A carrier tape bonding device and bonding method for flip chip bonding

Abstract

A carrier tape bonding device for flip chip bonding includes a carrier tape, a driving mechanism for driving the carrier tape to move, and a bonding mechanism; the bonding mechanism includes a bonding seat with an arc-shaped lower surface, a pin mounting groove arranged at the bottom of the bonding seat and opening downward, and a pin arranged in the pin mounting groove, the carrier tape is wound around the lower surface of the bonding seat, the driving mechanism drives the carrier tape to move along the lower surface of the bonding seat, the surface of the carrier tape away from the side of the bonding seat forms a chip mounting area, a number of flipped chips are arranged in the chip mounting area along the extension direction of the carrier tape, the pin moves downward to pierce the carrier tape and bond the chip downward. The above technical solution can realize flip chip without film inversion and efficient bonding, and the present invention also provides a corresponding bonding method.

Description

Technical Field

[0001] The invention relates to the technical field of crystal bonding devices, in particular to a carrier crystal bonding device and a crystal bonding method for flip chip crystal bonding. Background Art

[0002] The existing flip chip bonding requires an additional film flipping process. In addition, when bonding is required on a large-size substrate, the conventional practice is to suck the chip with a nozzle on the swing arm, then transfer it to the substrate for bonding, and then move the nozzle to the blue film through the swing arm to suck the chip, and then transfer the bonding. This is inefficient and needs to be improved. Summary of the invention

[0003] The purpose of the present invention is to provide a carrier bonding device and bonding method for flip chip bonding, which can realize flip chip bonding without film inversion and high efficiency. To achieve the above purpose, the present invention adopts the following technical solutions:

[0004] A carrier tape bonding device for flip chip bonding comprises a carrier tape, a driving mechanism for driving the carrier tape to move, and a bonding mechanism; the bonding mechanism comprises a bonding seat with an arc-shaped lower surface, an ejector pin mounting groove arranged at the bottom of the bonding seat and opening downward, and an ejector pin arranged in the ejector pin mounting groove; the carrier tape is wound around the lower surface of the bonding seat, the driving mechanism drives the carrier tape to move along the lower surface of the bonding seat, the surface of the carrier tape away from the side of the bonding seat forms a chip mounting area, a plurality of flip chip are arranged in the chip mounting area along the extension direction of the carrier tape, and the ejector pin moves downward to pierce the carrier tape and bond the chip downward.

[0005] Furthermore, the carrier tape includes a mounting wall and two side walls arranged on both sides of the mounting wall, the outer surface of the mounting wall forms the wafer mounting area, and the wafer is mounted in the wafer mounting area through a self-adhesive layer.

[0006] Furthermore, the side wall and the mounting wall are provided with an inclined connecting wall, and the outer side of the connection between the connecting wall and the side wall forms a resting position. When the carrier tape is wound into a roll, the end of the side wall of the carrier tape located on the outer side rests on the resting position of the carrier tape located on the inner side, and the inner side of the carrier tape located on the outer side forms a chip accommodating area for accommodating the chips on the inner carrier tape.

[0007] Furthermore, a plurality of driving holes are arranged at intervals on the side wall along the extension direction of the carrier tape, and the driving mechanism includes a driving roller and a power source, and the power source drives the roller to rotate, and a plurality of first protruding teeth are arranged along the outer circumference of the driving roller, and the first protruding teeth are inserted into the driving holes.

[0008] Furthermore, a guide roller is provided on the crystal fixing seat, and a plurality of second protruding teeth are provided along the outer circumference of the guide roller, and the second protruding teeth are inserted into the driving hole;

[0009] Furthermore, the left and right side walls of the carrier tape are both provided with driving holes, and the crystal fixing seat is provided with a guide roller on both sides of the ejector mounting groove, and the second protruding teeth on the two guide rollers are respectively inserted into the driving holes on the two side walls.

