Water-cooled heat dissipation device

Abstract

A water-cooling heat dissipation device includes a housing and a liquid driving group. The housing has a heat contact surface, a water inlet chamber, a heat exchange chamber, an impeller accommodating space, a water inlet passage and a water outlet passage. The water inlet chamber is communicated with the heat exchange chamber through the impeller accommodating space. The water inlet passage and the water outlet passage are respectively communicated with the water inlet chamber and the heat exchange chamber. The heat exchange chamber is closer to the heat contact surface than the water inlet chamber. The impeller accommodating space is located between the water inlet chamber and the heat exchange chamber. The liquid driving group includes an impeller. The impeller is located in the impeller accommodating space and can rotate relative to the housing. Among them, the impeller includes a plurality of blades. Each blade has a first side edge away from the heat contact surface. The water inlet passage and the water outlet passage are between the first side edge and the heat contact surface.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device, particularly a water-cooled heat dissipation device. Background Art

[0002] As the computing efficiency of electronic devices is increasingly enhanced, a large amount of heat is generated when the electronic components disposed therein operate. In order to prevent the operating temperature of the electronic components from exceeding the tolerable temperature upper limit, heat dissipation fins are generally provided on the electronic components to take away the heat energy generated by the electronic components through the heat dissipation fins. However, since the heat dissipation efficiency of the heat dissipation fins per unit time is limited, some manufacturers have now changed the heat dissipation fins to a water-cooling system with better heat dissipation effect to enhance the heat dissipation efficiency of the electronic components. The water-cooling system generally includes a water block and a radiator. The water block is provided with a pump. The water block is communicated with the radiator and together forms a cooling cycle, and the working fluid in the cooling cycle is driven to flow through the water block. The water block is installed on a heat source such as a processor, and the absorbed heat is transferred to the radiator through the fluid for heat dissipation.

[0003] Since the current demand for electronic devices is thin, light, short, and small, if the volume of the pump is reduced to meet this demand, the performance of the water block (such as the head) will be sacrificed. On the contrary, if the performance of the water block is considered, it will go against the current trend of being thin, light, short, and small. Therefore, how to balance the heat dissipation efficiency of the water block and the thinness and lightness of the volume is one of the problems that researchers should solve. Summary of the Invention

[0004] The present invention aims to provide a water-cooled heat dissipation device to balance the heat dissipation efficiency of the pump and the thinness and lightness of the volume.

[0005] The water-cooled heat dissipation device disclosed in an embodiment of the present invention includes a housing and a liquid driving group. The housing has a heat contact surface, a water inlet chamber, a heat exchange chamber, an impeller accommodating space, a water inlet passage, and a water outlet passage. The water inlet chamber is communicated with the heat exchange chamber through the impeller accommodating space. The water inlet passage and the water outlet passage are respectively communicated with the water inlet chamber and the heat exchange chamber. The heat exchange chamber is closer to the heat contact surface than the water inlet chamber. The impeller accommodating space is located between the water inlet chamber and the heat exchange chamber. The liquid driving group includes an impeller. The impeller is located in the impeller accommodating space and can rotate relative to the housing. Wherein, the impeller includes a plurality of blades. Each blade has a first side edge away from the heat contact surface. The water inlet passage and the water outlet passage are between the first side edge and the heat contact surface.

[0006] In an embodiment of the present invention, each blade has a second side edge close to the heat contact surface, and the water inlet passage and the water outlet passage are both between the second side edge and the heat contact surface.

[0007] In an embodiment of the present invention, the impeller further includes a base having a setting surface facing away from the heat contact surface, and the second side edges of the plurality of blades are connected to the setting surface of the base.

[0008] In an embodiment of the present invention, the housing further has a first straight flow channel and a second straight flow channel. The extending directions of the first straight flow channel and the second straight flow channel are parallel to the normal direction of the heat contact surface. The water inlet channel communicates with the water inlet chamber through the first straight flow channel, and the impeller accommodating space communicates with the heat exchange chamber through the second straight flow channel.

