Adsorption device and die bonding machine for die bonding

Abstract

The present invention discloses an adsorption device and a crystal bonding machine for crystal bonding, the adsorption device comprises: an adsorption area, which is covered with an elastic material, and the elastic material is provided with at least two micropores, and the aperture of each micropore is greater than or equal to 0.01 mm; a non-adsorption area, which is provided with at least one through hole, and the non-adsorption area includes a connecting sub-area, and the connecting sub-area is directly connected to the elastic material of the adsorption area, and is used to support the elastic material, and the material of the connecting sub-area is a rigid material; wherein the adsorption area and the non-adsorption area jointly form a cavity, and the through hole is connected to the cavity, and the through hole is used to connect to an external vacuum device, and the adsorption device can absorb more than two wafers at a time through at least two micropores on the elastic material of the adsorption area under the vacuum action of the external vacuum device. In this way, the present invention can efficiently bond the crystal, with low cost, and will not crush the wafer or leak the wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of crystal bonding, and in particular to an adsorption device and a crystal bonding machine for crystal bonding. Background Art

[0002] Die bonding is also known as Die Bond or chip mounting, which is a process of bonding the chip to the designated area of ​​the bracket through a colloid (generally conductive glue or insulating glue for LEDs) to form a thermal or electrical path to provide conditions for subsequent wire bonding.

[0003] The traditional die bonding process is to use a mechanical ejector to eject the wafer, then use a vacuum nozzle to suck the wafer and place it on the substrate. With the development of the LED packaging industry, the trend of the industry is to make the product size smaller and smaller. As the product size becomes smaller and smaller, the brackets and wafers used are also getting smaller and smaller. At present, the size of mini chips is less than 0.1mm. The efficiency of using traditional die bonding technology is low. And the use of rigid materials to process 0.05mm nozzle holes to form high-density nozzles is expensive. Once the rigid material needs to absorb multiple wafers at one time, due to the inconsistent thickness of the wafers, it is easy to cause the thick wafer to be compressed, causing damage, and the thin wafer cannot be sucked up by the nozzle, and there is a phenomenon of leakage. Summary of the invention

[0004] The main technical problem solved by the present invention is to provide an adsorption device and a crystal bonding machine for crystal bonding, which can bond crystals efficiently with low cost and will not crush the crystals or leak the crystals.

[0005] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide an adsorption device for solid crystal, comprising: an adsorption area, which is covered with an elastic material, and at least two micropores are arranged on the elastic material, and the pore size of each micropore is greater than or equal to 0.01 mm; a non-adsorption area, which is provided with at least one through hole, and the non-adsorption area includes a connecting sub-area, and the connecting sub-area is directly connected to the elastic material of the adsorption area for supporting the elastic material, and the material of the connecting sub-area is a rigid material; wherein the adsorption area and the non-adsorption area jointly form a cavity, and the through hole is connected to the cavity, and the through hole is used to connect to an external vacuum device, and the adsorption device can absorb more than two chips at one time through at least two micropores on the elastic material of the adsorption area under the vacuum action of the external vacuum device.

[0006] Wherein, the through hole is arranged in the connecting sub-region.

[0007] Wherein, the non-adsorption region also includes a non-connector region.

[0008] The two opposite connecting sub-areas and the non-connecting sub-area at the bottom together form a square notch, and the elastic material is attached to the notch.

[0009] Wherein, the non-adsorption area is integrally formed as the notch, the material of the notch is a rigid material, and the through hole is arranged at the bottom of the notch.

[0010] Among them, the connecting sub-area is an integrally formed L-shape, and the two connecting sub-areas are arranged relative to each other in an inverted L-shape to form a first slot and a second slot relative to each other, the opening of the first slot is smaller than the opening of the second slot, and the through hole is arranged on the long side of one of the connecting sub-areas, the elastic material is linear, and it covers and seals the first slot in a manner that completely covers the short side of the connecting sub-area, and the non-connecting sub-area is linear, and it covers and seals the second slot in a manner that completely covers the end of the long side of the connecting sub-area; the material of the non-connecting sub-area is a sealing material, and the length of the elastic material is equal to the length of the sealing material.

