Carrying device, semiconductor process equipment and current balancing method

Abstract

The present application discloses a carrier device, semiconductor process equipment and a current balancing method, and relates to the semiconductor field. A carrier device includes: a base, the base is provided with a positive module and a negative module, the positive module is connected to the positive circuit, and the negative module is connected to the negative circuit; a current regulating component, the current regulating component is respectively connected to the positive circuit and the negative circuit, and is used to collect a first current signal and a second current signal, and adjust at least one of the positive circuit and the negative circuit according to the first current signal and the second current signal, so that the first current signal and the second current signal are in a preset ratio. A semiconductor process equipment includes a process chamber, and the process chamber is provided with the above-mentioned carrier device. A current balancing method is applied to the above-mentioned carrier device. The present application can solve the problem that the radio frequency impedance of the positive and negative cable buses is not controlled.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a carrier device, semiconductor process equipment and a current balancing method. Background Art

[0002] In semiconductor coating or etching equipment, the RF energy provided by the RF power supply is transmitted to the chamber to ionize the process gas in a high vacuum state to generate a plasma containing active particles. These active particles interact with the wafer carried on the base in the chamber in a complex manner, causing various physical or chemical reactions on the surface of the wafer material to complete the wafer coating or etching process.

[0003] In some plasma devices used in coating processes, the DC power supply provides a negative DC bias to excite and attract plasma to bombard the target material, causing the metal ions in the target material to escape from the target material and eventually reach the wafer surface to form a metal film. However, due to the presence of the RF power of the RF power supply, a negative RF self-bias will be formed on the wafer, attracting positive ions to the wafer. Therefore, the uniformity of the bias distribution on the wafer surface determines the uniformity of the plasma acting on the wafer.

[0004] Among them, the base is provided with an RF electrode and a DC electrode, and the positive poles of the RF electrode and the DC electrode are respectively connected to the positive cable bus, and the negative poles of the RF electrode and the DC electrode are respectively connected to the negative cable bus, and the RF power supply and the DC power supply supply power to the RF electrode and the DC electrode through the positive cable bus and the negative cable bus respectively.

[0005] However, since the lengths of the positive cable bus and the negative cable bus cannot be completely equal, and the wiring of the positive cable bus and the negative cable bus is different, the inductance difference between the two will be large, resulting in uncontrolled RF impedance of the two sets of cable buses. Therefore, the energy of the RF power fed into the RF electrode will be greatly different, resulting in uncontrolled bias voltage on the wafer surface, causing eccentricity, and thus poor deposition or etching uniformity. Summary of the invention

[0006] The purpose of the embodiments of the present application is to provide a load-bearing device, semiconductor process equipment and current balancing method, which can solve the problem of uncontrolled radio frequency impedance of the positive cable bus and the negative cable bus.

[0007] In order to solve the above technical problems, this application is implemented as follows:

[0008] The present application provides a carrier device for use in semiconductor process equipment, the carrier device comprising:

[0009] A base for carrying a wafer, wherein the base is provided with a positive electrode module and a negative electrode module, wherein the positive electrode module is connected to a positive electrode circuit, and the negative electrode module is connected to a negative electrode circuit;

[0010] A current regulating component, wherein the current regulating component is connected to the positive circuit and the negative circuit respectively;

[0011] The current regulating component is used to collect a first current signal in the positive circuit and a second current signal in the negative circuit, and to regulate at least one of the positive circuit and the negative circuit according to the first current signal and the second current signal so that the first current signal and the second current signal are in a preset ratio.

[0012] A semiconductor process equipment comprises a process chamber, wherein the above-mentioned carrying device is arranged in the process chamber.

[0013] A current balancing method is applied to the above-mentioned load-bearing device, and the current balancing method comprises:

[0014] Collecting a first current signal in the positive circuit and a second current signal in the negative circuit;

[0015] At least one of the positive circuit and the negative circuit is adjusted according to the first current signal and the second current signal so that the first current signal and the second current signal are in a preset ratio.

[0016] In an embodiment of the present application, a first current signal in the positive circuit and a second current signal in the negative circuit can be collected through a current regulating component, and at least one of the positive circuit and the negative circuit can be adjusted according to the first current signal and the second current signal, so that the first current signal and the second current signal can be in a preset ratio, so that the RF impedance in the positive circuit and the negative circuit is within a controllable range, thereby reducing the difference in energy generated by the RF power fed into the electrode, and further making the bias voltage generated on the wafer surface controllable, not easily causing eccentricity, and further ensuring the uniformity of deposition or etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the structure of a load-bearing device and a power supply device disclosed in an embodiment of the present application;

[0018] Figure 2 A schematic diagram showing the connection between the current regulating component disclosed in the embodiment of the present application and the positive circuit and the negative circuit respectively;

[0019] Figure 3 A schematic diagram of a first electrode protection element or a second electrode protection element disclosed in an embodiment of the present application;

[0020] Figure 4 A schematic diagram of a first form of current regulating component disclosed in an embodiment of the present application;

[0021] Figure 5 A control flow chart of the first form of current regulating component disclosed in the embodiment of the present application;

[0022] Figure 6 A schematic diagram of a second form of current regulating component disclosed in an embodiment of the present application;

[0023] Figure 7 This is a control flow chart of the second form of current regulation component disclosed in an embodiment of the present application.