[0009] In an embodiment of the present invention, the first straight flow channel and the second straight flow channel are respectively located on opposite sides of the impeller.

[0010] In an embodiment of the present invention, opposite ends of the first straight flow channel respectively have a water inlet end and a water outlet end. The water inlet end of the first straight flow channel is connected to the water inlet channel and is closer to the heat contact surface than the impeller accommodating space, and the water outlet end of the first straight flow channel is connected to the water inlet chamber.

[0011] In an embodiment of the present invention, the housing further has a connecting flow channel including a slanting section and a transverse section connected to each other. The slanting section of the connecting flow channel is connected to the water inlet channel, and the transverse section is connected to the first straight flow channel. The transverse section is closer to the heat contact surface than the water inlet channel.

[0012] In an embodiment of the present invention, the housing further has a liquid-tight space located between the impeller accommodating space and the heat exchange chamber and not communicating with the water inlet channel. The liquid driving group further includes a power group located in the liquid-tight space and used to drive the impeller to rotate relative to the housing.

[0013] In an embodiment of the present invention, the housing includes a base, a heat conducting plate, a flow guiding frame, an impeller cover and a cover. The water inlet channel and the water outlet channel are located on the base. The heat contact surface is on one side of the heat conducting plate, and the side of the heat conducting plate away from the heat contact surface and the flow guiding frame are respectively stacked on opposite sides of the base. The heat conducting plate and the base jointly enclose the heat exchange chamber. The base and the flow guiding frame jointly enclose the liquid-tight space. The impeller cover is installed on the base and jointly encloses the impeller accommodating space with the flow guiding frame. The cover is installed on the flow guiding frame and jointly encloses the water inlet chamber with the impeller cover.

[0014] In an embodiment of the present invention, the water-cooling heat dissipation device further includes a baffle pad, which is blocked between the oblique section of the connection flow channel and the heat exchange chamber, so that the connection flow channel is not directly communicated with the heat exchange chamber, and the baffle pad is not blocked between the water outlet channel and the heat exchange chamber, so that the water outlet channel is communicated with the heat exchange chamber.

[0015] In an embodiment of the present invention, the heat conduction plate has a plurality of heat dissipation fins, and the plurality of heat dissipation fins are located in the heat exchange chamber.

[0016] In an embodiment of the present invention, the cover is a transparent cover, the impeller cover is a transparent impeller cover, the cover has an outer surface, the outer surface faces away from the heat contact surface, and the impeller is exposed outside through the outer surface.

[0017] In an embodiment of the present invention, the water-cooling heat dissipation device further includes a mask, the mask has an opening, the mask is installed on the base, covers a part of the outer surface of the cover, and a part of the outer surface of the cover is exposed outside through the opening.

[0018] In an embodiment of the present invention, the water-cooling heat dissipation device further includes a lighting component, the lighting component includes a circuit board and at least one lighting element, the circuit board is installed on the mask and is located on the side of the cover away from the heat contact surface, and the at least one lighting element is arranged on the side of the circuit board close to the cover.

[0019] In an embodiment of the present invention, the water-cooling heat dissipation device further includes a water inlet joint and a water outlet joint, the water inlet joint and the water outlet joint are respectively installed on the water inlet channel and the water outlet channel, each blade has a second side edge close to the heat contact surface, and the water inlet joint and the water outlet joint are both between the second side edge and the heat contact surface.

[0020] In an embodiment of the present invention, the water inlet joint and the water outlet joint are equidistant from the heat contact surface.

[0021] According to the water-cooling heat dissipation device of the above embodiment, through the position design of the water inlet channel and the water outlet channel, as well as the position design of the water inlet chamber, the heat exchange chamber and the impeller accommodation space, the thickness of the water-cooling heat dissipation device can be thinned, so that the water-cooling heat dissipation device can be applied to products with a thinness requirement, such as a graphics card, etc.