[0010] Furthermore, it also includes an unwinding mechanism and a rewinding mechanism, wherein the unwinding mechanism includes an unwinding reel, and the rewinding mechanism includes a rewinding reel, the carrier tape is arranged in the unwinding reel, and the carrier tape output by the unwinding reel is wound around the lower surface of the crystal fixing seat and is rewinded by the rewinding reel.

[0011] Furthermore, the carrier tape die-bonding device is entirely arranged on a moving mechanism, and the moving mechanism drives the wafer under the ejector pin to move above the die-bonding point on the substrate.

[0012] A method for bonding a flip chip using the aforementioned carrier tape bonding device for bonding a flip chip comprises the following steps:

[0013] (1) The moving mechanism drives the wafer under the ejector pin to move above the die bonding point on the substrate;

[0014] (2) The ejector pin moves downward and pierces the carrier tape, and then the ejector pin passes through the carrier tape and pushes the wafer down to the die bonding point of the substrate to achieve die bonding.

[0015] Furthermore, the method further comprises the following steps:

[0016] (3) The driving mechanism drives the carrier to move along the lower surface of the crystal bonding seat, so that the next wafer moves to the bottom of the ejector pin, and the moving mechanism drives the wafer under the ejector pin to move to the top of another crystal bonding point on the substrate;

[0017] (4) Repeat step (2) to achieve die bonding at another die bonding point.

[0018] With the above technical solution, the driving mechanism drives the carrier tape to move along the arc-shaped lower surface of the crystal-bonding seat, and the surface of the carrier tape away from the side of the crystal-bonding seat forms a chip installation area, in which a flip chip is pasted. Therefore, when the chip moves to the bottom of the ejector pin, the ejector pin moves downward and pierces the carrier tape, and then the ejector pin passes through the carrier tape and pushes the chip down to the crystal-bonding point of the substrate to achieve crystal bonding. Because the chip is flip-chip pasted on the carrier tape, when the chip moves to the bottom of the ejector pin, the chip pad is just located below, so the crystal bonding process can fix the chip on the substrate without an additional film flipping process.

[0019] In addition, for larger substrates, the entire carrier bonding device can be moved through a moving mechanism to achieve rapid bonding of large-sized substrates. Compared with the conventional bonding method using a swing arm, there is no need for the swing arm to move back and forth to suck the wafer and bond the wafer, which greatly improves the efficiency of bonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the carrier die bonding device installed on the moving mechanism.

[0021] Figure 2 Schematic diagram of the crystal bonding mechanism.

[0022] Figure 3 It is a schematic diagram of the carrier tape being wound around the lower surface of the crystal mount.

[0023] Figure 4 Schematic diagram of the connection between the driving mechanism and the carrier tape.

[0024] Figure 5 A schematic cross-sectional view of the carrier tape.

[0025] Figure 6 A schematic diagram of a cross section of a carrier tape roll. DETAILED DESCRIPTION

[0026] The present invention is described below in conjunction with the accompanying drawings and specific embodiments.

[0027] like Figure 1-6 As shown, a carrier tape bonding device for flip chip bonding comprises a carrier tape 1, a driving mechanism 2 for driving the carrier tape 1 to move, a bonding mechanism 3, an unwinding mechanism 4 and a winding mechanism 5.

[0028] The crystal bonding mechanism 3 includes a crystal bonding seat 6 with an arc-shaped lower surface, a pin mounting groove arranged at the bottom of the crystal bonding seat 6 and opening downward, and a pin 7 arranged in the pin mounting groove. The unwinding mechanism 4 includes an unwinding disk, and the winding mechanism 5 includes a winding disk. The carrier tape 1 is rolled up to form a carrier tape roll, and the carrier tape roll is arranged in the unwinding disk. The carrier tape 1 output by the unwinding disk is wound around the lower surface of the crystal bonding seat 6 and is wound up by the winding disk. The driving mechanism 2 drives the carrier tape 1 to move along the lower surface of the crystal bonding seat 6. The surface of the carrier tape 1 away from the side of the crystal bonding seat 6 forms a chip installation area. In the chip installation area, a number of flip-chip chips 8 are arranged along the extension direction of the carrier tape 1. The pin 7 moves downward to pierce the carrier tape 1 and fix the chip 8 downward. The above-mentioned carrier crystal bonding device is arranged as a whole on the moving mechanism 9. The moving mechanism 9 drives the carrier crystal bonding device to move as a whole, thereby moving the chip 8 to be bonded below the pin 7 to the top of the bonding point on the substrate 10.

