Supporting glass substrate
Patent Information
- Application Number
- CN202080054588.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2019-07-29
- Filing Date
- 2020-06-05
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2040-06-05
AI Technical Summary
It is difficult to strike a balance between suppressing deflection and reducing weight in existing supporting glass substrates. When the thickness is thickened to suppress deflection, the mass increases, and when it is thinned to reduce weight, deflection easily occurs.
By increasing the ratio of Young's modulus to density (ε/d) of the supporting glass substrate to 32.0 (above GPa·cm3/g), combined with the filling parameters, dissociation energy and molar ratio of the metal oxide, the glass substrate is optimized. Composed to achieve high rigidity and lightweight.
It achieves both suppression of deflection and lightweight, ensuring a balance between high rigidity and low density of the supporting glass substrate, and is suitable for the manufacture of high-density mounting semiconductor devices.
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Figure CN114206793B8_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a support for a glass substrate. Background Technology
[0002] With the miniaturization of electronic devices, the demand for technologies that can densely mount semiconductor devices used in these devices has increased. In recent years, technologies for densely mounting semiconductor devices, such as Fan-Out Wafer Level Package (FOWLP) and Fan-Out Panel Level Package (FOPLP), have been proposed. Hereinafter, FOWLP and FOPLP will be collectively referred to as FOWLP, etc.
[0003] In FOWLP and other similar applications, in order to suppress the deflection of the processing substrate of the stacked semiconductor device, a supporting glass substrate for supporting the processing substrate is sometimes used (for example, see Patent Document 1).
[0004] Existing technical documents
[0005] Patent documents
[0006] Patent Document 1: Japanese Patent No. 6443668 Summary of the Invention
[0007] For support glass substrates used in support components, such as those for FOWLP, it is necessary to suppress deflection and also reduce weight. Increasing the thickness of the support glass substrate to suppress deflection increases its mass, while reducing its thickness to reduce weight makes it prone to deflection. Therefore, it is difficult to balance deflection suppression and weight reduction.
[0008] The present invention was made in view of the above-mentioned problems, and its object is to provide a support glass substrate that can achieve both flexural suppression and lightweighting.
[0009] To address the aforementioned problems and achieve the objective, the Young's modulus ε (GPa) of the supporting glass substrate of the present invention is relative to the density d (g / cm³). 3 The ratio ε / d (GPa·cm) 3 The value of (g) is 37.0 (GPa·cm). 3 / g) or more, and greater than the value α (GPa·cm) calculated by the ratio. 3 The value of α (g / g) is calculated from this ratio, which is the Young's modulus (GPa) relative to the density (g / cm³) calculated based on the composition. 3 The ratio of α (GPa·cm) is calculated. 3 / g) is represented by the following formula.
[0010] α=2·Σ{(Vi ·G i ) / M i )·X i}
[0011] Here, V i G represents the filling parameters of the metal oxide contained in the aforementioned supporting glass substrate. i M is the dissociation energy of the metal oxide contained in the aforementioned supporting glass substrate. i X represents the molecular weight of the metal oxide contained in the aforementioned supporting glass substrate. i The molar ratio of the metal oxides contained in the aforementioned supporting glass substrate.
[0012] According to the present invention, it is possible to achieve both flexural suppression and weight reduction. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the supporting glass substrate in this embodiment.
[0014] Figure 2 This is a graph used to illustrate the performance of the supporting glass substrate in this embodiment.
[0015] Figure 3 This is a schematic diagram illustrating the flexural measurement method of the embodiments and comparative examples.
[0016] Figure 4 These are graphs illustrating the characteristics of the supporting glass substrates in the embodiments and comparative examples. Detailed Implementation
[0017] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that the present invention is not limited to these embodiments, and that in the case of multiple embodiments, there are also configurations that combine various embodiments.
[0018] Figure 1 This is a schematic diagram of the supporting glass substrate according to this embodiment. Figure 1 As shown, the support glass substrate 10 of this embodiment is used as a glass substrate for manufacturing semiconductor packages, and more specifically, as a support glass substrate for manufacturing FOWLPs, etc. However, the application of the support glass substrate 10 is arbitrary and is not limited to manufacturing FOWLPs, etc.; it can also be a glass substrate used for supporting members. It should be noted that, as described above, FOWLPs, etc., include both FOWLPs and FOPLPs.
[0019] The supporting glass substrate 10 can achieve both flexural suppression and weight reduction by increasing the ratio ε / d of Young's modulus ε to density d. Specifically, the ratio ε / d of the supporting glass substrate 10 is 32.0 (GPa·cm). 3 / g) or more, and satisfying the following formula (1). The ratio α calculated by formula (1) is the calculated value of the ratio of Young's modulus to density of the supporting glass substrate 10 calculated based on the composition of the supporting glass substrate 10, which will be described in detail later.
[0020] ε / d>α…(1)
[0021] The ratio ε / d is a value calculated using the measured values of the Young's modulus ε of the supporting glass substrate 10 and the measured values of the density d of the supporting glass substrate 10.
[0022] In this embodiment, the Young's modulus ε of the supporting glass substrate 10 is a value measured using an OLYMPUS 38DLPLUS ultrasonic transducer based on ultrasonic wave transmission. Furthermore, in this embodiment, the density d of the supporting glass substrate 10 is a value measured using the Archimedes method. The ratio ε / d is calculated by dividing the measured Young's modulus ε by the measured density d. It should be noted that the unit of Young's modulus ε is GPa, and the unit of density d is g / cm³. 3 The unit of the ratio ε / d is GPa·cm. 3 / g.
