Die bonding device for Mini RGB

By designing a crystal solid device for Mini RGB, the crystal solid mechanism and rotary mechanism are used to improve the crystal solid efficiency, and the substrate position is adjusted by the moving mechanism, the existing devices have low crystal solid efficiency and cannot meet the crystal solid at different locations, achieving an efficient and flexible crystal solidification process.

CN222655676UActive Publication Date: 2025-03-21江西瑞晟光电科技有限公司
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Patent Information

Application Number
CN202421000604.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-10
Publication Date
2025-03-21
Estimated Expiration
2034-05-10

AI Technical Summary

Technical Problem

When the existing solid crystal device is used, the nozzle needs to move back and forth between the wafer and the substrate, resulting in low crystal solid crystal efficiency and cannot meet the solid crystal solid crystal requirements at different positions of the substrate, reducing practicality.

Method used

A crystal solid device for Mini RGB is designed, using a crystal solid mechanism and a rotating mechanism. The rotating rod is driven by a driver to drive the electric suction nozzle to rotate 180 degrees. Combined with the extension of the cylinder, the electric suction nozzle absorbs and releases the wafer, thereby improving the crystal solidification efficiency. At the same time, by setting up a moving mechanism, the position of the substrate is adjusted by using an electric push rod and an electric telescopic rod to meet the crystal solidification needs of different positions.

Benefits of technology

Through this device, the crystal solidification time of the wafer is saved, the crystal solidification efficiency is improved, and the position of the substrate can be flexibly adjusted, meeting the crystal solidification needs at different locations, and improving practicality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of die bonding devices, and discloses a die bonding device for Mini RGB, which comprises a die bonding table, a support frame is fixedly connected between the front part and the rear part of the upper end of the die bonding table, the middle part of the upper end of the support frame is movably connected with a die bonding mechanism in a penetrating manner, and the lower part of the front end of the support frame is fixedly connected with a controller. A moving groove is formed in the right portion of the upper end of the die bonding table, a fixing block is fixedly connected to the middle of the right end of the die bonding table, a moving mechanism is jointly inserted and movably connected between the upper portion of the right end of the fixing block and the middle of the rear groove wall of the moving groove, and a die storage disc is fixedly connected to the left portion of the upper end of the die bonding table. According to the die bonding device used for Mini RGB, through arranging the die bonding mechanism and the rotating mechanism, adsorption and surface mounting of a wafer are carried out at the same time, die bonding efficiency is improved, through arranging the moving mechanism, the position of the substrate can be flexibly adjusted, die bonding requirements of different positions of the substrate are satisfied, and the die bonding device is suitable for wide application.
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Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding devices, in particular to a crystal bonding device for Mini RGB. Background Art

[0002] Mini LED, also known as sub-millimeter light-emitting diode, was first proposed by Epistar, meaning LED with a grain size of about 100 microns or more. Mini LED is a small lighting unit with a wide range of applications. Mini LED is composed of RGB three-primary color chips, and die bonding is one of the key processes that determine the reliability of Mini RGB components, so a die bonding device is used. There are at least the following disadvantages in the use of existing die bonding devices: 1. When using the existing die bonding device, the suction nozzle needs to move back and forth between the chip and the substrate. The time required to suck the chip and place it on the substrate is relatively long. Each reciprocating action is required to complete the placement of a chip, which reduces the efficiency of die bonding; 2. In order to ensure the fixing effect, the position of the substrate is fixed in the existing die bonding device, but it cannot meet the demand for die bonding at different positions of the substrate, which reduces the practicality. Therefore, we have launched a die bonding device for Mini RGB. Utility Model Content

[0003] The main purpose of the utility model is to provide a die-bonding device for Mini RGB, which can effectively solve the problems in the background technology.

[0004] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0005] A crystal bonding device for Mini RGB comprises a crystal bonding platform, a support frame is fixedly connected between the upper front part and the upper rear part of the crystal bonding platform, a crystal bonding mechanism is movably connected to the middle part of the upper end of the support frame, a controller is fixedly connected to the lower front end of the support frame, a movable groove is opened at the upper right part of the crystal bonding platform, a fixed block is fixedly connected to the middle part of the right end of the crystal bonding platform, a movable mechanism is movably connected between the upper part of the fixed block and the middle part of the rear groove wall of the movable groove, and a crystal storage tray is fixedly connected to the upper left part of the crystal bonding platform.

