3 and the fourth side portion 122s4 are respectively arranged on opposite side surfaces of the second main portion and exposed to the fourth surface, and the first main portion 121m and the second main portion 122m are arranged in a staggered manner in the third direction. In other words, the outer edge of the first main portion 121 m and the outer edge of the second main portion 122 m diverge from each other in the third direction.

[0037] The body 110 may include a dielectric layer 111 and internal electrodes 121 and 122 , which are alternately stacked in the body 110 .

[0038] The shape of the body 110 is not particularly limited and may be a hexahedron or a shape similar to a hexahedron as shown in the drawings. Although the body 110 does not have a completely straight hexahedron shape due to the shrinkage of ceramic powder particles included in the body 110 during the sintering process, the body 110 may have a substantially hexahedron shape.

[0039] The main body 110 may have: a first surface 1 and a second surface 2, which are opposite to each other in a first direction (Z direction); a third surface 3 and a fourth surface 4, which are connected to the first surface 1 and the second surface 2 and are opposite to each other in a second direction (X direction); and a fifth surface 5 and a sixth surface 6, which are connected to the first surface 1 and the second surface 2, and connected to the third surface 3 and the fourth surface 4, and are opposite to each other in a third direction (Y direction). The first surface 1 and the second surface 2 may be the upper surface and the lower surface of the main body 110, respectively, the third surface 3 and the fourth surface 4 may be the first end surface and the second end surface of the main body 110, respectively, and the fifth surface 5 and the sixth surface 6 may be the first side surface and the second side surface of the main body 110, respectively.

[0040] The plurality of dielectric layers 111 forming the body 110 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other such that it is difficult to identify boundaries therebetween without using a scanning electron microscope (SEM).

[0041] According to exemplary embodiments of the present disclosure, the raw materials of the dielectric layer 111 are not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate-based materials, lead composite perovskite-based materials, strontium titanate-based materials, etc. can be used as the raw materials of the dielectric layer 111. The barium titanate-based materials may include BaTiO3-based ceramic powder particles. Examples of BaTiO3-based ceramic powder particles may include BaTiO3 and calcium (Ca), zirconium (Zr), etc. partially dissolved in BaTiO3 (BaTiO3). 1-x Ca x )TiO3、Ba(Ti 1-y Ca y )O3、(Ba 1-x Ca x )(Ti 1-y Zr y )O3、Ba(Ti 1-y Zr y )O3, etc.

[0042] In addition, according to the purpose of the present disclosure, the raw materials of the dielectric layer 111 may include various ceramic additives added to powder particles (such as barium titanate (BaTiO 3 ) powder particles, etc.), organic solvents, binders, dispersants, etc.

[0043] The main body 110 may include a capacitor forming portion and protective layers 112 and 113, the capacitor forming portion being arranged in the main body 110 and forming a capacitor by including a first internal electrode 121 and a second internal electrode 122 arranged to face each other and with each of the dielectric layers 111 interposed between the first internal electrode 121 and the second internal electrode 122, the protective layers 112 and 113 being respectively formed on opposite end surfaces of the capacitor forming portion in the first direction (Z direction).

[0044] The capacitance forming portion contributing to the capacitance formation of the multilayer capacitor can be formed by repeatedly stacking multiple first internal electrodes 121 and multiple second internal electrodes 122 in a first direction (Z direction), and placing each of the dielectric layers 111 between the first internal electrode 121 and the second internal electrode 122.

[0045] The protective layers 112 and 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on opposite end surfaces in the first direction (Z direction) of the capacitor forming portion, respectively, and can basically be used to prevent damage to the internal electrodes due to physical stress or chemical stress.

[0046] The protective layers 112 and 113 do not include an internal electrode, and may include the same material as that of the dielectric layer 111 .

[0047] The dielectric layer 111 may include first dielectric layers 111 a and second dielectric layers 111 b alternately disposed in a first direction (Z direction).

