Cooling gas outlet components, cooling devices and laser annealing equipment

By designing the uniform flow chamber structure of the cooling gas outlet component, the cooling gas is evenly ejected, which solves the problem of uneven cooling of the sealing cover and improves the accuracy and effect of laser annealing.

CN114203538BActive Publication Date: 2025-09-16BEIJING U PRECISION TECH
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Patent Information

Application Number
CN202111407078.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-11-24
Publication Date
2025-09-16
Estimated Expiration
2041-11-24

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Abstract

The present invention provides a cooling gas outlet component, a cooling device, and a laser annealing device, which relate to the field of semiconductor technology. The cooling gas outlet component is used to cool the sealing cover of the process chamber in the laser annealing device, and includes a uniform flow chamber, which is surrounded by a uniform flow chamber body. The uniform flow chamber body includes an air inlet area, a uniform flow area, and an air outlet area along a first direction. The cavity walls corresponding to the uniform flow chamber and the air inlet area are provided with air inlet holes, and the cavity walls corresponding to the uniform flow chamber and the air outlet area are provided with multiple air outlet holes. The cooling device includes the above-mentioned cooling gas outlet component; the laser annealing device includes the above-mentioned cooling device. The provision of the uniform flow chamber in the cooling gas outlet component enables the cooling gas to be uniformly ejected from the multiple air outlet holes, thereby providing a highly consistent cooling effect on the corresponding areas of the sealing cover, thereby reducing the adverse effects of thermal deformation or even rupture of the sealing cover on laser annealing, and correspondingly ensuring the laser annealing accuracy and annealing effect.
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Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a cooling gas outlet component, a cooling device and laser annealing equipment. Background Art

[0002] During the semiconductor chip manufacturing process, some processes require laser annealing of wafers deposited with a metal layer to allow the metal layer to react with the wafer to form metal silicide. During the annealing process, the wafer is generally placed in a process chamber, and the laser beam emitted by the laser anneals the wafer through the sealing cover of the process chamber. The temperature uniformity and thermal deformation of the sealing cover have a significant impact on the overall process and the sealing of the process chamber. Therefore, during the annealing process, a cooling device is required to continuously cool the sealing cover. However, existing cooling devices have poor cooling effect on the sealing cover, and cannot guarantee the temperature uniformity and sealing of the sealing cover, and thus cannot guarantee the accuracy and effectiveness of the laser annealing process. Summary of the Invention

[0003] The purpose of the present invention includes providing a cooling air outlet component, a cooling device and a laser annealing device to solve the technical problems that the existing cooling device has a poor cooling effect on the sealing cover, cannot ensure the temperature uniformity and sealing of the sealing cover, and thus cannot ensure the accuracy and effect of the laser annealing process.

[0004] In order to solve the above problems, the present invention provides a cooling air outlet component for cooling the sealing cover of the process chamber in the laser annealing equipment, including a uniform flow chamber, the uniform flow chamber is surrounded by a uniform flow cavity, the uniform flow cavity includes an air inlet area, a uniform flow area and an air outlet area along a first direction, the cavity walls corresponding to the uniform flow chamber and the air inlet area are provided with air inlet holes, and the cavity walls corresponding to the uniform flow chamber and the air outlet area are provided with multiple air outlet holes.

[0005] Optionally, the uniform flow chamber comprises a cover plate, a bottom plate and a side panel, and the side panel is arranged between the cover plate and the bottom plate;

[0006] The air inlet is provided in an area corresponding to the cover plate and the air inlet region; and / or the air outlet is provided in an area corresponding to the side panel and the air outlet region.

[0007] Optionally, along the first direction, the side panel section facing away from the air intake area is a strip-shaped panel;

[0008] The plurality of air outlet holes are all provided on the strip plate, and the plurality of air outlet holes are evenly spaced along the length direction of the strip plate; and / or the air inlet holes are located in the edge area of ​​the cover plate away from the strip plate.

[0009] Optionally, the cover plate is arranged parallel to the base plate, and on the extended surface of the cover plate, along a second direction perpendicular to the first direction, the air inlet hole is located in the middle of the cover plate, and the air inlet hole is connected to an air inlet connector, and the angle between the air inlet connector and the extended surface of the cover plate is 85°-90°.