[0022] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and provide a further explanation of the claims of the present invention. Description of the Drawings

[0023] Figure 1 It is a three-dimensional schematic diagram of the water-cooling heat dissipation device according to the first embodiment of the present invention;

[0024] Figure 2 is the top view schematic diagram of Figure 1 ;

[0025] Figure 3 is the sectional schematic diagram drawn along the 3-3 cutting plane line of Figure 2 ;

[0026] Figure 4 is the sectional schematic diagram drawn along the 4-4 cutting plane line of Figure 3 ;

[0027] Figure 5 is the sectional schematic diagram drawn along the 5-5 cutting plane line of Figure 2 ;

[0028] Figure 6 is the sectional schematic diagram drawn along the 6-6 cutting plane line of Figure 2 ;

[0029] Figure 7 is the exploded schematic diagram of Figure 1 ;

[0030]

Symbol Explanation

[0031] 10... Water-cooled heat dissipation device

[0032] 100... Housing

[0033] 110... Base

[0034] 120... Heat conduction plate

[0035] 130... Flow guide frame

[0036] 140... Impeller cover

[0037] 141... Top plate

[0038] 1411... Opening

[0039] 142... Annular side plate

[0040] 150... Cover

[0041] 151... Outer surface

[0042] 160... Baffle pad

[0043] 161... Groove

[0044] 200... Liquid drive group

[0045] 210... Impeller

[0046] 211... Base

[0047] 2111...Setting surface

[0048] 212...Blade

[0049] 2121...First side edge

[0050] 2122...Second side edge

[0051] 220...Power unit

[0052] 300...Water inlet joint

[0053] 400...Water outlet joint

[0054] 500...Mask

[0055] 510...Opening

[0056] 600...Light-emitting component

[0057] 610...Circuit board

[0058] 620...Light-emitting element

[0059] C1...Water inlet channel

[0060] C2...Water outlet channel

[0061] C3...Connecting flow channel

[0062] C31...Oblique section

[0063] C32...Horizontal section

[0064] D...Direction

[0065] F...Thermal contact surface

[0066] H1, H2...First perforation

[0067] H3, H4...Second perforation

[0068] N...Normal direction

[0069] S1...Water inlet chamber

[0070] S2...Heat exchange chamber

[0071] S3...Impeller accommodation space

[0072] S4...Liquid-tight space

[0073] V1...First straight flow channel

[0074] V2...Second straight flow channel Detailed implementation manners

[0075] Please refer to Figures 1 to 6 . Figure 1 It is a three-dimensional schematic diagram of the water-cooled heat dissipation device according to the first embodiment of the present invention. Figure 2 It is Figure 1 top view schematic diagram of. Figure 3 It is along Figure 2 Schematic cross-sectional view shown along the 3-3 cutting plane line of. Figure 4 It is along Figure 3 Schematic cross-sectional view shown along the 4-4 cutting plane line of. Figure 5 It is along Figure 2 Schematic cross-sectional view shown along the 5-5 cutting plane line of. Figure 6 It is along Figure 2 Schematic cross-sectional view shown along the 6-6 cutting plane line of.

[0076] The water-cooled heat dissipation device 10 of this embodiment is, for example, a water block in a water-cooled heat dissipation system, and is connected to a water radiator (not shown) to jointly form a cooling cycle with the water radiator. The water-cooled heat dissipation device 10 is used to thermally couple or thermally contact with a heat source (not shown) of an electronic product (not shown), absorb the heat generated by the heat source, and transfer the heat generated by the heat source to the water radiator through a working fluid. The electronic product is, for example, a motherboard or a graphics card. The water-cooled heat dissipation device 10 includes a housing 100 and a liquid driving group 200.