[0024] Description of reference numerals:

[0025] 100-base; 110-electrostatic chuck base; 120-electrostatic chuck ceramic plate;

[0026] 210-positive electrode module; 211-RF positive electrode; 212-DC positive electrode; 213-RF positive electrode terminal; 214-DC positive electrode terminal; 220-negative electrode module; 221-RF negative electrode; 222-DC negative electrode; 223-RF negative electrode terminal; 224-DC negative electrode terminal; 230-positive electrode circuit; 240-negative electrode circuit; 250-flexible conductive member;

[0027] 300-current regulating component; 310-controller; 311-identification module; 312-comparison module; 313-driving module; 320-first regulating member; 330-second regulating member; 340-first collecting element; 350-second collecting element;

[0028] 410 - first electrode protection element; 420 - second electrode protection element;

[0029] 510-RF power supply; 520-matching device; 530-DC power supply; 540-filter; 550-DC blocking capacitor. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0032] The embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0033] refer to Figures 1 to 7 The embodiment of the present application discloses a carrier device, which can be used in a process chamber of a semiconductor process equipment, so that the wafer can be subjected to processes such as coating and etching in the process chamber.

[0034] The disclosed supporting device includes a base 100 and a current regulating component 300, wherein the base 100 is used to support the wafer, and the current regulating component 300 is used to detect and adjust the current so that the negative RF self-bias formed on the wafer is more uniform, thereby improving the uniformity of wafer surface coating or etching, and further improving product quality.

[0035] In order to form a radio frequency self-bias voltage on the wafer carried on the base 100, in the embodiment of the present application, the base 100 is provided with a positive module 210 and a negative module 220, wherein the positive module 210 is connected to the positive circuit 230, and the negative module 220 is connected to the negative circuit 240, so that electric energy can be transmitted to the positive module 210 and the negative module 220 respectively through the positive circuit 230 and the negative circuit 240, and under the action of the positive module 210 and the negative module 220, a radio frequency self-bias voltage can be formed on the wafer carried on the base 100. In this way, the ions generated in the process can contact with the wafer surface and react physically or chemically with the wafer surface, thereby realizing the coating or etching process on the wafer surface.

[0036] Since the positive circuit 230 supplies power to the positive module 210, and the negative circuit 240 supplies power to the negative module 220. However, considering factors such as mechanical design and actual installation, there are certain differences between the cables of the positive circuit 230 and the cables of the negative circuit 240. For example, the length of the cables of the positive circuit 230 and the cables of the negative circuit 240 differs greatly, resulting in a large difference in inductance between the positive circuit 230 and the negative circuit 240. In addition, the arrangement of the cables of the positive circuit 230 and the cables of the negative circuit 240 differs greatly, resulting in a large difference in distributed capacitance and distributed inductance between the positive circuit 230 and the negative circuit 240. Based on the above situation, the RF impedance of the positive circuit 230 and the negative circuit 240 is uncontrolled. Therefore, the energy of the RF power finally fed into the RF electrode is greatly different, resulting in uncontrolled deviation on the wafer surface, causing eccentricity, and then resulting in poor deposition or etching uniformity, affecting product quality.

[0037] Based on this, in an embodiment of the present application, the carrying device also includes a current regulating component 300, through which the current regulating component 300 can adjust the current signals in the positive circuit 230 and the negative circuit 240, so that the current in the positive circuit 230 and the current in the negative circuit 240 satisfy a certain proportional relationship, thereby overcoming the above-mentioned problem.

[0038] In the embodiment of the present application, the first current signal in the positive circuit 230 and the second current signal in the negative circuit 240 can be collected by the current regulating component 300, and at least one of the positive circuit 230 and the negative circuit 240 can be adjusted according to the first current signal and the second current signal, so that the first current signal and the second current signal can be in a preset ratio, so that the radio frequency impedance in the positive circuit 230 and the negative circuit 240 is within a controllable range, so that the difference in energy generated by the radio frequency power fed into the electrode can be reduced, and then the bias voltage generated on the wafer surface can be controlled, which is not easy to cause eccentricity, and further ensures the uniformity of deposition or etching.

[0039] refer to Figure 1 and Figure 2In some embodiments, the current regulating component 300 includes a controller 310, a first regulating member 320, a second regulating member 330, a first collecting element 340, and a second collecting element 350. The first regulating member 320 and the first collecting element 340 are arranged in series in the positive circuit 230, so that the first current signal in the positive circuit 230 can be collected in real time through the first collecting element 340; the second regulating member 330 and the second collecting element 350 are arranged in series in the negative circuit 240, so that the second current signal in the negative circuit 240 can be collected in real time through the second collecting element 350; the first regulating member 320 can regulate the first current signal in the positive circuit 230; and the second regulating member 330 can regulate the second current signal in the negative circuit 240.

[0040] At the same time, the first acquisition element 340 and the second acquisition element 350 are respectively connected to the controller 310, so that the current signals collected by each can be transmitted to the controller 310 for data processing by the controller 310. The first adjustment member 320 and the second adjustment member 330 are respectively connected to the controller 310, so that the first adjustment member 320 and / or the second adjustment member 330 can be respectively controlled by the controller 310 to adjust, so as to respectively adjust the first circuit signal in the positive circuit 230 and / or the second current signal in the negative circuit 240, so as to make the first current signal in the positive circuit 230 and the second current signal in the negative circuit 240 in a certain ratio to meet actual needs.

[0041] In this way, the controller 310 can control at least one of the first adjustment member 320 and the second adjustment member 330 to adjust according to the first current signal in the positive circuit 230 collected by the first collection element 340 and the second current signal in the negative circuit 240 collected by the second collection element 350, so that the first current signal in the positive circuit 230 and the second current signal in the negative circuit 240 are in a preset ratio. Optionally, the preset ratio can be 1 or not 1, such as 0.9, 1.1, 1.2, etc. The specific value of the preset ratio in the embodiment of the present application can be determined according to actual conditions.