[0010] Optionally, a filter layer is provided in the flow-uniform cavity, and the filter layer is separated between the air inlet and the air outlet.

[0011] Optionally, the filter layer is located in the uniform flow area, and an extension surface of the filter layer is arranged perpendicular to the first direction.

[0012] Optionally, the uniform flow chamber forms an inclined guide angle at a corner with the air inlet area and a corresponding area of ​​the uniform flow area;

[0013] Alternatively, the uniform flow chamber is smoothly connected to the air inlet area and the corresponding areas of the uniform flow area.

[0014] The present invention also provides a cooling device, including an air supply component, a temperature adjustment component, a temperature detection component, a processor and the above-mentioned cooling air outlet component, and the temperature detection component, the temperature adjustment component and the air supply component are all connected to the processor; the air inlet hole of the cooling air outlet component is connected to the air supply component through an air inlet pipeline, and the temperature adjustment component is connected to the air supply component or the air inlet pipeline for adjusting the temperature of the gas flowing through; the temperature detection component is used to detect the temperature of the sealing cover.

[0015] The present invention also provides a laser annealing device, comprising a workbench, a process chamber, a heating component and the above-mentioned cooling device, wherein the process chamber comprises a process chamber arranged on the workbench and a sealing cover covering the top opening of the process chamber, and the heating part of the heating component is located in the process chamber; the cooling air outlet component of the cooling device is arranged on the workbench, and the air outlet hole of the cooling air outlet component faces the sealing cover; the temperature detection component of the cooling device is arranged on the sealing cover.

[0016] Optionally, an extension tube is connected to the bottom of the heating part, and the bottom end of the extension tube extends out of the bottom wall of the process chamber as an air inlet end. The tube wall of the extension tube located in the process chamber is provided with a gas supply hole, and the side wall of the process chamber is provided with an exhaust hole.

[0017] Optionally, the exhaust hole is located in a top area of ​​the process chamber, and the gas supply hole is located in a bottom area of ​​the process chamber.

[0018] The present invention provides a setting of a uniform flow chamber in a cooling air outlet component, in which the air inlet and the air outlet are located in opposite side areas along the air flow direction (i.e., the first direction). The uniform flow area of ​​the uniform flow cavity can perform a uniform flow treatment on the cooling gas entering the air inlet area to improve its flow uniformity and make it a uniform fluid; the air outlet area can perform a secondary uniform flow treatment on the uniform fluid to further improve its flow uniformity so that it can be evenly ejected from multiple air outlets, thereby maintaining a high consistency in the cooling effect on the corresponding area of ​​the sealing cover, thereby achieving uniform cooling of the sealing cover, reducing the adverse effects of thermal deformation or even rupture of the sealing cover on laser annealing, and correspondingly ensuring the laser annealing accuracy and annealing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0020] Figure 1 This is a schematic diagram of the cooling gas outlet component in the laser annealing equipment provided by the present invention being installed on a workbench;

[0021] Figure 2 for Figure 1 Schematic cross-sectional view of the middle workbench;

[0022] Figure 3 A schematic diagram of a heating component in the laser annealing equipment provided by the present invention;

[0023] Figure 4 A schematic diagram of a cooling air outlet assembly provided by the present invention;

[0024] Figure 5 for Figure 4 Schematic diagram of the middle cooling air outlet assembly with part of the cover removed;

[0025] Figure 6 This is a schematic diagram of the interior of the uniform flow cavity in the cooling air outlet assembly provided by the present invention, wherein the dotted line represents the dividing line between the air inlet area, the uniform flow area and the air outlet area, and the arrow represents the flow direction of the cooling gas in the uniform flow cavity.