[0023] The ratio ε / d is a measured value, while the calculated ratio α is a value calculated based on the composition of the supporting glass substrate 10, without using the measured values of Young's modulus ε and density d. It is known that Young's modulus can be calculated from the composition of the glass; therefore, the calculated value α, the ratio of Young's modulus to density of the supporting glass substrate 10, can be calculated based on its composition. Here, the composition of the supporting glass substrate 10 refers to the composition when the composition contained in the supporting glass substrate 10 is converted to a metal oxide.
[0024] More specifically, the ratio calculation value α is equivalent to the value obtained as follows: for each metal oxide, the value obtained by multiplying the ion size of the metal oxide by the bonding force, dividing by the ion weight, adding the results, and then multiplying by 2. Specifically, the ratio calculation value α is calculated by the following formula (2).
[0025] α=2·Σ(P i ·X i )=2·Σ{(V i ·G i ) / M i )·X i}···(2)
[0026] Here, P i For (V) i ·G i / M i V i (cm 3 / mol) is the filling parameter of the metal oxide contained in the supporting glass substrate 10, G i (kJ / cm 3 M represents the dissociation energy of the metal oxide contained in the supporting glass substrate 10. i (g / mol) represents the molecular weight of the metal oxide contained in the supporting glass substrate 10, X i X represents the molar ratio of the metal oxide contained in the supporting glass substrate 10 to the entire supporting glass substrate 10. i The unit is dimensionless. As shown in equation (2), the calculated value α of the ratio is obtained as follows: For all the metal oxides contained in the supporting glass substrate 10, the calculated value for each metal oxide contained in the supporting glass substrate 10 is {(V i ·G i ) / M i )·X i Add them together, then multiply by 2. It should be noted that the unit of the calculated ratio α is GPa·cm. 3 / g.
[0027] Additionally, V i G is calculated using the following formula (3). i It is calculated using the following formula (4).
[0028] V i =6.02·10 23 ·(4 / 3)·π·(x·r 3 M +y·r 3 O )···(3)
[0029] G i =d i / M i ·{x·ΔHf(M gas )+y·ΔHf(O gas )-ΔHf(M x O ycrystal )-(x+y)·RT}···(4)
[0030] Here, the metal oxide contained in the supporting glass substrate 10 is designated as M. x O y .
[0031] M is a metallic element, O is an oxygen element, x is the valence of the metallic element M, and y is the valence of the oxygen element O.
[0032] r M M is a metal oxide x O y The Shannon ionic radius of the metallic element M, rO M is a metal oxide x O y The Shannon ionic radius of oxygen (O). Additionally, d i M is a metal oxide x O y The density.
[0033] ΔHf(M gas Let ΔHf(O) be the standard enthalpy of formation of the metallic element M in its gaseous state. gas ) represents the standard enthalpy of formation of oxygen (O) in its gaseous state, ΔHf(M x O ycrystal ) is a metal oxide M x O y The standard enthalpy of formation. Additionally, R is the gas constant, and T is the absolute temperature.
[0034] The ratio ε / d of the supporting glass substrate 10 is 32.0 (GPa·cm). 3 The value is greater than ( / g) and is greater than the value α calculated based on the ratio of the composition.
[0035] That is, the supporting glass substrate 10 can be said to be a component in which the ratio ε / d of Young's modulus to density obtained by actual measurement is greater than the value of the ratio calculated as α, which is the ratio of Young's modulus to density calculated based on the composition.
[0036] By setting the ratio ε / d of the supporting glass substrate 10 to 32.0 (GPa·cm) 3 Even with the support glass substrate 10 being made thinner and lighter ( / g) and above, it still maintains high rigidity, thus achieving both stress suppression and thinning and lightening of the support glass substrate. Furthermore, the ratio ε / d of the support glass substrate 10 is greater than the value of α calculated based on the composition; in other words, the Young's modulus per unit density is greater than the value expected based on the composition.
[0037] Therefore, the supporting glass substrate 10 can achieve deflection suppression and weight reduction to a greater extent than expected.
[0038] Figure 2 This is a graph used to illustrate the performance of the supporting glass substrate in this embodiment. Figure 2 The range of the ratio ε / d described above is represented in a graph, with the horizontal axis representing the calculated value of the ratio α and the vertical axis representing the ratio ε / d. Line segment L1a represents the ratio ε / d = 32.0 (GPa·cm). 3 The boundary line of / g), line segment L2a is the boundary line of the ratio ε / d = the calculated value α. In Figure 2 In this context, it can be said that the ratio ε / d of the supporting glass substrate 10 is drawn on the upper side of the vertical axis than line segments L1a and L2a. In other words, it can be said that the ratio ε / d is drawn on... Figure 2 Within the area marked by the diagonal line.
[0039] It should be noted that the ratio ε / d of the supporting glass substrate 10 is more preferably 37.0 (GPa·cm). 3 / g) or more, more preferably 40.0 (GPa·cm) 3 / g) or more. The pass rate ε / d is 37.0 (GPa·cm) 3 With a ratio ε / d of 40.0 (GPa·cm) or higher, it is possible to more appropriately suppress flexural deformation and reduce weight, achieving this through a ratio ε / d of 40.0 (GPa·cm). 3 (g) or above, can further and appropriately achieve the suppression of flexural deformation and weight reduction.
[0040] exist Figure 2 In the diagram, line segment L1b represents the ratio ε / d = 37.0 (GPa·cm). 3 The boundary line of / g), the line segment L1c is the ratio ε / d=40.0(GPa·cm) 3 / g) boundary line.