[0006] Preferably, the crystal fixing mechanism includes a fixed frame, the rear portion of the upper frame wall of the fixed frame is movably connected with a rotating mechanism through a bearing, the front portion of the upper frame wall of the fixed frame is fixedly connected with a driver, the output end of the driver passes through the upper frame wall of the fixed frame and is fixedly connected with a first gear, and the lower end of the first gear is movably connected to the upper end of the fixed frame through a bearing, and the lower end of the fixed frame and the lower end of the driver are both fixedly connected to the upper end of the support frame.

[0007] Preferably, the rotating mechanism includes a cylinder, a second gear is inserted and fixedly connected to the upper part of the outer surface of the cylinder, a rotating rod is fixedly connected to the output end of the cylinder, an electric suction nozzle is inserted and fixedly connected to the upper front and rear ends of the rotating rod, and the lower part of the outer surface of the cylinder is movably connected to the upper frame wall of the support frame through a bearing.

[0008] Preferably, the cylinder, the electric suction nozzle and the driver are all electrically connected to the controller, and the length of the rotating rod is shorter than the length of the supporting frame.

[0009] Preferably, the moving mechanism includes a fixed seat, the middle part of the front seat wall and the middle part of the rear seat wall of the fixed seat are both threadedly connected with screws, the opposite surfaces of the two screws are movably connected with fixed plates through bearings, a first sliding groove is opened in the middle part of the right end of the fixed seat, a first sliding block is slidably connected in the first sliding groove, and the right end of the first sliding block is fixedly connected to an electric push rod.

[0010] Preferably, a second sliding groove is opened in the middle of the lower end of the fixing seat, a second sliding block is slidably connected in the second sliding groove, and an electric telescopic rod is fixedly connected to the rear end of the second sliding block.

[0011] Preferably, the second slide groove, the second slider, the first slider and the first slide groove are all arranged as T-shaped structures, and the electric telescopic rod and the electric push rod are both electrically connected to the controller.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] 1. In the utility model, by setting a crystal bonding mechanism and a rotating mechanism, the driving of the driver cooperates with the meshing transmission between the first gear and the second gear, so that the rotating rod drives the electric suction nozzle to rotate 180 degrees, and then the two electric suction nozzles are respectively sucked and released by the extension of the cylinder, thereby saving the crystal bonding time of the wafer and improving the crystal bonding efficiency;

[0014] 2. In the utility model, a moving mechanism is provided, and the substrate is firmly fixed by rotating the screw to make the fixing plate, and then the fixing seat can drive the substrate to move left and right by extending and retracting the electric push rod, and then the fixing seat can drive the substrate to move forward and backward by extending and retracting the electric telescopic rod, so that the position of the substrate can be flexibly adjusted to meet the needs of fixing the crystal at different positions of the substrate, thereby improving practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall structure of a die-bonding device for Mini RGB according to the utility model;

[0016] Figure 2 This is a schematic diagram of the overall structure of a die-bonding mechanism of a die-bonding device for Mini RGB according to the utility model;

[0017] Figure 3 This is a schematic diagram of the overall structure of a rotating mechanism of a crystal bonding device for Mini RGB according to the utility model;

[0018] Figure 4 This is a schematic diagram of the overall structure of a mobile mechanism of a die-bonding device for Mini RGB according to the utility model;

[0019] Figure 5 The utility model is a schematic diagram of the cross-sectional structure of a fixing seat of a die-bonding device for Mini RGB.