[0011] Among them, the connecting sub-area is an integrally formed L-shape, and the two connecting sub-areas are arranged relative to each other in an inverted L-shape to form a first slot and a second slot relative to each other, the opening of the first slot is smaller than the opening of the second slot, and the through hole is arranged on the long side of one of the connecting sub-areas, and the non-connecting sub-area is linear, which covers the second slot in a manner of completely covering the bottom end of the long side of the connecting sub-area; the device also includes an elastomeric upper cover and an elastomeric lower cover, the materials of the elastomeric upper cover and the elastomeric lower cover are both elastic materials, the elastomeric lower cover is sleeved on the outside of the long sides of the two connecting sub-areas and the outside of the non-connecting sub-area, the elastomeric upper cover covers and is sealed on the elastomeric lower cover, the elastomeric upper cover is provided with the adsorption area at the position corresponding to the first slot, and the elastomeric lower cover is provided with a first corresponding through hole at the position corresponding to the through hole of one of the connecting sub-areas.

[0012] Wherein, the connecting sub-area is an integrally formed L-shape, and the two connecting sub-areas are arranged relative to each other in an L-shape to form a first slot and a second slot relative to each other, the opening of the first slot is smaller than the opening of the second slot, and the non-connecting sub-area is a linear shape, which is arranged in the middle of the first slot and is respectively spaced from the two connecting sub-areas to form the two through holes; the device also includes a heat shrinkable sleeve upper cover and a heat shrinkable sleeve lower cover, the heat shrinkable sleeve lower cover is sleeved and sealed on the outside of the short sides of the two connecting sub-areas, the outside of a part of the long sides adjacent to the short sides and the outside of the non-connecting sub-area, the heat shrinkable sleeve upper cover is sleeved and sealed on the outside of a part of the long sides of the two connecting sub-areas away from the short sides, the top of the long side and the second slot; the heat shrinkable sleeve upper cover is provided with the adsorption area at the position corresponding to the second slot, and the heat shrinkable sleeve lower cover is provided with two second corresponding through holes at the positions corresponding to the two through holes.

[0013] The elastic material includes thin plastic material, rubber material and silicone material; the thin plastic material includes polyethylene terephthalate, polypropylene and polyvinyl chloride.

[0014] In order to solve the above technical problems, another technical solution adopted by the present invention is: to provide a crystal bonding machine, wherein the crystal bonding machine comprises the adsorption device as described in any one of the above items.

[0015] The beneficial effects of the present invention are as follows: different from the prior art, in the adsorption device of the present invention, the elastic material is elastic and deforms when subjected to force, and can quickly return to the original shape and size after the external force is removed. When the micropores on the elastic material absorb multiple chips, even if the thickness of the chips is inconsistent, the vacuum force can be increased for thin chips, thereby preventing leakage. At the same time, when the vacuum force increases, since the elastic material is elastic, it will deform when subjected to force, and will not cause thick chips to be crushed due to pressure. Since the micropores on the elastic material can absorb multiple chips, the efficiency of solid crystal can be improved in this way. Elastic materials are cheap and readily available materials. In addition, compared with processing micropores on rigid materials, processing micropores on elastic materials is also easier. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0017] Figure 1It is a structural schematic diagram of an embodiment of an adsorption device for solid crystal of the present invention;

[0018] Figure 2 It is a structural schematic diagram of another embodiment of the adsorption device for crystal bonding of the present invention;

[0019] Figure 3 It is a structural schematic diagram of another embodiment of the adsorption device for crystal bonding of the present invention;

[0020] Figure 4 It is a structural schematic diagram of another embodiment of the adsorption device for solid crystal of the present invention. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] See also Figures 1 to 4 , Figures 1 to 4 Schematic diagram of the structure of four embodiments of the adsorption device for solid crystal of the present invention. The adsorption device comprises: an adsorption area 1 and a non-adsorption area 2.

[0023] The adsorption area 1 is covered with an elastic material 11, and at least two micropores 12 are arranged on the elastic material 11, and the pore size of each micropore 12 is greater than or equal to 0.01 mm; the non-adsorption area 2 is provided with at least one through hole 21, and the non-adsorption area 2 includes a connecting sub-area 22, which is directly connected to the elastic material 11 of the adsorption area 1 and is used to support the elastic material 11. The material of the connecting sub-area 22 is a rigid material 221.

[0024] Among them, the adsorption area 1 and the non-adsorption area 2 jointly form a cavity 3, the through hole 21 is connected to the cavity 3, and the through hole 21 is used to connect to an external vacuum device. Under the vacuum action of the external vacuum device, the adsorption device can absorb more than two chips at one time through at least two micropores 12 on the elastic material 11 of the adsorption area 1.

[0025] The elastic material 11 is elastic and deforms when subjected to force, and can quickly return to its original shape and size after the external force is removed. When the micropores 12 on the elastic material 11 absorb multiple chips, even if the thickness of the chips is inconsistent, the vacuum force can be increased for thin chips, thereby preventing leakage; at the same time, when the vacuum force increases, since the elastic material 11 is elastic, it will deform when subjected to force, and will not cause thick chips to be crushed due to pressure. Since the micropores 12 on the elastic material 11 can absorb multiple chips, the efficiency of solid crystal can be improved in this way.