[0048] The first inner electrode 121 exposed to the third surface 3 of the body 110 and the first dummy pattern d1 spaced apart from the first inner electrode and exposed to the fourth surface 4 of the body 110 may be disposed on the first dielectric layer 111 a, and the second inner electrode 122 exposed to the fourth surface 4 of the body 110 and the second dummy pattern d2 spaced apart from the second inner electrode and exposed to the third surface 3 of the body 110 may be disposed on the second dielectric layer 111 b.

[0049] Reference Figure 2 and Figure 7 The first internal electrodes 121 and the second dummy patterns d2 may be alternately exposed to the third surface 3 . In addition, the second internal electrodes 122 and the first dummy patterns d1 may be alternately exposed to the fourth surface 4 .

[0050] When a portion of the inner electrode other than the portion connected to the outer electrode is exposed to the outside of the body, a short circuit may occur due to the introduction of conductive foreign matter, etc., so that the reliability of the multilayer electronic component may be reduced. Therefore, in the prior art, when the inner electrode is formed on the dielectric layer, the dielectric layer is formed to have an area larger than the area of ​​the inner electrode, so that an edge portion is formed on the remaining peripheral portion of the inner electrode except for the portion connected to the outer electrode. That is, the edge portion refers to the area of ​​the dielectric layer where the inner electrode is not formed. When the inner electrode is formed on the dielectric layer in the manufacturing process, the inner electrode has a shape protruding from the edge portion. Due to this protruding shape, a step portion is generated, and when tens to hundreds of dielectric layers are stacked, the dielectric layer is stretched to fill these step portions. When the dielectric layer is stretched, the inner electrode also warps. When the inner electrode warps, there is a problem of a reduction in the breakdown voltage (BDV) in the corresponding portion.

[0051] Since the first internal electrode 121 is disposed to be spaced apart from the fourth surface 4 and the second internal electrode 122 is disposed to be spaced apart from the third surface 3 , a step portion may be generated due to a thickness difference between the internal electrodes 121 and 122 at both ends in the length direction (X direction) of the body 110 .

[0052] According to an exemplary embodiment in the present disclosure, since the first inner electrode 121 exposed to the third surface 3 of the body 110 and the first dummy pattern d1 spaced apart from the first inner electrode and exposed to the fourth surface 4 of the body 110 are provided on the first dielectric layer 111 a, and the second inner electrode 122 exposed to the fourth surface 4 of the body 110 and the second dummy pattern d2 spaced apart from the second inner electrode and exposed to the third surface 3 of the body 110 are provided on the second dielectric layer 111 b, the step portion generated due to the difference in thickness of the inner electrodes 121 and 122 at both ends in the length direction (X direction) of the body 110 can be suppressed.

[0053] In addition, in conventional internal electrode forms according to the prior art, the internal electrodes are alternately exposed at both ends in the length direction (X direction) of the main body, but are generally not exposed at both ends in the width direction (Y direction) of the main body. Therefore, the step portion caused by the thickness difference of the internal electrode may be more severe at the ends in the width direction (Y direction) of the main body than at the ends in the length direction (X direction) of the main body.

[0054] According to an exemplary embodiment in the present disclosure, the first inner electrode 121 may include a first main portion 121m and a first side portion 121s1 and a second side portion 121s2, the first main portion 121m is disposed to be spaced apart from the fifth surface and the sixth surface, the first side portion 121s1 and the second side portion 121s2 are respectively disposed on opposite side surfaces of the first main portion and exposed to the third surface, and the second inner electrode 122 may include a second main portion 122m and a third side portion 122s3 and a fourth side portion 122s4, the second main portion 122m is disposed to be spaced apart from the fifth surface and the sixth surface, the third side portion 122s3 and the fourth side portion 122s4 are respectively disposed on opposite side surfaces of the second main portion and exposed to the fourth surface.

[0055] The first main portion 121m and the second main portion 122m corresponding to a conventional inner electrode according to the related art may be configured to have different positions in the width direction when they are formed on the dielectric layer 111. That is, when a plurality of dielectric layers 111 are stacked, the first main portion 121m and the second main portion 122m arranged adjacent to each other in the vertical direction may be configured to have different positions in the width direction.