[0041] Furthermore, the ratio ε / d of the supporting glass substrate 10 more preferably satisfies the following formula (5), and even more preferably satisfies formula (6). By satisfying formula (5), it is possible to more appropriately achieve the suppression of deflection and the weight reduction, and by satisfying formula (6), it is possible to further appropriately achieve the suppression of deflection and the weight reduction.
[0042] ε / d>α+2.0(GPa·cm 3 / g)···(5)
[0043] ε / d>α+4.0(GPa·cm 3 / g)···(6)
[0044] exist Figure 2 In the equation, line segment L2b is ε / d=α+2.0(GPa·cm). 3 The boundary line of / g), the line segment L2c is ε / d=α+4.0(GPa·cm) 3 / g) boundary line.
[0045] Furthermore, the fill density Vt of the supporting glass substrate 10 is preferably less than 13.8 (cm³). 3 / mol), more preferably less than 13.6 (cm) 3 / mol), further preferably less than 13.3 (cm). 3 / mol). By using a filling density Vt within this range, molecules can be densely filled to appropriately suppress flexural deformation and reduce weight. Here, the filling density Vt refers to the degree of molecular filling, and in this embodiment, it refers to the degree of filling of the metal oxide contained in the supporting glass substrate 10. The filling density Vt is a value calculated based on the composition of the supporting glass substrate 10. The filling density Vt is calculated using the following formula (7).
[0046] Vt=Σ(V i ·X i )···(7)
[0047] As mentioned above, V in equation (7) i As described above, X in equation (7) is the filling parameter for the metal oxide contained in the supporting glass substrate 10. i The fill density Vt is the molar ratio of the metal oxides contained in the supporting glass substrate 10 relative to the entire supporting glass substrate 10. That is, the fill density Vt is obtained by multiplying the fill parameters calculated for each metal oxide contained in the supporting glass substrate 10 by the molar ratio and then summing the results.
[0048] The preferred ratio of the supporting glass substrate 10 is calculated to be α, which is 31.6 (GPa·cm). 3 The content of the material must be above 13.8 g and the packing density Vt must be less than 13.8 cm³. 3 / mol). Furthermore, the preferred ratio of the supporting glass substrate 10 is calculated to be α, which is 32.8 (GPa·cm). 3 With a content of 1.5 g or more and a filling density Vt of less than 13.8, the calculated ratio of the preferred ratio is α, which is 33.1 (GPa·cm). 3 The content of the material must be above 13.6 g and the packing density Vt must be less than 13.6 cm³. 3 / mol), and further optimized ratios yielded a value of α of 33.5 (GPa·cm). 3 / g) and the packing density Vt is less than 13.3 (cm³). 3 By using a support glass substrate 10 with a ratio calculated to have a relationship between the value α and the filling density Vt, it is possible to appropriately suppress deflection and reduce weight.
[0049] Furthermore, the ratio ε / d to the calculated ratio α, i.e., the ratio ε / d divided by the calculated ratio α, is defined as the structure factor M. That is, the structure factor M refers to the ratio of the measured value of the specific elastic modulus to the specific elastic modulus calculated based on the composition. In this case, the structure factor M of the supporting glass substrate 10 is preferably greater than 1, more preferably 1.1 or more, and even more preferably greater than 1.12. With the structure factor M within this range, flexural suppression and weight reduction can be appropriately achieved.
[0050] Furthermore, the ratio of the average molecular weight V to the density d of the supporting glass substrate 10, i.e., the average molecular weight V divided by the density d, is set as the molecular volume Vm (cm³). 3 / mol). The average molecular weight V is a calculated value of the average molecular weight of the supporting glass substrate 10, based on the composition of the supporting glass substrate 10. For example, the average molecular weight V of a supporting glass substrate containing 50% Al2O3 and 50% SiO2 in a molar ratio is (101.96 × 0.5) + (60.08 × 0.5). The molecular volume Vm can be considered the ratio of the average molecular weight calculated based on the composition to the measured value of the density d. The molecular volume Vm of the supporting glass substrate 10 is preferably less than 24.1 (cm³). 3 / mol), more preferably less than 23.2 (cm) 3 / mol), further preferably less than 22.7 (cm). 3 / mol). By using a molecular volume Vm within this range, the molecules are densely packed, which can appropriately suppress flexural deformation.
[0051] Next, the composition of the supporting glass substrate 10 will be described. In this embodiment, the supporting glass substrate 10 is composed of the following components, thereby enabling a ratio ε / d of 32.0 (GPa·cm). 3 The composition described below is an example, provided that the ratio ε / d is greater than or equal to 32.0 (GPa·cm). The supporting glass substrate 10 is provided that the ratio ε / d is 32.0 (GPa·cm). 3 If the ratio is greater than or equal to the value α calculated from the ratio ( / g), then any composition is possible.
[0052] The supporting glass substrate 10 comprises a base material and additives. The supporting glass substrate 10 preferably comprises SiO2 and Al2O3 as base materials. Expressed as a mole % based on oxides, the total content of SiO2 and Al2O3 in the supporting glass substrate 10 is preferably 50% to 85%, more preferably 60% to 75%. It should be noted that 50% to 85% here means 50% or more and 85% or less when the total mole % of the supporting glass substrate 10 is set to 100%, and the same applies below.
[0053] In addition to SiO2 and Al2O3, the supporting glass substrate 10 may also contain B2O3 as a base material. The content of B2O3, expressed as a mole percent based on oxides, is preferably 1% to 30%, more preferably 3% to 10%. By maintaining the content of the base material within this range, the ratio ε / d can be increased, appropriately achieving suppression of deflection and weight reduction. Furthermore, the supporting glass substrate 10 may also contain at least one of P2O5, Ga2O3, AlN, and Si3N4 as a base material.