[0026] Description of reference numerals:

[0027] 10-workbench; 20-process chamber; 21-process chamber body; 22-sealing cover; 23-exhaust hole; 30-heating component; 31-heating part; 32-extension tube; 33-air inlet end; 34-air delivery hole; 40-cooling outlet component; 100-uniform flow chamber; 110-uniform flow chamber body; 111-air inlet area; 112-uniform flow area; 113-air outlet area; 120-cover plate; 121-air inlet hole; 130-bottom plate; 140-side panel; 141-strip plate; 142-air outlet hole; 150-air inlet joint; 160-inclined guide angle; 200-filter layer. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the following detailed description of the specific embodiments of the present invention is given in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0029] This embodiment provides a cooling air outlet component 40, such as Figure 4-Figure 6 As shown, it is used to cool the sealing cover 22 of the process chamber 20 in the laser annealing equipment, including a uniform flow chamber 100, the uniform flow chamber 100 is surrounded by a uniform flow chamber body 110, the uniform flow chamber body 110 includes an air inlet area 111, a uniform flow area 112 and an air outlet area 113 along a first direction, the cavity wall corresponding to the uniform flow chamber 100 and the air inlet area 111 is provided with an air inlet hole 121, and the cavity wall corresponding to the uniform flow chamber 100 and the air outlet area 113 is provided with a plurality of air outlet holes 142.

[0030] The cooling air outlet assembly 40 provided in this embodiment includes a uniform flow chamber 100 that serves as a gas flow channel and performs uniform flow treatment on the air flow passing through. Along the first direction, the two opposite side areas of the uniform flow chamber 100 are respectively provided with an air inlet hole 121 for air intake and an air outlet hole 142 for air outlet. When in use, the air inlet 121 is connected to the external air supply component through the air inlet pipeline, and the air outlet 142 of the cooling air outlet component 40 is directed toward the sealing cover 22 of the process chamber 20 in the laser annealing equipment. When the sealing cover 22 needs to be cooled, the air supply component is turned on, and the air supply component inputs cooling gas to the air inlet area 111 of the uniform flow cavity 110 through the air inlet pipeline and the air inlet 121. Since the flow areas of the air inlet area 111, the uniform flow area 112 and the air outlet area 113 are all larger than the flow area of ​​the air inlet 121, the cooling gas entering the air inlet area 111 will diffuse and flow toward the uniform flow area 112 along the first direction. During the diffusion flow, the flow velocity of the cooling gas gradually decreases to form a uniform fluid with a relatively uniform overall flow velocity. The uniform fluid in the uniform flow area 112 further flows toward The cooling air in the air inlet area 111 is uniformly discharged through the plurality of air outlet holes 142 on the cavity wall of the air outlet area 113. The cooling effect of the uniformly discharged cooling gas on the corresponding area of ​​the sealing cover 22 is highly consistent, thereby improving the cooling uniformity of the sealing cover 22 by the cooling air outlet component 40 and reducing the different air outlet flow rates of different air outlet holes 142 of the cooling air outlet component 40, resulting in poor cooling uniformity of different areas of the sealing cover 22. The thermal deformation of the sealing cover 22 affects the laser annealing accuracy and the sealing effect of the process chamber 21, thereby ensuring the laser annealing accuracy and annealing effect.

[0031] That is, the setting of the uniform flow chamber 100 in the cooling air outlet component 40, the air inlet 121 and the air outlet 142 are located in the opposite two side areas along the air flow direction (that is, the first direction), and the uniform flow area 112 of the uniform flow cavity 110 can perform a uniform flow treatment on the cooling gas entering the air inlet area 111 to improve its flow uniformity and become a uniform fluid; the air outlet area 113 can perform a secondary uniform flow treatment on the uniform fluid to further improve its flow uniformity, so that it can be evenly ejected from multiple air outlet holes 142, thereby maintaining a high consistency in the cooling effect on the corresponding areas of the sealing cover 22, thereby achieving uniform cooling of the sealing cover 22, reducing the adverse effects of thermal deformation or even rupture of the sealing cover 22 on laser annealing, and correspondingly ensuring the laser annealing accuracy and annealing effect.