[0056] Reference Figure 8 The first main portion 121m of the vertically upper first dielectric layer 111a and the second main portion 122m of the vertically lower second dielectric layer 111b may be stacked in a staggered manner in the width direction, thereby suppressing steps in the width direction. For example, a portion of the first main portion 121m and a portion of the second main portion 122m may overlap each other in the Z direction, while another portion of the first main portion 121m and another portion of the second main portion 122m may not overlap each other in the Z direction.

[0057] In addition, the first side portion 121s1 and the second side portion 121s2 may be respectively provided on opposite side surfaces of the first main portion 121m in the width direction and the third side portion 122s3 and the fourth side portion 122s4 may be respectively provided on opposite side surfaces of the second main portion 122m in the width direction to further suppress the step portion in the width direction.

[0058] That is, according to an exemplary embodiment in the present disclosure, dummy patterns d1 and d2 may be provided to suppress the step portion in the length direction (X direction), and the first main portion 121m of the first dielectric layer 111a stacked at the upper portion and the second main portion 122m of the second dielectric layer 111b stacked at the lower portion may be stacked in a staggered manner in the width direction and side portions 121s1, 121s2, 122s3, and 122s4 may be provided to suppress the step portion in the width direction (Y direction).

[0059] Since the first dielectric layers 111 a and the second dielectric layers 111 b are alternately disposed in the first direction (Z direction), the first internal electrodes 121 and the second internal electrodes 122 may also be alternately disposed in the first direction (Z direction).

[0060] The first inner electrode 121 and the second dummy pattern d2 can be electrically connected to the first outer electrode 131 through the third surface, and the second inner electrode 122 and the first dummy pattern d1 can be electrically connected to the second outer electrode 132 through the fourth surface. The first and second dummy patterns do not contribute to the formation of capacitance and can be used to suppress step portions in the length direction.

[0061] The first and second internal electrodes 121 and 122 may be electrically separated from each other by each of the dielectric layer 111 a and the dielectric layer 111 b disposed between the first and second internal electrodes 121 and 122 .

[0062] The material of each of the internal electrodes 121 and 122 and the dummy patterns d1 and d2 is not particularly limited and may be a material having excellent electrical conductivity. For example, the internal electrodes 121 and 122 may be formed by printing a conductive paste including one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet.

[0063] The method of printing the conductive paste may be screen printing, gravure printing, etc., but is not limited thereto.

[0064] In this case, the internal electrodes 121 and 122 and the dummy patterns d1 and d2 may be formed using the same material, but are not limited thereto. That is, the internal electrodes 121 and 122 and the dummy patterns d1 and d2 may also be formed by printing different conductive pastes on the ceramic green sheet.

[0065] Reference Figures 3 to 5 , a distance G1 between the first main portion 121m and the fifth surface 5 may be longer than a distance G1′ between the first main portion 121m and the sixth surface 6, and a distance G2 between the second main portion 122m and the fifth surface 5 may be shorter than a distance G2′ between the second main portion 122m and the sixth surface 6. Therefore, the first main portion 121m and the second main portion 122m may be stacked in a staggered manner.

[0066] In this case, the difference between the distance G1 between the first main portion and the fifth surface and the distance G2 between the second main portion and the fifth surface may be greater than or equal to 0.05 times the width Wm1 of the first main portion and less than or equal to 0.2 times the width Wm1 of the first main portion. That is, 0.05×Wm1≤G1-G2≤0.2×Wm1.

[0067] The reason is that when the difference between the distance G1 between the first main portion and the fifth surface and the distance G2 between the second main portion and the fifth surface is less than 0.05 times the width Wm1 of the first main portion, the effect of suppressing the step portion in the width direction may be insufficient, and when the difference between the distance G1 between the first main portion and the fifth surface and the distance G2 between the second main portion and the fifth surface is greater than 0.2 times the width Wm1 of the first main portion, it may be difficult to ensure high capacitance.

[0068] In addition, the width Wm1 of the first main portion and the width Wm2 of the second main portion can be substantially the same. Therefore, the effect of suppressing the step in the width direction can be ensured as much as possible, and the capacitance can be ensured as much as possible. Here, those skilled in the art will understand that the expression "substantially the same" means being the same while allowing for process errors, positional deviations, and / or measurement errors that may occur in the manufacturing process.