[0042] Based on the above configuration, the first current signal is collected by the first collecting element 340, the second current signal is collected by the second collecting element 350, and the first current signal and the second current signal are transmitted to the controller 310 respectively. After comparison by the controller 310, when the difference between the first current signal in the positive circuit 230 and the second current signal in the negative circuit 240 is large and not in a preset ratio, the controller 310 controls at least one of the first adjustment member 320 and the second adjustment member 330 to adjust the first current signal in the positive circuit 230 and the second current signal in the negative circuit 240, so that the first current signal in the positive circuit 230 and the second current signal in the negative circuit 240 can be in a preset ratio, so that the radio frequency impedance in the positive circuit 230 and the negative circuit 240 is within a controllable range, so that the difference in energy generated by the radio frequency power fed into the electrode can be reduced, thereby making the bias voltage generated on the wafer surface controllable, not easy to cause eccentricity, and further ensuring deposition or etching uniformity.

[0043] refer to Figure 4 In order to receive and analyze the current signal and control the adjustment action, the controller 310 in the embodiment of the present application includes an identification module 311, a comparison module 312 and a drive module 313, and the identification module 311, the comparison module 312 and the drive module 313 are connected in sequence.

[0044] Among them, the identification module 311 is connected to the first collection element 340 and the second collection element 350 respectively. The first current signal and the second current signal collected by the first collection element 340 and the second collection element 350 can be received through the identification module 311, and the first current signal and the second current signal are sent to the comparison module 312 for comparison through the comparison module 312; the comparison module 312 is used to compare the first current signal and the second current signal, and send the comparison result to the driving module 313; the driving module 313 is used to control at least one of the first adjustment member 320 and the second adjustment member 330 to adjust when the difference between the first current signal and the N times the second current signal is not equal to zero, so as to correspondingly adjust the current signal in the positive circuit 230 and / or the negative circuit 240, so that the difference between the first current signal and the N times the second current signal is equal to zero.

[0045] In this way, the first acquisition element 340 transmits the first current signal collected from the positive circuit 230 to the identification module 311, and the second acquisition element 350 transmits the second current signal collected from the negative circuit 240 to the identification module 311; the identification module 311 transmits the received first current signal and the second current signal to the comparison module 312, and the comparison module 312 compares the first current signal and the second current signal to determine whether the first current signal and the second current signal are in a preset ratio, that is, to determine whether the difference between the first current and the N times the second current signal is equal to zero, and transmits the judgment result to the driving module 313.

[0046] When the difference between the first current signal and the N times second current signal is equal to zero, the actual requirement is met. At this time, there is no need to adjust the current in the positive circuit 230 and the negative circuit 240, and the driving module 313 will not issue an adjustment instruction to at least one of the first adjustment member 320 and the second adjustment member 330.

[0047] When the difference between the first current signal and N times the second current signal is not equal to zero, the current in the positive circuit 230 is not proportional to the current in the negative circuit 240. Based on this, the driving module 313 sends an adjustment instruction to at least one of the first adjustment member 320 and the second adjustment member 330, so that at least one of the first adjustment member 320 and the second adjustment member 330 starts the adjustment action and adjusts at least one of the first current signal and the second current signal, so that the first current signal and the second current signal are in a preset ratio to meet actual needs.

[0048] Based on the above configuration, the identification module 311 , the comparison module 312 and the driving module 313 can cooperate with each other to adjust the current signal in at least one of the positive circuit 230 and the negative circuit 240 to meet actual needs.

[0049] In order to adjust the current signal, in some embodiments, the first adjustment member 320 and the second adjustment member 330 both include an adjustable inductor, so that the current signal can be adjusted by adjusting the inductance of the adjustable inductor. Optionally, the first adjustment member 320 may include an adjustable inductor L1, and the second adjustment member 330 may include an adjustable inductor L2. Initially, the adjustable inductor L1 and the adjustable inductor L2 are both in the middle position. For example, if the full range of the adjustable inductor is defined as 0-100%, initially, the adjustable inductor L1 and the adjustable inductor L2 are both in the 50% position.

[0050] refer to Figure 5The specific adjustment process is as follows: detecting whether the radio frequency is started. When the radio frequency is started, the current signals in the positive circuit 230 and the negative circuit 240 are respectively collected by the first collection element 340 and the second collection element 350, wherein the first current signal in the positive circuit 230 is I1, and the second current signal in the negative circuit 240 is I2. After identification, the recognition module 311 transmits the first current signal I1 and the second current signal I2 to the comparison module 312, and the comparison module 312 compares the first current signal I1 and the N-fold second current signal I2, and performs inductance control according to the difference between the first current signal I1 and the N-fold second current signal I2.

[0051] When the difference Δ between the first current signal I1 and the N-times second current signal I2 is equal to zero, no adjustment is performed, so that the inductance of the first adjustment member 320 and the second adjustment member 330 remain unchanged.