[0032] In this embodiment, Figure 4 and Figure 5As shown, the uniform flow chamber 100 includes a cover plate 120, a bottom plate 130 and a side panel 140. The side panel 140 is arranged between the cover plate 120 and the bottom plate 130, and the air inlet 121 is arranged in the area corresponding to the cover plate 120 and the air inlet area 111. This is a specific form of the uniform flow chamber 100. The air inlet 121 is located on the cover plate 120, and the cooling gas delivered by the air supply component flows from top to bottom into the air inlet area 111 of the uniform flow chamber 110 through the air inlet 121. The flow direction of the cooling gas entering the air inlet area 111 is different from the first direction. The cooling gas entering the air inlet area 111 changes its flow direction under the obstruction of the bottom plate 130 and the side panel 140, and then can flow along the first direction to the uniform flow area 112 and the air outlet area 113, wherein, During the process of the cooling gas changing its flow direction in the air inlet area 111, it can diffuse toward the air inlet area 111 in all directions, and then flow toward the uniform flow area 112 and the air outlet area 113 along the first direction through the air inlet area 111, thereby ensuring that the cooling gas effectively fills the uniform flow area 112 and the air outlet area 113, and correspondingly ensures the uniform flow effect of the uniform flow area 112 and the air outlet area 113 on the cooling gas, thereby further improving the uniformity of the cooling gas in the air outlet area 113 ejected through each air outlet hole 142.

[0033] Optionally, in this embodiment, the air outlet holes 142 are provided in the corresponding areas of the side panel 140 and the air outlet area 113. The air outlet holes 142 are located on the side panel 140, and the flow direction of the air outlet holes 142 is aligned with the first direction. The cooling gas from the air outlet area 113 then continues in the first direction or makes a slight turn at a small angle before being ejected from the inside out through the air outlet holes 142. This reduces the occurrence of a large change in the flow direction of the cooling gas from the air inlet area 111 when ejected through the air outlet holes 142, which could affect its flow rate and uniformity. This further improves the uniformity of the air outlet from the cooling gas outlet assembly 40, ensures uniform cooling of the sealing cover 22 by the cooling gas outlet assembly 40, and further improves the temperature uniformity of the sealing cover 22, reducing the adverse effects of thermal deformation on annealing accuracy and effectiveness. Furthermore, when the cooling gas flow rate is high, the flow direction of the air outlet holes 142 is aligned with the first direction, effectively reducing noise and vibration generated by the cooling gas flow, thereby improving laser annealing accuracy and reducing the impact of the operation on surrounding equipment.

[0034] In this embodiment, along the first direction, such as Figure 4-Figure 6As shown, the section of the side panel 140 facing away from the air inlet region 111 is a strip-shaped panel 141. Multiple air outlet holes 142 are provided in the strip-shaped panel 141, and the air outlet holes 142 are evenly spaced along the length of the strip-shaped panel 141. On the one hand, the flow direction of the air outlet holes 142 is the same as the first direction, so the cooling gas from the air outlet region 113 can be directly ejected outward through the air outlet holes 142 without changing its flow direction. This further reduces the impact of phase transition on the flow rate and uniformity of the cooling gas from the air inlet region 111 when it is ejected through the air outlet holes 142. This further improves the uniformity of the cooling gas ejected through the air outlet holes 142, and further improves the cooling uniformity of the sealing cover 22 by the cooling outlet assembly 40.

[0035] In this embodiment, Figure 4 and Figure 5 As shown, the air inlet hole 121 is located in the edge area of ​​the cover plate 120 away from the strip plate 141. The panel section of the side panel 140 opposite to the strip plate 141 is the air inlet panel section. The air inlet hole 121 is located in the edge area of ​​the cover plate 120 close to the air inlet panel section. The cooling gas flows into the area of ​​the air inlet area 111 close to the air inlet panel section through the air inlet hole 121. The air inlet panel section can prevent the cooling gas from flowing toward the side away from the first direction. That is, the cooling gas can change its flow direction under the obstruction of the air inlet panel section and the bottom plate 130, and flow along the first direction to the uniform flow area 112 and the air outlet area 113, thereby reducing the air inlet hole 121 being located in the cover plate 1 20 is close to the area of ​​the air intake area 111, resulting in a portion of the cooling gas entering the air intake area 111 first flowing in the opposite direction of the first direction toward the air intake enclosure section under the action of the bottom plate 130, and then turning to flow toward the air intake area 111, forming a vortex between the air intake hole 121 and the air intake enclosure section, affecting the flow stability and uniformity of the cooling gas, and correspondingly improving the uniform flow effect of the uniform flow cavity 110 on the cooling gas, thereby further improving the uniformity of the cooling gas ejected from the cold zone outlet component, and the cooling uniformity of the ejected cooling gas on the sealing cover 22.