[0077] The housing 100 has a heat contact surface F, a water inlet chamber S1, a heat exchange chamber S2, an impeller accommodation space S3, a water inlet channel C1, and a water outlet channel C2. The heat contact surface F is used to thermally couple or thermally contact with the heat source of the electronic product. The water inlet chamber S1 communicates with the heat exchange chamber S2 through the impeller accommodation space S3. The water inlet channel C1 and the water outlet channel C2 are respectively connected to the water inlet chamber S1 and the heat exchange chamber S2. The heat exchange chamber S2 is closer to the heat contact surface F than the water inlet chamber S1. The impeller accommodation space S3 is located between the water inlet chamber S1 and the heat exchange chamber S2.

[0078] In this embodiment, the housing 100 also has a connecting flow channel C3, a first straight flow channel V1, and a second straight flow channel V2. The connecting flow channel C3 includes an inclined section C31 and a horizontal section C32. The extending direction of the inclined section C31 of the connecting flow channel C3 forms an acute angle with the normal direction N of the heat contact surface F, and one end is connected to the water inlet channel C1. The extending direction of the horizontal section C32 forms a right angle with the normal direction N of the heat contact surface F, and one end is connected to the inclined section C31 of the connecting flow channel C3. In addition, the horizontal section C32 is closer to the heat contact surface F than the water inlet channel C1.

[0079] The extending directions of the first straight flow channel V1 and the second straight flow channel V2 are parallel to the normal direction N of the heat contact surface F. The water inlet channel C1 communicates with the first straight flow channel V1 through the connecting flow channel C3 to enter the water inlet chamber S1. The second straight flow channel V2 communicates the impeller accommodating space S3 with the heat exchange chamber S2. Specifically, the opposite ends of the first straight flow channel V1 respectively have a water inlet end V11 and a water outlet end V12. The water inlet end V11 of the first straight flow channel V1 is connected to the water inlet channel C1 and is closer to the heat contact surface F than the impeller accommodating space S3. The water outlet end V12 of the first straight flow channel V1 is connected to the water inlet chamber S1.

[0080] The water inlet chamber S1, the heat exchange chamber S2, the impeller accommodating space S3, the water inlet channel C1, the water outlet channel C2, the connecting flow channel C3, the first straight flow channel V1 and the second straight flow channel V2 of the housing 100 are used to accommodate the working fluid (not shown).

[0081] In addition, the housing 100 further has a liquid-tight space S4. The liquid-tight space S4 is located between the impeller accommodating space S3 and the heat exchange chamber S2 and is not connected to the water inlet channel C1. That is to say, the liquid-tight space S4 is not connected to the water inlet chamber S1, the heat exchange chamber S2, the impeller accommodating space S3, the water inlet channel C1, the water outlet channel C2, the connecting flow channel C3, the first straight flow channel V1 and the second straight flow channel V2.

[0082] The liquid driving group 200 includes an impeller 210 and a power group 220. The impeller 210 is located in the impeller accommodating space S3 and can rotate relative to the housing 100. The impeller 210 includes a base 211 and a plurality of blades 212. The base 211 has a setting surface 2111. The setting surface 2111 faces away from the heat contact surface F. Each blade 212 has a first side edge 2121 away from the heat contact surface F and a second side edge 2122 close to the heat contact surface F. These second side edges 2122 of these blades 212 are connected to the setting surface 2111 of the base 211. The water inlet channel C1 and the water outlet channel C2 are both between the second side edge 2122 and the heat contact surface F.

[0083] However, in this embodiment, the water inlet channel C1 and the water outlet channel C2 are between the second side edge 2122 and the heat contact surface F, but it is not limited thereto. In other embodiments, the water inlet channel and the water outlet channel can also be changed to be between the first side edge and the heat contact surface.

[0084] The power unit 220 is located in the liquid-tight space S4 to prevent the electronic components of the power unit 220 from being damaged by liquid. The power unit 220 is used to drive the impeller 210 to rotate relative to the housing 100. For example, the power unit 220 is the stator unit of a motor and includes a yoke and a coil. A magnet matching the power unit 220 is installed on the impeller 210. The power unit 220 cooperates with the magnet installed on the impeller 210 to drive the impeller 210 to rotate relative to the housing 100.