[0052] When the difference △ between the first current signal I1 and the N times second current signal I2 is not equal to zero, the inductance of the first adjustment member 320 or the second adjustment member 330 is adjusted according to a first adjustment method, wherein the first adjustment method may be to increase the inductance of the adjustable inductor L1 or to decrease the inductance of the adjustable inductor L2. At this time, if the absolute value of the difference between the first current signal I1 and the N times the second current signal I2 decreases, that is, |I1-N*I2| decreases, then continue to adjust according to the first adjustment method, so that the absolute value of the difference between the first current signal I1 and the N times the second current signal I2 gradually approaches zero, and finally equals zero; if when adjusting according to the above-mentioned first adjustment method, the absolute value of the difference between the first current signal I1 and the N times the second current signal I2 increases, that is, |I1-N*I2| increases, then adjust in a manner opposite to the first adjustment method, which can be to reduce the inductance of the adjustable inductor L1 or increase the inductance of the adjustable inductor L2, so that the absolute value of the difference between the first current signal I1 and the N times the second current signal I2 gradually approaches zero, and finally equals zero.

[0053] Based on the above method, the first current signal in the positive circuit 230 or the second current signal in the negative circuit 240 can be adjusted by adjusting the inductance of the first adjusting component 320 or the second adjusting component 330, so that the first current signal in the positive circuit 230 and the second current signal in the negative circuit 240 can finally be in a preset ratio, that is, |I1-N*I2| is equal to zero, thereby meeting actual needs.

[0054] refer to Figure 6 and Figure 7In some other embodiments, the first adjustment member 320 and the second adjustment member 330 both include an inductor and an adjustable capacitor. Optionally, the inductor and the adjustable capacitor are connected in parallel, so that when the difference between the first current signal I1 and the N times second current signal I2 is equal to zero, the capacitance of the first adjustment member 320 and the second adjustment member 330 remains unchanged; when the difference between the first current signal I1 and the N times second current signal I2 is not equal to zero, the capacitance of the adjustable capacitor in the first adjustment member 320 is adjusted, or the capacitance of the adjustable capacitor in the second adjustment member 330 is adjusted, so that the difference between the first current signal I1 and the N times second current signal I2 is equal to zero.

[0055] In addition to the above-mentioned methods, there are other combinations of inductors and capacitors in the first adjustment member 320, including: adjustable inductors and capacitors arranged in parallel and adjustable inductors and adjustable capacitors arranged in parallel. Similarly, there are other combinations of inductors and capacitors in the second adjustment member 330, including: adjustable inductors and capacitors arranged in parallel and adjustable inductors and adjustable capacitors arranged in parallel. In this way, there are three combinations of inductors and capacitors in the first adjustment member 320, and three combinations of inductors and capacitors in the second adjustment member 330, so that nine different combinations can be obtained.

[0056] Optionally, the example in which the first adjusting component 320 includes an adjustable capacitor C1 and an inductor L1 connected in parallel, and the second adjusting component 330 includes an adjustable capacitor C2 and an inductor L2 connected in parallel is taken for detailed description.

[0057] In practical applications, device selection can be performed based on the RF frequency and hardware structure used by the carrier device to ensure that the device adjustment direction is monotonic, thereby simplifying the control process. Optionally, when the RF frequency is 13.56MHz and the inductance of a single RF branch is 100nH, the adjustable capacitors C1 and C2 are respectively in the range of 10pF-100pF, and the inductors L1 and L2 are 44uH respectively. At this time, the control process is monotonic, and the specific adjustment process is:

[0058] Determine whether the radio frequency is turned on. When the radio frequency is turned on, the current signals in the positive circuit 230 and the negative circuit 240 are correspondingly collected by the first collection element 340 and the second collection element 350, wherein the first current signal in the positive circuit 230 is I1, and the second current signal in the negative circuit 240 is I2. After identification, the identification module 311 transmits the first current signal I1 and the second current signal I2 to the comparison module 312, and the first current signal I1 and the N-fold second current signal I2 are compared by the comparison module 312, and the inductance control is performed according to the difference between the first current signal I1 and the N-fold second current signal I2.

[0059] When the difference between the first current signal I1 and the N-times second current signal I2 is equal to zero, no adjustment is performed, so that the capacitance of the first adjustment member 320 and the capacitance of the second adjustment member 330 remain unchanged.

[0060] In the case where the difference between the first current signal I1 and the N times second current signal I2 is not equal to zero, continue to judge the positive or negative of the above difference, that is, judge the positive or negative of I1-N*I2. When I1-N*I2>0, reduce the capacitance of the adjustable capacitor C1 or increase the capacitance of the adjustable capacitor C2, so that the difference between the first current signal I1 and the N times second current signal I2 can gradually approach zero from a positive number, and finally equal to zero; when I1-N*I2<0, increase the capacitance of the adjustable capacitor C1 or reduce the capacitance of the adjustable capacitor C2, so that the difference between the first current signal I1 and the N times second current signal I2 can gradually approach zero from a negative number, and finally equal to zero.

[0061] Based on the above method, the first current signal in the positive circuit 230 or the second current signal in the negative circuit 240 can be adjusted by adjusting the respective capacitances of the first adjusting member 320 and the second adjusting member 330, so that the first current signal in the positive circuit 230 and the second current signal in the negative circuit 240 can finally be in a preset ratio, that is, |I1-N*I2| is equal to zero, thereby meeting actual needs.

[0062] It should be noted here that the other eight of the above nine different combinations can also realize the adjustment of the first current signal in the positive circuit 230 or the second current signal in the negative circuit 240, so that the first current signal in the positive circuit 230 and the second current signal in the negative circuit 240 can finally be in a preset ratio. For details, please refer to the specific process of the above-mentioned capacitor adjustment, which will not be repeated here.

[0063] In order to enable plasma to deposit on or etch the wafer surface, the positive electrode module 210 and the negative electrode module 220 need to be connected to an RF power supply and a DC power supply, so that RF power and DC power can be provided to the positive electrode module 210 and the negative electrode module 220 at the same time.