[0020] In the figure: 1. crystal fixing table; 2. support frame; 3. crystal fixing mechanism; 4. controller; 5. moving groove; 6. moving mechanism; 7. fixed block; 8. crystal storage plate; 31. fixed frame; 32. rotating mechanism; 33. driver; 34. first gear; 321. cylinder; 322. second gear; 323. rotating rod; 324. electric suction nozzle; 61. fixed seat; 62. screw; 63. fixed plate; 64. first slide groove; 65. first slider; 66. electric push rod; 67. second slide groove; 68. second slider; 69. electric telescopic rod. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0022] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0023] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] See also Figure 1-5 , the utility model provides a technical solution:

[0025] A crystal bonding device for Mini RGB comprises a crystal bonding platform 1, a support frame 2 is fixedly connected between the upper front and the upper rear of the crystal bonding platform 1, a crystal bonding mechanism 3 is movably connected to the middle of the upper end of the support frame 2, a controller 4 is fixedly connected to the lower front end of the support frame 2, a movable groove 5 is opened at the upper right part of the crystal bonding platform 1, a fixed block 7 is fixedly connected to the middle of the right end of the crystal bonding platform 1, a movable mechanism 6 is movably connected between the upper part of the fixed block 7 and the middle of the rear groove wall of the movable groove 5, and a crystal storage tray 8 is fixedly connected to the upper left part of the crystal bonding platform 1.

[0026] In this embodiment, the crystal fixing mechanism 3 includes a fixed frame 31, the rear part of the upper frame wall of the fixed frame 31 is movably connected with a rotating mechanism 32 through a bearing, the front part of the upper frame wall of the fixed frame 31 is fixedly connected with a driver 33, the output end of the driver 33 passes through the upper frame wall of the fixed frame 31 and is fixedly connected with a first gear 34, and the lower end of the first gear 34 is movably connected to the upper end of the fixed frame 31 through a bearing, and the lower end of the fixed frame 31 and the lower end of the driver 33 are both fixedly connected to the upper end of the support frame 2; the rotating mechanism 32 includes a cylinder 321, and the cylinder 321 has a A second gear 322 is fixedly connected to the upper part of the outer surface, a rotating rod 323 is fixedly connected to the output end of the cylinder 321, an electric suction nozzle 324 is fixedly connected to the upper front and rear parts of the rotating rod 323, and the lower part of the outer surface of the cylinder 321 is movably connected to the upper wall of the support frame 2 through a bearing; the cylinder 321, the electric suction nozzle 324 and the driver 33 are all electrically connected to the controller 4, and the length of the rotating rod 323 is shorter than that of the support frame 2, so that the rotating rod 323 does not contact the wall of the support frame 2 and does not affect the rotation of the rotating rod 323.

[0027] In this embodiment, the moving mechanism 6 includes a fixed seat 61, the middle of the front seat wall and the middle of the rear seat wall of the fixed seat 61 are both threadedly connected with screw rods 62, the opposite surfaces of the two screw rods 62 are movably connected with fixed plates 63 through bearings, a first slide groove 64 is opened in the middle of the right end of the fixed seat 61, a first slider 65 is slidably connected in the first slide groove 64, and an electric push rod 66 is fixedly connected to the right end of the first slider 65; a second slide groove 67 is opened in the middle of the lower end of the fixed seat 61, a second slider 68 is slidably connected in the second slide groove 67, and an electric telescopic rod 69 is fixedly connected to the rear end of the second slider 68; the second slide groove 67, the second slider 68, the first slider 65 and the first slide groove 64 are all set to a T-shaped structure, so that the first slider 65 will not be separated from the first slide groove 64, and the second slider 68 will not be separated from the second slide groove 67, and the electric telescopic rod 69 and the electric push rod 66 are both electrically connected to the controller 4.