[0085] In this embodiment, the first straight flow channel V1 and the second straight flow channel V2 are respectively located on opposite sides of the impeller 210, but this is not limiting. In other embodiments, the first straight flow channel and the second straight flow channel may also be located at different positions of the impeller.

[0086] In this embodiment, the water-cooling heat dissipation device 10 may further include a water inlet joint 300 and a water outlet joint 400. The water inlet joint 300 and the water outlet joint 400 are respectively installed in the water inlet channel C1 and the water outlet channel C2, and are used to facilitate connection to a water-cooling radiator through a pipe body. Each blade 212 has a second side edge 2122 close to the heat contact surface F, and both the water inlet joint 300 and the water outlet joint 400 are located between the second side edge 2122 and the heat contact surface F.

[0087] In this embodiment, the water inlet joint 300 and the water outlet joint 400 are equidistant from the heat contact surface F, but this is not limiting. In other embodiments, the water inlet joint and the water outlet joint may also be at different distances from the heat contact surface F.

[0088] When the impeller 210 rotates relative to the housing 100, the impeller 210 guides the working fluid to flow in from the water inlet channel C1 and sequentially flow through the connecting flow channel C3, the first straight flow channel V1, the water inlet chamber S1, the impeller accommodation space S3, the second straight flow channel V2, and the heat exchange chamber S2 in the direction D, and then flow out from the water outlet channel C2.

[0089] Please refer to Figure 7 。 Figure 7 For Figure 1 is an exploded schematic view. The housing 100 includes, for example, a base 110, a heat conducting plate 120, a flow guiding frame 130, an impeller cover 140, and a cover 150. The water inlet channel C1 and the water outlet channel C2 are located in the base 110. The heat contact surface F is located on one side of the heat conducting plate 120, and the side of the heat conducting plate 120 away from the heat contact surface F and the flow guiding frame 130 are respectively stacked on opposite sides of the base 110, and the heat conducting plate 120 and the base 110 jointly enclose the heat exchange chamber S2. The base 110 and the flow guiding frame 130 jointly enclose the liquid-tight space S4. The impeller cover 140 is installed on the base 110 and jointly encloses the impeller accommodation space S3 with the flow guiding frame 130. The cover 150 is installed on the flow guiding frame 130 and jointly encloses the water inlet chamber S1 with the impeller cover 140.

[0090] In addition, the base 110 may further have a first through hole H1. The flow guide frame 130 may further have a second through hole H3. The first through hole H1 communicates with the second through hole H3 and together forms a section connecting the first straight flow channel V1 and the connection channel C3. The impeller cover 140 includes a top plate 141 and an annular side plate 142. The top plate 141 has a plurality of openings 1411. The annular side plate 142 is connected around the top plate 141, and the space between the annular side plate 142 and the cover 150 forms another section connecting the first straight flow channel V1 and the inlet chamber S1. That is, the working fluid located in the connection channel C3 can flow through the first through hole H1, the second through hole H3, and the space between the annular side plate 142 and the cover 150 to the water inlet chamber S1. In addition, the space between the top plate 141 and the cover 150 forms the water inlet chamber S1 and communicates with the space between the annular side plate 142 and the cover 150. The water inlet chamber S1 communicates with the impeller accommodation space S3 through these openings 1411.

[0091] The base 110 may further have another first through hole H2, and the flow guide frame 130 may further have another second through hole H4. The first through hole H2 communicates with the second through hole H4 and together forms a section connecting the second straight flow channel V2 and the heat exchange chamber S2. The space between the annular side plate 142 and the base 211 of the impeller 210 forms another section connecting the second straight flow channel V2 and the impeller accommodation space S3. That is, the working fluid located in the impeller accommodation space S3 can flow through the first through hole H2, the second through hole H4, and the space between the annular side plate 142 and the base 211 of the impeller 210 to the heat exchange chamber S2.

[0092] In this embodiment, the heat conducting plate 120 has a plurality of heat dissipation fins 121, and these heat dissipation fins 121 are located in the heat exchange chamber S2 to improve the heat dissipation efficiency of the water cooling heat dissipation device 10.