[0029] The carrier tape 1 includes a mounting wall 11 and two side walls 12 arranged on both sides of the mounting wall 11. The outer surface of the mounting wall 11 forms a wafer mounting area, and the wafer 8 is mounted in the wafer mounting area through a self-adhesive layer 13. The side wall 12 and the mounting wall 11 are provided with an inclined connecting wall 14, and the outer side of the connection between the connecting wall 14 and the side wall 12 forms abutment. When the carrier tape 1 is wound into a roll, the end of the side wall 12 of the carrier tape 1 located on the outer side abuts against the abutment of the carrier tape 1 located on the inner side, and the inner side of the carrier tape 1 located on the outer side forms a wafer accommodating area 21 for accommodating the wafer 8 on the inner carrier tape 1, which can protect the wafer 8.

[0030] A plurality of drive holes 16 are arranged on the side wall 12 at intervals along the extension direction of the carrier tape 1. The left and right side walls 12 of the carrier tape 1 are both provided with drive holes 16. The drive mechanism 2 includes a drive roller 17 and a power source. The power source can be a motor, etc. The power source drives the roller 17 to rotate. A plurality of first protruding teeth 18 are arranged along the outer periphery of the drive roller 17. The first protruding teeth 18 are inserted into the drive holes 16 on one of the side walls 12.

[0031] A guide roller 19 is provided on both sides of the ejector mounting groove on the crystal fixing seat 6, and a plurality of second protruding teeth 20 are provided along the outer circumference of the guide roller 19. The second protruding teeth 20 on the two guide rollers 19 are respectively inserted into the driving holes 16 on the two side walls 12, so as to guide the carrier tape 1 and facilitate the ejector 7 to accurately act on the wafer 8 for crystal fixing.

[0032] A method for bonding a flip chip using the aforementioned carrier tape bonding device for bonding a flip chip comprises the following steps:

[0033] (1) The moving mechanism drives the wafer 8 below the ejector pin 7 to move above the die-bonding point on the substrate 10;

[0034] (2) The ejector pin 7 moves downward and pierces the carrier tape 1, and then the ejector pin 7 passes through the carrier tape 1 and pushes the wafer 8 downward to the wafer bonding point of the substrate 10 to achieve wafer bonding.

[0035] (3) The driving mechanism 2 drives the carrier tape 1 to move along the lower surface of the crystal bonding seat 6, so that the next wafer 8 moves to the bottom of the ejector pin 7. In addition, the moving mechanism drives the wafer 8 under the ejector pin 7 to move to the top of another crystal bonding point on the substrate 10;

[0036] (4) Repeat step (2) to achieve die bonding at another die bonding point.

[0037] With the above technical solution, the driving mechanism 2 drives the carrier tape 1 to move along the arc-shaped lower surface of the crystal-bonding seat 6, and the surface of the carrier tape 1 away from the side of the crystal-bonding seat 6 forms a chip installation area, in which a flip chip 8 is pasted. Therefore, when the chip 8 moves to the bottom of the ejector pin 7, the ejector pin 7 moves downward and pierces the carrier tape 1, and then the ejector pin 7 passes through the carrier tape 1 and pushes the chip 8 downward to the crystal-bonding point of the substrate 10 to achieve crystal bonding. Because the chip 8 is flip-chip pasted on the carrier tape 1, when the chip 8 moves to the bottom of the ejector pin 7, the pad of the chip 8 is just located below, so the crystal bonding process can fix the chip 8 on the substrate 10 without an additional film-flipping process.