[0069] Widths of the first and second sides 121s1 and 121s2 may decrease as they become farther from the third surface, and widths of the third and fourth sides 122s3 and 122s4 may decrease as they become farther from the fourth surface.

[0070] When the widths of the side portions 121s1, 121s2, 122s3, and 122s4 are constant and long, electrical connection between the inner and outer electrodes can be ensured, but the bonding area between the first and second dielectric layers 111a and 111b at the edge portion of the body may become too small, so that the bonding force may be reduced, and delamination may occur at the edge portion of the body.

[0071] In contrast, when the widths of the side portions 121 s 1 , 121 s 2 , 122 s 3 , and 122 s 4 are constant and short, it may be difficult to ensure electrical connection between the internal and external electrodes, and the effect of suppressing the step portion in the width direction may be insufficient.

[0072] Therefore, in an exemplary embodiment of the present disclosure, the electrical connection between the internal electrodes 121 and 122 and the external electrodes 131 and 132 can be ensured by making the widths Ws1, Ws2, Ws3 and Ws4 of the side portions exposed to the third surface and the fourth surface as large as possible, and the effect of suppressing delamination and the effect of suppressing the step portion in the width direction can be fully ensured by making the widths of the side portions 121s1, 121s2, 122s3 and 122s4 smaller toward the central portion in the length direction (X direction) of the main body.

[0073] The first side portion 121s1 can be disposed on one side surface of the first main portion 121m, which is close to the sixth surface, among the opposite side surfaces, and the second side portion 121s2 can be disposed on the other side surface of the first main portion 121m among the opposite side surfaces. The third side portion 122s3 can be disposed on one side surface of the second main portion 122m, which is close to the sixth surface, among the opposite side surfaces, and the fourth side portion 122s4 can be disposed on the other side surface of the second main portion 122m among the opposite side surfaces. Here, the opposite side surfaces refer to the side surfaces opposite to each other in the width direction (Y direction).

[0074] In this case, the width Ws1 of the first side portion exposed to the third surface can be smaller than the width Ws2 of the second side portion exposed to the third surface, and the width Ws3 of the third side portion exposed to the fourth surface can be larger than the width Ws4 of the fourth side portion exposed to the fourth surface. According to an exemplary embodiment of the present disclosure, the distance G1 between the first main portion 121m and the fifth surface 5 can be longer than the distance G1' between the first main portion 121m and the sixth surface 6, and the distance G2 between the second main portion 122m and the fifth surface 5 can be shorter than the distance G2' between the second main portion 122m and the sixth surface 6. Therefore, Ws1 < Ws2 and Ws3 > Ws4, so that the step portion suppression effect and the electrical connectivity improvement effect of the side portion can be significantly increased.

[0075] In addition, the width Ws1 of the first side portion exposed to the third surface and the width Ws4 of the fourth side portion exposed to the fourth surface can be greater than or equal to 0.2 times and less than or equal to 1.0 times the distance G2 between the second main portion and the fifth surface. The width Ws2 of the second side portion exposed to the third surface and the width Ws3 of the third side portion exposed to the fourth surface can be greater than or equal to 0.2 times and less than or equal to 1.0 times the distance G1 between the first main portion and the fifth surface.

[0076] When the widths Ws1 and Ws4 are less than 0.2 times the distance G2, the improvement effect of the connectivity between the inner electrode and the outer electrode and the step portion suppression effect may be insufficient. When the widths Ws1 and Ws4 are greater than 1.0 times the distance G2, the first side portion and the fourth side portion will exceed the width of the main body. Therefore, it may be difficult to form the first side portion and the fourth side portion such that the widths Ws1 and Ws4 are greater than 1.0 times the distance G2.