[0026] The elastic material 11 includes but is not limited to thin plastic materials, rubber materials, silicone materials, etc., wherein the thin plastic materials include but are not limited to polyethylene terephthalate (PET), polypropylene (PP), polyvinyl chloride (PVC). These elastic materials 11 are cheap and readily available materials. In addition, it is easier to process micropores 12 on these elastic materials 11 than to process micropores on rigid materials. The processing methods for processing micropores 12 on these elastic materials 11 include, for example, laser drilling, drilling with a needle, etc.

[0027] The elastic material 11 is elastic, usually not very hard, and relatively soft, and a rigid material with a certain rigidity is required to support the elastic material 11. Therefore, the non-adsorption area 2 includes a connecting sub-area 22, which is directly connected to the elastic material 11 of the adsorption area 1 and is used to support the elastic material 11. The material of the connecting sub-area 22 is a rigid material 221. The rigid material 221 can be a metal material or a non-metal material.

[0028] The processing method of directly connecting the elastic material 11 of the adsorption area 1 and the connecting sub-area 22, for example: if the rigid material 221 is a metal material, the metal material and the elastic material can be bonded with organic materials; if the rigid material 221 is a non-metallic material, infrared welding, heating tube welding, ultrasonic welding, laser welding, etc. can be used.

[0029] In order to enable the micropores 12 on the elastic material 11 to absorb the wafer, it is necessary to ensure that the adsorption area 1 and the non-adsorption area 2 together form a cavity 3 that can be close to a vacuum state. In order to make the cavity 3 close to a vacuum state, a vacuum device needs to be introduced from the outside, so the external vacuum device is connected through at least one through hole 21 set in the non-adsorption area 2. Under the vacuum effect of the external vacuum device, the adsorption device can absorb more than two wafers at a time through at least two micropores 12 on the elastic material 11 of the adsorption area 1.

[0030] The adsorption area 1 and the non-adsorption area 2 of the adsorption device of the embodiment of the present invention jointly form a cavity 3, and the through hole 21 is connected to the cavity 3. The through hole 21 is used to connect to an external vacuum device. The adsorption area 1 is covered with an elastic material 11, and at least two micropores 12 are arranged on the elastic material 11. The adsorption device can absorb more than two wafers at a time through the at least two micropores 12 on the elastic material 11 of the adsorption area 1 under the vacuum action of the external vacuum device. Since the adsorption device absorbs more than two wafers at a time, the solid crystal efficiency can be improved in this way; when the micropores 12 on the elastic material 11 absorb multiple wafers, even if the thickness of the wafers is inconsistent, the vacuum force can be increased for the thin wafer, thereby preventing leakage; at the same time, when the vacuum force increases, since the elastic material 11 is elastic, it will deform when subjected to force, and the thick wafer will not be crushed due to pressure; in addition, the elastic material 11 is a cheap and easily available material. Compared with processing micropores on rigid materials, processing micropores 12 on the elastic material 11 is also easier, so the cost is low.

[0031] The non-adsorption region 2 further includes a non-connector region 23. In other embodiments, the non-adsorption region 2 may also not include the non-connector region 23, for example, the connecting sub-regions 22 are directly connected together, specifically, the cross-section of the connecting sub-region 22 is semicircular (in this case, the cavity 3 is hemispherical), straight (two straight-line connecting sub-regions 22 are directly connected, in this case, the cavity 3 is triangular), and the like.

[0032] See also Figure 2 , Figure 3 , the through hole 21 can be arranged in the connecting sub-region 22. Figure 1 and Figure 4 The through hole 21 may also be arranged in the non-connection sub-area 23. The number of the through hole 21 may be one or more than two. The arrangement position and number of the through hole 21 are determined according to the actual application and are not limited here.

[0033] See also Figures 1 to 4 In one embodiment, two opposite connecting sub-areas 22 and a non-connecting sub-area 23 at the bottom together form a square notch, and the elastic material 11 is attached to the notch, that is, the cavity 3 is square.

[0034] Specifically, see Figure 1 In one embodiment, the non-adsorption area 2 is integrally formed as a notch, and the material of the notch is a rigid material 221, that is, the connecting sub-area 22 and the non-connecting sub-area 23 are integrally formed, and the materials of the connecting sub-area 22 and the non-connecting sub-area 23 are both rigid material 221, and the through hole 21 is arranged at the bottom of the notch, that is, the through hole 21 is arranged in the non-connecting sub-area 23.