[0038] In addition, for larger substrates 10, the entire set of carrier bonding devices can be moved by the moving mechanism 9, so that rapid bonding of large-sized substrates 10 can be achieved. Compared with the conventional bonding method using a swing arm, there is no need for the swing arm to move back and forth to suck the wafer and bond the wafer, which greatly improves the efficiency of bonding.

[0039] The above description is only the preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications, combinations and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the claims of the present invention.

Claims

1. A carrier tape bonding device for flip chip bonding, characterized in that: It includes a carrier tape, a driving mechanism for driving the carrier tape to move, and a die-bonding mechanism; The crystal bonding mechanism comprises a crystal bonding seat with an arc-shaped lower surface, an ejector mounting groove arranged at the bottom of the crystal bonding seat and opening downward, and an ejector arranged in the ejector mounting groove, the carrier tape is wound around the lower surface of the crystal bonding seat, the driving mechanism drives the carrier tape to move along the lower surface of the crystal bonding seat, the surface of the carrier tape away from the side of the crystal bonding seat forms a chip mounting area, a plurality of flip-chip chips are arranged in the chip mounting area along the extension direction of the carrier tape, and the ejector needle moves downward to pierce the carrier tape and bond the chip downward; The carrier tape comprises a mounting wall and two side walls arranged on both sides of the mounting wall, the outer surface of the mounting wall forms the wafer mounting area, and the wafer is mounted in the wafer mounting area through a self-adhesive layer; The side wall and the mounting wall are provided with an inclined connecting wall, and the outer side of the connection between the connecting wall and the side wall forms an abutment position. When the carrier tape is wound into a roll, the end of the side wall of the carrier tape located on the outer side abuts against the abutment position of the carrier tape located on the inner side, and the inner side of the carrier tape located on the outer side forms a wafer accommodating area for accommodating wafers on the inner carrier tape; A plurality of driving holes are arranged on the side wall at intervals along the extension direction of the carrier tape. The driving mechanism includes a driving roller and a power source. The power source drives the roller to rotate. A plurality of first protruding teeth are arranged along the outer circumference of the driving roller. The first protruding teeth are inserted into the driving holes.

2. The tape bonding device for flip chip bonding according to claim 1, characterized in that: A guide roller is arranged on the crystal fixing seat, and a plurality of second protruding teeth are arranged along the outer circumference of the guide roller, and the second protruding teeth are inserted into the driving holes.

3. The tape bonding device for flip chip bonding according to claim 1, characterized in that: The left and right side walls of the carrier tape are both provided with driving holes, and the crystal fixing seat is provided with a guide roller on both sides of the ejector mounting groove, and the second protruding teeth on the two guide rollers are respectively inserted into the driving holes on the two side walls.

4. The tape bonding device for flip chip bonding according to any one of claims 1 to 3, characterized in that: It also includes an unwinding mechanism and a rewinding mechanism. The unwinding mechanism includes an unwinding reel, and the rewinding mechanism includes a rewinding reel. The carrier tape is arranged in the unwinding reel. The carrier tape output by the unwinding reel is wound around the lower surface of the crystal fixing seat and is rewinded by the rewinding reel.

5. The tape bonding device for flip chip bonding according to claim 4, characterized in that: The carrier tape die bonding device is integrally arranged on a moving mechanism, and the moving mechanism drives the wafer under the ejector pin to move above the die bonding point on the substrate.

6. A method for bonding a flip chip using the tape bonding device for bonding a flip chip according to claim 5, characterized in that: The following steps are involved: (1) The moving mechanism drives the wafer under the ejector pin to move above the die bonding point on the substrate; (2) The ejector pin moves downward and pierces the carrier tape, and then the ejector pin passes through the carrier tape and pushes the wafer down to the die bonding point of the substrate to achieve die bonding.

7. The die bonding method according to claim 6, characterized in that: The following steps are also included: (3) The driving mechanism drives the carrier to move along the lower surface of the crystal bonding seat, so that the next wafer moves to the bottom of the ejector pin, and the moving mechanism drives the wafer under the ejector pin to move to the top of another crystal bonding point on the substrate; (4) Repeat step (2) to achieve die bonding at another die bonding point.

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