[0064] Based on this, the positive electrode module 210 in the embodiment of the present application includes an RF positive electrode 211 and a DC positive electrode 212, and the RF positive electrode 211 is connected to the first branch, the DC positive electrode 212 is connected to the second branch, the first branch and the second branch are arranged in parallel, and both are connected to the positive circuit 230. In this way, the RF positive electrode 211 can be connected to the positive circuit 230 through the first branch, and the DC positive electrode 212 can be connected to the positive circuit 230 through the second branch, so that the RF positive electrode 211 and the DC positive electrode 212 can be powered respectively.

[0065] Similarly, the negative electrode module 220 includes an RF negative electrode 221 and a DC negative electrode 222, and the RF negative electrode 221 is connected to the third branch, the DC negative electrode 222 is connected to the fourth branch, the third branch and the fourth branch are arranged in parallel, and both are connected to the negative electrode circuit 240. In this way, the RF negative electrode 221 can be connected to the negative electrode circuit 240 through the third branch, and the DC negative electrode 222 can be connected to the negative electrode circuit 240 through the fourth branch, so that the RF negative electrode 221 and the DC negative electrode 222 can be powered respectively.

[0066] Taking into account the fact that excessive RF current may cause damage to some positive electrode devices (such as the flexible conductive member 250 connected to the DC positive electrode 212), in an embodiment of the present application, a first electrode protection element 410 is connected in series in the second branch. The first electrode protection element 410 can reduce the RF current flowing into the positive electrode device to a certain extent, thereby protecting the positive electrode device and preventing damage to the positive electrode device.

[0067] Taking into account the fact that excessive RF current may cause damage to some negative electrode devices (such as the flexible conductive member 250 connected to the DC negative electrode 222), in an embodiment of the present application, a second electrode protection element 420 is connected in series in the fourth branch. The second electrode protection element 420 can reduce the RF current flowing into the negative electrode device to a certain extent, thereby protecting the negative electrode device to prevent damage to the negative electrode device.

[0068] refer to Figure 3 The first electrode protection element 410 may also include an inductor and a capacitor, which are connected in parallel and arranged in the second branch. Based on this, the inductor and capacitor connected in parallel form a parallel resonant network, so that the radio frequency current flowing through the positive electrode device can be reduced, thereby protecting the positive electrode device. Optionally, the radio frequency frequency is selected to be 13.56MHz, the inductor L is selected to be a 1uH hollow winding inductor, and the capacitor C is selected to be 150pF.

[0069] Similarly, the second electrode protection element 420 may also include an inductor and a capacitor, which are connected in parallel and arranged in the fourth branch. Based on this, the inductor and capacitor connected in parallel form a parallel resonant network, so that the radio frequency current flowing through the negative electrode device can be reduced, thereby protecting the negative electrode device. Optionally, the radio frequency frequency is selected to be 13.56MHz, the inductor L is selected to be a 1uH hollow winding inductor, and the capacitor C is selected to be 150pF.

[0070] In order to realize the connection between the positive module 210 and the positive circuit 230 to transmit electric energy to the positive module 210, in some embodiments, the positive module 210 may include an RF positive terminal 213 and a DC positive terminal 214. The RF positive terminal 213 connects the RF positive electrode 211 and the first branch. At this time, the positive circuit 230, the first branch, the RF positive terminal 213 and the RF positive electrode 211 are connected in sequence to realize the transmission of electric energy to the RF positive electrode 211. Optionally, the RF positive terminal 213 and the RF positive electrode 211 can be connected by a hard conductive member, which can be a conductive wire or the like. In addition, the DC positive terminal 214 is connected to the second branch, and the DC positive terminal 214 and the DC positive electrode 212 are connected by a flexible conductive member 250. In this way, the positive circuit 240, the second branch, the DC positive terminal 214, the flexible conductive member 250 and the DC positive electrode 212 are connected in sequence to realize the transmission of electric energy to the DC positive electrode 212. Optionally, the flexible conductive member 250 may be conductive glue or the like.

[0071] Similarly, in order to realize the connection between the negative electrode module 220 and the negative electrode circuit 240 to transmit electric energy to the negative electrode module 220, in some embodiments, the negative electrode module 220 may include an RF negative terminal 223 and a DC negative terminal 224. Among them, the RF negative terminal 223 connects the RF negative electrode 221 and the third branch. At this time, the negative electrode circuit 240, the third branch, the RF negative terminal 223 and the RF negative electrode 221 are connected in sequence to realize the transmission of electric energy to the RF negative electrode 221. Optionally, the RF negative terminal 223 and the RF negative electrode 221 can be connected by a hard conductive part, which can be a conductive wire, etc. In addition, the DC negative terminal 224 is connected to the fourth branch, and the DC negative terminal 224 is connected to the DC negative electrode 222 through a flexible conductive member 250. In this way, the negative circuit 240, the fourth branch, the DC negative terminal 224, the flexible conductive member 250 and the DC negative electrode 222 are connected in sequence to achieve power transmission to the DC negative electrode 222. Optionally, the flexible conductive member 250 can be a conductive adhesive or the like.

[0072] refer to Figure 1 In some embodiments, the base 100 is an electrostatic chuck, which includes an electrostatic chuck base 110 and an electrostatic chuck ceramic disk 120 disposed on the electrostatic chuck base 110. The electrostatic chuck base 110 is disposed on a side of the electrostatic chuck ceramic disk 120 that is away from the bearing surface, and the electrostatic chuck base 110 and the electrostatic chuck ceramic disk 120 are coaxially disposed.