[0077] In addition, when the widths Ws2 and Ws3 are less than 0.2 times the distance G1, the effect of improving the connectivity between the inner electrode and the outer electrode and the effect of suppressing the step portion may be insufficient. When the widths Ws2 and Ws3 are greater than 1.0 times the distance G1, the second side portion and the third side portion will exceed the width of the main body. Therefore, it may be difficult to form the second side portion and the third side portion such that the widths Ws2 and Ws3 are greater than 1.0 times the distance G1.

[0078] In addition, the length Ls1 at which the first side portion contacts the first main portion with each other may be less than the length Ls2 at which the second side portion contacts the first main portion with each other, and the length Ls3 at which the third side portion contacts the second main portion with each other may be greater than the length Ls4 at which the fourth side portion contacts the second main portion with each other.

[0079] That is, Ls1 < Ls2 and Ls3 > Ls4, and thus the effect of suppressing the step portion of the side portion can be significantly increased.

[0080] In addition, the length Ls1 at which the first side portion contacts the first main portion with each other and the length Ls4 at which the fourth side portion contacts the second main portion with each other may be greater than or equal to 0.4 times the distance G2 between the second main portion and the fifth surface and less than or equal to 3.0 times the distance G2 between the second main portion and the fifth surface. The length Ls2 at which the second side portion contacts the first main portion with each other and the length Ls3 at which the third side portion contacts the second main portion with each other may be greater than or equal to 0.4 times the distance G1 between the first main portion and the fifth surface and less than or equal to 3.0 times the distance G1 between the first main portion and the fifth surface.

[0081] When the lengths Ls1 and Ls4 are less than 0.4 times the distance G2, the effect of suppressing the step portion may be insufficient. When the lengths Ls1 and Ls4 are greater than 3.0 times the distance G2, the bonding force between the first dielectric layer 111a and the second dielectric layer 111b may become insufficient.

[0082] When the lengths Ls2 and Ls3 are less than 0.4 times the distance G1, the effect of suppressing the step portion may be insufficient. When the lengths Ls2 and Ls3 are greater than 3.0 times the distance G1, the bonding force between the first dielectric layer 111a and the second dielectric layer 111b may become insufficient.

[0083] In addition, the second side portion 121s2 may be arranged to partially overlap with the second main portion 122m, and the third side portion 122s3 may be arranged to partially overlap with the first main portion 121m. Therefore, not only can the effect of suppressing the step portion be ensured, but also the effect of improving the capacitance can be ensured.

[0084] In addition, the width of the first dummy pattern d1 may decrease as the first dummy pattern d1 moves away from the fourth surface, and the width of the second dummy pattern d2 may decrease as the second dummy pattern d2 moves away from the third surface.

[0085] When the widths of the dummy patterns d1 and d2 are constant and long, the effect of suppressing the step portion in the width direction can be improved, but the bonding area between the first dielectric layer 111a and the second dielectric layer 111b at the edge portion of the body may become too small, so that the bonding force may be reduced and delamination may occur at the edge portion of the body.

[0086] In contrast, when the widths of the first and second dummy patterns d1 and d2 are constant and short, the effect of suppressing the step portion in the length direction may be insufficient.

[0087] Therefore, in the exemplary embodiment of the present disclosure, the step portion in the length direction can be suppressed by making the widths Wd1 and Wd2 of the dummy patterns exposed to the third surface 3 and the fourth surface 4 as large as possible, and the delamination can be suppressed by making the widths of the first dummy pattern d1 and the second dummy pattern d2 smaller toward the central portion in the length direction (X direction) of the main body 110.

[0088] In addition, the width Wd1 of the first dummy pattern d1 exposed to the fourth surface 4 may be 0.95 times to 1.05 times the width We2 of the second internal electrode 122 exposed to the fourth surface 4, and the width Wd2 of the second dummy pattern d2 exposed to the third surface 3 may be 0.95 times to 1.05 times the width We1 of the first internal electrode 121 exposed to the third surface 3.

[0089] That is to say, if Figure 7 As shown in FIG, Wd2 and We1 may be substantially the same as each other on the third surface 3. In addition, Wd1 and We2 may also be substantially the same as each other on the fourth surface. Therefore, the widths of the first and second dummy patterns d1 and d2 and the side portions 121s1, 121s2, 122s3, and 122s4 can be ensured to be as large as possible, thereby significantly increasing the effect of suppressing the step portion according to each configuration.