[0036] Specifically, in this embodiment, Figure 4-Figure 6As shown, the cover plate 120 is arranged parallel to the base plate 130. On the extended surface of the cover plate 120, along the second direction perpendicular to the first direction, the air inlet hole 121 is located in the middle position of the cover plate 120. The air inlet hole 121 is connected to the air inlet connector 150, and the angle between the air inlet connector 150 and the extended surface of the cover plate 120 is 85°-90°. After the cooling gas flows into the air inlet area 111 through the air inlet hole 121, under the obstruction and guidance effect of the bottom plate 130, part of the cooling gas flows toward the first side of the uniform flow cavity 110 along the second direction, and the other part of the cooling gas flows toward the second side of the uniform flow cavity 110 in the opposite direction of the second direction. Since the second direction is approximately perpendicular to the first direction and the air inlet hole 121 is located in the middle position of the cover plate 120 along the second direction, the flow rates of the two parts of cooling gas are approximately equal. On the whole, the cooling gas flowing into the air inlet area 111 through the air inlet hole 121 diffuses in an approximately symmetrical flaring shape to the uniform flow area 112, thereby improving the filling uniformity of the cooling gas in the air inlet area 111 and the uniform flow area 112, ensuring the uniform flow effect of the entire uniform flow cavity 110 on the cooling gas, reducing the large difference in the flow rate of the cooling gas entering different areas of the air inlet area 111 and the uniform flow area 112, and reducing the occurrence of the uniform flow effect of the uniform flow cavity 110. In addition, the air inlet connector 150 protrudes from the uniform flow chamber 100 and can be used to connect to the air inlet pipeline to improve the connection convenience between the cooling air outlet assembly 40 and the air inlet pipeline. Preferably, the angle between the air inlet connector 150 and the cover plate 120 can be 90 degrees.

[0037] Optionally, in this embodiment, a filter layer 200 is provided in the uniform flow cavity 110, and the filter layer 200 is separated between the air inlet 121 and the air outlet 142. The cooling gas flows into the uniform flow cavity 110 through the air inlet 121 and flows out through the air outlet 142. The filter layer 200 is separated between the air inlet 121 and the air outlet 142. Therefore, the cooling gas flowing through the uniform flow cavity 110 must flow through the filter layer 200. The filter layer 200 can filter impurities in the cooling gas flowing through, so as to improve the cleanliness of the cooling gas flowing into the air outlet area 113 and ejected through the air outlet 142, thereby reducing the pollution caused to the sealing cover 22 by the cooling gas outlet component 40 during the cooling process, and correspondingly ensuring the normal use of the sealing cover 22. In addition, when the cooling gas flows through the filter holes of the filter layer 200, the filter holes can weaken the flow rate of the cooling gas with a faster flow rate and evenly distribute the flow rate of the cooling gas in different areas, thereby improving the flow uniformity of the cooling gas entering the air outlet area 113, and correspondingly improving the uniformity of the cooling gas ejected through multiple air outlet holes 142, thereby ensuring the cooling uniformity of the sealing cover 22 by the cooling air outlet component 40.

[0038] Specifically, in this embodiment, Figure 6As shown, the filter layer 200 is located in the uniform flow area 112, and the extension surface of the filter layer 200 is perpendicular to the first direction. As mentioned above, the uniform flow area 112 with a larger space can play a uniform flow role for the cooling gas entering the uniform flow cavity 110. On this basis, the filter layer 200 is located in the uniform flow area 112, and the extension surface of the filter layer 200 is approximately perpendicular to the flow direction (first direction) of the cooling gas, that is, the flow direction of the cooling gas is approximately consistent with the axial direction of the filter hole. The flow direction of the cooling gas changes less during the process of flowing through the filter layer 200, and the eddy current and noise generated when the cooling gas flows through the filter hole are smaller. Accordingly, the filter layer 200 has a better uniform flow effect and a quiet effect on the cooling gas, thereby further improving the flow uniformity of the cooling gas entering the outlet area 113, and correspondingly further improving the uniformity of the cooling gas ejected through the multiple outlet holes 142, thereby ensuring the cooling uniformity of the cooling outlet component 40 on the sealing cover 22.