[0073] In order to install the positive electrode module 210 and the negative electrode module 220 to the base 100, in an embodiment of the present application, the RF positive electrode 211, the RF negative electrode 221, the DC positive electrode 212 and the DC negative electrode 222 are respectively arranged inside the electrostatic chuck ceramic disk 120, and each electrode is close to the carrying surface of the electrostatic chuck ceramic disk 120 to achieve the application of electrical energy to the wafer carried on the carrying surface of the electrostatic chuck ceramic disk 120.

[0074] In addition, the RF positive terminal 213, the RF negative terminal 223, the DC positive terminal 214 and the DC negative terminal 224 are respectively arranged inside the electrostatic chuck base 110. Optionally, one end of each electrode terminal is closely attached to the joint surface of the electrostatic chuck base 110 and the electrostatic chuck ceramic disk 120, so that the RF positive terminal 213 can be connected to the RF positive electrode 211, the RF negative terminal 223 can be connected to the RF negative electrode 221, the DC positive terminal 214 can be connected to the DC positive electrode 212, and the DC negative terminal 224 can be connected to the DC negative electrode 222, so that electric energy can be transmitted to each corresponding electrode through each electrode terminal.

[0075] In order to install electrical components such as the current regulating component 300 on the base 100, the current regulating component 300 can be set inside the electrostatic chuck base 110, or the current regulating component 300 can be partially set inside the electrostatic chuck base 110 and the remaining part can be set at the bottom of the electrostatic chuck base 110.

[0076] In some embodiments, the first adjusting member 320, the second adjusting member 330, the first collecting element 340, the second collecting element 350, the first electrode protection element 410 and the second electrode protection element 420 are all arranged inside the electrostatic chuck base 110, so that the electrostatic chuck base 110 can protect each electrical component.

[0077] Of course, when the internal space of the electrostatic chuck base 110 is too small to accommodate the above-mentioned electrical components, a portion of the first adjustment member 320, the second adjustment member 330, the first collection element 340, the second collection element 350, the first electrode protection element 410 and the second electrode protection element 420 may be disposed inside the electrostatic chuck base 110, and the remaining portion may be disposed at the lower portion of the electrostatic chuck base 110.

[0078] Optionally, the first electrode protection element 410 and the second electrode protection element 420 can be set inside the electrostatic chuck base 110, the first adjustment member 320 and the second adjustment member 330 can be tightly attached to the lower surface of the electrostatic chuck base 110 to achieve fixation, and the first collection element 340 and the second collection element 350 can be set below the electrostatic chuck base 110.

[0079] Based on the above configuration, the current regulating component 300, the first electrode protection element 410 and the second electrode protection element 420 can be flexibly installed according to actual working conditions to meet working condition requirements.

[0080] In addition, in order to realize power supply, the positive module 210 and the negative module 220 are respectively connected to the power supply device. In some embodiments, the power supply device includes a radio frequency power supply 510, a matcher 520, a direct current power supply 530, a filter 540 and a direct current blocking capacitor 550. Among them, the radio frequency power supply 510 is connected to the matcher 520, the matcher 520 is connected to the direct current blocking capacitor 550, the direct current power supply 530 is connected to the filter 540, the filter 540 is respectively connected to the positive circuit 230 and the negative circuit 240, and the direct current blocking capacitor 550 is respectively connected to the positive circuit 230 and the negative circuit 240.

[0081] Based on this, the positive circuit 230 and the negative circuit 240 can be powered by the RF power supply 510, the matcher 520 and the DC blocking capacitor 550, and the positive circuit 230 and the negative circuit 240 can be powered by the DC power supply 530 and the filter 540. Setting the filter 540 can avoid the influence of radio frequency on the DC power supply 530; setting the DC blocking capacitor 550 can realize that the RF power supply 510 and the DC power supply 530 supply electric energy to the positive module 210 and the negative module 220 through the positive circuit 230 and the negative circuit 240 respectively.

[0082] It should be noted here that the principle of the RF power supply 510 and the DC power supply 530 respectively supplying power to the base 100 can be referred to the relevant technology and will not be elaborated here.

[0083] Based on the above-mentioned carrier device, the embodiment of the present application further discloses a semiconductor process equipment, the disclosed semiconductor process equipment includes a process chamber, and the process chamber is provided with the above-mentioned carrier device. Based on this, the semiconductor process equipment also has the technical effects of the above-mentioned carrier device, which will not be repeated here.

[0084] refer to Figures 1 to 7 Based on the above-mentioned load-bearing device, the embodiment of the present application further discloses a current balancing method, which is applied to the above-mentioned load-bearing device. The disclosed current balancing method includes:

[0085] Collecting a first current signal in the positive circuit 230 and a second current signal in the negative circuit 240;

[0086] At least one of the positive circuit 230 and the negative circuit 240 is adjusted according to the first current signal and the second current signal, so that the first current signal and the second current signal are in a preset ratio.

[0087] In some embodiments, the first current acquisition element 340 can be used to acquire the first current signal in the positive circuit 230, and the second current acquisition element 350 can be used to acquire the second current signal in the negative circuit 240, and the controller 310 adjusts at least one of the positive circuit 230 and the negative circuit 240 according to the first current signal and the second current signal, so that the current signals in the positive circuit 230 and the negative circuit 240 respectively meet actual requirements.