[0090] The first dummy pattern d1 may have substantially the same width as the second internal electrode 122 in a region overlapping the second internal electrode 122 , and the second dummy pattern d2 may have substantially the same width as the first internal electrode 121 in a region overlapping the first internal electrode 121 .

[0091] That is, the entire area of ​​the first dummy pattern d1 may substantially overlap the second internal electrode 122 , and the entire area of ​​the second dummy pattern d2 may substantially overlap the first internal electrode 121 .

[0092] The external electrodes 131 and 132 may be disposed on the body 110 and may be connected to the internal electrodes 121 and 122 , respectively.

[0093] like Figure 6As shown in , the external electrodes 131 and 132 may include: a first external electrode 131, which is provided on the third surface 3 of the body 110 and connected to the first internal electrode 121 and the second dummy pattern d2; and a second external electrode 132, which is provided on the fourth surface 4 of the body 110 and connected to the second internal electrode 122 and the first dummy pattern d1.

[0094] The structure in which the multilayer electronic component 100 includes two external electrodes 131 and 132 has been described in the present exemplary embodiment, but the number, shape, etc. of the external electrodes 131 and 132 may be changed according to the shapes of the internal electrodes 121 and 122 or other purposes.

[0095] In addition, the external electrodes 131 and 132 can be formed using any material having conductivity (such as metal), and the specific material of each of the external electrodes 131 and 132 can be determined considering electrical characteristics, structural stability, etc., and the external electrodes 131 and 132 can have a multi-layer structure.

[0096] For example, Figure 6 As shown in FIG, the external electrodes 131 and 132 may include electrode layers 131 a and 132 a disposed on the body 110, and plating layers 131 b and 132 b disposed on the electrode layers 131 a and 132 a, respectively.

[0097] As more specific examples of the electrode layers 131 a and 132 a , the electrode layers 131 a and 132 a may be fired electrodes including a conductive metal and glass or resin-based electrodes including a conductive metal and resin.

[0098] Alternatively, the electrode layers 131a and 132a may have a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Furthermore, the electrode layers 131a and 132a may be formed by transferring a sheet comprising a conductive metal onto the main body, or by transferring a sheet comprising a conductive metal onto a fired electrode. Alternatively, the first electrode layer 131a and the second electrode layer 132a may be formed by, for example, atomic layer deposition (ALD), molecular layer deposition (MLD), chemical vapor deposition (CVD), sputtering, or the like.

[0099] The conductive metal used for the electrode layers 131a and 132a is not particularly limited as long as it can be electrically connected to the internal electrodes to form a capacitor, and may include, for example, one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0100] As a more specific example of the plating layers 131b and 132b, the plating layers 131b and 132b may be Ni plating layers or Sn plating layers, and may have a form in which Ni plating layers and Sn plating layers are sequentially formed on the electrode layers 131a and 132a, respectively, or may have a form in which Sn plating layers, Ni plating layers, and Sn plating layers are sequentially formed. Alternatively, the plating layers 131b and 132b may include multiple Ni plating layers and / or multiple Sn plating layers.

[0101] As described above, according to exemplary embodiments, dummy patterns may be provided to suppress steps in the length direction, internal electrodes may be arranged in a staggered manner in the width direction, and side portions may be provided on opposite side surfaces of the internal electrodes to suppress steps in the width direction. This allows for suppression of steps in both the width direction and the length direction. Consequently, the reliability of a multilayer electronic component can be improved.

[0102] In addition, side portions may be provided to improve electrical connectivity between the inner and outer electrodes.

[0103] While exemplary embodiments have been shown and described above, it will be readily apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present invention as defined by the appended claims.