[0028] It should be noted that the utility model is a crystal fixing device for Mini RGB. During use, the substrate to be crystal fixed is first placed in the fixing seat 61, and then the screw 62 is rotated to push the fixing plate 63 toward the middle, so that the two fixing plates 63 can clamp and fix the substrate together, and then the position of the substrate to be crystal fixed is adjusted to directly below the electric suction nozzle 324 on the right side according to needs. The electric push rod 66 and the electric telescopic rod 69 can be controlled in sequence by the controller 4 to start, and the first slider 65 drives the fixing seat 61 to move left and right through the extension and retraction of the electric push rod 66, and the second slider 68 slides in the second slide groove 67 without affecting the movement of the fixing seat 61, so that the position of the substrate can be moved left and right stably, and then the electric telescopic rod 69 is extended and retracted, so that the second slider 68 drives the fixing seat 61 to move forward and backward, and the first slider 65 slides in the first slide groove 64 without affecting the movement of the fixing seat 61, so that the position of the substrate can be moved forward and backward stably, The position of the substrate can be flexibly adjusted while the substrate is firmly fixed, so as to meet the needs of solid crystal at different positions of the substrate, thereby improving practicality. Finally, the driver 33, the cylinder 321 and the electric suction nozzle 324 can be started by the controller 4, and the driver 33 drives the first gear 34 to rotate, and then through the meshing transmission between the first gear 34 and the second gear 322, the cylinder 321 drives the rotating rod 323 to rotate 180 degrees to exchange the positions of the two electric suction nozzles 324, and then the cylinder 321 is extended to make the rotating rod 323 drive the two electric suction nozzles 324 to push downward, so that the electric suction nozzle 324 on one side can absorb the wafer in the crystal storage tray 8, and the electric suction nozzle 324 on the other side releases the wafer and mounts it on the substrate, and so on. When a single reciprocating rotation is realized, the wafer can be adsorbed and mounted at the same time, thereby saving the solid crystal time of the wafer and improving the solid crystal efficiency.

[0029] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A die bonding device for Mini RGB, comprising a die bonding table (1), characterized in that: A support frame (2) is fixedly connected between the front and rear parts of the upper end of the crystal fixing platform (1); a crystal fixing mechanism (3) is movably connected to the middle part of the upper end of the support frame (2); a controller (4) is fixedly connected to the lower part of the front end of the support frame (2); a movable groove (5) is opened at the right part of the upper end of the crystal fixing platform (1); a fixed block (7) is fixedly connected to the middle part of the right end of the crystal fixing platform (1); a movable mechanism (6) is movably connected between the upper part of the fixed block (7) and the middle part of the rear groove wall of the movable groove (5); and a crystal storage tray (8) is fixedly connected to the left part of the upper end of the crystal fixing platform (1); The crystal fixing mechanism (3) comprises a fixed frame (31), the rear part of the upper frame wall of the fixed frame (31) is movably connected with a rotating mechanism (32) through a bearing, the front part of the upper frame wall of the fixed frame (31) is fixedly connected with a driver (33), the output end of the driver (33) passes through the upper frame wall of the fixed frame (31) and is fixedly connected with a first gear (34), and the lower end of the first gear (34) is movably connected to the upper end of the fixed frame (31) through a bearing, and the lower end of the fixed frame (31) and the lower end of the driver (33) are both fixedly connected to the upper end of the support frame (2); The rotating mechanism (32) comprises a cylinder (321), a second gear (322) is inserted and fixedly connected to the upper portion of the outer surface of the cylinder (321), a rotating rod (323) is fixedly connected to the output end of the cylinder (321), an electric suction nozzle (324) is inserted and fixedly connected to the upper front and rear ends of the rotating rod (323), and the lower portion of the outer surface of the cylinder (321) is inserted and movably connected to the upper frame wall of the support frame (2) through a bearing; The moving mechanism (6) comprises a fixed seat (61), the middle part of the front seat wall and the middle part of the rear seat wall of the fixed seat (61) are both threadedly connected with screw rods (62), the opposite surfaces of the two screw rods (62) are movably connected with fixed plates (63) through bearings, a first sliding groove (64) is opened in the middle part of the right end of the fixed seat (61), a first sliding block (65) is slidably connected in the first sliding groove (64), and the right end of the first sliding block (65) is fixedly connected with an electric push rod (66).

2. The die bonding device for Mini RGB according to claim 1, characterized in that: The cylinder (321), the electric suction nozzle (324) and the driver (33) are all electrically connected to the controller (4), and the length of the rotating rod (323) is shorter than the length of the supporting frame (2).

3. The die bonding device for Mini RGB according to claim 1, characterized in that: A second sliding groove (67) is provided in the middle of the lower end of the fixing seat (61), a second sliding block (68) is slidably connected in the second sliding groove (67), and an electric telescopic rod (69) is fixedly connected to the rear end of the second sliding block (68).

4. The die bonding device for Mini RGB according to claim 3, characterized in that: The second slide groove (67), the second slider (68), the first slider (65) and the first slide groove (64) are all arranged in a T-shaped structure, and the electric telescopic rod (69) and the electric push rod (66) are both electrically connected to the controller (4).