[0035] See also Figure 2In another embodiment, the connecting sub-area 22 is an integrally formed L-shape, and the two connecting sub-areas 22 are arranged relative to each other in an inverted L-shape to form a first slot 31 and a second slot 32 relative to each other, the opening of the first slot 31 is smaller than the opening of the second slot 32, and the through hole 21 is arranged on the long side of one of the connecting sub-areas 22, and the elastic material 11 is linear, which covers the sealed first slot 31 in a manner of completely covering the short side of the connecting sub-area 22, and the non-connecting sub-area 23 is linear, which covers the sealed second slot 32 in a manner of completely covering the end of the long side of the connecting sub-area 22; the material of the non-connecting sub-area 23 is a sealing material 231, and the length of the elastic material 11 is equal to the length of the sealing material 231.

[0036] In this embodiment, the elastic material 11 covers the first sealing notch 31 and also completely covers the short side of the sealing connection sub-area 22. For the processing method of direct connection between the elastic material 11 and the rigid material, please refer to the above description.

[0037] In this embodiment, the non-connecting sub-area 23 covers the sealed second notch 32 and also completely covers the end of the long side of the sealed connecting sub-area 22. The processing method of directly connecting the non-connecting sub-area 23 and the connecting sub-area 22, for example: if the rigid material and the sealing material 231 are both metal materials, a weldable material is plated on the surface of the metal material, and welding can be performed by pre-set metal welding sheets and metal solder, or resistance welding, laser welding, etc.; if the rigid material and the sealing material are both non-metallic materials, infrared welding, heating tube welding, ultrasonic welding, laser welding, and bonding with organic materials, etc. can be used.

[0038] See also Figure 3 In another embodiment, the connecting sub-area 22 is an integrally formed L-shape, and the two connecting sub-areas 22 are arranged opposite to each other in an inverted L-shape to form a first notch 31 and a second notch 32 opposite to each other, the opening of the first notch 31 is smaller than the opening of the second notch 32, the through hole 21 is arranged on the long side of one of the connecting sub-areas 22, and the non-connecting sub-area 23 is linear, which covers the second notch 32 in a manner of completely covering the bottom end of the long side of the connecting sub-area 22; the device also includes an elastic upper cover 41 and the elastomeric lower cover 42, the materials of the elastomeric upper cover 41 and the elastomeric lower cover 42 are both elastic materials, the elastomeric lower cover 42 is sleeved on the outside of the long sides of the two connecting sub-areas 22 and the outside of the non-connecting sub-areas 23, the elastomeric upper cover 41 covers and is sealed on the elastomeric lower cover 42, the elastomeric upper cover 41 is provided with an adsorption area 1 at a position corresponding to the first notch 31, and the elastomeric lower cover 42 is provided with a first corresponding through hole 43 at a position corresponding to the through hole 21 of one of the connecting sub-areas 22.

[0039] In this embodiment, the elastic upper cover 41 and the elastic lower cover 42 can be sealed by infrared welding, heating tube welding, ultrasonic welding, laser welding or other processing methods.

[0040] See also Figure 4 In another embodiment, the connecting sub-area 22 is an integrally formed L-shaped, and the two connecting sub-areas 22 are arranged in an L-shape to form a first slot 31 and a second slot 32. The opening of the first slot 31 is smaller than the opening of the second slot 32. The non-connecting sub-area 23 is linear, which is arranged in the middle of the first slot 31 and is spaced from the two connecting sub-areas 22 to form two through holes 21. The device also includes a heat shrink sleeve upper cover 51 and a heat shrink sleeve lower cover 52. The heat shrink sleeve lower cover 5 2 is sleeved and sealed on the short sides of the two connecting sub-areas 22, a part of the long sides adjacent to the short sides and the outside of the non-connecting sub-area 23, the heat shrink sleeve upper cover 51 is sleeved and sealed on a part of the long sides away from the short sides of the two connecting sub-areas 22, the top of the long sides and the second notch 32; the heat shrink sleeve upper cover 51 is provided with an adsorption area 1 at a position corresponding to the second notch 32, and the heat shrink sleeve lower cover 52 is respectively provided with two second corresponding through holes 53 at positions corresponding to the two through holes 21.

[0041] Specifically, the heat shrink tube lower cover 52 is sleeved and sealed on the outside of the short sides of the two connecting sub-areas 22, the outside of a portion of the long sides adjacent to the short sides, and the outside of the non-connecting sub-area 23, and the heat shrink tube upper cover 51 is sleeved and sealed on the outside of a portion of the long sides away from the short sides of the two connecting sub-areas 22, the top of the long side, and the second notch 32.