[0093] In this embodiment, the water cooling heat dissipation device 10 may further include a flow blocking pad 160. The flow blocking pad 160 stops between the inclined section C31 of the connection channel C3 and the heat exchange chamber S2, so that the connection channel C3 is not directly communicated with the heat exchange chamber S2. The flow blocking pad 160 does not stop between the water outlet channel C2 and the heat exchange chamber S2, so that the water outlet channel C2 is communicated with the heat exchange chamber S2. In addition, the flow blocking pad 160 has a slot 161, and the flow blocking pad 160 is stacked on these heat dissipation fins 121 to allow the working fluid to flow evenly through these heat dissipation fins. However, in other embodiments, it may not be through the flow blocking pad to block the connection channel C3 and the heat exchange chamber S2, but instead through the base to directly block the connection channel C3 and the heat exchange chamber S2.

[0094] In this embodiment, the cover 150 and the impeller housing 140 are made of a transparent material, for example. The cover 150 has an outer surface 151. The outer surface 151 faces away from the heat contact surface F. The impeller 210 is exposed to the outside through the outer surface 151. However, in other embodiments, the cover and the impeller housing may also be made of a non-transparent material.

[0095] In this embodiment, the water-cooled heat dissipation device 10 may further include a mask 500 which has an opening 510. The mask 500 is installed on the base 110, covers a part of the outer surface 151 of the cover 150, and a part of the outer surface 151 of the cover 150 is exposed to the outside through the opening 510.

[0096] In this embodiment, the water-cooled heat dissipation device 10 further includes a lighting assembly 600 which includes a circuit board 610 and a plurality of lighting elements 620. The circuit board 610 is installed on the mask 500 and is located on the side of the cover 150 away from the heat contact surface F. At least one lighting element 620 is disposed on the side of the circuit board 610 close to the cover 150 to add variability to the visual effect of the water-cooled heat dissipation device 10.

[0097] According to the water-cooled heat dissipation device of the above embodiment, through the position design of the water inlet channel and the water outlet channel, as well as the position design of the water inlet chamber, the heat exchange chamber and the impeller accommodation space, the thickness of the water-cooled heat dissipation device can be thinned, so that the water-cooled heat dissipation device can be applied to products with a thinness requirement, such as a graphics card, etc.

[0098] In addition, by additionally connecting the water inlet channel and the water inlet chamber through the first straight flow channel, and connecting the impeller accommodation space and the heat exchange chamber through the second straight flow channel, the water-cooled heat dissipation device takes into account both the heat dissipation efficiency and the thinness and lightness of the volume.

[0099] Although the present invention is disclosed as above in the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the relevant art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope defined by the claims attached to this specification.

Claims

1. A water-cooled heat dissipation device, characterized in that, Comprising: A housing having a heat contact surface, a water inlet chamber, a heat exchange chamber, an impeller accommodation space, a water inlet passage and a water outlet passage. The water inlet chamber communicates with the heat exchange chamber through the impeller accommodation space. The water inlet passage and the water outlet passage are respectively connected to the water inlet chamber and the heat exchange chamber. The heat exchange chamber is closer to the heat contact surface than the water inlet chamber. The impeller accommodation space is located between the water inlet chamber and the heat exchange chamber; and A liquid driving group including an impeller located in the impeller accommodation space and capable of rotating relative to the housing; Wherein, the impeller includes a plurality of blades, and each blade has a first side edge away from the heat contact surface, and the water inlet passage and the water outlet passage are between the first side edge and the heat contact surface; The housing further has a first straight flow channel and a second straight flow channel. The extending directions of the first straight flow channel and the second straight flow channel are parallel to the normal direction of the heat contact surface. The water inlet passage communicates with the water inlet chamber through the first straight flow channel. The impeller accommodation space communicates with the heat exchange chamber through the second straight flow channel. The opposite ends of the first straight flow channel respectively have a water inlet end and a water outlet end. The water inlet end of the first straight flow channel is connected to the water inlet passage and is closer to the heat contact surface than the impeller accommodation space. The water outlet end of the first straight flow channel is connected to the water inlet chamber. The housing further has a connecting flow channel including an inclined section and a transverse section connected to each other. The inclined section of the connecting flow channel is connected to the water inlet passage. The extending direction of the transverse section forms a right angle with the normal direction of the heat contact surface. The transverse section is connected to the first straight flow channel, and the transverse section is closer to the heat contact surface than the water inlet passage.