Claims

1. A multilayer electronic assembly comprising: a body having a first surface and a second surface opposite to each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface, and the fourth surface and opposite to each other in a third direction, the body including first and second dielectric layers alternately arranged in the first direction; as well as external electrodes, respectively disposed on the third surface and the fourth surface, wherein a first inner electrode exposed to the third surface and a first dummy pattern spaced apart from the first inner electrode and exposed to the fourth surface are disposed on the first dielectric layer; A second inner electrode exposed to the fourth surface and a second dummy pattern spaced apart from the second inner electrode and exposed to the third surface are disposed on the second dielectric layer, The first inner electrode includes a first main portion and a first side portion and a second side portion, the first main portion being disposed to be spaced apart from the fifth surface and the sixth surface, the first side portion and the second side portion being disposed on opposite side surfaces of the first main portion and exposed to the third surface, respectively, and a size of the first side portion and a size of the second side portion being different from each other. The second inner electrode includes a second main portion and a third side portion and a fourth side portion, the second main portion being disposed to be spaced apart from the fifth surface and the sixth surface, the third side portion and the fourth side portion being disposed on opposite side surfaces of the second main portion and exposed to the fourth surface, respectively, and a size of the third side portion and a size of the fourth side portion being different from each other, and The first main portion and the second main portion are arranged in a staggered manner in the third direction.

2. The multilayer electronic component according to claim 1, wherein A difference between a distance from the first main portion to the fifth surface and a distance from the second main portion to the fifth surface is greater than or equal to 0.05 times the width of the first main portion and less than or equal to 0.2 times the width of the first main portion.

3. The multilayer electronic component according to claim 2, wherein The first main portion and the second main portion have substantially the same width as each other.

4. The multilayer electronic component according to claim 1, wherein The width of the first side portion and the width of the second side portion decrease in a direction away from the third surface, and The width of the third side portion and the width of the fourth side portion decrease in a direction away from the fourth surface.

5. The multilayer electronic component according to claim 4, wherein The first side portion is provided on a first side surface close to the sixth surface among the opposite side surfaces of the first main portion, the second side portion is provided on a second side surface among the opposite side surfaces of the first main portion, and The third side portion is provided on a first side surface close to the sixth surface among the opposing side surfaces of the second main portion, and the fourth side portion is provided on a second side surface among the opposing side surfaces of the second main portion.

6. The multilayer electronic component according to claim 5, wherein The width of the first side portion exposed to the third surface is smaller than the width of the second side portion exposed to the third surface, and A width of the third side portion exposed to the fourth surface is greater than a width of the fourth side portion exposed to the fourth surface.

7. The multilayer electronic component according to claim 5, wherein The width of the first side portion exposed to the third surface and the width of the fourth side portion exposed to the fourth surface are greater than or equal to 0.2 times the distance from the second main portion to the fifth surface and less than or equal to 1.0 times the distance from the second main portion to the fifth surface, and A width of the second side portion exposed to the third surface and a width of the third side portion exposed to the fourth surface are greater than or equal to 0.2 times the distance from the first main portion to the fifth surface and less than or equal to 1.0 times the distance from the first main portion to the fifth surface.

8. The multilayer electronic component according to claim 5, wherein The length of the first side portion and the first main portion at which they contact each other is shorter than the length of the second side portion and the first main portion at which they contact each other, and A length at which the third side portion contacts the second main portion is greater than a length at which the fourth side portion contacts the second main portion.

9. The multilayer electronic component according to claim 5, wherein The length of contact between the first side portion and the first main portion and the length of contact between the fourth side portion and the second main portion are greater than or equal to 0.4 times the distance from the second main portion to the fifth surface and less than or equal to 3.0 times the distance from the second main portion to the fifth surface, and A contact length between the second side portion and the first main portion and a contact length between the third side portion and the second main portion are greater than or equal to 0.4 times the distance from the first main portion to the fifth surface and less than or equal to 3.0 times the distance from the first main portion to the fifth surface.

10. The multilayer electronic component according to claim 5, wherein The second side portion is arranged to partially overlap the second main portion, and The third side portion is disposed to partially overlap the first main portion.

11. The multilayer electronic component according to claim 4, wherein The width of the first dummy pattern decreases in a direction away from the fourth surface, and A width of the second dummy pattern decreases in a direction away from the third surface.