[0054] The additive is a metal oxide. The supporting glass substrate 10 contains at least one of MgO, CaO, and Y2O3 as an additive. The content of the additive in the supporting glass substrate 10, expressed as a mole percent based on oxides, in other words, the total content of one or more components selected from MgO, CaO, and Y2O3, is preferably in the range of 15% to 50%, more preferably 20% to 45%.
[0055] The supporting glass substrate 10 preferably contains only MgO (from MgO, CaO, and Y2O3) as an additive, only MgO and CaO as additives, all of MgO, CaO, and Y2O3 as additives, or only Y2O3 as an additive. The supporting glass substrate 10 preferably contains 11% to 35% MgO (in molar percentage based on oxides), more preferably 20% to 30% MgO. Furthermore, the supporting glass substrate 10 preferably contains 7% to 32% CaO (in molar percentage based on oxides), more preferably 8% to 15% CaO. Additionally, the supporting glass substrate 10 preferably contains 2.8% to 20% Y2O3 (in molar percentage based on oxides). By setting the content of the additives within these ranges, the ratio ε / d can be increased, appropriately achieving flexural suppression and weight reduction. In addition, the supporting glass substrate 10 may contain at least one of ZrO2, TiO2, Li2O and ZnO as an additive material, in addition to at least one of MgO, CaO and Y2O3.
[0056] Furthermore, the supporting glass substrate 10 preferably contains 40% to 60% SiO2, 20% to 30% Al2O3, and 20% to 30% MgO, expressed as a mole percent based on oxides. In this case, the supporting glass substrate 10 preferably does not contain any components other than SiO2, Al2O3, and MgO, except for unavoidable impurities.
[0057] The preferred composition of the supporting glass substrate 10 will be described in further detail. It should be noted that the supporting glass substrate 10 preferably has parameters such as ratio ε / d, structure factor M, and molecular volume Vm within the ranges specified above, and there is no particular limitation on the composition. That is, as long as various supporting glass substrates are manufactured with any composition, the parameters such as ratio ε / d, structure factor M, and molecular volume Vm are measured and calculated on the manufactured supporting glass substrate, and a glass substrate with calculated parameters within the ranges specified above is used as the supporting glass substrate 10.
[0058] The supporting glass substrate 10 preferably has a SiO2 content of 20% to 66%, an Al2O3 content of 6% to 30%, and an MgO content of 25% to 30%, expressed as a mole percent based on oxides. Alternatively, the supporting glass substrate 10 preferably has a SiO2 content of 20% to 66%, an Al2O3 content of 6% to 30%, and a combined MgO and CaO content of 19% to 46%, expressed as a mole percent based on oxides. Alternatively, the supporting glass substrate 10 preferably has a SiO2 content of 20% to 66%, an Al2O3 content of 6% to 30%, and a combined B2O3 and Y2O3 content of 5.8% to 50%, more preferably a combined B2O3 and Y2O3 content of 25% to 50%, expressed as a mole percent based on oxides.
[0059] (Component 1)
[0060] An example of a preferred composition of the supporting glass substrate 10 is designated as the first composition. The supporting glass substrate 10 of the first composition preferably has a SiO2 content of 48% to 52%, an Al2O3 content of 20% to 25%, and an MgO content of 25% to 30%, and does not contain any components other than SiO2, Al2O3, and MgO except for unavoidable impurities.
[0061] (Part 2)
[0062] An example of a preferred composition of the supporting glass substrate 10 is designated as the second composition. The supporting glass substrate 10 of the second composition preferably has a SiO2 content of 43% to 58%, an Al2O3 content of 12% to 17%, an MgO content of 14% to 27%, and a CaO content of 7% to 32%, and does not contain any components other than SiO2, Al2O3, MgO, and CaO except for unavoidable impurities.
[0063] (Part 3)
[0064] An example of a preferred composition of the supporting glass substrate 10 is designated as the third composition. The supporting glass substrate 10 of the third composition preferably has a SiO2 content of 64% to 68%, an Al2O3 content of 10% to 14%, a MgO content of 9% to 13%, a CaO content of 6% to 10%, and a B2O3 content of 1% to 5%, and does not contain any components other than SiO2, Al2O3, MgO, CaO, and B2O3 except for unavoidable impurities.
[0065] (Part 4)
[0066] An example of a preferred composition of the supporting glass substrate 10 is designated as composition 4. The supporting glass substrate 10 of composition 4 preferably has a SiO2 content of 55.7% to 59.7%, an Al2O3 content of 15% to 19%, a MgO content of 13% to 17%, a CaO content of 7% to 11%, and a SrO content of 0.1% to 1%, and does not contain any components other than SiO2, Al2O3, MgO, CaO, and SrO except for unavoidable impurities.
[0067] (Fifth component)
[0068] An example of a preferred composition of the supporting glass substrate 10 is set as composition 5. The supporting glass substrate 10 of composition 5 preferably has a SiO2 content of 58% to 59%, an Al2O3 content of 13% to 14%, an MgO content of 17% to 19%, a CaO content of 7% to 8%, and a TiO2 content of 2% to 4%, and does not contain any components other than SiO2, Al2O3, MgO, CaO, and TiO2 except for unavoidable impurities.