2. The water-cooled heat dissipation device according to claim 1, wherein Each blade has a second side edge close to the heat contact surface, and the water inlet passage and the water outlet passage are both between the second side edge and the heat contact surface.

3. The water-cooled heat dissipation device according to claim 2, characterized in that 4. The water-cooled heat dissipation device according to claim 1, wherein The impeller further includes a base having a setting surface facing away from the heat contact surface, and the second side edges of the plurality of blades are connected to the setting surface of the base.

5. The water-cooled heat dissipation device according to claim 1, wherein The first straight flow channel and the second straight flow channel are respectively located on opposite sides of the impeller.

6. The water-cooled heat dissipation device according to claim 5, characterized in that, The housing further has a liquid-tight space located between the impeller accommodation space and the heat exchange chamber and not communicating with the water inlet passage. The liquid driving group further includes a power group located in the liquid-tight space and used to drive the impeller to rotate relative to the housing. The housing includes a base, a heat conducting plate, a flow guiding frame, an impeller cover and a cover. The water inlet passage and the water outlet passage are located on the base. The heat contact surface is on one side of the heat conducting plate. The side of the heat conducting plate away from the heat contact surface and the flow guiding frame are respectively stacked on opposite sides of the base. The heat conducting plate and the base jointly enclose the heat exchange chamber. The base and the flow guiding frame jointly enclose the liquid-tight space. The impeller cover is installed on the base and jointly encloses the impeller accommodation space with the flow guiding frame. The cover is installed on the flow guiding frame and jointly encloses the water inlet chamber with the impeller cover.

7. The water-cooled heat dissipation device according to claim 6, wherein, It further includes a baffle pad which is stopped between the inclined section of the connecting flow channel and the heat exchange chamber, so that the connecting flow channel is not directly communicated with the heat exchange chamber, and the baffle pad is not stopped between the water outlet channel and the heat exchange chamber, so that the water outlet channel is communicated with the heat exchange chamber.

8. The water-cooled heat dissipation device according to claim 6, characterized in that The heat conducting plate has a plurality of heat dissipating fins, and the plurality of heat dissipating fins are located in the heat exchange chamber.

9. The water-cooled heat dissipation device according to claim 6, characterized in that, The cover is a transparent cover, the impeller cover is a transparent impeller cover, the cover has an outer surface which faces away from the heat contact surface, and the impeller is exposed outside through the outer surface.

10. The water-cooled heat dissipation device according to claim 9, characterized in that, It further includes a mask which has an opening, the mask is installed on the base, covers a part of the outer surface of the cover, and a part of the outer surface of the cover is exposed outside through the opening.

11. The water-cooled heat dissipation device according to claim 10, wherein It further includes a lighting assembly which includes a circuit board and at least one lighting element, the circuit board is installed on the mask and is located on the side of the cover away from the heat contact surface, and the at least one lighting element is arranged on the side of the circuit board close to the cover.

12. The water-cooled heat dissipation device according to claim 1, wherein It further includes a water inlet joint and a water outlet joint, the water inlet joint and the water outlet joint are respectively installed on the water inlet channel and the water outlet channel, each blade has a second side edge close to the heat contact surface, and the water inlet joint and the water outlet joint are both between the second side edge and the heat contact surface.

13. The water-cooled heat dissipation device according to claim 12, characterized in that, The water inlet joint and the water outlet joint are equidistant from the heat contact surface.

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