[0039] Optionally, in this embodiment, if Figure 4-Figure 6 As shown, an inclined guide angle 160 is formed at the corner between the uniform flow chamber 100 and the corresponding areas of the air intake area 111 and the uniform flow area 112. Of the cooling gas flowing into the air intake area 111 through the air inlet hole 121, part of the cooling gas flows to both sides along the side panels 140 under the guiding effect of the side panels 140. An inclined guide angle 160 is formed at the corner between the uniform flow chamber 100 and the corresponding areas of the air intake area 111 and the uniform flow area 112. Accordingly, the side panels 140 form inclined guide surfaces at the corners. When the cooling gas flows to the corners, it can flow into the air intake area 111 more smoothly under the guiding effect of the inclined guide surfaces, thereby reducing the vortex formed at the corners when the cooling gas flows through the corners, affecting its flow stability and uniformity, and further affecting the uniform flow effect of the uniform flow chamber 110. Specifically, as Figure 4 and Figure 5 As shown, the cover plate 120 and the bottom plate 130 can be rectangular respectively, and the two corners located upstream in the first direction are both provided with inclined guide angles 160 to reduce the degree of bending of the corners and reduce the vortex formed by the cooling gas there.

[0040] In addition to providing inclined diversion angles 160 at the corners to improve cooling gas flow stability, the uniform flow chamber 100 also features a smooth transition connection with the corresponding areas of the intake area 111 and the uniform flow area 112. The side panels 140, along with the corresponding areas of the intake area 111 and the stabilization zone, are smooth, curved panels. Cooling gas entering the intake area 111 flows along its smooth inner wall surface toward the intake area 111 under the guidance of the curved panels, where it is redirected to flow in the first direction. This effectively reduces or even eliminates the likelihood of cooling gas forming vortices as it flows through the intake area 111 and the uniform flow area 112. This further enhances the uniform flow of the cooling gas within the uniform flow chamber 110 and improves the uniformity of cooling gas ejected from the cooling outlet assembly 40.

[0041] This embodiment also provides a cooling device, including an air supply component, a temperature adjustment component, a temperature detection component, a processor and the above-mentioned cooling air outlet component 40, and the temperature detection component, the temperature adjustment component and the air supply component are all connected to the processor; the air inlet hole 121 of the cooling air outlet component 40 is connected to the air supply component through an air inlet pipeline, and the temperature adjustment component is connected to the air supply component or the air inlet pipeline for adjusting the temperature of the gas flowing through; the temperature detection component is used to detect the temperature of the sealing cover 22.

[0042] The cooling device provided in this embodiment includes a gas supply component for serving as a cooling gas delivery source, a temperature regulating component for regulating the temperature of the cooling gas, a cooling gas outlet component 40 for uniform flow treatment of the cooling gas, a temperature detection component for temperature detection of the sealing cover 22 of the process chamber 20, and a processor for intelligently controlling and regulating the above components.

[0043] This embodiment also provides a laser annealing device, such as Figure 1 As shown, it includes a workbench 10, a process chamber 20, a heating component 30 and the above-mentioned cooling device. The process chamber 20 includes a process chamber 21 arranged on the workbench 10 and a sealing cover 22 covering the top opening of the process chamber 21. The heating part 31 of the heating component 30 is located in the process chamber 21; the cooling air outlet component 40 of the cooling device is arranged on the workbench 10, and the air outlet 142 of the cooling air outlet component 40 faces the sealing cover 22; the temperature detection component of the cooling device is arranged on the sealing cover 22.