[0088] Optionally, at least one of the positive circuit 230 and the negative circuit 240 is adjusted according to the first current signal and the second current signal so that the first current signal and the second current signal are in a preset ratio, specifically including:

[0089] comparing the first current signal and the second current signal;

[0090] When the difference between the first current signal and the N times second current signal is not equal to zero, at least one of the first adjustment element 320 and the second adjustment element 330 is controlled to adjust so that the difference between the first current signal and the N times second current signal is equal to zero.

[0091] In some embodiments, the controller 310 may include an identification module 311, a comparison module 312, and a drive module 313. In this way, the first current signal and the second current signal collected can be received by the identification module 311 and transmitted to the comparison module 312. The first current signal and the second current signal are compared by the comparison module 312 to determine whether the first current signal and the second current signal are in a preset ratio. When the difference between the first current signal and the N-times second current signal is equal to zero, the drive module 313 will not send an adjustment instruction to the first adjustment member 320 and the second adjustment member 330, so that the positive circuit 230 and the negative circuit 240 will not be adjusted. When the difference between the first current signal and the N-times second current signal is not equal to zero, the drive module 313 sends an adjustment instruction to the first adjustment member 320 and the second adjustment member 330 according to the comparison result, so as to adjust at least one of the positive circuit 230 and the negative circuit 240. Of course, the specific principle can refer to the corresponding content in the above-mentioned carrier device, which will not be repeated here.

[0092] Optionally, when the difference between the first current signal and the N-times second current signal is not equal to zero, controlling at least one of the first adjustment member 320 and the second adjustment member 330 to adjust so that the difference between the first current signal and the N-times second current signal is equal to zero, specifically includes:

[0093] When the difference between the first current signal and the N-times second current signal is not equal to zero, adjusting the inductance of the first adjusting member 320 or the second adjusting member 330 according to the first adjustment method;

[0094] When the difference between the first current signal and the N-times second current signal decreases, continue adjusting according to the first adjustment method until the difference between the first current signal and the N-times second current signal is equal to zero;

[0095] When the difference between the first current signal and the N-times second current signal increases, the adjustment is performed in a manner opposite to the first adjustment manner until the difference between the first current signal and the N-times second current signal is equal to zero;

[0096] The first adjustment method is to increase or decrease the inductance of the first adjustment member 320 or the second adjustment member 330 .

[0097] In some embodiments, the first adjustment member 320 and the second adjustment member 330 both include adjustable inductors. In this way, the inductance of at least one of the first adjustment member 320 and the second adjustment member 330 can be adjusted according to the comparison result to change the current signal in at least one of the positive circuit 230 and the negative circuit 240, so that the difference between the first current value and the N times second current value is equal to zero to meet the actual requirements. Of course, the specific principle can refer to the corresponding content in the above-mentioned load-bearing device, which will not be repeated here.

[0098] Optionally, when the difference between the first current signal and the N-times second current signal is not equal to zero, controlling at least one of the first adjustment member 320 and the second adjustment member 330 to adjust so that the difference between the first current signal and the N-times second current signal is equal to zero, specifically includes:

[0099] When the difference between the first current signal and the N times second current signal is not equal to zero, and when it is determined that the difference between the first current signal and the N times second current signal is greater than zero, the capacitance value of the adjustable capacitor in the first adjustment member 320 or the second adjustment member 330 is adjusted by a second adjustment method;

[0100] If the difference between the first current signal and the N times second current signal decreases, the second adjustment method is continued to be used; otherwise, the method opposite to the second adjustment method is used to adjust until the difference between the first current signal and the N times second current signal is equal to zero.

[0101] In some embodiments, the first adjustment member 320 and the second adjustment member 330 each include an inductor and an adjustable capacitor arranged in parallel. In this way, the capacitance of the adjustable capacitor of at least one of the first adjustment member 320 and the second adjustment member 330 can be adjusted according to the comparison result to change the current signal in at least one of the positive circuit 230 and the negative circuit 240, so that the difference between the first current value and the N times second current value is equal to zero to meet the actual requirements. Of course, the specific principle can refer to the corresponding content in the above-mentioned carrier device, which will not be repeated here.

[0102] To sum up, the embodiments of the present application can make the RF impedance in the positive circuit 230 and the negative circuit 240 within a controllable range, thereby reducing the difference in energy generated by the RF power fed into the electrode, and further making the bias voltage generated on the wafer surface controllable, less likely to cause eccentricity, and further ensuring the uniformity of deposition or etching.

[0103] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A carrier device, used in semiconductor process equipment, characterized in that: The carrying device comprises: A base (100) for carrying a wafer, the base (100) being provided with a positive electrode module (210) and a negative electrode module (220), the positive electrode module (210) being connected to a positive electrode circuit (230), and the negative electrode module (220) being connected to a negative electrode circuit (240); A current regulating component (300), the current regulating component (300) being connected to the positive circuit (230) and the negative circuit (240) respectively; The current regulating component (300) is used to collect a first current signal in the positive circuit (230) and a second current signal in the negative circuit (240), and to regulate at least one of the positive circuit (230) and the negative circuit (240) when the difference between the first current signal and N times the second current signal is not equal to zero, so that the difference between the first current signal and N times the second current signal is equal to zero.