12. The multilayer electronic component according to claim 4, wherein A width of the first dummy pattern exposed to the fourth surface is 0.95 to 1.05 times a width of the second internal electrode exposed to the fourth surface, and A width of the second dummy pattern exposed to the third surface is 0.95 to 1.05 times a width of the first internal electrode exposed to the third surface.

13. The multilayer electronic component according to claim 4, wherein A width of the first dummy pattern exposed to the fourth surface is substantially the same as a width of the second internal electrode exposed to the fourth surface, and A width of the second dummy pattern exposed to the third surface is substantially the same as a width of the first internal electrode exposed to the third surface.

14. A multilayer electronic assembly comprising: a body comprising first and second dielectric layers, first and second internal electrodes, and first and second dummy patterns, the first and second dielectric layers being alternately arranged in a stacking direction, the first and second internal electrodes being respectively arranged on the first and second dielectric layers, the first dummy pattern being arranged on the first dielectric layer and spaced apart from the first internal electrode, and the second dummy pattern being arranged on the second dielectric layer and spaced apart from the second internal electrode; as well as external electrodes, respectively provided on a first end surface and a second end surface of the main body opposite to each other in the length direction, wherein the first inner electrode and the first dummy pattern are exposed to the first end surface and the second end surface, respectively, and the second inner electrode and the second dummy pattern are exposed to the second end surface and the first end surface, respectively, The outer edge of the first inner electrode and the outer edge of the second inner electrode are separated from each other in a width direction, wherein the width direction is perpendicular to the length direction and the stacking direction. The first internal electrode includes a first main portion exposed to the first end surface, and a first side portion and a second side portion provided on opposite side surfaces of the first main portion and exposed to the first end surface, wherein the first side portion and the second side portion are asymmetrical with respect to a longitudinal central axis of the first main portion, and The second inner electrode includes a second main portion exposed to the second end surface, and a third side portion and a fourth side portion provided on opposite side surfaces of the second main portion and exposed to the second end surface, and the third side portion and the fourth side portion are asymmetric with respect to a longitudinal central axis of the second main portion.

15. The multilayer electronic component according to claim 14, wherein The width of the first dummy pattern decreases in a direction away from the second end surface of the body, and A width of the second dummy pattern decreases in a direction away from the first end surface of the body.

16. The multilayer electronic component according to claim 14, wherein A width of a portion of the first inner electrode decreases in a direction away from the first end surface of the body, and A width of a portion of the second internal electrode decreases in a direction away from the second end surface of the body.

17. A multilayer electronic assembly comprising: a body comprising first and second dielectric layers, first and second internal electrodes, and first and second dummy patterns, the first and second dielectric layers being alternately arranged in a stacking direction, the first and second internal electrodes being respectively arranged on the first and second dielectric layers, the first dummy pattern being arranged on the first dielectric layer and spaced apart from the first internal electrode, and the second dummy pattern being arranged on the second dielectric layer and spaced apart from the second internal electrode; external electrodes, respectively provided on a first end surface and a second end surface of the main body opposite to each other in the length direction, wherein the first inner electrode and the first dummy pattern are exposed to the first end surface and the second end surface, respectively, and the second inner electrode and the second dummy pattern are exposed to the second end surface and the first end surface, respectively. A width of at least one of the first dummy pattern and the second dummy pattern varies in the length direction, and The first internal electrode includes a first main portion exposed to the first end surface, and a first side portion and a second side portion provided on opposite side surfaces of the first main portion and exposed to the first end surface, and a width of a portion of the first side portion exposed to the first end surface and a width of a portion of the second side portion exposed to the first end surface are different from each other, and The second inner electrode includes a second main portion exposed to the second end surface, and a third side portion and a fourth side portion provided on opposite side surfaces of the second main portion and exposed to the second end surface, and a width of a portion of the third side portion exposed to the second end surface is different from a width of a portion of the fourth side portion exposed to the second end surface.

18. The multilayer electronic component according to claim 17, wherein The first internal electrodes and the second internal electrodes are arranged in a staggered manner in a width direction, and the width direction is perpendicular to the length direction and the stacking direction.

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