[0044] The cooling device provided in this embodiment is applied to a laser annealing device. When the laser annealing device is in use, the sealing cover 22 covers the process chamber 21 to form the process chamber 20, and the wafer is placed on the heating part 31. The laser of the laser annealing device performs laser annealing on the wafer through the sealing cover 22. During the annealing process, the gas supply component delivers cooling gas to the cooling gas outlet component 40 through the air inlet pipeline. The cooling gas outlet component 40 performs flow uniformity treatment on the cooling gas flowing therethrough and then sprays the cooling gas toward the sealing cover 22 through the air outlet 142. The cooling gas cools the sealing cover 22. During the cooling process, the temperature detection component detects the temperature of the sealing cover 22 in real time and transmits a temperature signal related to the sealing cover 22 to the processor. When the temperature of the sealing cover 22 is higher than a set threshold, the processor controls the gas supply component to increase the flow rate of the cooling gas and controls the temperature adjustment component to lower the temperature of the cooling gas, thereby improving the cooling effect of the cooling device on the sealing cover 22, ensuring that the sealing cover 22 is in a uniform and optimal temperature range and ensuring its normal operation. The above arrangement can achieve high-precision cooling and intelligent control of the sealing cover 22 by the cooling device, thereby improving the ease of use and temperature adjustment accuracy of the cooling device and the laser annealing equipment, and ensuring the normal operation of the laser annealing equipment.

[0045] In this embodiment, Figure 2 and Figure 3 As shown, the bottom of the heating section 31 is connected to an extension tube 32. The bottom end of the extension tube 32 serves as an air inlet end 33 extending out of the bottom wall of the process chamber 21. The wall of the extension tube 32 located within the process chamber 21 is provided with a gas delivery hole 34, and the side wall of the process chamber 21 is provided with an exhaust hole 23. The extension tube 32 is used to deliver inert gas into the process chamber 21. During use, the bottom end of the extension tube 32 can be connected to an external inert gas source. The inert gas flows upward through the bottom end of the extension tube 32 to the gas delivery hole 34, and then flows into the process chamber 21 through the gas delivery hole 34. The original gas in the process chamber 21 is extruded through the exhaust hole 23 under the action of the inert gas, thereby maintaining an inert atmosphere in the process chamber 21. In addition to serving as a support base for the heating section 31, the extension tube 32 can also serve as a delivery pipeline for the inert gas, thus achieving dual purposes, thereby improving the structural simplicity of the laser annealing equipment.

[0046] Preferably, if Figure 2 As shown, the extension tube 32 can be located in the middle of the process chamber 21, and there can be multiple gas holes 34, which are arranged at intervals along the circumference of the extension tube 32. The inert gas in the extension tube 32 can flow out to the four sides of the process chamber 21 through the gas holes 34 at the same time, thereby comprehensively driving out the original gas in the process chamber 21, thereby improving the efficiency of forming an inert atmosphere in the process chamber 21, and ensuring the overall good quality of the inert atmosphere in the process chamber 21, thereby improving the operating efficiency of the laser annealing equipment and ensuring its annealing quality.

[0047] In this embodiment, Figure 2 As shown, the exhaust hole 23 is located in the top area of ​​the process chamber 21, and the gas supply hole 34 is located in the bottom area of ​​the process chamber 21. When an external inert gas source delivers inert gas into the process chamber 21 through the extension tube 32, the inert gas flows into the bottom area of ​​the process chamber 21 through the gas supply hole 34. As the inert gas is continuously supplied, the inert gas in the process chamber 21 gradually fills upward from the bottom area of ​​the process chamber 21, correspondingly squeezing the original gas in the process chamber 21 to flow upward and be discharged through the exhaust hole 23 in the top area. The position distribution of the gas supply hole 34 and the exhaust hole 23 is consistent with the flow direction of the inert gas and the original gas, which can effectively and comprehensively discharge the original gas in the dead zone at the bottom of the process chamber 21, thereby further improving the efficiency of forming an inert atmosphere in the process chamber 21 and ensuring a good inert atmosphere quality in the process chamber 21.