[0069] (Sixth group)
[0070] An example of a preferred composition of the supporting glass substrate 10 is set as composition 6. The supporting glass substrate 10 of composition 6 preferably has a SiO2 content of 58% to 62%, an Al2O3 content of 11% to 15%, an MgO content of 15% to 19%, a CaO content of 6% to 10%, and a ZrO2 content of 0.5% to 2%, and does not contain any components other than SiO2, Al2O3, MgO, CaO, and ZrO2 except for unavoidable impurities.
[0071] (Seventh Component)
[0072] An example of a preferred composition of the supporting glass substrate 10 is designated as composition 7. The supporting glass substrate 10 of composition 7 preferably contains 48%–50% SiO2, 6%–10% Al2O3, 12%–16% MgO, 7%–11% CaO, 0.8%–4.8% Y2O3, 0%–4% TiO2, 0%–3% ZrO2, 2%–6% LiO2, and 4%–8% ZnO. Except for unavoidable impurities, it does not contain any components other than SiO2, Al2O3, MgO, CaO, Y2O3, TiO2, ZrO2, LiO2, and ZnO.
[0073] (8th group)
[0074] An example of a preferred composition of the supporting glass substrate 10 is set as composition 8. The supporting glass substrate 10 of composition 8 preferably has a SiO2 content of 20% to 50%, an Al2O3 content of 20% to 30%, a B2O3 content of 5% to 30%, and a Y2O3 content of 19% to 20%, and does not contain any components other than SiO2, Al2O3, B2O3, and Y2O3 except for unavoidable impurities.
[0075] (Group 9)
[0076] An example of a preferred composition of the supporting glass substrate 10 is designated as composition 9. The supporting glass substrate 10 of composition 9 preferably has a SiO2 content of 38% to 42%, an Al2O3 content of 18% to 22%, a B2O3 content of 16% to 20%, a Y2O3 content of 18% to 22%, and a P2O5 content of 0% to 4%, and does not contain any components other than SiO2, Al2O3, B2O3, Y2O3, and P2O5 except for unavoidable impurities.
[0077] (Group 10)
[0078] An example of a preferred composition of the supporting glass substrate 10 is designated as composition 10. The supporting glass substrate 10 of composition 10 preferably has a SiO2 content of 38% to 42%, an Al2O3 content of 13% to 15%, a B2O3 content of 18% to 22%, a Y2O3 content of 18% to 22%, and a Ga2O5 content of 3% to 7%, and does not contain any components other than SiO2, Al2O3, B2O3, Y2O3, and Ga2O5 except for unavoidable impurities.
[0079] It should be noted that the supporting glass substrate 10 does not contain a sintered body. That is, the supporting glass substrate 10 is glass that is not a sintered body. Here, a sintered body refers to a component formed by heating multiple particles to a temperature below their melting point, thereby bonding the particles together. Sintered bodies contain pores, and therefore have a higher porosity to some extent. However, since the supporting glass substrate 10 is not a sintered body, its porosity is low, typically 0%. However, the presence of unavoidable trace amounts of pores is permissible. The porosity here refers to the so-called true porosity, which is the value obtained by dividing the sum of the volumes of pores (voids) connected to the outside and those not connected to the outside by the total volume (apparent volume). Porosity can be measured, for example, according to JIS R 1634.
[0080] Furthermore, the glass used in the supporting glass substrate 10 is typically amorphous glass, i.e., an amorphous solid. Alternatively, the glass could be a crystalline glass containing crystals on its surface or within its interior, but from a density perspective, amorphous glass is preferred. Sintered bodies (ceramics) cannot be used due to their low transmittance and high density.
[0081] Next, the shape of the supporting glass substrate 10 will be described. For example... Figure 1 As shown, the supporting glass substrate 10 is a plate-shaped glass substrate, including a first surface 12 as one side surface, a second surface 14 as the other side surface, and a side surface 16. The second surface 14 is the surface opposite to the first surface 12, for example, parallel to the first surface 12. The side surface 16 is the side surface of the supporting glass substrate 10, or it can be described as the end face connecting the first surface 12 and the second surface 14.
[0082] When viewed from above, i.e., from a direction orthogonal to the first surface 12, the supporting glass substrate 10 is in the shape of a circular plate. However, the supporting glass substrate 10 is not limited to a circular shape and can be any shape, such as a rectangular or other polygonal plate.
[0083] Furthermore, the thickness D2 of the supporting glass substrate 10, i.e., the length between the first surface 12 and the second surface 14, is preferably 0.1 mm to 2.0 mm, and more preferably 0.1 mm to 0.5 mm. By making the thickness D2 0.1 mm or more, it is possible to prevent the supporting glass substrate 10 from becoming too thin, thus suppressing breakage due to bending or impact. By making the thickness D2 2.0 mm or less, it is possible to suppress weight gain, and by making the thickness D2 0.5 mm or less, it is possible to further appropriately suppress weight gain.
[0084] The manufacturing method of the supporting glass substrate 10 is arbitrary and not particularly limited. For example, the supporting glass substrate 10 can be manufactured by the following operation: raw materials, such as silica sand or soda ash, which are the compounds contained in the supporting glass substrate 10, are fed into a continuous melting furnace, heated and melted at 1500°C to 1600°C, clarified, and then fed to a forming device to form the molten glass into a plate shape and slowly cooled. It should be noted that the supporting glass substrate 10 can be manufactured by various methods, such as melt casting, pull-down methods (e.g., overflow pull-down method, flow hole pull-down method, and re-traction method), float glass, rolling, and pressing.