[0042] The connecting sub-area 22 and the non-connecting sub-area 23 are both made of rigid materials. When manufacturing the heat shrinkable sleeve, the upper and lower covers are sealed with the rigid materials by bonding with organic materials to form the heat shrinkable sleeve, and the rigid materials are heated and coated.

[0043] The embodiment of the present invention further provides a die bonding machine, which includes any one of the above adsorption devices. For detailed description of the relevant contents, please refer to the above adsorption device part, which will not be repeated here.

[0044] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An adsorption device for solid crystal, characterized in that: include: The adsorption area is covered with an elastic material, the elastic material is provided with at least two micropores, and the pore size of each micropore is greater than or equal to 0.01 mm; A non-adsorption area is provided with at least one through hole, the non-adsorption area includes a connecting sub-area, the connecting sub-area is directly connected to the elastic material of the adsorption area, and is used to support the elastic material, and the material of the connecting sub-area is a rigid material; The adsorption area and the non-adsorption area jointly form a cavity, the through hole is connected to the cavity, the through hole is used to connect to an external vacuum device, and the adsorption device can absorb more than two wafers at a time through at least two micropores on the elastic material of the adsorption area under the vacuum effect of the external vacuum device; The non-adsorption region also includes a non-linker region; The two opposite connecting sub-areas and the non-connecting sub-area at the bottom together form a square notch, and the elastic material is attached to the notch; The connecting sub-area is integrally formed in an L-shape, and the two connecting sub-areas are arranged opposite to each other in an inverted L-shape.

2. The adsorption device according to claim 1, characterized in that: The through hole is arranged in the connecting sub-region.

3. The adsorption device according to claim 1, characterized in that: The non-adsorption area is integrally formed as the notch, the material of the notch is a rigid material, and the through hole is arranged at the bottom of the notch.

4. The adsorption device according to claim 1, characterized in that: The two connecting sub-areas form a first slot and a second slot relative to each other, the opening of the first slot is smaller than the opening of the second slot, the through hole is arranged on the long side of one of the connecting sub-areas, the elastic material is linear, and covers and seals the first slot in a manner that completely covers the short side of the connecting sub-area, and the non-connecting sub-area is linear, and covers and seals the second slot in a manner that completely covers the end of the long side of the connecting sub-area; the material of the non-connecting sub-area is a sealing material, and the length of the elastic material is equal to the length of the sealing material.

5. The adsorption device according to claim 1, characterized in that: The two connecting sub-regions form a first notch and a second notch opposite to each other, the opening of the first notch is smaller than the opening of the second notch, the through hole is arranged on the long side of one of the connecting sub-regions, and the non-connecting sub-region is linear, and covers the second notch in a manner of completely covering the bottom end of the long side of the connecting sub-region; The device also includes an elastomeric upper cover and an elastomeric lower cover, both of which are made of elastic material. The elastomeric lower cover is sleeved on the outside of the long sides of the two connecting sub-areas and the outside of the non-connecting sub-areas. The elastomeric upper cover covers and is sealed on the elastomeric lower cover. The elastomeric upper cover is provided with the adsorption area at a position corresponding to the first notch, and the elastomeric lower cover is provided with a first corresponding through hole at a position corresponding to the through hole of one of the connecting sub-areas.

6. The adsorption device according to claim 1, characterized in that: The connecting sub-region is integrally formed in an L-shape, and the two connecting sub-regions are arranged opposite to each other in an L-shape to form a first notch and a second notch opposite to each other, the opening of the first notch is smaller than the opening of the second notch, and the non-connecting sub-region is linear, which is arranged in the middle of the first notch and is spaced from the two connecting sub-regions to form two through holes; The device also includes an upper cover of a heat shrinkable tube and a lower cover of a heat shrinkable tube. The lower cover of the heat shrinkable tube is sleeved and sealed on the outside of the short sides of the two connecting sub-areas, the outside of a portion of the long sides adjacent to the short sides, and the outside of the non-connecting sub-area. The upper cover of the heat shrinkable tube is sleeved and sealed on the outside of a portion of the long sides of the two connecting sub-areas away from the short sides, the top of the long side, and the second notch; the upper cover of the heat shrinkable tube is provided with the adsorption area at a position corresponding to the second notch, and the lower cover of the heat shrinkable tube is provided with two second corresponding through holes at positions corresponding to the two through holes.

7. The adsorption device according to claim 1, characterized in that: The elastic material includes thin plastic material, rubber material and silicone material; the thin plastic material includes polyethylene terephthalate, polypropylene and polyvinyl chloride.

8. A die bonding machine, characterized in that: The die bonding machine comprises the adsorption device as described in any one of claims 1-7.

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