[0048] Finally, it should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0049] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A cooling gas outlet assembly for cooling a sealing cover (22) of a process chamber (20) in a laser annealing device, characterized in that: The invention comprises a uniform flow chamber (100), wherein the uniform flow chamber (100) comprises a cover plate (120), a bottom plate (130) and a side panel (140), wherein the side panel (140) is arranged between the cover plate (120) and the bottom plate (130), and wherein the cover plate (120), the bottom plate (130) and the side panel (140) enclose a uniform flow chamber (110), wherein the uniform flow chamber (110) comprises an air inlet area (111), a uniform flow area (112) and an air outlet area (113) along a first direction; Along the first direction, the side panel (140) away from the air inlet area (111) is a strip plate (141), and the strip plate (141) is provided with a plurality of air outlet holes (142), and the plurality of air outlet holes (142) are evenly spaced along the length direction of the strip plate (141), and the flow direction of the air outlet holes (142) is consistent with the direction of the first direction; the edge area of ​​the cover plate (120) away from the strip plate (141) is provided with an air inlet hole (121), and the flow areas of the air inlet area (111), the uniform flow area (112) and the air outlet area (113) are all larger than the flow area of ​​the air inlet hole (121).

2. The cooling air outlet assembly according to claim 1, characterized in that: The cover plate (120) is arranged parallel to the bottom plate (130); on the extension surface of the cover plate (120), along a second direction perpendicular to the first direction, the air inlet hole (121) is located in the middle of the cover plate (120); the air inlet hole (121) is connected to an air inlet connector (150); and the angle between the air inlet connector (150) and the extension surface of the cover plate (120) is 85°-90°.

3. The cooling air outlet component according to claim 1 or 2, characterized in that: A filter layer (200) is provided in the flow-uniform cavity (110), and the filter layer (200) is separated between the air inlet (121) and the air outlet (142).

4. The cooling air outlet assembly according to claim 3, characterized in that: The filter layer (200) is located in the uniform flow area (112), and an extension surface of the filter layer (200) is arranged perpendicular to the first direction.

5. The cooling air outlet component according to claim 1 or 2, characterized in that: An inclined flow guide angle (160) is formed at the corners of the uniform flow chamber (100), the air inlet area (111), and the corresponding areas of the uniform flow area (112); Alternatively, the uniform flow chamber (100) is smoothly transitionally connected to corresponding areas of the air inlet area (111) and the uniform flow area (112).

6. A cooling device, characterized in that: It comprises an air supply component, a temperature regulating component, a temperature detection component, a processor and a cooling air outlet component (40) according to any one of claims 1 to 5, and the temperature detection component, the temperature regulating component and the air supply component are all connected to the processor; the air inlet hole (121) of the cooling air outlet component (40) is connected to the air supply component through an air inlet pipeline, and the temperature regulating component is connected to the air supply component or the air inlet pipeline for regulating the temperature of the gas flowing therethrough; the temperature detection component is used to detect the temperature of the sealing cover (22).

7. A laser annealing device, characterized in that: The invention comprises a workbench (10), a process chamber (20), a heating component (30) and the cooling device according to claim 6, wherein the process chamber (20) comprises a process chamber (21) provided on the workbench (10) and a sealing cover (22) covering the top opening of the process chamber (21), and the heating part (31) of the heating component (30) is located in the process chamber (21); a cooling air outlet component (40) of the cooling device is provided on the workbench (10), and an air outlet hole (142) of the cooling air outlet component (40) faces the sealing cover (22); and a temperature detection component of the cooling device is provided on the sealing cover (22).

8. The laser annealing equipment according to claim 7, characterized in that: The bottom of the heating portion (31) is connected to an extension tube (32), and the bottom end of the extension tube (32) extends out of the bottom wall of the process chamber (21) as an air inlet end (33). The wall of the extension tube (32) located in the process chamber (21) is provided with an air delivery hole (34), and the side wall of the process chamber (21) is provided with an exhaust hole (23).

9. The laser annealing equipment according to claim 8, characterized in that: The exhaust hole (23) is located in the top area of ​​the process chamber (21), and the gas supply hole (34) is located in the bottom area of ​​the process chamber (21).

Citation Information

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