[0085] Next, an example of the manufacturing process using the support glass substrate 10 in FOWLP manufacturing will be described. In FOWLP manufacturing, multiple semiconductor chips are bonded to the support glass substrate 10, and the semiconductor chips are covered with a sealing material to form a component substrate. Then, the support glass substrate 10 is separated from the component substrate, and the side of the component substrate opposite to the semiconductor chips is bonded to, for example, another support glass substrate 10. Next, wiring or solder bumps are formed on the semiconductor chips, and the component substrate and support glass substrate 10 are separated again. Then, the component substrate is cut into individual semiconductor chips to obtain a semiconductor device.
[0086] As described above, the ratio ε / d of the supporting glass substrate 10 in this embodiment is 32.0 (GPa·cm). 3 / g) or more, and is greater than the value of the ratio calculated as α. The ratio ε / d is the ratio of the Young's modulus ε of the supporting glass substrate 10 to the density d. The ratio calculated as α is the ratio of the Young's modulus to the density calculated based on the composition of the supporting glass substrate 10, and is expressed by the above formula (2).
[0087] Glass substrates sometimes require a balance between flexural strength suppression and weight reduction. However, typically, flexural strength suppression necessitates increased thickness, while weight reduction requires decreased thickness, making it difficult to achieve both simultaneously. In contrast, the supporting glass substrate 10 of this embodiment achieves this by setting the ratio ε / d of the supporting glass substrate 10 to 32.0 (GPa·cm). 3 Even if the supporting glass substrate 10 is made thinner for the purpose of weight reduction, the high Young's modulus can suppress flexural deformation, thus achieving both flexural deformation suppression and weight reduction.
[0088] Furthermore, the ratio ε / d of the supporting glass substrate 10 is greater than the value α calculated based on the composition; in other words, the Young's modulus per unit density is greater than the value expected based on the composition. Therefore, the supporting glass substrate 10 can achieve flexural suppression and weight reduction to a greater extent than expected.
[0089] Furthermore, the preferred ratio ε / d of the supporting glass substrate 10 is 37.0 (GPa·cm). 3 The structure factor M is greater than or equal to 1.1, and the packing density Vt is less than 13.8 (cm³). 3 / mol). The supporting glass substrate 10 that meets these conditions can achieve flexural suppression and weight reduction to a greater extent than expected.
[0090] Furthermore, the preferred ratio α of the supporting glass substrate 10 is calculated to be 31.6 (GPa·cm). 3 The content of the material must be above 13.8 g and the packing density Vt must be less than 13.8 cm³. 3 / mol). By setting the ratio α and the filling density Vt to this range, flexural suppression and weight reduction can be achieved to a greater extent than expected.
[0091] Furthermore, the supporting glass substrate 10 preferably satisfies the ratio ε / d > the calculated ratio value α + 2.0 (GPa·cm). 3 The relationship between ε / d and g is preferred, and more preferably, the ratio ε / d > the calculated value α + 4.0 (GPa·cm) is satisfied. 3 By satisfying these relationships, it becomes possible to more appropriately suppress flexural deformation and reduce weight.
[0092] Furthermore, the preferred ratio ε / d of the supporting glass substrate 10 is 37.0 (GPa·cm). 3 / g) or higher, more preferably a ratio ε / d of 40.0 (GPa·cm) 3 / g) or above. By using the ratio ε / d at this value, it is possible to more appropriately achieve flexural suppression and weight reduction.
[0093] Furthermore, the supporting glass substrate 10 preferably contains one or more components selected from MgO, CaO, and Y2O3, with the total content ranging from 15% to 50% in moles relative to the total amount of the supporting glass substrate 10. By including such materials in such an amount, the supporting glass substrate 10 can achieve a Young's modulus ε higher than assumed, thus more appropriately suppressing deflection and reducing weight.
[0094] Furthermore, the combined content of SiO2 and Al2O3 in the supporting glass substrate 10 is preferably in the range of 50% to 85% (mol%) relative to the total amount of the supporting glass substrate 10. With this composition, the supporting glass substrate 10 can achieve a Young's modulus ε higher than assumed, thus more appropriately suppressing deflection and reducing weight.
[0095] Furthermore, the thickness D2 of the supporting glass substrate 10 is preferably in the range of 0.1 mm to 0.5 mm. By setting the thickness D2 within this range, damage caused by bending or impact can be suppressed, while simultaneously achieving weight reduction.
[0096] Furthermore, the supporting glass substrate 10 is a non-sintered glass. Since the supporting glass substrate 10 is not a sintered body, it is possible to prevent the density from becoming too high and achieve weight reduction. In addition, since there is no light scattering due to the pores present in sintered bodies, light transmittance can be ensured.
[0097] Furthermore, the supporting glass substrate 10 is preferably amorphous glass. Since the supporting glass substrate 10 is amorphous glass, it is possible to prevent the density from becoming too high and thus achieve weight reduction.
[0098] The support glass substrate 10 is preferably a support glass substrate for manufacturing at least one of fan-out wafer-level packaging (FOWLP) and fan-out panel-level packaging. By using the support glass substrate 10 in at least one of fan-out wafer-level packaging manufacturing and fan-out panel-level packaging manufacturing, semiconductor packaging can be manufactured appropriately.
[0099] (Example)
[0100] Next, embodiments will be described. It should be noted that the implementation methods can be modified within the scope of achieving the effects of the invention.
[0101] In the embodiments and comparative examples, support glass substrates with different compositions were fabricated. Then, the ratio α was calculated for each support glass substrate, and the ratio ε / d was calculated by measuring the Young's modulus ε and density d. Furthermore, the deflection and mass of each support glass substrate were measured, and an evaluation was performed based on the deflection and mass. The following is a more detailed description.