2. The carrying device according to claim 1, characterized in that: The current regulating component (300) comprises a controller (310) and a first regulating member (320), a second regulating member (330), a first collecting element (340) and a second collecting element (350) respectively connected to the controller (310); The first adjusting member (320) and the first collecting element (340) are connected in series to the positive circuit (230), and the second adjusting member (330) and the second collecting element (350) are connected in series to the negative circuit (240); The controller (310) is used to control at least one of the first adjustment element (320) and the second adjustment element (330) to adjust the difference between the first current signal collected by the first collection element (340) and the second current signal collected by the second collection element (350) N times as much as the first current signal, so as to make the difference between the first current signal and the second current signal N times as much as the first current signal equal to zero, when the difference between the first current signal collected by the first collection element (340) and the second current signal collected by the second collection element (350) N times as much as the first current signal is not equal to zero.

3. The carrying device according to claim 2, characterized in that: The controller (310) comprises an identification module (311), a comparison module (312) and a driving module (313); The identification module (311) is connected to the first acquisition element (340) and the second acquisition element (350) respectively, and is used to receive the first current signal and the second current signal, and send the first current signal and the second current signal to the comparison module (312); The comparison module (312) is used to compare the first current signal and the second current signal, and send the comparison result to the driving module (313); The driving module (313) is used to control at least one of the first adjusting member (320) and the second adjusting member (330) to adjust when the difference between the first current signal and the second current signal (N times) is not equal to zero, so as to make the difference between the first current signal and the second current signal (N times) equal to zero.

4. The carrying device according to claim 3, characterized in that: The first adjusting member (320) and the second adjusting member (330) both include adjustable inductors.

5. The carrying device according to claim 3, characterized in that: The first adjusting member (320) and the second adjusting member (330) both include an inductor and an adjustable capacitor which are arranged in parallel.

6. The carrying device according to claim 1, characterized in that: Also includes: A first electrode protection element (410) and / or a second electrode protection element (420); The positive electrode module (210) comprises a radio frequency positive electrode (211) and a direct current positive electrode (212), the radio frequency positive electrode (211) is connected to a first branch, the direct current positive electrode (212) is connected to a second branch, the first branch and the second branch are connected in parallel and are respectively connected to the positive electrode circuit (230), and the first electrode protection element (410) is connected in series to the second branch; The negative electrode module (220) comprises a radio frequency negative electrode (221) and a direct current negative electrode (222); the radio frequency negative electrode (221) is connected to a third branch; the direct current negative electrode (222) is connected to a fourth branch; the third branch and the fourth branch are connected in parallel and are respectively connected to the negative electrode circuit (240); and the second electrode protection element (420) is connected in series to the fourth branch.

7. The carrying device according to claim 6, characterized in that: The first electrode protection element (410) and the second electrode protection element (420) both include an inductor and a capacitor connected in parallel.

8. The carrying device according to claim 1, characterized in that: The base (100) is an electrostatic chuck, and the electrostatic chuck comprises an electrostatic chuck base (110) and an electrostatic chuck ceramic disc (120) arranged on the electrostatic chuck base (110); The current regulating component (300) is disposed inside the electrostatic chuck base (110); or, part of the current regulating component (300) is disposed inside the electrostatic chuck base (110), and the remaining part is disposed at the bottom of the electrostatic chuck base (110).

9. A semiconductor process equipment, comprising a process chamber, characterized in that: The process chamber is provided with the carrying device described in any one of claims 1 to 8.

10. A current balancing method, applied to the load-bearing device according to any one of claims 1 to 8, characterized in that: The current balancing method comprises: Collecting a first current signal in the positive circuit and a second current signal in the negative circuit; When the difference between the first current signal and N times the second current signal is not equal to zero, at least one of the positive circuit and the negative circuit is adjusted to make the difference between the first current signal and N times the second current signal equal to zero.

11. The current balancing method according to claim 10, characterized in that: In the case where the difference between the first current signal and the N-times second current signal is not equal to zero, at least one of the positive circuit and the negative circuit is adjusted so that the difference between the first current signal and the N-times second current signal is equal to zero, specifically comprising: When the difference between the first current signal and the N times the second current signal is not equal to zero, at least one of the first adjustment element and the second adjustment element is controlled to adjust so that the difference between the first current signal and the N times the second current signal is equal to zero.

12. The current balancing method according to claim 11, characterized in that: When the difference between the first current signal and the N-times second current signal is not equal to zero, controlling at least one of the first adjustment element and the second adjustment element to adjust so that the difference between the first current signal and the N-times second current signal is equal to zero, specifically includes: When the difference between the first current signal and the N-times second current signal is not equal to zero, adjusting the inductance of the first adjusting member or the second adjusting member according to a first adjustment method; When the difference between the first current signal and the N-times second current signal decreases, continue adjusting according to the first adjustment method until the difference between the first current signal and the N-times second current signal is equal to zero; When the difference between the first current signal and the N-times second current signal increases, adjusting in a manner opposite to the first adjustment manner until the difference between the first current signal and the N-times second current signal is equal to zero; The first adjustment method is to increase or decrease the inductance of the first adjustment member or the second adjustment member.

13. The current balancing method according to claim 11, characterized in that: When the difference between the first current signal and the N-times second current signal is not equal to zero, controlling at least one of the first adjustment element and the second adjustment element to adjust so that the difference between the first current signal and the N-times second current signal is equal to zero, specifically includes: When the difference between the first current signal and the N-times second current signal is not equal to zero, and when it is determined that the difference between the first current signal and the N-times second current signal is greater than zero, a second adjustment method is used to adjust the capacitance value of the adjustable capacitor in the first adjustment member or the second adjustment member; If the difference decreases, continue to use the second adjustment method, otherwise use the method opposite to the second adjustment method until the difference between the first current signal and N times the second current signal is equal to zero; The second adjustment method is to increase or decrease the capacitance value of the adjustable capacitor.

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