[0102] Table 1 shows the materials used in the support glass substrates of the Examples and Comparative Examples. Table 1 shows the content of the materials used in the fabrication of the support glass substrates of Examples 1 to 17 and Comparative Examples 1 to 11, expressed in mol% based on oxides. In addition, Table 2 shows the content of the materials used in the fabrication of the support glass substrates of Examples 18 to 26, expressed in mol% based on oxides.
[0103] In the examples and comparative examples, blanks with a diameter of 320 mm and a thickness of 6 mm were manufactured using the melt casting method with the compositions described in Tables 1 and 2, respectively. Next, multiple plates with a diameter of 300 mm and a thickness of 3 mm were cut from the center of the blanks. Both sides of these plates were double-sided polished using cerium oxide as the abrasive material, and the thicknesses were adjusted to 0.4 mm, 0.7 mm, 1.3 mm, and 2.0 mm, respectively, to fabricate supporting glass substrates.
[0104] The supporting glass substrate manufactured in this manner will be used as a sample for evaluation.
[0105] [Table 1]
[0106]
[0107] [Table 2]
[0108]
[0109] In the examples and comparative examples, for each supporting glass substrate fabricated into samples, the ratio α was calculated based on the material composition shown in Table 1. Then, for each supporting glass substrate fabricated into samples, the Young's modulus ε was measured using a 38DL PLUS manufactured by OLYMPUS Corporation, and the density d was measured by the Archimedes method. The ratio ε / d was calculated based on the measured Young's modulus ε and density d.
[0110] Figure 3 This is a schematic diagram illustrating the deflection measurement method of the embodiments and comparative examples. In the embodiments and comparative examples, the deflection due to its own weight was measured on each supporting glass substrate used to prepare the samples. Specifically, as... Figure 3 As shown, when the second surface 14 of the support glass substrate serving as the sample is supported at three points by the support portion B, the central portion of the first surface 12 is measured using a Dyvoce manufactured by Shinzu Seiki. Figure 3 The deflection amount (of the arrow portion). It should be noted that the diameter of support portion B is 1.6 mm, and support portion B is arranged such that its center overlaps with the portion of the supporting glass substrate 5.0 mm radially inward from the outer periphery. Furthermore, the mass of each supporting glass substrate used to fabricate the sample was measured.
[0111] Table 3 shows the evaluation results of the embodiments and comparative examples. Figure 4 This is a graph showing the characteristics of the supporting glass substrates of the embodiments and comparative examples. Table 3 shows the calculated ratio α, Young's modulus ε, density d, ratio ε / d, deflection of each thickness D2, mass of the sample with a thickness of 2.0 mm, the determination results of deflection and mass, and the comprehensive determination results for each supporting glass substrate used as a sample.
[0112] As shown in Table 3, in Examples 1 to 17, the ratio ε / d was 32.0 (GPa·cm). 3 The ratio ε / d is greater than the calculated value α of the ratio (g / g) or higher. On the other hand, in Comparative Examples 1 to 11, the ratio ε / d of 32.0 (GPa·cm) was not satisfied. 3 At least one of the following conditions must be met: ( / g) above the condition and the ratio ε / d is greater than the value α calculated from the ratio.
[0113] Figure 4 It is a graph showing the relationship between the ratio ε / d of the supporting glass substrate used as the sample and the calculated value α of the ratio. Figure 4 The black dots represent the supporting glass substrates of Examples 1 to 17, and the crosses represent the supporting glass substrates of Comparative Examples 1 to 11. Figure 4 It can also be seen from the examples that the ratio ε / d of the supporting glass substrate in Examples 1 to 17 is 32.0 (GPa·cm). 3 / g) or more, and the ratio ε / d is greater than the calculated value α, the supporting glass substrates of Comparative Examples 1 to 11 do not meet at least one of these conditions. According to Figure 4 It can be seen that in this embodiment, the ratio ε / d is separated from the ratio calculated as α, but in the comparative example, especially the sample with a higher ratio ε / d, the ratio ε / d is not separated from the ratio calculated as α.
[0114] [Table 3]
[0115]
[0116] In addition, in the determination of deflection in Table 3,
[0117] Cases with a deflection of less than 0.8 mm are defined as double-circle cases.
[0118] Cases with a deflection of 0.8 mm or more but less than 0.9 mm are defined as loops.
[0119] Cases with a deflection of 0.9 mm or more but less than 1.0 mm are defined as triangular.
[0120] Cases with a deflection of 1.0 mm or more are marked with an "X".
[0121] Double circles, circles, and triangles are considered acceptable.
[0122] In addition, in the quality assessment in Table 3,
[0123] Cases weighing less than 400g are designated as double loops.
[0124] Cases weighing more than 400g but less than 430g are designated as circles.
[0125] Cases with a mass of 430g or more but less than 500g are designated as triangles.
[0126] Mark cases with a weight of 500g or more as an "X".
[0127] Double circles, circles, and triangles are considered acceptable.
[0128] Furthermore, given that both deflection and mass are considered as two distinct cycles, the overall judgment will be set as a two-cycle process.
[0129] If both the deflection and mass are cycles or more, and at least one of them is a cycle, then the overall judgment is set to a cycle.
[0130] If both the deflection and mass are triangular or higher, and at least one of them is triangular, the overall judgment will be set as triangular.
[0131] If at least one of the deflection and mass is marked as a cross, the overall judgment is set to a cross.
[0132] In the comprehensive evaluation, double circles, circles, and triangles are also considered qualified.
[0133] As shown in Table 3, the deflection and mass of the supporting glass substrates in Examples 1 to 17 were deemed acceptable. On the other hand, at least one of the deflection and mass of the supporting glass substrates in Comparative Examples 1 to 11 was deemed unacceptable. That is, the ratio ε / d was 32.0 (GPa·cm). 3 The supporting glass substrate of this embodiment, which has a ratio ε / d greater than the calculated value α, can achieve both flexural suppression and weight reduction.
[0134] Table 4 shows the calculated ratio α and the measured ratio ε / d for Examples 18 to 27. As shown in Table 4, in Examples 18 to 27, the ratio ε / d is also 32.0 (GPa·cm). 3The ratio ε / d is greater than the calculated value α.
[0135] [Table 4]
[0136]
[0137] Table 5 shows the ratio ε / d, structure factor M, molecular volume Vm, calculated ratio α, and filling density Vt of the supporting glass substrates for the examples and comparative examples. As shown in Table 5, in Examples 1, 3-4, 6-9, and 20-26, the ratio ε / d is 37.0 (GPa·cm). 3 The molecular weight (g) is greater than or equal to the calculated value α, the structure factor M is greater than or equal to 1.1, and the molecular volume Vm is less than 24.1. Furthermore, as shown in Table 5, in Examples 2, 4, 6-9, and 20-27, the calculated value α is 31.6 (GPa·cm⁻¹). 3 The content is above / g) and the packing density Vt is less than 13.8 (cm³). 3 / mol).
[0138] [Table 5]
[0139]
[0140] The embodiments of the present invention have been described above, but the embodiments are not limited to the content of these embodiments. Furthermore, the above-described constituent elements include elements readily conceived by those skilled in the art, substantially the same elements, and elements of so-called equivalent scope. Furthermore, the above-described constituent elements can be appropriately combined. Furthermore, various omissions, substitutions, or modifications can be made to the constituent elements without departing from the spirit of the above-described embodiments.
[0141] Symbol Explanation
[0142] 10 Supporting glass substrate
[0143] d density
[0144] α ratio calculated value
[0145] ε Young's modulus
[0146] ε / d ratio
Claims
1. A supporting glass substrate having a Young's modulus ε to density d ratio ε / d of 37.0 GPa·cm³. 3 The structure factor M is 1.1 or higher, where the ratio ε / d is greater than or equal to the ratio calculated as α (i.e., the structure factor M is 1.1 or higher), and the filling density Vt calculated based on the composition is less than 13.
8. The ratio calculated as α is the ratio of Young's modulus to density calculated based on the composition. The unit of Young's modulus ε is GPa, and the unit of density d is g / cm³. 3 The units of the ratio ε / d and the calculated value α are GPa·cm. 3 / g, the unit of the packing density Vt is cm. 3 / mol, The ratio α is calculated using the following formula, with units of GPa·cm. 3 / g, α=2·Σ{(V i ·G i ) / M i )·X i }, The packing density Vt is expressed by the following formula: Vt=Σ(V i ·X i ), Here, V i G represents the filling parameter of the metal oxide contained in the supporting glass substrate. i M is the dissociation energy of the metal oxide contained in the supporting glass substrate. i X is the molecular weight of the metal oxide contained in the supporting glass substrate. i The molar ratio of the metal oxides contained in the supporting glass substrate.
2. The supporting glass substrate according to claim 1, wherein, The ratio ε / d must be greater than the calculated ratio α + 2.0 GPa·cm. 3 The relationship between / g, the ratio ε / d, and the calculated value α are in GPa·cm. 3 / g.
3. The supporting glass substrate according to claim 2, wherein, The ratio ε / d is greater than the calculated ratio α + 4.0 GPa·cm. 3 The relationship between / g, the ratio ε / d, and the calculated value α are in GPa·cm. 3 / g.
4. The supporting glass substrate according to any one of claims 1 to 3, wherein, The ratio ε / d is 40.0 GPa·cm 3 / g or above, the unit of the ratio ε / d is GPa·cm 3 / g.
5. A supporting glass substrate having a Young's modulus to density ratio α calculated based on its composition of 31.6 or more, and a filling density Vt calculated based on its composition of less than 13.8, wherein the unit of Young's modulus is GPa and the unit of density is g / cm³. 3 The unit of the calculated value α for the ratio is GPa·cm. 3 / g, the unit of the packing density Vt is cm. 3 / mol, The ratio α is calculated using the following formula, with units of GPa·cm. 3 / g, α=2·Σ{(V i ·G i ) / M i )·X i }, The packing density Vt is expressed by the following formula: Vt=Σ(V i ·X i ), Here, V i G represents the filling parameter of the metal oxide contained in the supporting glass substrate. i M is the dissociation energy of the metal oxide contained in the supporting glass substrate. i X is the molecular weight of the metal oxide contained in the supporting glass substrate. i The molar ratio of the metal oxides contained in the supporting glass substrate.
6. The supporting glass substrate according to any one of claims 1 to 5, wherein, The total content of one or more components selected from MgO, CaO and Y2O3, relative to the total amount of the supporting glass substrate, ranges from 15% to 50% in mol%.
7. The supporting glass substrate according to claim 6, wherein, The total content of SiO2 and Al2O3 relative to the total amount of the supporting glass substrate is in the range of 50% to 85% in mol%.
8. The supporting glass substrate according to any one of claims 1 to 7, wherein the thickness is in the range of 0.1 mm to 0.5 mm.
9. The supporting glass substrate according to any one of claims 1 to 8, wherein it is amorphous glass.
10. The support glass substrate according to any one of claims 1 to 9, wherein it is a support glass substrate for manufacturing at least one of fan-out wafer-level packaging and fan-out panel-level packaging.
